Laying device

Abstract

The present invention aims to provide a mounting device capable of mounting a module to a substrate with high accuracy. The mounting device includes: a stage (31) that supports a substrate (1); a head (32) that carries a module (2) on which a plurality of elements are mounted to a position facing the substrate (1); a camera (33) that faces the substrate (1) through the module (2) held by the head (32) and photographs an alignment mark (M) provided on the substrate (1) and an alignment mark (m) provided on the module (2) in the same field of view; and a focal length adjustment section (34) that is provided on an optical path connecting the alignment mark (M) and the camera (33), adjusts the focal length of the camera (33) with respect to the alignment mark (M) so that the focal point of the camera (33) simultaneously aligns with the alignment marks (M, m), and the head (32) mounts the module (2) to the substrate (1) based on the image photographed by the camera (33).

Description

TECHNICAL FIELD

[0001] The present application relates to a tiling device. BACKGROUND

[0002] In recent years, development of modules in which a plurality of light emitting diode (LED) elements of tens to hundreds of micrometers are mounted in multiple rows and multiple columns is being promoted. Further, it is being studied to arrange such modules in multiple rows and multiple columns to manufacture a display device or a lighting device.

[0003] [Related Art Literature]

[0004] [Patent Literature]

[0005] Patent Literature 1: Japanese Patent Laid-Open No. 2021-9937 SUMMARY

[0006] [Problems to be Solved by the Invention]

[0007] In a case where the LED module in which a plurality of LED elements are mounted is tiled in multiple rows and multiple columns (hereinafter also referred to as tiling), for example, an alignment mark provided to the LED module and an alignment mark provided to the substrate are imaged, and based on the imaged images, the alignment of the two is performed.

[0008] In such alignment, the recognition accuracy of the position at the time of imaging becomes important. For example, the positional relationship of the camera that images the LED module and the camera that images the substrate becomes a factor of error. For example, sometimes the positional relationship of the cameras or the positional relationship in the imaged images changes due to thermal expansion or vibration, and the like, and thus it is difficult to perform the alignment of the LED module and the substrate with high accuracy.

[0009] An object of the present application is to provide a tiling device capable of tiling a module to a substrate with high accuracy.

[0010] [Technical Means for Solving the Problems]

[0011] The tiling device of the present application includes: a stage that supports a substrate; a head that carries a module in which a plurality of elements are mounted to a position facing the substrate; an imaging section that images a first alignment mark provided to the substrate and a second alignment mark provided to the module in the same field of view, facing the substrate through the module held by the head; and a focal length adjustment section that is provided on an optical path that links the first alignment mark and the imaging section, adjusts the focal length of the imaging section with respect to the first alignment mark so that the focal point of the imaging section simultaneously aligns with the first alignment mark and the second alignment mark, and the head tiles the module to the substrate based on the image imaged by the imaging section.

[0012] [Effects of the Invention]

[0013] The tiling device of the present application can tile the module to the substrate with high precision. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a plan view of a substrate of an embodiment.

[0015] Figure 2 (A) of is a plan view of a module of an embodiment, Figure 2 (B) of is a side view of a module of an embodiment.

[0016] Figure 3 is a plan view of a supply table and a tiling device of an embodiment.

[0017] Figure 4A is a side view of a tiling device of an embodiment.

[0018] Figure 4B (A) to Figure 4B (C) of is a schematic view of a case at the time of picking up Figure 4B (A) of is before alignment, Figure 4B (B) of is at the time of picking up, Figure 4B (C) of is after picking up.

[0019] Figure 5 (A) to Figure 5 (D) of is a view of a tiling flow of an embodiment.

[0020] Figure 6 is a block diagram of a control device of an embodiment.

[0021] Figure 7 is a flowchart of a tiling flow of an embodiment.

[0022] Figure 8 is a view of a photographing field of a photographing section of an embodiment.

[0023] Figure 9 (A) to Figure 9 (C) of is a view of a direction to be tiled of a module of an embodiment.

[0024] Figure 10 (A), Figure 10 (B) and Figure 10 (C) of are side views of a focal distance adjustment section of a modified example.

[0025] [Explanation of Symbols]

[0026] 1: substrate

[0027] 2: module

[0028] 3: tiling device

[0029] 8: control device

[0030] 21: flexible substrate

[0031] 22: light emitting element

[0032] 23: sealing member

[0033] 31: stage

[0034] 32: head

[0035] 32a: holding portion

[0036] 32b: transparent portion

[0037] 33: photographing portion

[0038] 33a: frame

[0039] 34: focal length adjusting portion

[0040] 81: storage portion

[0041] 82: photographing control portion

[0042] 83: arithmetic portion

[0043] 84: movement control portion

[0044] 85: setting portion

[0045] 86: input / output control portion

[0046] 91: input device

[0047] 92: output device

[0048] 320: movement mechanism

[0049] 321: linear movement mechanism

[0050] 321a, 322a: rail

[0051] 321b, 322b: guide

[0052] 321c, 333c: slider

[0053] 321d: base

[0054] 322: lifting mechanism

[0055] C: frame

[0056] M, m: alignment mark

[0057] S: supply stage

[0058] S01~S08: Steps

[0059] X, Y, Z, θ: Direction Detailed Implementation

[0060] Embodiments of the present invention (hereinafter referred to as "this embodiment") will be described in detail with reference to the accompanying drawings. First, the substrate and the module will be described, and next, the mounting apparatus will be described. Furthermore, the figures schematically illustrate this embodiment.

[0061] [Substrate]

[0062] like Figure 1 As shown, the substrate 1 of this embodiment is a substrate of a display device, and the module 2, described later, is mounted on its surface. Alignment marks M are provided on the surface of the substrate 1 to align and mount the module 2 to the desired position. The alignment marks M are provided at positions corresponding to the alignment marks m provided in the module 2. That is, the alignment marks M and the alignment marks m serve as references for mounting the module 2 onto the substrate 1. In this embodiment, the alignment marks M are provided four times for each module 2, corresponding to the alignment marks m that are individually provided at the four corners of the square module 2. Figure 1 (Module 2 is represented by a dashed line). That is, the group of four alignment marks M is arranged at the vertices of a square. By arranging these four groups of alignment marks M in multiple rows and columns on the surface of the substrate 1, the module 2 can be mounted onto the substrate 1. Figure 1 This illustrates a case where alignment marks M are provided, with four modules 2 mounted on a substrate 1. Furthermore, the surface of the substrate 1 is covered by a thin adhesive layer (not shown), through which the substrate 1 and the modules 2 are bonded. Additionally, the terms "corners" and "vertices" include their vicinity.

[0063] [Module]

[0064] like Figure 2 (A) and Figure 2 As shown in (B), the module 2, which is the object to be laid in this embodiment, includes a flexible substrate 21, an alignment mark m provided on the surface of the flexible substrate 21, a plurality of light-emitting elements 22 mounted on the surface of the flexible substrate 21, and a sealing member 23 for sealing the alignment mark m and the light-emitting elements 22. The module 2 is laid on the surface of the substrate 1 by the laying device 3 described later.

[0065] The flexible substrate 21, for example, comprises polyimide, on which a light-emitting element 22 is mounted. Figure 2As shown in (A), the flexible substrate 21 of this embodiment is a square when viewed from above. At the four corners of the flexible substrate 21, alignment marks m are provided corresponding to the alignment marks M of the substrate 1 for aligning the module 2 to the substrate 1. That is, the four alignment marks m are arranged in groups located at the vertices of the square. Furthermore, while there are four groups of alignment marks M and alignment marks m in this embodiment, as will be described later, only two groups are actually used for alignment. Therefore, there can also be two groups of alignment marks M and alignment marks m. Additionally, the terms "four corners" and "vertices" include their vicinity.

[0066] The light-emitting element 22 is an LED element, and multiple of them are mounted on the surface of the flexible substrate 21. The light-emitting element 22 in this embodiment is especially a micron-sized LED element, with a height of, for example, about 25 μm.

[0067] like Figure 2 As shown in (B), the sealing member 23 is a transparent resin member that seals the alignment mark m and the light-emitting element 22 provided on the surface of the flexible substrate 21. The sealing member 23 can be, for example, a thermosetting resin with a viscosity of approximately 4000 mPa·s before curing. The sealing member 23 can be formed by curing a curable resin on the side of the module 2 where the light-emitting element 22 is mounted. Furthermore, the thickness of the sealing member 23 is, for example, 50 μm to 300 μm. As described above, the sealing member 23 is a transparent resin member, therefore the alignment mark m and the light-emitting element 22 can be seen through the sealing member 23.

[0068] [Painting Installation]

[0069] [structure]

[0070] like Figure 3 as well as Figure 4A As shown, the laying device 3 includes a frame C, a supply table S, a platform 31, a head 32, a moving mechanism 320, an imaging unit 33, a focus adjustment unit 34, and a control device 8. The frame C houses the supply table S, platform 31, head 32, moving mechanism 320, and control device 8. The supply table S is movably mounted and supports the module 2, supplying it to the laying device 3. The platform 31 is movably mounted and supports the substrate 1. The head 32, in cooperation with the moving mechanism 320, moves the module 2 from the supply table S to the substrate 1. At this time, the imaging unit 33 directly and / or via the focus adjustment unit 34 photographs the alignment mark M of the substrate 1 and the alignment mark m of the module 2. Based on the photographing results, the moving mechanism 320 and the platform 31 align and place the module 2 onto the placement position of the substrate 1. The control device 8 controls each structure (see reference). Figure 6 ).in addition, Figure 3 The focal length adjustment unit 34 is omitted from the illustration.

[0071] Figure 3 In this embodiment, the direction in which the supply table S and the carrier 31 are arranged is defined as the X direction. On a plane parallel to the surface of the carrier 31, the direction orthogonal to the X direction is defined as the Y direction, and the direction orthogonal to both the X and Y directions is defined as the Z direction. The Z direction is the direction that penetrates the paper in the figure. In this embodiment, the laying device 3 is arranged with the Z direction as the vertical direction, thus making the XY plane a horizontal plane. At this time, the Z direction is the height direction; the side facing the device is called the lower side, and the opposite side is called the upper side. That is, the lower side refers to the direction of gravity. Furthermore, the rotation direction parallel to the XY plane is defined as the θ direction.

[0072] The supply table S is a support platform with a flat surface, on which one or more modules 2 are supported. In this embodiment, as... Figure 3 As shown, the supply table S supports four modules 2. The supply table S is movable along the Y direction via a linear motion mechanism (not shown), reciprocating inside and outside the frame C. Thus, the supply table S can move the modules 2 to be laid on the substrate 1 from the outside of the frame C to the inside of the frame C. Furthermore, as described later, the modules 2 are moved in cooperation with the moving mechanism 320 so that the module 2 to be picked up faces the head 32, allowing the head 32 to pick up the module 2. The linear motion mechanism (not shown) includes, for example, a motor, a linear guide, and a ball screw, and the table surface of the supply table S is supported by the slider of the linear guide. Alternatively, a separate loading device, including a robot, can be provided to move the modules 2 from the outside of the laying device 3 to the supply table S. In this case, the modules 2 can be moved in one by one, or multiple modules 2 can be moved in together using a tray.

[0073] The stage 31 is a support platform having a flat surface, and the substrate 1 is supported on the surface. Figure 3 As shown, the stage 31 of this embodiment supports a substrate 1. The stage 31 is movable in the Y direction via a linear motion mechanism (not shown), reciprocating inside and outside the frame C. Thus, the stage 31 can move the substrate 1 from the outside of the frame C into the inside of the frame C, and move the substrate 1 with the module 2 attached from the inside of the frame C to the outside of the frame C. Furthermore, as described later, the moving mechanism 320 cooperates with the stage 31 to move the substrate 1 so that the head 32 faces the predetermined placement position of the module 2 on the substrate 1, thereby enabling the head 32 to place the module 2 at a predetermined position on the substrate 1 for placement. The linear motion mechanism (not shown) includes, for example, a motor, a linear guide, and a ball screw, and the table surface of the stage 31 is supported by the slider of the linear guide. Alternatively, a separate transfer device, including a robot, may be provided to move the substrate 1 from the stage 31 to the outside of the placement device 3.

[0074] In this embodiment, the alignment mark M on the surface of the substrate 1 placed on the stage 31 and the alignment mark m on the surface of the module 2 placed on the supply stage S are set to the same height. In this setting, the height of the support surface of the supply stage S and the stage 31 can be set by an adjustment mechanism (not shown), such as a micro-motion mechanism including push-pull screws, depending on the thickness of the flexible substrate 21 of the module 2 or the thickness of the substrate 1.

[0075] The head 32 is used to hold and hold the module 2 supported on the supply stage S, and to attach it to the substrate 1 supported on the carrier stage 31. Figure 4A As shown, the head 32 is supported on the linear motion mechanism 321 via the lifting mechanism 322, and is movably arranged between the two to transfer the module 2 from the supply table S to the platform 31. The linear motion mechanism 321, for example, includes a motor, a linear guide, and a ball screw, and is mounted above the supply table S and the platform 31, extending towards the table surface of the supply table S and the platform 31. The linear guide includes a track 321a, a guide 321b, a slider 321c, and a base 321d. The track 321a is mounted on the base 321d in a horizontally movable manner. The guide 321b is provided to grip the track 321a and is mounted on the slider 321c. The lifting mechanism 322, for example, includes a motor, a linear guide, and a ball screw, is supported on the slider of the linear motion mechanism 321, and extends in the direction of approaching / moving away from the supply table S and the platform 31. The slider 322c of the linear guide is mounted on the side of the head 32, and the guide 322b is mounted on the slider 322c. Furthermore, the track 322a is mounted vertically movable on the slider 321c of the linear motion mechanism 321. The head 32 is supported by the slider of the lifting mechanism 322. The linear motion mechanism 321 and the lifting mechanism 322 constitute the moving mechanism 320. Additionally, Figure 4A In the diagram, two of each of the rails 321a and guides 321b are shown, but the number can be increased or decreased depending on the size of the base 321d or the slider 321c. Similarly, the number of rails 322a and guides 322b can also be increased or decreased.

[0076] On the side of the head 32 facing the supply table S and the table 31, a holding portion 32a is provided. On the holding portion 32a, a suction hole not shown is provided on the side facing the supply table S and the table 31, and the module 2 is held by generating a negative pressure in the suction hole, so that the module 2 can be picked up from the supply table S. Further, the holding portion 32a releases the module 2 by canceling the negative pressure generated in the suction hole, so that the module 2 can be laid on the substrate 1. Furthermore, the holding portion 32a is rotatably provided in the θ direction with respect to the head 32 by a θ direction rotation mechanism not shown, so that the module 2 held thereby can be rotated in the θ direction. Thus, the holding portion 32a can adjust the orientation of the module 2 when the module 2 is laid on the substrate 1. In addition, the θ direction rotation mechanism is included in the moving mechanism 320.

[0077] On the head 32, a contact sensor not shown is provided. The contact sensor detects the case where the holding portion 32a contacts the module 2 or the case where the holding portion 32a contacts the substrate 1 in the state where the module 2 is held. The contact sensor is, for example, a gap sensor such as an eddy current sensor. Based on the contact information detected by the contact sensor, the head 32 can perform suction holding or release of the module 2.

[0078] The holding portion 32a of the present embodiment holds the module 2 in such a manner that at least two of the alignment marks m provided on the four corners of the module 2 can be recognized from above. This is achieved by the holding portion 32a holding the module 2 at a portion of the upper surface of the module 2 that does not interfere with the recognition of the alignment marks m from above. Furthermore, in the present embodiment, a transparent portion 32b including a transparent member such as quartz glass is provided on the side surface of the holding portion 32a on the optical path of the photographing portion 33 and the alignment marks m of the module 2 held by the holding portion 32a. That is, the photographing portion 33 photographs the alignment marks m through the transparent portion 32b. The lower surface of the transparent portion 32b is set to the same height as the lower surface of the holding portion 32a, whereby the module 2 is supported flat on its upper surface (the surface of the sealing member 23) by the holding portion 32a and the transparent portion 32b, and the head 32 can press the entire upper surface of the module 2 to the substrate 1 when the module 2 is laid on the substrate 1.

[0079] The photographing portion 33 is a camera having one optical system such as a lens and one photographing element that photograph the alignment marks m of the module 2 and the alignment marks M of the substrate 1 in the same field of view. That is, the photographing portion 33 is provided at a position facing the substrate 1 through the module 2 held by the head 32 and can photograph the alignment marks M provided on the substrate 1 and the alignment marks m provided on the module 2 positioned so as to face the portion of the substrate 1 to which the module 2 is to be laid in the same field of view. Further, the focal distance of the photographing portion 33 is set to a predetermined reference height position at which the alignment marks m of the module 2 facing the substrate 1 are positioned.

[0080] In this embodiment, the imaging unit 33 is supported on the linear motion mechanism 321 above the head 32. More specifically, two imaging units 33 are provided at each end of the U-shaped frame 33a supported on the linear motion mechanism 321. The frame 33a is provided such that one side of the parallel sides connecting the U-shape is supported on the linear motion mechanism 321, thereby being movable in the X-direction in conjunction with the movement of the head 32 in the X-direction. That is, the imaging unit 33 is positioned above the alignment mark m and the alignment mark M when the holding part 32a of the head 32 has held the module 2 and has been transported to the position facing the substrate 1. Thus, as Figure 8 As shown, each imaging unit 33 simultaneously captures images of corresponding alignment marks m and alignment marks M within the same field of view. "Capturing images within the same field of view" means simultaneously (at once) capturing multiple objects within that field of view. Each imaging unit 33 sends the images obtained from capturing alignment marks m and alignment marks M to the control device 8, which will be described later. Furthermore, each imaging unit 33 is positioned at a height that coincides with a predetermined reference height position where the focal length of the alignment mark m on the module 2 facing the substrate 1 is located.

[0081] The focus adjustment section 34 is a transparent component such as quartz glass that adjusts the focal length of the imaging section 33 relative to the alignment mark M, so that the focus is aligned with the alignment mark M. That is, the focus adjustment section 34 is provided in the optical path connecting the alignment mark M of the substrate 1 and the imaging section 33, extending the focal length of the imaging section 33 to the substrate 1. Thus, the focus adjustment section 34 is a component such that, since the actual focal position is moved away from the imaging section 33, the focus of the imaging section 33 is aligned with the alignment mark m of the module 2, which is closer to the imaging section 33, based on the state where the focus of the imaging section 33 is aligned with the alignment mark m. For example, the state where the alignment mark m is located 1 mm above the upper surface of the substrate 1 where the alignment mark M is located is set as a predetermined reference height position for positioning the alignment mark m. In this state, when imaging the alignment mark M and the alignment mark m within the same field of view, a focus adjustment section 34 with a thickness of approximately 0.3 mm is used in the optical path connecting the alignment mark M and the imaging section 33. Furthermore, as... Figure 8 As shown, the focus adjustment unit 34 covers half of the shooting field of view of the shooting unit 33. Figure 8 It is designed in a way that covers the lower half of the field of view, thus allowing for shooting in the remaining half of the field of view. Figure 8 Compared to the focal length of the upper part of the image (in the image), the focal length of the lower half of the field of view of the shooting unit 33 is extended. Furthermore, in the upper half of the field of view of the shooting unit 33 in this embodiment, as described later, the module 2 held by the head 32 and the alignment mark m are reflected. Thus, by means of the focal length adjustment unit 34, the focal length of the shooting unit 33 is fixedly set such that the focus is simultaneously aligned with both the predetermined alignment mark m and the alignment mark M.

[0082] The focus adjustment unit 34 is supported on the linear motion mechanism 321 via a support member (not shown), and is movably mounted in the X direction in conjunction with the movement of the head 32 and the shooting unit 33 in the X direction. Thus, as... Figure 4A As shown by the dashed arrow, when the imaging unit 33 is positioned above the substrate 1 and its focus is aligned with the alignment mark m of the module 2 held by the head 32, it can also align its focus with the alignment mark M. Therefore, the image captured by the imaging unit 33 becomes an image with both the focus aligned with the alignment mark m and the alignment mark M, thus enabling high-precision correction processing in the control device 8 described later. Furthermore, in practice, not only the focus adjustment unit 34 but also the transparent portion 32b extends the focal length of the imaging unit 33. Therefore, the focus adjustment unit 34 includes a transparent member that is thicker than the transparent portion 32b in the optical path direction connecting the substrate 1 and the imaging unit 33.

[0083] The control device 8 is a device for controlling the tiling apparatus 3. The control device 8 may include, for example, dedicated electronic circuitry or a computer operating according to a predetermined program. That is, the control device 8 controls the operation of the tiling apparatus 3 by controlling the movements of the supply table S, the platform 31, the head 32, the imaging unit 33, etc. Figure 6 As shown, the control device 8 includes a storage unit 81, a shooting control unit 82, a calculation unit 83, a movement control unit 84, a setting unit 85, and an input / output control unit 86.

[0084] Storage unit 81 is a storage medium such as a hard disk drive (HDD) or a solid state drive (SSD). Storage unit 81 stores pre-stored data and programs required for system operation, and also stores other data necessary for system operation. Capture control unit 82 controls the operation of capture unit 33. That is, it performs capture-related controls such as starting, capturing, stopping, image transmission, and focusing of capture unit 33. Calculation unit 83 calculates the deviation of alignment mark M and alignment mark m based on the captured image received from capture unit 33, and sends the calculated deviation to movement control unit 84.

[0085] The movement control unit 84 controls the movement of the supply stage S, the platform 31, and the movement mechanism 320. This control is based on data, programs, images captured by the imaging unit 33, and calculation results from the calculation unit 83, all pre-stored in the storage unit 81, required for system operation. In particular, in this embodiment, the movement control unit 84 controls the alignment of the module 2 held by the head 32 to the substrate 1 supported by the platform 31 based on the deviation of the alignment marks M and m calculated by the calculation unit 83. Furthermore, the control performed by the movement control unit 84 can also be based on user commands input from the input device 91 (described later).

[0086] The setting unit 85 is a processing unit that sets information for the storage unit 81 based on input. The input / output control unit 86 is an interface for controlling signal exchange or input / output with each unit that is controlled.

[0087] The control device 8 is connected to an input device 91 and an output device 92. The input device 91 is an input component that allows the operator to operate the installation device 3 via the control device 8, including switches, a touchscreen, a keyboard, and a mouse. The operator can input various information set in the storage unit 81 through the input device 91. The output device 92 is an output component that displays, lights, meters, etc., to show information used to confirm the device's status in a way that is recognizable to the operator. Furthermore, the output device 92 can display an input screen showing information received from the input device 91.

[0088] [effect]

[0089] Next, refer to Figure 4B (A) to Figure 4B (C) Figure 5 (A) to Figure 5 (D) and Figure 7 Here is an example of how this implementation method works. Figure 4B (A) to Figure 4B (C) indicates the situation during pickup. Figure 5 (A) to Figure 5 (D) indicates the installation process of the implementation method. Figure 7 This is a flowchart illustrating the installation process of the installation device 3. Although not shown, firstly, module 2 is supported on the supply platform S and moved into the frame C, and substrate 1 is also supported on the carrier platform 31 and moved into the frame C. The supply platform S and the carrier platform 31 are positioned adjacent to each other (see reference). Figure 3 Furthermore, the head 32, the shooting unit 33, and the focus adjustment unit 34 are supported above the supply table S by the linear motion mechanism 321, and stand by facing the module 2 to be picked up this time, which is supported on the supply table S.

[0090] First, such as Figure 4BAs shown in (A), the movement of the supply stage S and the movement mechanism 320 is controlled by the movement control unit 84 to bring the imaging unit 33 and the module 2 into a predetermined positional relationship. This predetermined positional relationship refers to the positional relationship in which the imaging unit 33 can capture the alignment mark m of the module 2 on the supply stage S via the focus adjustment unit 34. Next, the imaging unit 33 captures the alignment mark m of the module 2 to be picked up, supported on the supply stage S, via the imaging control unit 82, and sends the captured image to the movement control unit 84. The alignment mark m of the module 2 placed on the supply stage S is set to the same height as the alignment mark M of the substrate 1 placed on the stage 31; therefore, when the imaging unit 33 captures the alignment mark m of the module 2 on the supply stage S, a clear, focused image can be obtained via the focus adjustment unit 34. Based on the captured image, the movement control unit 84 calculates the position of the alignment mark m relative to the imaging unit 33 using known image processing techniques, and controls the movement of the supply stage S and the movement mechanism 320 to achieve the predetermined positional relationship. That is, the supply table S is moved in the Y direction, and the head 32 is moved in the X direction, thereby achieving the desired effect. Figure 5 As shown in (A), the head 32 is aligned with the module 2 to the specified position, i.e., the position for picking (step S01).

[0091] Then, as Figure 4B As shown in (B), the head 32 is moved toward the module 2 along the Z direction, so that the holding portion 32a of the head 32 contacts the upper surface of the module 2. Furthermore, a negative pressure is generated in the holding portion 32a of the head 32 to attract and hold the module 2. Figure 4B As shown in (C), the head 32 is moved to a height that allows it to move onto the substrate 1 without obstruction while the module 2 is held in place, thereby picking up the module 2 from the supply stage S (step S02). Furthermore, during pickup, the head is held at a height where the shooting unit 33 can focus on the alignment mark m of the module 2 without needing to pass through the focus adjustment unit 34.

[0092] Next, as Figure 5 As shown in (B), the head 32 holding the module 2 is moved along the X direction toward the position on the substrate 1 where the module 2 is to be laid, which is stored in the storage unit 81, and the stage 31 supporting the substrate 1 is moved along the Y direction. Thus, the module 2 is moved above the substrate 1 supported by the stage 31 (step S03). Here, the position on the substrate 1 where the module 2 is to be laid is defined as... Figure 5 (A) to Figure 5For example, in the case of (D), it refers to the position on the right upper side of the substrate 1, and next to the upper left side of the substrate 1, and then to the lower left side. In this movement, the movement control section 84 calculates a position in which the alignment mark m provided to the module 2 is deviated from the alignment mark M provided to the substrate 1 by a prescribed amount in the XY plane, in order to photograph the alignment mark M and the alignment mark m provided to the substrate 1 on which the module 2 is to be attached in the same field of view, and relatively moves the module 2 and the substrate 1 to position the alignment mark m to this position. The prescribed amount of the position deviated by the prescribed amount at this time refers to an amount based on the field of view range in the same field of view of the photographing section 33, that is, the photographing section 33 can photograph the alignment mark M of the substrate 1 without the focal distance adjustment section 34, and the photographing section 33 can photograph the alignment mark m of the module 2 with the focal distance adjustment section 34.

[0093] Subsequently, the head 32 is moved to a height at which the alignment mark M and the alignment mark m are photographed in the same field of view by the movement control section 84. The height is a height at which the focal point of the photographing section is aligned with the alignment mark m, and also aligned with the alignment mark M with the focal distance adjustment section 34. The height is a height based on a design value of the focal distance stored in advance. Further, the photographing section 33 photographs a photographing image in which the alignment mark m provided to the module 2 and the alignment mark M provided to the substrate 1 are converged in the same field of view, and transmits it to the arithmetic section 83 and the movement control section 84 by the photographing control section 82 (step S04). The photographing field of view of the photographing section 33 at this time is described with reference to FIG. 8. Figure 8

[0094] Figure 8 The photographing section 33 is photographing the alignment mark m of the module 2 and the alignment mark M of the substrate 1. The photographing section 33 is positioned so as to simultaneously reflect the two alignment marks in order to photograph the alignment mark m and the alignment mark M in the same field of view. In the figure, hatching is applied to the portion of the module 2. Figure 8 The area indicated by the circle in FIG. 8 is the photographing field of view. The alignment mark M and the alignment mark m are displayed in the circle, that is, in the same photographing field of view. At this time, the outline of the module 2 and the alignment mark m are reflected on the upper side of the figure, and the photographing section 33 photographs the alignment mark m in the area on the upper side of the figure. Meanwhile, the alignment mark M is reflected on the lower side of the figure, and the photographing section 33 photographs the alignment mark M in the area on the lower side of the figure.

[0095] Here, the focal distance adjustment section 34 including the transparent member is located on the optical path of the photographing section 33 up to the alignment mark M. That is, the focal distance adjustment section 34 is located on the optical path of the photographing section 33 up to the alignment mark M. Figure 8 ​The region on the lower side. By the focus adjustment section 34, the focus of the photographing section 33 is aligned with the alignment mark M. That is, by the photographing control section 82, the focus of the photographing section 33 is aligned with the alignment mark m of the module 2, and by the focus adjustment section 34, it is also aligned with the alignment mark M of the substrate 1. Thus, the photographing section 33 can photograph both the alignment mark M and the alignment mark m, which are located at different distances, with the focus aligned.

[0096] Further, in step S04, the head 32 can be further moved in the direction (Z direction) approaching / away from the photographing section 33 by the elevation mechanism 322, and the height position of the alignment mark m of the module 2 is adjusted so that the photographing section 33 is in focus. The upper surface of the module 2 is held by the holding section 32a. That is, the alignment mark m of the module 2 is held via the sealing member 23 by the holding section 32a. Thus, in the case where the thickness of the module 2 is uneven (as described above, the thickness of the sealing member 23 of the module 2 is formed by extending the curable resin, and thus is uneven), it can not be possible to perform the focusing on the module 2. At this time, by moving the height position of the head 32 up and down, the distance from the photographing section 33 to the alignment mark m can be adjusted to absorb the unevenness in the thickness of the sealing member 23. Such focusing can be performed by the photographing section 33 using a known method.

[0097] As described above, the height of the head 32 is positioned based on the designed value of the focus distance of the photographing section 33 with respect to the alignment mark m of the module 2. That is, at the time of photographing the alignment mark M and the alignment mark m, the alignment mark m of the module 2 is positioned at a prescribed interval (height) above the substrate 1. The interval is an interval that can be moved at the time of aligning the module 2 to the tiling position of the substrate 1. The interval is the height (distance) of the module 2 from the substrate 1, and corresponds to the distance adjusted by the focus adjustment section 34. Thus, the interval is fixed as the initial value at the time of photographing the alignment mark M and the alignment mark m, and is the position in the Z direction (the interval of the module 2 and the substrate 1). Thus, the thickness of the focus adjustment section 34 is determined by the interval. That is, the thickness of the focus adjustment section 34 is fixed. At this time, unlike the sealing member 23 of the module 2, the thickness of the substrate 1 is almost not uneven, and also almost does not deviate from the designed value. Thus, even if the focus of the photographing section 33 with respect to the alignment mark M of the substrate 1 via the focus adjustment section 34 is set based on the focus distance with respect to the alignment mark m of the module 2, it does not greatly deviate. Thus, even in the case where the thickness of the module 2 is uneven, and the focusing on the module 2 cannot be performed by the designed value, since the focus is aligned with the alignment mark M of the substrate 1, the head 32 can be controlled based on the thickness of the module 2 to move the module 2 up and down so that the focus is aligned with the alignment mark m of the module 2. Thus, it is possible to cope with the position variation of the alignment mark m due to the unevenness in the thickness of each module 2, and it is possible to more strictly align the focus with the alignment mark m.

[0098] After step S04, based on Figure 8 In the captured image shown, the arithmetic unit 83 detects the positions of alignment mark M and alignment mark m respectively, and calculates the positional relationship between alignment mark M and alignment mark m (step S05). That is, it calculates the deviation direction and deviation amount between alignment mark M and alignment mark m. In this embodiment, two imaging units 33 are provided. Through these two imaging units 33, two images can be acquired. Figure 8 The images shown are used to calculate the direction and amount of deviation between substrate 1 and module 2 based on the images taken from the two locations. Figure 9 The example shown in (A) illustrates a misalignment between the substrate 1 (the direction in which module 2 should be mounted) and the module 2 held by the head 32. The dashed circle represents the field of view. There are two imaging units 33, each representing its own field of view. The two imaging units 33 capture images of the alignment marks M and m in the left and right fields of view, respectively. Based on the captured images of the left and right alignment marks M and m, the positional relationship (direction and amount of deviation) between the left and right alignment marks M and m is calculated. Furthermore, the positional relationship (direction and amount of deviation) between the left and right alignment marks M and between the left and right alignment marks m is calculated, and the angle formed by the line connecting the two alignment marks M and the line connecting the two alignment marks m is calculated based on the results. This angle is the angle between the substrate 1 and the module 2. The positional relationship (direction and amount of deviation) between the substrate 1 and the module 2 is determined based on these calculation results. That is, based on the images captured by the two imaging units 33, the deviation direction and deviation amount of the alignment mark M and alignment mark m are calculated, thereby correcting the deviations in the XY and θ directions, and thus achieving... Figure 9 As shown in (C), accurate tiling can be achieved.

[0099] in addition, Figure 9 The example in (A) represents an extreme directional deviation for ease of understanding, but since alignment relative to head 32 is performed during pickup in module 2, it is unlikely to produce, for example... Figure 9the position relationship of the alignment mark M and the alignment mark m becomes reversed. Assuming that the module 2 has deviated in the movement of the head 32, in the case where the position relationship of the alignment mark M and the alignment mark m becomes reversed, either one of the alignment marks M will be covered by the module 2 and become a state where it cannot be photographed at all. In such a case, the processing will be stopped as an error. Also, as explained in step 03, in order to photograph the alignment mark M and the alignment mark m in the same field of view, the module 2 is positioned at a position where the alignment mark m is deviated from the alignment mark M by a prescribed amount in the XY plane. Therefore, the position relationship of the alignment mark M and the alignment mark m becomes reversed is avoided. However, there is a possibility that the module 2 will be out of the field of view, in which case either one of the alignment marks cannot be photographed, in which case the processing will be stopped as an error. Therefore, regarding the deviation of the direction of the substrate 1 and the module 2, instead of performing the operation of the angle formed by the line connecting the two alignment marks M and the line connecting the two alignment marks m, the operation can be performed based on the difference amount of the deviation amount of the position relationship (deviation direction and deviation amount) of the left and right alignment marks M and the alignment marks m. That is, the direction (angle) of the deviation can be operated based on the interval of the left and right alignment marks M, the alignment marks m. At this time, it is possible to make the operation processing simple.

[0100] Further, the operation section 83 transmits the operation result to the movement control section 84, and the movement control section 84 moves the stage 31 in the Y direction, moves the head 32 in the X direction, and moves the holding section 32a in the θ direction based on the operation result, so as to align the module 2 to the substrate 1 so that the alignment mark M and the alignment mark m coincide with each other in plan view (step S06) as shown in (C) of FIG. 8. Figure 5 Further, the operation section 83 transmits the operation result to the movement control section 84, and the movement control section 84 moves the stage 31 in the Y direction, moves the head 32 in the X direction, and moves the holding section 32a in the θ direction based on the operation result, so as to align the module 2 to the substrate 1 so that the alignment mark M and the alignment mark m coincide with each other in plan view (step S06) as shown in (C) of FIG. 8. Figure 5 Further, the operation section 83 transmits the operation result to the movement control section 84, and the movement control section 84 moves the stage 31 in the Y direction, moves the head 32 in the X direction, and moves the holding section 32a in the θ direction based on the operation result, so as to align the module 2 to the substrate 1 so that the alignment mark M and the alignment mark m coincide with each other in plan view (step S06) as shown in (C) of FIG. 8.

[0101] [Effects]

[0102] (1) The mounting device 3 of this embodiment includes: a stage 31 that supports the substrate 1; a head 32 that carries the module 2 on which a plurality of elements are mounted to a position facing the substrate 1; a camera 33 that faces the substrate 1 through the module 2 held by the head 32 and photographs the alignment mark M provided on the substrate 1 and the alignment mark m provided on the module 2 in the same field of view; and a focus adjustment section 34 that is provided on the optical path connecting the alignment mark M and the camera 33, adjusts the focus of the camera 33 with respect to the alignment mark M so that the focal point of the camera 33 simultaneously aligns with the alignment mark M and the alignment mark m, and the head 32 mounts the module 2 to the substrate 1 based on the image photographed by the camera 33.

[0103] Thus, the substrate 1 can be aligned with the module 2 based on the captured images of the alignment marks M and m, which are different in distance from the photographing section. Therefore, the substrate 1 can be aligned with the module 2 with high accuracy. In order to align the substrate 1 with the module 2, the module 2 must be moved above the substrate 1. Therefore, when the module 2 is positioned to face the portion of the substrate 1 to which the module 2 is to be aligned, there is a gap between the substrate 1 and the module 2. Therefore, the distance from the photographing section 33 to the module 2 is shorter than the distance from the photographing section 33 to the substrate 1. That is, in a state where the focus is aligned with the module 2, the focus cannot be aligned with the substrate 1. Similarly, in a state where the focus is aligned with the substrate 1, the focus cannot be aligned with the module 2. Therefore, in the related art, the photographing is performed by the cameras (corresponding to the photographing section 33 of the present embodiment) that respectively align the focus with the alignment marks M and m of the substrate 1 and the module 2. The positional relationship between the substrate 1 and the module 2 is indirectly calculated based on the positions of the respective alignment marks recognized from the respective captured images and the positional relationship between the two cameras. However, at this time, the positions of the cameras can change due to thermal expansion or vibration generated at the time of photographing, and thus it is difficult to perform alignment with high accuracy. Furthermore, in order to align the directions of the substrate 1 and the module 2, the photographing is performed by the two cameras (photographing sections 33) that respectively and independently perform photographing of the alignment marks of the substrate 1 and the module 2 at two places, and the positions of the alignment marks of the substrate 1 and the module 2 are recognized at the two places. At the time of alignment for alignment, it is difficult to perform alignment with high accuracy due to errors in the positional relationship between the two cameras caused by thermal expansion or vibration generated at the time of photographing. Moreover, since four cameras are used as described above, the device structure becomes complicated. On the other hand, the photographing section 33 of the present embodiment photographs the alignment marks M and m of the substrate 1 and the module 2 in the same field of view. Therefore, even if vibration or the like is generated at the time of photographing, the relative positional relationship between the alignment marks M and m does not change. Moreover, two photographing sections 33 are used instead of four cameras as described above. Therefore, the error between the cameras is halved, and thus alignment with high accuracy can be performed, and the device structure can be simplified.

[0104] (2) In a state where the focus of the photographing section 33 is aligned with the alignment mark M, the head 32 moves the module 2 toward the photographing section 33 or away from the photographing section 33 according to the thickness of the module 2 held by the head 32, and aligns the focus of the photographing section 33 with the alignment mark m. Thus, the focus can be more strictly aligned with the alignment mark m of the module 2. Moreover, even if the thickness of the substrate 1 or the module 2 is uneven, the focus can be easily aligned, and thus the substrate 1 can be aligned with the module 2 with high accuracy.

[0105] [Modifications]

[0106] (1) In the embodiment, the focal length adjustment section 34 is supported by the linear movement mechanism 321 and moves in the X direction in conjunction with the head 32 and the photographing section 33, but is not limited thereto. For example, as shown in (A) of FIG. 10, the focal length adjustment section 34 can be provided integrally with the transparent section 32b on the side of the holding section 32a of the head 32. By this means, the alignment of the focal length adjustment section 34 with respect to the photographing section 33 can be simplified. In particular, it is possible to easily perform the adjustment of the position in the field of view, for example, to half thereof, via the focal length adjustment section 34. Figure 10

[0107] (2) Also, as shown in (B) of FIG. 10, the focal length adjustment section 34 can be provided to the photographing section 33. By this means, as in the modification, the alignment of the focal length adjustment section 34 with respect to the photographing section 33 can be easily performed. Figure 10

[0108] (3) Further, as shown in (C) of FIG. 10, the focal length adjustment section 34 can be provided directly to the head 32. In this case, the focal length adjustment section 34 moves up and down in conjunction with the head 32, but as long as the photographing section 33 is positioned on the optical path of the photographing alignment mark M, the focal point of the photographing section 33 is aligned with the alignment mark M, and thus the alignment can be performed. Also, the arrangement and shape of the focal length adjustment section 34 must be such that the focal length adjustment section 34 does not appear on the optical path of the photographing alignment mark m. For example, as shown in (C) of FIG. 10, the focal length adjustment section 34 is provided with a hole (indicated by a dotted line in the figure) on the optical path of the photographing alignment mark m, and the photographing section 33 can photograph the alignment mark m through the hole. Thus, in the photographing of the alignment mark m, the photographing can be performed in the state of the focal point alignment without passing through the focal length adjustment section 34. Figure 10 Figure 10

[0109] (4) In the embodiment, the photographing section 33 is supported by the linear movement mechanism 321, but is not limited thereto. For example, it can be provided fixed to the frame C above the substrate 1. By this means, the influence of the vibration generated in conjunction with the movement of the photographing section 33 or the vibration generated in the tiling device 3, and the like can be avoided, and thus the error in the alignment can be reduced. In this case, the stage 31 is configured to be movable not only in the Y direction but also in the X direction, and thus the alignment mark M of the substrate 1 can be moved directly below the photographing section 33 provided to the frame C.

[0110] ​​​​(5) In the embodiment, two photographing sections 33 are provided to perform photographing at the same time, but as long as the relative angle of the module 2 picked up and held and the substrate 1 supported on the stage 31 deviates within an allowable range, θ alignment (alignment of the direction) of the module 2 with respect to the substrate 1 is not required, in which case, the photographing section 33 can also be one. In addition to being able to simplify the device structure, it is also possible to simplify the image processing or calculation for alignment, and thus it is possible to shorten the tact time of the tiling, thereby enabling an increase in productivity. Furthermore, an optical system including a mirror or a prism that enables observation of a plurality of sites can also be applied to the optical system of the photographing section 33 or an optical system outside the photographing section 33, thereby enabling photographing of two sets of alignment marks M, m at a time. At this time, the photographing section 33 can also be one. Furthermore, one photographing section 33 can also be moved to photograph the two sets of alignment marks M, m. At this time, it is also possible to obtain information on the relative direction of the substrate 1 and the module 2. In either case, it is possible to simplify the device structure, reduce the number of components used, thereby enabling a reduction in the cost of the device, and it is also possible to suppress the occurrence of malfunctions. Furthermore, it is also not necessary to perform a correction operation between the two photographing sections 33, thereby enabling ease of manufacture or maintenance of the device.

[0111] (6) In the embodiment, the alignment mark M on the surface of the substrate 1 placed on the stage 31 and the alignment mark m on the surface of the module 2 placed on the supply stage S are set to the same height, and when the photographing section 33 is used to photograph the alignment mark m on the surface of the module 2 placed on the supply stage S, the alignment mark is photographed via the focal length adjustment section 34. However, in the case where the height of the alignment mark m of the module 2 placed on the supply stage S is set to the height at which the module 2 is held by the head 32 and the alignment mark m and the alignment mark M are photographed at the same time, it is also possible to recognize the pickup position. At this time, when photographing is performed using the photographing section 33, the alignment mark m is directly photographed in the field of view without passing through the focal length adjustment section 34.

[0112] [Other Embodiments]

[0113] The present application is not limited to the embodiments described above, and various modifications can be made to the constituent elements within a range not deviating from the gist thereof in the implementation stage. Furthermore, various applications can be formed by appropriate combinations of a plurality of constituent elements disclosed in the embodiments. For example, several constituent elements can be deleted from all of the constituent elements shown in the embodiments. Furthermore, constituent elements across different embodiments can be appropriately combined.

Claims

1. A tiling device comprising: a stage supporting a substrate; a head that carries a module on which a plurality of elements are mounted to a position facing the substrate; a camera that photographs a first alignment mark provided on the substrate and a second alignment mark provided on the module in the same field of view through the module held by the head; and a focal length adjustment section that is provided on an optical path connecting the first alignment mark and the camera, adjusts a focal length of the camera with respect to the first alignment mark so that a focal point of the camera simultaneously aligns with the first alignment mark and the second alignment mark, the head tiling the module to the substrate based on an image photographed by the camera, wherein in a state in which the focal point of the camera is aligned with the first alignment mark via the focal length adjustment section, the head moves the module toward a direction of approaching / leaving the camera in accordance with a thickness of the module held by the head, thereby aligning the focal point of the camera with the second alignment mark.

2. The tiling device according to claim 1, wherein the focal length adjustment section is supported by a linear movement mechanism, and the focal length adjustment section is provided so as to move in an X direction in conjunction with the head and the camera.

3. The tiling device according to claim 1, wherein the focal length adjustment section is provided to the head.

4. The tiling device according to claim 1, wherein the focal length adjustment section is provided to a holding section of the head.

5. The tiling device according to claim 1, wherein the focal length adjustment section is provided to the camera.

6. The tiling device according to any one of claims 1 to 5, wherein the camera is provided in two, the first alignment mark and the second alignment mark are provided in two groups, each of the cameras photographs each of the groups of the first alignment mark and the second alignment mark in the same field of view simultaneously. ​

Images