An LED phosphor mixing process

Abstract

The present invention provides an LED phosphor mixing process, which comprises the following steps: taking a phosphor with a gallium content α as a mother powder, taking a phosphor with the same composition as the mother powder and a gallium content β as a daughter powder, wherein the content α is greater than the content β, and adding the mother powder and the daughter powder into a mixer for mixing; mixing the mother powder and the daughter powder according to a calculated weight percentage (x:y), ensuring that x is greater than y, adding the mixed powder into the mixer for rolling mixing to obtain mixed powder A1, and taking out part of the mixed powder A1 from the mixer for shipment. The present invention changes the phosphor mixing process, controls the mixing ratio, process, and shipment, eliminates differences between batches of LED phosphors, eliminates a trial mixing process when the phosphors are used in an LED packaging dispensing station, adopts a step-by-step incremental method to directly configure each batch of mixed powders in the mixer, effectively improves the control of product order yield, and reduces the cost caused by phosphor ratio control.

Description

Technical Field

[0001] The invention belongs to the technical field of phosphor manufacturing technology, and particularly relates to a LED phosphor mixing process. Background Art

[0002] Currently, white light LEDs are mainly realized in three forms: 1) using a combination of red, green, and blue LEDs to emit light, i.e., multi-chip white light LEDs; 2) using blue LED chips and yellow phosphors to obtain white light by complementing the blue and yellow lights, or using blue LED chips with red and green phosphors to obtain white light by mixing the blue light emitted by the chip with the red and green light emitted by the phosphors; 3) using near-ultraviolet light emitted by ultraviolet LED chips to excite the three primary colors of phosphors to obtain white light. The latter two methods of obtaining white light LEDs require the use of phosphors, which are called phosphor converted light emitting diodes (pc-LEDs). Compared with multi-chip white light LEDs, pc-LEDs have advantages in control circuits, production costs, heat dissipation, etc., and currently dominate the LED product market.

[0003] In existing LED packaging technology, due to the differences between batches of phosphors, it is necessary to proportion and evenly mix high-end and mid-range products, so as to control costs while meeting the performance requirements. At this time, LED packaging companies need to stop production at the dispensing station to wait for the proportioning results and debug the phosphor proportioning scheme. The time and labor costs spent on this process are huge, and the control over order yield is relatively low. In addition, due to the differences between batches of phosphors in the process of using phosphors, LED packaging companies also need to set up a proportioning group to control in the dispensing process, which consumes huge amounts of labor costs, materials, order delivery time, yield control, etc. Therefore, a new technical solution is needed to improve it. Summary of the Invention

[0004] In response to the above-mentioned deficiencies in the prior art, the present invention provides an LED phosphor mixing process, which effectively improves the control of the order yield of LED phosphor products and reduces the cost caused by the control of LED phosphor ratio.

[0005] The present invention is implemented through the following technical solutions: A LED phosphor powder mixing process includes the following steps:

[0006] S1: taking a phosphor with a gallium content of α as a mother powder, taking a phosphor with the same composition as the mother powder and a gallium content of β as a daughter powder, wherein the content α is greater than the content β, and adding the mother powder and the daughter powder into a mixer for mixing;

[0007] S2: The mother powder and the sub-powder are mixed according to the weight percentage (x:y), ensuring that x>y, and the mixed powder is added to the mixer and rolled to mix to obtain mixed powder A1. Part of the mixed powder A1 is taken out from the mixer for shipment;

[0008] S3: The mixed powder A1 in the mixer and the newly added sub-powder are mixed in a weight percentage ratio of mixed powder A1:sub-powder=x:y, and the mixer is rolled to mix to obtain mixed powder A2. Part of the mixed powder A2 is taken out from the mixer for shipment.

[0009] Furthermore, the present invention further comprises the following steps:

[0010] S4: The mixed powder A2 in the mixer and the newly added sub-powder are mixed according to the weight percentage (x:y), and the mixer is rolled to mix to obtain mixed powder A3, and a portion of the mixed powder A3 is taken out from the mixer for shipment;

[0011] S5: The mixed powder A3 in the mixer and the newly added sub-powder are mixed according to the weight percentage (x:y), and the mixer is rolled to mix to obtain mixed powder A4. Part of the mixed powder A4 is taken out from the mixer for shipment;

[0012] S6: The mixed powder A4 in the mixer and the newly added sub-powder are mixed according to the weight percentage (x:y), and the mixer is rolled to mix to obtain mixed powder A5, and a portion of the mixed powder A5 is taken out of the mixer for shipment;

[0013] S7: The mixed powder A5 in the mixer and the newly added sub-powder are mixed according to the weight percentage (x:y), and the mixer is rolled to mix to obtain mixed powder A6, and the mixed powder A6 is taken out from the mixer for shipment.

[0014] Furthermore, the content α ranges from 40% to 50%, and the content β ranges from 20% to 30%.

[0015] Furthermore, in the percentage (x:y), x is 66% to 67%, and y is 33% to 34%.

[0016] Furthermore, the mother powder is one of Class I, Class II, and Class III, the Class I component contains elements Y, Al, Ga, Ce, and O, the Class II component contains elements Sr, Ca, Al, Si, N, and Eu, and the Class III component contains elements Ca, Al, Si, N, and Eu.

[0017] The beneficial effects of the present invention are as follows: the present invention changes the phosphor mixing process, controls it through mixing ratio, process and shipment, eliminates the trial mixing process when using phosphor in LED packaging dispensing station, and adopts step-by-step incremental method to directly configure each batch of mixed powder in the mixer, thereby effectively improving the control of LED phosphor product order yield and reducing the cost caused by LED phosphor ratio control. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a process flow chart of the present invention. DETAILED DESCRIPTION

[0019] The present invention will be described in further detail below with reference to the accompanying drawings and embodiments.

[0020] Example 1

[0021] like Figure 1 As shown, a LED phosphor powder mixing process includes the following steps:

[0022] S1: Take a high-grade phosphor with a gallium content of 40% as a mother powder (containing the elements Y, Al, Ga, Ce, and O), and a mid-grade phosphor with the same composition and a gallium content of 20% as a daughter powder. Add the mother powder and daughter powder into a mixer and mix them, thereby controlling costs while meeting the performance requirements;

[0023] S2: The master powder and the seed powder are mixed according to the calculated weight percentage of 66.5%:33.5%, and the mixing is carried out in a mixer to obtain mixed powder A1. Part of the mixed powder A1 is taken out from the mixer for shipment. The mixed powder of batch A1 is set as a high-quality product, which is suitable for LED packaging products and is mainly used in Class A chips (chip wavelength 450-451nm, chip wavelength range 1nm, chip voltage is relatively stable 2.9-3.0V);

[0024] S3: Mix the mixed powder A1 in the mixer and the newly added sub-powder in a weight percentage of 66.5%:33.5%, and mix them in the mixer to obtain mixed powder A2. Part of the mixed powder A2 is taken out of the mixer for shipment, and the mixed powder batch A2 is set as good quality. It is suitable for LED packaging products, mainly used in Class B chips (chip wavelength 447-457nm chip wavelength range 10nm, chip voltage is relatively stable 2.9-3.0V);

[0025] S4: Mix the mixed powder A2 in the mixer and the newly added sub-powder in a weight ratio of 66.5%:33.5%, and roll the mixer to mix to obtain mixed powder A3. Part of the mixed powder A3 is removed from the mixer for shipment, and the A3 batch of mixed powder is set as medium quality; it is suitable for LED packaging products, mainly used in square chips (chip wavelength 445-455nm, chip wavelength range 10nm, chip voltage 2.6-3.0V wide span);

[0026] S5: Mix the mixed powder A3 in the mixer and the newly added sub-powder in a weight ratio of 66.5%:33.5%, and roll the mixer to mix to obtain mixed powder A4. Part of the mixed powder A4 is removed from the mixer for shipment, and the mixed powder batch A4 is set as a medium-defective product; it is suitable for LED packaging products, mainly used in small wafers (chip wavelength 445-455nm, chip wavelength range 10nm, chip voltage is not sorted);

[0027] S6: Mix the mixed powder A4 in the mixer and the newly added sub-powder in a weight percentage of 66.5%:33.5%, and roll the mixer to mix to obtain mixed powder A5. Part of the mixed powder A5 is removed from the mixer for shipment, and the mixed powder batch A4 is designated as defective. This is suitable for LED packaging products, mainly used in medium wafers (chip wavelength 440-465nm, chip wavelength range 15nm, chip voltage is not sorted);

[0028] S7: Mixed powder A5 in the mixer and the newly added sub-powder are mixed in a weight ratio of 66.5%:33.5%. The mixer is then rolled to produce mixed powder A6. Mixed powder A6 is removed from the mixer for shipment. Mixed powder A6 is designated as standard. This batch is suitable for LED packaging products, primarily for large wafers (chip wavelength 440-465nm, with no quality control).

[0029] This embodiment adopts a step-by-step incremental method to directly configure each batch of mixed powder in the mixer, effectively improving the control of the yield rate of LED phosphor product orders and reducing the cost caused by the control of LED phosphor ratio.

[0030] Example 2

[0031] This embodiment differs from the first embodiment in that the gallium content of the daughter powder is adjusted according to the gallium content of the mother powder, and includes the following steps:

[0032] S1: Take a high-grade phosphor with a gallium content of 40% as a master powder (containing the elements Y, Al, Ga, Ce, and O), and a mid-grade phosphor with the same composition and a gallium content of 30% as a daughter powder. Add the master powder and daughter powder into a mixer and mix them, thereby controlling costs while meeting the performance requirements;

[0033] S2: The master powder and the seed powder are mixed according to the calculated weight percentage of 66.5%:33.5%, and the mixing is carried out in a mixer to obtain mixed powder A1. Part of the mixed powder A1 is taken out from the mixer for shipment. The mixed powder of batch A1 is set as a high-quality product, which is suitable for LED packaging products and is mainly used in Class A chips (chip wavelength 450-451nm, chip wavelength range 1nm, chip voltage is relatively stable 2.9-3.0V);

[0034] S3: Mix the mixed powder A1 in the mixer and the newly added sub-powder in a weight percentage of 66.5%:33.5%, and mix them in the mixer to obtain mixed powder A2. Part of the mixed powder A2 is taken out of the mixer for shipment, and the mixed powder batch A2 is set as good quality. It is suitable for LED packaging products, mainly used in Class B chips (chip wavelength 447-457nm chip wavelength range 10nm, chip voltage is relatively stable 2.9-3.0V);

[0035] S4: Mix the mixed powder A2 in the mixer and the newly added sub-powder in a weight ratio of 66.5%:33.5%, and roll the mixer to mix to obtain mixed powder A3. Part of the mixed powder A3 is removed from the mixer for shipment, and the A3 batch of mixed powder is set as medium quality; it is suitable for LED packaging products, mainly used in square chips (chip wavelength 445-455nm, chip wavelength range 10nm, chip voltage 2.6-3.0V wide span);

[0036] S5: Mix the mixed powder A3 in the mixer and the newly added sub-powder in a weight ratio of 66.5%:33.5%, and roll the mixer to mix to obtain mixed powder A4. Part of the mixed powder A4 is removed from the mixer for shipment, and the mixed powder batch A4 is set as a medium-defective product; it is suitable for LED packaging products, mainly used in small wafers (chip wavelength 445-455nm, chip wavelength range 10nm, chip voltage is not sorted);

[0037] S6: Mix the mixed powder A4 in the mixer and the newly added sub-powder in a weight percentage of 66.5%:33.5%, and roll the mixer to mix to obtain mixed powder A5. Part of the mixed powder A5 is removed from the mixer for shipment, and the mixed powder batch A5 is set as defective; it is suitable for LED packaging products, mainly used in medium wafers (chip wavelength 440-465nm, chip wavelength range 15nm, chip voltage is not sorted);

[0038] S7: Mixed powder A5 in the mixer and the newly added sub-powder are mixed in a weight ratio of 66.5%:33.5%. The mixer is then rolled to produce mixed powder A6. Mixed powder A6 is removed from the mixer for shipment. Mixed powder A6 is designated as standard. This batch is suitable for LED packaging products, primarily for large wafers (chip wavelength 440-465nm, with no quality control).

[0039] This embodiment adopts a step-by-step incremental method to directly configure each batch of mixed powder in the mixer and adjust the gallium content of the sub-powder, effectively improving the control of the order yield of LED phosphor products and reducing the cost caused by the control of LED phosphor ratio.

[0040] Example 3

[0041] This embodiment differs from the first embodiment in that the gallium content of the daughter powder is adjusted according to the gallium content of the mother powder, and includes the following steps:

[0042] S1: Take a high-grade phosphor with a gallium content of 50% as a mother powder (containing the elements Y, Al, Ga, Ce, and O), and a mid-grade phosphor with the same composition and a gallium content of 20% as a daughter powder. Add the mother powder and daughter powder into a mixer and mix them, thereby controlling costs while meeting the performance requirements;

[0043] S2: The master powder and the seed powder are mixed according to the calculated weight percentage of 66.5%:33.5%, and the mixing is carried out in a mixer to obtain mixed powder A1. Part of the mixed powder A1 is taken out from the mixer for shipment. The mixed powder of batch A1 is set as a high-quality product, which is suitable for LED packaging products and is mainly used in Class A chips (chip wavelength 450-451nm, chip wavelength range 1nm, chip voltage is relatively stable 2.9-3.0V);

[0044] S3: Mix the mixed powder A1 in the mixer and the newly added sub-powder in a weight percentage of 66.5%:33.5%, and mix them in the mixer to obtain mixed powder A2. Part of the mixed powder A2 is taken out of the mixer for shipment, and the mixed powder batch A2 is set as good quality. It is suitable for LED packaging products, mainly used in Class B chips (chip wavelength 447-457nm chip wavelength range 10nm, chip voltage is relatively stable 2.9-3.0V);

[0045] S4: Mix the mixed powder A2 in the mixer and the newly added sub-powder in a weight ratio of 66.5%:33.5%, and roll the mixer to mix to obtain mixed powder A3. Part of the mixed powder A3 is removed from the mixer for shipment, and the A3 batch of mixed powder is set as medium quality; it is suitable for LED packaging products, mainly used in square chips (chip wavelength 445-455nm, chip wavelength range 10nm, chip voltage 2.6-3.0V wide span);

[0046] S5: Mix the mixed powder A3 in the mixer and the newly added sub-powder in a weight ratio of 66.5%:33.5%, and roll the mixer to mix to obtain mixed powder A4. Part of the mixed powder A4 is removed from the mixer for shipment, and the mixed powder batch A4 is set as a medium-defective product; it is suitable for LED packaging products, mainly used in small wafers (chip wavelength 445-455nm, chip wavelength range 10nm, chip voltage is not sorted);

[0047] S6: Mix the mixed powder A4 in the mixer and the newly added sub-powder in a weight percentage of 66.5%:33.5%, and roll the mixer to mix to obtain mixed powder A5. Part of the mixed powder A5 is removed from the mixer for shipment, and the mixed powder batch A5 is set as defective; it is suitable for LED packaging products, mainly used in medium wafers (chip wavelength 440-465nm, chip wavelength range 15nm, chip voltage is not sorted);

[0048] S7: Mixed powder A5 in the mixer and the newly added sub-powder are mixed in a weight ratio of 66.5%:33.5%. The mixer is then rolled to produce mixed powder A6. Mixed powder A6 is removed from the mixer for shipment. Mixed powder A6 is designated as standard. This batch is suitable for LED packaging products, primarily for large wafers (chip wavelength 440-465nm, with no quality control).

[0049] This embodiment adopts a step-by-step incremental method to directly configure each batch of mixed powder in the mixer and adjust the gallium content of the sub-powder, effectively improving the control of the order yield of LED phosphor products and reducing the cost caused by the control of LED phosphor ratio.

[0050] Example 4

[0051] The difference between this embodiment and the first embodiment lies in that the composition of the masterbatch is changed to be suitable for low-radiation LED products.

[0052] S1: Take a high-grade phosphor with a gallium content of 45% as a mother powder (containing the elements Sr, Ca, Al, Si, N, and Eu), and a mid-grade phosphor with the same composition and a gallium content of 25% as a daughter powder. Add the mother powder and daughter powder into a mixer and mix them to control costs while meeting the performance requirements.

[0053] S2: The master powder and the seed powder are mixed in a calculated weight ratio of 66.5%:33.5%, and the mixture is rolled in a mixer to obtain mixed powder A1. Part of the mixed powder A1 is removed from the mixer for shipment. The mixed powder in batch A1 is designated as a superior product and is suitable for LED packaging products. It is mainly used in Class A chips (chip wavelength 450-451nm, chip wavelength range 1nm, and chip voltage is relatively stable at 2.9-3.0V). Utilizing the radiation absorption characteristics of strontium, it can be applied to low-radiation medical LED lighting.

[0054] S3: The mixed powder A1 in the mixer and the newly added sub-powder are mixed in a weight percentage of 66.5%:33.5%, and the mixer is rolled to mix to obtain mixed powder A2. Part of the mixed powder A2 is taken out of the mixer for shipment, and the A2 batch of mixed powder is set as good product; it is suitable for LED packaging products, mainly used in Class B chips (chip wavelength 447-457nm chip wavelength range 10nm, chip voltage is relatively stable 2.9-3.0V), and can be used in low-radiation LED liquid crystal backlight sources by utilizing the radiation absorption characteristics of strontium.

[0055] This embodiment uses a step-by-step incremental method to directly configure each batch of mixed powder in the mixer, and changes the master powder composition to be suitable for low-radiation LED products, effectively improving the control of LED phosphor product order yield and reducing the cost caused by LED phosphor ratio control.

[0056] The above-described embodiments are merely preferred embodiments of the present invention and do not constitute formal limitations on the present invention. Without departing from the scope of features defined in the claims, the present invention may also be modified, altered, and replaced with equivalents in other forms, all of which should fall within the scope of protection of the present invention.

Claims

1. A LED phosphor powder mixing process, characterized by: The following steps are involved: S1: taking a phosphor with a gallium content of α as a mother powder, and taking a phosphor with the same composition as the mother powder and a gallium content of β as a daughter powder, wherein the content α is greater than the content β, adding the mother powder and the daughter powder into a mixer for mixing, wherein the content α is in the range of 40% to 50%, and the content β is in the range of 20% to 30%; S2: The mother powder and the sub-powder are mixed in a weight percentage ratio of mother powder:sub-powder = x:y, where x>y, and the mother powder and the sub-powder are added to a mixer and rolled to mix to obtain mixed powder A1. A portion of the mixed powder A1 is taken out of the mixer for shipment, where x is 66% to 67% and y is 33% to 34%; S3: The mixed powder A1 in the mixer and the newly added sub-powder are mixed in a weight percentage ratio of mixed powder A1:sub-powder=x:y, and the mixer is rolled to mix to obtain mixed powder A2. Part of the mixed powder A2 is taken out from the mixer for shipment.

2. The LED phosphor powder mixing process according to claim 1, wherein: The following steps are also included: S4: The mixed powder A2 in the mixer and the newly added sub-powder are mixed according to the weight percentage x:y, and the mixer is rolled to mix to obtain mixed powder A3, and a portion of the mixed powder A3 is taken out from the mixer for shipment; S5: The mixed powder A3 in the mixer and the newly added sub-powder are mixed according to the weight percentage x:y, and the mixer is rolled to mix to obtain mixed powder A4, and a portion of the mixed powder A4 is taken out from the mixer for shipment; S6: The mixed powder A4 in the mixer and the newly added sub-powder are mixed according to the weight percentage x:y, and the mixer is rolled to mix to obtain mixed powder A5, and a portion of the mixed powder A5 is taken out from the mixer for shipment; S7: The mixed powder A5 in the mixer and the newly added sub-powder are mixed according to the weight percentage x:y, and the mixer is rolled to mix to obtain mixed powder A6, and the mixed powder A6 is taken out from the mixer for shipment.

3. The LED phosphor powder mixing process according to claim 1, wherein: The mother powder is one of Class I, Class II, and Class III. The Class I component contains elements Y, Al, Ga, Ce, and O; the Class II component contains elements Sr, Ca, Al, Si, N, and Eu; and the Class III component contains elements Ca, Al, Si, N, and Eu.

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