A processing method for gold-plated circuit board hand guiding lines and electrical measuring points

Abstract

The application discloses a kind of gold-plated circuit board hand guiding line and the processing method of electric measuring point, comprising the following steps: A, from the following dimension in CAM algorithm parameter setting;B, by CAM software, algorithm required parameter is artificially gradually input interface;C, call network judgment form to simplify;D, call size;D, call spacing card control.Through the above mode, the gold-plated circuit board hand guiding line and the processing method of electric measuring point, by the intelligent automation function classification in CAM software, artificially or machine script algorithm is called to make electric measuring point and wire, can consider gold-plated wire and electric measuring point in design end whole plate, also can be made in manufacturing end by this algorithm plus gold-plated hand guiding line and electric measuring point, improve the work efficiency of design and manufacture.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board design and production, in particular to a processing method of gold-plated finger guide line and electrical test point of a circuit board based on CAM. BACKGROUND

[0002] In the circuit board, the place where plugging or conduction with the outside world is required to have good conductivity and not be oxidized, and the copper surface of this place is usually plated with gold as the best choice, so it is commonly known as a gold finger.

[0003] In the process of plating gold on the copper surface of the circuit board, there are mainly electroplating gold and chemical plating gold. In the electroplating gold, the external current must be conducted to the place to be plated, and the plating guide wire needs to be designed additionally. In the chemical plating gold, the chemical tank is used for soaking, and the plating guide wire is not needed. However, both of them may have quality problems after production, especially gold is a precious metal, and the manufacturing party must strictly control the quality in terms of cost and yield. At this time, the electrical test technology is used, that is, the needle is electrified, and the network to be tested is touched by the needle point to confirm the conductivity. However, the needle point directly piercing the gold finger is too rough and easy to damage the gold plating layer.

[0004] In order to protect the gold plating layer, the guide wire can be extended out and an electrical test point can be added. Therefore, it is concluded that the electroplating needs a test point and a plating guide wire, and the chemical plating only needs a test point. In the prior art, the original design of the design end does not consider these links for the manufacturing end. The manufacturing end needs to design the test point and the guide wire additionally and extend them out of the board. After the plating and electrical test are completed, the excess part is cut off at one time when the board is formed. In order to reduce the difficulty of the manufacturing end, the electrical test problem needs to be considered in the design end. The design process of the circuit board is complex, and the electrical test problem further increases the complexity of the design process. The existing CAM usually does not consider the electrical test problem comprehensively. At present, the most common method is that the engineers manually operate the software to add the electrical test point one by one, which is a large amount of work and has high labor cost. Therefore, it needs to be improved. SUMMARY

[0005] The technical problem solved by the present application is to provide a processing method of gold-plated finger guide line and electrical test point of a circuit board, which comprehensively considers the electrical test problem in the design end of the circuit board by CAM to improve the design work efficiency of the circuit board.

[0006] To solve the above technical problems, one technical scheme adopted by the present application is to provide a processing method of gold-plated finger guide line and electrical test point of a circuit board, which comprises the following steps:

[0007] A. Setting algorithm parameters in the CAM from the following dimensions:

[0008] Dimension one, for electroplating, the following settings are made respectively:

[0009] 1 ) Electroplating gold:

[0010] 1.1 ) Manufacturing: must have gold-plated wires for power supply;

[0011] 1.2 ) Testing: can have electrical test points;

[0012] 2 ) Electroless plating gold:

[0013] 2.1 ) Manufacturing: no need for power supply, no need for gold-plated wires;

[0014] 2.2 ) Testing: can have electrical test points;

[0015] Dimension two, for gold-plated wires and electrical test points:

[0016] 1) Gold-plated wires:

[0017] From individual gold fingers, gold-plated wires are drawn out and finally gathered on a gold-plated wire bus, which continues to an endpoint where an electrode is connected for power supply, electroplating gold on the gold fingers on the network;

[0018] 2) Electrical test points:

[0019] Special electrical test points are extended from gold fingers;

[0020] 3) Both gold-plated wires and electrical test points:

[0021] Dimension three, for pin network design of gold fingers, set as follows:

[0022] 1) Single gold finger pin forms a separate network;

[0023] 2) Multiple gold finger pins share the same network;

[0024] 3) Single gold finger pin does not participate in any electrical network;

[0025] Dimension four, for electrical network reference of gold fingers, set as follows:

[0026] 1) Layer network: only consider the network of the layer, that is, two-dimensional network;

[0027] 2) Whole board network: consider the whole PCB multi-layer network, that is, three-dimensional network;

[0028] 3) If the gold fingers in the layer network are in the same network, the gold fingers in the whole board network must also be in the same network;

[0029] If the gold fingers in the whole board network are in the same network, but the gold fingers in the layer network may not be in the same network;

[0030] Dimension five, size control:

[0031] 1) The size of the electrical test point;

[0032] 2) The size of the gold-plated wire;

[0033] Dimension six, spacing control:

[0034] 1) Gold-plated wire to gold-plated wire

[0035] 2) Gold-plated wire to the drill hole of the original design

[0036] 3) Gold-plated wire to other copper objects of the original design

[0037] 4) Gold-plated wire to electrical test point

[0038] 5) Electrical test point to electrical test point

[0039] 6) Electrical test point to the drill hole of the original design

[0040] 7) Electrical test point to other copper objects of the original design

[0041] 8) Electrical test point to the formed wire

[0042] B. By CAM software, manually input the required parameters of the algorithm step by step through the interface:

[0043] 1.1, specify the two network judgment forms of dimension four;

[0044] 1.2, specify that each of the three types of gold fingers in dimension three corresponds to three types of additions in dimension two;

[0045] 1.3, specify the control data of dimension five and dimension six;

[0046] C. Call the network judgment form for simplification

[0047] 2.1, as long as multiple gold fingers are judged to share the same network, their gold-plated wires and test points can also be shared, and the multiple gold-plated wires originally drawn can be simplified into one, and whether to simplify can be selected;

[0048] 2.2, as long as it is judged that a single gold finger pin does not participate in any electrical network, the drawn wires and test points can be simplified and omitted, and whether to simplify can be selected;

[0049] D, call size:

[0050] 3.1, first generate the electrical test point and gold-plated wire with the specified size, but there may be overlapping due to the lack of spacing control;

[0051] 3.2. According to the size of the electrical test point, a plurality of distribution areas connected in sequence are generated;

[0052] E, call interval control:

[0053] 4.1, interval control when only adding electrical test points, distributing the electrical test points on adjacent conductive lines in the same or different distribution areas to avoid overlapping of the electrical test points;

[0054] 4.2, interval control when adding electrical test points and gold-plated conductive lines at the same time, distributing the electrical test points on adjacent conductive lines in the same or different distribution areas to avoid overlapping of the electrical test points, and extending the gold-plated conductive lines forward from the electrical test points.

[0055] In a preferred embodiment of the present application, the electrical test point is circular, and the diameter is greater than the width of the gold-plated conductive line.

[0056] In a preferred embodiment of the present application, the number of distribution areas is 2-4.

[0057] In a preferred embodiment of the present application, the forming line is a virtual line cut along the circuit board after the circuit board is made.

[0058] The beneficial effects of the present application are: the processing method of the gold-plated hand guide line and electrical test point of the present application uses the intelligent automation function classification in the CAM software, and the electrical test point and conductive line are made by manually or machine script calling algorithm, which can consider the production of gold-plated conductive line and electrical test point at the design end, and can add gold-plated hand guide line and electrical test point at the manufacturing end by using the algorithm, greatly improving the work efficiency of design and manufacturing. BRIEF DESCRIPTION OF DRAWINGS

[0059] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0060] Figure 1 is a common gold finger design in the art;

[0061] Figure 2 is a structure schematic diagram of a gold-plated conductive line bus in a processing method of a gold-plated hand guide line and electrical test point of a circuit board according to a preferred embodiment of the present application;

[0062] Figure 3 is a structure schematic diagram of a processing method of a gold-plated hand guide line and electrical test point of a circuit board according to a preferred embodiment of the present application only with electrical test points;

[0063] Figure 4 This is a schematic diagram of a preferred embodiment of the present invention, which combines gold-plated finger wires and electrical test points in a method for processing gold-plated finger wires and electrical test points on a circuit board.

[0064] Figure 5 This is a schematic diagram of a preferred embodiment of the pin network design for gold fingers in the processing method of gold-plated finger wires and electrical test points of a circuit board according to the present invention.

[0065] Figure 6 This is a schematic diagram of a preferred embodiment of the distribution area in the processing method of gold-plated finger wires and electrical test points on a circuit board according to the present invention;

[0066] Figure 7 This is a schematic diagram of a preferred embodiment of the present invention, which involves adding only electrical test points for spacing control in a method for processing gold-plated finger wires and electrical test points on a circuit board.

[0067] Figure 8 This is a schematic diagram of a preferred embodiment of the method for processing gold-plated finger wires and electrical test points on a circuit board according to the present invention, which involves spacing control when simultaneously adding electrical test points and gold-plated wires. Detailed Implementation

[0068] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0069] Based on years of experience in factory manufacturing, to maximize efficiency, at least the following dimensions should be considered:

[0070] The dimensions, location, and orientation of the electrical testing points;

[0071] The dimensions, location, and orientation of the conductor;

[0072] The distance between them;

[0073] The corresponding dimensions of each other;

[0074] The spacing relative to other original design elements;

[0075] Compared to the utilization rate of the entire board consumed...etc.

[0076] Compared to previous methods that only addressed certain aspects of the problem, this invention comprehensively considers all variables and solves them using CAM software algorithms.

[0077] Figure 1For a standard common gold finger design, the forming line is a virtual line along which the excess material is cut off after the circuit board is made, and the circuit board is cut off along the forming line after it is made. The content inside the forming line (on the board) is the finished product of the circuit board, and the content outside the forming line (off the board) is the excess material.

[0078] Please refer to Figures 2-8 The embodiment of the application comprises:

[0079] A processing method for a gold finger guide line and an electrical measurement point of a circuit board, comprising the following steps:

[0080] A. Set the algorithm parameters in the CAM from the following dimensions:

[0081] Dimension one, for the plating form, set as follows respectively:

[0082] 1) Gold plating:

[0083] 1.1) During manufacturing: gold plating guide lines must be used for power supply;

[0084] 1.2) During testing: electrical measurement points can be provided;

[0085] 2) Chemical gold plating:

[0086] 2.1) During manufacturing: no power supply is required, and no gold plating guide lines are needed;

[0087] 2.2) During testing: electrical measurement points can be provided;

[0088] Dimension two, for the gold plating guide line and the electrical measurement point:

[0089] 1) Gold plating guide line:

[0090] The gold plating guide line is drawn from individual gold fingers and finally gathered on a gold plating guide line gathering line, as shown in Figure 2 The gold plating guide line gathering line continues to extend to an end point, and an electrode is connected to the end point for power supply, so that the gold fingers on the network are electroplated with gold;

[0091] 2) Electrical measurement point:

[0092] Directly piercing the gold finger can also achieve the electrical measurement effect, but considering that the gold finger is usually too thin and difficult to pierce, and the gold finger will be damaged, a special electrical measurement point is needed, as shown in Figure 3 In this embodiment, the electrical measurement point is circular and has a diameter greater than the width of the gold plating guide line, facilitating detection;

[0093] 3) Simultaneously having both the gold plating guide line and the electrical measurement point, as shown in Figure 4

[0094] ​Dimension three, pin network design for gold fingers, as shown in Figure 5 , is set as follows:

[0095] 1) Single gold finger pin is a separate network;

[0096] 2) Multiple gold finger pins share the same network, as shown in Figure 5 , at least two gold finger pins share the same electrical network;

[0097] 3) Single gold finger pin does not participate in any electrical network. Since the gold finger is a whole row as a design unit, the whole row is a fixed pin under the fixed module, but when designing the network, not every finger pin is used, so there is a gold finger that does not participate in any electrical network;

[0098] Dimension four, electrical network for gold finger reference, is set as follows:

[0099] 1) When layer network: only consider the network of this layer, that is, two-dimensional network;

[0100] 2) Whole board network: consider the whole PCB multi-layer network, that is, three-dimensional network;

[0101] 3) If the gold fingers in the layer network are in the same network, then the gold fingers in the whole board network must be in the same network;

[0102] If the gold fingers in the whole board network are in the same network, but the gold fingers in the layer network are not necessarily in the same network, such as 2 wires in the layer network are not in the same network in the layer network, but in the same network in the whole board network;

[0103] Dimension five, size control:

[0104] 1) Electrical measuring point size;

[0105] 2) Gold-plated wire size;

[0106] Dimension six, spacing control:

[0107] 1) Gold-plated wire to gold-plated wire

[0108] 2) Gold-plated wire to original design drill hole

[0109] 3) Gold-plated wire to other copper objects in original design

[0110] 4) Gold-plated wire to electrical measuring point

[0111] 5) Electrical measuring point to electrical measuring point

[0112] 6) Electrical measuring point to original design drill hole

[0113] 7) Electric test point to other copper objects in the design of the original manuscript

[0114] 8) Electric test point to the forming line

[0115] B. By CAM software, the required parameters of the algorithm are manually input into the interface step by step:

[0116] 1.1. Specify two network determination forms of dimension four;

[0117] 1.2. Specify three gold finger forms in dimension three, each corresponding to three addition forms in dimension two;

[0118] 1.3. According to the design requirements, specify the control data of dimension five and dimension six;

[0119] C. Call the network determination form for simplification

[0120] 2.1. As long as multiple gold fingers are determined to share the same network, their gold-plated wires and test points can also be shared, and the originally drawn multiple gold-plated wires can be simplified into one, and whether to simplify can be selected;

[0121] 2.2. As long as it is determined that a single gold finger pin does not participate in any electrical network, the drawn wires and test points can be simplified and omitted, and whether to simplify can be selected;

[0122] D. Call the size:

[0123] 3.1. First, generate the specified size of the electric test point and the gold-plated wire, but because the spacing is not controlled, there may be overlapping situations, such as Figure 6 shown, the electric test point overlaps;

[0124] 3.2. According to the size of the electric test point, generate multiple distribution areas connected in sequence, and the number of distribution areas is 2-4, such as Figure 6 shown, in this embodiment, three distribution areas connected in sequence are used;

[0125] E. Call the spacing control:

[0126] 4.1. When only adding electric test points, control the spacing between adjacent wires to distribute the electric test points on the same or different distribution areas to avoid overlapping of electric test points, such as Figure 7 shown, the uppermost distribution area at the front end is relatively empty and can distribute the most electric test points;

[0127] 4.2. When adding electric test points and gold-plated wires at the same time, control the spacing, such as Figure 8 shown, distribute the electric test points on adjacent wires in the same or different distribution areas to avoid overlapping of electric test points, and extend the gold-plated wires forward from the electric test points.

[0128] In summary, the application points out a circuit board gold-plated lead guide and electrical measuring point processing method, perfects the CAM algorithm, can consider the gold-plated lead and electrical measuring point manufacturing in the design end, improves the design work efficiency, greatly shortens the working hours, and reduces the labor cost.

[0129] The above is only an embodiment of the application, and does not limit the patent scope of the application, and any equivalent structure or equivalent process transformation using the content of the application specification, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the application.

Claims

1. A method for processing gold-plated finger wires and electrical test points on a circuit board, characterized in that, Includes the following steps: A. Set the algorithm parameters in CAM from the following dimensions: Dimension 1: For each electroplating method, the following settings are defined: 1) Electroplating gold: 1.1) During manufacturing: Gold-plated wires must be used to conduct electricity; 1.2) During testing: electrical testing points may be present; 2) Chemical gold plating: 2.1) During manufacturing: no electricity is required, and no gold-plated wires are needed; 2.2) During testing: electrical testing points may be present; Dimension Two: For Gold-Plated Wires and Electrical Testing Points: 1) Gold-plated wires: Gold-plated wires are drawn from individual gold fingers and finally converge on a gold-plated wire convergence line. This gold-plated wire convergence line continues to extend to one end, where an electrode is connected to conduct electricity to electroplate gold onto the gold fingers on the network. 2) Electrical measuring points: Specialized electrical testing points extend from the gold fingers; 3) It also features gold-plated wires and electrical testing points; Dimension Three: The foot network design for the gold finger is set as follows: 1) Each gold finger foot forms its own network; 2) Multiple gold finger positions share the same network; 3) A single gold finger pin does not participate in any electrical network; Dimension Four: The electrical network for the gold finger reference is configured as follows: 1) Layer-specific network: This refers to a network that only considers the current layer, i.e., a two-dimensional network; 2) Whole-board network: Consider the entire PCB multi-layer network, that is, the three-dimensional network; 3) If the gold fingers in a layer network are the same as the network, then the gold fingers of the entire board network must be the same as the network. If the gold fingers in the whole board network are the same network, the gold fingers in the layer network may not be the same network. Dimension 5: Size Control 1) Dimensions of electrical measuring points; 2) Dimensions of gold-plated wires; Dimension Six: Spacing Control 1) Gold-plated wire to gold-plated wire 2) Gold-plated wire to the original design's drill hole 3) Gold-plated wires to other copper components in the original design. 4) Gold-plated wire to electrical test point 5) Electrical measurement point to electrical measurement point 6) Electrical test point to the borehole designed in the original manuscript 7) Electrical test point to other copper objects in the original design. B. Using CAM software, manually input the parameters required for the algorithm step by step into the interface: 1.1 Two network judgment forms for specifying dimension four; 1.

2. The three types of cheat codes in Dimension 3 correspond to the three types of additions in Dimension 2. 1.

3. Specify the control data for dimensions five and six; C. Simplify by calling the network judgment form. 2.1 As long as it is determined that multiple gold fingers share the same network, their gold-plated wires and measuring points can also be shared. The original multiple gold-plated wires can be simplified into one. Whether to simplify is optional. 2.2 If it is determined that a single gold finger pin does not participate in any electrical network, the need to pull out wires and measuring points can be simplified and eliminated. This simplification is optional. D. Call size: 3.1 First, generate electrical test points and gold-plated wires of the specified size, but due to the lack of spacing control, there will be overlap; 3.

2. Based on the dimensions of the electrical measurement points, generate multiple sequentially connected distribution areas; E. Invoke Spacing Control: 4.1 When only electrical measuring points are added, the spacing is controlled so that the electrical measuring points on adjacent conductors are distributed in the same or different distribution areas to avoid the overlap of electrical measuring points; 4.2 When applying electrical test points and gold-plated wires simultaneously, the spacing between them is controlled so that the electrical test points on adjacent wires are distributed in the same or different distribution areas to avoid overlap of the electrical test points, and the gold-plated wires extend forward from the electrical test points.

2. The method for processing gold-plated finger wires and electrical test points on a circuit board according to claim 1, characterized in that, The electrical test point is circular, and its diameter is greater than the width of the gold-plated wire.

3. The method for processing gold-plated finger wires and electrical test points on a circuit board according to claim 1, characterized in that, The number of distribution areas is 2 to 4.

4. The method for processing gold-plated finger wires and electrical test points on a circuit board according to claim 1, characterized in that, In dimension six, spacing control also includes 8) electrical measurement points to forming line.

5. The method for processing gold-plated finger wires and electrical test points on a circuit board according to claim 4, characterized in that, The forming line is a virtual line along which excess material is cut off after the circuit board is manufactured.

Images