Cooling components and radiators

Abstract

The present invention discloses a heat dissipation assembly and a radiator, wherein the heat dissipation assembly includes a substrate base, a substrate cover plate, a spoiler component and a plurality of heat dissipation components; the substrate cover plate is connected to the substrate base and forms a heat collection cavity for concentrating heat; the spoiler component includes a spoiler and a spoiler column, which are arranged in the heat collection cavity, the spoiler is equal in height to the heat collection cavity, the spoiler is at least partially arranged close to the substrate base, the spoiler is at least partially arranged close to the substrate cover plate, the side wall of the spoiler is arranged between the substrate cover plate and the substrate base, the side wall of the spoiler is used to support the substrate cover plate and the substrate base, and a cavity is arranged between adjacent side walls of the spoiler; a plurality of heat dissipation components are connected to the substrate cover plate, the heat dissipation component is provided with a heat dissipation pipeline, and the heat dissipation pipeline is connected to the heat collection cavity. The arrangement of the spoiler can improve the pressure bearing capacity, structural strength and reliability of the radiator, and can also significantly reduce thermal resistance, increase heat transfer coefficient, and play a role in strengthening heat transfer.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and in particular to a heat dissipation component and a heat sink. Background Art

[0002] With the rapid development of power electronics technology, electronic equipment is increasingly moving towards large capacity, high power, high integration and lightweight. As a result, the heat consumption density of equipment systems is increasing and the demand for environmental adaptability is also increasing. The high-reliability heat dissipation problem of electronic equipment has become a bottleneck that curbs the development of the industry.

[0003] Taking the heat sink of the Active Antenna Unit (AAU) as an example, its lightweight heat dissipation demand is mainly constrained by the internal high power consumption bottleneck chip. The existing technical solution can use a 3D VC heat sink to dissipate heat in the local high heat flux area, but this technical form has problems such as high leakage risk, low reliability, poor pressure bearing capacity, and easy deformation; at the same time, in the vertical placement state, the top of the heat collection cavity of the 3D VC heat dissipation module is prone to dry burning, resulting in the risk of over-temperature failure of the corresponding chip.

[0004] The heat dissipation capacity of the 3D VC heat dissipation module is closely related to its structural thermal design. In order to further improve the heat dissipation capacity of the 3D VC module itself and the entire machine, the inner cavity design of the heat dissipation module and the assembly structure design of the heat dissipation module and the outer shell need to be improved and optimized. Summary of the invention

[0005] The purpose of the present invention is to solve at least one of the above-mentioned technical problems existing in the prior art, and to provide a heat dissipation component and a radiator, which can improve the pressure bearing capacity, structural strength and reliability of the radiator, and can also significantly reduce thermal resistance, increase heat transfer coefficient, and play a role in enhancing heat transfer.

[0006] In a first aspect, an embodiment of the present invention provides a heat dissipation assembly, including:

[0007] Base plate base;

[0008] A substrate cover plate connected to the substrate base and forming a heat collection cavity for concentrating heat;

[0009] A spoiler component is arranged in the heat collection cavity, the spoiler component includes one or more spoilers and spoiler columns, the height of the spoiler is equal to the height of the heat collection cavity, the spoiler is at least partially arranged close to the substrate base, the spoiler is at least partially arranged close to the substrate cover plate, the side wall of the spoiler is arranged between the substrate cover plate and the substrate base, the side wall is used to support the substrate cover plate and the substrate base, and a cavity is arranged between adjacent side walls of the spoiler;

[0010] A plurality of heat dissipation components are connected to the substrate cover plate, and the heat dissipation components are provided with one or more heat dissipation pipelines, and the heat dissipation pipelines are connected to the heat collection cavity.

[0011] In a second aspect, an embodiment of the present invention provides a heat sink, comprising the heat dissipation assembly described in the first aspect.

[0012] An embodiment of the present invention includes: a heat dissipation component and a radiator, wherein the heat dissipation component includes a substrate base, a substrate cover, a spoiler component and a plurality of heat dissipation components; the substrate cover is connected to the substrate base and forms a heat collection cavity for concentrating heat; the spoiler component includes a spoiler plate and a spoiler column, which is arranged in the heat collection cavity, the spoiler plate is at the same height as the heat collection cavity, the spoiler plate is at least partially arranged close to the substrate base, the spoiler plate is at least partially arranged close to the substrate cover, the side wall of the spoiler plate is arranged between the substrate cover and the substrate base, the side wall of the spoiler plate is used to support the substrate cover and the substrate base, and a cavity is arranged between adjacent side walls of the spoiler plate; a plurality of heat dissipation components are connected to the substrate cover, the heat dissipation component is provided with one or more heat dissipation pipelines, and the heat dissipation pipelines are connected to the heat collection cavity. The top surface of the spoiler is in close contact with the inner cavity surface of the substrate cover, the bottom surface of the spoiler is in close contact with the inner cavity surface of the substrate base, and the side wall of the spoiler is sandwiched between the substrate cover and the substrate base to form a support, which can improve the pressure bearing capacity, structural strength and reliability of the radiator; a cavity is arranged between adjacent side walls of the spoiler, and the cavity can be used as a gas-liquid separation channel to allow the liquid working medium to flow along the wall surface, and the gaseous working medium rises and separates through the center of the cavity, thereby improving the two-phase circulation efficiency of the substrate inner cavity; at the same time, when the high-temperature gas-liquid working medium flows through the spoiler, the high-temperature gas-liquid flow is blocked by the spoiler, so that the high-temperature gas-liquid flow bypasses the spoiler and forms a vortex on the side of the spoiler, destroying the thermal boundary layer on the surface of the spoiler, thereby significantly reducing the thermal resistance, increasing the heat transfer coefficient, and playing a role in enhancing heat transfer.

[0013] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention.

[0015] The present invention is further described below in conjunction with the accompanying drawings and embodiments;

[0016] Figure 1 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present invention;

[0017] Figure 2 It is a partial schematic diagram of a connection structure between a substrate and a heat dissipation component of a heat dissipation assembly provided by an embodiment of the present invention;

[0018] Figure 3 It is a partial schematic diagram of a spoiler of a heat dissipation assembly provided by an embodiment of the present invention being arranged in a substrate;

[0019] Figure 4 is a first schematic diagram of the structure of a spoiler in a heat dissipation assembly provided by an embodiment of the present invention;

[0020] Figure 5 is a second schematic diagram of the structure of a spoiler in a heat dissipation assembly provided by an embodiment of the present invention;

[0021] Figure 6 is a third schematic diagram of the structure of a spoiler in a heat dissipation assembly provided by an embodiment of the present invention;

[0022] Figure 7 is a first schematic diagram of the structure of a spoiler component in a heat dissipation assembly provided by an embodiment of the present invention;

[0023] Figure 8 is a second schematic diagram of the structure of a spoiler component in a heat dissipation assembly provided by an embodiment of the present invention;

[0024] Fig. 9 is a third schematic diagram of the structure of a spoiler component in a heat dissipation assembly provided by an embodiment of the present invention;

[0025] Fig.10 It is a structural schematic diagram of staggered arrangement of a spoiler component and a heat dissipation pipeline of a heat dissipation component of a heat dissipation assembly provided by an embodiment of the present invention;

[0026] Fig.11 is a schematic structural diagram of a radiator provided by an embodiment of the present invention;

[0027] Fig.12 is a schematic structural diagram of a heat dissipation component of a heat dissipation assembly provided by an embodiment of the present invention;

[0028] Fig.13 It is a schematic structural diagram of the spoiler column assembly of a heat dissipation assembly provided by an embodiment of the present invention;

[0029] Fig.14 It is a schematic structural diagram of a heat dissipation assembly and an outer shell being screwed together according to an embodiment of the present invention;

[0030] Fig.15 It is a structural schematic diagram of a heat dissipation component and an outer shell connected by friction stir welding according to an embodiment of the present invention. DETAILED DESCRIPTION

[0031] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0032] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0033] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0034] An embodiment of the present invention provides a heat dissipation component and a radiator, wherein the heat dissipation component includes a substrate base, a substrate cover, a spoiler component and multiple heat dissipation components; the substrate cover is connected to the substrate base and forms a heat collection cavity for concentrating heat; the spoiler component includes a spoiler, which is arranged in the heat collection cavity, the spoiler and the heat collection cavity are at the same height, the spoiler is at least partially arranged close to the substrate base, the spoiler is at least partially arranged close to the substrate cover, the side wall of the spoiler is arranged between the substrate cover and the substrate base, the side wall of the spoiler is used to support the substrate cover and the substrate base, and a cavity is arranged between adjacent side walls of the spoiler; multiple heat dissipation components are connected to the substrate cover, the heat dissipation component is provided with more than one heat dissipation pipeline, and the heat dissipation pipeline is connected to the heat collection cavity. The top surface of the spoiler is in close contact with the inner cavity surface of the substrate cover, the bottom surface of the spoiler is in close contact with the inner cavity surface of the substrate base, and the side wall of the spoiler is sandwiched between the substrate cover and the substrate base to form a support, which can improve the pressure bearing capacity, structural strength and reliability of the radiator; a cavity is arranged between adjacent side walls of the spoiler, and the cavity can be used as a gas-liquid separation channel to allow the liquid working medium to flow along the wall surface, and the gaseous working medium rises and separates through the center of the cavity, thereby improving the two-phase circulation phase rate of the substrate inner cavity; at the same time, when the high-temperature gas-liquid working medium flows through the spoiler, the high-temperature gas-liquid flow is blocked by the spoiler, so that the high-temperature gas-liquid flow bypasses the spoiler and forms a vortex on the side of the spoiler, destroying the thermal boundary layer on the surface of the spoiler, thereby significantly reducing the thermal resistance, increasing the heat transfer coefficient, and playing a role in enhancing heat transfer.

[0035] The embodiments of the present invention are further described below in conjunction with the accompanying drawings.

[0036] like Figure 1-3As shown, a heat dissipation component 100 provided by an embodiment of the present invention includes a substrate base 110, a substrate cover plate 120, a spoiler component and a plurality of heat dissipation components 130. The substrate cover plate 120 is connected to the substrate base 110 and forms a heat collection chamber 210 for concentrating heat; the spoiler component is arranged in the heat collection chamber 210, and the spoiler component includes one or more spoiler plates 310 and spoiler columns. The spoiler plates 310 are at least partially arranged close to the substrate base 110, and the spoiler plates 310 are at least partially arranged close to the substrate cover plate 120. A plurality of heat dissipation components 130 are connected to the substrate cover plate 120. The heat dissipation component 130 is provided with one or more heat dissipation pipes 230, and the heat dissipation pipes 230 are connected to the heat collection chamber 210. The provision of the spoiler 310 can solve the reliability and pressure resistance problems of the radiator; at the same time, when the high-temperature gas and liquid flow through the spoiler 310, the high-temperature gas and liquid flow is blocked by the spoiler 310, so that the high-temperature gas and liquid flow bypasses the spoiler 310 and forms a vortex on the side of the spoiler 310, destroying the thermal boundary layer on the surface of the spoiler 310, thereby significantly reducing the thermal resistance, increasing the heat transfer coefficient, and playing a role in enhancing heat transfer; that is, the provision of the spoiler 310, in addition to solving the reliability and pressure resistance problems of the radiator, can also play a role in reducing the thermal resistance and increasing the heat transfer coefficient.

[0037] like Figure 3 As shown, in one embodiment, a plurality of groups of continuous spoilers 310 having the same height as the heat collection cavity 210 are arranged in the heat collection cavity, so as to enhance the welding strength between the substrate base 110 and the substrate cover plate 120; the top surface of the spoiler 310 is closely arranged against the inner cavity surface of the substrate cover plate 120, the bottom surface of the spoiler 310 is closely arranged against the inner cavity surface of the substrate base 110, and the side wall of the spoiler 310 is clamped between the substrate cover plate 120 and the substrate base 110 to form a support, which can improve the pressure bearing capacity, structural strength and reliability of the radiator; independent cavities can be separated between adjacent side walls of the spoiler 310 as gas-liquid separation channels, so that the liquid working medium flows along the wall surface, and the gaseous working medium rises and detaches through the center of the cavity, thereby improving the two-phase circulation phase rate in the inner cavity of the substrate.

[0038] It is understandable that the structure of the spoiler 310 can be various, such as Figures 4 to 5 A simple spoiler 310 structure, such as Figure 6 A complex spoiler 310 structure is formed by combining a plurality of simple spoiler 310 structures. The complex spoiler 310 structure closely arranges two simple spoilers 310, and the side walls are non-aligned to form a partially staggered overlapping structure. The partially staggered overlapping structure of the spoiler component makes its pressure bearing performance stronger than that of the simple spoiler 310. This embodiment does not specifically limit the structure of the spoiler 310.

[0039] It should be noted that, in the heat collecting chamber 210, each spoiler 310 in a plurality of groups of spoilers 310 can be individually spot-welded and positioned, or a large-surface spoiler 310 can be positioned in an integrated manner; adjacent spoilers 310 can be arranged close to each other or at intervals, and the side walls of the spoilers 310 can be aligned in parallel or non-aligned to form a partially staggered overlapping structure. This embodiment does not specifically limit the arrangement of the spoilers 310.

[0040] It should be noted that if Figures 4 to 6 As shown, the spoiler 310 includes a plurality of array elements 311, and the cross-sectional shape of the array element 311 can be an X-shape, a trapezoid, a rectangle, a Z-shape, a V-shape, or a W-shape, which is not specifically limited in this embodiment.

[0041] It should be noted that the heat dissipation component 130 is a toothed plate provided with a heat dissipation pipeline 230 , and the heat dissipation component 130 and the substrate cover plate 120 may be vertically arranged or inclined, which is not specifically limited in this embodiment.

[0042] Furthermore, the heat dissipation component 130 with the heat dissipation pipeline 230 can be understood as the heat dissipation pipeline 230 can satisfy the flow of gas-liquid refrigerant. When the temperature of the gas-liquid refrigerant exceeds the threshold value, the liquid gas-liquid refrigerant will vaporize, and the vaporized gas-liquid refrigerant will flow upward, and exchange heat with the cold air of the external environment through the surface of the heat dissipation component 130. When the temperature of the vaporized gas-liquid refrigerant drops below the threshold value, the vaporized gas-liquid refrigerant will liquefy, and the liquefied gas-liquid refrigerant will flow downward due to the action of gravity, thereby realizing a circulating flow.

[0043] like Figure 7 As shown, in one embodiment, when a large-surface spoiler 310 is arranged on the substrate base 110 in an integrated positioning manner, the local spoiler 310 area can be hollowed out by laser engraving or the like to reduce the flow resistance in the heat collection chamber 210; at the same time, the large-surface integrated spoiler 310 structure is used to utilize the structural connectivity between the spoilers 310 for integrated positioning, thereby reducing the risk of the spoiler 310 being offset and shifted during welding and blocking the heat dissipation pipeline 230.

[0044] like Figure 8 As shown, in one embodiment, when in use, the cavity of the spoiler 310 is nearly perpendicular to the direction of gravity, the spoiler 310 and the heat dissipation component 130 are arranged in an alternating manner, and the spoiler 310 is not arranged at the position of the through groove 220 for gas-liquid exchange with the heat dissipation component 130 in the substrate cover 120, and the edge spacing between the spoiler 310 and the through groove 220 for gas-liquid exchange is greater than or equal to 1 mm.

[0045] like Fig. 9As shown, in one embodiment, when the cavity of the spoiler 310 is nearly parallel to the gravity direction, the spoiler 310 can adopt a flat sheet structure transition at the position of the through slot 220 for gas-liquid exchange, the bottom surface of the flat sheet is in close contact with the inner cavity surface of the substrate base 110, and a gap space is reserved between the top surface of the flat sheet and the gas-liquid exchange through hole, that is, the part of the spoiler 310 in close contact with the substrate cover plate 120 is misaligned with the through slot 220 to prevent the spoiler 310 from blocking the through slot 220. Among them, the distance between the edge of the flat sheet and the edge of the through slot 220 for gas-liquid exchange is greater than or equal to 1 mm.

[0046] like Fig.10 As shown, in one embodiment, when the cavity of the spoiler 310 is nearly parallel to the direction of gravity, the portion of each spoiler 310 that is in close contact with the substrate cover 120 is offset from the heat dissipation pipeline 230 to prevent the spoiler 310 from blocking the heat dissipation pipeline 230, thereby hindering the gas-liquid exchange between the heat collection cavity 210 and the heat dissipation pipeline 230 of the heat dissipation component 130.

[0047] In one embodiment, if Figure 3 As shown, the interior of the substrate base 110 is separated into a heat collection cavity 210 by a circumferential sinking platform, and the connection strength and air tightness between the substrate base 110 and the substrate cover plate 120 are strengthened by the circumferential sinking platform. It should be noted that the circumferential sinking platform can be an integrated structure with the substrate base 110, or an integrated structure with the substrate cover plate 120, and this embodiment does not specifically limit it. A circumferential sinking platform is provided in the inner cavity of the substrate base 110, the bottom surface of the substrate cover plate 120 is tightly connected to the top surface of the circumferential sinking platform, the side surface of the substrate cover plate 120 is tightly fitted with the circumferential surface of the inner cavity of the substrate base 110, and the substrate cover plate 120 and the substrate base 110 are separated into a heat collection cavity 210 by the circumferential sinking platform.

[0048] like Figures 11 to 12 As shown, the heat dissipation assembly 100 and the outer shell 1110 are assembled to form a heat sink 1100, and the heat dissipation component 130 can reduce the gap between the teeth on the outer shell 1110 through the epitaxial structure 330, thereby compensating for the heat dissipation area of ​​the heat dissipation component 130. It can be understood that the epitaxial structure 330 of the heat dissipation component 130 can partially or completely replace the teeth of the outer shell 1110, and the heat dissipation pipeline 230 connected to the heat collection chamber 210 can be arranged in the epitaxial structure 330; through the upper epitaxial structure 330 of the heat dissipation component 130, the heat dissipation component 130 completely replaces the upper teeth of the outer shell 1110 in the height direction, and the upper epitaxial structure 330 is provided with a heat dissipation pipeline 230 connected to the heat collection chamber 210, so that the heat dissipation component 130 increases the condensation area and the heat dissipation area, and further pulls up the liquid level height in the heat collection chamber 210, which can improve the dry burning problem at the top of the heat collection chamber 210 and improve the two-phase circulation efficiency and heat dissipation efficiency of the heat dissipation component.

[0049] In one embodiment, if Figure 2 and Fig.12 As shown, since a through groove 220 for gas-liquid exchange corresponding to the heat dissipation component 130 is provided on the substrate cover plate 120, the bottom of the heat dissipation component 130 can be inserted into the through groove 220 to enable the heat dissipation pipeline 230 of the heat dissipation component 130 to be interconnected with the heat collection cavity 210 of the substrate. In order to prevent the problem of blocking the gas-liquid exchange caused by excessive insertion of the heat dissipation component 130 into the heat collection cavity 210, a limiting portion 430 in the form of a trapezoidal overlap is provided at the bottom of the heat dissipation component 130. The heat dissipation component 130 can use the limiting portion 430 to form a limiting assembly with the through groove 220 of the substrate cover plate 120.

[0050] It should be noted that the heat dissipation component 130 may be extended downward to form a lower epitaxial structure 330 , or may be extended upward to form an upper epitaxial structure 330 , which is not specifically limited in this embodiment.

[0051] It should be noted that the epitaxial structure 330 of the heat dissipation component 130 may not replace the teeth provided on the outer shell 1110, but the epitaxial structure 330 may be placed in the original fin flow channel of the outer shell 1110 to form an encrypted tooth state.

[0052] It should be noted that the heat dissipation component 130 is provided with a heat dissipation pipeline 230 interconnected with the heat collection chamber, and the heat dissipation pipeline 230 can be in a honeycomb form, a steepest descent line form, an inclined line form, or a combination of the above forms, which is not specifically limited in this embodiment. For example: Fig.12 As shown, when the heat dissipation pipeline 230 adopts the fastest descent line form or the inclined line form, the high point of the heat dissipation pipeline 230 against gravity can be set on the side of the tooth top, and the low point of the heat dissipation pipeline 230 against gravity can be set on the side of the substrate.

[0053] like Figure 1 and Fig.12 As shown, an anchor point 530 may be provided on the top of the heat dissipation component 130, and the protective cover plate 140 of the radiator 1100 is assembled with the anchor point 530 of the heat dissipation component 130 of the heat dissipation assembly by riveting, which can provide protection for the heat dissipation assembly 100. It should be noted that the heat dissipation component 130 may also be assembled with the protective cover plate 140 by welding, which is not specifically limited in this embodiment.

[0054] During operation, the liquid refrigerant (two-phase working fluid) in the heat collection chamber 210 of the heat dissipation assembly 100 will quickly absorb heat and vaporize, so the substrate of the heat dissipation assembly 100 needs to have sufficient pressure bearing capacity to reduce the problems of bulging and deformation that may be caused by excessive internal pressure. This embodiment mainly arranges spoilers 310 or spoiler columns in the heat collection chamber 210 to enhance the connection strength between the substrate base 110 and the substrate cover 120.

[0055] When in use, the heat generating chip is attached to the outer surface of the substrate base 110 for heat dissipation. In order to reduce the contact thermal resistance between the attached surfaces, screw locking is usually used to tightly assemble the PCB and the substrate of the heat dissipation assembly 100. Therefore, the heat dissipation substrate needs to be equipped with threaded holes for fixing and assembling with the PCB. Fig.13 As shown, a concentric spoiler column with a threaded hole is arranged in the heat collecting cavity 210 in the heat dissipation component 100, and the spoiler column includes a first column 1320 and a second column 1310 arranged concentrically with the first column 1320. The radius of the first column 1320 is greater than the radius of the second column 1310. The first column 1320 is arranged in the heat collecting cavity 210, and the height of the first column 1320 is equal to the height of the heat collecting cavity 210. Since the top and bottom surfaces of the first column 1320 are respectively tightly attached to the inner cavity surfaces of the substrate base 110 and the substrate cover plate 120, the pressure bearing strength of the substrate can be enhanced after welding, and the second column 1310 is provided with a threaded hole, and the height of the second column 1310 is higher than the height of the first column 1320. When the position of the threaded hole interferes with the heat dissipation component 130, the height of the second column 1310 does not exceed the upper surface of the substrate cover 120, and the depth of the threaded hole does not penetrate the substrate cover 120; when the position of the threaded hole does not interfere with the heat dissipation component 130, the height of the second column 1310 can protrude from the substrate cover 120, thereby matching the threaded hole with a longer depth, so as to enhance the assembly capability between the PCB and the substrate, and effectively reduce the contact thermal resistance between the chip and the substrate.

[0056] Embodiments of the present invention also provide Fig.11 A heat sink 1100 is shown, and the heat sink 1100 includes the heat sink assembly 100 and the outer shell 1110 of the above embodiment. The technical means, problems solved and technical effects achieved by the heat sink 1100 are consistent with those of the heat sink assembly 100 in the above embodiment, and are not described in detail here. In order to better improve the function of the heat sink assembly 100, the heat sink assembly 100 needs to be tightly assembled with the outer shell 1110 of the heat sink 1100. The heat sink assembly 100 and the outer shell 1110 can be assembled in a screw-fitting sealing form or in a stir friction welding form, which is not specifically limited in this embodiment.

[0057] In one embodiment, when the heat dissipation assembly 100 and the outer shell 1110 are assembled in a screw-fitting sealing manner, as shown in FIG. Fig.14As shown in the figure: the heat-releasing area of ​​the substrate base 110 is used as the inner contour boundary, and the assembly flange 1410 is turned outward along the inner contour boundary toward the heat dissipation component 130 side and is higher than the top surface of the substrate of the outer shell 1110; a plurality of flanges 1420 are provided on the contour edge of the assembly flange 1410, and an assembly screw hole 1430 is provided at the center of the flange 1420, and a sealing groove 1440 is opened at the center line of the lower side surface of the assembly flange 1410; the substrate of the outer shell 1110 is opened with an assembly through groove with reference to the outer contour boundary of the substrate base 110 of the heat dissipation component, and the top surface of the substrate of the outer shell 1110 is opened according to the assembly through groove. An assembly boss 1120 is set with the groove boundary and the outer contour boundary of the assembly flange 1410 of the heat dissipation component as a reference range. The assembly boss 1120 is tightly attached to the bottom surface of the assembly flange 1410, and a threaded hole of the same size is set on the assembly boss 1120 at a position corresponding to the assembly screw hole 1430 of the assembly flange 1410; the heat dissipation component 100 is limited by fitting the assembly flange 1410 outwardly of the substrate base 110 and the assembly boss 1120 on the top surface of the substrate of the outer shell 1110, and is fixed and assembled through the corresponding assembly screw holes 1430, and a sealing strip is set at the flange sealing groove 1440.

[0058] In one embodiment, when the heat dissipation assembly 100 and the outer shell 1110 are assembled by friction stir welding, Fig.15 As shown: the heat release area of ​​the substrate base 110 is taken as the reference boundary, and the inside of the reference boundary is the central bottom plate of the substrate base 110; the outward expansion along the reference boundary is not less than the heat affected range of the stir friction welding process, and the outward expansion distance is greater than or equal to 2mm. The substrate base 110 is provided with a circumferential thickened area 410 within the expansion range of the reference boundary, and the height of the circumferential thickened area 410 is not less than the welding head depth of the stir friction welding process; the substrate of the outer shell 1110 is opened with the circumferential outer edge boundary of the substrate base 110 of the heat dissipation component 100 as a reference to open an assembly groove, and the outward expansion range based on the boundary of the assembly groove is not less than the shoulder radius of the welding process. The substrate of the outer shell 1110 is locally thickened in the form of a circumferential thickened area 2 1510 within the expansion range, and the thickening height is not less than the welding head depth of the stir friction welding process; the circumferential thickened area 1 410 of the substrate base 110 of the heat dissipation component and the circumferential thickened area 2 1510 of the substrate of the outer shell 1110 are tightly assembled through the side surfaces and fixedly connected by stir friction welding. It should be noted that friction stir welding refers to the use of the heat generated by the friction between the high-speed rotating welding tool and the workpiece to partially melt the material to be welded. When the welding tool moves forward along the welding interface, the plasticized material flows from the front to the back of the welding tool under the action of the rotating friction force of the welding tool, and forms a dense solid phase weld under the extrusion of the welding tool.

[0059] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A heat dissipation component, characterized in that: include: Base plate base; A substrate cover plate connected to the substrate base and forming a heat collection cavity for concentrating heat; A spoiler component is arranged in the heat collection cavity, the spoiler component includes more than one spoiler, the height of the spoiler is equal to the height of the heat collection cavity, the spoiler is at least partially arranged close to the substrate base, the spoiler is at least partially arranged close to the substrate cover plate, the side wall of the spoiler is arranged between the substrate cover plate and the substrate base, the side wall is used to support the substrate cover plate and the substrate base, and a cavity is arranged between adjacent side walls of the spoiler; A plurality of heat dissipation components are connected to the substrate cover plate, the heat dissipation components are provided with one or more heat dissipation pipelines, and the heat dissipation pipelines are connected to the heat collection cavity; Among them, the substrate cover is provided with a through groove, the heat dissipation pipeline is connected with the heat collection cavity through the through groove, and two adjacent spoilers separate independent cavities as gas-liquid separation channels. There are multiple gas-liquid separation channels, and any one of the gas-liquid separation channels can make the liquid working medium flow along the wall, and the gaseous working medium rises to the heat dissipation pipeline through the center of the cavity.

2. The heat dissipation assembly according to claim 1, characterized in that: The spoiler includes a plurality of array elements, and the cross-sectional shape of the array elements includes at least one of the following: an X-shape; a trapezoid; a rectangle; a Z-shape; a V-shape; or a W-shape.

3. The heat dissipation assembly according to claim 1, characterized in that: The adjacent spoilers are arranged in at least one of the following ways: arranged at intervals; and arranged closely.

4. The heat dissipation assembly according to claim 3, characterized in that: The side walls of the two closely arranged spoilers may be parallel and aligned, or partially staggered and overlapped in an unaligned manner.

5. The heat dissipation assembly according to claim 4, characterized in that: Two or more closely arranged spoiler monomer structures are used to combine into an integrated complex spoiler monomer structure.

6. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation component is assembled with the through slot through a limiting portion at the bottom.

7. The heat dissipation assembly according to claim 6, characterized in that: The portion of the spoiler that is in close contact with the substrate cover is staggered with the through slot to prevent the spoiler from blocking the through slot.

8. The heat dissipation assembly according to claim 6, characterized in that: The portion of the spoiler that is in close contact with the substrate cover is staggered with the heat dissipation pipeline to prevent the spoiler from blocking the heat dissipation pipeline.

9. The heat dissipation assembly according to claim 1, characterized in that: The substrate base is provided with a spoiler column, which includes a first column and a second column concentrically arranged with the first column, the radius of the first column is greater than the radius of the second column, the first column is arranged in the heat collection chamber, and the height of the first column is equal to the height of the heat collection chamber, the second column is provided with a threaded hole, and the height of the second column is higher than the height of the first column.

10. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation component includes an epitaxial structure, in which the heat dissipation pipeline is arranged. The epitaxial structure is extended on both sides of the heat dissipation component in the direction of gravity. The epitaxial structure is used to make the size of the heat dissipation component in the direction of gravity larger than the longitudinal size of the substrate base and to serve as the upper side tooth plate of the outer shell in the height direction.

11. The heat dissipation assembly according to claim 1, characterized in that: The shape structure of the heat dissipation pipeline includes at least one of the following: honeycomb shape; steepest descent line shape; inclined line shape.

12. A radiator, characterized in that: A heat dissipation component comprising any one of claims 1 to 11.

13. The heat sink according to claim 12, characterized in that It also includes an outer shell, and the heat dissipation component is sealed and connected to the outer shell.

14. The heat sink according to claim 13, characterized in that The heat dissipation component is screwed to the outer shell; or, the heat dissipation component is friction stir welded to the outer shell.

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