A vacuum suction block for ceramic substrate mounting and its preparation method

Abstract

This application provides a vacuum suction block for ceramic substrate mounting and its preparation method. The vacuum suction block includes: a base; an adsorption portion disposed on one side surface of the base; a plurality of adsorption holes arrayed on the adsorption portion, the adsorption holes being used to align with the edge of each substrate unit in the ceramic substrate; a rubber nozzle disposed in each adsorption hole, the rubber nozzle being used to provide vacuum adsorption force to the ceramic substrate; a vacuum discharge groove disposed between two adjacent rows of adsorption holes; the vacuum discharge groove being connected to the atmosphere and used to align with the square groove of each substrate unit in the ceramic substrate; and a vacuum inlet groove disposed inside the base, the vacuum inlet groove being connected to the adsorption holes and used to provide vacuum to the adsorption holes. Thus, the vacuum adsorption method enhances the adsorption force of the vacuum suction block, and the arrangement of the vacuum inlet groove and vacuum discharge groove ensures that the individual substrate units do not interfere with each other, thereby improving the ceramic substrate mounting yield.

Description

Technical Field

[0001] This application relates to the field of mold manufacturing technology, and in particular to a vacuum suction block for ceramic substrate mounting and its preparation method. Background Technology

[0002] Chips are the core technology in semiconductors. Currently, chips are usually bonded onto ceramic substrates before use. During the chip bonding process, the ceramic substrate typically needs to be adhered to a vacuum suction block to maintain stability.

[0003] See Figure 1 This is a schematic diagram of the ceramic substrate bonding process. Figure 1 As can be seen, multiple substrate units 2 are disposed on the ceramic substrate 1, and a square groove 3 is disposed in the center of each substrate unit 2. During chip mounting, adhesive is first applied around the square groove 3, and adhesive 4 of similar size to the chip 5 is applied. Finally, the chip 5 is placed on top of the adhesive 4, and the adhesive 4 is allowed to solidify. After the chip mounting is completed, see [link to documentation]. Figure 2 This is a cross-sectional view of a ceramic substrate. A sealed space is formed between the chip 5 and the square groove 3. At this time, it is necessary to ensure that the height of the adhesive 4 and the adhesive coverage around the chip 5 are within the preset qualified range. At the same time, there is no adhesive overflow in the square groove 3 in order to produce a qualified ceramic substrate.

[0004] See Figure 3 This is a schematic diagram of an existing vacuum suction block structure. The existing vacuum suction block 6 is provided with an adsorption part 7, and the adsorption part 7 is provided with multiple vacuum adsorption holes 8. When performing the surface mount technology (SMT) process, the ceramic substrate 1 needs to be adsorbed onto the adsorption part 7 and fixed by the vacuum adsorption force provided by the vacuum adsorption holes 8, thereby providing stable operating conditions for the SMT process.

[0005] However, due to the high hardness and smooth back surface of the ceramic substrate 1, when edge warping occurs, the existing vacuum suction block 6 cannot fully adsorb the ceramic substrate 1, resulting in a height discrepancy between the normal and warped portions of the ceramic substrate 1. Consequently, during the surface mount process, the height of the adhesive 4 will exceed the preset acceptable range.

[0006] In addition, the vacuum adsorption force is also transmitted to the chip 5 through the sealed space, causing the chip 5 to be pulled down by the vacuum adsorption force before the glue 4 solidifies, resulting in the glue 4 flowing into the square groove 3 and a large amount of glue overflow.

[0007] In summary, the yield rate of ceramic substrate bonding is relatively low based on the existing vacuum pick-and-place technology. Summary of the Invention

[0008] This application provides a vacuum pick-and-place for ceramic substrate mounting and its preparation method, which can be used to solve the technical problem of low yield rate of ceramic substrate mounting based on existing vacuum pick-and-place methods.

[0009] In a first aspect, this application provides a vacuum suction block for mounting ceramic substrates, the vacuum suction block comprising:

[0010] Base;

[0011] An adsorption portion is provided on one side surface of the base;

[0012] The adsorption section is provided with an array of adsorption holes, which are used to align with the edge of each substrate unit in the ceramic substrate; each adsorption hole is provided with a rubber nozzle, which is used to provide vacuum adsorption force to the ceramic substrate; a vacuum discharge groove is provided between two adjacent rows of adsorption holes; the vacuum discharge groove is connected to the atmosphere and is used to align with the square groove of each substrate unit in the ceramic substrate.

[0013] The base has a vacuum inlet groove inside, which is connected to the adsorption hole to provide a vacuum for the adsorption hole.

[0014] In one possible implementation of the first aspect, the number of rows of the adsorption holes is half the number of rows of the substrate units; the number of columns of the adsorption holes is the number of columns of the substrate units plus one.

[0015] In one possible implementation of the first aspect, the number of vacuum discharge slots is equal to the number of columns of the substrate cells.

[0016] In one possible implementation of the first aspect, the base is further provided with a leveling adjustment column, which is used to adjust the levelness of the base.

[0017] In one possible implementation of the first aspect, the number of leveling adjustment columns is four, respectively disposed at both ends of the diagonal of the base.

[0018] In one possible implementation of the first aspect, the base is further provided with a fixing screw hole for fixing the base.

[0019] In one possible implementation of the first aspect, the base is provided with a compressed air inlet slot for allowing compressed air to enter the base.

[0020] In one possible implementation of the first aspect, the adsorption part is provided with a substrate horizontal fixing post, which penetrates the adsorption part and enters the base for fixing the ceramic substrate in the horizontal direction.

[0021] In one possible implementation of the first aspect, the base is provided with a vacuum plug screw hole for maintaining a vacuum state inside the base.

[0022] Secondly, this application provides a method for preparing a vacuum pick for ceramic substrate mounting, the method being applied to preparing a vacuum pick for ceramic substrate mounting as described in the first aspect and various implementable embodiments, the method comprising:

[0023] Obtain the number of rows and columns of substrate cells on the ceramic substrate;

[0024] The number of rows of adsorption holes is determined based on the number of rows of the substrate units;

[0025] The number of columns of the adsorption holes is determined based on the number of columns of the substrate units;

[0026] Design the suction block mold according to the number of rows and columns of the suction holes;

[0027] Obtain the mold material for the suction block mold;

[0028] According to the suction mold, the mold material is roughly processed to obtain a first rough suction block;

[0029] The first rough suction block is heat-treated, and then punched and slotted to obtain the second rough suction block;

[0030] The second rough suction block is subjected to surface polishing and surface hard anodizing to obtain a vacuum suction block.

[0031] As can be seen from the above technical solution, this application provides a vacuum suction block for ceramic substrate mounting and its preparation method. The vacuum suction block includes: a base; an adsorption part disposed on one side surface of the base; a plurality of adsorption holes arrayed on the adsorption part, the adsorption holes being used to align with the edge of each substrate unit in the ceramic substrate; a rubber nozzle disposed in each adsorption hole, the rubber nozzle being used to provide vacuum adsorption force to the ceramic substrate; a vacuum discharge groove disposed between two adjacent rows of adsorption holes; the vacuum discharge groove being connected to the atmosphere and used to align with the square groove of each substrate unit in the ceramic substrate; a vacuum inlet groove disposed inside the base, the vacuum inlet groove being connected to the adsorption holes and used to provide vacuum to the adsorption holes. Thus, the vacuum adsorption method enhances the adsorption force of the vacuum suction block, and the arrangement of the vacuum inlet groove and the vacuum discharge groove ensures that the various substrate units do not interfere with each other, thereby improving the ceramic substrate mounting yield. Attached Figure Description

[0032] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the ceramic substrate bonding process;

[0034] Figure 2 This is a schematic diagram of a cross-section of a ceramic substrate patch.

[0035] Figure 3 This is a schematic diagram of an existing vacuum suction block structure;

[0036] Figure 4 A schematic diagram of the overall structure of a vacuum suction block for ceramic substrate mounting provided in the first aspect of this application;

[0037] Figure 5 A top-view perspective view of a vacuum suction block for ceramic substrate mounting provided in the first aspect of this application;

[0038] Figure 6 This is a side view schematic diagram of a vacuum suction block for ceramic substrate mounting provided in the first aspect of this application.

[0039] Figures 4 to 6 middle:

[0040] 100 is the base, 200 is the adsorption part, 210 is the adsorption hole, 211 is the rubber nozzle, 220 is the vacuum discharge groove, 300 is the vacuum inlet groove, 400 is the level adjustment column, 500 is the screw hole for fixing the suction block, 600 is the compressed air inlet groove, and 700 is the vacuum plug screw hole. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0042] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, “at least one,” “one or more” refers to one, two, or more than two, and “multiple” refers to two or more. The term “and / or” is used to describe the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can indicate: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character “ / ” generally indicates that the preceding and following related objects are in an “or” relationship.

[0043] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0044] The following section first introduces the chip mounting process requirements for the ceramic substrate in this application:

[0045] The ceramic substrate mounting process refers to the process of attaching a chip to a fixed position after the ceramic substrate has been coated with adhesive.

[0046] During this process, it is necessary to ensure that the vacuum adsorption force on the ceramic substrate reaches a stable operating requirement during the pick-and-place machine operation, while ensuring that the adhesive height on the surface of the ceramic substrate is within the range of 0.130±0.075mm, the adhesive coverage around the chip is within the range of 5%-10%, and there is no adhesive overflow in the holes of the ceramic substrate.

[0047] The first embodiment of this application discloses a vacuum suction block for ceramic substrate mounting. The following is a detailed description of the vacuum suction block for ceramic substrate mounting disclosed in the first embodiment of this application with reference to the accompanying drawings.

[0048] See Figure 4 This is a schematic diagram of the overall structure of a vacuum suction block for ceramic substrate mounting provided in the first aspect of this application;

[0049] Depend on Figure 4 As can be seen, the vacuum suction block for ceramic substrate mounting provided in the first embodiment of this application includes:

[0050] Base 100;

[0051] Adsorption portion 200 provided on one side surface of the base 100;

[0052] See Figure 5 This is a top-view perspective view of a vacuum suction block for ceramic substrate mounting provided in the first aspect of this application.

[0053] See Figure 6 This is a side view schematic diagram of a vacuum suction block for ceramic substrate mounting provided in the first aspect of this application.

[0054] Depend on Figure 5 and Figure 6 As can be seen, in some embodiments of this application, the adsorption part 200 is provided with a plurality of adsorption holes 210, which are used to align with the edge of each substrate unit in the ceramic substrate.

[0055] In some embodiments of this application, each adsorption hole 210 is provided with a rubber nozzle 211, which is used to provide vacuum adsorption force to the ceramic substrate.

[0056] In some embodiments of this application, the rubber nozzle 211 can be either fixedly disposed within the adsorption hole 210 or detachably installed within the adsorption hole 210. Since the edge of the ceramic substrate has a curvature, the adsorption force experienced by the rubber nozzle 211 at different positions may vary to achieve perfect adsorption of the ceramic substrate, resulting in different lifespans for the rubber nozzle 211 at different positions. Therefore, detachably installing the rubber nozzle 211 within the adsorption hole 210 facilitates the replacement of the rubber nozzle 211 at different positions.

[0057] The rubber nozzle 221 enables localized vacuum control of the ceramic substrate by the vacuum suction block. For example, by adjusting the suction force of a single suction hole 210, and then using the rubber nozzle 221 to achieve localized control of a specific location, it can better adsorb the edges of the ceramic substrate while preventing vacuum leakage into surrounding products. Furthermore, the assembly method of the rubber nozzle 221 is simple, improving the suction force of the vacuum suction block through a straightforward approach.

[0058] To ensure the adsorption force of the vacuum suction block, in some embodiments of this application, the number of rows of the adsorption holes 210 is half the number of rows of the substrate units; the number of columns of the adsorption holes 210 is one more than the number of columns of the substrate units. Thus, each adsorption hole is located at the edge where two substrate units meet, allowing the rubber nozzle 221 to more stably adsorb the ceramic substrate.

[0059] In some embodiments of this application, a vacuum discharge groove 220 is provided between two adjacent columns of adsorption holes 210; the vacuum discharge groove 220 is connected to the atmosphere and is used to align with the square groove of each substrate unit in the ceramic substrate.

[0060] In some embodiments of this application, the vacuum venting groove 220 passes under the chip of the substrate unit and communicates with the square groove under the chip. Thus, the square groove under the chip is connected to the atmosphere through the vacuum venting groove 220, maintaining pressure balance on both sides of the chip and preventing adhesive overflow within the square groove due to the chip being sucked in.

[0061] To achieve the above effects, in some embodiments of this application, the number of vacuum discharge slots 220 is equal to the number of columns of the substrate units. This ensures that each column of substrate units corresponds to one vacuum discharge slot 220. Furthermore, the length of the vacuum discharge slot 220 is at least equal to the distance from the chip of the first substrate unit to the chip of the last substrate unit in each column.

[0062] In some embodiments of this application, the adsorption part 200 is provided with a substrate horizontal fixing post 230, which penetrates the adsorption part 200 and enters the base 100 for fixing the ceramic substrate in the horizontal direction.

[0063] In some embodiments of this application, the base 100 is provided with a vacuum inlet groove 300, which is connected to the adsorption hole 210 and is used to provide a vacuum to the adsorption hole 210.

[0064] In some embodiments of this application, the base 100 is further provided with a leveling adjustment column 400, which is used to adjust the level of the base 100.

[0065] In some embodiments of this application, the number of the leveling adjustment columns 400 is four, which are respectively arranged at both ends of the diagonal of the base 100.

[0066] In one possible implementation of this application embodiment, the vacuum suction block is controlled in its horizontal direction by the horizontal fixing post 230 of the substrate, and then the horizontality is finely adjusted by the horizontal adjustment post 400, so that the horizontality of the vacuum suction block meets the requirements of the ceramic substrate patch.

[0067] In some embodiments of this application, the base 100 is further provided with a fixing suction block screw hole 500, which is used to fix the base 100.

[0068] In another possible implementation of this application embodiment, the vacuum suction block can also be fixed by other fixing methods, such as snap-fit ​​or magnetic attraction.

[0069] In some embodiments of this application, the base 100 is provided with a compressed air inlet groove 600, which is used to allow compressed air to enter the base 100.

[0070] In some embodiments of this application, when compressed air enters the base 100 from the compressed air inlet 600, it can be adsorbed by the adsorption holes 210 and the rubber nozzle 221 in the adsorption part 220, thus adsorbing the ceramic substrate. Using the method of this application, the edges of the ceramic substrate can also be adsorbed.

[0071] In some embodiments of this application, the base 100 is provided with a vacuum plug screw hole 700, which is used to maintain a vacuum state inside the base 100.

[0072] As can be seen from the above technical solution, the present application provides a vacuum suction block for ceramic substrate mounting, the vacuum suction block including: a base 100;

[0073] Adsorption portion 200 provided on one side surface of the base 100;

[0074] The adsorption section 200 is provided with a plurality of adsorption holes 210 arranged in an array. The adsorption holes 210 are used to align with the edge of each substrate unit in the ceramic substrate. Each adsorption hole 210 is provided with a rubber nozzle 211, which is used to provide vacuum adsorption force to the ceramic substrate. A vacuum discharge groove 220 is provided between two adjacent rows of adsorption holes 210. The vacuum discharge groove 220 is connected to the atmosphere and is used to align with the square groove of each substrate unit in the ceramic substrate.

[0075] The base 100 is provided with a vacuum inlet groove 300, which is connected to the adsorption hole 210 and is used to provide a vacuum to the adsorption hole 210.

[0076] Thus, the vacuum adsorption method enhances the adsorption force of the vacuum suction block, and the setting of the vacuum inlet and vacuum outlet grooves ensures that the various substrate units do not interfere with each other, thereby improving the low ceramic substrate bonding qualification rate.

[0077] Corresponding to the vacuum suction block for ceramic substrate mounting provided in the first embodiment of this application, the second embodiment of this application provides a method for preparing a vacuum suction block for ceramic substrate mounting, the method comprising:

[0078] Step 101: Obtain the number of rows and columns of substrate cells in the ceramic substrate;

[0079] Step 102: Determine the number of rows of adsorption holes 210 based on the number of rows of the substrate unit;

[0080] Step 103: Determine the number of columns of the adsorption holes 210 based on the number of columns of the substrate units;

[0081] Step 104: Design the suction block mold according to the number of rows and columns of the suction holes 210;

[0082] Step 105: Obtain the mold material for the suction block mold;

[0083] Step 106: According to the suction block mold, the mold material is roughly processed to obtain the first rough suction block;

[0084] Step 107: The first rough suction block is heat-treated, and then punched and slotted to obtain the second rough suction block;

[0085] Step 108: Perform surface polishing and surface hard oxidation on the second rough suction block to obtain a vacuum suction block.

[0086] Thus, a vacuum suction block for ceramic substrate mounting is prepared by a method for preparing a vacuum suction block for ceramic substrate mounting according to the above technical solution. The vacuum suction block includes: a base 100.

[0087] Adsorption portion 200 provided on one side surface of the base 100;

[0088] The adsorption section 200 is provided with a plurality of adsorption holes 210 arranged in an array. The adsorption holes 210 are used to align with the edge of each substrate unit in the ceramic substrate. Each adsorption hole 210 is provided with a rubber nozzle 211, which is used to provide vacuum adsorption force to the ceramic substrate. A vacuum discharge groove 220 is provided between two adjacent rows of adsorption holes 210. The vacuum discharge groove 220 is connected to the atmosphere and is used to align with the square groove of each substrate unit in the ceramic substrate.

[0089] The base 100 is provided with a vacuum inlet groove 300, which is connected to the adsorption hole 210 and is used to provide a vacuum to the adsorption hole 210.

[0090] Thus, the vacuum adsorption method enhances the adsorption force of the vacuum suction block, and the setting of the vacuum inlet and vacuum outlet grooves ensures that the various substrate units do not interfere with each other, thereby improving the low ceramic substrate bonding qualification rate.

[0091] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein; the specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0092] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope; the scope of the present invention is limited only by the appended claims.

Claims

1. A method for preparing a vacuum suction block for ceramic substrate mounting, characterized in that, The vacuum suction block prepared by the method includes: Base (100); An adsorption part (200) is provided on one side surface of the base (100). The adsorption section (200) is provided with an array of adsorption holes (210), which are used to align with the edge of each substrate unit in the ceramic substrate; each adsorption hole (210) is provided with a rubber nozzle (211), which is used to provide vacuum adsorption force to the ceramic substrate; a vacuum discharge groove (220) is provided between two adjacent rows of adsorption holes (210); the vacuum discharge groove (220) is connected to the atmosphere and is used to align with the square groove of each substrate unit in the ceramic substrate; The base (100) is provided with a vacuum inlet groove (300) inside, which is connected to the adsorption hole (210) to provide a vacuum to the adsorption hole (210); The number of rows of the adsorption holes (210) is half the number of rows of the substrate unit; the number of columns of the adsorption holes (210) is one more than the number of columns of the substrate unit. The number of vacuum discharge tanks (220) is equal to the number of columns of the substrate unit; The base (100) is also provided with a leveling adjustment column (400), which is used to adjust the levelness of the base (100); The preparation method includes: Obtain the number of rows and columns of substrate cells on the ceramic substrate; The number of rows of adsorption holes (210) is determined according to the number of rows of the substrate unit; The number of columns of the adsorption holes (210) is determined according to the number of columns of the substrate units; The suction block mold is designed according to the number of rows and columns of the suction holes (210); Obtain the mold material for the suction block mold; According to the suction block mold, the mold material is roughly processed to obtain a first rough suction block; The first rough suction block is heat-treated, and then punched and slotted to obtain the second rough suction block; The second rough suction block is subjected to surface polishing and surface hard anodizing to obtain a vacuum suction block.

2. The method for preparing a vacuum suction block for ceramic substrate mounting according to claim 1, characterized in that, The number of the leveling adjustment columns (400) is four, which are respectively set at both ends of the diagonal of the base (100).

3. The method for preparing a vacuum suction block for ceramic substrate mounting according to claim 1, characterized in that, The base (100) is also provided with a fixing suction block screw hole (500), which is used to fix the base (100).

4. The method for preparing a vacuum suction block for ceramic substrate mounting according to claim 1, characterized in that, The base (100) is provided with a compressed air inlet groove (600) for allowing compressed air to enter the base (100).

5. The method for preparing a vacuum suction block for ceramic substrate mounting according to claim 1, characterized in that, The adsorption part (200) is provided with a substrate horizontal fixing post (230), which penetrates the adsorption part (200) and enters the base (100) for fixing the ceramic substrate in the horizontal direction.

6. The method for preparing a vacuum suction block for ceramic substrate mounting according to claim 1, characterized in that, The base (100) is provided with a vacuum plug screw hole (700), which is used to maintain a vacuum state inside the base (100).

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