Optical element mounting package and light-emitting device

Abstract

An optical element mounting package according to the present invention comprises: a ceramic substrate that includes a mounting part having a first surface on which a laser element is mounted; a first fixing part that is positioned at one end of the ceramic substrate in a first direction along the first surface; and a second fixing part that is positioned at the other end of the ceramic substrate opposite to the one end in the first direction. The first fixing part and the second fixing part can be used to fix the ceramic substrate. The first fixing part has a first through hole and a second through hole that pass therethrough in the direction intersecting the first surface. The second fixing part has a third through hole that passes therethrough in the direction intersecting the first surface. The maximum widths of the first through hole and the third through hole in the direction along the first surface are greater than the maximum width of the second through hole in the direction along the first surface.

Description

Package and light-emitting device for mounting optical elements

[0001] This disclosure relates to a package for mounting optical elements and a light-emitting device.

[0002] There is a light-emitting device that seals a laser light source inside a package and stably emits the light emitted by the laser light source. In International Publication No. 2020 / 175303, the laser light source is positioned by abutting it against the corner of a concave slope, thereby emitting light in a desired direction.

[0003] One aspect of the present disclosure is an optical element mounting package comprising: [1] a ceramic substrate having a mounting portion having a first surface on which a laser element is mounted; a first fixing portion located at one end of the ceramic substrate in a first direction along the first surface; and a second fixing portion located at the other end of the ceramic substrate opposite to the one end in the first direction, wherein the first fixing portion and the second fixing portion can be used to fix the ceramic substrate, the first fixing portion has a first through hole and a second through hole penetrating in a direction intersecting the first surface, the second fixing portion has a third through hole penetrating in a direction intersecting the first surface, and the maximum width of the first through hole and the third through hole in the direction along the first surface is greater than the maximum width of the second through hole in the direction along the first surface; [2] the optical element mounting package of [1], wherein the first surface is parallel to the irradiation direction of light emitted from the laser element. [3] The optical element mounting package of [1] or [2], wherein at least a portion of a heat dissipation member made of metal is embedded inside the ceramic substrate, and the first surface is located on the heat dissipation member. [4] The optical element mounting package of any of [1] to [3], wherein the ceramic substrate has a first mounting portion to which a cover is attached that surrounds the area of ​​the mounting portion in a plan view when viewed from above the first surface. [5] The optical element mounting package of [4], wherein the ceramic substrate has a second mounting portion to which a lens is attached in a plan view within the area surrounded by the first mounting portion. [6] The optical element mounting package of any of [1] to [5], wherein the first fixing portion and the second fixing portion are located on either side of the mounting portion along the direction of irradiation of light by the laser element. [7] The optical element mounting package of any of [1] to [6], wherein the first fixing portion and the second fixing portion are made of metal separate from the ceramic substrate. [8] The first through-hole and the third through-hole have an elongated hole shape in a plan view when viewed from above the first surface, in any of the optical element mounting packages from [1] to [7]. [9] The first through-hole and the third through-hole are located diagonally to the ceramic substrate in a plan view when viewed from above the first surface, in any of the optical element mounting packages from [1] to [8].

[10] The optical element mounting package of any of [1] to [9] wherein the first and second fixing portions have a thickness perpendicular to the first surface that is thinner than the ceramic substrate.

[11] The optical element mounting package of any of [1] to

[10] wherein the length of the first fixing portion along the direction of irradiation of light emitted from the laser element and the length of the second fixing portion along the direction of irradiation are different from each other.

[12] The optical element mounting package of any of [1] to

[11] wherein the position of the second surface opposite to the first surface of the first and second fixing portions is equal to or lower than the position of the third surface of the ceramic substrate opposite to the first surface, in a direction perpendicular to the first surface.

[13] The optical element mounting package of [3] wherein the heat dissipation member penetrates the ceramic substrate in a direction intersecting the first surface.

[14] The optical element mounting package of

[13] wherein the mounting portion is a part of the heat dissipation member that includes the first surface and protrudes from the surface of the ceramic substrate on the side of the first surface.

[15] The optical element mounting package of

[13] or

[14] , wherein the heat dissipation member is connected to the first fixing portion and the second fixing portion along the third surface of the ceramic substrate opposite to the first surface.

[16] A light-emitting device comprising: an optical element mounting package of any of [1] to

[15] , and a laser element located on the first surface.

[17] The light-emitting device of

[16] , wherein the direction of light irradiation by the laser element is parallel to the first surface.

[18] The light-emitting device of

[16] or

[17] , comprising a lid having a light-transmitting portion through which light emitted by the laser element is transmitted, and which is bonded to the ceramic substrate to seal the first surface.

[19] The light-emitting device of

[18] , comprising a lens inside the lid sealed on the ceramic substrate.

[0004] It is an overall perspective view showing the appearance of the light-emitting device. It is a perspective view showing the state where the lid body is removed from the light-emitting device. It is a perspective view of the package disassembled. It is a cross-sectional view of the package. It is a cross-sectional view of the package. It is a view for explaining the fixing and adjustment of the light-emitting device. It is a perspective view showing a light-emitting device of another embodiment. It is a cross-sectional view of the package of the light-emitting device of another embodiment. It is a plan view when a plurality of light-emitting devices of another embodiment are arranged side by side. It is a cross-sectional view of the package of another embodiment. It is a perspective view showing an example of an electronic device on which the light-emitting device is mounted. It is a cross-sectional view of the light-emitting device of another embodiment.

[0005] Hereinafter, embodiments will be described based on the drawings. FIG. 1 is an overall perspective view showing the appearance of the light-emitting device 1. FIG. 2 is a perspective view showing the state where the lid body 40 is removed from the light-emitting device 1. The light-emitting device 1 includes a substrate 10, a fixing portion 30, a lid body 40, and the like. The internal space covered by the substrate 10 and the lid body 40 is sealed. The internal space includes the range occupied by the lens 61 and the light-emitting unit 50 fixed to the substrate 10. The surface of the substrate 10 on which the lens 61 and the light-emitting unit 50 are mounted is defined as the upper surface side and represented as the +Z direction. The substrate 10 and the fixing portion 30 are included in the package 2 (see FIG. 3). The package 2 is a package for mounting an optical element in one embodiment.

[0006] The substrate 10 is a ceramic substrate according to one embodiment, comprising a base 11 and a mounting portion 21. The base 11 is ceramic and has insulating properties. The base 11 may be, for example, aluminum oxide (alumina). The mounting portion 21 protrudes from the upper surface 11U of the base 11 in the +Z direction. In a plan view, an annular first mounting portion 14 is located surrounding the area of ​​the mounting portion 21 on the upper surface 11U, and is joined to the lid 40. The first mounting portion 14 is a sealing member suitable for joining to the lid 40, and may be made of metal. Multiple connecting electrodes 102 are located in the area surrounded by the first mounting portion 14 on the upper surface 11U, alongside the mounting portion 21. Outside the area surrounded by the first mounting portion 14, the same number of external electrodes 115 as the connecting electrodes 102 are located. The connecting electrodes 102 and the external electrodes 115 are electrically connected one by one by wiring inside the base 11 or the like. The connecting electrode 102 and the external electrode 115 only need to have high and stable electrical conductivity. The connecting electrode 102 and the external electrode 115 may have a structure in which, for example, a nickel underlayer surface is gold-plated. The connecting electrode 102 and the external electrode 115 may be made of the same material. The number of connecting electrodes 102 and external electrodes 115 may correspond to the number of light-emitting elements 51.

[0007] The mounting portion 21 may be part of the heat dissipation member 20 (see Figure 3), described later, and the +Z side of the mounting portion 21 is a planar first surface 20U. A light-emitting unit 50 may be mounted on the first surface 20U. The light-emitting unit 50 mounted on the first surface 20U may be, for example, a chip-on-submount (CoS) having a plurality of light-emitting elements 51 on a submount. There may be, for example, two light-emitting elements 51 on the submount. The light-emitting elements 51 may be laser elements, for example, end-face emitting type laser diodes. The light-emitting elements 51 emit light due to power supplied via the external electrode 115 and the connecting electrode 102. The direction along the direction of light irradiation by the light-emitting elements 51 is defined as the +X direction. The X-axis direction, which is the first direction in one embodiment, may coincide with the longitudinal direction when the substrate 10 is viewed from above. The X-axis direction may also be perpendicular to the Z-axis direction. The Y-axis direction is defined perpendicular to the X-axis and Z-axis directions. The light-emitting elements 51 are connected to the connecting electrode 102 by a bonding wire 80. The bonding wires 80 connect the light-emitting element 51 and the connecting electrode 102 in parallel, for example, by connecting multiple wires, such as three wires, thereby reducing the possibility of malfunction due to wire breakage. The submount is bonded and fixed to the first surface 20U. The first surface 20U may be perpendicular to the Z-axis direction. That is, the direction of light irradiation from the light-emitting element 51 may be parallel to the first surface 20U, and the X-axis direction may be along the first surface 20U.

[0008] The mounting portion 21 may be made of a material with a higher thermal conductivity than the base 11. The mounting portion 21 may be made of metal. If the base 11 is made of alumina, the mounting portion 21 may be made of, for example, copper, aluminum, iron, magnesium, or an alloy thereof. Furthermore, the mounting portion 21 is less likely to be distorted when heated if its coefficient of thermal expansion is close to that of the base 11. Therefore, if the base 11 is made of alumina, the mounting portion 21 may be made of copper or iron, or especially oxygen-free copper. The mounting portion 21 may have a nickel plating layer on the surface of these metals.

[0009] In a plan view, within the area enclosed by the first mounting portion 14 of the substrate 10, a second mounting portion 16 may be located on the +X side, i.e., the light emission side, relative to the mounting portion 21 and the light-emitting unit 50. A lens 61 may be attached to and fixed to the second mounting portion 16. The lens 61 may be a focusing lens that reduces the diffusion of the fast axis component in the emitted light.

[0010] The cover 40 has a recessed shape with one side on the -Z side that contacts the substrate 10 open. When the cover 40 is joined to the substrate 10, the recessed portion is sealed as an internal space. On the +Z side of the substrate 10, the mounting portion 21, which includes the first surface 20U to which the light-emitting unit 50 is fixed, the second mounting portion 16 to which the lens 61 is fixed, and the connecting electrode 102 are covered by the cover 40. The +X side surface of the cover 40 is covered with a light-transmitting member 41, which is a light-transmitting portion through which light emitted from the light-emitting element 51 in the internal space is transmitted and emitted out of the internal space. An anti-reflective film may be attached to the +X side surface, i.e., the outer surface, of the light-transmitting member 41. The -Z end surface of the side surface of the cover 40 may have an outward-opening bonding surface, thereby ensuring a bonding area with the first mounting portion 14. Therefore, leakage of sealing of the internal space surrounded by the substrate 10 and the cover 40 is reduced.

[0011] Fixing portions 30 are located at both ends of the substrate 10 in the X direction. A first fixing portion 31 is located at one end of the substrate 10 on the +X side, i.e., the side from which light is emitted, and a second fixing portion 32 is located at the other end opposite to the first fixing portion. In other words, the first fixing portion 31 and the second fixing portion 32 are located on either side of the mounting portion 21 in the X direction. The fixing portions 30 are used when fixing the substrate 10, i.e., the light-emitting device 1, to the support member of the electronic device.

[0012] The first fixing portion 31 has a first through hole 311 located near one end in the Y direction, for example, on the +Y side. A second through hole 312 is located near the opposite end of the first fixing portion 31 in the Y direction, in this case on the -Y side. The first through hole 311 and the second through hole 312 penetrate the first fixing portion 31 in a direction intersecting the first surface 20U, i.e., the XY plane. The first through hole 311 and the second through hole 312 may also penetrate the first fixing portion 31 in a direction perpendicular to the XY plane. The second through hole 312 may be circular in plan view. The maximum width of the first through hole 311 in the XY plane is greater than the maximum width of the second through hole 312 in the XY plane, i.e., its diameter. The first through hole 311 may, for example, have an elongated hole shape extending in the Y direction in plan view. The first fixing portion 31 is a metal member, and may be copper, aluminum, iron, magnesium, or an alloy thereof. The first fixing portion 31 may be made of the same material as the mounting portion 21. Alternatively, the first fixing portion 31 may be made of a metal-impregnated material. The surface of the first fixing portion 31 may be further nickel-plated.

[0013] The second fixing portion 32 has a third through-hole 321 located near one end in the Y direction. The third through-hole 321 may be located diagonally to the first through-hole 311 of the package 2, i.e., on the -Y side, in a plan view from the Z direction, with the substrate 10 and the light-emitting unit 50 in between. The second fixing portion 32 may have a fourth through-hole 322 near the end opposite to the aforementioned one end in the Y direction. The third through-hole 321 and the fourth through-hole 322 penetrate the second fixing portion 32 in a direction intersecting the first surface 20U. The maximum width of the third through-hole 321 in the XY plane is greater than the maximum width of the second through-hole 312 in the XY plane. The third through-hole 321 may, for example, have an elongated hole shape extending in the Y direction in a plan view. The second fixing portion 32 is a metal member, and may be, for example, copper, aluminum, iron, magnesium, or an alloy thereof. Alternatively, the second fixing portion 32 may be a metal-impregnated material. The second fixing portion 32 may be made of the same material as the first fixing portion 31. The surface of the second fixing portion 32 may be further nickel-plated.

[0014] Figure 3 is a disassembled perspective view of package 2. Figures 4A and 4B are cross-sectional views of package 2 along the cross-sectional line iv-iv in Figure 2. The substrate 10 has a through hole 101 that penetrates between the upper surface 11U and the third surface 11L, which is the lower surface opposite to the upper surface 11U, and a heat dissipation member 20 that penetrates the through hole 101. The through hole 101 may extend along the Z direction. On the third surface 11L of the substrate 10, there may be a recess 104 around the through hole 101 that is in contact with the through hole 101. The heat dissipation member 20 has a base 22 and the aforementioned mounting portion 21 that protrudes from the base 22 in the +Z direction. The peripheral portion of the base 22 may be located within the recess 104 on the side of the third surface 11L of the substrate 10. The central portion of the base 22 is embedded inside the substrate 10 within the through hole 101 and penetrates the through hole 101 in the Z direction. The mounting portion 21 may protrude further in the +Z direction, i.e., upward, from the upper end of the base 22 than the upper surface 11U.

[0015] As shown in Figures 4A and 4B, the substrate 10 and the heat dissipation member 20 are hermetically joined by a bonding material 71. That is, the bonding material 71 is positioned in an annular shape on the base 22 of the heat dissipation member 20 in a planar perspective view. Therefore, no airflow occurs between the upper surface 11U of the substrate 10, i.e., the internal space sealed by the lid 40, and the third surface 11L of the substrate 10, i.e., the outside of the internal space, through the gap between the substrate 10 and the heat dissipation member 20. The bonding material 71 may be a brazing material such as AuSn. Alternatively, a molten metal such as solder may be used for the bonding material 71. In addition, joining may be performed by welding instead of joining with the bonding material 71. In this case, the melting point of the molten metal may be lower than the melting point of the bonding material 72 described later. On the other hand, the melting point of the molten metal is higher than the melting point of the metal used to join the lens 61, the light-emitting unit 50, and the lid 40. In other words, the metals used in parts that are joined in later processes have lower melting points to prevent the metals in the parts that have already been joined in earlier processes from remelting.

[0016] The first fixing portion 31 has a projection 313 in the -X direction. The second fixing portion 32 has a projection 323 in the +X direction. The substrate 10 has grooves 103 on the sides of the ±X ends. The grooves 103 have shapes corresponding to the projections 313 and 323. The first fixing portion 31 and the second fixing portion 32, which are separate from the substrate 10, are joined together with the projections 313 and 323 fitted into the grooves 103, respectively. The joining material 72 may be, for example, a brazing material. The surface of the package 2 after brazing with the joining material 72 may be nickel-plated again. Gold plating may be applied on top of this nickel plating. The joining material 72 may be a brazing material such as AuSn. Alternatively, a molten metal such as solder may be used as the joining material 72. In addition, joining may be performed by welding instead of joining with the joining material 72.

[0017] As shown in Figure 4A, the lower surface 20L of the heat dissipation member 20, and the second surfaces 31L and 32L of the first and second fixing parts 31 and 32, respectively, may be at the same position in the Z direction as the third surface 11L of the base 11. Alternatively, as shown in Figure 4B, the lower surface 20L and the second surfaces 31L and 32L may protrude to the negative side in the Z direction, i.e., downward, from the position of the third surface 11L indicated by the dotted line. In this case, the lower surface 20L and the second surfaces 31L and 32L may be at the same position in the Z direction. This allows for both heat dissipation to the fixing part of the electronic device and stability of the fixing. The upper surface of the first fixing part 31 and the upper surface of the second fixing part 32 may be located on the -Z side of the upper surface of the base 11. The thickness of the first fixing part 31 and the second fixing part 32 in the Z direction may be thinner than that of the base 11.

[0018] Figure 5 illustrates the fixing and adjustment of the light-emitting device 1. As described above, the light-emitting device 1 is fixed to the electronic device by fixing members such as screws, bolts, or fasteners at the fixing part 30. The fixing members include at least a fixing member 91 inserted into the first through hole 311 and a fixing member 92 inserted into the third through hole 321. The second through hole 312 may be an alignment hole. That is, alignment may be performed by alignment marks on the electronic device viewed through the second through hole 312.

[0019] As described above, the first through-hole 311 and the third through-hole 321 have a large maximum width, allowing for play in the screws. In other words, the position in which the fixing members 91 and 92 are fixed to the two diagonally opposite through-holes can be adjusted. Therefore, the light-emitting device 1 can be adjusted not only by translation but also by rotational movement. For example, even if the light-emitting unit 50 is fixed to the package 2 with variations, and there are variations in the direction of light irradiation by the light-emitting element 51, the emission direction can be easily aligned by adjusting the light-emitting device 1 when it is fixed.

[0020] Figure 6A is a perspective view showing a light-emitting device 1a of another embodiment. Figure 6B is a cross-sectional view of the package 2a of the light-emitting device 1a. The cross-sectional view shown in Figure 6B is a cross-section along the same cross-sectional line iv-iv as in Figures 4A and 4B.

[0021] In the light-emitting device 1a, the length of the first fixing part 31a in the X direction is different from, for example, larger than, the length of the second fixing part 32 in the X direction. Accordingly, the first through hole 311a may be an elongated hole extending along the X direction in a plan view. As shown in Figure 6A, a lens 62 may be fixed to the wide first fixing part 31a. Light emitted from the internal space of the cover 40 through the light-transmitting member 41 passes through the lens 62. The lens 62 may be a focusing lens that reduces the diffusion of light in the slow axis direction. The combination of the lens 61 and lens 62 in the internal space makes the light emitted from the light-emitting device 1a substantially parallel light. The first fixing part 31a may have a mark indicating the fixing position of the lens 62.

[0022] Since the first through-hole 311a extends in the X direction, that is, its extension direction is perpendicular to that of the third through-hole 321, the rotational direction of the light-emitting device 1a can be adjusted more easily.

[0023] As shown in Figure 6B, the cross-sectional structure of package 2a is the same as that of package 2 shown in Figure 4A, except for the length of the first fixing portion 31a in the X direction. Depending on the position of the lens 62 in the +Z direction, the first fixing portion 31a may have a portion that protrudes to the +Z side in a range that does not overlap with the substrate 10 in a plan view.

[0024] Figure 7 is a plan view showing multiple light-emitting devices 1b of another embodiment arranged in a row. Multiple light-emitting devices 1b can be arranged substantially adjacent to each other within a range where the fixed positions can be adjusted. That is, in the light-emitting device 1b, the width of the first fixed part 31b and the second fixed part 32b in the Y direction may be equal to or shorter than the width of the substrate 10 in the Y direction. This makes it easier to miniaturize electronic devices, especially electronic devices having multiple light-emitting devices 1b. In addition, the manufacturing cost is reduced by reducing the length of the first fixed part 31b and the second fixed part 32b in the Y direction.

[0025] Figure 8 is a cross-sectional view of package 2c of another embodiment. This cross-section corresponds to the cross-sectional line iv-iv in the above embodiment. In package 2c, the heat dissipation member 20c extends in the X direction along the third surface 11L of the base 11c and is connected to the first fixing part 31c and the second fixing part 32c to form an integrated structure. In this case, the width of the heat dissipation member 20c in the Y direction and the width of the first fixing part 31c and the second fixing part 32c in the Y direction do not have to be the same, and they do not have to be uniform. The heat dissipation member 20c is connected to the first fixing part 31c and the second fixing part 32c, and has a larger area on the lower surface side of the light-emitting device 1c than in the above other embodiment, so that heat is dissipated more efficiently.

[0026] Figure 9 is a perspective view showing an example of an electronic device 100 equipped with a light-emitting device 1. The electronic device 100 may be a high-power light-emitting module such as a high-power laser, and may have multiple light-emitting devices 1, for example, 10, arranged on a base 6. Power is supplied to each light-emitting device 1 via wiring 7 connected to the outside, and wiring (not shown) located inside and / or on the surface of the base 6. The paths of the light emitted by each light-emitting device 1 are shown by dotted lines.

[0027] A lens 3 and a mirror 4 are positioned side by side, corresponding to each light-emitting device 1. Lens 3 may be the same as the lens 62 described above, that is, it may be a focusing lens that reduces diffusion in the slow axis direction of the light emitted from each light-emitting device 1. Mirror 4 is a half-mirror that reflects light incident on its surface and transmits light incident on its back surface, thereby generating parallel light narrower than the spacing between the light-emitting devices 1. This parallel light is further focused and combined by a focusing lens 5 and output. Some or all of the other filters, prisms, optical elements, and IC chips may be positioned on the base 6.

[0028] When the light from multiple light-emitting devices 1 is focused and combined in this manner, variations in the light-emitting units 50 and lenses 61 in each light-emitting device 1 may have an effect. Since the mounting position and direction of the light-emitting device 1 can be easily fine-tuned after assembly, the electronic device 100 can easily align the direction of the emitted light from the multiple light-emitting devices 1.

[0029] Figure 10 is a cross-sectional view of a light-emitting device 1d of another embodiment. The cross-section corresponds to the position of the cross-sectional views in Figures 4A and 4B. The light-emitting device 1d may include a light-emitting unit 50d having a surface-emitting laser diode as a light-emitting element 51d. In this case, the light from the light-emitting element 51d is irradiated in the +Z direction. Accordingly, the light-transmitting member 41d of the cover 40d is positioned on the +Z side. The first surface 20U of the mounting portion 21 on which the light-emitting unit 50d is mounted may be located on the -Z side of the upper surface 11U of the base 11. That is, the heat dissipation member 20d does not have to protrude from the upper surface 11U toward the +Z side.

[0030] The light-emitting device 1d does not necessarily have a lens. The first fixing part 31 and the second fixing part 32 may be used, for example, to adjust the orientation of the focusing lens in the fast axis direction and the focusing lens in the slow axis direction, which are located outside the light-emitting device 1d.

[0031] As described above, the package 2 for mounting optical elements in this embodiment comprises a substrate 10, a first fixing portion 31, and a second fixing portion 32. The substrate 10 has a mounting portion 21 having a first surface 20U on which the light-emitting element 51 is mounted, and the material is ceramic. The first fixing portion 31 is located at one end of the substrate 10 on the +X side in the X direction along the first surface 20U. The second fixing portion 32 is located at the other end of the substrate 10 opposite to the one end in the X direction. In package 2, the first fixing portion 31 and the second fixing portion 32 can be used to fix the substrate 10. The first fixing portion 31 has a first through hole 311 and a second through hole 312 that penetrate in a direction intersecting the first surface 20U. The second fixing portion 32 has a third through hole 321 that penetrates in a direction intersecting the first surface 20U. The maximum width of the first through-hole 311 and the third through-hole 321 in the direction along the first surface 20U is greater than the maximum width of the second through-hole 312 in the direction along the first surface 20U. Even after the light-emitting unit 50 and the lens 61 have been mounted in the package 2, the package 2 can be fixed while adjusting the position and direction of the optical axis of the emitted light using the first through-hole 311 and the third through-hole 321. Therefore, the package 2 can be fixed more easily and with higher precision, even with variations in the mounting of the light-emitting unit 50 in the package 2.

[0032] Furthermore, the first surface 20U may be parallel to the direction of light emitted from the light-emitting element 51. This allows the package 2 to be easily aligned within a plane along the optical axis of the light-emitting element 51.

[0033] Furthermore, at least a portion of the heat dissipation member 20, which is made of metal, may be embedded inside the substrate 10. The first surface 20U may be located on the heat dissipation member 20. This allows the heat generated by the light-emitting unit 50 to be easily released via the heat dissipation member 20. On the other hand, the presence of the heat dissipation member 20 in the substrate 10 can cause manufacturing errors between the substrate 10 and the heat dissipation member 20. These manufacturing errors can also cause variations in the optical axis of the light-emitting element 51. The package 2 can easily and accurately adjust for such variations, thereby reducing the decrease in manufacturing yield and the need to improve required accuracy.

[0034] Furthermore, the substrate 10 may have a first mounting portion 14 to which a cover 40 enclosing the area of ​​the mounting portion 21 is attached in a plan view from above the first surface 20U. That is, since the cover 40 is attached to the package 2 after the light-emitting unit 50 is mounted, it is difficult to directly adjust the light-emitting unit 50 when mounting the package 2 to an electronic device. Even in this situation, the influence of variations in the light-emitting unit 50 can be easily reduced by making it possible to adjust the axial direction of the package 2.

[0035] Furthermore, the substrate 10 may have a second mounting portion 16 on which the lens 61 is attached, within the area enclosed by the first mounting portion 14 in a plan view. By positioning the lens 61 in close proximity to the light-emitting element 51, the diffusion of the light-emitting element 51 can be reduced. On the other hand, errors may occur in the mounting position of the lens 61 within the cover 40. The effects of such errors can also be reduced by making the mounting position and orientation of the package 2 adjustable.

[0036] Furthermore, the first fixing portion 31 and the second fixing portion 32 may be positioned on either side of the mounting portion 21 along the X direction, which is the direction of light irradiation by the light-emitting element 51. By aligning the first fixing portion 31 and the second fixing portion 32 in the X direction, the increase in width in the Y direction can be reduced. Therefore, the package 2 and the light-emitting device 1 can be miniaturized in the width direction. In particular, when multiple light-emitting devices 1 are arranged in the electronic device 100, the overall width is reduced, leading to a miniaturization of the width of the electronic device 100.

[0037] Furthermore, the first fixing portion 31 and the second fixing portion 32 may be made of a different metal from the substrate 10. Since the first fixing portion 31, which has the first through-hole 311 and the second through-hole 312, and the second fixing portion 32, which has the third through-hole 321, are made of metal, processing is easy, and through-holes can be obtained accurately and easily.

[0038] Furthermore, the first through-hole 311 and the third through-hole 321 may have an elongated shape when viewed from above the first surface 20U in a plan view. The elongated shape allows for degrees of freedom of the fixing members 91 and 92 along the extending direction, while also allowing the first fixing portion 31 and the second fixing portion 32 to be easily fixed by the fixing members 91 and 92. Therefore, the fixing position of the package 2 can be easily adjusted.

[0039] Furthermore, the first through-hole 311 and the third through-hole 321 may be positioned diagonally to the substrate 10 in a plan view from above the first surface 20U. This allows the package 2 to be easily rotated, for example, using the position of the second through-hole 312 as a reference.

[0040] Furthermore, the first fixing portion 31 and the second fixing portion 32 may have a thickness perpendicular to the first surface 20U that is thinner than that of the substrate 10. The first fixing portion 31 and the second fixing portion 32 will not become heavier than necessary to ensure sufficient strength.

[0041] Furthermore, the length of the first fixing part 31 along the irradiation direction of the light emitted from the light-emitting element 51, i.e., the X direction, and the length of the second fixing part 32 along the irradiation direction may be different from each other. In particular, if the first fixing part 31 is longer, the lens 62 can be mounted on the first fixing part 31, and the light that has passed through the light-transmitting member 41 can be allowed to pass through as is. Alternatively, the first through hole 311a of the first fixing part 31 can be an elongated hole extending in the X direction, which makes it easier to guide the adjustment of the rotation direction of the package 2, i.e., the light-emitting device 1.

[0042] Furthermore, the positions of the second surfaces 31L and 32L of the first fixing portion 31 and the second fixing portion 32, which are opposite to the side of the first surface 20U, may be equal to or lower than the position of the third surface 11L of the base 11, in the Z direction perpendicular to the first surface 20U. This allows the first fixing portion 31 and the second fixing portion 32 to be stably fixed to the base 6 of the electronic device 100 to be fixed.

[0043] Further, the heat radiating member 20 may penetrate the substrate 10 in a direction intersecting the first surface 20U. Since the heat radiating member 20 is continuous from the mounting surface of the light emitting element 51 to the lower surface side in the light emitting device 1, the heat generated by the light emitting element 51 can be more efficiently released from the lower surface side to the fixing surface of the light emitting device 1.

[0044] Further, the mounting portion 21 may be a part of the heat radiating member 20 that includes the first surface 20U and protrudes from the upper surface 11U of the base 11 of the substrate 10. The protruding height of the mounting portion 21 may be determined according to the optical axis position of the light emitted by the light emitting element 51, that is, the positional relationship with the lens 61 or the like. Also, since the heat generated by the light emitting element 51 is selectively transmitted from the mounting portion 21 to the heat radiating member 20 and released downward, an increase in the temperature of the internal space due to the lid body 40 can be reduced.

[0045] Further, the heat radiating member 20 may be connected to the first fixing portion 31 and the second fixing portion 32 along the third surface 11L of the base 11 of the substrate 10, which is opposite to the side of the first surface 20U. Thereby, since the area for releasing heat to the fixing surface extends to the first fixing portion 31 and the second fixing portion 32, the heat generated by the light emitting element 51 can be released more efficiently, and the temperature rise of the light emitting device 1 can be reduced.

[0046] Further, the light emitting device 1 of the present embodiment includes the above-described package 2 and the light emitting unit 50. Therefore, this light emitting device 1 can easily and accurately perform optical axis adjustment and the like of the light emitted by the light emitting element 51 of the mounted light emitting unit 50.

[0047] Further, the irradiation direction of the light by the light emitting element 51 may be parallel to the first surface 20U. Thereby, adjustment of the optical axis of the emitted light in the light emitting device 1 can be easily performed within the range of the plane along the mounting surface.

[0048] Further, the light-emitting device 1 may include a light-transmitting member 41 through which the light emitted from the light-emitting element 51 passes, and a lid 40 joined to the substrate 10 to seal the first surface 20U. Thereby, the internal space is blocked from external air, dust, etc., and the deterioration of the light-emitting device 1 is reduced. Also, although it is difficult to adjust the light-emitting element 51 itself after being sealed by the lid 40, the light-emitting device 1 can adjust variations such as the optical axis direction of the light-emitting element 51 in the package 2. Therefore, there is no need to increase the accuracy requirements for variations in the light-emitting element 51, and the yield reduction during manufacturing of the light-emitting device 1 is reduced.

[0049] Further, the light-emitting device 1 may have a lens 61 inside the lid 40 on the substrate 10 for sealing. By positioning the lens 61 in the vicinity of the light-emitting element 51, the diffusion of the irradiation light by the light-emitting element 51 can be reduced. On the other hand, an error can also occur in the mounting position of the lens 61 within the lid 40. The influence of such an error can also be reduced by making it possible to adjust the mounting position and direction of the package 2.

[0050] Note that the above embodiments are examples, and various modifications are possible. For example, the first surface 20U, which is the fixing surface of the light-emitting unit 50, may not be parallel to the XY plane. For example, the light-emitting unit 50 may be fixed to a surface along the XZ plane. In this case, light may be emitted side by side from a plurality of light-emitting elements 51 arranged in the Z direction.

[0051] Also, the first through hole 311, the second through hole 312, the third through hole 321, and the fourth through hole 322 may not be perpendicular to the XY plane. They may extend obliquely with respect to the XY plane.

[0052] Also, the second mounting portion 16 of the lens 61 may not be located in the internal space sealed by the lid 40. That is, the lens 61 may not be fixed to the internal space. For example, the lens 61 may be attached to the first fixing portion 31, or both the lenses 61 and 3 may be located outside the light-emitting device 1.

[0053] Furthermore, the first through-hole 311 and the third through-hole 321 do not have to be elongated holes that are straight in plan view. For example, the first through-hole 311 and the third through-hole 321 may be arc-shaped to facilitate adjustment in the rotational direction. Alternatively, they may simply be circular in diameter, resulting in larger heads for the fixing members 91 and 92, or the fixing members 91 and 92 may fix the first fixing part 31 and the second fixing part 32, respectively, via washers or the like. The second through-hole 312 and the fourth through-hole 322 do not have to be used for actual fixing, or they may be used for fixing after adjustment by the first through-hole 311 and the third through-hole 321.

[0054] Furthermore, the shapes of the first fixing portion 31 and the second fixing portion 32 are not limited to those described above. They may have other shapes or thicknesses, and they do not have to be made of metal. Also, the first fixing portion 31 and the second fixing portion 32 may be integrally structured with the base 11. Also, the first fixing portion 31 and the second fixing portion 32 do not have to be located in the ±X direction of the substrate 10, respectively. The first fixing portion 31 and the second fixing portion 32 only need to be in a positional relationship that allows the orientation of the package 2 to be adjusted. Also, the first through hole 311 and the third through hole 321 do not have to be diagonally opposite each other in a plan view.

[0055] Furthermore, although the substrate 10 is provided with a heat dissipation member 20 in the above description, it is not limited to this. The base 11 may have a ceramic mounting portion that protrudes to the +Z side. Alternatively, a mounting portion 21, which is a metal member, may be mounted on a flat base 11.

[0056] Furthermore, although the columnar heat dissipation member 20 penetrated the through hole 101 of the base 11 in the above description, the invention is not limited to this. For example, the base 11 may have a mounting portion for a ceramic member protruding to the +Z side, and one or more heat dissipation paths for metal conductors may be located that penetrate the mounting portion and the base 11 in the Z direction. The first surface 20U and the lower surface 20L, which is the back surface of the base 11, may each have a heat absorption surface and a heat dissipation surface to which the metal conductor is connected, respectively.

[0057] Furthermore, although the above description uses an example where the lens 61 and the light-emitting unit 50 are located on the substrate 10, other components may be located on the substrate 10. For example, a driver IC for controlling the amount of light emitted or the timing of light emission may be located on the upper surface 11U of the base 11, outside the first mounting portion 14.

[0058] Furthermore, the external electrode 115 does not have to be located on the top surface of the substrate 10. It may be located on the side or bottom surface of the substrate 10.

[0059] Furthermore, the specific details such as structure, configuration, materials, and size shown in the above embodiments may be modified as appropriate without departing from the spirit of this disclosure. The scope of the present invention includes the scope of the invention as described in the claims and its equivalents.

[0060] This disclosure can be used in packages for mounting optical elements and light-emitting devices.

[0061] 1, 1a-1d Light-emitting device 2, 2a, 2c Package 3 Lens 4 Mirror 5 Focusing lens 6 Base 7 Wiring 10 Substrate 11 Base 11U Top surface 11c Base 20, 20c, 20d Heat dissipation member 20L Bottom surface 21 Mounting section 22 Base 30 Fixing section 40, 40d Cover 41, 41d Light-transmitting member 50, 50d Light-emitting unit 51, 51d Light-emitting element 61, 62 Lens 71, 72 Bonding material 80 Bonding wire 91, 92 Fixing member 100 Electronic device 101 Through hole 102 Connecting electrode 103 Groove 104 Recess 115 External electrode 313, 323 Protrusion

Claims

1. A package for mounting optical elements, comprising: a ceramic substrate having a mounting portion having a first surface on which a laser element is mounted; a first fixing portion located at one end of the ceramic substrate in a first direction along the first surface; and a second fixing portion located at the other end of the ceramic substrate opposite to the first end in the first direction, wherein the first fixing portion and the second fixing portion can be used to fix the ceramic substrate, the first fixing portion has a first through hole and a second through hole penetrating in a direction intersecting the first surface, the second fixing portion has a third through hole penetrating in a direction intersecting the first surface, and the maximum width of the first through hole and the third through hole in the direction along the first surface is greater than the maximum width of the second through hole in the direction along the first surface.

2. The optical element mounting package according to claim 1, wherein the first surface is parallel to the direction of irradiation of light emitted from the laser element.

3. The optical element mounting package according to claim 1 or 2, wherein at least a portion of a heat dissipation member, which is made of metal, is embedded inside the ceramic substrate, and the first surface is located on the heat dissipation member.

4. The optical element mounting package according to any one of claims 1 to 3, wherein the ceramic substrate has a first mounting portion to which a cover is attached that surrounds the area of ​​the mounting portion in a plan view as seen from above the first surface.

5. The optical element mounting package according to claim 4, wherein the ceramic substrate has a second mounting portion on which a lens is attached in a plan view within the area surrounded by the first mounting portion.

6. The optical element mounting package according to any one of claims 1 to 5, wherein the first fixing portion and the second fixing portion are positioned on either side of the mounting portion along the direction of light irradiation by the laser element.

7. The optical element mounting package according to any one of claims 1 to 6, wherein the first fixing portion and the second fixing portion are made of a metal separate from the ceramic substrate.

8. The optical element mounting package according to any one of claims 1 to 7, wherein the first through hole and the third through hole have an elongated hole shape when viewed from above the first surface in a plan view.

9. The optical element mounting package according to any one of claims 1 to 8, wherein the first through hole and the third through hole are located diagonally to the ceramic substrate in a plan view seen from above the first surface.

10. The optical element mounting package according to any one of claims 1 to 9, wherein the first fixing portion and the second fixing portion have a thickness perpendicular to the first surface that is thinner than the ceramic substrate.

11. The optical element mounting package according to any one of claims 1 to 10, wherein the length of the first fixed portion along the irradiation direction of the light emitted from the laser element and the length of the second fixed portion along the irradiation direction are different from each other.

12. The optical element mounting package according to any one of claims 1 to 11, wherein the position of the second surface opposite to the first surface of the first fixing portion is equal to or lower than the position of the third surface of the ceramic substrate opposite to the first surface, in a direction perpendicular to the first surface.

13. The optical element mounting package according to claim 3, wherein the heat dissipation member penetrates the ceramic substrate in a direction intersecting the first surface.

14. The optical element mounting package according to claim 13, wherein the mounting portion is a part of the heat dissipation member including the first surface and protruding from the surface of the ceramic substrate on the side of the first surface.

15. The optical element mounting package according to claim 13 or 14, wherein the heat dissipation member is connected to the first fixing portion and the second fixing portion along the third surface of the ceramic substrate opposite to the first surface.

16. A light-emitting device comprising: a package for mounting an optical element according to any one of claims 1 to 15; and a laser element located on the first surface.

17. The light-emitting device according to claim 16, wherein the direction of light irradiation by the laser element is parallel to the first surface.

18. The light-emitting device according to claim 16 or 17, comprising a lid having a light-transmitting portion through which light emitted by the laser element is transmitted, and which is bonded to the ceramic substrate to seal the first surface.

19. The light-emitting device according to claim 18, further comprising a lens inside the ceramic substrate sealed by the lid.

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