Combined sensor and electronic device

Abstract

An embodiment of the present application provides a combined sensor and an electronic device. The combined sensor includes a substrate and a housing. The substrate includes a first substrate and a second substrate. The housing is covered on the first substrate. A groove with an opening facing the housing is provided on the first substrate, and the second substrate is connected to the opening. The first sensing module and the second sensing module in the combined sensor are both arranged on the side of the second substrate facing the housing, avoiding the mutual stacking between the first sensing module and the second sensing module, reducing the height of the combined sensor, and realizing the miniaturization setting of the combined sensor.

Description

Technical Field

[0001] This application belongs to the technical field of sensors. Specifically, this application relates to a combined sensor and an electronic device. Background Art

[0002] With the continuous increase of functions on electronic devices, more and more sensors are required in electronic devices. In order to reduce the assembly space of electronic devices, the development of combined sensors has become a market trend.

[0003] However, multiple chips in traditional combined sensors are stacked on top of each other, resulting in an increase in the height of the combined sensor. The relatively large size of the combined sensor not only increases the internal space of the electronic device occupied by the combined sensor, but also increases the packaging difficulty of the combined sensor. Summary of the Invention

[0004] An object of an embodiment of this application is to provide a technical solution for a combined sensor and an electronic device, which can solve the problem of the relatively large size of traditional combined sensors.

[0005] According to a first aspect of an embodiment of this application, a combined sensor is provided, including:

[0006] A substrate and a housing, the substrate includes a first substrate and a second substrate, the housing is disposed on the first substrate, a groove with an opening facing the housing is provided on the first substrate, the second substrate is connected to the opening and electrically connected to the first substrate, and a ventilation hole is provided on the housing;

[0007] A first sensing module and a second sensing module, the first sensing module includes a first MEMS chip and a first ASIC chip, and the second sensing module includes a second MEMS chip and a second ASIC chip;

[0008] A plurality of first welding parts are provided on a side of the first substrate facing the housing, both the first sensing module and the second sensing module are disposed on a side of the second substrate facing the housing, and the first MEMS chip and the second MEMS chip are electrically connected to the first welding parts.

[0009] Optionally, the first MEMS chip and the first ASIC chip are spaced apart and disposed on a side of the second substrate facing the housing.

[0010] Optionally, the second MEMS chip and the second ASIC chip are stacked on a side of the second substrate facing the housing, and the second ASIC chip is located between the second substrate and the second MEMS chip.

[0011] Optionally, a plurality of second welding portions are provided on one side of the first substrate facing the housing, and a plurality of third welding portions are provided on one side of the second substrate facing the groove;

[0012] The first welding portion exposes from the first substrate and is electrically connected to the second welding portion, and the second welding portion and the third welding portion face each other.

[0013] Optionally, a plurality of fourth welding portions are provided on one side of the second substrate facing the housing, and the fourth welding portion and the third welding portion are connected through internal traces of the second substrate;

[0014] The first ASIC chip and the second ASIC chip are electrically connected to the fourth welding portion.

[0015] Optionally, a plurality of fifth welding portions are provided on one side of the second substrate facing the housing, and a plurality of sixth welding portions are provided on one side of the second substrate facing the groove, and the fifth welding portion and the sixth welding portion are connected through internal traces of the second substrate;

[0016] The first ASIC chip and the second ASIC chip are electrically connected to the fifth welding portion.

[0017] Optionally, a plurality of seventh welding portions are provided on one side of the first substrate facing the housing;

[0018] The seventh welding portion faces the sixth welding portion.

[0019] Optionally, the first sensing module is a microphone module;

[0020] A communication hole is provided on the second substrate, and the communication hole communicates the back cavity of the first MEMS chip and the groove.

[0021] Optionally, a sealant is provided between the second substrate and the first substrate.

[0022] According to a second aspect of the embodiments of the present application, an electronic device is provided, including the combined sensor described in the first aspect.

[0023] One technical effect of the present application is that:

[0024] An embodiment of the present application provides a combined sensor. The combined sensor includes a substrate and a housing. The substrate includes a first substrate and a second substrate. The housing covers the first substrate. A groove with an opening facing the housing is provided on the first substrate, and the second substrate is connected to the opening. The first sensing module and the second sensing module in the combined sensor are both arranged on the side of the second substrate facing the housing, avoiding the mutual stacking between the first sensing module and the second sensing module, reducing the height of the combined sensor, and realizing the miniaturization setting of the combined sensor.

[0025] Other features and advantages of the present application will become clear through the following detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments of the present application and, together with the description, are used to explain the principles of the present application.

[0027] Figure 1 is a side cross-sectional view of a combined sensor provided by an embodiment of the present application;

[0028] Figure 2 is a top view of the second substrate of a combined sensor provided by an embodiment of the present application;

[0029] Figure 3 is a bottom view of the second substrate of a combined sensor provided by an embodiment of the present application;

[0030] Figure 4 is the top view of the first substrate of a combined sensor provided by an embodiment of the present application Figure 1 ;

[0031] Figure 5 is the top view of the first substrate of a combined sensor provided by an embodiment of the present application Figure 2 。

[0032] Wherein:

[0033] 1. Substrate; 11. First substrate; 111. Groove; 112. First welding part; 113. Second welding part; 114. Seventh welding part; 12. Second substrate; 121. Third welding part; 122. Fourth welding part; 123. Fifth welding part; 124. Sixth welding part; 125. Communication hole; 2. Housing; 21. Ventilation hole; 3. First sensing module; 31. First MEMS chip; 311. Back cavity; 32. First ASIC chip; 4. Second sensing module; 41. Second MEMS chip; 42. Second ASIC chip; 5. Gold wire. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0034] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application.

[0035] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present application or its application or use.

[0036] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the specification.

[0037] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0038] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof in subsequent drawings is not required.

[0039] Referring Figures 1 to 5 , an embodiment of the present application provides a combined sensor, which can integrate two or more of information such as sound, pressure, and temperature into one sensor to improve the integration and functional diversity of the combined sensor. The combined sensor includes:

[0040] A substrate 1 and a housing 2, the substrate 1 includes a first substrate 11 and a second substrate 12, the housing 2 is covered on the first substrate 11, a groove 111 with an opening facing the housing 2 is provided on the first substrate 11, the second substrate 12 is connected to the opening and electrically connected to the first substrate 11, and a ventilation hole 21 is provided on the housing 2, and the ventilation hole 21 can be used for the sensors inside the combined sensor to sense changes in air flow and air pressure.

[0041] A first sensing module 3 and a second sensing module 4, the first sensing module 3 includes a first MEMS chip 31 and a first ASIC chip 32, and the second sensing module 4 includes a second MEMS chip 41 and a second ASIC chip 42; the first sensing module 3 and the second sensing module 4 can be an acoustic sensor and a pressure sensing module respectively. For example, the first sensing module 3 can be a microphone module.

[0042] See Figure 1 and Figure 4, on the side of the first substrate 11 facing the housing 2, a plurality of first welding portions 112 are provided. For example, the plurality of first welding portions 112 are arranged at intervals on the top surface edge of the first substrate 11; both the first sensing module 3 and the second sensing module 4 are arranged on the side of the second substrate 12 facing the housing 2. For example, both the first sensing module 3 and the second sensing module 4 are arranged on the top surface of the second substrate 12; and the first MEMS chip 31 and the second MEMS chip 41 are electrically connected to the first welding portions 112.

[0043] Specifically, the first welding portion 112 can be a pad. Both the first MEMS chip 31 and the second MEMS chip 41 have pads, and the pads on the first MEMS chip 31 and the pads on the second MEMS chip 41 are respectively connected to different first welding portions 112 through gold wires 5.

[0044] Further, the second substrate 12 can be mounted on the first substrate 11. The first welding portion 112 is connected to the first ASIC chip 32 and the second ASIC chip 42 through the second substrate 12, so as to realize that the first MEMS chip 31 is electrically connected to the first ASIC chip 32 through the first welding portion 112 and the second substrate 12, and the second MEMS chip 41 is electrically connected to the second ASIC chip 42 through the first welding portion 112 and the second substrate 12; and the first ASIC chip 32 and the second ASIC chip 42 can also be electrically connected to the first substrate 11 through the second substrate 12 to ensure the signal transmission of the first sensing module 3 and the second sensing module 4 and ensure the signal sensing stability of the first sensing module 3 and the second sensing module 4.

[0045] In the combined sensor provided by the embodiment of the present application, both the first sensing module 3 and the second sensing module 4 are arranged on the side of the second substrate 12 facing the housing 2, avoiding the mutual stacking between the first sensing module 3 and the second sensing module 4, reducing the height of the combined sensor, not only reducing the size of the combined sensor, but also simplifying the packaging process of the combined sensor.

[0046] Optionally, refer to Figure 1 , the first MEMS chip 31 and the first ASIC chip 32 are arranged at intervals on the side of the second substrate 12 facing the housing 2.

[0047] Specifically, the first MEMS chip 31 and the first ASIC chip 32 can be arranged at intervals on the same side of the second substrate 12 to avoid the increase in the height of the combined sensor caused by the stacking of the first MEMS chip 31 and the first ASIC chip 32, and simplify the structure of the first sensing module 3.

[0048] Optionally, refer toFigure 1 The second MEMS chip 41 and the second ASIC chip 42 are stacked on one side of the second substrate 12 facing the housing 2, and the second ASIC chip 42 is located between the second substrate 12 and the second MEMS chip 41.

[0049] Specifically, the second ASIC chip 42 can be arranged on one side of the second substrate 12 facing the housing 2 in a flip-chip packaging manner, specifically by connecting the pads of the second ASIC chip 42 to the pads on the second substrate, and the second MEMS chip 41 is mounted on the second ASIC chip 42 in a stacked manner to achieve a compact design of the second sensing module 4.

[0050] In addition, referring to Figure 1 , the first MEMS chip 31, the first ASIC chip 32, and the second ASIC chip 42 can be arranged side by side on one side of the second substrate 12 facing the housing 2, and a separation distance is provided between the first MEMS chip 31, the first ASIC chip 32, and the second ASIC chip 42. For example, a separation distance of 0.2 - 1.0 mm is left between the first ASIC chip 32 and the second ASIC chip 42 to ensure the independence of signal transmission between the first sensing module 3 and the second sensing module 4.

[0051] In one embodiment, the second sensing module 4 can be a pressure sensing module, that is, the second MEMS chip 41 is a pressure MEMS chip, and the second ASIC chip 42 is a pressure ASIC chip, so as to sense the pressure outside the combined sensor through the second MEMS chip 41, and then transmit the pressure signal sensed by the second MEMS chip 41 to the first substrate 11 through the second ASIC chip 42 to ensure the stability of signal transmission of the second sensing module 4.

[0052] Optionally, referring to Figure 3 and Figure 4 , a plurality of second welding parts 113 are arranged on one side of the first substrate 11 facing the housing 2, and a plurality of third welding parts 121 are arranged on one side of the second substrate 12 facing the groove 111;

[0053] The first welding part 112 exposes from the first substrate 11 and is electrically connected to the second welding part 113, and the second welding part 113 and the third welding part 121 are opposite to each other.

[0054] Specifically, in one embodiment, the second welding portion 113 and the third welding portion 121 can be in contact with each other after facing each other. In another embodiment, the second welding portion 113 and the third welding portion 121 can also be connected by solder paste or metal material. In both cases, the connection between the first welding portion 112 and the third welding portion 121 can be achieved through the second welding portion 113 to electrically connect the first MEMS chip 31 and the second MEMS chip 41 to the second substrate 12.

[0055] Optionally, referring to Figures 2 to 4 , a plurality of fourth welding portions 122 are provided on one side of the second substrate 12 facing the housing 2, and the fourth welding portions 122 and the third welding portions 121 are connected through the internal traces of the second substrate 12;

[0056] The first ASIC chip 32 and the second ASIC chip 42 are electrically connected to the fourth welding portions 122.

[0057] Specifically, when the first ASIC chip 32 and the second ASIC chip 42 are disposed on one side of the second substrate 12 facing the housing 2, the first MEMS chip 31 and the second MEMS chip 41 can both be connected to the first ASIC chip 32 and the second ASIC chip 42 through the first welding portion 112, the second welding portion 113, the third welding portion 121, and the fourth welding portion 122 in sequence, thereby achieving the signal transmission between the first MEMS chip 31 and the first ASIC chip 32, and the signal transmission between the second MEMS chip 41 and the second ASIC chip 42.

[0058] In addition, when the fourth welding portions 122 and the third welding portions 121 are connected through the internal traces of the second substrate 12, since the internal traces of the second substrate 12 can extend freely, the fourth welding portions 122 and the third welding portions 121 can be relatively disposed on both sides of the second substrate 12, or the fourth welding portions 122 and the third welding portions 121 can be misaligned and disposed on both sides of the second substrate 12.

[0059] Optionally, referring to Figure 2 and Figure 3 , a plurality of fifth welding portions 123 are provided on one side of the second substrate 12 facing the housing 2, and a plurality of sixth welding portions 124 are provided on one side of the second substrate 12 facing the groove 111. The fifth welding portions 123 and the sixth welding portions 124 are connected through the internal traces of the second substrate 12;

[0060] The first ASIC chip 32 and the second ASIC chip 42 are electrically connected to the fifth welding portions 123.

[0061] Specifically, when the first ASIC chip 32 and the second ASIC chip 42 are electrically connected to the fourth welding portion 122, and the first ASIC chip 32 and the second ASIC chip 42 are electrically connected to the fifth welding portion 123, the fourth welding portion 122 can serve as the signal inlet end interface of the first ASIC chip 32 and the second ASIC chip 42, and the fifth welding portion 123 can serve as the signal outlet end interface of the first ASIC chip 32 and the second ASIC chip 42, so as to ensure signal transmission and conversion in the first ASIC chip 32 and the second ASIC chip 42.

[0062] In addition, when the fifth welding portion 123 and the sixth welding portion 124 are connected through the internal traces of the second substrate 12, since the internal traces of the second substrate 12 can extend freely, the fifth welding portion 123 and the sixth welding portion 124 can be relatively arranged on both sides of the second substrate 12, or the fifth welding portion 123 and the sixth welding portion 124 can be staggeredly arranged on both sides of the second substrate 12.

[0063] Optionally, referring to Figure 4 and Figure 5 , a plurality of seventh welding portions 114 are provided on one side of the first substrate 11 facing the housing 2;

[0064] The seventh welding portion 114 is opposite to the sixth welding portion 124.

[0065] Specifically, in one embodiment, the seventh welding portion 114 and the sixth welding portion 124 can be in contact with each other after being opposite to each other. In another embodiment, the seventh welding portion 114 and the sixth welding portion 124 can also be connected by solder paste or metal material, so as to electrically connect the first ASIC chip 32 and the second ASIC chip 42 to the first substrate 11 through the sequential connection of the fifth welding portion 123, the sixth welding portion 124 and the seventh welding portion 114, realizing signal transmission between the first ASIC chip 32 and the second ASIC chip 42 and the first substrate 11.

[0066] Optionally, referring to Figure 1 , the first sensing module 3 is a microphone module;

[0067] A communication hole 125 is provided on the second substrate 12, and the communication hole 125 communicates the back cavity 311 of the first MEMS chip 31 and the groove 111.

[0068] Specifically, the size of the back cavity 311 is directly related to the sensitivity of the microphone module. After the communication hole 125 communicates the back cavity 311 of the first MEMS chip 31 and the groove 111, the groove 111 can be used to extend the space of the back cavity 311, that is, the volume of the back cavity of the microphone module can be increased, and the SNR (signal-to-noise ratio) and the sound pickup quality of the microphone module are improved.

[0069] Optionally, a sealant is provided between the second substrate 12 and the first substrate 11.

[0070] Specifically, when the second substrate 12 is connected to the opening of the groove 111 and electrically connected to the first substrate 11, the groove 111 can be used to communicate with the back cavity 311 to increase the back cavity space of the microphone module. In order to ensure the sealing of the back cavity space in the microphone module, a sealant can be provided between the second substrate 12 and the first substrate 11. By providing the sealant, not only can the gap between the second substrate 12 and the first substrate 11 be filled to prevent air leakage in the groove 111, but also the stability of the connection between the second substrate 12 and the first substrate 11 can be ensured.

[0071] The embodiment of the present application also provides an electronic device, and the electronic device includes the combined sensor described above.

[0072] Specifically, in the combined sensor of the electronic device, both the first sensing module 3 and the second sensing module 4 are disposed on the side of the second substrate 12 facing the housing 2, avoiding the mutual stacking between the first sensing module 3 and the second sensing module 4, reducing the height of the combined sensor, not only reducing the size of the combined sensor, reducing the space occupied by the combined sensor in the electronic device, but also simplifying the packaging process of the combined sensor and improving the assembly efficiency of the electronic device.

[0073] In addition, the electronic device includes, but is not limited to, one of a microphone, a speaker, a smart watch, a mobile phone, a tablet computer, an e-book reader, an MP3 player, an MP4 player, a computer, a set-top box, a smart TV, and a wearable device.

[0074] Although some specific embodiments of the present application have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A combined sensor, characterized in that, Comprising: A substrate (1) and a housing (2), the substrate (1) includes a first substrate (11) and a second substrate (12), the housing (2) is covered on the first substrate (11), a groove (111) with an opening facing the housing (2) is provided on the first substrate (11), the second substrate (12) is connected to the opening and is electrically connected to the first substrate (11), and a ventilation hole (21) is provided on the housing (2); A first sensing module (3) and a second sensing module (4), the first sensing module (3) includes a first MEMS chip (31) and a first ASIC chip (32), and the second sensing module (4) includes a second MEMS chip (41) and a second ASIC chip (42); On one side of the first substrate (11) facing the housing (2), a plurality of first welding parts (112) are provided. Both the first sensing module (3) and the second sensing module (4) are arranged on one side of the second substrate (12) facing the housing (2), and the first MEMS chip (31) and the second MEMS chip (41) are electrically connected to the first welding parts (112); On one side of the first substrate (11) facing the housing (2), a plurality of second welding parts (113) are provided, and on one side of the second substrate (12) facing the groove (111), a plurality of third welding parts (121) are provided; The first welding parts (112) are exposed from the first substrate (11) and are electrically connected to the second welding parts (113), and the second welding parts (113) and the third welding parts (121) are opposite to each other.

2. The combined sensor according to claim 1, characterized in that, The first MEMS chip (31) and the first ASIC chip (32) are arranged at intervals on one side of the second substrate (12) facing the housing (2).

3. The combined sensor according to claim 1, characterized in that, The second MEMS chip (41) and the second ASIC chip (42) are stacked on one side of the second substrate (12) facing the housing (2), and the second ASIC chip (42) is located between the second substrate (12) and the second MEMS chip (41).

4. The combined sensor according to claim 1, characterized in that, On one side of the second substrate (12) facing the housing (2), a plurality of fourth welding parts (122) are provided, and the fourth welding parts (122) and the third welding parts (121) are connected through internal traces of the second substrate (12); The first ASIC chip (32) and the second ASIC chip (42) are electrically connected to the fourth welding parts (122).

5. The combined sensor according to claim 1, characterized in that, On one side of the second substrate (12) facing the housing (2), a plurality of fifth welding parts (123) are provided, and on one side of the second substrate (12) facing the groove (111), a plurality of sixth welding parts (124) are provided. The fifth welding parts (123) and the sixth welding parts (124) are connected through internal traces of the second substrate (12); The first ASIC chip (32) and the second ASIC chip (42) are electrically connected to the fifth welding parts (123).

6. The combined sensor according to claim 5, characterized in that, On one side of the first substrate (11) facing the housing (2), a plurality of seventh welding parts (114) are provided; The seventh welding part (114) is opposite to the sixth welding part (124).

7. The combined sensor according to claim 1, characterized in that, The first sensing module (3) is a microphone module; A communication hole (125) is provided on the second substrate (12), and the communication hole (125) communicates the back cavity (311) of the first MEMS chip (31) and the groove (111).

8. The combined sensor according to claim 1, characterized in that, A sealant is provided between the second substrate (12) and the first substrate (11).

9. An electronic device, characterized in that, Comprising the combined sensor according to any one of claims 1-8.

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