Cylindrical front body ceramic thin film temperature sensor and preparation device and method thereof

Abstract

The application discloses a cylindrical front body ceramic thin film temperature sensor and a preparation device and a preparation method thereof, and the temperature sensor comprises a cylindrical substrate, a ceramic thin film sensitive grid, a welding spot, a lead wire and a fixing part, the ceramic thin film sensitive grid and the welding spot are conformally laid on the cylindrical substrate through a curved surface weissenberg direct writing forming technology and are prepared through pyrolysis and ceramicization, the welding spot is arranged on the ceramic thin film sensitive grid, the lead wire is connected with the welding spot, and the fixing part is covered on the welding spot. The application can realize in-situ preparation of the ceramic thin film temperature sensor on a cylindrical substrate such as a bearing and a bolt, the sensor has the advantages of in-situ nondestructive detection, strong resistance to extreme environment and less influence on surface characteristics of a structure to be measured, and the preparation device and the method have the advantages of high cylindrical patterning efficiency and simple process, thereby providing a new idea for popularization of high-temperature thin film sensors to practical application.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of thin film temperature sensor preparation, in particular to a cylindrical surface precursor ceramic thin film temperature sensor and a preparation device and method thereof. BACKGROUND

[0002] In the fields of aerospace, gas turbine, etc., the parts with cylindrical surface common characteristics such as aero bearings and high-temperature-resistant bolts often operate under harsh conditions of high temperature and high pressure, high speed, and are prone to failure problems such as fatigue and wear. Temperature is an important indicator for measuring the service state of the above-mentioned parts, and it is of great significance to realize high-temperature in-situ detection on the parts with cylindrical surface common characteristics for the state monitoring and early fault diagnosis of key parts.

[0003] However, due to the large size of the traditional sensor, the opening or external installation method is often used for signal acquisition when measuring curved surface parts, which damages the structure of the measured parts, and it is difficult to obtain accurate test signals because the measurement position is not in situ. In addition, due to the high requirements of high-temperature application scenarios on sensor materials, the expansion application of mature curved surface self-assembly technology and curved surface transfer technology is limited.

[0004] To solve the above problems, the prior art provides a variety of, for example, the application number CN 201811300429.7 provides a thin film temperature sensor for aero-engine turbine blade, which uses ion deposition technology to prepare a functional and structural integrated thin film sensor on the curved surface of the blade. The total thickness of the thin film sensor is less than 25um, and the highest measurement temperature is 1100℃, but the ion deposition process is not suitable for curved surfaces with large curvature, and the preparation cost is high; for example, the utility model number CN201921389203.9 provides a grating type bolt sensor, which prepares a reusable and low-cost grating type sensor on the cylindrical surface of the bolt, but its temperature measurement range is limited, and there is a circular groove on the cylindrical surface of the bolt, which affects its mechanical strength. SUMMARY

[0005] The purpose of the present application is to overcome the shortcomings of the prior art, provide a cylindrical surface precursor ceramic thin film temperature sensor which can realize in-situ detection, has strong resistance to extreme environment, and has little effect on the surface characteristics of the measured structure, and also provide a preparation device and method of a cylindrical surface precursor ceramic thin film temperature sensor which has high patterning efficiency and simple process.

[0006] In order to achieve the above purpose, the technical scheme of the present application is:

[0007] A kind of preparation device of cylindrical front body ceramic thin film temperature sensor, including base, workbench, Y axis sealed linear module, X axis sealed linear module, Z axis sealed linear module, electric rotary table, weissenberg direct writing module, motion controller, V-shaped holder;

[0008] Workbench is fixed above base, both sides above base are provided with Y axis sealed linear module, Y axis sealed linear module includes Y axis motor, Y axis slide rail and Y axis sliding block, Y axis sliding block is located on Y axis slide rail, Y axis motor is used to drive Y axis sliding block along Y axis slide rail sliding;

[0009] X axis sealed linear module includes X axis motor, X axis slide rail and X axis sliding block, X axis slide rail both ends are fixed on Y axis sliding block, X axis sliding block is located on X axis slide rail, X axis motor is used to drive X axis sliding block along X axis slide rail sliding;

[0010] Z axis sealed linear module includes Z axis motor, Z axis slide rail and Z axis sliding block, Z axis slide rail is fixed on X axis sliding block, Z axis sliding block is located on Z axis slide rail, Z axis motor is used to drive Z axis sliding block along Z axis slide rail sliding, X axis slide rail, Y axis slide rail, Z axis slide rail are mutually perpendicular two by two;

[0011] Electric rotary table is fixed on Z axis sliding block, weissenberg direct writing module is fixed on electric rotary table, when electric rotary table rotates, weissenberg direct writing module is swung;

[0012] V-shaped holder is installed on workbench, V-shaped holder is used to hold and fix cylindrical surface base;

[0013] X axis motor, Y axis motor, Z axis motor, electric rotary table are electrically connected with motion controller, controller is used to read four-axis G code and control X axis motor, Y axis motor, Z axis motor, electric rotary table movement, so that weissenberg direct writing module carries out curved surface co-line direct writing ceramic thin film sensitive grid and welding spot on cylindrical surface base, in curved surface co-line direct writing process, the direction of raw material ejection of weissenberg direct writing module coincides with the normal direction of curved surface.

[0014] As preferred, V-shaped holder includes V-shaped seat, pressing block, guide rod and compression screw, one end of guide rod is fixed on V-shaped seat, pressing block is sleeved with guide rod, and pressing block is fixed on guide rod by compression screw.

[0015] As preferred, weissenberg direct writing module includes connecting assembly, rotary motor, shaft coupling, micro-needle, liquid storage cavity, lock washer, liquid storage cavity cover, glue dispensing needle, direct current power supply, connecting assembly includes connecting plate, motor fixing plate, liquid storage cavity fixing plate, first set screw, second set screw;

[0016] The motor fixing plate is installed on the upper side of the connecting plate, the liquid storage cavity fixing plate is installed on the lower side of the connecting plate, the rotating motor is installed on the motor fixing plate and used for driving the microneedle to rotate, one end of the shaft coupling is sleeved with the output shaft of the rotating motor, the other end is sleeved with the microneedle, and the rotating motor and the microneedle are fixedly connected through the first locking screw and the second locking screw respectively, the upper end of the liquid storage cavity is sleeved with the lock washer and then is threadedly connected with the liquid storage cavity fixing plate, the liquid storage cavity is used for storing raw materials of the direct writing ceramic thin film sensitive grid and the welding point, a through hole for accommodating the microneedle is arranged in the center of the liquid storage cavity cover, the liquid storage cavity cover is threadedly connected with the liquid storage cavity after passing through the microneedle, the dispensing needle head is fixed at the lower end of the liquid storage cavity, the microneedle is arranged in the dispensing needle head, and the direct current power supply is electrically connected with the rotating motor and used for controlling the rotating speed of the rotating motor, so that the raw materials of the direct writing ceramic thin film sensitive grid and the welding point are stably discharged along the microneedle in the dispensing needle head.

[0017] As preferred, the microneedle is flush with the liquid outlet port of the dispensing needle head or extends into the liquid outlet port by 0-200 μm.

[0018] A preparation method of the cylindrical front body ceramic thin film temperature sensor, using the preparation device of the cylindrical front body ceramic thin film temperature sensor, comprises the following steps:

[0019] S1, correcting the V-shaped seat of the electric rotating table and the V-shaped holder, so that the dispensing needle head of the Weissenberg direct writing module is perpendicular to the workbench, and the two side surfaces of the V-shaped seat are parallel to the Y-axis slide rail;

[0020] S2, sequentially using acetone, alcohol and deionized water to ultrasonically clean the cylindrical surface base, placing the cylindrical surface base on the V-shaped seat after cleaning, pressing the cylindrical surface base by using the pressing block of the V-shaped holder and fixing the cylindrical surface base by using the pressing screw, so that the cylindrical surface base is parallel to the two side surfaces and the bottom surface of the V-shaped seat respectively;

[0021] S3, adding 50wt%-60wt% TiB2 powder into 40wt%-50wt% SiCN precursor ceramic solution to form the raw materials of the direct writing ceramic thin film sensitive grid and the welding point, and then injecting the raw materials into the liquid storage cavity of the Weissenberg direct writing module after magnetic stirring for 1h at room temperature;

[0022] S4, moving the liquid outlet port of the dispensing needle head to the machining origin, setting the machining origin as the origin of the machine tool coordinate system, and re-setting the origin of the machine tool coordinate system to coincide with the workpiece coordinate system according to which the four-axis G code is generated;

[0023] S5, loading the four-axis G code into the motion controller, connecting the direct current power supply of the Weissenberg direct writing module and giving a proper voltage, so that the raw materials of the direct writing ceramic thin film sensitive grid and the welding point are stably delivered, and then executing the four-axis G code to conformally write the ceramic thin film sensitive grid on the curved surface of the cylindrical surface base;

[0024] S6, pre-curing the ceramic thin film sensitive grid in air;

[0025] S7, putting the pre-cured ceramic thin film sensitive grid into a tube furnace and sintering in air to pyrolyze the ceramic thin film sensitive grid;

[0026] S8, respectively applying a proper amount of soldering points to the first and last ends of the pyrolyzed ceramic thin film sensitive grid, and fixing the lead wires to the grooves of the fixing member;

[0027] S9, bonding the groove side of the fixing member to the soldering points, and pre-curing the soldering points in air;

[0028] S10, putting the product obtained in step S9 into a tube furnace and sintering in air to pyrolyze the soldering points.

[0029] A cylindrical surface precursor ceramic thin film temperature sensor is prepared by the preparation method of the cylindrical surface precursor ceramic thin film temperature sensor, and comprises a cylindrical surface substrate, a ceramic thin film sensitive grid, soldering points, lead wires and a fixing member, the ceramic thin film sensitive grid and the soldering points are conformally laid on the cylindrical surface substrate by the Weissenberg direct writing forming technology and are prepared by pyrolysis and ceramicization, the soldering points are arranged on the ceramic thin film sensitive grid, the lead wires are connected with the soldering points, and the fixing member covers the soldering points.

[0030] Preferably, the cylindrical surface substrate is a cylindrical part with a temperature resistance of more than 800 DEG C and high-temperature insulation, and the machining origin is arranged on the highest generatrix of the cylindrical surface substrate during direct writing.

[0031] Preferably, the ceramic thin film sensitive grid is comb-shaped, and the thickness is 5 mu m to 30 mu m.

[0032] Preferably, the fixing member is provided with a groove on the side close to the soldering points, the lead wire is in interference fit with the groove, and the lead wire is led out from the groove.

[0033] Preferably, the raw material components for direct writing of the ceramic thin film sensitive grid and the soldering points comprise 50wt%-60wt% TiB2 powder and 40wt%-50wt% SiCN precursor ceramic solution.

[0034] Compared with the prior art, the present application has the following beneficial effects:

[0035] The application can solve the problems that the key components of high-end equipment serving in complex high-temperature environment, such as precision machine tools, aerospace equipment, robots and the like, have complex shape curvature distribution and are difficult to prepare sensors in situ for health monitoring. Based on a high-temperature resistant precursor ceramic material, a preparation device of a cylindrical surface precursor ceramic thin film temperature sensor is provided, and the integrated sensor manufacturing of the curved surface structure is realized. Compared with most studies on the plane, the preparation device and the preparation method of the cylindrical surface precursor ceramic thin film temperature sensor can effectively realize the preparation of the thin film sensor close to the actual application; compared with the physical sputtering deposition, chemical vapor deposition and other processes commonly used in the preparation of sensors at present, the application overcomes the defects of traditional processes such as complexity, high cost and limitation of curved surface manufacturing, lays a good foundation for practical application, realizes curved surface conformal printing, and provides certain reference for solving the problem. And in the direct writing process of the preparation device of the cylindrical surface precursor ceramic thin film temperature sensor, the dispensing needle is always perpendicular to the curved surface, which can ensure the uniformity and consistency of the thin film in the direct writing process, overcome the liquid leading and lag phenomenon caused by the inconsistent distance between the dispensing needle and the surface in the traditional three-axis curved surface direct writing process, and improve the surface quality of the thin film. BRIEF DESCRIPTION OF DRAWINGS

[0036] The accompanying drawings are included to provide a further understanding of embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of the application. Other embodiments and many of the intended advantages of the embodiments will be readily appreciated as the same becomes better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.

[0037] Figure 1 FIG. 1 is a schematic diagram of the preparation device of the cylindrical surface precursor ceramic thin film temperature sensor of the embodiments of the present application;

[0038] Figure 2 FIG. 2 is an enlarged view of part A of FIG. 1; Figure 1

[0039] Figure 3 FIG. 3 is an enlarged view of part B of FIG. 1; Figure 1

[0040] Figure 4 (a) is a three-dimensional view of the preparation device of the cylindrical surface precursor ceramic thin film temperature sensor of the embodiments of the present application; Figure 4 (b) is a direct writing schematic diagram of the preparation device of the cylindrical surface precursor ceramic thin film temperature sensor of the embodiments of the present application; Figure 4 (c) is a micro-needle rotation liquid supply schematic diagram of the preparation device of the cylindrical surface precursor ceramic thin film temperature sensor of the embodiments of the present application;

[0041] ​​Figure 5 (a)~5(d) and 5(f)~5(h) are different patterning direct-writing schematic diagrams of the preparation device of the cylindrical precursor ceramic thin film temperature sensor of the embodiment of the present application;

[0042] Figure 6 (a)~5(d) and 5(f)~5(h) are different patterning direct-writing schematic diagrams of the preparation device of the cylindrical precursor ceramic thin film temperature sensor of the embodiment of the present application;

[0043] Figure 7 (a)~5(d) and 5(f)~5(h) are different patterning direct-writing schematic diagrams of the preparation device of the cylindrical precursor ceramic thin film temperature sensor of the embodiment of the present application;

[0044] Figure 8 (a)~5(d) and 5(f)~5(h) are different patterning direct-writing schematic diagrams of the preparation device of the cylindrical precursor ceramic thin film temperature sensor of the embodiment of the present application;

[0045] Figure 9 (a)~9(d) is a surface micro-morphology diagram of the cylindrical precursor ceramic thin film temperature sensor of the embodiment of the present application;

[0046] Figure 10 (a)~9(d) is a surface micro-morphology diagram of the cylindrical precursor ceramic thin film temperature sensor of the embodiment of the present application;

[0047] Figure 11 (a)~9(d) is a surface micro-morphology diagram of the cylindrical precursor ceramic thin film temperature sensor of the embodiment of the present application;

[0048] Figure 12 (a)~12(b) is a schematic diagram of the preparation method of the cylindrical precursor ceramic thin film temperature sensor of the embodiment of the present application applied to a bearing and a temperature dynamic test result diagram thereof; Figure 12 (a)~9(d) is a surface micro-morphology diagram of the cylindrical precursor ceramic thin film temperature sensor of the embodiment of the present application;

[0049] Figure 13 (a)~9(d) is a surface micro-morphology diagram of the cylindrical precursor ceramic thin film temperature sensor of the embodiment of the present application;

[0050] Figure 14 (a)~9(d) is a surface micro-morphology diagram of the cylindrical precursor ceramic thin film temperature sensor of the embodiment of the present application;

[0051] Reference numerals: 1, cylindrical surface base; 1a, machining origin 1a; 2, ceramic thin film sensitive grid; 3, first welding point; 4, second welding point; 5, first fixing piece; 6, second fixing piece; 7, first lead wire; 8, second lead wire; 5a, first slot; 6a, second slot; 9, machine base; 10, workbench; 11, Y-axis sealed linear module; 111, Y-axis motor; 112, Y-axis slide rail; 113, Y-axis slide block; 12, X-axis sealed linear module; 121, X-axis motor; 122, X-axis slide rail; 123, X-axis slide block; 13, Z-axis sealed linear module; 131, Z-axis motor; 132, Z-axis slide rail; 133, Z-axis slide block; 14, electric rotary table; 15, Weissenberg direct writing module; 151, fixing assembly; 1511, connecting plate; 1512, liquid storage cavity fixing plate; 1513, motor fixing plate; 1514, first fixing screw; 1515, second fixing screw; 152, rotary motor; 153, shaft coupling; 154, microneedle; 155, liquid storage cavity; 156, anti-loosening washer; 157, liquid storage cavity cover; 158, dispensing needle; 159, direct current power supply; 16, motion controller; 17, V-shaped holder; 171, V-shaped seat; 172, pressing block; 173, guide rod; 174, pressing screw. DETAILED DESCRIPTION

[0052] The application will be further described below in detail with reference to the drawings and examples. It can be understood that the specific examples described herein are only used to explain the related application, and are not limited to the application. In addition, it should be noted that only the parts related to the application are shown in the drawings for ease of description.

[0053] It should be noted that the examples in the present application and the features in the examples can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and examples.

[0054] Reference Figures 1-3The embodiment of the application provides a preparation device of a cylindrical front body ceramic thin film temperature sensor, which comprises a base 9, a workbench 10, a Y-axis sealed linear module 11, an X-axis sealed linear module 12, a Z-axis sealed linear module 13, an electric rotary table 14, a Weissenberg direct writing module 15, a motion controller 16 and a V-shaped holder 17. The workbench 10 is fixed above the base 9, Y-axis sealed linear modules 11 are arranged on the two sides of the upper part of the base 9, the Y-axis sealed linear module 11 comprises a Y-axis motor 111, a Y-axis sliding rail 112 and a Y-axis sliding block 113, the Y-axis sliding block 113 is arranged on the Y-axis sliding rail 112, and the Y-axis motor 111 is used for driving the Y-axis sliding block 113 to slide along the Y-axis sliding rail 112. The X-axis sealed linear module 12 comprises an X-axis motor 121, an X-axis sliding rail 122 and an X-axis sliding block 123, the two ends of the X-axis sliding rail 122 are fixed on the Y-axis sliding block 113, the X-axis sliding block 123 is arranged on the X-axis sliding rail 122, and the X-axis motor 121 is used for driving the X-axis sliding block 123 to slide along the X-axis sliding rail 122. The Z-axis sealed linear module 13 comprises a Z-axis motor 131, a Z-axis sliding rail 132 and a Z-axis sliding block 133, the Z-axis sliding rail 132 is fixed on the X-axis sliding block 123, the Z-axis sliding block 133 is arranged on the Z-axis sliding rail 132, and the Z-axis motor 131 is used for driving the Z-axis sliding block 133 to slide along the Z-axis sliding rail 132. The X-axis sliding rail 122, the Y-axis sliding rail 112 and the Z-axis sliding rail 132 are perpendicular to each other in pairs. The electric rotary table 14 is fixed on the Z-axis sliding block 133, the Weissenberg direct writing module 15 is fixed on the electric rotary table 14, and the electric rotary table 14 drives the Weissenberg direct writing module 15 to swing when rotating. The V-shaped holder 17 is installed on the workbench 10, and the V-shaped holder 17 is used for clamping and fixing the cylindrical surface base 1. The X-axis motor 121, the Y-axis motor 111, the Z-axis motor 131 and the electric rotary table 14 are electrically connected with the motion controller 16. The controller is used for reading four-axis G codes and controlling the movement of the X-axis motor 121, the Y-axis motor 111, the Z-axis motor 131 and the electric rotary table 14, so that the Weissenberg direct writing module 15 performs curved surface co-arrangement direct writing of a ceramic thin film sensitive grid 2 and a welding point on the cylindrical surface base 1. In the curved surface co-arrangement direct writing process, the material spraying direction of the Weissenberg direct writing module coincides with the normal direction of the curved surface.

[0055] In specific embodiments, the V-shaped holder 17 comprises a V-shaped seat 171, a pressing block 172, a guide rod 173 and a pressing screw 174. One end of the guide rod 173 is fixed on the V-shaped seat 171, the pressing block 172 is sleeved with the guide rod 173, and the pressing block 172 is fixed on the guide rod 173 through the pressing screw 174.

[0056] In specific embodiments, the Weissenberg direct writing module 15 includes a connecting assembly, a rotary motor 152, a shaft coupling 153, a microneedle 154, a liquid storage cavity 155, a lock washer 156, a liquid storage cavity cover 157, a dispensing needle 158, a direct current power supply 159, the connecting assembly includes a connecting plate 1511, a motor fixing plate 1513, a liquid storage cavity fixing plate 1512, a first set screw 1514, and a second set screw 1515; the connecting plate 1511 is fixed on the electric rotary table 14, the motor fixing plate 1513 is installed on the upper side of the connecting plate 1511, the liquid storage cavity fixing plate 1512 is installed on the lower side of the connecting plate 1511, the rotary motor 152 is installed on the motor fixing plate 1513 and used to drive the microneedle 154 to rotate, one end of the shaft coupling 153 is sleeved with the output shaft of the rotary motor 152, the other end is sleeved with the microneedle 154, and the shaft coupling 153 is fixedly connected with the output shaft of the rotary motor 152 and the microneedle 154 through the first set screw 1514 and the second set screw 1515, respectively, the upper end of the liquid storage cavity 155 is sleeved with the lock washer 156 and then is threadedly connected with the liquid storage cavity fixing plate 1512, the liquid storage cavity 155 is used to store raw materials of the direct writing ceramic thin film sensitive grid 2 and the welding point, the liquid storage cavity cover 157 is provided with a through hole in the center for accommodating the microneedle 154 to pass through, the liquid storage cavity cover 157 is threadedly connected with the liquid storage cavity 155 after passing through the microneedle 154, the dispensing needle 158 is fixed at the lower end of the liquid storage cavity 155, the microneedle 154 is arranged in the dispensing needle 158, and the direct current power supply 159 is electrically connected with the rotary motor 152 and used to control the rotating speed of the rotary motor 152, so that the raw materials of the direct writing ceramic thin film sensitive grid 2 and the welding point can stably flow out along the microneedle 154 in the dispensing needle 158.

[0057] Specifically, the microneedle 154 is flush with or extends into the liquid outlet port of the dispensing needle 158 by 0-200 μm. The preparation device of the present application can ensure that the dispensing needle 158 is always perpendicular to the curved surface during the direct writing process, so as to ensure the uniformity and consistency of the thin film during the direct writing process, overcome the liquid leading and lagging phenomenon caused by the inconsistent distance between the dispensing needle 158 and the surface during the traditional three-axis curved surface direct writing process, improve the surface quality of the thin film, and facilitate uniform film formation.

[0058] The traditional three-axis curved surface jet printing device can only stack layer by layer in one direction. When the printed part is complex, a large number of support structures need to be printed as an aid, which not only wastes materials but also affects the processing efficiency, and there are liquid leading and lagging phenomena, and the "step effect" is easy to occur, which affects the printing quality and is not conducive to uniform film formation. The five-axis device is commonly used for manufacturing curved surface parts, and has the advantages of high flexibility and strong adaptability. The preparation device of the cylindrical surface precursor ceramic thin film temperature sensor of the embodiment of the present application is as shown in Figure 4 (a). In order to further improve the personalized direct writing ability, a complex curved surface conformal direct writing algorithm is developed to control the dispensing needle 158 to be always parallel to the curved surface normal direction during the direct writing process, which is helpful for uniform film formation. As shown in Figure 4(b) shows that the microneedle 154 rotates in the glue dispensing needle 158 to supply liquid, and can continue to be patterned under the driving of the five-axis platform. As shown in Figure 4 (c) shows that the liquid forms a meniscus at the glue dispensing needle 158 under the action of the Weissenberg effect in a short time.

[0059] To further verify the direct writing performance, different curvature radii (10mm-25mm) are selected for grid pattern, as shown in Figure 5 (a)-(d) show that the consistency is good. As shown in Figure 5 (f)-(h) show that by directly writing complex patterns on the cylindrical surface, the direct writing performance is expanded, and it is further verified that the preparation device of the cylindrical precursor ceramic thin film temperature sensor of the embodiment of the application can realize stable direct writing on the curved surface.

[0060] Referring to Figure 6 The embodiment of the application proposes a preparation method of a cylindrical precursor ceramic thin film temperature sensor, which uses the above-mentioned preparation device of the cylindrical precursor ceramic thin film temperature sensor, and includes the following steps:

[0061] S1, the V-shaped seat 171 of the electric rotating table 14 and the V-shaped holder 17 is corrected, so that the glue dispensing needle 158 of the Weissenberg direct writing module 15 is perpendicular to the workbench 10, and the two side surfaces of the V-shaped seat 171 are parallel to the Y-axis sliding rail 112;

[0062] S2, the cylindrical surface substrate 1 is sequentially cleaned by ultrasonic cleaning with acetone, alcohol and deionized water, and after cleaning, the cylindrical surface substrate 1 is placed on the V-shaped seat 171, the pressing block 172 of the V-shaped holder 17 is used to press the cylindrical surface substrate 1 and the pressing screw 174 is used to fix, so that the cylindrical surface substrate 1 is parallel to the two side surfaces and the bottom surface of the V-shaped seat 171 respectively;

[0063] S3, 50wt%-60wt% TiB2 powder is added to 40wt%-50wt% SiCN precursor ceramic solution to form the raw material of the direct writing ceramic thin film sensitive grid 2 and the welding point, and after magnetic stirring at room temperature for 1h, it is injected into the liquid storage cavity 155 of the Weissenberg direct writing module 15;

[0064] S4, the liquid outlet port of the glue dispensing needle 158 is moved to the machining origin 1a, and the machining origin 1a is set as the machine tool coordinate system origin, and after the machine tool coordinate system origin is reset, it coincides with the workpiece coordinate system on which the four-axis G code is generated;

[0065] S5, the four-axis G code is loaded into the motion controller 16, the direct current power supply 159 of the Weissenberg direct writing module 15 is turned on and an appropriate voltage is given, so that the raw material of the direct writing ceramic thin film sensitive grid 2 and the welding point is stably delivered, and then the four-axis G code is executed, the cylindrical surface substrate 1 is directly written with the ceramic thin film sensitive grid 2, and the thickness of the ceramic thin film sensitive grid 2 is 10μm;

[0066] S6, pre-curing the ceramic thin film sensitive grid 2 in air, the pre-curing temperature is 180℃, and the time is 30min;

[0067] S7, after the pre-cured ceramic thin film sensitive grid 2 is placed in a tube furnace and sintered in air, the ceramic thin film sensitive grid 2 is pyrolyzed, the sintering condition is that the temperature is raised from room temperature to 800℃ at a rate of 2℃ / min, and then the temperature is lowered from 800℃ to room temperature at a rate of 3℃ / min after 1h of heat preservation;

[0068] S8, a proper amount of soldering points are respectively spotted on the first and last ends of the pyrolyzed ceramic thin film sensitive grid 2 to form a first soldering point 3 and a second soldering point 4, and the lead wires are respectively fixed to the grooves of the fixing members, specifically, the first lead wire 7 and the second lead wire 8 are respectively fixed to the first groove 5a and the second groove 6a;

[0069] S9, the groove side of the fixing member is bonded to the soldering point, specifically, the groove side of the first fixing member 5 and the second fixing member 6 is bonded to the first soldering point 3 and the second soldering point 4 respectively; the soldering points are pre-cured in air, the pre-curing temperature is 180℃, and the time is 30min;

[0070] S10, the product obtained in step S9 is placed in a tube furnace and sintered in air to pyrolyze the soldering points, the sintering condition is that the temperature is raised from room temperature to 800℃ at a rate of 2℃ / min, and then the temperature is lowered from 800℃ to room temperature at a rate of 3℃ / min after 1h of heat preservation.

[0071] Reference Figure 7 and 8 The embodiment of the present application proposes a cylindrical surface precursor ceramic thin film temperature sensor prepared by the above-mentioned preparation method of the cylindrical surface precursor ceramic thin film temperature sensor, which comprises a cylindrical surface substrate 1, a ceramic thin film sensitive grid 2, a soldering point, a lead wire and a fixing member, the ceramic thin film sensitive grid 2 and the soldering point are conformally laid on the cylindrical surface substrate 1 by the Weissberg direct writing forming technology and are prepared by pyrolysis and ceramicization, the soldering point is arranged on the ceramic thin film sensitive grid 2, the lead wire is connected with the soldering point, and the fixing member is covered on the soldering point.

[0072] In a specific embodiment, the cylindrical surface substrate 1 is a cylindrical part which can withstand a temperature of more than 800℃ and is high-temperature insulation, and the machining origin 1a is arranged on the highest generatrix of the cylindrical surface substrate 1 during direct writing. The raw material components for direct writing of the ceramic thin film sensitive grid 2 and the soldering point include 50wt%-60wt% TiB2 powder and 40wt%-50wt% SiCN precursor ceramic solution. The ceramic thin film sensitive grid 2 is comb-shaped after direct writing, and the thickness is 5μm-30μm.

[0073] In specific embodiments, the fixing member is provided with a slot on the side close to the welding point, the lead wire is in interference fit with the slot and is led out of the slot. Specifically, the welding points include a first welding point 3 and a second welding point 4, the fixing member includes a first fixing member 5 and a second fixing member 6, the first fixing member 5 is provided with a first slot 5a, the second fixing member 6 is provided with a second slot 6a, the lead wire includes a first lead wire 7 and a second lead wire 8, the first lead wire 7 and the second lead wire 8 are in interference fit with the first slot 5a and the second slot 6a respectively, one end of the first welding point 3 and the second welding point 4 is respectively fixedly connected with the ceramic thin film sensitive grid 2, the other end is respectively fixedly connected with the first fixing member 5 and the second fixing member 6, and the first lead wire 7 and the second lead wire 8 are respectively in contact with the first welding point 3 and the second welding point 4. The lead wire is made of conductive platinum wire. As an optimization, the first lead wire 7 and the second lead wire 8 have equal diameters of 0.2-0.5 mm.

[0074] Based on the above-mentioned preparation method of the cylindrical precursor ceramic thin film temperature sensor, a thin film temperature sensor is prepared on the alumina-based cylindrical substrate 1. As shown in Figure 9 (a) and (b), the surface morphology of the prepared sensitive thin film is shown. The thin film has a continuous, uniform and dense structure, which ensures that the ceramic thin film sensitive grid 2 has excellent electrical conductivity. As shown in Figure 9 (c), through cross-section analysis, it can be seen that the ceramic thin film sensitive grid 2 closely adheres to the cylindrical substrate 1 without obvious gaps. Through EDS analysis, Ti element in the ceramic thin film sensitive grid 2 and Al element in the alumina-based cylindrical substrate 1 are analyzed, and the ceramic thin film sensitive grid 2 is conformally laid along the cylindrical surface in a crescent shape, as shown in Figure 9 (d).

[0075] In order to further characterize the temperature measurement performance of the cylindrical thin film temperature sensor, a temperature measurement platform is built, which includes a tube furnace, a K-type thermocouple, a data acquisition device and a computer. The alumina cylindrical thin film temperature sensor is placed in the high-temperature furnace, the resistance of the thin film temperature sensor and the temperature value of the K-type thermocouple are collected by the data acquisition card, and then transmitted to the computer for post-processing.

[0076] Based on the above-mentioned preparation method of the cylindrical precursor ceramic thin film temperature sensor, a thin film temperature sensor is prepared on the cylindrical surface, as shown in Figure 11 (a). It is placed in the temperature test platform for testing, as shown in Figure 11 (b). The results show that in the six cycles (room temperature to 800℃) test, the resistance of the cylindrical thin film temperature sensor shows a negative correlation with the temperature, and the repeatability is good in the six tests. In order to further test its high-temperature stability, high-temperature steady-state and dynamic tests are carried out respectively. As shown in Figure 11 (c), at 400℃, 600℃ and 800℃, the resistance change rates are 0.5%, 0.7% and 0.4% respectively. As shown in Figure 11(d), the cylindrical film temperature sensor was subjected to five dynamic cycle tests at 610 °C to 785 °C, and the maximum resistance change rates at 610 °C and 785 °C were 5.95% and 2.75%, respectively. Reference Figure 11 (e), the SHHE equation can describe the nonlinear characteristics of resistance change with temperature, and the fitting curve is shown in equation (1). Reference Figure 11 (f), the film temperature sensor temperature value was calculated by fitting the curve and compared with the standard thermocouple test value, the change trend of the cylindrical film thermocouple was consistent with that of the standard thermocouple, the maximum temperature change rate was less than 5%, and the change rate decreased to 0.5% as the test number increased.

[0077] (1)

[0078] In the formula, R is the resistance of the cylindrical film temperature sensor at temperature T.

[0079] Bearing is the core component of rotary support unit, known as the "heart" of rotary support system, and is widely used in aerospace, high-speed rail and automobile hub, large rotor and precision machine tool and other fields. Main shaft bearing is a supporting part of rotary main shaft of high-end equipment such as aircraft engine, which is easy to fail in complex and harsh working conditions such as ultra-high temperature and high-low temperature alternation. Therefore, in-situ temperature online real-time detection is helpful to ensure its operation reliability. Based on the above preparation method of cylindrical precursor ceramic film temperature sensor, a curved film temperature sensor was prepared on the bearing outer ring with a temperature resistance of 1200 °C, as shown in Figure 12 (a). To further verify its high temperature stability and repeatability, five dynamic temperature cycle tests were carried out in different temperature ranges (395 °C-415 °C, 602 °C-622 °C, 792 °C-812 °C), and the results are shown in Figure 12 (b). The temperature sensor and thermocouple temperature curve trend are consistent, and the resistance change rates are 1.6%, 0.7% and 3.8% respectively, and the repeatability is good.

[0080] Bolt is a fastener for many parts, which is easy to produce creep deformation failure at high temperature, so its healthy state at high temperature is the guarantee of the reliability of high-temperature equipment. Based on the above preparation process, a film temperature sensor was prepared on an alumina bolt as shown in Figure 12 (c). The high temperature heating state was simulated by flame loading, and the temperature was heated from room temperature to 285 °C, 595 °C and 705 °C respectively. As shown in Figure 12 (d), the temperature resistance curve trend of the film temperature sensor is consistent with that of the commercial thermocouple. The response times of the thermocouple and the film temperature sensor from room temperature to 285 °C, 595 °C and 705 °C are 3.342 s / 1.269 s, 3.938 s / 2.022 s and 4.811 s / 2.037 s respectively.

[0081] In-situ integrated thin film temperature sensor on high-end parts with complex topography curvature distribution can effectively monitor its health status and help to promote the development of intelligent high-end equipment. The precursor ceramic solution doped with nano conductive particles is selected to prepare direct writing raw materials, combined with the preparation device and method of cylindrical precursor ceramic thin film temperature sensor. Based on the preparation method, different curvature and different patterned direct writing are realized to verify the feasibility of the process. The in-situ prepared thin film temperature sensor on the alumina cylinder is tested at high temperature, and the results show that the repeatability is good in six cycles, the resistance change rate is less than 1% at 400℃, 600℃ and 800℃ for 20 minutes, and the resistance change rate is less than 6% in five dynamic cycles from 610℃ to 785℃. The temperature curve of the thin film temperature sensor is obtained by fitting the temperature-resistance characteristics, and the temperature change rate of the standard thermocouple is less than 0.5% after multiple tests. To further verify the practicability of the thin film temperature sensor, bearings, bolts and other different surfaces are selected to prepare thin film sensors for testing. The results show that the resistance change rate of the bearing thin film temperature sensor is less than 4% under different temperature cycle tests, and the resistance change trend of the bolt thin film temperature sensor is consistent with that of the standard thermocouple under different flame temperature tests, and the response time is less than that of the standard thermocouple.

[0082] Reference Figure 10 、 Figure 13 and Figure 14 The three curves respectively represent the performance of the thin film temperature sensor in different application scenarios, namely the alumina cylindrical surface, the bearing surface and the bolt surface, proving that the precursor ceramic material can be well applied on the cylindrical surface as a temperature sensor under the process.

[0083] The above describes the specific embodiments of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

[0084] In the description of the application, it needs to be understood that the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application. The word 'comprising' does not exclude the existence of elements or steps not listed in the claims. The word 'a' or 'an' in front of an element does not exclude the existence of multiple such elements. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that the combination of these measures cannot be used to improve. Any reference signs in the claims should not be interpreted as limiting the scope.

Claims

1. An apparatus for fabricating a cylindrical precursor ceramic thin film temperature sensor, characterized in that, Includes a base, worktable, Y-axis sealing linear module, X-axis sealing linear module, Z-axis sealing linear module, electric rotary table, Wesenberg direct writing module, motion controller, and V-clamp. The workbench is fixed above the machine base. The Y-axis sealing linear module is provided on both sides above the machine base. The Y-axis sealing linear module includes a Y-axis motor, a Y-axis slide rail and a Y-axis slider. The Y-axis slider is provided on the Y-axis slide rail and the Y-axis motor is used to drive the Y-axis slider to slide along the Y-axis slide rail. The X-axis sealing linear module includes an X-axis motor, an X-axis slide rail, and an X-axis slider. The two ends of the X-axis slide rail are fixed on the Y-axis slider, and the X-axis slider is disposed on the X-axis slide rail. The X-axis motor is used to drive the X-axis slider to slide along the X-axis slide rail. The Z-axis sealing linear module includes a Z-axis motor, a Z-axis slide rail, and a Z-axis slider. The Z-axis slide rail is fixed on the X-axis slider, and the Z-axis slider is disposed on the Z-axis slide rail. The Z-axis motor is used to drive the Z-axis slider to slide along the Z-axis slide rail. The X-axis slide rail, Y-axis slide rail, and Z-axis slide rail are perpendicular to each other. The electric rotary table is fixed on the Z-axis slider, and the Wesenberg direct writing module is fixed on the electric rotary table. When the electric rotary table rotates, it drives the Wesenberg direct writing module to swing. The V-shaped clamp is mounted on the worktable and is used to clamp and fix the cylindrical base. The X-axis motor, Y-axis motor, Z-axis motor, and electric rotary table are electrically connected to the motion controller. The controller is used to read the four-axis G-code and control the movement of the X-axis motor, Y-axis motor, Z-axis motor, and electric rotary table, so that the Weissenberg direct writing module performs curved surface co-line direct writing of ceramic thin film sensitive gates and solder joints on the cylindrical substrate. During the curved surface co-line direct writing process, the raw material ejection direction of the Weissenberg direct writing module coincides with the normal direction of the curved surface.

2. The apparatus for fabricating a cylindrical precursor ceramic thin film temperature sensor according to claim 1, characterized in that, The V-shaped clamp includes a V-shaped seat, a pressure block, a guide rod, and a clamping screw. One end of the guide rod is fixed to the V-shaped seat, the pressure block is sleeved with the guide rod, and the pressure block is fixed to the guide rod by the clamping screw.

3. The apparatus for fabricating a cylindrical precursor ceramic thin film temperature sensor according to claim 1, characterized in that, The Wesenberg direct writing module includes a connecting assembly, a rotary motor, a coupling, a microneedle, a liquid reservoir, an anti-loosening washer, a liquid reservoir cover, a dispensing needle, and a DC power supply. The connecting assembly includes a connecting plate, a motor fixing plate, a liquid reservoir fixing plate, a first set screw, and a second set screw. The connecting plate is fixed on the electric rotary table, the motor fixing plate is installed on the upper side of the connecting plate, the liquid storage chamber fixing plate is installed on the lower side of the connecting plate, the rotary motor is installed on the motor fixing plate and is used to drive the microneedle to rotate. One end of the coupling is sleeved with the output shaft of the rotary motor, and the other end is sleeved with the microneedle. It is fixedly connected to the output shaft of the rotary motor and the microneedle by the first set screw and the second set screw, respectively. The upper end of the liquid storage chamber is fitted with the anti-loosening washer and then threadedly connected to the liquid storage chamber fixing plate. The liquid storage chamber is used to store the raw materials for direct writing ceramic thin film sensitive grids and solder joints. The center of the liquid storage chamber cover has a through hole to accommodate the microneedle to pass through. The liquid storage chamber cover passes through the microneedle and is threadedly connected to the liquid storage chamber. The dispensing needle is fixed at the lower end of the liquid storage chamber. The microneedle is inserted in the dispensing needle. The DC power supply is electrically connected to the rotary motor and is used to control the rotation speed of the rotary motor so that the raw materials for direct writing ceramic thin film sensitive grids and solder joints flow out stably along the microneedle in the dispensing needle.

4. The apparatus for fabricating a cylindrical precursor ceramic thin film temperature sensor according to claim 3, characterized in that, The microneedle is flush with or extends 0-200 μm into the liquid outlet port of the dispensing needle.

5. A method for fabricating a cylindrical precursor ceramic thin film temperature sensor, characterized in that, The apparatus for fabricating a cylindrical precursor ceramic thin film temperature sensor according to any one of claims 1-4 includes the following steps: S1, align the electric rotary table with the V-shaped seat of the V-shaped holder so that the dispensing needle of the Wesenberg direct writing module is perpendicular to the worktable and the two sides of the V-shaped seat are parallel to the Y-axis slide rail; S2, use acetone, alcohol and deionized water to ultrasonically clean the cylindrical substrate in sequence. After cleaning, place the cylindrical substrate on the V-shaped seat, use the pressure block of the V-shaped clamp to press the cylindrical substrate and fix it with the clamping screw, so that the cylindrical substrate is parallel to the two sides and the bottom of the V-shaped seat respectively. S3, 50wt%-60wt% TiB2 powder is added to 40wt%-50wt% SiCN precursor ceramic solution to form the raw material for direct writing ceramic thin film sensitive gate and solder joint. After magnetic stirring at room temperature for 1 hour, it is injected into the liquid storage chamber of the Wesenberg direct writing module. S4, move the dispensing needle's outlet port to the processing origin, set the processing origin as the machine tool coordinate system origin, and after the machine tool coordinate system origin is reset, it coincides with the workpiece coordinate system on which the four-axis G-code is generated; S5, load the four-axis G code into the motion controller, turn on the DC power supply of the Wesenberg direct writing module and give a suitable voltage, so that the raw materials of the direct writing ceramic thin film sensitive gate and solder joint are stably delivered and the four-axis G code is executed to conformally write the ceramic thin film sensitive gate on the cylindrical substrate surface. S6, pre-curing the ceramic thin-film sensing gate in air; S7. The pre-cured ceramic thin film sensitive grid is placed in a tube furnace and sintered in an air atmosphere to pyrolyze the ceramic thin film sensitive grid. S8, Apply an appropriate amount of solder to the end of the ceramic thin film sensitive gate after pyrolysis, and fix the lead wires to the slots of the fixing component respectively; S9, the slotted side of the fastener is bonded to the weld point, and the weld point is pre-cured in air; S10, the product obtained in step S9 is placed in a tube furnace and sintered in an air atmosphere to pyrolyze the weld joint.

6. A cylindrical precursor ceramic thin film temperature sensor, fabricated using the method described in claim 5, characterized in that, The device includes a cylindrical substrate, a ceramic thin-film sensitive grid, solder joints, leads, and a fixing element. The ceramic thin-film sensitive grid and solder joints are conformally laid on the cylindrical substrate using Wesenberg direct-write molding technology and then pyrolytically ceramicized. The solder joints are disposed on the ceramic thin-film sensitive grid, the leads are connected to the solder joints, and the fixing element covers the solder joints.

7. The cylindrical precursor ceramic thin film temperature sensor according to claim 6, characterized in that, The cylindrical substrate is a cylindrical component that is heat-resistant to temperatures exceeding 800°C and is insulated at high temperatures. During direct writing, the machining origin is set on the highest generatrix of the cylindrical substrate.

8. The cylindrical precursor ceramic thin film temperature sensor according to claim 6, characterized in that, The ceramic thin-film sensing grid is comb-shaped and has a thickness of 5μm to 30μm.

9. The cylindrical precursor ceramic thin film temperature sensor according to claim 6, characterized in that, The fastener has a slot on the side near the weld point, the lead wire is interference-fitted with the slot and leads out from the slot.

10. The cylindrical precursor ceramic thin film temperature sensor according to claim 6, characterized in that, The raw material composition used for direct writing of the ceramic thin film sensitive gate and solder joints includes: 50wt%-60wt% TiB2 powder and 40wt%-50wt% SiCN precursor ceramic solution.

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