Lamination method

Abstract

The present application relates to a bonding method for bonding a first target part and a second target part. The bonding method includes obtaining the center of gravity line of the first target part and the alignment line of the second target part. The second target part is provided with a plurality of alignment holes that pass through the first surface and the second surface along the first direction, and each alignment hole has a first opening located on the first surface and a second opening located on the second surface, and the alignment line is determined based on the centers of all the second openings. The first target part is controlled to move to be bonded to the first surface based on the target position. The orthographic projection of the second opening on the reference surface is located within the orthographic projection of the first opening on the reference surface. The present application provides a plurality of alignment holes on the second target part to determine the alignment line of the second target part, thereby improving the bonding accuracy when bonding the first target part to the second target part, thereby alleviating the poor vibration caused by poor precision when the first target part drives the second target part to vibrate.

Description

Technical Field

[0001] The present application relates to the field of lamination technology, and in particular to a lamination method. Background Art

[0002] In some devices, such as pressure feedback devices or sensing devices, feedback is achieved through the use of vibrating elements. When a vibrating element vibrates under control, it causes resonance in other components that are in contact with it. However, due to the tolerances between components, the vibration frequency is affected, resulting in poor vibration. Summary of the Invention

[0003] Based on this, a bonding method is provided that can improve the bonding accuracy to improve the vibration problem caused by poor bonding position.

[0004] A bonding method is provided for bonding a first target part and a second target part, wherein the second target part has a first surface and a second surface disposed opposite to each other along a first direction, the first surface being used to bond the first target part, and a raised portion being provided on the second surface, wherein the axis of symmetry of the raised portion coincides with the axis of symmetry of the second target part; the bonding method comprises:

[0005] Obtaining a center of gravity line of the first target part and an alignment line of the second target part; the second target part is provided with a plurality of alignment holes extending through the first surface and the second surface along a first direction, each alignment hole having a first opening located on the first surface and a second opening located on the second surface, and the alignment line is determined based on the centers of all the second openings;

[0006] Controlling the movement of the first target component until the center of gravity line reaches the target position; the center of gravity line is at the target position, the orthographic projection of the center of gravity line on the reference surface and the orthographic projection of the alignment line on the reference surface have a preset relative position, and the center of gravity line and the alignment line are parallel to each other;

[0007] Based on the target position, the first target part is controlled to move along a first direction toward the first surface of the second target part until the first target part is attached to the first surface;

[0008] The orthographic projection of the second opening on the reference plane is located within the orthographic projection of the first opening on the reference plane, and the reference plane is a plane perpendicular to the first direction.

[0009] In one embodiment, before obtaining the center of gravity line of the first target part and the alignment line of the second target part, the method further includes:

[0010] Acquire image information of the first target part and image information of the second target part;

[0011] determining a center of gravity line of the first target part according to the image information of the first target part;

[0012] Acquiring position information of the plurality of alignment holes relative to the second target part according to the image information of the second target part;

[0013] An alignment line of the second target part is determined according to position information of the plurality of alignment holes.

[0014] In one embodiment, obtaining image information of the first target part and image information of the second target part specifically includes:

[0015] Acquire image information of the first target part and image information of the second target part by means of a spectroscope and a camera module;

[0016] The beam splitter is tilted and arranged between the first target part and the second target part to obtain the image beam of the first target part and the image beam of the second target part;

[0017] The camera module is configured to receive an image beam from the beam splitter and convert the image beam into image information of the first target part and image information of the second target part.

[0018] In one embodiment, the camera module includes a charge coupled device.

[0019] In one embodiment, the method further includes controlling the first target part to move in a first direction toward the first surface of the second target part based on the target position until the first target part is attached to the first surface.

[0020] Filling the alignment hole with colloid to make the second target part fit the third target part;

[0021] The third target part is located on a side of the second target part facing away from the first target part.

[0022] In one embodiment, the first target member is provided in plurality;

[0023] All of the first target parts and the second target parts are configured to form a stacked component;

[0024] The center of gravity of the stacked component coincides with the alignment line of the second target component.

[0025] In one embodiment, a radial dimension of an inner wall of the alignment hole gradually decreases from the first surface to the second surface along the first direction.

[0026] In one embodiment, the orthographic projection of the first opening on the reference plane and the orthographic projection of the second opening on the reference plane are concentric circles.

[0027] In one embodiment, the foot of the alignment line is located on the symmetry axis of the second target.

[0028] In one embodiment, the center of the second opening is located on the symmetry axis of the protrusion.

[0029] In one embodiment, the first target member is configured as an axisymmetric structure;

[0030] The foot of the perpendicular to the center of gravity line is located on the symmetry axis of the first target part.

[0031] The above-mentioned bonding method opens multiple alignment holes on the second target part, and the second target part determines the alignment line of the second target part with the help of all the alignment holes being located at the center of the second opening of the second surface, and then determines the bonding position of the first target part through the preset relative position between the center of gravity line of the first target part and the alignment line of the second target part, thereby improving the bonding accuracy when bonding the first target part to the second target part, thereby alleviating the poor vibration caused by poor precision when the first target part drives the second target part to vibrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic diagram of a first target component and a second target component according to an embodiment of the related art;

[0033] Figure 2 A schematic cross-sectional view of a stacked component according to an embodiment of the related art;

[0034] Figure 3 A schematic diagram of a process of a bonding method according to an embodiment of the related art;

[0035] Figure 4 A schematic diagram of a bonding method according to another embodiment of the related art;

[0036] Figure 5 This is a flow chart of a bonding method according to an embodiment of the present application;

[0037] Figure 6 This is a structural diagram of a second target component according to an embodiment of the present application;

[0038] Figure 7 is a schematic cross-sectional view of a stacked member according to an embodiment of the present application;

[0039] Figure 8 A schematic diagram of an orthographic projection of a first opening and a second opening according to an embodiment of the present application;

[0040] Figure 9 A schematic diagram of the symmetry axis of the second target element according to an embodiment of the present application;

[0041] Figure 10 A schematic diagram of an alignment hole according to an embodiment of the present application;

[0042] Figure 11 A schematic diagram of an alignment hole according to another embodiment of the present application;

[0043] Figure 12This is a flow chart of a bonding method according to another embodiment of the present application;

[0044] Figure 13 A schematic diagram of a bonding method according to an embodiment of the present application;

[0045] Figure 14 A schematic diagram of laminating a third target component according to an embodiment of the present application;

[0046] Figure 15 A cross-sectional view of an alignment hole according to an embodiment of the present application;

[0047] Figure 16 A box plot of measurement data of a bonding method according to an embodiment of the present application.

[0048] Brief description of component symbols: 10, 100: first target part 20, 200: second target part

[0049] 21, 220: First surface 22, 230: Second surface 22a, 232: Raised portion 30: CCD camera s, S: Stacked components a, b: Center line d, D: Preset relative position 221: First opening

[0050] 231: Second opening 221a, 231a: Orthographic projection

[0051] 300: Spectrometer 400: Camera module

[0052] 500: Third target part 600: Colloid

[0053] A: Center of gravity line B: Alignment line

[0054] P: midpoint L: axis of symmetry

[0055] R: reference surface t, T: actual distance DETAILED DESCRIPTION

[0056] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0057] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0058] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0059] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0060] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0061] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0062] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0063] To facilitate understanding of the technical solutions of the embodiments of the present application, before explaining the specific implementation methods of the embodiments of the present application, some technical terms in the technical field to which the embodiments of the present application belong are first briefly explained.

[0064] A CCD camera (Charge Coupled Device) is an image-generating device that converts light into electrical charge, stores and transfers that charge, and can also extract the stored charge to produce a voltage change. CCD cameras are widely used because of their small size, light weight, immunity to magnetic fields, and resistance to vibration and impact.

[0065] In order to facilitate understanding of the technical solution of the present application, before detailed description, the bonding method in the related art is first explained.

[0066] Figure 1 A schematic diagram showing a first target part 10 and a second target part 20 according to an embodiment of the related art is shown; Figure 2 FIG. 1 is a schematic cross-sectional view of a stacked member s according to an embodiment of the related art.

[0067] Combine Figure 1 and Figure 2 As shown, in embodiments of the related art, when attaching two first target parts 10 to a second target part 20, the first target parts 10 are typically attached symmetrically to the second target part 20, centered around the axis of symmetry of the second target part 20. After attachment, a predetermined relative position d is defined between the centerline b of the first target part 10 and the centerline b of the second target part 20. The first target part 10 can be controlled by an electric field to vibrate, thereby driving the second target part 20 to vibrate as well.

[0068] Figure 3 A process diagram of a bonding method according to an embodiment of the related art is shown.

[0069] See Figure 3, a bonding method exemplified in the related art is to use a CCD camera 30 to successively obtain the center line a of the first target part 10 and the center line b of the second target part 20. The second target part 20 has a first surface 21 and a second surface 22 arranged opposite to each other, and the first surface 21 faces the first target part 10. It can be understood that the first surface 21 is the bonding surface. The second surface 22 is at least partially raised toward the side away from the first surface 21 to form a raised portion 22a, and the symmetry axis of the raised portion 22a coincides with the symmetry axis of the second target part 20. In this way, by obtaining the symmetry axis of the raised portion 22a of smaller size, the accuracy of obtaining the center line b is improved to a certain extent, and the cost of a CCD camera 30 machine is also lower. However, the inventors found that since the CCD camera 30 needs to obtain the center line a of the first target part 10 and the center line b of the second target part 20 respectively, whether moving the CCD camera 30 or moving the first target part 10 or the second target part 20 will lead to an increase in error, and it is impossible to re-inspect after the bonding is completed.

[0070] The stacked component s, formed by the aforementioned bonding method, exhibited poor vibration frequency performance, leading to a series of problems for other products manufactured in downstream processes. The inventors investigated the cause and discovered that after bonding the first target component 10 to the symmetrical second target component 20, tolerances often affected the bonding accuracy of the first target component 10. This, in turn, led to a deviation between the center of gravity of the stacked component s and the center of gravity of the second target component 20, affecting the overall vibration frequency and swing amplitude of the stacked component s. As a result, the stacked component s was judged as defective due to its inability to maintain vibration balance.

[0071] Figure 4 A schematic diagram showing a process of a bonding method according to another embodiment of the related art is shown.

[0072] exist Figure 3 Based on the bonding method shown, the inventors made preliminary improvements. Figure 4 As shown, the inventors attempted to simultaneously capture the centerline a of the first target part 10 and the centerline b of the second target part 20 using two CCD cameras 30. One CCD camera 30 was located on the side of the first target part 10 facing away from the second target part 20, while the other CCD camera 30 was located on the side of the second target part 20 facing away from the first target part 10. Compared to the bonding method using a single CCD camera 30 in the aforementioned related embodiments, the bonding method using two CCD cameras 30 improves bonding accuracy and enables post-bonding re-inspection. However, the cost of the equipment required to use two CCD cameras 30 is relatively high.

[0073] Based on this, the inventor of this application conducted in-depth research and improved the structure of the second target part 20 so that the alignment relationship between the first target part 10 and the second target part 20 can be obtained more accurately before bonding, thereby improving the bonding accuracy between the first target part 10 and the second target part 20.

[0074] For ease of description, the drawings only show structures related to the embodiments of the present application.

[0075] Figure 5 A flow chart showing a bonding method according to an embodiment of the present application is shown; Figure 6 shows a structural diagram of a second target component 200 according to an embodiment of the present application; Figure 7 1 shows a cross-sectional schematic diagram of a stacked member S according to an embodiment of the present application; Figure 8 A schematic diagram showing orthographic projections of the first opening 221 and the second opening 231 according to an embodiment of the present application is shown; Figure 9 FIG. 1 is a schematic diagram showing the symmetry axis L of the second target element 200 according to an embodiment of the present application.

[0076] See Figure 5 , and combined with Figures 6 to 9 , an embodiment of the present application provides a bonding method for bonding a first target part 100 and a second target part 200, wherein the second target part 200 has a first direction (i.e. Figure 5 The first surface 220 and the second surface 230 are disposed opposite to each other (in the x-axis direction shown in FIG), the first surface 220 is used to fit the first target part 100, and the second surface 230 is provided with a protrusion 232. The symmetry axis of the protrusion 232 coincides with the symmetry axis L of the second target part 200. The method includes:

[0077] S110, obtaining a center of gravity line A of the first target part 100 and an alignment line B of the second target part 200; the second target part 200 is provided with a plurality of alignment holes 210 extending along a first direction through the first surface 220 and the second surface 230, each alignment hole 210 having a first opening 221 located on the first surface 220 and a second opening 231 located on the second surface 230, and the alignment line B is determined based on the centers P of all the second openings 231;

[0078] S120, controlling the first target component 100 to move until the center of gravity line A reaches the target position; the center of gravity line A is at the target position, the orthographic projection of the center of gravity line A on the reference plane R and the orthographic projection of the alignment line B on the reference plane R have a preset relative position D, and the center of gravity line A and the alignment line B are parallel to each other;

[0079] S130. Based on the target position, control the first target part 100 to move along the first direction close to the first surface 220 of the second target part 200 until the first target part 100 is attached to the first surface 220; wherein, the orthographic projection 231a of the second opening 231 on the reference plane R is located within the orthographic projection 221a of the first opening 221 on the reference plane R, and the reference plane R is a plane perpendicular to the first direction.

[0080] It should be noted that, see Figure 7 In the embodiment of the present application, the first target part 100 can be controlled by an electric field to generate vibration. In combination with some of the aforementioned embodiments, when applied to, for example, some tactile feedback and perception devices, the first target part 100 can be used to drive other components to achieve vibration. Among them, the first target part 100 can be, for example, a piezoelectric ceramic block, and the second target part 200 can be, for example, a metal plate. Of course, the first target part 100 and the second target part 200 in the present application are not limited to the above-mentioned materials and structures, nor are they limited to applications in tactile feedback and perception devices. In fact, as long as the first target part 100 and the second target part 200 need to be aligned and bonded in the scenario, the bonding method provided in the present application can be used, and there is no limitation here.

[0081] It should also be noted that, according to the analysis of the aforementioned related art embodiments, during the vibration process, if the first target part 100 is not properly positioned on the second target part 200, the center of gravity may shift, thereby causing adverse effects such as increased swing amplitude and changes in resonant frequency during the vibration process. Therefore, improving the accuracy of the bonding process is to improve the consistency of the center of gravity before and after bonding.

[0082] like Figure 9 As shown, the second target part 200 is constructed as an axisymmetric structure, which makes it easier to obtain the alignment line B. Specifically, the foot of the alignment line B is located on the symmetry axis L of the second target part 200, that is, the alignment line B is perpendicular to and intersects the symmetry axis L of the second target part 200. On the basis that the second target part 200 is an axisymmetric structure, the alignment line B is on the symmetry axis L, which can improve the accuracy of the alignment line B. Figure 7 As shown, the second surface 230 is raised toward a side away from the first surface 220 to form a raised portion 232. Since the symmetry axis of the raised portion 232 coincides with the symmetry axis L of the second target part 200, the symmetry axis L of the second target part 200 can be obtained by obtaining the symmetry axis of the raised portion 232, thereby making it easier to obtain the alignment line B.

[0083] like Figure 5 As shown, combined with Figure 7In step S110, the center of gravity refers to the point in the gravitational field through which the resultant force of the gravity of all the fulcrums passes when the object is in any orientation. The center of gravity line A refers to a vertical line drawn through the center of gravity of the first target part 100.

[0084] In this application, the first target part 100 is constructed as an axisymmetric structure, with the foot of the center of gravity line A located on the axis of symmetry of the first target part 100. It is understood that the center of gravity of a regular and uniformly dense object is its geometric center. Of course, in other embodiments, the center of gravity line A of the first target part 100 with an irregular outer shape can be obtained using other methods, which are not limiting here.

[0085] Figure 10 A schematic diagram of an alignment hole 210 according to an embodiment of the present application is shown; Figure 11 A schematic diagram of an alignment hole 210 according to another embodiment of the present application is shown.

[0086] like Figure 10 and Figure 11 As shown, the alignment line B is determined based on the centers P of all second openings 231, that is, the centers P of two adjacent second openings 231 are connected in sequence until all alignment holes 210 are traversed, and then the position of the alignment line B is determined by all the connecting lines. Figure 10 In the illustrated embodiment, when the alignment holes 210 are set to two, the centers P of the second openings 231 of the two alignment holes 210 are connected to form a straight line, and the alignment line B is perpendicular to the midpoint of the straight line. When the alignment holes 210 are set to three or more, the line connecting the centers P of all the second openings 231 forms a regular closed shape. The regular closed shape includes a centrally symmetrical figure, which includes, for example, an ellipse, a rhombus, a rectangle, a regular even-numbered polygon (a regular polygon with an even number of sides), a parallelogram, or an irregular shape. For another example, the irregular shape is a shape composed of a rectangle and an ellipse. The regular closed shape can also be a trapezoid, a regular odd-numbered polygon (a regular polygon with an even number of sides), etc., which is not specifically limited in the embodiments of the present disclosure. Figure 11 In the illustrated embodiment, when there are four alignment holes 210, the centers P of the second openings 231 of the four alignment holes 210 are sequentially connected to form a rectangle, with the alignment line B perpendicular to the midpoint of the rectangle. Alternatively, when there are three alignment holes 210, the centers P of the second openings 231 of the three alignment holes 210 are sequentially connected to form a triangle, with the alignment line B perpendicular to the midpoint of the triangle. Of course, when there are more than three alignment holes 210, all alignment holes 210 can be arranged in a row, that is, the centers P of all second openings 231 are sequentially connected to form a straight line.

[0087] Please refer again Figure 7In step S120, the preset relative position D refers to the pre-set distance between the center of gravity line A and the alignment line B. Before the first target component 100 is bonded, the preset relative position D can be used to determine the position of the first target component 100 to be bonded. Furthermore, the parallelism between the center of gravity line A and the alignment line B prevents the bonding effect from being affected by an angle between the bonding surfaces of the first target component 100 and the second target component 200.

[0088] In step S130, based on the target position, that is, while controlling the first target part 100 to approach the second target part 200, the predetermined relative position D is maintained between the center of gravity line A of the first target part 100 and the alignment line B of the second target part 200. This ensures that the predetermined relative position D is maintained even after the first target part 100 is attached to the second target part 200, thereby improving the attachment accuracy. Furthermore, the orthographic projection 231a of the second opening 231 is located within the orthographic projection 221a of the first opening 221, making it easier to grasp the edge contour of the second opening 231.

[0089] Specifically, if Figure 8 As shown, the orthographic projection 221a of the first opening 221 on the reference plane R and the orthographic projection 231a of the second opening 231 on the reference plane R are concentric circles. In this way, the first opening 221 and the second opening 231 are concentric, which can further improve the bonding accuracy and facilitate re-inspection with the help of the first opening 221 after the bonding is completed.

[0090] The bonding method provided in the embodiment of the present application is to open a plurality of alignment holes 210 on the second target part 200. The second target part 200 determines the alignment line B of the second target part 200 by virtue of all the alignment holes 210 being located at the center P of the second opening 231 of the second surface 230. The bonding position of the first target part 100 is then determined by the preset relative position D between the center of gravity line A of the first target part 100 and the alignment line B of the second target part 200. This improves the bonding accuracy when the first target part 100 is bonded to the second target part 200, thereby alleviating poor vibration caused by poor precision when the first target part 100 drives the second target part 200 to vibrate.

[0091] Figure 12 A flow chart of a bonding method according to another embodiment of the present application is shown.

[0092] See Figure 12 In another embodiment of the present application, a bonding method is further provided, comprising:

[0093] S210, acquiring image information of the first target part 100 and image information of the second target part 200;

[0094] S220, determining a center of gravity line A of the first target part 100 according to the image information of the first target part 100;

[0095] S230, acquiring position information of the plurality of alignment holes 210 relative to the second target part 200 according to the image information of the second target part 200;

[0096] S240 , determining an alignment line B of the second target component 200 according to position information of the plurality of alignment holes 210 ;

[0097] S250, obtaining the center of gravity line A of the first target part 100 and the alignment line B of the second target part 200; the second target part 200 is provided with a plurality of alignment holes 210 extending through the first surface 220 and the second surface 230 along a first direction, each alignment hole 210 having a first opening 221 located on the first surface 220 and a second opening 231 located on the second surface 230, and the alignment line B is determined based on the centers P of all the second openings 231;

[0098] S260, controlling the first target component 100 to move until the center of gravity line A reaches the target position; the center of gravity line A is at the target position, the orthographic projection of the center of gravity line A on the reference plane R and the orthographic projection of the alignment line B on the reference plane R have a preset relative position D, and the center of gravity line A and the alignment line B are parallel to each other;

[0099] S270. Based on the target position, control the first target part 100 to move along the first direction close to the first surface 220 of the second target part 200 until the first target part 100 is attached to the first surface 220; wherein, the orthographic projection 231a of the second opening 231 on the reference plane R is located within the orthographic projection 221a of the first opening 221 on the reference plane R, and the reference plane R is a plane perpendicular to the first direction.

[0100] For step S250, step S260 and step S270, please refer to the contents in some of the aforementioned embodiments for details, which will not be repeated here. It should be noted that step S210, step S220, step S230 and step S240 are not in a preset order. In the embodiment of the present application, they can be completed simultaneously, that is, the image information of the first target part 100 and the second target part 200 are obtained at the same time, and the center of gravity line A and the alignment line B are determined at the same time. In some other embodiments, the image information of the first target part 100 can be obtained first and its center of gravity line A can be determined, and then the image information of the second target part 200 can be obtained and its alignment line B can be determined. Alternatively, the image information of the second target part 200 can be obtained first and its alignment line B can be determined, and then the image information of the first target part 100 can be obtained and its center of gravity line A can be determined.

[0101] Figure 13 A schematic diagram of the process of a bonding method according to an embodiment of the present application is shown.

[0102] like Figure 13 As shown, in some embodiments, step S210 specifically includes acquiring image information of the first target part 100 and image information of the second target part 200 using a beam splitter 300 and a camera module 400. The beam splitter 300 is tilted and disposed between the first target part 100 and the second target part 200 to acquire an image beam of the first target part 100 and an image beam of the second target part 200. The camera module 400 is configured to receive the image beam from the beam splitter 300 and convert the image beam into image information of the first target part 100 and image information of the second target part 200. In this manner, the beam splitter 300 can simultaneously acquire the image beams of the first target part 100 and the second target part 200. Simultaneously, the camera module 400 receives the image beams and converts them into image information, thereby acquiring image information of the first target part 100 and the second target part 200 simultaneously, thereby improving accuracy and reducing costs. Exemplarily, the camera module 400 includes a charge-coupled device, or CCD camera.

[0103] Please continue reading Figure 13 , and combined with Figure 10 and Figure 11 In conjunction with some of the aforementioned embodiments, after acquiring the image information of the first target part 100 and the image information of the second target part 200, the contour shape of the first target part 100 and the figure formed by connecting the center P of the second opening 231 of the alignment hole 210 on the second target part 200 are acquired. Thus, the coordinates of the center of gravity line A of the first target part 100 and the alignment line B of the second target part 200 can be calculated, that is, the relative position between the first target part 100 and the second target part 200 before bonding is determined. Then, with the help of the preset relative position D, the target position of the first target part 100 bonded to the second target part 200 is determined. It should be noted that the shape and structure of the first target part 100 and the second target part 200, the method of acquiring the position information of the first target part 100 and the second target part 200, and the preset relative position D can all be designed according to actual needs and are not specifically limited in this embodiment of the present application.

[0104] Figure 14 A schematic diagram of bonding a third target component 500 according to an embodiment of the present application is shown.

[0105] See Figure 14 , and combined with Figure 12In some embodiments, after step S270, the step of filling the alignment hole 210 with a colloid 600 is further included to mate the second target part 200 with the third target part 500. The third target part 500 is located on the side of the second target part 200 facing away from the first target part 100. Thus, with the aid of the colloid 600, the second target part 200 and the third target part 500 can be bonded. For example, the third target part 500 can be a metal plate. Furthermore, the raised portion 232 can increase the volume of the colloid 600, thereby increasing the bonding force between the second target part 200 and the third target part 500.

[0106] Please refer again Figure 7 In some embodiments, a plurality of first target parts 100 are provided. All first target parts 100 and second target parts 200 are constructed to form a stacked component S, and the center of gravity line A of the stacked component S coincides with the alignment line B of the second target part 200. In this way, when it is necessary to attach a plurality of first target parts 100 to the second target part 200, the center of gravity line of the stacked component S after attachment can be made to coincide with the alignment line B of the second target part 200 through the aforementioned attachment method. Figure 7 , taking the example of bonding two first target parts 100 to the second target part 200, with the help of a pre-set relative position D, the two first target parts 100 are symmetrically bonded on both sides of the second target part 200 with the symmetry axis L of the second target part 200 as the center. On the basis of improving the bonding accuracy, the phenomenon of increased amplitude and changed frequency of the laminated component S during vibration after bonding is alleviated.

[0107] Figure 15 A cross-sectional view of an alignment hole 210 according to an embodiment of the present application is shown.

[0108] See Figure 14 and Figure 15 Through the alignment hole 210 that passes through the first surface 220 and the second surface 230, when the second target part 200 and the third target part 500 are bonded, the glue 600 is poured from the alignment hole 210, thereby increasing the bonding force between the second target part 200 and the third target part 500.

[0109] The inventors tried to set the radial dimension of the inner wall of the alignment hole 210 to be consistent from the first surface 220 to the second surface 230 (not shown in the figure), which can be understood as a straight-through hole. However, during the research process, the inventors found that when opening the alignment hole 210, the punching position was determined based on the protrusion 232 and the accuracy of the straight-through hole was detected, that is, the accuracy of the alignment hole 210 was actually based on the second opening 231. Specifically, the center P of the second opening 231 is located on the symmetry axis of the protrusion 232. In this way, compared with the surface of the entire second target part 200, the range that the protrusion 232 needs to grasp is smaller, thereby further improving the accuracy. However, during the bonding process, the only feature that can be grasped is the first opening 221 on the first surface 220. Based on the above analysis, the edges of the hole that can be grasped during the opening and actual bonding are the first opening 221 on the first surface 220 and the second opening 231 on the second surface 230, respectively. That is, the features that can be captured on both sides are different, and the more features that need to be captured, the greater the accuracy error.

[0110] Based on this, please continue to refer to Figure 14 and Figure 15 In some embodiments, the radial dimension of the inner wall of the alignment hole 210 is along the first direction (ie Figure 14 The x-axis direction shown in the figure gradually decreases from the first surface 220 to the second surface 230. As a result, the second opening 231 with a smaller size can be captured during the bonding process. As analyzed above, the second opening 231 is also the opening on the side where the protrusion 232 of the second target part 200 is located. As a result, the bonding accuracy can be further improved, and the error caused by the need to capture more features can be minimized. In addition, the radial dimension of the inner wall of the alignment hole 210 on the first surface 220 is larger, and the colloid 600 can be poured more easily. It also increases the volume of the colloid 600 in the alignment hole 210, thereby further improving the bonding reliability between the second target part 200 and the third target part 500.

[0111] Figure 16 A box plot of measurement data of a bonding method according to an embodiment of the present application is shown.

[0112] The following is a combination of the contents of some of the above embodiments and Figure 2 、 Figure 7 , the bonding method provided by the embodiment of the present application is further described. Taking the preset relative position of 1.725 mm as an example, bonding is performed using the bonding method in the related art, that is, bonding the first target part 10 to the second target part 20 without a positioning hole. Combined with the measurement data box diagram ( Figure 16) It can be seen that after the bonding, the center line a of the first target part 10 and the center line b of the second target part 20 are rechecked, and the actual distance T between the center line a and the center line b is 1.65 mm to 1.8 mm. It can be understood that the tolerance is 75 microns. The inventors also experimented with the bonding method of the second target part with a through hole, and measured that the tolerance is 50 microns. According to the bonding method in the embodiment provided in the present application, after bonding with the help of the alignment hole 210, the actual distance T between the center line A of the first target part 100 and the alignment line B of the second target part 200 is rechecked to be 1.7 mm to 1.75 mm. It can be understood that the tolerance is reduced to 25 microns. Combined with Figure 16 , it can be clearly seen that the bonding solution provided in this application can greatly improve the bonding accuracy.

[0113] Combine Figures 5 to 16 As shown, the bonding method provided by the embodiment of the present application is to open a plurality of alignment holes 210 on the second target part 200. The second target part 200 determines the alignment line B of the second target part 200 by virtue of all the alignment holes 210 being located at the center P of the second opening 231 of the second surface 230. Then, the bonding position of the first target part 100 is determined by the preset relative position D between the center of gravity line A of the first target part 100 and the alignment line B of the second target part 200. This improves the bonding accuracy when bonding the first target part 100 to the second target part 200, thereby alleviating the vibration caused by poor accuracy when the first target part 100 drives the second target part 200 to vibrate. Moreover, with the help of the spectroscope 300 and the camera module 400, it is possible to simultaneously obtain image information of the first target part 100 and the second target part 200. Furthermore, the radial dimension of the inner wall of the alignment hole 210 gradually decreases from the first surface 220 to the second surface 230, allowing the second opening 221, which has a smaller radial dimension, to be directly grasped when capturing features, thereby improving the accuracy of the alignment hole 210. When the colloid 600 is poured into the alignment hole 210 to achieve the bonding between the second target part 200 and the third target part 500, the alignment hole 210 can also be used to improve the bonding strength between the two.

[0114] It should be noted that some of the technical solutions described above can be implemented as independent embodiments in the actual implementation process, or they can be combined with each other and implemented as combined embodiments. Some of the technical solutions described above are exemplary solutions. How to combine them for implementation can be selected according to actual needs, and the embodiments of the present application are not specifically limited. In addition, when the contents of the above-mentioned embodiments of the present application are described, different embodiments are described in the corresponding order based on the idea of ​​convenient description, such as the order preset according to the requirements in the actual implementation process, rather than limiting the execution order between different embodiments. Accordingly, in the actual implementation process, if it is necessary to implement multiple embodiments provided by the embodiments of the present application, it is not necessarily necessary to follow the execution order provided when the embodiments are described in the present invention, but the execution order between different embodiments can be arranged according to demand.

[0115] It should be understood that although Figure 5 and Figure 12 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. In addition, Figure 5 and Figure 12 At least part of the steps may include multiple steps or multiple stages. These steps or stages are not necessarily performed at the same time, but can be performed at different times. The order of execution of these steps or stages is not necessarily one by one, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.

[0116] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0117] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A bonding method for bonding a first target part and a second target part, characterized in that: The second target part has a first surface and a second surface disposed opposite to each other along a first direction, the first surface being adapted to fit the first target part, and a protrusion being provided on the second surface, wherein the axis of symmetry of the protrusion coincides with the axis of symmetry of the second target part; The bonding method includes: Obtaining a center of gravity line of the first target part and an alignment line of the second target part; the second target part is provided with a plurality of alignment holes extending through the first surface and the second surface along the first direction, each of the alignment holes having a first opening located on the first surface and a second opening located on the second surface, and the alignment line is determined based on the centers of all the second openings; Controlling the first target component to move until the center of gravity line reaches a target position; the center of gravity line is at the target position, an orthographic projection of the center of gravity line on the reference surface and an orthographic projection of the alignment line on the reference surface have a preset relative position, and the center of gravity line and the alignment line are parallel to each other; Based on the target position, controlling the first target part to move along the first direction toward the first surface of the second target part until the first target part is attached to the first surface; The orthographic projection of the second opening on the reference plane is located within the orthographic projection of the first opening on the reference plane, and the reference plane is a plane perpendicular to the first direction; Furthermore, obtaining the center of gravity line of the first target part and the alignment line of the second target part includes: Acquiring image information of the first target part and image information of the second target part; determining a center of gravity line of the first target part according to the image information of the first target part; acquiring position information of the plurality of alignment holes relative to the second target part according to the image information of the second target part; The alignment line of the second target part is determined according to the position information of the plurality of alignment holes.

2. The laminating method according to claim 1, wherein: The acquiring of the image information of the first target part and the image information of the second target part specifically includes: Acquire image information of the first target part and image information of the second target part by means of a spectroscope and a camera module; The beam splitter is tilted and arranged between the first target part and the second target part to obtain the image beam of the first target part and the image beam of the second target part; The camera module is configured to receive the image beam from the beam splitter and convert the image beam into image information of the first target part and image information of the second target part.

3. The laminating method according to claim 2, wherein: The camera module includes a charge coupled device.

4. The laminating method according to claim 1, wherein: The method of controlling the first target part to move along the first direction toward the first surface of the second target part based on the target position until the first target part is attached to the first surface further includes the following steps: Filling the alignment hole with colloid to make the second target part fit the third target part; Wherein, the third target part is located on a side of the second target part facing away from the first target part.

5. The laminating method according to any one of claims 1 to 4, characterized in that: The first target part is provided in plurality; All of the first target parts and the second target parts are configured to form a stacked component; The center of gravity of the stacked component coincides with the alignment line of the second target component.

6. The laminating method according to claim 5, characterized in that: A radial dimension of an inner wall of the alignment hole gradually decreases from the first surface to the second surface along the first direction.

7. The laminating method according to claim 6, characterized in that: The orthographic projection of the first opening on the reference plane and the orthographic projection of the second opening on the reference plane are concentric circles.

8. The laminating method according to any one of claims 1 to 4, characterized in that: The foot of the alignment line is located on the symmetry axis of the second target part.

9. The laminating method according to any one of claims 1 to 4, characterized in that: The center of the second opening is located on the symmetry axis of the protrusion.

10. The laminating method according to any one of claims 1 to 4, characterized in that: The first target part is constructed as an axisymmetric structure; The foot of the perpendicular to the center of gravity is located on the symmetry axis of the first target part.

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