Methods and systems for discharging electronic components on a semiconductor package substrate

Abstract

This invention discloses a method and system for discharging electronic components on a semiconductor packaging substrate. The method includes: providing conductive protrusions on the surface of a wire bonding hot plate in an area corresponding to a first conductive connection pad; stacking the semiconductor packaging substrate on the surface of the wire bonding hot plate, such that the first surface of the semiconductor packaging substrate faces the surface of the wire bonding hot plate, and making the conductive protrusions electrically contact the first conductive connection pad; electrically connecting a wire bonding machine to a conductive pin, and making the conductive pin electrically contact the wire bonding area, thereby releasing the charge stored in the electronic component through the wire bonding machine and the wire bonding hot plate. This invention provides a method for discharging electronic components on a semiconductor packaging substrate, which can simultaneously discharge both ends of the electronic component, resulting in more complete discharge and ensuring that there is no charge inside the electronic component after discharge, with the potential at both ends of the electronic component synchronously returning to zero.

Description

Technical Field

[0001] This invention relates to a semiconductor packaging method, specifically to a method and system for discharging electronic components on a semiconductor packaging substrate, belonging to the field of semiconductor packaging technology. Background Technology

[0002] In the manufacturing process of integrated circuits, it is necessary to electrically connect the integrated circuit chip (IC) to the circuit board, that is, to complete the packaging of the IC chip in order for it to perform its function.

[0003] One commonly used packaging method is wire bonding. After the IC chip is bonded to the circuit board, thin metal wires are sequentially bonded to the IC chip and lead frame or pads using methods such as ultrasonic bonding, thermoforming, or thermo-ultrasonic bonding to form an electrical connection. Wire bonding technology has advantages such as simplicity and convenience.

[0004] To simplify the wire bonding process, one end of the wire is first bonded to a pad on the chip, and the other end is bonded to the corresponding bonding area on the substrate. However, before the wire bonding operation, the substrate may already have capacitors or other components. If one end of the wire is bonded to a pad on the chip and the other end to the corresponding bonding area on the substrate, a conductive loop will be formed between the capacitor and the chip. Due to the formation of this conductive loop, if the current generated by the capacitor discharge is too large, it may burn out the chip.

[0005] To address this issue, CN101346033A proposes a method for discharging electronic components on a substrate. This method involves sintering a metal wire passing through a ceramic soldering nozzle of a wire bonder into a metal ball, then moving the soldering nozzle to electrically connect the metal ball to the soldering area. This allows the charge stored in the electronic components to be conducted to the wire bonder via the metal ball and the soldering wire and released. Summary of the Invention

[0006] The main objective of this invention is to provide a method and system for discharging electronic components on a semiconductor packaging substrate, thereby overcoming the shortcomings of the prior art.

[0007] To achieve the aforementioned objectives, the technical solution adopted by this invention includes:

[0008] The present invention provides a method for discharging electronic components on a semiconductor packaging substrate, wherein a first conductive connection pad and a bonding wire area are respectively provided on a first side and a second side of the semiconductor packaging substrate, and the bonding wire area and the first conductive connection pad are electrically connected to the two poles of the electronic component, and the first side and the second side are opposite to each other.

[0009] Furthermore, the method includes:

[0010] A conductive protrusion is provided on the surface of the wire bonding hot plate in the area corresponding to the first conductive connection pad;

[0011] The semiconductor packaging substrate is stacked on the surface of the wire bonding hot plate, such that the first side of the semiconductor packaging substrate is opposite to the surface of the wire bonding hot plate, and the conductive protrusion is electrically contacted with the first conductive connection pad.

[0012] A wire bonding machine is electrically connected to a conductive pin, and the conductive pin is made into electrical contact with the wire bonding area, thereby releasing the charge stored in the electronic component through the wire bonding machine and the wire bonding hot plate.

[0013] In another aspect, the present invention provides a system for discharging electronic components on a semiconductor packaging substrate, wherein a first conductive connection pad and a bonding wire area are respectively provided on a first side and a second side of the semiconductor packaging substrate, and the bonding wire area and the first conductive connection pad are electrically connected to the two poles of the electronic component, and the first side and the second side are opposite to each other.

[0014] And, the system includes:

[0015] A wire bonding machine and a conductive contact pin, wherein the conductive contact pin is electrically connected to the wire bonding machine and is used to make electrical contact with the wire bonding area;

[0016] A wire bonding hot plate has conductive protrusions on its surface in the area corresponding to the first conductive connection pad. When the semiconductor packaging substrate is stacked on the surface of the wire bonding hot plate and the first surface of the semiconductor packaging substrate is opposite to the surface of the wire bonding hot plate, the conductive protrusions make electrical contact with the first conductive connection pad.

[0017] Compared with the prior art, the advantages of the present invention include:

[0018] 1) The present invention provides a method for discharging electronic components on a semiconductor packaging substrate, which can discharge the two ends of the electronic components simultaneously, so that the discharge of the electronic components is more complete, and can ensure that there is no charge in the electronic components after discharge, and the potential at both ends of the electronic components returns to zero synchronously.

[0019] 2) The present invention provides a method for discharging electronic components on a semiconductor packaging substrate. After discharging, there is no long waiting time, which avoids the electronic components from being recharged due to complex external environments. It also ensures that when the chip is interconnected with the corresponding electronic components, the reverse discharge of the electronic components will not cause potential damage to the chip.

[0020] 3) The system for discharging electronic components on a semiconductor packaging substrate provided by the present invention has good inheritance of manufacturing processes and equipment. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a system for discharging electronic components on a semiconductor packaging substrate, provided in a typical embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of a system for discharging electronic components on a semiconductor packaging substrate, provided in a typical embodiment of the present invention.

[0024] Figure 3 This is a schematic diagram of the structure of a system for discharging electronic components on a semiconductor packaging substrate and its interaction with a chip, provided in a typical embodiment of the present invention.

[0025] Figure 4 This is a schematic diagram of a system for discharging electronic components on a semiconductor packaging substrate, as provided in Comparative Example 1.

[0026] Figure 5 This is a schematic diagram of a system for discharging electronic components on a semiconductor packaging substrate, as provided in Comparative Example 1.

[0027] Figure 6 This is a schematic diagram of the structure in Comparative Example 1 where leakage current caused by discharge of electronic components leads to chip pin failure.

[0028] Figure 7 It is the location of heat accumulation formed inside the chip after burnout, which is captured by hotspot analysis of the chip damaged by discharge.

[0029] Figure 8 This is a schematic diagram showing the chip pin failure caused by leakage after the electronic components in Comparative Example 1 are discharged. Detailed Implementation

[0030] In view of the shortcomings of the prior art, the inventors of this invention, through long-term research and practice, have proposed the technical solution of this invention, which will be described in more detail below.

[0031] The present invention provides a method for discharging electronic components on a semiconductor packaging substrate, wherein a first conductive connection pad and a bonding wire area are respectively provided on a first side and a second side of the semiconductor packaging substrate, and the bonding wire area and the first conductive connection pad are electrically connected to the two poles of the electronic component, and the first side and the second side are opposite to each other.

[0032] Furthermore, the method includes:

[0033] A conductive protrusion is provided on the surface of the wire bonding hot plate in the area corresponding to the first conductive connection pad;

[0034] The semiconductor packaging substrate is stacked on the surface of the wire bonding hot plate, such that the first side of the semiconductor packaging substrate is opposite to the surface of the wire bonding hot plate, and the conductive protrusion is electrically contacted with the first conductive connection pad.

[0035] A wire bonding machine is electrically connected to a conductive pin, and the conductive pin is made into electrical contact with the wire bonding area, thereby releasing the charge stored in the electronic component through the wire bonding machine and the wire bonding hot plate.

[0036] Furthermore, the electronic component includes a capacitor.

[0037] Furthermore, the first side of the semiconductor packaging substrate is also provided with a second conductive connection pad, which electrically connects the electronic components and the bonding wire area respectively.

[0038] Furthermore, the two poles of the electronic component are grounded via a wire bonding machine and a wire bonding hot plate, respectively.

[0039] Furthermore, the height of the conductive protrusion is 15µm to 35µm.

[0040] Furthermore, the conductive protrusion may be one or more.

[0041] Furthermore, the conductive protrusion includes a boss integrally formed on the surface of the wire bonding hot plate.

[0042] Furthermore, the conductive contact pin includes a metal bonding wire that extends from the bonding nozzle of the wire bonding machine.

[0043] In another aspect, the present invention provides a system for discharging electronic components on a semiconductor packaging substrate, wherein a first conductive connection pad and a bonding wire area are respectively provided on a first side and a second side of the semiconductor packaging substrate, and the bonding wire area and the first conductive connection pad are electrically connected to the two poles of the electronic component, and the first side and the second side are opposite to each other.

[0044] And, the system includes:

[0045] A wire bonding machine and a conductive contact pin, wherein the conductive contact pin is electrically connected to the wire bonding machine and is used to make electrical contact with the wire bonding area;

[0046] A wire bonding hot plate has conductive protrusions on its surface in the area corresponding to the first conductive connection pad. When the semiconductor packaging substrate is stacked on the surface of the wire bonding hot plate and the first surface of the semiconductor packaging substrate is opposite to the surface of the wire bonding hot plate, the conductive protrusions make electrical contact with the first conductive connection pad.

[0047] Furthermore, the electronic component includes a capacitor.

[0048] Furthermore, the first side of the semiconductor packaging substrate is also provided with a second conductive connection pad, which electrically connects the electronic components and the bonding wire area respectively.

[0049] Furthermore, the two poles of the electronic component are grounded via a wire bonding machine and a wire bonding hot plate, respectively.

[0050] Furthermore, the height of the conductive protrusion is 15µm to 35µm.

[0051] Furthermore, the conductive protrusion may be one or more.

[0052] Furthermore, the conductive protrusion includes a boss integrally formed on the surface of the wire bonding hot plate.

[0053] Furthermore, the conductive contact pin includes a metal bonding wire that extends from the bonding nozzle of the wire bonding machine.

[0054] The technical solution of the present invention will be described in more detail below with reference to the accompanying drawings and specific implementation examples. Unless otherwise specified, the specific semiconductor packaging processes and packaging elements used in the embodiments of the present invention are known to those skilled in the art, and their specific process parameters and the specifications and models of the elements are not limited here.

[0055] Example 1

[0056] Please see Figure 1 A system for discharging electronic components on a semiconductor packaging substrate includes a semiconductor packaging substrate 100, a wire bonding hot plate 200, and a wire bonding machine. The electronic component 400 is disposed on and electrically connected to the semiconductor packaging substrate 100. The semiconductor packaging substrate 100 is disposed on and electrically connected to the wire bonding hot plate 200. The wire bonding machine is electrically connected to the semiconductor packaging substrate 100 via conductive pins 310.

[0057] In this embodiment, the semiconductor packaging substrate 100 has a first side and a second side disposed opposite to each other. The first side of the semiconductor packaging substrate 100 is provided with a first conductive connection pad 110, a second conductive connection pad 120 and a solder resist layer (i.e., green oil layer) 140. The first conductive connection pad 110 is disposed between the solder resist layers 140, and the thickness of the solder resist layer 140 is greater than the thickness of the first conductive connection pad 110. The second side of the semiconductor packaging substrate 100 is provided with a bonding wire area 130, and the bonding wire area 130 is electrically connected to the second conductive connection pad 120.

[0058] In this embodiment, the wire bonding hot plate 200 has a third surface, the semiconductor packaging substrate 100 is stacked on the third surface of the wire bonding hot plate 200, and the first surface of the semiconductor packaging substrate 100 faces the third surface of the wire bonding hot plate 200. The solder resist layer 140 is also connected to the third surface of the wire bonding hot plate 200. The first conductive connection pad 110 and the second conductive connection pad 120 have gaps with the third surface of the wire bonding hot plate 200 and are not connected to or in contact with the wire bonding hot plate 200.

[0059] In this embodiment, a conductive protrusion 210 is further provided on the third surface of the wire bonding hot plate 200 in the area corresponding to the first conductive connection pad 110, and the conductive protrusion 210 is in electrical contact with the first conductive connection pad 110.

[0060] In this embodiment, the height of the conductive protrusion 210 is 15um to 35um. Specifically, there are one or more conductive protrusions 210. For example, the conductive protrusion 210 includes a plurality of arc-shaped bosses, which are integrally formed on the third surface of the wire bonding hot plate 200.

[0061] In this embodiment, the electronic component 400 is disposed on the second side of the semiconductor packaging substrate 100, and the electronic component 400 is electrically connected to the wire bonding area 130 and the first conductive connection pad 110 respectively. Specifically, the two poles of the electronic component 400 are grounded through the wire bonding machine and the wire bonding hot plate 200 respectively. Specifically, the electronic component 400 includes a capacitor.

[0062] In this embodiment, the conductive contact 310 includes a metal bonding wire that extends from the welding nozzle of the wire bonding machine.

[0063] In this embodiment, please refer to Figure 2 and Figure 3The two poles of the electronic component 400 are grounded through the wire bonding machine and the wire bonding hot plate 200, respectively. Both sides of the electronic component 400 are simultaneously and synchronously discharged to the ground, reducing the potential to zero. This achieves synchronous and sufficient discharge at both ends of the electronic component, and there is no charge remaining inside the electronic component. Therefore, when the chip 300 is connected to the wire bonding area 130, there will be no problem of instantaneous discharge of residual charge inside the electronic component, which would damage the chip 300.

[0064] In this embodiment, the method for discharging electronic components on a semiconductor packaging substrate using the system may include:

[0065] Conductive protrusions 210 are provided on the third surface of the wire bonding hot plate 200 in the area corresponding to the first conductive connection pad 110;

[0066] The semiconductor packaging substrate 100 is stacked on the third surface of the wire bonding hot plate 200, so that the first surface of the semiconductor packaging substrate 100 is opposite to the third surface of the wire bonding hot plate 200, and the conductive protrusion 210 is electrically in contact with the first conductive connection pad 110.

[0067] A wire bonding machine is electrically connected to a conductive pin 310, and the conductive pin 310 is made to make electrical contact with the wire bonding area 130, thereby releasing the charge stored in the electronic component 400 through the wire bonding machine and the wire bonding hot plate 200.

[0068] Comparative Example 1

[0069] Please refer to the following: Figure 4 and Figure 5 The system and method for discharging electronic components on a semiconductor packaging substrate in Comparative Example 1 differ from that in Example 1 in that the third surface of the wire bonding hot plate 200 in Comparative Example 1 has no conductive protrusion 210, and the first surface of the semiconductor packaging substrate 100 and the third surface of the wire bonding hot plate 200 are raised by the solder resist layer 140, resulting in a gap between the first conductive connection pad 110 and the third surface of the wire bonding hot plate 200 and no contact with the wire bonding hot plate 200. As a result, one pole of the electronic component electrically connected to the first conductive connection pad is not connected to the device ground, while the other pole electrically connected to the second conductive connection pad is connected to the device ground, and the potential is zero.

[0070] Specifically, the potential on one side of the electronic component can be reduced to zero by manual discharge or ball discharge. When the grounding on the anti-electricity side is removed, the potential on the other side of the electronic component is non-zero. Under the effect of induced electricity, the electronic component side that has already reduced to zero potential quickly recovers the reverse potential, making the electronic component charged again. When the chip 300 is connected to the bonding area 130, the residual charge inside the electronic component is discharged instantaneously, causing damage to the chip 300.

[0071] Specifically, Figure 6 This is a schematic diagram of the structure in Comparative Example 1 where leakage current caused by the discharge of electronic components leads to chip pin failure. Figure 8 This is a schematic diagram showing the failure of chip pins caused by leakage after the electronic components in Comparative Example 1 are discharged. Figure 7 It is the location of heat accumulation formed inside the chip after burnout, which is captured by hotspot analysis of the chip damaged by discharge.

[0072] Discharge tests were performed on the capacitors on the semiconductor packaging substrate using the systems in Example 1 and Comparative Example 1, respectively. The test results are shown in Table 1.

[0073] Table 1. Test results of discharging electronic components on a semiconductor packaging substrate using the systems in Example 1 and Comparative Example 1.

[0074]

[0075] This invention provides a method for discharging electronic components on a semiconductor packaging substrate. This method allows for simultaneous discharge of both ends of the electronic component, resulting in a more complete discharge and ensuring that the component is free of charge after discharge, with the potential at both ends returning to zero simultaneously. Furthermore, it minimizes the waiting time after discharge, preventing the component from recharging due to complex external environments. It also prevents potential damage to the chip from reverse discharge during interconnection with the corresponding electronic component. Additionally, the system for discharging electronic components on a semiconductor packaging substrate provided by this invention offers excellent process and equipment compatibility.

[0076] It should be understood that the above embodiments are merely illustrative of the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A method for discharging an electronic component on a semiconductor packaging substrate, wherein a first conductive connection pad is provided on a first side of the semiconductor packaging substrate and a bonding wire area is provided on a second side, the bonding wire area and the first conductive connection pad are electrically connected to the two poles of the electronic component respectively, and the first side and the second side are opposite to each other; Its features are, The method includes: A conductive protrusion is provided on the surface of the wire bonding hot plate in the area corresponding to the first conductive connection pad; The semiconductor packaging substrate is stacked on the surface of the wire bonding hot plate, with the first surface of the semiconductor packaging substrate facing the surface of the wire bonding hot plate, and the conductive protrusions are electrically in contact with the first conductive connection pads. The electronic components are disposed on the second surface of the semiconductor packaging substrate, and the two poles of the electronic components are grounded through the wire bonding machine and the wire bonding hot plate, respectively. A wire bonding machine is electrically connected to a conductive pin, and the conductive pin is made into electrical contact with the wire bonding area, thereby releasing the charge stored in the electronic component through the wire bonding machine and the wire bonding hot plate.

2. The method according to claim 1, characterized in that: The electronic components include capacitors.

3. The method according to claim 1 or 2, characterized in that: The first side of the semiconductor packaging substrate is further provided with a second conductive connection pad, which is electrically connected to the bonding wire area.

4. The method according to claim 1, characterized in that: The height of the conductive protrusion is 15um to 35um.

5. The method according to claim 1, characterized in that: The conductive protrusion may be one or more.

6. The method according to claim 1 or 5, characterized in that: The conductive protrusion includes a boss integrally formed on the surface of the wire bonding hot plate.

7. The method according to claim 1, characterized in that: The conductive contact pin includes a metal bonding wire that extends from the welding nozzle of the wire bonding machine.

8. A system for discharging electronic components on a semiconductor packaging substrate, wherein a first conductive connection pad is provided on a first side of the semiconductor packaging substrate and a bonding wire area is provided on a second side, the bonding wire area and the first conductive connection pad are electrically connected to the two poles of the electronic component respectively, and the first side and the second side are opposite to each other; Its features are, The system includes: A wire bonding machine and a conductive contact pin, wherein the conductive contact pin is electrically connected to the wire bonding machine and is used to make electrical contact with the wire bonding area; A wire bonding hot plate has conductive protrusions on its surface in the area corresponding to the first conductive connection pad. The electronic component is disposed on the second side of the semiconductor packaging substrate. The two poles of the electronic component are grounded through a wire bonding machine and the wire bonding hot plate, respectively. When the semiconductor packaging substrate is stacked on the surface of the wire bonding hot plate and the first side of the semiconductor packaging substrate is opposite to the surface of the wire bonding hot plate, the conductive protrusions make electrical contact with the first conductive connection pad.

9. The system according to claim 8, characterized in that: The electronic components include capacitors.

10. The system according to claim 8 or 9, characterized in that: The first side of the semiconductor packaging substrate is further provided with a second conductive connection pad, which is electrically connected to the bonding wire area.

11. The system according to claim 8, characterized in that: The height of the conductive protrusion is 15um to 35um.

12. The system according to claim 11, characterized in that: The conductive protrusion may be one or more.

13. The system according to claim 8 or 11, characterized in that: The conductive protrusion includes a boss integrally formed on the surface of the wire bonding hot plate.

14. The system according to claim 8, characterized in that: The conductive contact pin includes a metal bonding wire that extends from the welding nozzle of the wire bonding machine.

Images