Chip dispensing apparatus, method and method for improving pick rate of chip automatic taping

Abstract

The application relates to a chip film turning device, a method and a method for improving the suction rate during automatic chip pasting, and the chip film turning device comprises a carrier plate, the carrier plate has a front surface and a back surface opposite to the front surface, the front surface is provided with a chip box placing groove, the shape of the chip box placing groove is matched with a chip box, and a hand-held taking and placing groove is arranged on the two sides of the chip box placing groove and communicated with the chip box placing groove; the back surface is provided with a circular film stretching boss, four cutting grooves are arranged on the film stretching boss, the four cutting grooves correspond to the four edges of the chip box respectively, and a gap is reserved between the two adjacent cutting grooves. In the application, the chip film turning device has simple structure, can turn the chips in the chip box to the bearing film as a whole, has low processing cost, high compatibility, and can improve the chip film turning success rate.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electronic packaging, and relates to a chip film turning device and method and a method for improving the suction rate of chip automatic mounting. BACKGROUND

[0002] The field of electronic packaging must involve the mounting of various chips. Some wafer or gel box packaged chips have the problems of difficult suction and easy damage on an automatic mounting machine due to the miniaturization, edge burr and back adhesion of the chips. The problems cannot be effectively solved by adjusting the suction parameters of the automatic mounting machine. The use of wafer film stretching equipment to form a film loaded chip has the problem of high production equipment cost caused by high wafer film stretching equipment cost. In addition, the position accuracy of the chip on the film is poor, which is not conducive to the identification and suction of the chip on the automatic mounting machine. SUMMARY

[0003] In view of the above problems of the prior art, the technical problems to be solved by the application are to provide a chip film turning device and method and a method for improving the suction rate of chip automatic mounting.

[0004] To achieve the above-mentioned purpose, the application provides the following technical scheme.

[0005] A chip film turning device comprises a carrier plate, the carrier plate has a front surface and a back surface opposite to the front surface, the front surface is provided with a chip box placing groove, the shape of the chip box placing groove is matched with that of a chip box, and a hand-held taking and placing groove is arranged on each side of the chip box placing groove.

[0006] Further, a primary and secondary wafer expanding ring is further included, the primary and secondary wafer expanding ring comprises a primary ring and a secondary ring sleeved on the primary ring, the film stretching boss is circular, and the inner diameter of the primary ring is matched with the outer diameter of the film stretching boss.

[0007] A chip film turning method is adopted, and the chip film turning method comprises the following steps.

[0008] S110, the adhesive surface of the first carrier film is tightly attached to the chips in the chip box, and the non-adhesive surface of the first carrier film with the chips is laid flat on the film stretching boss with the non-adhesive surface facing downward;

[0009] S120, the position of the first carrier film is adjusted so that all the chips are in the area surrounded by the four cutting grooves, and the primary ring of the primary and secondary wafer expanding ring is used to fasten the first carrier film on the film stretching boss;

[0010] S130, cutting through the first carrier film along the four cutting grooves;

[0011] S140, placing the second carrier film with the adhesive surface facing down on the first carrier film, and tightly attaching the second carrier film and the first carrier film;

[0012] S150, pressing the female ring of the mother-daughter expansion ring down on the second carrier film and sleeving it on the daughter ring, so that the second carrier film is tightly fixed between the female ring and the daughter ring of the mother-daughter expansion ring;

[0013] S160, removing the mother-daughter expansion ring from the film stretching boss, and turning over the mother-daughter expansion ring so that the first carrier film faces upward;

[0014] S170, peeling off the cut part of the first carrier film from the second carrier film to obtain a finished product of the chip reverse film.

[0015] Further, the chip box is a wafer box, and the S110 step includes the following sub-steps:

[0016] S111, placing the chip box with the opening facing upward in the chip box placing groove after opening the chip box with the front surface facing upward;

[0017] S112, placing the first carrier film with the adhesive surface facing down on the chip box, and rolling the first carrier film on the non-adhesive surface using an anti-static roller to tightly attach the adhesive surface of the first carrier film to the chip box and the chips in the chip box;

[0018] S113, removing the first carrier film and the chips and the chip box adhered to the first carrier film from the carrier plate, turning over the carrier plate so that the back surface faces upward, and placing the first carrier film with the non-adhesive surface facing down on the film stretching boss.

[0019] In the S140 step, the chip box is removed from the adhesive surface of the first carrier film before the adhesive surface of the second carrier film is placed on the first carrier film.

[0020] Further, the chip box is a vacuum gel box, and the S110 step includes the following sub-steps:

[0021] S116, placing the chip box with the front surface facing upward on the platform with a vacuum pump after opening the chip box, and aligning the vacuum extraction through hole at the bottom of the chip box with the air extraction port of the vacuum pump;

[0022] S117, placing the first carrier film with the adhesive surface facing down on the chip box, and rolling the first carrier film on the non-adhesive surface using an anti-static roller to tightly attach the adhesive surface of the first carrier film to the chip box and the chips in the chip box;

[0023] S118, a vacuum pump is used to apply a vacuum to the chip box, remove the first bearing film and adhere the chip in the chip box, and lay the non-adhesive side of the first bearing film on the film stretcher boss.

[0024] Further, a mark is formed on the first bearing film in a direction corresponding to the chip box cut angle.

[0025] Further, the first bearing film is a blue film.

[0026] Further, the first bearing film is a UV film, and before the cutting part of the first bearing film is peeled off from the second bearing film in the S170 step, the first bearing film is subjected to UV exposure to reduce the adhesion of the first bearing film.

[0027] Further, the first bearing film is a pyrolytic film, and before the cutting part of the first bearing film is peeled off from the second bearing film in the S170 step, the first bearing film is heated to reduce the adhesion of the first bearing film.

[0028] A method for improving the suction rate of automatic chip mounting, comprising the following steps:

[0029] S210, using a chip film inversion method to invert the chip from the chip box to the bearing film to form a chip film inversion product;

[0030] S220, placing the chip film inversion product instead of the chip box on the automatic chip mount, and using the device needle to lift the single chip of the chip film inversion product, and then sucking the chip.

[0031] In the present application, by using the carrier plate and the mother-daughter expansion crystal ring together, the chips in the chip box can be inverted to the bearing film as a whole, and the chip inversion device has simple structure and low processing cost, the inversion method is simple and convenient to operate, and has strong compatibility, which can improve the success rate of chip inversion, reduce the damage and waste in the chip inversion process; it can be used for inversion of multiple types of box-mounted chips, and the inversion product is suitable for widely used automatic chip mount in the industry; the position of the chip on the bearing film is accurate, and after multiple batches of chips are inverted, the chip array is located at the center position of the bearing film in the same direction, and the chip inversion product has clear identification in the same direction, which is conducive to the identification of the chip array by the automatic chip mount, and can be accurately identified and quickly sucked on the automatic chip mount, thereby improving the suction efficiency of the chip on the automatic chip mount, and reducing the material throwing rate and damage rate of the chip during suction; and the compatibility of the program. BRIEF DESCRIPTION OF DRAWINGS

[0032] The drawings described herein are used to provide further understanding of the present application, and form a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application, and do not constitute an improper limitation on the present application. In the drawings:

[0033] As Figure 1 And Figure 2 is a structural schematic diagram of a preferred embodiment of the chip film turning device of the present application.

[0034] Figure 3 is a flow chart of a preferred embodiment of the chip film turning method of the present application.

[0035] Figure 4 is a schematic diagram of rolling the first carrier film on the non-adhesive surface using the anti-static roller to make the adhesive surface of the first carrier film and the chips in the chip box closely adhere.

[0036] Figure 5 is Figure 4 is a sectional view of A-A direction in

[0037] Figure 6 is a schematic diagram of rolling the second carrier film on the non-adhesive surface using the anti-static roller to make the second carrier film and the first carrier film closely adhere.

[0038] Figure 7 is Figure 6 is a sectional view of B-B direction in

[0039] Figure 8 is a structural schematic diagram of the finished product of the chip film turning.

[0040] Figure 9 is a flow chart of a preferred embodiment of the method for improving the pick-up rate of the chip automatic taping of the present application.

[0041] The meanings of the respective reference numerals in the drawings are as follows:

[0042] carrier plate-1; chip box placing groove-2; hand-held taking and placing groove-3; film stretching boss-4; cutting groove-5; first carrier film-6; second carrier film-7; primary and secondary crystal expanding ring-8; chip box-9; film turning finished product-10; front surface-11; back surface-12; chamfer structure-21; gap-51; cutting area-52; mark-61; chip-91; anti-static roller-92. DETAILED DESCRIPTION

[0043] The embodiments of the present application will be described below through specific concrete examples, the illustrations provided in the following examples only illustrate the basic concept of the present application in a schematic manner, and the following examples and the features in the examples can be combined with each other without conflict.

[0044] As Figure 1 And Figure 2As shown, a preferred embodiment of the chip film inversion device of the present application comprises a carrier plate 1 and a primary-secondary wafer expanding ring 8 used in cooperation with the carrier plate 1; the carrier plate 1 has a front surface 11 and a back surface 12 opposite to the front surface 11, the front surface 11 is provided with a chip box placing groove 2, which can be arranged at the center of the front surface 11. The chip box placing groove 2 is shaped to match the chip box 9, which is generally square, and one corner of the chip box placing groove 2 is provided with a chamfer structure 21 matching the cut corner of the chip box 9, so as to position the direction of the chip box 9. The typical length and width of the chip box placing groove 2 are 51.2 mm, and the depth is 2 mm, and the width of the chamfer structure 21 is 1.2 mm, so that after the chip box 9 is placed in the chip box placing groove 2, the opening of the chip box 9 is slightly higher than the front surface 11, of course, the depth of the chip box placing groove 2 can also be greater than 2 mm, so that the opening of the chip box 9 is flush with the front surface 11. The two sides of the chip box placing groove 2 are respectively provided with a hand-held taking and placing groove 3 communicating therewith, the length and width of the taking and placing groove are smaller than those of the chip box placing groove 2, and the depth of the taking and placing groove is generally not less than that of the chip box placing groove 2, so as to take out or place the chip box 9 from the chip box placing groove 2.

[0045] The primary-secondary wafer expanding ring 8 comprises a primary ring and a secondary ring sleeved on the primary ring, and the back surface 12 is provided with a circular film stretching boss 4, which can be arranged at the center of the back surface 12. The outer diameter of the film stretching boss 4 matches the inner diameter of the primary ring of the primary-secondary wafer expanding ring 8. For example, when the primary-secondary wafer expanding ring 8 is a 6-inch wafer expanding ring, the diameter of the film stretching boss 4 is 139.5 mm, and the height can be 5.5 mm.

[0046] The film stretching boss 4 is provided with four cut grooves 5, the length of the cut groove 5 is 49.2 mm, the width is 0.5 mm, and the depth is 1 mm. The four cut grooves 5 correspond to the four edges of the chip box 9 respectively, so that a cutting area 52 is formed between the four cut grooves 5, which is generally located at the center of the film stretching boss 4. A gap 51 is left between the adjacent two cut grooves 5, so that the four cut grooves 5 are not communicated with each other, so as to avoid the cutting part from falling off when cutting the carrier film. The width of the gap is preferably 0.5 mm, so as to peel off the cutting part from the carrier film before forming the chip film inversion product 10.

[0047] The chip film inversion device of the present embodiment can invert the chips 91 in the chip box 9 to the carrier film as a whole by using the carrier plate 1 and the primary-secondary wafer expanding ring 8 in cooperation, and has the advantages of simple structure, low processing cost, strong compatibility, and high chip film inversion success rate.

[0048] As shown, a preferred embodiment of the chip film inversion method of the present application comprises the following steps: Figure 3 ​

[0049] S110, the adhesive surface of the first carrier film 6 and the chip 91 in the chip box 9 are closely attached, and the non-adhesive surface of the first carrier film 6 with the chip is laid flat on the film stretching boss 4. Wherein, the first carrier film 6 is preferably a blue film, of course, the first carrier film 6 can also be a UV film or a thermal decomposition film. The chip box 9 can be a wafer box or a vacuum gel box; when the chip box 9 is a wafer box, the present step can include the following sub-steps:

[0050] S111, the front surface 11 of the carrier plate 1 is upward, and the chip box 9 is placed in the chip box placing groove 2 with the opening upward after being opened; at this time, the upper end of the chip box 9 protrudes out of or is flush with the slot of the chip box placing groove 2. Because the chip box placing groove 2 has a chamfer structure 21, the direction of the chip box 9 can be positioned, so that all the chip boxes 9 are placed in the chip box placing groove 2 in the same direction.

[0051] S112, as shown in Figure 4 and Figure 5 , the adhesive surface of the first carrier film 6 is laid flat on the chip box 9, and the size of the first carrier film 6 should be greater than the size of the film stretching boss 4; the non-adhesive surface of the first carrier film 6 is rolled by using an anti-static roller 92 to make the adhesive surface of the first carrier film 6 closely attached to the chip box 9 and the chip 91 in the chip box 9, so as to facilitate taking out the chip 91 from the chip box 9. At this time, a mark 61 can also be formed on the first carrier film 6 corresponding to the direction of the chip box corner, so as to identify the direction of the chip 91 through the mark 61 after forming the chip film reversing product 10.

[0052] S113, the first carrier film 6 and the chip 91 and the chip box 9 adhered to the first carrier film 6 are taken off from the carrier plate 1, the carrier plate 1 is turned over with the back surface 12 upward, and the non-adhesive surface of the first carrier film 6 is laid flat on the film stretching boss 4.

[0053] When the chip box 9 is a vacuum gel box, the present step can include the following sub-steps:

[0054] S116, the chip box 9 is placed on a platform (not shown in the figure) with a vacuum pump with the front surface 11 upward after being opened, and the vacuum extraction hole at the bottom of the chip box 9 is aligned with the air extraction port of the vacuum pump, so as to facilitate vacuumizing the chip box 9.

[0055] S117, the adhesive surface of the first carrier film 6 is laid flat on the chip box 9, and the size of the first carrier film 6 should be greater than the size of the film stretching boss 4; the non-adhesive surface of the first carrier film 6 is rolled by using an anti-static roller 92 to make the adhesive surface of the first carrier film 6 closely attached to the chip box 9 and the chip 91 in the chip box 9.

[0056] S118, a vacuum pump is used to apply vacuum to the chip box 9, so that the contact area between the gel of the chip box 9 and the chips 91 is greatly reduced, then the first bearing film 6 is slowly taken off and the chips 91 in the chip box 9 are adhered out of the chip box 9, the non-adhesive surface of the first bearing film 6 is laid flat on the film stretching boss 4, and the chips 91 are arranged in a chip matrix on the first bearing film 6.

[0057] S120, the position of the first bearing film 6 is adjusted so that all the chips 91 adhered by the first bearing film 6 are in the cutting area 52 enclosed by the four cutting grooves 5; when the chip box 9 is a waffle box, the four edges of the chip box 9 need to be aligned with the four cutting grooves 5 at this time.

[0058] Then the sub-ring of the sub-mother crystal expanding ring 88 is pressed downward from above to the first bearing film 66 and the sub-ring of the sub-mother crystal expanding ring 88 is tightly sleeved on the film stretching boss 44, so as to fasten the first bearing film 66 on the film stretching boss 44.

[0059] S130, the first bearing film 6 is cut along the four cutting grooves 5. Since there is a gap 51 between adjacent two cutting grooves 5, the four cutting grooves 5 are not connected to each other, so that when the first bearing film 6 is cut, the cut part can be avoided from falling off.

[0060] S140, the adhesive surface of the second bearing film 7 is laid flat on the first bearing film 6 with the adhesive surface downward, and the second bearing film 7 is tightly attached to the first bearing film 6, the size of the second bearing film 7 should be larger than the size of the film stretching boss 4, and the second bearing film 7 is preferably a blue film. When the chip box 9 is a waffle box, before the adhesive surface of the second bearing film 7 is laid flat on the first bearing film 6, the chip box 9 needs to be taken off from the adhesive surface of the first bearing film 6, and only the chip matrix formed by the chips 91 is left on the adhesive surface of the first bearing film 6.

[0061] S150, as shown in Figure 6 and Figure 7 The mother ring of the sub-mother crystal expanding ring 8 is pressed downward to the second bearing film 7 and is sleeved on the sub-ring, so that the second bearing film 7 is fastened between the mother ring and the sub-ring of the sub-mother crystal expanding ring 8.

[0062] S160, the sub-mother crystal expanding ring 8 is taken off from the film stretching boss 4, and the first bearing film 6 and the second bearing film 7 are taken off together; the sub-mother crystal expanding ring 8 is turned over by 180° and placed on the platform with the first bearing film 6 on top.

[0063] S170, as shown in Figure 8As shown, the cut portion of the first carrier film 6 is slowly peeled off from the second carrier film 7 at a nearly horizontal angle of 180°, and the excess first carrier film 6 and second carrier film 7 are trimmed along the outer edge of the mother-child expansion ring 8 to obtain the finished chip flip film 10. When the gap width is small (for example, the gap width is 0.5mm), the connection between the cut portion and the first carrier film 6 is very narrow, and the cut portion can be peeled off from the first carrier film 6 with slight force, thereby forming a window above the chip matrix to facilitate the suction of the chip 91.

[0064] When the first carrier film 6 is a UV film, the UV film may be exposed to UV light to reduce its viscosity before the cut portion of the first carrier film 6 is peeled off from the second carrier film 7. When the first carrier film 6 is a pyrolytic film, the pyrolytic film may be heated to reduce its viscosity before the cut portion of the first carrier film 6 is peeled off from the second carrier film 7.

[0065] In this embodiment, by using the carrier plate 1 and the mother-child expansion ring 8 together, the chips 91 in the chip box 9 can be integrally molded onto the second carrier film 7. This has low processing costs, is easy to operate, and has strong compatibility. It can also improve the success rate of mold-molding the chips 91 and reduce damage and waste to the chips 91 during the mold-molding process. It can be used for mold-molding multiple types of boxed chips, and the finished molded product is suitable for the automatic placement machines widely used in the industry. The position of the chip 91 on the second carrier film 7 is highly accurate. After mold-molding multiple batches of chips 91, the chip array is located in the center of the second carrier film 7 in the same direction. The chip mold-molding finished product 10 has clear marks 61 in the same direction, which is conducive to the accurate identification and rapid absorption of the chip array by the automatic placement machine.

[0066] like Figure 9 As shown, a preferred embodiment of the method for improving the pick-up rate during automatic chip placement of the present invention comprises the following steps:

[0067] S210 , using the chip lamination method of any of the above embodiments to lamination the chip 91 from the chip box 9 onto the carrier film to form a finished chip lamination product 10 .

[0068] S220. The chip box 9 is replaced with the finished chip film 10 and placed on an automatic placement machine. The automatic placement machine is equipped with components such as an image recognition system, a vacuum nozzle assembly, a wafer fixing workbench and a pin device. The automatic placement machine first identifies the position of the chip matrix through the image recognition system, and then lifts up the single chip 91 of the finished chip film through the pin device, and then sucks the lifted chip 91 under less pressure and in a shorter time through the vacuum nozzle assembly, thereby improving the success rate and speed of sucking the chip 91 and reducing the risk of the nozzle damaging the chip 91.

[0069] The present embodiment transfers the box-chip to the second carrier film 7 to form the chip reverse film product 10, and then uses the automatic chip mounter to suck, which can accurately identify and quickly suck the chip 91 on the automatic chip mounter. Compared with directly sucking the box-chip, the effective suction rate can be increased from below 70% to above 90%, thereby greatly improving the suction efficiency of the chip 91 on the automatic chip mounter, reducing the material throwing rate and damage rate of the chip 91 during suction, and improving the compatibility of the program.

[0070] Finally, it should be pointed out that the above embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the purpose and scope of the technical solutions, which should be covered in the scope of the claims of the present application.

Claims

1. A chip film inversion device, characterized in that: It includes a carrier plate and a mother-and-child crystal expansion ring, the carrier plate has a front side and a back side opposite to the front side, the front side is provided with a chip box placement groove, the shape of the chip box placement groove is adapted to the chip box, and both sides of the chip box placement groove are respectively provided with a hand-held pick-up and placement groove connected to it; the back side is provided with a stretch film boss, the stretch film boss is provided with four grooves, the four grooves respectively correspond to the four sides of the chip box, and a gap is left between two adjacent grooves; the mother-and-child crystal expansion ring includes a sub-ring and a mother ring mounted on the sub-ring, the stretch film boss is circular, and the inner diameter of the sub-ring is adapted to the outer diameter of the stretch film boss.

2. A chip film-turning method, characterized in that: Using the chip lamination device according to claim 1, the chip lamination method comprises the following steps: S110, making the sticky surface of the first carrier film and the chip in the chip box fit tightly together, and laying the non-sticky surface of the first carrier film with the chip adhered to it downward onto the stretch film boss; S120, adjusting the position of the first carrier film so that all the chips are within the area enclosed by the four cutting grooves, and fastening the first carrier film to the stretching boss using the sub-rings of the mother-and-child wafer expansion ring; S130, cutting through the first carrier film along the four cutting grooves; S140, laying the second carrier film with the adhesive surface facing downward on the first carrier film, and making the second carrier film and the first carrier film fit tightly together; S150, pressing the mother ring of the mother-and-child wafer expansion ring downward onto the second carrier film and fitting it onto the child ring, so that the second carrier film is fastened between the mother ring and the child ring of the mother-and-child wafer expansion ring; S160, removing the mother-and-child wafer expansion ring from the film stretching boss, and turning the mother-and-child wafer expansion ring over so that the first carrier film faces upward; S170, peeling off the cut portion of the first carrier film to obtain a finished chip film.

3. The chip flipping method according to claim 2, wherein: The chip box is a waffle box, and the step S110 includes the following sub-steps: S111, with the front side of the carrier facing upwards, open the chip box and place it in the chip box placement slot with the opening facing upwards; S112, laying the first carrier film with the sticky surface facing downward on the chip box, and using an antistatic roller to roll the non-sticky surface of the first carrier film so that the sticky surface of the first carrier film is in close contact with the opening of the chip box and the chips in the chip box; S113, remove the first carrier film and the chip and chip box adhered to the first carrier film from the carrier plate, turn the carrier plate over so that its back side faces upward, and lay the first carrier film flat on the stretch film boss with its non-adhesive side facing downward; In the step S140 , before laying the second carrier film with its adhesive surface facing downward onto the first carrier film, the chip cassette is first removed from the adhesive surface of the first carrier film.

4. The chip flipping method according to claim 2, wherein: The chip box is a vacuum gel box, and the step S110 includes the following sub-steps: S116, placing the chip box with the front side facing upward on a platform with a vacuum pump, and aligning the vacuum hole at the bottom of the chip box with the vacuum port of the vacuum pump; S117, laying the first carrier film with the sticky surface facing downward on the chip box, and using an antistatic roller to roll the non-sticky surface of the first carrier film so that the sticky surface of the first carrier film is tightly fitted to the chip in the chip box; S118, applying vacuum to the chip box using a vacuum pump, removing the first carrier film and sticking the chip out of the chip box, and laying the non-adhesive surface of the first carrier film downward on the stretch film boss.

5. The chip flipping method according to claim 2, wherein: A mark is formed on the first carrier film in a direction corresponding to the cut corner of the chip box.

6. The chip flipping method according to any one of claims 2 to 5, characterized in that: The first carrier film is a blue film.

7. The chip flipping method according to any one of claims 2 to 5, characterized in that: The first carrier film is a UV film. In the step S170 , before the cut portion of the first carrier film is peeled off from the second carrier film, the first carrier film is first exposed to UV light to reduce the viscosity of the first carrier film.

8. The chip flipping method according to any one of claims 2 to 5, characterized in that: The first carrier film is a pyrolysis film. In the step S170 , before the cut portion of the first carrier film is peeled off from the second carrier film, the first carrier film is heated to reduce the viscosity of the first carrier film.

9. A method for improving the absorption rate of automatic chip placement, characterized in that: The following steps are involved: S210, using the chip lamination method according to any one of claims 2 to 8 to lamination the chip from the chip box onto the carrier film to form a finished chip lamination product; S220, placing the finished chip film product on the automatic placement machine instead of the chip box, and using the ejector pin of the equipment to lift up a single chip of the finished chip film product, and then sucking the chip.

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