Display device

Abstract

A display device includes a substrate, a pixel structure, a metal layer, a first oxidation-resistant conductive layer, and an insulating layer. The substrate has opposite display and back surfaces. The pixel structure is disposed on the display surface of the substrate. The metal layer is disposed on the back surface of the substrate and includes an island-shaped test pad, a first segment of a trace, and a second segment of the trace. The first and second segments of the trace are respectively located on two sides of the island-shaped test pad and are structurally separated from the island-shaped test pad. The first oxidation-resistant conductive layer is disposed on the back surface and includes a first bridge pattern and a second bridge pattern. The first bridge pattern is connected between the first segment of the trace and the island-shaped test pad. The second bridge pattern is connected between the second segment of the trace and the island-shaped test pad. The insulating layer is disposed on the first oxidation-resistant conductive layer and has an opening. The opening of the insulating layer overlaps the island-shaped test pad.

Description

TECHNICAL FIELD

[0001] The present application relates to an optoelectronic device, and particularly to a display device. BACKGROUND

[0002] A light emitting diode display panel includes a backplane and a plurality of light emitting diode elements disposed on the backplane. Inherited the characteristics of light emitting diode, the light emitting diode display panel has the advantages of power saving, high efficiency, high brightness, fast response time, etc. In addition, compared with the organic light emitting diode display panel, the light emitting diode display panel also has the advantages of easy color adjustment, long light emitting life, no image imprinting, etc. Therefore, the light emitting diode display panel is considered as the next generation display technology.

[0003] Generally, in order to realize the light emitting diode display panel with ultra-narrow frame or even no frame, the peripheral circuit (such as fan-out wiring, test pad, etc.) is made on the back of the backplane, and then a peelable adhesive layer is used to cover and protect it. The peelable adhesive layer has an opening overlapping the test pad to facilitate the insertion of the probe of the test machine for electrical testing. During electrical testing, the test pad is easily damaged by the probe, resulting in corrosion phenomenon of the light emitting diode display panel at the test pad after reliability testing and along the fan-out wiring inside. SUMMARY

[0004] The present application provides a display device with good quality and high yield.

[0005] The display device of the present application includes a substrate, a pixel structure, a metal layer, a first oxidation-resistant conductive layer and an insulating layer. The substrate has opposite display and back surfaces. The pixel structure is disposed on the display surface of the substrate. The metal layer is disposed on the back surface of the substrate and includes an island-shaped test pad, a first segment of a wiring and a second segment of the wiring, wherein the first and second segments of the wiring are respectively located on both sides of the island-shaped test pad and are structurally separated from the island-shaped test pad. The first oxidation-resistant conductive layer is disposed on the back surface and includes a first bridge pattern and a second bridge pattern, wherein the first bridge pattern is connected between the first segment of the wiring and the island-shaped test pad, and the second bridge pattern is connected between the second segment of the wiring and the island-shaped test pad. The insulating layer is disposed on the first oxidation-resistant conductive layer and has an opening, wherein the opening of the insulating layer overlaps the island-shaped test pad.

[0006] In an embodiment of the present application, the display device described above further includes a peelable adhesive layer disposed on the insulating layer and having an opening, wherein the opening of the peelable adhesive layer overlaps the island-shaped test pad.

[0007] In an embodiment of the present application, the opening of the peelable adhesive layer further overlaps the first and second bridge patterns of the first oxidation-resistant conductive layer.

[0008] In an embodiment of the present application, the metal layer is located between the first anti-oxidation conductive layer and the back surface of the substrate. The first anti-oxidation conductive layer further includes an anti-oxidation conductive pattern disposed on the island-shaped test pad of the metal layer, wherein the opening of the peelable adhesive layer, the opening of the insulating layer and the anti-oxidation conductive pattern overlap.

[0009] In an embodiment of the present application, the first bridge pattern and the second bridge pattern are respectively disposed on two sides of the anti-oxidation conductive pattern and are structurally separated from the anti-oxidation conductive pattern.

[0010] In an embodiment of the present application, the metal layer is located between the first anti-oxidation conductive layer and the back surface of the substrate. The display device further includes a second anti-oxidation conductive layer disposed between the metal layer and the back surface of the substrate, wherein the first section of the metal layer trace and the island-shaped test pad of the metal layer have a first gap, the second section of the metal layer trace and the island-shaped test pad of the metal layer have a second gap, the second anti-oxidation conductive layer has a first region and a second region respectively overlapping the first gap and the second gap, the first bridge pattern and the second bridge pattern of the first anti-oxidation conductive layer are respectively disposed in the first gap and the second gap and are respectively electrically connected to the first region and the second region of the second anti-oxidation conductive layer.

[0011] In an embodiment of the present application, the second anti-oxidation conductive layer further has a third region overlapping the island-shaped test pad of the metal layer; two ends of the third region are respectively connected to the first region and the second region.

[0012] In an embodiment of the present application, the first anti-oxidation conductive layer is located between the metal layer and the back surface of the substrate.

[0013] In an embodiment of the present application, the first anti-oxidation conductive layer further includes an anti-oxidation conductive pattern, wherein the island-shaped test pad of the metal layer is disposed on the anti-oxidation conductive pattern of the first anti-oxidation conductive layer, and two ends of the anti-oxidation conductive pattern are respectively connected to the first bridge pattern and the second bridge pattern.

[0014] The present application will be described in detail below with reference to the accompanying drawings and specific embodiments, but is not limited to the present application. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a bottom view of the display device of the first embodiment of the present application.

[0016] Figure 2 It is a cross-sectional view of the display device of the first embodiment of the present application.

[0017] Figure 3 It is a cross-sectional view of the display device of the second embodiment of the present application.

[0018] Figure 4FIG. 3 is a cross-sectional view of a display device according to a third embodiment of the present application.

[0019] In the drawings:

[0020] 10, 10A, 10B: display device

[0021] 110: substrate

[0022] 112: display surface

[0023] 114: back surface

[0024] 120: pixel structure

[0025] 130: barrier protective layer

[0026] 140: metal layer

[0027] 142: island-shaped test pad

[0028] 144: first section

[0029] 146: second section

[0030] 146a, 146b: end

[0031] 148: test pad

[0032] 150, 150B: first oxidation-resistant conductive layer

[0033] 152, 152B: oxidation-resistant conductive pattern

[0034] 154, 154B: first bridge pattern

[0035] 156, 156B: second bridge pattern

[0036] 158: another oxidation-resistant conductive pattern

[0037] 160: insulating layer

[0038] 160a, 170a: opening

[0039] 160b: another opening

[0040] 170: peelable adhesive layer

[0041] 180: second oxidation-resistant conductive layer

[0042] 182: third region

[0043] 184: first region

[0044] 186: second region

[0045] A-A': cutting line

[0046] L: wire

[0047] g1: first gap

[0048] g2: second gap

[0049] Z: direction DETAILED DESCRIPTION

[0050] The structure principle and working principle of the present application will be described in detail below with reference to the drawings:

[0051] Reference will now be made in detail to the exemplary embodiments of the present application, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.

[0052] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or intervening elements can also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" can mean physically and / or electrically connected. Also, "electrical connection" or "coupling" between two elements can be other elements present between the two elements.

[0053] As used herein, "about," "approximately," or "substantially" include the stated value and mean within an acceptable range of deviation for an average of the particular value as determined by one of ordinary skill in the art to be within the scope of what is claimed in view of certain quantities associated with the measurement and errors in the measurement (i.e., limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ± 30%, ± 20%, ± 10%, ± 5%. Also, as used herein, "about," "approximately," or "substantially" can select a more acceptable range of deviation or standard deviation for optical properties, etching properties, or other properties, and can not apply one standard deviation to all properties.

[0054] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present application, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0055] Figure 1 A bottom view schematic of a display device according to a first embodiment of the present application. Figure 2 A cross-sectional view schematic of a display device according to a first embodiment of the present application. Figure 2 CorrespondingFigure 1 The cross-section is A-A'. The direction Z points from the back surface 114 of the substrate 110 to the display surface 112. Figure 1 The display device 10 is shown as seen along a direction parallel to direction Z.

[0056] Please refer to Figure 1 and Figure 2 The display device 10 includes a substrate 110 having a display surface 112 and a back surface 114 facing each other. In this embodiment, the substrate 110 may be made of glass, quartz, organic polymer, or opaque / reflective material (e.g., wafer, ceramic, or other suitable material), or other suitable material.

[0057] The display device 10 further includes a pixel structure 120 disposed on the display surface 112 of the substrate 110. For example, in this embodiment, the pixel structure 120 may include a pixel driving circuit (not shown), a pad (not shown) electrically connected to the pixel driving circuit, and a light-emitting diode element (not shown) bonded to the pad, but the present invention is not limited thereto.

[0058] The display device 10 further includes a metal layer 140. The metal layer 140 is disposed on the back surface 114 of the substrate 110. In this embodiment, the display device 10 may also optionally include a barrier layer 130, wherein the barrier layer 130 is disposed on the back surface 114 of the substrate 110, and the metal layer 140 is disposed on the barrier layer 130, but the present invention is not limited thereto. In this embodiment, the material of the barrier layer 130 may be an inorganic material (e.g., silicon oxide, silicon nitride, silicon oxynitride, or a stack of at least two of the above materials), an organic material, or a combination thereof.

[0059] The metal layer 140 includes an island-shaped test pad 142, a first segment 144 of a trace L, and a second segment 146 of a trace L. The first segment 144 and the second segment 146 of the trace L are located on opposite sides of the island-shaped test pad 142 and are structurally separated from the island-shaped test pad 142. The first segment 144 of the trace L has a first gap g1 with the island-shaped test pad 142. The second segment 146 of the trace L has a second gap g2 with the island-shaped test pad 142 of the metal layer 140. In this embodiment, the metal layer 140 may optionally include a test pad 148, wherein one end 146a of the second segment 146 of the trace L has the second gap g2 with the island-shaped test pad 142, and the other end 146b of the second segment 146 of the trace L is connected to the test pad 148.

[0060] The traces L disposed on the back surface 114 of the substrate 110 are electrically connected to the pixel structure 120 disposed on the display surface 112 of the substrate 110. In the embodiment, the traces L disposed on the back surface 114 of the substrate 110 can be electrically connected to the pixel structure 120 disposed on the display surface 112 of the substrate 110 through side edge conductive lines (not shown) disposed on the side walls (not shown) of the substrate 110 or conductive materials (not shown) penetrating through the substrate 110, but the present application is not limited thereto. In the embodiment, the material of the metal layer 140 can be aluminum, copper or other metals, but the present application is not limited thereto.

[0061] The display device 10 further comprises a first oxidation-resistant conductive layer 150 disposed on the back surface 114 of the substrate 110. In the embodiment, the first oxidation-resistant conductive layer 150 can be selectively disposed on the metal layer 140, wherein the metal layer 140 is located between the first oxidation-resistant conductive layer 150 and the back surface 114 of the substrate 110, but the present application is not limited thereto.

[0062] The first oxidation-resistant conductive layer 150 comprises a first bridge pattern 154 and a second bridge pattern 156. The first bridge pattern 154 is connected between the first segment 144 of the traces L and the island-shaped test pad 142 to electrically connect the first segment 144 of the traces L and the island-shaped test pad 142. The second bridge pattern 156 is connected between the second segment 146 of the traces L and the island-shaped test pad 142 to electrically connect the second segment 146 of the traces L and the island-shaped test pad 142. Compared with the metal layer 140, the first oxidation-resistant conductive layer 150 is less likely to be oxidized. For example, in the embodiment, the material of the first oxidation-resistant conductive layer 150 can be a metal oxide, such as but not limited to indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium germanium zinc oxide, other suitable oxides, or a stack of at least two of the above.

[0063] In the embodiment, the first oxidation-resistant conductive layer 150 can further selectively comprise an oxidation-resistant conductive pattern 152 disposed on the island-shaped test pad 142 of the metal layer 140. The first bridge pattern 154 and the second bridge pattern 156 are respectively disposed on two sides of the oxidation-resistant conductive pattern 152. In the embodiment, the oxidation-resistant conductive pattern 152 can be selectively structurally separated from the first bridge pattern 154 and the second bridge pattern 156, but the present application is not limited thereto.

[0064] In this embodiment, the first anti-oxidation conductive layer 150 can further selectively include another anti-oxidation conductive pattern 158 disposed on the test pad 148 of the metal layer 140, wherein the second bridge pattern 156 is located between the anti-oxidation conductive pattern 152 and the another anti-oxidation conductive pattern 158. In this embodiment, the second bridge pattern 156 and the anti-oxidation conductive pattern 152 and the another anti-oxidation conductive pattern 158 can be selectively structurally separated, but the present application is not limited thereto.

[0065] The display device 10 further includes an insulating layer 160 disposed on the first anti-oxidation conductive layer 150 and having an opening 160a, wherein the opening 160a of the insulating layer 160 overlaps the island-shaped test pad 142. In this embodiment, the opening 160a of the insulating layer 160 further overlaps the anti-oxidation conductive pattern 152. The anti-oxidation conductive pattern 152 covers the area of the island-shaped test pad 142 overlapping the opening 160a. In this embodiment, the opening 160a of the insulating layer 160 can expose the anti-oxidation conductive pattern 152, but the present application is not limited thereto.

[0066] In this embodiment, the insulating layer 160 can further have another opening 160b, wherein the opening 160a of the insulating layer 160 overlaps the test pad 148. In this embodiment, the another opening 160b of the insulating layer 160 further overlaps the another anti-oxidation conductive pattern 158. The another anti-oxidation conductive pattern 158 covers the area of the test pad 148 overlapping the another opening 160b. In this embodiment, the material of the insulating layer 160 can be inorganic material (e.g. silicon oxide, silicon nitride, silicon oxynitride, or stack layers of at least two of the above), organic material or combination of the above. In this embodiment, the insulating layer 160 can include multiple insulating sub-layers, but the present application is not limited thereto.

[0067] In the present embodiment, the display device 10 further comprises a peelable adhesive layer 170 disposed on the insulating layer 160 and having an opening 170a, wherein the opening 170a of the peelable adhesive layer 170 overlaps the island-shaped test pad 142. In the present embodiment, the opening 170a of the peelable adhesive layer 170 overlaps the opening 160a of the insulating layer 160 and the anti-oxidation conductive pattern 152. In the present embodiment, the opening 170a of the peelable adhesive layer 170 further overlaps the first bridge pattern 154 and the second bridge pattern 156 of the first anti-oxidation conductive layer 150, and the opening 160a of the insulating layer 160 is located between the first bridge pattern 154 and the second bridge pattern 156. In the present embodiment, the opening 160a of the insulating layer 160 is located within the opening 170a of the peelable adhesive layer 170 and communicates with the opening 170a of the peelable adhesive layer 170. In the present embodiment, the peelable adhesive layer 170 can fill another opening 160b of the insulating layer 160. In the present embodiment, the peelable adhesive layer 170 filling the another opening 160b of the insulating layer 160 can contact the another anti-oxidation conductive pattern 158, but the present application is not limited thereto.

[0068] It is worth noting that the first bridge pattern 154 and the second bridge pattern 156 of the first anti-oxidation conductive layer 150 are used to separate the island-shaped test pad 142 of the metal layer 140 and the wire L of the metal layer 140, in addition to being used to bridge the first segment 144 and the second segment 146 of the wire L and the island-shaped test pad 142. In this way, even if water vapor enters the metal layer 140 from the island-shaped test pad 142 that is not covered by the peelable adhesive layer 170, the first bridge pattern 154 and the second bridge pattern 156 of the first anti-oxidation conductive layer 150 can block the water vapor from entering the inside of the wire L covered by the peelable adhesive layer 170. Even if the island-shaped test pad 142 of the metal layer 140 is corroded due to oxidation, the corrosion phenomenon is not easy to spread to the inside of the wire L of the metal layer 140 through the first bridge pattern 154 and the second bridge pattern 156 of the first anti-oxidation conductive layer 150. In this way, the quality and yield of the display device 10 can be improved.

[0069] It should be noted that the following embodiments use the element numbers and some of the contents of the previous embodiments, wherein the same numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. For the omitted part, please refer to the previous embodiments, which will not be repeated here.

[0070] Figure 3 A cross-sectional view of a display device according to a second embodiment of the present application. Figure 3 The display device 10A is similar to the display device 10 described above, and the difference between the two is that: Figure 3 The display device 10A further comprises a second anti-oxidation conductive layer 180.

[0071] Referring to FIG. 1A, Figure 3 The second oxidation-resistant conductive layer 180 is disposed between the metal layer 140 and the back surface 114 of the substrate 110. In this embodiment, the second oxidation-resistant conductive layer 180 can be disposed on the barrier protection layer 130, but the present application is not limited thereto. The first section 144 of the trace L of the metal layer 140 and the island-shaped test pad 142 of the metal layer 140 have a first gap g1. The second section 146 of the trace L of the metal layer 140 and the island-shaped test pad 142 of the metal layer 140 have a second gap g2. The second oxidation-resistant conductive layer 180 has a first region 184 and a second region 186 that overlap the first gap g1 and the second gap g2, respectively. The first bridge pattern 154 and the second bridge pattern 156 of the first oxidation-resistant conductive layer 150 are disposed in the first gap g1 and the second gap g2, respectively, and are electrically connected to the first region 184 and the second region 186 of the second oxidation-resistant conductive layer 180, respectively.

[0072] In this embodiment, the second oxidation-resistant conductive layer 180 can also have a third region 182 that overlaps the island-shaped test pad 142 of the metal layer 140; the two ends of the third region 182 are connected to the first region 184 and the second region 186, respectively. Compared with the metal layer 140, the second oxidation-resistant conductive layer 180 is less likely to undergo oxidation reaction. For example, in this embodiment, the material of the second oxidation-resistant conductive layer 180 can be a metal oxide, such as but not limited to indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium germanium zinc oxide, other suitable oxides, or a stack of at least two of the above.

[0073] It is worth mentioning that, in this embodiment, the use of the double-layer first oxidation-resistant conductive layer 150 and the second oxidation-resistant conductive layer 180 to bridge the island-shaped test pad 142 and the first section 144 and the second section 146 of the trace L can reduce the resistance, thereby improving the performance of the display device 10A.

[0074] Figure 4 FIG. 1B is a cross-sectional view of a display device according to a third embodiment of the present application. Figure 4 The display device 10B is similar to the display device 10 described above, and the difference between the two is that: Figure 4 The position of the first oxidation-resistant conductive layer 150B of the display device 10B is different from the position of the first oxidation-resistant conductive layer 150 of the display device 10 described above.

[0075] Referring to FIG. 1A, Figure 4In this embodiment, the first oxidation-resistant conductive layer 150B is located between the metal layer 140 and the back surface 114 of the substrate 110. In this embodiment, the island-shaped test pad 142 of the metal layer 140 is disposed on the oxidation-resistant conductive pattern 152B of the first oxidation-resistant conductive layer 150B, and the two ends of the oxidation-resistant conductive pattern 152B are connected to the first bridge pattern 154B and the second bridge pattern 156B, respectively. In this embodiment, the first oxidation-resistant conductive layer 150B is formed first, and then the metal layer 140 is formed. The island-shaped test pad 142 of the metal layer 140 and the first segment 144 and the second segment 146 of the trace L are electrically connected by the first oxidation-resistant conductive layer 150B formed first.

[0076] Of course, the present application can have other various embodiments, and those skilled in the art can make various corresponding changes and modifications according to the present application without departing from the spirit and essence of the present application. However, these corresponding changes and modifications should all belong to the protection scope of the claims attached to the present application.

Claims

1. A display device, characterized by comprising: Comprising: a substrate having a display surface and a back surface opposite to the display surface; a pixel structure disposed on the display surface of the substrate; a metal layer disposed on the back surface of the substrate, and comprising an island-shaped test pad, a first segment of a trace, and a second segment of the trace, wherein the first segment and the second segment of the trace are respectively located on two sides of the island-shaped test pad and are structurally separated from the island-shaped test pad; a first anti-oxidation conductive layer disposed on the back surface, and comprising a first bridge pattern and a second bridge pattern, wherein the first bridge pattern is connected between the first segment of the trace and the island-shaped test pad, and the second bridge pattern is connected between the second segment of the trace and the island-shaped test pad; and an insulating layer disposed on the first anti-oxidation conductive layer, and having an opening, wherein the opening of the insulating layer overlaps the island-shaped test pad. Further comprising:

2. The display device of claim 1, wherein, a peelable adhesive layer disposed on the insulating layer, and having an opening, wherein the opening of the peelable adhesive layer overlaps the island-shaped test pad. Wherein the opening of the peelable adhesive layer further overlaps the first bridge pattern and the second bridge pattern of the first anti-oxidation conductive layer.

3. The display device of claim 2, wherein, Wherein the metal layer is located between the first anti-oxidation conductive layer and the back surface of the substrate, the first anti-oxidation conductive layer further comprises:

4. The display device of claim 2, wherein an anti-oxidation conductive pattern disposed on the island-shaped test pad of the metal layer, wherein the opening of the peelable adhesive layer, the opening of the insulating layer, and the anti-oxidation conductive pattern overlap. Wherein the first bridge pattern and the second bridge pattern are respectively disposed on two sides of the anti-oxidation conductive pattern and are structurally separated from the anti-oxidation conductive pattern.

5. The display device of claim 4, wherein, Wherein the metal layer is located between the first anti-oxidation conductive layer and the back surface of the substrate, the display device further comprises:

6. The display device of claim 1, wherein a second anti-oxidation conductive layer disposed between the metal layer and the back surface of the substrate, wherein the first segment of the trace of the metal layer and the island-shaped test pad of the metal layer have a first gap, the second segment of the trace of the metal layer and the island-shaped test pad of the metal layer have a second gap, the second anti-oxidation conductive layer has a first region and a second region respectively overlapping the first gap and the second gap, the first bridge pattern and the second bridge pattern of the first anti-oxidation conductive layer are respectively disposed in the first gap and the second gap and are respectively electrically connected to the first region and the second region of the second anti-oxidation conductive layer. Wherein the second anti-oxidation conductive layer further has a third region overlapping the island-shaped test pad of the metal layer; two ends of the third region are respectively connected to the first region and the second region.

7. The display device of claim 6, wherein Wherein the first anti-oxidation conductive layer is located between the metal layer and the back surface of the substrate.

8. The display device of claim 1, wherein, Wherein the first anti-oxidation conductive layer further comprises:

9. The display device of claim 8, wherein, an anti-oxidation conductive pattern, wherein the island-shaped test pad of the metal layer is disposed on the anti-oxidation conductive pattern of the first anti-oxidation conductive layer, and two ends of the anti-oxidation conductive pattern are respectively connected to the first bridge pattern and the second bridge pattern. ​

Images