A microphone

Abstract

This specification discloses a microphone, which includes: a housing structure and a vibration pickup unit that generates vibrations in response to vibrations transmitted to the housing structure; and at least two electroacoustic conversion elements configured to generate electrical signals by respectively vibrating the vibration pickup unit. Among them, the at least two electroacoustic conversion elements have different frequency responses to the vibrations of the vibration pickup unit, and the difference in resonance frequencies between at least two of the at least two electroacoustic conversion elements is greater than 2000 Hz. The microphone provided in this specification realizes sub-band frequency division of sound signals by using multiple electroacoustic conversion components to perform electroacoustic conversion on sound signals near their respective resonance peaks, avoiding the problems of complex hardware circuit design, high computational resource occupancy by software algorithms, signal distortion, and noise introduction. Furthermore, it reduces the complexity and production cost of the microphone, while improving the signal quality of the microphone and the sensitivity of the entire broadband.

Description

Technical Field

[0001] This application relates to the technical field of sound transmission devices, and particularly to a microphone. Background Art

[0002] A microphone (e.g., a bone conduction microphone or an air conduction microphone) outputs a full-band signal based on an external sound signal. After the full-band signal output by the microphone undergoes sub-band frequency division processing (also known as sub-band decomposition processing), subsequent signal processing operations such as speech recognition, noise reduction, and signal enhancement can be better performed. Sub-band frequency division processing technology can be widely applied in fields such as electroacoustics, communication, image coding, echo cancellation, and radar sorting. Currently, the sub-band frequency division processing technology usually uses hardware circuits (e.g., electronic components) and software algorithms (e.g., digital technology) to perform sub-band frequency division processing on the full-band signal. On the one hand, due to the influence of the characteristics of the electronic components themselves, the higher the performance of the filter, the more complex its circuit design. On the other hand, using a software algorithm to perform sub-band frequency division processing on the full-band signal requires high computing resources and will also cause problems such as sound signal distortion and noise introduction during the processing, affecting the sound quality.

[0003] Therefore, it is desirable to provide a microphone that can simplify the process of sub-band frequency division for the full-band signal, achieve sub-band separation from the device side, reduce its dependence on complex hardware circuits and software algorithms, and at the same time improve the quality of the finally formed sound signal. Summary of the Invention

[0004] An embodiment of this application provides a microphone, which includes: a housing structure; a vibration pickup unit that generates vibrations in response to an external sound signal; and at least two electroacoustic conversion elements configured to receive the vibrations of the vibration pickup unit respectively and generate electrical signals, wherein the at least two electroacoustic conversion elements have different frequency responses to the vibrations of the vibration pickup unit, and the difference in resonant frequencies between at least two of the at least two electroacoustic conversion elements is greater than 2000 Hz.

[0005] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) The microphone can perform acoustic-to-electrical conversion on the sound signals near their respective resonance peaks by using multiple acoustic-to-electrical conversion components without using hardware circuits or software algorithms, thereby realizing sub-band frequency division of the sound signal, avoiding the problems of complex hardware circuit design and high computing resources occupied by software algorithms, resulting in signal distortion and noise introduction, thereby reducing the complexity and production cost of the microphone; (2) Different acoustic-to-electrical conversion elements have frequency responses with different frequency widths and different resonance frequencies, respectively, so that the microphone can output a high signal-to-noise ratio and a flatter frequency response curve, thereby improving the signal quality of the microphone; (3) By setting different acoustic-to-electrical conversion elements, resonance peaks in different frequency ranges can be added to the microphone system, thereby improving the sensitivity of the microphone near multiple resonance peaks, and thereby improving the sensitivity of the microphone in the entire wide frequency band. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The present application will be further described in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, like numbers represent like structures, wherein:

[0007] Figure 1 is an exemplary flow chart of performing sub-band frequency division processing according to some embodiments of the present application;

[0008] Figure 2 is an exemplary flow chart of performing sub-band frequency division processing according to some embodiments of the present application;

[0009] Figure 3 is a schematic diagram of a spring-mass-damper system of an acoustic-to-electric conversion element according to some embodiments of the present application;

[0010] Figure 4 is a schematic diagram of an exemplary normalized displacement resonance curve of a spring-mass-damper system according to some embodiments of the present application;

[0011] Figure 5 is a schematic structural diagram of a microphone according to some embodiments of the present application;

[0012] Figure 6A yes Figure 5 Schematic diagram of the cross section of the middle microphone along the AA direction;

[0013] Figure 6B yes Figure 5 Schematic diagram of the cross section of the microphone perpendicular to the AA direction;

[0014] Figure 7A is a schematic diagram of cantilever beam structure distribution according to some embodiments of the present application;

[0015] Figure 7B It is a schematic diagram of the distribution of the cantilever beam structure shown in some embodiments of the present application;

[0016] Figure 8 It is a schematic structural diagram of a microphone shown in some embodiments of the present application;

[0017] Figure 9 It is a schematic diagram of the frequency response curve of a microphone shown in some embodiments of the present application;

[0018] Figure 10 It is a schematic structural diagram of a microphone shown in some embodiments of the present application;

[0019] Figure 11 It is a schematic structural diagram of a microphone shown in some embodiments of the present application;

[0020] Figure 12 It is a schematic structural diagram of a microphone shown in some embodiments of the present application;

[0021] Figure 13 It is a schematic structural diagram of a microphone shown in some embodiments of the present application;

[0022] Figure 14 It is a schematic structural diagram of a microphone shown in some embodiments of the present application;

[0023] Figure 15 It is a schematic structural diagram of a microphone shown in some embodiments of the present application;

[0024] Figure 16A It is a schematic cross-sectional view of a microphone shown in some embodiments of the present application;

[0025] Figure 16B It is a schematic cross-sectional view of a microphone shown in some embodiments of the present application;

[0026] Figure 17A It is a schematic cross-sectional view of a microphone shown in some embodiments of the present application;

[0027] Figure 17B It is a schematic cross-sectional view of a microphone shown in some embodiments of the present application;

[0028] Figure 18 It is a schematic structural diagram of a microphone shown in some embodiments of the present application;

[0029] Figure 19 It is a schematic structural diagram of a microphone shown in some embodiments of the present application;

[0030] Figure 20It is a schematic structural diagram of a microphone shown in some embodiments of the present application. Detailed implementation manners

[0031] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application. For those of ordinary skill in the art, without creative efforts, the present application can also be applied to other similar scenarios based on these drawings. Unless obvious from the language context or otherwise stated, the same reference numerals in the figures represent the same structure or operation.

[0032] It should be understood that the "system", "device", "unit" and / or "module" used herein is a way to distinguish different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the said words can be replaced by other expressions.

[0033] As shown in the present application and the claims, unless the context clearly indicates an exceptional situation, words such as "a", "an", "one" and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0034] Flowcharts are used in the present application to illustrate the operations performed by the systems according to the embodiments of the present application. It should be understood that the operations before or after do not necessarily need to be executed precisely in sequence. On the contrary, they can be executed in reverse order or simultaneously. At the same time, other operations can also be added to these processes, or one or several steps can be removed from these processes.

[0035] This specification describes a microphone. A microphone is a transducer that converts sound signals into electrical signals. In some embodiments, the microphone can be a dynamic microphone, a ribbon microphone, a capacitive microphone, a piezoelectric microphone, an electret microphone, an electromagnetic microphone, a carbon granule microphone, etc., or any combination thereof. In some embodiments, classified by the way of sound collection, the microphone can include a bone conduction microphone and an air conduction microphone. The microphone described in the embodiments of this specification can include a housing structure, a vibration pickup portion, and at least two electroacoustic conversion elements. Among them, the housing structure can be configured to carry the vibration pickup portion and at least two electroacoustic conversion elements. In some embodiments, the housing structure can be a cuboid, a cylinder, or other irregular structures. In some embodiments, the housing structure can be a hollow structure inside, and the housing structure can independently form an acoustic cavity, and the vibration pickup portion and at least two electroacoustic conversion elements can be located in the acoustic cavity of the housing structure. In some embodiments, the vibration pickup portion can be connected to the side wall of the housing structure, and the vibration pickup portion can generate vibrations in response to the external sound signal transmitted to the housing structure. In some embodiments, at least two electroacoustic conversion elements can be directly or indirectly connected to the vibration pickup portion to receive the vibrations of the vibration pickup portion and convert the received vibration signals into electrical signals for output.

[0036] In some embodiments, different electroacoustic conversion elements (e.g., cantilever beam structures) may have different frequency responses to the vibrations of the vibration pickup portion. For example, each electroacoustic conversion element has its own resonant frequency, and each electroacoustic conversion element has a higher response to the sound components near its own resonant frequency. In some embodiments, the response of each electroacoustic conversion element to the sound signal or vibration signal can be described by its corresponding frequency response curve (e.g., Figure 9The frequency response curves 920 and 930 shown in [figure]. In some embodiments, by respectively setting the structures, dimensions, materials, etc. of each acoustic-electric conversion element (e.g., cantilever beam structure), frequency responses with different frequency widths and different resonance frequencies can be achieved for different acoustic-electric conversion elements. For example, by setting cantilever beam structures with different lengths, the resonance frequencies of the cantilever beam structures with different lengths can be respectively located in frequency ranges such as 300 Hz - 500 Hz, 500 Hz - 700 Hz, 700 Hz - 1000 Hz, 2200 Hz - 3000 Hz, 4700 Hz - 5700 Hz, 7000 Hz - 12000 Hz, etc. In some embodiments, each acoustic-electric conversion element only maintains a high sensitivity near its resonance peak, that is, the sensitivity of the acoustic-electric conversion element at its resonance peak is much greater than that in other regions (especially the regions far from the resonance peak position). Therefore, by using multiple acoustic-electric conversion components to perform acoustic-electric conversion on the sound signals near their respective resonance peaks, sub-band frequency division of the sound signals can be achieved. In some embodiments, the difference in resonance frequencies between at least two of the different acoustic-electric conversion elements is greater than 5000 Hz. In some embodiments, the difference in resonance frequencies between at least two of the different acoustic-electric conversion elements is greater than 3000 Hz. In some embodiments, the difference in resonance frequencies between at least two of the different acoustic-electric conversion elements is greater than 2000 Hz. In some embodiments, the difference in resonance frequencies between at least two of the different acoustic-electric conversion elements is greater than 1000 Hz. In some embodiments, the difference in resonance frequencies between at least two of the different acoustic-electric conversion elements is greater than 500 Hz. In some embodiments, the difference in resonance frequencies between at least two of the different acoustic-electric conversion elements is greater than 200 Hz. In some embodiments, the difference in resonance frequencies between at least two of the different acoustic-electric conversion elements is greater than 100 Hz. For the convenience of describing this content, only as an exemplary illustration, within 20 Hz - 15000 Hz, the sensor can include 100 sub-bands, where the bandwidth of each sub-band is about 150 Hz, the frequency band range where the minimum resonance frequency is located is 20 Hz - 170 Hz, the frequency band range where the maximum resonance frequency is located is 14850 Hz - 15000 Hz, and the difference between the maximum resonance frequency (e.g., about 14920 Hz) and the minimum resonance frequency (e.g., about 95 Hz), the difference between the two is about 14825 Hz.For another example, within 20 Hz - 10,000 Hz, the sensor may include 40 sub - bands, where the bandwidth of each sub - band is 250 Hz. The frequency band range where the minimum resonance frequency is located is 20 Hz - 270 Hz, and the frequency band range where the maximum resonance frequency is located is 9750 Hz - 10,000 Hz. The difference between the maximum resonance frequency (e.g., approximately 9875 Hz) and the minimum resonance frequency (e.g., approximately 145 Hz) is approximately 9730 Hz. For yet another example, within 20 Hz - 10,000 Hz, the sensor may include 10 sub - bands, where the bandwidth of each sub - band is 1000 Hz. The frequency band range where the minimum resonance frequency is located is 20 Hz - 1020 Hz, and the frequency band range where the maximum resonance frequency is located is 9000 Hz - 10,000 Hz. The difference between the maximum resonance frequency (e.g., approximately 9500 Hz) and the minimum resonance frequency (e.g., approximately 510 Hz) is approximately 8090 Hz. It should be noted that the above is only for illustrative purposes. The specific values of the selected frequency band range, the number of sub - bands, the bandwidth width, etc. can be adaptively adjusted according to different application scenarios (e.g., indoor call scenario, outdoor noise scenario, etc.), and no further limitation is made here. The frequency response of the microphone can be regarded as a high - signal - to - noise - ratio and flatter frequency response curve formed by fusing the frequency responses of different acoustic - electric conversion elements (e.g., Figure 9 the frequency response curve 910 shown in). On the one hand, the microphone provided by the embodiments of this specification can, without using a hardware circuit (e.g., a filtering circuit) or a software algorithm, perform sub - band frequency division processing on the full - band signal through its own structure, avoiding the problems of complex hardware circuit design, high computing resource occupation by the software algorithm, signal distortion, and noise introduction, thereby reducing the complexity and production cost of the microphone. On the other hand, the microphone provided by the embodiments of this specification can output a frequency response curve with a high signal - to - noise ratio and greater flatness, improving the signal quality of the microphone. In addition, by setting different acoustic - electric conversion elements (e.g., a cantilever beam structure), resonance peaks in different frequency ranges can be added to the microphone system, enhancing the sensitivity of the microphone near multiple resonance peaks, and thus enhancing the sensitivity of the microphone across the entire wide frequency band.

[0037] Figure 1 is an exemplary flowchart for performing sub - band frequency division processing according to some embodiments of the present application. As Figure 1 shown, in some embodiments, the microphone 100 may include an acoustic - electric conversion element 110, a sampling module 120, a sub - band frequency division module 130, and a signal processing module 140.

[0038] The microphone 100 is a transducer that converts sound signals into electrical signals. In some embodiments, the microphone 100 may be a dynamic microphone, a ribbon microphone, a condenser microphone, a piezoelectric microphone, an electret microphone, an electromagnetic microphone, a carbon granule microphone, etc., or any combination thereof. In some embodiments, when distinguished by the way of sound collection, the microphone 100 may include a bone conduction microphone and an air conduction microphone.

[0039] The acoustic-electric conversion element 110 is configured to receive vibrations and generate electrical signals. Taking the bone conduction microphone as an example, in some embodiments, the microphone 100 may further include a housing structure and a vibration pickup portion, wherein the vibration pickup portion is accommodated in the housing structure, and the vibration pickup portion generates vibrations in response to an external sound signal transmitted to the housing structure. Taking the air conduction microphone as an example, in some embodiments, the vibration pickup portion and the housing structure form an acoustic cavity, and the acoustic cavity may include a first acoustic cavity. The housing structure includes one or more hole portions, and the one or more hole portions are located at the first acoustic cavity. The one or more hole portions may introduce an external sound signal into the first acoustic cavity. Among them, the vibration pickup portion generates vibrations in response to the sound signal transmitted to the housing structure and further entering the first acoustic cavity, and the acoustic-electric conversion element 110 receives the vibrations of the vibration pickup portion and generates electrical signals.

[0040] In some embodiments, the acoustic-electric conversion element 110 may convert sound signals into electrical signals. In some embodiments, the acoustic-electric conversion element 110 may include a capacitive acoustic-electric conversion element or a piezoelectric conversion element. In some embodiments, the piezoelectric conversion element may be an element that converts the change of a non-electrical quantity to be measured (such as pressure, displacement, etc.) into a change in voltage. For example, the piezoelectric conversion element may include a cantilever beam structure, and the cantilever beam structure may be deformed under the vibration of the vibration pickup portion, and the inverse piezoelectric effect caused by the deformed cantilever beam structure may generate an electrical signal. In some embodiments, the capacitive acoustic-electric conversion element may be an element that converts the change of a non-electrical quantity to be measured (such as displacement, pressure, light intensity, acceleration, etc.) into a change in capacitance. For example, the capacitive conversion element may include a first cantilever beam structure and a second cantilever beam structure. The first cantilever beam structure and the second cantilever beam structure may be deformed to different degrees under the vibration of the vibration pickup portion, so that the distance between the first cantilever beam structure and the second cantilever beam structure changes. The first cantilever beam structure and the second cantilever beam structure may convert the change in the distance between the two into a change in capacitance, so as to realize the conversion of vibration signals into electrical signals. For the specific structure of the acoustic-electric conversion element 110, reference may be made to the specification of this application Figure 5 、 Figure 8 and its related descriptions.

[0041] The sampling module 120 can sample (and hold), quantize, and encode the electrical signal based on the sampling frequency, thereby converting the electrical signal into a digital signal. In some embodiments, the sampling module 120 may include a sampling circuit, an analog-to-digital converter, etc. Specifically, the sampling circuit can discretize the continuous electrical signal input into the sampling module 120, that is, sample the continuous electrical signal based on the sampling frequency to obtain a series of discrete sampling values (i.e., the sampling signal).

[0042] The subband frequency division module 130 can decompose the digital signal into multiple subband frequency division signals. In some embodiments, the subband frequency division module 130 may include electronic components (e.g., filters, frequency dividers, etc.). In some embodiments, the filter can select the electrical signal within a specific frequency range according to its own frequency characteristics and attenuate the electrical signals in other frequency ranges. The frequency characteristics of the filter can be achieved by adjusting the parameters of components such as resistors, capacitors, and inductors in the filter circuit. In some embodiments, the subband frequency division module 130 may include multiple filters with different frequency characteristics. The filters with different frequency characteristics can resonate within their own resonance frequency ranges respectively and select the electrical signals within the corresponding resonance frequency ranges respectively, thereby decomposing the wideband electrical signal into multiple subband frequency division signals. In some embodiments, the signal can also be processed by a backend algorithm for subband frequency division. In some embodiments, the backend algorithm may include, but is not limited to, one or more of linear prediction analysis (LPC), linear prediction cepstral coefficients (LPCC), Mel frequency cepstral coefficients (MFCC), etc.

[0043] The signal processing module 140 can process the sub-band frequency-divided signal. In some embodiments, the signal processing module 140 can include one or more of an equalizer, a dynamic range controller, a phase processor, etc. In some embodiments, the equalizer can be configured to perform gain and / or attenuation on the sub-band frequency-divided signal output by the sub-band frequency division module 130 according to a specific frequency band (for example, the frequency band corresponding to the sub-band frequency-divided signal). Performing gain on the sub-band frequency-divided signal means increasing the signal amplification amount; performing attenuation on the sub-band frequency-divided signal means reducing the signal amplification amount. In some embodiments, the dynamic range controller can be configured to compress and / or amplify the sub-band frequency-divided signal. Compressing and / or amplifying the sub-band frequency-divided electrical signal means reducing and / or increasing the ratio between the signal input and output in the microphone 100. In some embodiments, the phase processor can be configured to adjust the phase of the sub-band frequency-divided signal. In some embodiments, the signal processing module 140 can be located inside the microphone 100. For example, the signal processing module 140 can be located in an acoustic cavity independently formed by the housing structure of the microphone 100. In some embodiments, the signal processing module 140 can also be located in other electronic devices, such as one or any combination of headphones, mobile devices, tablet computers, laptop computers, etc. In some embodiments, the mobile device can include, but is not limited to, mobile phones, smart home devices, smart mobile devices, etc., or any combination thereof. In some embodiments, the smart home device can include a control device for smart appliances, a smart monitoring device, a smart TV, a smart camera, etc., or any combination thereof. In some embodiments, the smart mobile device can include a smart phone, a personal digital assistant (PDA), a gaming device, a navigation device, a POS device, etc., or any combination thereof.

[0044] During the operation of the above-mentioned microphone 100, on the one hand, when the sub-band frequency division module 130 is an electronic component, affected by the characteristics of the electronic component, the design of the filter circuit of the sub-band frequency division module 130 is usually relatively complex to achieve a better frequency division and filtering effect. On the other hand, the sub-band frequency division module 130 realizes sub-band frequency division through a back-end algorithm, which requires a relatively high amount of computing resources for the back-end algorithm, a large amount of data needs to be processed, resulting in too long calculation time. Implementing sub-band frequency division through the back-end algorithm will also cause problems such as sound signal distortion and noise introduction during the processing process, affecting the sound quality. Therefore, in view of the problems existing in the above sub-band frequency division method, this specification provides a microphone to solve the problems of complex filter circuit design and large back-end algorithm calculation amount in the microphone, and at the same time improve the Q value and sensitivity of the microphone. For the content of the microphone, reference can be made to the specification of this application Figures 2 - 20 and its related descriptions.

[0045] It should be noted that the components of the microphone 100 are not limited to Figure 1The electroacoustic conversion element 110, sampling module 120, subband frequency division module 130, and signal processing module 140 shown in [description] may further include other modules. In addition, the electroacoustic conversion element 110, sampling module 120, subband frequency division module 130, and signal processing module 140 may form a system. As part of this system, the microphone 100 may only include the electroacoustic conversion element 110. The sampling module 120, subband frequency division module 130, and signal processing module 140 may be provided outside the microphone 100, and the electrical signal output by the electroacoustic conversion element 110 may be transmitted to the corresponding module by wired or wireless means for subsequent processing.

[0046] Figure 2 is an exemplary flowchart for performing subband frequency division processing according to some embodiments of the present application. As shown in Figure 2As shown, in some embodiments, the microphone 200 may include at least two electroacoustic conversion elements 210, a sampling module 220, and a signal processing module 230. The microphone 200 picks up an external sound signal and transmits the sound signal to the electroacoustic conversion element 210, which can convert the sound signal (e.g., vibration) into an electrical signal. In some embodiments, each of the at least two electroacoustic conversion elements 210 (e.g., the first electroacoustic conversion element, the second electroacoustic conversion element, … the nth electroacoustic conversion element, etc.) has a different frequency response to the sound signal, such that the electrical signals mainly output by each electroacoustic conversion element respectively correspond to different frequency ranges and frequency bandwidths (i.e., sub-band frequency-divided electrical signals 1, … sub-band frequency-divided electrical signals n, etc.). For example, the electroacoustic conversion element may include a first electroacoustic conversion element, a second electroacoustic conversion element, a third electroacoustic conversion element, and a fourth electroacoustic conversion element, which may respectively have a first frequency response, a second frequency response, a third frequency response, and a fourth frequency response. In some embodiments, the frequency ranges corresponding to the first frequency response, the second frequency response, the third frequency response, and the fourth frequency response may be different. Alternatively, the frequency ranges corresponding to the first frequency response, the second frequency response, and the third frequency response may be different from each other, while the frequency range of the fourth frequency response may be the same as the frequency range of the third frequency response. In some embodiments, the frequency bandwidths corresponding to the first frequency response, the second frequency response, the third frequency response, and the fourth frequency response may be the same or different. For example, the frequency bandwidth of the second frequency response is greater than the frequency bandwidth of the first frequency response, and the frequency bandwidth of the third frequency response is greater than the frequency bandwidth of the second frequency response. Also for example, the frequency bandwidth corresponding to the fourth frequency response is equal to the frequency bandwidth corresponding to the third frequency response. In some embodiments, the frequency ranges corresponding to different electroacoustic conversion elements may overlap or not overlap. For example, the first frequency response and the second frequency response respectively correspond to one of two adjacent sub-bands, the frequency range of the second frequency response includes at least a part of the frequency range of the first frequency response, and there will be an overlapping part between the frequency range of the second frequency response and the frequency range of the first frequency response. Also for example, the first frequency response and the fourth frequency response respectively correspond to one of two non-adjacent sub-bands, and there is no same frequency or frequency range between the frequency range of the fourth frequency response and the frequency range of the first frequency response. At this time, the fourth frequency response does not overlap with the first frequency response. In some embodiments, the resonant frequencies corresponding to different electroacoustic conversion elements may be different. For example, the resonant frequencies corresponding to the first frequency response, the second frequency response, the third frequency response, and the fourth frequency response gradually increase. In some embodiments, the second frequency response and the first frequency response may intersect at a position close to or at the half-power point. For example, the resonant frequency of the second frequency response is greater than the resonant frequency of the first frequency response, and the half-power point of the second frequency response intersects with the half-power point of the first frequency response.In some embodiments, the second frequency response and the first frequency response may intersect at a position not close to the half-power point.

[0047] In some embodiments, by adjusting the dimensions (such as length, width, thickness, etc.), materials, etc. of the cantilever beam structure, different cantilever beam structures can be made to resonate within the required frequency ranges respectively, and then frequency responses corresponding to different resonant frequency ranges can be obtained. Taking the cantilever beam as a cuboid structure as an exemplary illustration, in some embodiments, the resonant frequency of the acoustic-electric conversion element 250 is negatively correlated with the length of the cantilever beam structure. For example, the acoustic-electric conversion element 250 may include a first acoustic-electric conversion element and a second acoustic-electric conversion element. The first acoustic-electric conversion element may include a first cantilever beam structure, and the second acoustic-electric conversion element may include a second cantilever beam structure. Among them, the length of the first cantilever beam structure is greater than the length of the second cantilever beam structure, and the resonant frequency corresponding to the first acoustic-electric conversion element is lower than the resonant frequency corresponding to the second acoustic-electric conversion element. It should be noted that the first cantilever beam structure and the second cantilever beam structure have the same other parameters (such as width, thickness, material, etc.) except for the different lengths. In some other embodiments, the lengths, widths, thicknesses, and materials of different cantilever beam structures can all be adjusted to adjust the resonant frequencies of different cantilever beam structures.

[0048] In some embodiments, multiple sub-band frequency-divided electrical signals can be transmitted through different parallel lines respectively. In some embodiments, multiple sub-band frequency-divided electrical signals can also be output in a specific format according to specific protocol rules through a shared line. In some embodiments, the specific protocol rules may include, but are not limited to, one or more of direct transmission, amplitude modulation, frequency modulation, etc. In some embodiments, the line medium may include, but is not limited to, one or more of coaxial cable, communication cable, flexible cable, spiral cable, non-metallic sheathed cable, metallic sheathed cable, multi-core cable, twisted pair cable, ribbon cable, shielded cable, telecommunication cable, twin cable, parallel twin-core wire, twisted pair, optical fiber, infrared ray, electromagnetic wave, sound wave, etc. In some embodiments, the specific format may include, but is not limited to, one or more of CD, WAVE, AIFF, MPEG-1, MPEG-2, MPEG-3, MPEG-4, MIDI, WMA, RealAudio, VQF, AMR, APE, FLAC, AAC, etc. In some embodiments, the transmission protocol may include, but is not limited to, one or more of AES3, EBU, ADAT, I2S, TDM, MIDI, CobraNet, Ethernet AVB, Dante, ITU-T G.728, ITU-T G.711, ITU-T G.722, ITU-T G.722.1, ITU-T G.722.1 Annex C, AAC-LD, etc.

[0049] In some embodiments, each electroacoustic conversion element in the electroacoustic conversion element 210 (e.g., the first electroacoustic conversion element, … the nth electroacoustic conversion element) outputs its corresponding sub-band frequency-divided electrical signal (e.g., sub-band frequency-divided electrical signal 1, … sub-band frequency-divided electrical signal n), and then transmits them to the corresponding sampling module 220 (e.g., the first sampling module 1, … the nth sampling module, etc.) for sampling respectively, so as to convert the sub-band frequency-divided electrical signals (e.g., sub-band frequency-divided electrical signal 1, … sub-band frequency-divided electrical signal n, etc.) into their corresponding digital signals (e.g., digital signal 1, … digital signal n, etc.) respectively. For example, the first sampling module can sample the sub-band frequency-divided electrical signal 1 to convert the sub-band frequency-divided electrical signal 1 into the digital signal 1. It should be noted that the sub-band frequency-divided electrical signal can also be simply referred to as the sub-band. In some embodiments, the number of the sampling modules 220 can also be different from the number of the electroacoustic conversion elements 210. For example, the sub-band frequency-divided electrical signals output by multiple electroacoustic conversion elements can be sampled by the same sampling module at the same sampling frequency. In some embodiments, the frequency ranges of the sub-band frequency-divided electrical signals output by two or more adjacent electroacoustic conversion elements are relatively close. In order to improve the conversion efficiency of the sub-band frequency-divided electrical signals, the same sampling module can sample the sub-band frequency-divided electrical signals output by two or more adjacent electroacoustic conversion elements. In order to reduce the sampling frequency, the amount of sampling data and the sampling difficulty, in some embodiments, the sampling frequency of the sampling module 220 can be determined based on the frequency ranges of different sub-band frequency-divided electrical signals. Here, it can be understood that different sub-band frequency-divided electrical signals have different frequency ranges, and the sampling module can process different sub-band frequency-divided electrical signals according to different sampling frequencies. For example, the sub-band frequency-divided electrical signals in the low-frequency range adopt a lower sampling frequency to ensure a lower cut-off frequency. For another example, the sub-band frequency-divided electrical signals in the medium-high frequency range adopt a higher sampling frequency to ensure a relatively higher cut-off frequency. The sampling module can process different sub-band frequency-divided electrical signals according to different sampling frequencies to reduce the amount of sampled data, and at the same time, it also reduces the sampling difficulty and cost. In addition, by processing the sub-band signals with different sampling frequencies, problems such as signal distortion and noise introduction in the process of sub-band frequency division and sampling processing are avoided. In some embodiments, the sampling cut-off frequency of the sampling module corresponding to each sub-band frequency-divided electrical signal can be greater than a specific value with respect to the maximum frequency in the resonant frequency range (hereinafter also simply referred to as the "bandwidth") corresponding to the sub-band frequency-divided electrical signal. Here, the resonant frequency range corresponding to the sub-band frequency-divided electrical signal refers to the 3dB bandwidth of the sub-band frequency-divided electrical signal, and it can also be understood as the frequency range defined when the response amplitude drops to 1 / 2 of the resonant peak. In some embodiments, the range of this specific value can be greater than 500Hz. In some embodiments, the range of this specific value can be greater than 600Hz. In some embodiments, the range of this specific value can be greater than 800Hz.In some embodiments, to further improve the conversion quality of the sub-band frequency-divided electrical signal, the sampling frequency may be not less than 2 times the highest frequency of the bandwidth of the sub-band frequency-divided electrical signal. In some embodiments, the sampling frequency may be not less than 3 times the highest frequency of the bandwidth of the sub-band frequency-divided electrical signal. In some embodiments, the sampling frequency may be not less than 2 times the highest frequency of the bandwidth of the sub-band frequency-divided electrical signal and not greater than 4 times the highest frequency of the bandwidth of the sub-band frequency-divided electrical signal.

[0050] In some embodiments, the digital signals (e.g., digital signal 1, …… digital signal n, etc.) output by each sampling module in the sampling module 220 may be further transmitted to the signal processing module 230 for signal processing. In some embodiments, multiple digital signals may be respectively transmitted to the signal processing module 230 through different parallel lines. In some embodiments, multiple digital signals may also share one line and be transmitted to the signal processing module 230 in a specific format according to specific protocol rules.

[0051] In some embodiments, by providing electroacoustic conversion elements (e.g., cantilever beam structures) with different frequency response characteristics in the microphone, the electroacoustic conversion elements can directly perform sub-band decomposition on wide-band sound signals, thereby avoiding the problems of complex hardware circuit design and high computational resource occupation, signal distortion, and noise introduction caused by using hardware circuits or software algorithms, and further reducing the complexity and production cost of the microphone.

[0052] It should be noted that the components of the microphone 200 are not limited to Figure 2 the electroacoustic conversion element 210, the sampling module 220, and the signal processing module 230 shown, and may further include other modules, such as a vibration pickup part, a vibration transmission part, a circuit module, etc., or any combination thereof. Similarly, it can be understood that Figure 2 the n (e.g., the nth electroacoustic conversion element, the nth sampling module, etc.) described may be an integer greater than or equal to 2, and the specific value of n can be adaptively adjusted according to the actual application scenario.

[0053] To facilitate the understanding of the electroacoustic conversion element, in some embodiments, the electroacoustic conversion element of the microphone may be approximately equivalent to a spring-mass-damper system. When the microphone works, the spring-mass-damper system may vibrate under the action of an excitation source (e.g., the vibration of the vibration pickup part). Figure 3 is a schematic diagram of the spring-mass-damper system of the electroacoustic conversion element shown according to some embodiments of the present application. As Figure 3 shown, the spring-mass-damper system can move according to the differential equation (1):

[0054]

[0055] Where M represents the mass of the spring-mass-damper system, x represents the displacement of the spring-mass-damper system, R represents the damping of the spring-mass-damper system, K represents the elastic constant of the spring-mass-damper, F represents the amplitude of the driving force, and ω represents the circular frequency of the external force.

[0056] The differential equation (1) can be solved to obtain the displacement in the steady state (2):

[0057] x=x a cos(ωt-θ),(2)

[0058] Where x represents the deformation of the spring-mass-damper system when the microphone is working, which is equal to the value of the output electrical signal. Medium x a represents the output displacement, Z represents the mechanical impedance, and θ represents the oscillation phase.

[0059] The normalized displacement amplitude ratio A can be described as equation (3):

[0060]

[0061] in, Medium x a0 represents the displacement amplitude in steady state (or the displacement amplitude when ω = 0), middle Indicates the ratio of external force frequency to natural frequency, ω0=K / M where ω0 represents the circumferential frequency of vibration. Middle Q m Represents the mechanical quality factor.

[0062] Figure 4 Schematic diagram of an exemplary normalized displacement resonance curve of a spring-mass-damper system according to some embodiments of the present application. The horizontal axis may represent the ratio of the actual vibration frequency of the spring-mass-damper system to its natural frequency, and the vertical axis may represent the normalized displacement of the spring-mass-damper system. It is understood that Figure 4 The various curves in can respectively represent the displacement resonance curves of the spring-mass-damper system with different parameters. In some embodiments, the microphone can generate an electrical signal through the relative displacement between the acoustic-electric conversion element and the shell structure. For example, the electret microphone can generate an electrical signal based on the change in the distance between the deformed diaphragm and the substrate. As another example, the cantilever bone conduction microphone can generate an electrical signal based on the inverse piezoelectric effect caused by the deformed cantilever structure or the change in capacitance caused by the change in the distance between the cantilever beams. In some embodiments, the greater the displacement of the cantilever structure deformation, the greater the electrical signal output by the microphone. As Figure 4As shown, when the actual vibration frequency of the spring-mass-damper system is the same as or approximately the same as its natural frequency (i.e., when the ratio ω / ω0 of the actual vibration frequency to the natural frequency of the spring-mass-damper system is equal to or approximately equal to 1), the larger the normalized displacement of the spring-mass-damper system, and the narrower the 3dB bandwidth (which can be understood as the resonant frequency range) of the resonant peak in the displacement resonance curve. Combining with the above equation (3), it can be seen that the larger the normalized displacement of the spring-mass-damper system, the larger the Q value of the microphone.

[0063] Figure 5 is a schematic structural diagram of a microphone shown according to some embodiments of the present application. As Figure 5 shown, the microphone 500 may include a housing structure 510, at least two electroacoustic conversion elements 520, and a vibration pickup portion 522. Among them, the housing structure 510 may be configured to carry the vibration pickup portion 522 and the electroacoustic conversion elements 520. In some embodiments, the housing structure 510 may be a regular structure such as a cuboid, a cylinder, a frustum of a cone, or other irregular structures. In some embodiments, the housing structure 510 is a hollow structure inside, and the housing structure 510 may independently form an acoustic cavity, and the vibration pickup portion 522 and at least two electroacoustic conversion elements 520 may be located in the acoustic cavity. In some embodiments, the material of the housing structure 510 may include, but is not limited to, one or more of metals, alloy materials, polymer materials (for example, acrylonitrile-butadiene-styrene copolymer, polyvinyl chloride, polycarbonate, polypropylene, etc.). In some embodiments, the vibration pickup portion 522 may be connected to the side wall of the housing structure 510, so as to divide the acoustic cavity formed by the housing structure 510 into multiple cavities, including a first acoustic cavity 530 and a second acoustic cavity 540.

[0064] In some embodiments, one or more hole portions 511 may be provided on the side wall of the housing structure 510 corresponding to the first acoustic cavity 530, and the one or more hole portions 511 may be located at the first acoustic cavity 530 and introduce external sound signals into the first acoustic cavity 530. In some embodiments, the external sound signals may enter the first acoustic cavity 530 of the microphone 500 from the hole portions 511 and cause the air in the first acoustic cavity 530 to vibrate. The vibration pickup portion 522 may pick up the air vibration signal and transmit the vibration signal to the electroacoustic conversion element 520, and the electroacoustic conversion element 520 receives the vibration signal and converts the vibration signal into an electrical signal for output.

[0065] In some embodiments, the vibration pickup unit 522 may include a first vibration pickup unit 5221 and a second vibration pickup unit 5222 which are arranged in sequence from top to bottom. The first vibration pickup unit 5221 and the second vibration pickup unit 5222 may be connected to the housing structure 510 through their peripheral sides, and at least part of the structures of the first vibration pickup unit 5221 and the second vibration pickup unit 5222 may generate vibrations in response to the sound signal entering the microphone 500 through the hole 511. In some embodiments, the material of the vibration pickup unit 522 may include, but is not limited to, one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, the semiconductor material may include, but is not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, etc. In some embodiments, the metal material may include, but is not limited to, copper, aluminum, chromium, titanium, gold, etc. In some embodiments, the metal alloy may include, but is not limited to, copper-aluminum alloy, copper-gold alloy, titanium alloy, aluminum alloy, etc. In some embodiments, the organic material may include, but is not limited to, polyimide, parylene, PDMS, silicone gel, silica gel, etc. In some embodiments, the structure of the vibration pickup unit 522 may be a plate-like structure, a columnar structure, etc.

[0066] In some embodiments, different regions on the vibration pickup unit 522 may be made of different materials. For example, the part of the vibration pickup unit 522 in contact with the vibration transmission unit 523 and the part of the vibration pickup unit 522 corresponding to the cavity 550 may be made of a rigid material, and its stiffness is greater than that of other regions of the vibration pickup unit 522. For example, the stiffness of the edge region mainly used to respond to air vibration and move relative to the housing structure 510. In some embodiments, the partial structure of the vibration pickup unit 522 composed of the rigid material hardly deforms under the action of the air vibration in the first acoustic cavity 530, so that the volume of the cavity 550 remains basically constant, which can avoid the influence of the volume change of the cavity 550 on the acoustic-electric conversion element 1320, and further ensure that the acoustic-electric conversion element 520 can convert the vibration signal of the received vibration pickup unit 522 into an electric signal within the required frequency band range. In some embodiments, the cavity 550 may be a vacuum cavity. The acoustic-electric conversion element 520 is located in the vacuum cavity, avoiding the contact between the acoustic-electric conversion element 520 and the air in the acoustic cavity, and thus solving the influence of the air vibration in the acoustic cavity during the acoustic-electric conversion process of the acoustic-electric conversion element 520, that is, solving the problem of relatively high microphone background noise. On the other hand, the acoustic-electric conversion element 520 is located in the vacuum cavity, which can avoid the friction between the acoustic-electric conversion element 520 and the gas during vibration, thereby reducing the air damping inside the vacuum cavity of the microphone 500 and increasing the Q value of the microphone 500. In some embodiments, the vacuum degree of the cavity 550 may be less than 100 Pa. In some embodiments, the vacuum degree of the cavity 550 may be 10 -610 Pa - 100 Pa. In some embodiments, the vacuum degree of the cavity 550 can be 10 -3 Pa - 100 Pa. In some embodiments, the vacuum degree of the cavity 550 can be 1 Pa - 100 Pa.

[0067] In some embodiments, the microphone 500 may include a vibration transfer part 523. The vibration transfer part 523 may be located between the first vibration pickup part 5221 and the second vibration pickup part 5222. The upper surface of the vibration transfer part 523 is connected to the lower surface of the first vibration pickup part 5221, and the lower surface of the vibration transfer part 523 is connected to the upper surface of the second vibration pickup part 5222. In some embodiments, a cavity 550 may be formed between the vibration transfer part 523, the first vibration pickup part 5221, and the second vibration pickup part 5222, and the acoustic - electric conversion element 520 may be located inside the cavity 550. Specifically, one end of the acoustic - electric conversion element 520 may be connected to the inner wall of the vibration transfer part 523, and the other end of the acoustic - electric conversion element 520 may be suspended in the cavity 550. In some embodiments, the vibration pickup part 522 (e.g., the first vibration pickup part 5221, the second vibration pickup part 5222) may transfer the vibration signal to the acoustic - electric conversion element 520 through the vibration transfer part 523. In some embodiments, the material of the vibration transfer part 523 may include, but is not limited to, one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, the material of the vibration transfer part 523 and the material of the vibration pickup part 522 may be the same or different. In some embodiments, the vibration transfer part 523 and the vibration pickup part 522 may be an integrally formed structure. In some embodiments, the vibration transfer part 523 and the vibration pickup part 522 may also be relatively independent structures. In some embodiments, the vibration transfer part 523 may be a tubular structure, an annular structure, a regular and / or irregular polygon structure such as a quadrilateral, a pentagon, etc.

[0068] It should be noted that, in an alternative embodiment, the vibration pickup unit 522 may only include the first vibration pickup unit 5221, and the first vibration pickup unit 5221 is connected to the housing structure 510 through its peripheral side. One or more acoustic-electric conversion elements 520 may be directly or indirectly connected to the first vibration pickup unit 5221. For example, the acoustic-electric conversion elements 520 may be located on the upper surface or the lower surface of the first vibration pickup unit 5221. When the number of the acoustic-electric conversion elements 520 is multiple, the multiple acoustic-electric conversion elements 520 are spaced apart and distributed on the upper surface or the lower surface of the first vibration pickup unit 5221, and the multiple acoustic-electric conversion elements 520 do not contact each other. Again, for example, the acoustic-electric conversion elements 520 may be connected to the first vibration pickup unit 5221 through other structures (such as the vibration transmission unit 523). The first vibration pickup unit 5221 may generate vibrations in response to the sound signal entering the microphone 500 through the hole 511, and the acoustic-electric conversion elements 520 may convert the vibrations of the first vibration pickup unit 5221 or the vibration transmission unit 523 into electrical signals.

[0069] In some embodiments, multiple acoustic-electric conversion elements 520 may be spaced apart and distributed on the inner wall of the vibration transmission unit 523. It should be noted that the spaced-apart distribution here may refer to the horizontal direction (perpendicular to the Figure 5 A-A direction shown in Figure 5 ) or the vertical direction ( Figure 6A the A-A direction shown in Figure 5 ). For example, when the vibration transmission unit 523 is an annular tubular structure, in the vertical direction, multiple acoustic-electric conversion elements 520 may be spaced apart and distributed from top to bottom in sequence. Figure 6A is a schematic cross-sectional view of the microphone along the A-A direction. As Figure 6B shown, multiple acoustic-electric conversion elements 520 may be spaced apart and distributed on the inner wall of the vibration transmission unit 523 in sequence, and in the horizontal direction, the multiple acoustic-electric conversion elements 520 in spaced-apart distribution are on the same plane or approximately parallel. Figure 5 is a schematic cross-sectional view of the microphone along the direction perpendicular to the A-A direction. As [[ID=1s]] Figure 6B shown, in the horizontal direction, the fixed ends of each acoustic-electric conversion element 520 with the vibration transmission unit 523 may be spaced apart and distributed on the annular inner wall of the vibration transmission unit 523. The fixed end of the acoustic-electric conversion element 520 and the vibration transmission unit 523 may be approximately perpendicular, and the other end (also referred to as the free end) of the acoustic-electric conversion element 520 extends towards the center direction of the vibration transmission unit 523 and is suspended in the cavity 550, so that the acoustic-electric conversion elements 520 are annularly distributed in the horizontal direction. In some embodiments, when the vibration transmission unit 523 is a polygonal tubular structure (such as a triangle, a pentagon, a hexagon, etc.), in the horizontal direction, the fixed ends of multiple acoustic-electric conversion elements 520 may also be spaced apart and distributed along the side walls of the vibration transmission unit 523. Figure 7AIt is a schematic diagram of the distribution of the acoustic-electric conversion elements in the horizontal direction according to some embodiments of the present application. As Figure 7A shown, the vibration transmission part 523 has a quadrilateral structure, and multiple acoustic-electric conversion elements 520 can be alternately distributed on the four side walls of the vibration transmission part 523. Figure 7B It is a schematic diagram of the distribution of the acoustic-electric conversion elements according to some embodiments of the present application. As Figure 7B shown, the vibration transmission part 523 has a hexagonal structure, and the cantilever beam structures 521 with different lengths can be alternately distributed on the six side walls of the vibration transmission part 523. The spaced distribution of multiple acoustic-electric conversion elements 520 at the inner wall of the vibration transmission part 523 can improve the utilization rate of the space of the cavity 550, thereby reducing the overall volume of the microphone 500.

[0070] It should be noted that in the horizontal or vertical direction, multiple acoustic-electric conversion elements 520 are not limited to being spaced and distributed on all the inner walls of the vibration transmission part 523. Multiple acoustic-electric conversion elements 520 can also be arranged on one side wall or part of the side walls of the vibration transmission part 523, or multiple acoustic-electric conversion elements 520 are on the same horizontal plane. For example, if the vibration transmission part 523 has a cuboid structure, multiple acoustic-electric conversion elements 520 can be arranged on one side wall of the cuboid structure, on two opposite or adjacent side walls, or on any three side walls at the same time. The distribution method of multiple acoustic-electric conversion elements 520 can be adaptively adjusted according to their quantity or the size of the cavity 550, and no further limitation is made here.

[0071] In some embodiments, each acoustic-electric conversion element 520 can include a cantilever beam structure. One end of the cantilever beam structure can be connected to the inner wall of the vibration transmission part 523, and the other end of the cantilever beam structure can be suspended in the cavity 550.

[0072] In some embodiments, the cantilever beam structure may include a first electrode layer, a piezoelectric layer, a second electrode layer, an elastic layer, and a substrate layer. Among them, the first electrode layer, the piezoelectric layer, and the second electrode layer may be sequentially arranged from top to bottom. The elastic layer may be located on the upper surface of the first electrode layer or the lower surface of the second electrode layer, and the substrate layer may be located on the upper surface or the lower surface of the elastic layer. In some embodiments, an external sound signal may enter the first acoustic cavity 530 of the microphone 500 through the hole 511 and cause the air in the first acoustic cavity 530 to vibrate. The vibration pickup portion 522 may pick up the air vibration signal and transmit the vibration signal to the acoustic-electric conversion element 520 (e.g., the cantilever beam structure) through the vibration transmission portion 523, so that the elastic layer in the cantilever beam structure deforms under the action of the vibration signal. In some embodiments, the piezoelectric layer may generate an electrical signal based on the deformation of the elastic layer, and the first electrode layer and the second electrode layer may collect the electrical signal. In some embodiments, the piezoelectric layer may generate a voltage (potential difference) under the action of the deformation stress of the elastic layer based on the piezoelectric effect, and the first electrode layer and the second electrode layer may export the voltage (electrical signal).

[0073] In some embodiments, the elastic layer may be a film-like structure or a bulk structure supported by one or more semiconductor materials. In some embodiments, the semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, gallium nitride, zinc oxide, silicon carbide, etc. In some embodiments, the material of the piezoelectric layer may include piezoelectric crystal materials and piezoelectric ceramic materials. Piezoelectric crystal materials refer to piezoelectric single crystals. In some embodiments, the piezoelectric crystal materials may include quartz, sphalerite, boracite, tourmaline, zincite, GaAs, barium titanate and its derivative structure crystals, KH2PO4, NaKC4H4O6·4H2O (Rochelle salt), etc., or any combination thereof. Piezoelectric ceramic materials refer to piezoelectric polycrystals formed by the random aggregation of fine grains obtained by the solid-phase reaction and sintering between different material powder particles. In some embodiments, the piezoelectric ceramic materials may include barium titanate (BT), lead zirconate titanate (PZT), lead barium lithium niobate (PBLN), modified lead titanate (PT), aluminum nitride (AIN), zinc oxide (ZnO), etc., or any combination thereof. In some embodiments, the piezoelectric layer material may also be a piezoelectric polymer material, such as polyvinylidene fluoride (PVDF), etc. In some embodiments, the first electrode layer and the second electrode layer may be conductive material structures. Exemplary conductive materials may include metals, alloy materials, metal oxide materials, graphene, etc., or any combination thereof. In some embodiments, the metals and alloy materials may include nickel, iron, lead, platinum, titanium, copper, molybdenum, zinc, or any combination thereof. In some embodiments, the alloy materials may include copper-zinc alloy, copper-tin alloy, copper-nickel-silicon alloy, copper-chromium alloy, copper-silver alloy, etc., or any combination thereof. In some embodiments, the metal oxide materials may include RuO2, MnO2, PbO2, NiO, etc., or any combination thereof.

[0074] In some embodiments, the cantilever beam structure may further include a wire bonding electrode layer (PAD layer). The wire bonding electrode layer may be located on the first electrode layer and the second electrode layer. The first electrode layer and the second electrode layer are connected to an external circuit by means of external wire bonding (such as gold wire, aluminum wire, etc.), so as to lead out the voltage signal between the first electrode layer and the second electrode layer to the backend processing circuit. In some embodiments, the material of the wire bonding electrode layer may include copper foil, titanium, copper, etc. In some embodiments, the material of the wire bonding electrode layer may be the same as that of the first electrode layer (or the second electrode layer). In some embodiments, the material of the wire bonding electrode layer may be different from that of the first electrode layer (or the second electrode layer).

[0075] In some other embodiments, the cantilever beam structure may include one or more elastic layers, electrode layers, and piezoelectric layers. Among them, the elastic layer may be located on the surface of the electrode layer, and the electrode layer may be located on the upper surface or the lower surface of the piezoelectric layer. In some embodiments, the electrode layer may include a first electrode and a second electrode. The first electrode and the second electrode may be bent into a first comb-like structure. The first comb-like structure and the second comb-like structure may include a plurality of comb structures. There is a certain distance between adjacent comb structures of the first comb-like structure and between adjacent comb structures of the first comb-like structure. This distance may be the same or different. Among them, the first comb-like structure and the second comb-like structure cooperate with each other to form the electrode layer. Further, the comb structures of the first comb-like structure may extend into the spaces between the comb structures of the second comb-like structure, and the comb structures of the second comb-like structure may extend into the spaces between the comb structures of the first comb-like structure, so as to cooperate with each other to form the electrode layer. The first comb-like structure and the second comb-like structure cooperate with each other, so that the first electrode and the second electrode are arranged compactly but do not intersect. In some embodiments, the first comb-like structure and the second comb-like structure extend along the length direction of the cantilever beam (for example, from the fixed end to the free end direction). For more descriptions of the elastic layer and the piezoelectric layer, reference can be made to Figure 5 and its related descriptions. In some embodiments, each cantilever beam structure in different acoustic-electric conversion elements 520 may respectively form a cantilever beam resonance system, and the resonance frequency of this system can be expressed by formula (4):

[0076]

[0077] where f0 represents the resonance frequency of the resonance system, k represents the stiffness of the resonance system, and m represents the mass of the resonance system. According to formula (4), it can be known that when the ratio k / m of the stiffness to the mass of the cantilever beam resonance system decreases, the resonance frequency f0 of the resonance system also decreases. In some embodiments, by changing the resonance frequency of the resonance system, the sensitivity of the resonance system in a specific frequency range (for example, less than the resonance frequency) can be improved.

[0078] In some embodiments, when the cantilever beam structure is a cuboid structure, the calculation formula (4) of the resonance frequency of the cantilever beam resonance system can be further expressed as formula (5):

[0079]

[0080] Wherein, f0 represents the resonance frequency of the resonance system, E represents the elastic modulus of the material of the cantilever beam structure, l represents the moment of inertia of the cross-section of the cantilever beam structure (which can be understood as the length of the cantilever beam structure), ρ represents the density of the cantilever beam structure, and A represents the cross-sectional area of the cantilever beam structure. Wherein, b represents the width of the cross-section of the cantilever beam structure, and h represents the height of the cross-section of the cantilever beam structure. According to formula (5), it can be known that when the cross-sectional dimensions of the cantilever beam structure (i.e., the width and height of the cantilever beam structure) and the material are the same, the longer the length of the cantilever beam structure, the smaller the resonance frequency of the cantilever beam structure.

[0081] Based on the above description, in some embodiments, different acoustic-electric conversion elements 520 (for example, cantilever beam structures of different lengths) can be set so that different acoustic-electric conversion elements 520 have different resonance frequencies respectively, thereby generating different frequency responses to the vibration signals of the vibration transmission part 523. In some embodiments, the parameters of the cantilever beam structure (such as length, width, thickness, material, etc.) can be set to obtain frequency responses corresponding to different resonance frequencies. In some embodiments, the resonance frequency corresponding to the cantilever beam structure can be negatively correlated with the length of the cantilever beam structure in the direction perpendicular to its vibration direction, that is, the longer the length of the cantilever beam structure in the direction perpendicular to its vibration direction, the smaller the resonance frequency corresponding to the cantilever beam structure. For example, Figure 7AThe length of the first cantilever beam structure 5211 in the direction perpendicular to its vibration direction is greater than the length of the second cantilever beam structure 5212 in the direction perpendicular to its vibration direction, and the resonant frequency corresponding to the first cantilever beam structure 5211 is lower than the resonant frequency corresponding to the second cantilever beam structure 5212. In some embodiments, by adjusting the length of the cantilever beam structure, at least two of the multiple resonant frequencies corresponding to different cantilever beam structures can be in the range of 20 Hz - 16000 Hz. In some embodiments, by adjusting the length of the cantilever beam structure, at least two of the multiple resonant frequencies corresponding to different cantilever beam structures can be in the range of 100 Hz - 12000 Hz. Since the cantilever beam structure is sensitive to vibrations near its resonant frequency, it can be considered that the cantilever beam structure has a frequency selection characteristic for vibration signals, that is, the cantilever beam structure will mainly convert the sub-band vibration signals in the vibration signal near its resonant frequency into electrical signals. Therefore, in some embodiments, by setting different lengths, different cantilever beam structures can have different resonant frequencies, thereby forming sub-bands respectively near each resonant frequency. For example, 11 sub-bands can be set within the human voice frequency range through multiple cantilever beam structures, and the resonant frequencies of the cantilever beam structures corresponding to the 11 sub-bands can be located at 500 Hz - 700 Hz, 700 Hz - 1000 Hz, 1000 Hz - 1300 Hz, 1300 Hz - 1700 Hz, 1700 Hz - 2200 Hz, 2200 Hz - 3000 Hz, 3000 Hz - 3800 Hz, 3800 Hz - 4700 Hz, 4700 Hz - 5700 Hz, 5700 Hz - 7000 Hz, 7000 Hz - 12000 Hz respectively. Another example is that 16 sub-bands can be set within the human voice frequency range through multiple cantilever beam structures, and the resonant frequencies of the cantilever beam structures corresponding to the 16 sub-bands can be located at 500 Hz - 640 Hz, 640 Hz - 780 Hz, 780 Hz - 930 Hz, 940 Hz - 1100 Hz, 1100 Hz - 1300 Hz, 1300 Hz - 1500 Hz, 1500 Hz - 1750 Hz, 1750 Hz - 1900 Hz, 1900 Hz - 2350 Hz, 2350 Hz - 2700 Hz, 2700 Hz - 3200 Hz, 3200 Hz - 3800 Hz, 3800 Hz - 4500 Hz, 4500 Hz - 5500 Hz, 5500 Hz - 6600 Hz, 6600 Hz - 8000 Hz respectively.For another example, 24 sub-bands can be set within the vocal frequency range through multiple cantilever beam structures. The resonant frequencies of the 24 sub-bands corresponding to the cantilever beam structures can be respectively located at 20 Hz - 120 Hz, 120 Hz - 210 Hz, 210 Hz - 320 Hz, 320 Hz - 410 Hz, 410 Hz - 500 Hz, 500 Hz - 640 Hz, 640 Hz - 780 Hz, 780 Hz - 930 Hz, 940 Hz - 1100 Hz, 1100 Hz - 1300 Hz, 1300 Hz - 1500 Hz, 1500 Hz - 1750 Hz, 1750 Hz - 1900 Hz, 1900 Hz - 2350 Hz, 2350 Hz - 2700 Hz, 2700 Hz - 3200 Hz, 3200 Hz - 3800 Hz, 3800 Hz - 4500 Hz, 4500 Hz - 5500 Hz, 5500 Hz - 6600 Hz, 6600 Hz - 7900 Hz, 7900 Hz - 9600 Hz, 9600 Hz - 12100 Hz, 12100 Hz - 16000 Hz. Taking the cantilever beam structure as a cuboid as an exemplary illustration, in some embodiments, by adjusting the lengths of multiple cantilever beam structures to be different, at least 5 sub-bands can be formed within the vocal frequency range (e.g., 20 Hz - 16000 Hz). In some embodiments, by adjusting the lengths of multiple cantilever beam structures to be different, 5 to 11 sub-bands can be formed within the vocal frequency range (e.g., 20 Hz - 16000 Hz). In some embodiments, by adjusting the lengths of multiple cantilever beam structures to be different, 5 to 16 sub-bands can be formed within the vocal frequency range (e.g., 20 Hz - 16000 Hz). In some embodiments, by adjusting the lengths of multiple cantilever beam structures to be different, 6 to 24 sub-bands can be formed within the vocal frequency range (e.g., 20 Hz - 16000 Hz). It should be noted that regarding the electroacoustic conversion element (or cantilever beam structure), the number of sub-bands, and the frequency ranges of the resonant frequencies respectively corresponding to each sub-band, they are not limited to the above descriptions and can be adaptively adjusted according to specific situations such as the application scenario of the microphone and the size of the microphone, and no further limitation is made here. Additionally, the cantilever beam structure is not limited to the above cuboid shape. The cantilever beam structure can also be other shapes. When the cross-sectional shape of the cantilever beam structure can be a regular or irregular shape such as a triangle, semi-circle, rhombus, pentagon, hexagon, etc., in addition, different resonant frequencies of different cantilever beams can also be achieved by adjusting the parameters related to the mass or stiffness of the cantilever beam structure.

[0082] In some embodiments, the acoustic-electric conversion element 520 of the microphone 500 can resonate within the required frequency ranges by adjusting parameters such as the structure, size, and inner surface roughness of the first acoustic cavity 530 and / or the hole portion 511. For example, by adjusting the shape, cavity volume, and inner surface roughness of the first acoustic cavity 530, sub-band decomposition of the vibration signal can also be achieved, such that the sound entering the first acoustic cavity 530 has the frequency of a specific sub-band. Regarding the content of enabling the microphone 500 to resonate within the required frequency ranges by adjusting parameters such as the structure, size, and inner surface roughness of the first acoustic cavity 530 and / or the hole portion 511, reference can be made to the patent application titled "A Microphone" filed on the same day as this application, which will not be elaborated here.

[0083] Figure 8 is a schematic structural diagram of a microphone shown in some embodiments of the present application. As Figure 8 shown, the microphone 800 can include a housing structure 810, an acoustic-electric conversion element 820, and a vibration pickup portion 822. Figure 8 The microphone 800 shown in Figure 5 can be the same as or similar to the microphone 500 shown in Figure 5 and its related description. For example, the housing structure 810 of the microphone 800 can be the same as or similar to the housing structure 510 of the microphone 500. Also, for example, the first acoustic cavity 830, the second acoustic cavity 840, and the cavity 850 of the microphone 800 can be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the cavity 550 of the microphone 500, respectively. Further, for example, the vibration pickup portion 822 (e.g., the first vibration pickup portion 8221, the second vibration pickup portion 8222) of the microphone 800 can be the same as or similar to the vibration pickup portion 522 (e.g., the first vibration pickup portion 5221, the second vibration pickup portion 5222) of the microphone 500. Regarding more structures of the microphone 800 (such as the hole portion 811, the vibration transmission portion 823, etc.), reference can be made to Figure 5 and its related description.

[0084] In some embodiments, Figure 8 the microphone 800 shown in Figure 5The main difference of the microphone 500 shown is that each electroacoustic conversion element 820 of the microphone 800 may include a first cantilever beam structure 8211 and a second cantilever beam structure 8212, where the first cantilever beam structure 8211 and the second cantilever beam structure 8212 can be regarded as two electrode plates. In some embodiments, the first cantilever beam structure 8211 and the second cantilever beam structure 8212 may be arranged oppositely, and the first cantilever beam structure 8211 and the second cantilever beam structure 8212 have an opposing area. In some embodiments, the first cantilever beam structure 8211 and the second cantilever beam structure 8212 are arranged vertically. At this time, the opposing area can be understood as the area where the lower surface of the first cantilever beam structure 8211 faces the upper surface of the second cantilever beam structure 8212. In some embodiments, the first cantilever beam structure 8211 and the second cantilever beam structure 8212 may have a first spacing d1. After receiving the vibration signal of the vibration transmission part 823, the first cantilever beam structure 8211 and the second cantilever beam structure 8212 can generate different degrees of deformation in their vibration directions (the extension direction of the first spacing d1), so that the first spacing d1 changes. The first cantilever beam structure 8211 and the second cantilever beam structure 8212 can convert the vibration signal of the vibration transmission part 823 received based on the change of the first spacing d1 into an electrical signal.

[0085] In order to make the first cantilever beam structure 8211 and the second cantilever beam structure 8212 generate different degrees of deformation in their vibration directions, in some embodiments, the stiffness of the first cantilever beam structure 8211 and the stiffness of the second cantilever beam structure 8212 may be different. Under the action of the vibration signal of the vibration transmission part 823, the cantilever beam structure with a smaller stiffness can generate a certain degree of deformation, and the cantilever beam structure with a larger stiffness can be approximately considered not to generate deformation or the amount of deformation generated is less than that of the cantilever beam structure with a smaller stiffness. In some embodiments, when the microphone 800 is in a working state, the cantilever beam structure with a smaller stiffness (for example, the second cantilever beam structure 8212) can generate deformation in response to the vibration of the vibration transmission part 823, and the cantilever beam structure with a larger stiffness (for example, the first cantilever beam structure 8211) can vibrate with the vibration transmission part 823 without generating deformation, so that the first spacing d1 changes.

[0086] In some embodiments, the resonant frequency of the cantilever beam structure with a relatively small stiffness in the acoustic-electric conversion element 820 can be within the frequency range audible to the human ear (e.g., within 12000 Hz). In some embodiments, the resonant frequency of the cantilever beam structure with a relatively large stiffness in the acoustic-electric conversion element 820 can be within the frequency range to which the human ear is insensitive (e.g., greater than 12000 Hz). In some embodiments, the stiffness of the first cantilever beam structure 8211 (or the second cantilever beam structure 8212) in the acoustic-electric conversion element 820 can be achieved by adjusting the material, length, width, or thickness of the first cantilever beam structure 8211 (or the second cantilever beam structure 8212), etc. In some embodiments, by adjusting the parameters of each set of cantilever beam structures corresponding to different acoustic-electric conversion elements 820 (e.g., the material, thickness, length, width, etc. of the cantilever beam structure), frequency responses corresponding to different resonant frequencies can be obtained. In some embodiments, by adjusting the lengths of each set of cantilever beam structures corresponding to different acoustic-electric conversion elements 820 (e.g., the first cantilever beam structure 8211 and the second cantilever beam structure 8212), at least two of the multiple resonant frequencies corresponding to different acoustic-electric conversion elements 820 can be within the range of 20 Hz - 16000 Hz. In some embodiments, by adjusting the lengths of each set of cantilever beam structures corresponding to different acoustic-electric conversion elementsFor example, 11 sub-bands can be set within the human voice frequency range through multiple groups of cantilever beam structures. The resonance frequencies of each group of cantilever beam structures corresponding to the 11 sub-bands can be respectively located at 500 Hz - 700 Hz, 700 Hz - 1000 Hz, 1000 Hz - 1300 Hz, 1300 Hz - 1700 Hz, 1700 Hz - 2200 Hz, 2200 Hz - 3000 Hz, 3000 Hz - 3800 Hz, 3800 Hz - 4700 Hz, 4700 Hz - 5700 Hz, 5700 Hz - 7000 Hz, 7000 Hz - 12000 Hz. Another example, 16 sub-bands can be set within the human voice frequency range through multiple groups of cantilever beam structures. The resonance frequencies of each group of cantilever beam structures corresponding to the 16 sub-bands can be respectively located at 500 Hz - 640 Hz, 640 Hz - 780 Hz, 780 Hz - 930 Hz, 940 Hz - 1100 Hz, 1100 Hz - 1300 Hz, 1300 Hz - 1500 Hz, 1500 Hz - 1750 Hz, 1750 Hz - 1900 Hz, 1900 Hz - 2350 Hz, 2350 Hz - 2700 Hz, 2700 Hz - 3200 Hz, 3200 Hz - 3800 Hz, 3800 Hz - 4500 Hz, 4500 Hz - 5500 Hz, 5500 Hz - 6600 Hz, 6600 Hz - 8000 Hz. Still another example, 24 sub-bands can be set within the human voice frequency range through multiple groups of cantilever beam structures. The resonance frequencies of each group of cantilever beam structures corresponding to the 24 sub-bands can be respectively located at 20 Hz - 120 Hz, 120 Hz - 210 Hz, 210 Hz - 320 Hz, 320 Hz - 410 Hz, 410 Hz - 500 Hz, 500 Hz - 640 Hz, 640 Hz - 780 Hz, 780 Hz - 930 Hz, 940 Hz - 1100 Hz, 1100 Hz - 1300 Hz, 1300 Hz - 1500 Hz, 1500 Hz - 1750 Hz, 1750 Hz - 1900 Hz, 1900 Hz - 2350 Hz, 2350 Hz - 2700 Hz, 2700 Hz - 3200 Hz, 3200 Hz - 3800 Hz, 3800 Hz - 4500 Hz, 4500 Hz - 5500 Hz, 5500 Hz - 6600 Hz, 6600 Hz - 7900 Hz, 7900 Hz - 9600 Hz, 9600 Hz - 12100 Hz, 12100 Hz - 16000 Hz. In some embodiments, by adjusting the lengths of multiple groups of cantilever beam structures to be different, different acoustic-electric conversion elements 820 can form 5 to 50 sub-bands within the human voice frequency range (for example, 20 Hz - 16000 Hz).Preferably, by setting the lengths of multiple groups of cantilever beam structures to be different, 6 to 24 sub-bands can be formed within the human voice frequency range (e.g., 20 Hz - 16000 Hz) for the multiple groups of cantilever beam structures.

[0087] Figure 9 is a schematic diagram of the frequency response curve of a microphone shown in some embodiments of the present application. As Figure 9 shown, the horizontal axis represents frequency, with the unit of Hz, and the vertical axis represents the frequency response of the sound signal output by the microphone, with the unit of dB. The microphone here can refer to microphone 500, microphone 800, microphone 1000, microphone 1100, microphone 1300, microphone 1400, microphone 1500, microphone 1800, microphone 1900, microphone 2000, etc. Figure 9 Each of the dashed lines in can represent the frequency response curve corresponding to each electro-acoustic conversion element of the microphone. According to Figure 9 each of the frequency response curves in, it can be known that each electro-acoustic conversion element has its own resonance frequency (e.g., the resonance frequency of the frequency response curve 920 is about 350 Hz, and the resonance frequency of the frequency response curve 930 is about 1500 Hz). When an external sound signal is transmitted to the microphone, different electro-acoustic conversion elements are more sensitive to the vibration signals near their own resonance frequencies. Therefore, the electrical signals output by each electro-acoustic conversion element mainly include sub-band signals corresponding to their resonance frequencies. In some embodiments, the output at the resonance peak of each electro-acoustic conversion element is much larger than the output in its own flat region. By selecting the frequency band near the resonance peak in the frequency response curve of each electro-acoustic conversion component, sub-band frequency division of the full-band signal corresponding to the sound signal can be achieved. In some embodiments, after Figure 9 each of the frequency response curves in are fused, a frequency response curve 910 of the microphone with high signal-to-noise ratio and more flatness can be obtained. In addition, by setting different electro-acoustic conversion elements (cantilever beam structures), resonance peaks in different frequency ranges can be added in the microphone system, improving the sensitivity of the microphone near multiple resonance peaks, and thus improving the sensitivity of the microphone in the entire wide frequency band.

[0088] By arranging multiple electro-acoustic conversion elements in the microphone and utilizing the characteristics that the electro-acoustic conversion elements (e.g., cantilever beam structures) have different resonance frequencies, filtering and frequency band decomposition of vibration signals can be realized, avoiding the complexity of the filter circuit in the microphone and the problems of high computing resource occupation by software algorithms, signal distortion, and noise introduction, and thus reducing the complexity and production cost of the microphone.

[0089] Figure 10 is a schematic diagram of the structure of a microphone shown in some embodiments of the present application. As Figure 10As shown, the microphone 1000 may include a housing structure 1010, an acoustic-electric conversion element 1020, and a vibration pickup portion 1022. Figure 10 The microphone 1000 shown in Figure 5 may be the same as or similar to the microphone 500 shown in Figure 5 and its related description. For example, the housing structure 1010 of the microphone 1000 may be the same as or similar to the housing structure 510 of the microphone 500. Also, for example, the first acoustic cavity 1030, the second acoustic cavity 1040, and the cavity 1050 of the microphone 1000 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the cavity 550 of the microphone 500, respectively. Further, for example, the vibration pickup portion 1022 (e.g., the first vibration pickup portion 10221 and the second vibration pickup portion 10222) of the microphone 1000 may be the same as or similar to the vibration pickup portion 522 (e.g., the first vibration pickup portion 5221 and the second vibration pickup portion 5222) of the microphone 500. More structures of the microphone 1000 (e.g., the hole portion 1011, the vibration transfer portion 1023, the acoustic-electric conversion element 1020, etc.) can be referred to

[0090] In some embodiments, Figure 10 the microphone 1000 shown in Figure 5The main difference of the microphone 500 shown is that the microphone 1000 may further include one or more membrane structures 1060. In some embodiments, the membrane structure 1060 may be located on the upper surface and / or the lower surface of the electroacoustic conversion element 1020. For example, the membrane structure 1060 may be a single-layer membrane structure, and the membrane structure 1060 may be located on the upper surface or the lower surface of the electroacoustic conversion element 1020. For another example, the membrane structure 1060 may be a double-layer membrane, and the membrane structure 1060 may include a first membrane structure and a second membrane structure. The first membrane structure is located on the upper surface of the electroacoustic conversion element 1020, and the second membrane structure is located on the lower surface of the electroacoustic conversion element 1020. By providing the membrane structure 1060 on the surface of the electroacoustic conversion element 1020, the resonance frequency of the electroacoustic conversion element 1020 can be adjusted. In some embodiments, by adjusting the material, size (such as length, width), thickness, etc. of the membrane structure 1060, the resonance frequency of the electroacoustic conversion element 1020 can be affected. On the one hand, by adjusting the parameter information (such as material, size, thickness, etc.) of the membrane structure 1060 and the electroacoustic conversion element 1020 (such as a cantilever beam structure), each electroacoustic conversion element 1020 can resonate within the required frequency range. On the other hand, by providing the membrane structure 1060 on the surface of the electroacoustic conversion element 1020, damage to the electroacoustic conversion element 1020 caused by the microphone 1000 under overload conditions can be avoided, thereby improving the reliability of the microphone 1000. In addition, by providing the membrane structure 1060 on the surface of the electroacoustic conversion element 1020, the deformation amount of the microphone 1000 due to stress can be reduced, making the actual product closer to the design target.

[0091] In some embodiments, the membrane structure 1060 may entirely or partially cover the upper surface and / or the lower surface of the electroacoustic conversion element 1020. For example, the upper surface or the lower surface of each electroacoustic conversion element 1020 is covered with a corresponding membrane structure 1060. The membrane structure 1060 may entirely cover the upper surface or the lower surface of the corresponding electroacoustic conversion element 1020, or the membrane structure 1060 may partially cover the upper surface or the lower surface of the corresponding electroacoustic conversion element 1020. For another example, when viewed in the horizontal direction, when multiple electroacoustic conversion elements 1020 are located on the same horizontal plane at the same time, a membrane structure 1060 may entirely cover the upper surface or the lower surface of multiple electroacoustic conversion elements 1020 on the same horizontal plane at the same time. For example, here the membrane structure 1060 is connected to the inner wall of the vibration transfer part 1023 through its peripheral side, thereby dividing the cavity 1050 into two independent upper and lower cavities. For another example, the shape of the membrane structure 1060 may be the same as the cross-sectional shape of the vibration transfer part 1023. The membrane structure 1060 is connected to the inner wall of the vibration transfer part 1023 through its peripheral side, and the middle part of the membrane structure 1060 may include a hole part ( Figure 10(not shown in the figure), the membrane structure 1060 can locally cover the upper or lower surfaces of multiple acoustic-electric conversion elements 1020 on the same horizontal plane at the same time, and the cavity 1050 can be separated into two upper and lower connected cavities by the membrane structure 1060.

[0092] In some embodiments, the material of the membrane structure 1060 may include, but is not limited to, one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, the semiconductor material may include, but is not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, etc. In some embodiments, the metal material may include, but is not limited to, copper, aluminum, chromium, titanium, gold, etc. In some embodiments, the metal alloy may include, but is not limited to, copper-aluminum alloy, copper-gold alloy, titanium alloy, aluminum alloy, etc. In some embodiments, the organic material may include, but is not limited to, polyimide, parylene, PDMS, silicone gel, silica gel, etc.

[0093] Figure 11 is a schematic structural diagram of a microphone shown in some embodiments of the present application. As Figure 11 shown, the microphone 1100 can be Figure 8 the same as or similar to the microphone 800 shown. For example, the housing structure 1110 of the microphone 1100 can be the same as or similar to the housing structure 810 of the microphone 800. Also, for example, the first acoustic cavity 1130, the second acoustic cavity 1140, and the cavity 1150 of the microphone 1100 can be respectively the same as or similar to the first acoustic cavity 830, the second acoustic cavity 840, and the cavity 850 of the microphone 800. Again, for example, the vibration pickup part 1122 (e.g., the first vibration pickup part 11221, the second vibration pickup part 11222) of the microphone 1100 can be the same as or similar to the vibration pickup part 822 (e.g., the first vibration pickup part 8221, the second vibration pickup part 8222) of the microphone 800. For more structures of the microphone 1100 (e.g., the hole part 1111, the vibration transfer part 1123, the acoustic-electric conversion element 1120, etc.), reference can be made to Figure 8 and its related description.

[0094] In some embodiments, Figure 11 the microphone 1100 shown in Figure 8The main difference of the microphone 800 shown is that the microphone 1100 may further include one or more membrane structures 1160. In some embodiments, the membrane structure 1160 may be located on the upper surface and / or the lower surface of the cantilever beam structure (e.g., the second cantilever beam structure 11212) of the acoustic-electric conversion element 1120 having a smaller stiffness. For example, the membrane structure 1160 may be a single-layer membrane structure, and the membrane structure 1160 may be located on the upper surface or the lower surface of the second cantilever beam structure 11212. Again, for example, the membrane structure 1160 may be a double-layer membrane, and the membrane structure 1160 may include a first membrane structure and a second membrane structure. The first membrane structure is located on the upper surface of the second cantilever beam structure 11212, and the second membrane structure is located on the lower surface of the second cantilever beam structure 11212. In some embodiments, the membrane structure 1160 may entirely or partially cover the upper surface and / or the lower surface of the second cantilever beam structure 11212. For example, the upper surface or the lower surface of each second cantilever beam structure 11212 is covered with a corresponding membrane structure 1160. The membrane structure 1160 may entirely cover the upper surface or the lower surface of the corresponding second cantilever beam structure 11212, or the membrane structure 1160 may partially cover the upper surface or the lower surface of the corresponding second cantilever beam structure 11212. More content regarding the entire or partial covering of the upper and lower surfaces of the second cantilever beam structure 11212 by the membrane structure 1160 can be referred to Figure 10 and its related description.

[0095] In some embodiments, the membrane structure 1160 may also be located on the upper surface and / or the lower surface of the cantilever beam structure (e.g., the first cantilever beam structure 11211) of the acoustic-electric conversion element 1120 having a larger stiffness. The manner in which the membrane structure 1160 is located on the upper surface and / or the lower surface of the first cantilever beam structure 11211 is similar to the manner in which the membrane structure 1160 is located on the upper surface and / or the lower surface of the second cantilever beam structure 11212, and will not be elaborated here.

[0096] In some embodiments, the membrane structure 1160 may also be simultaneously located on the upper surface and / or the lower surface of the cantilever beam structure (e.g., the second cantilever beam structure 11212) of the acoustic-electric conversion element 1120 having a smaller stiffness and on the upper surface and / or the lower surface of the cantilever beam structure (e.g., the first cantilever beam structure 11211) having a larger stiffness. For example, Figure 12 is a schematic structural diagram of a microphone shown according to some embodiments of the present application, as Figure 12As shown, the membrane structure 1160 is located on the upper surface of the first cantilever beam structure 11211 and the lower surface of the second cantilever beam structure 11212 simultaneously. In some embodiments, disposing the membrane structure 1160 on the upper surface and / or the lower surface of a cantilever beam structure with relatively high stiffness (e.g., the first cantilever beam structure 11211) can prevent the cantilever beam structure with relatively high stiffness from deforming relative to the vibration transmission part 1123, thereby improving the sensitivity of the microphone 1100. On the other hand, disposing the membrane structure 1060 on the surface of the second cantilever beam structure 11212 or the first cantilever beam structure 11211 can adjust the deformation amount of the second cantilever beam structure 11212 or the first cantilever beam structure 11211 caused by stress, thereby precisely controlling the distance between the second cantilever beam structure 1122 and the first cantilever beam structure 11211.

[0097] Figure 13 is a schematic structural diagram of a microphone shown according to some embodiments of the present application. As Figure 13 shown, the microphone 1300 may include a housing structure 1310, an acoustic-electric conversion element 1320, and a vibration pickup part 1322. Figure 13 The microphone 1300 shown in Figure 5 may be the same as or similar to the microphone 500 shown in Figure 5 and its related description. For example, the housing structure 1310 of the microphone 1300 may be the same as or similar to the housing structure 510 of the microphone 500. Also, for example, the first acoustic cavity 1330, the second acoustic cavity 1340, and the cavity 1350 of the microphone 1300 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the cavity 550 of the microphone 500, respectively. For more structures of the microphone 1300 (e.g., the hole part 1311, the vibration transmission part 1323, the acoustic-electric conversion element 1320, etc.), reference may be made to Figure 5 and its related description.

[0098] In some embodiments, Figure 13 the microphone 1300 shown in Figure 5The main difference of the microphone 500 shown lies in the vibration pickup unit 1322. In some embodiments, the vibration pickup unit 1322 may include a first vibration pickup unit 13221, a second vibration pickup unit 13222, and a third vibration pickup unit 13223. In some embodiments, the first vibration pickup unit 13221, the vibration transmission unit 1323, and the first vibration pickup unit 13221 are arranged in sequence from top to bottom. Specifically, the lower surface of the first vibration pickup unit 13221 is connected to the upper surface of the vibration transmission unit 1323, and the upper surface of the second vibration pickup unit 13222 is connected to the lower surface of the vibration transmission unit 1323. A cavity 1350 may be formed among the first vibration pickup unit 13221, the second vibration pickup unit 13222, and the vibration transmission unit 1323, and the acoustic-electric conversion element 1320 is located in the cavity 1350. In some embodiments, the third vibration pickup unit 13223 is connected between the vibration transmission unit 1323 and the inner wall of the housing structure 1310. When the microphone 1300 works, the sound signal can enter the first acoustic cavity 1330 through the hole 1311 and act on the vibration pickup unit 1322, causing the third vibration pickup unit 13223 to vibrate. The third vibration pickup unit 13223 transmits the vibration to the acoustic-electric conversion element 1320 through the vibration transmission unit 1323.

[0099] In some embodiments, the third vibration pickup unit 13223 may include one or more thin film structures that are adapted to the vibration transmission unit 1323 and the housing structure 1310. For example, when both the housing structure 1310 and the vibration transmission unit 1323 are cylindrical structures, the third vibration pickup unit 13223 may be an annular thin film structure, and the outer wall on the circumferential side of the annular thin film structure is connected to the housing structure 1310, and the inner wall on the circumferential side of the annular thin film structure is connected to the vibration transmission unit 1323. Another example is that when the housing structure 1310 is a cylindrical structure and the vibration transmission unit 1323 is a cuboid structure, the third vibration pickup unit 13223 may be a circular thin film structure with a rectangular hole in the central part. The outer wall on the circumferential side of the thin film structure is connected to the housing structure 1310, and the inner wall of the thin film structure is connected to the vibration transmission unit 1323. It should be noted that the shape of the third vibration pickup unit 13223 is not limited to the aforementioned annular and rectangular shapes, and may also be other shaped thin film structures, such as regular and / or irregular shapes like pentagons and hexagons. The shape and structure of the third vibration pickup unit 13223 can be adaptively adjusted according to the shapes of the housing structure 1310 and the vibration transmission unit 1323.

[0100] In some embodiments, the material of the third vibration pickup unit 13223 may include, but is not limited to, one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, the semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, etc. In some embodiments, the metal materials may include, but are not limited to, copper, aluminum, chromium, titanium, gold, etc. In some embodiments, the metal alloys may include, but are not limited to, copper-aluminum alloy, copper-gold alloy, titanium alloy, aluminum alloy, etc. In some embodiments, the organic materials may include, but are not limited to, polyimide, parylene, PDMS, silicone gel, silica gel, etc.

[0101] In some embodiments, the material of the first vibration pickup unit 13221 and / or the material of the second vibration pickup unit 13222 may be a flexible material. When the materials of the first vibration pickup unit 13221 and the second vibration pickup unit 13222 and the material of the third vibration pickup unit 13223 are all flexible materials. In this case, the first vibration pickup unit 13221 and the second vibration pickup unit 13222, as part of the vibration pickup unit 1322 (i.e., the first vibration pickup unit 13221 and the second vibration pickup unit 13222 are used to pick up vibration signals), can be deformed under the action of the air vibration in the first acoustic cavity 1330. In some embodiments, the material of the first vibration pickup unit 13221 and the material of the second vibration pickup unit 13222 may be rigid materials. In this case, the first vibration pickup unit 13221 and the second vibration pickup unit 13222 do not deform under the action of the air vibration in the first acoustic cavity 1330. In some embodiments, the first vibration pickup unit 13221 and the second vibration pickup unit 13222 being rigid materials can enable the volume of the cavity 1350 to remain substantially constant when the microphone 1300 works, which can avoid the influence of the volume change of the cavity 1350 on the acoustic-electric conversion element 1320, and further ensure that the acoustic-electric conversion element 1320 resonates within the required frequency range.

[0102] In some embodiments, the microphone 1300 may further include one or more membrane structures (not shown in the figure), and the membrane structures may be located on the upper surface and / or the lower surface of the acoustic-electric conversion element 1320. For the detailed content of the membrane structure, reference can be made to Figure 10 and its related description, which will not be elaborated here.

[0103] Figure 14 is a schematic structural diagram of a microphone shown according to some embodiments of the present application. As Figure 14 shown, the microphone 1400 may include a housing structure 1410, an acoustic-electric conversion element 1420, and a vibration pickup unit 1422. Figure 14 The microphone 1400 shown in Figure 8is the same as or similar to the microphone 800 shown. For example, the housing structure 1410 of the microphone 1400 may be the same as or similar to the housing structure 810 of the microphone 800. Also, for example, the first acoustic cavity 1430, the second acoustic cavity 1440, and the cavity 1450 of the microphone 1400 may be the same as or similar to the first acoustic cavity 830, the second acoustic cavity 840, and the cavity 850 of the microphone 800, respectively. For more structures of the microphone 1400 (such as the hole portion 1411, the vibration transfer portion 1423, the acoustic-electric conversion element 1420, etc.), reference can be made to Figure 8 and its related description.

[0104] In some embodiments, Figure 14 the main difference between the microphone 1400 shown in Figure 8 and the microphone 800 shown in Figure 13 lies in the vibration pickup portion 1422. In some embodiments, the vibration pickup portion 1422 may include a first vibration pickup portion 14221, a second vibration pickup portion 14222, and a third vibration pickup portion 14223. In some embodiments, the first vibration pickup portion 14221, the second vibration pickup portion 14222, and the third vibration pickup portion 14223 are arranged in sequence from top to bottom. Specifically, the lower surface of the first vibration pickup portion 14221 may be connected to the upper surface of the vibration transfer portion 1423, the upper surface of the second vibration pickup portion 14222 may be connected to the lower surface of the vibration transfer portion 1423, and a cavity 1450 may be formed between the first vibration pickup portion 14221, the second vibration pickup portion 14222, and the vibration transfer portion 1423, and the acoustic-electric conversion element 1420 is located in the cavity 1450. In some embodiments, the third vibration pickup portion 14223 is connected between the vibration transfer portion 1423 and the inner wall of the housing structure 1410. When the microphone 1400 works, the sound signal can enter the first acoustic cavity 1430 through the hole portion 1411 and act on the third vibration pickup portion 14223 to cause vibration, and the third vibration pickup portion 14223 transfers the vibration to the acoustic-electric conversion element 1420 through the vibration transfer portion 1423. For the detailed content of the third vibration pickup portion 14223, reference can be made to

[0105] Figures 10 - 12 and its related description, which will not be elaborated here.

[0106] Figure 15 Figure 15 is a schematic structural diagram of a microphone shown according to some embodiments of the present application. As Figure 15As shown, the microphone 1500 may include a housing structure 1510, an acoustic-electric conversion element 1520, and a vibration pickup portion 1522. Figure 15 The microphone 1500 shown in Figure 13 may be the same as or similar to the microphone 1300 shown in Figure 13 and its related description. For example, the housing structure 1510 of the microphone 1500 may be the same as or similar to the housing structure 1310 of the microphone 1300. Also, for example, the first acoustic cavity 1530, the second acoustic cavity 1540, and the cavity 1550 of the microphone 1500 may be the same as or similar to the first acoustic cavity 1330, the second acoustic cavity 1340, and the cavity 1350 of the microphone 1300, respectively. Further, for example, the vibration pickup portion 1522 (e.g., the first vibration pickup portion 15221, the second vibration pickup portion 15222, the third vibration pickup portion 15223) of the microphone 1500 may be the same as or similar to the vibration pickup portion 1322 (e.g., the first vibration pickup portion 13221, the second vibration pickup portion 13222, the third vibration pickup portion 13223) of the microphone 1300. More structures of the microphone 1500 (e.g., the hole portion 1511, the vibration transfer portion 1523, the acoustic-electric conversion element 1520, etc.) can be referred to

[0107] In some embodiments, Figure 15 the main difference between the microphone 1500 shown in Figure 13 and the microphone 1300 shown in

[0108] is that the microphone 1500 may further include one or more support structures 1560. In some embodiments, the support structure 1560 may be disposed in the cavity 1550. The upper surface of the support structure 1560 may be connected to the lower surface of the first vibration pickup portion 15221, and the lower surface of the support structure 1560 may be connected to the upper surface of the second vibration pickup portion 15222. On the one hand, by disposing the support structure 1560 in the cavity, and connecting the support structure 1560 to the first vibration pickup portion 15221 and the second vibration pickup portion 15222 respectively, the stiffness of the first vibration pickup portion 15221 and the second vibration pickup portion 15222 can be further improved, such that the first vibration pickup portion 15221 and the second vibration pickup portion 15222 are not deformed due to the air vibration in the first acoustic cavity 1530, thereby reducing the vibration modes of the internal components (e.g., the first vibration pickup portion 15221, the second vibration pickup portion 15222) of the microphone 1500. On the other hand, by connecting the support structure 1560 to the first vibration pickup portion 15221 and the second vibration pickup portion 15222 respectively, the reliability of the microphone 1500 under overload conditions can also be improved.In some embodiments, the shape of the support structure 1560 may be a regular and / or irregular structure such as a plate-like structure, a cylinder, a frustum of a cone, a cuboid, a frustum of a pyramid, a hexahedron, etc. In some embodiments, the material of the support structure 1560 may include, but is not limited to, one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, the semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, etc. In some embodiments, the metal materials may include, but are not limited to, copper, aluminum, chromium, titanium, gold, etc. In some embodiments, the metal alloys may include, but are not limited to, copper-aluminum alloy, copper-gold alloy, titanium alloy, aluminum alloy, etc. In some embodiments, the organic materials may include, but are not limited to, polyimide, parylene, PDMS, silicone gel, silica gel, etc.

[0109] Referring Figure 15 , in some embodiments, the second spacing d2 between the free end (i.e., the end suspended in the cavity 1550) of the acoustic-electric conversion element 1520 and the support structure 1560 is not less than 2 μm to prevent the acoustic-electric conversion element 1520 from colliding with the support structure 1560 during vibration. At the same time, when the second spacing d2 is small (for example, the second spacing d2 is not greater than 20 μm), the overall volume of the microphone 1500 can be effectively reduced. In some embodiments, the second spacing d2 between the free ends of different acoustic-electric conversion elements 1520 (for example, cantilever beam structures of different lengths) and the support structure 1560 may be different. In some embodiments, by designing support structures 1560 with different shapes and sizes and adjusting the position of the support structure 1560, a plurality of acoustic-electric conversion elements 1520 (for example, cantilever beam structures) can be closely arranged in the cavity 1550, so that the microphone 1500 has a smaller overall size. Figure 16A and Figure 16B are cross-sectional schematic diagrams of the microphone in different directions according to some embodiments of the present application. As Figure 16A and Figure 16B shown, when the support structure 1560 is an elliptical cylinder, the support structure 1560 and the vibration transmission part form an annular or similar annular cavity in the cavity 1550 and the vibration pickup part, and a plurality of acoustic-electric conversion elements 1520 are located in the cavity and are spaced along the circumferential side of the support structure 1560. In some embodiments, the support structure 1560 may be located at the central position of the cavity 1550. For example, Figure 17A is a cross-sectional schematic diagram of the microphone according to some embodiments of the present application. As Figure 17A shown, the support structure 1560 is located at the central position of the cavity 1550. The central position here may be the geometric center of the cavity 1550. In some embodiments, the support structure 1560 may also be disposed at a position in the cavity 1550 close to either end of the vibration transmission part 1523. For example, Figure 17Bis a cross-sectional schematic diagram of a microphone shown in some embodiments of the present application, as Figure 17B shown, the support structure 1560 is located at a position on the side wall L of the cavity 1550 close to the vibration transfer portion 1523. It should be noted that the shape, arrangement, position, material, etc. of the support structure 1560 can be adaptively adjusted according to the length, quantity, and distribution mode, etc. of the acoustic-electric conversion element 1520, and no further limitation is made here.

[0110] In some embodiments, the microphone 1500 may further include one or more membrane structures (not shown in the figure), and the membrane structure may be disposed on the upper surface and / or the lower surface of the acoustic-electric conversion element 1520. In some embodiments, a hole through which the support structure 1560 passes may be provided at the middle position of the membrane structure, and the hole may have the same or different cross-sectional shapes as the support structure. In some embodiments, the peripheral side wall of the support structure 1560 may be connected to the peripheral portion of the hole in the membrane structure, or may not be connected to the peripheral portion of the hole in the membrane structure. For more descriptions about the shape, material, structure, etc. of the membrane structure, reference can be made to Figure 10 and its related descriptions.

[0111] It should be noted that the support structure can also be applied to microphones in other embodiments. For example, it can be applied to Figure 5 the microphone 500 shown in Figure 8 the microphone 800 shown in Figure 10 the microphone 1000 shown in Figure 11 the microphone 1100 shown in Figure 12 the microphone 1200 shown in. When the support structure is applied to other microphones, the shape, position, and material of the support structure can be adaptively adjusted according to specific circumstances.

[0112] Figure 18 is a structural schematic diagram of a microphone shown in some embodiments of the present application. As Figure 18 shown, the microphone 1800 may include a housing structure 1810, an acoustic-electric conversion element 1820, and a vibration pickup portion 1822. Figure 18 The microphone 1800 shown in Figure 14is the same as or similar to the microphone 1400 shown in. For example, the housing structure 1810 of the microphone 1800 may be the same as or similar to the housing structure 1410 of the microphone 1400. Also, for example, the first acoustic cavity 1830, the second acoustic cavity 1840, and the cavity 1850 of the microphone 1800 may be the same as or similar to the first acoustic cavity 1430, the second acoustic cavity 1440, and the cavity 1450 of the microphone 1400, respectively. Further, for example, the vibration pickup part 1822 (e.g., the first vibration pickup part 18221, the second vibration pickup part 18222, the third vibration pickup part 18223) of the microphone 1800 may be the same as or similar to the vibration pickup part 1422 (e.g., the first vibration pickup part 14221, the second vibration pickup part 14222, the third vibration pickup part 14223) of the microphone 1400. For more structures of the microphone 1800 (e.g., the hole part 1811, the vibration transfer part 1823, the acoustic-electric conversion element 1820, etc.), reference may be made to Figure 14 and its related description.

[0113] In some embodiments, Figure 18 the main difference between the microphone 1800 shown in and Figure 14 the microphone 1400 shown in is that the microphone 1800 may further include a support structure 1860. In some embodiments, the upper surface of the support structure 1860 may be connected to the lower surface of the first vibration pickup part 18221, and the lower surface of the support structure 1860 may be connected to the upper surface of the second vibration pickup part 18222. In some embodiments, the free ends (i.e., the ends suspended in the cavity 1850) of at least two acoustic-electric conversion elements 1820 may have a second spacing d2 from the support structure 1860. For more descriptions of the support structure 1860, reference may be made to Figure 15 and its related description.

[0114] In some embodiments, the microphone 1800 may further include one or more membrane structures (not shown in the figure). For a detailed description of the membrane structure of the microphone 1800 including the support structure 1860, reference may be made to Figure 11 , Figure 12 , Figure 15 and its related description.

[0115] It should be noted that the support structure in this embodiment is not limited to Figure 15 and Figure 18 the microphones described in, and the support structure can be applied to the microphones described in other embodiments. For example, Figure 5 , Figure 8 , Figure 10 , Figure 11 , Figure 12 etc. The microphones are not limited herein.

[0116] Figure 19 is a schematic structural diagram of a microphone according to some embodiments of the present application. In some embodiments, the microphone may be a bone conduction microphone, such as Figure 19 shown, the bone conduction microphone 1900 may include a housing structure 1910, a sound-electricity conversion element 1920, and a vibration pickup portion 1922. Figure 19 The components of the bone conduction microphone 1900 shown may be the same as or similar to those of the Figure 15 microphone 1500 shown, for example, the sound-electricity conversion element 1920, the first acoustic cavity 1930, the second acoustic cavity 1940, the cavity 1950, the vibration transfer portion 1923, the support structure 1960, etc.

[0117] In some embodiments, the difference between the bone conduction microphone 1900 and the Figure 15 microphone 1500 shown lies in the different vibration pickup methods. The vibration pickup portion 1522 of the microphone 1500 (for example, the first vibration pickup portion 15221, the second vibration pickup portion 15222, the third vibration pickup portion 195223) picks up the vibration signal of the air transmitted into the first acoustic cavity 1530 through the hole portion 1511, while the housing structure 1910 of the bone conduction microphone 1900 does not include a hole portion. The bone conduction microphone 1900 generates a vibration signal through the vibration pickup portion 1922 (for example, the third vibration pickup portion 19223) in response to the vibration of the housing structure 1910. Specifically, the housing structure 1910 may generate vibration based on an external sound signal. The third vibration pickup portion 19223 may generate a vibration signal in response to the vibration of the housing structure 1910, and transmit the vibration signal to the sound-electricity conversion element 1920 through the vibration transfer portion 1923. The sound-electricity conversion element 1920 converts the vibration signal into an electrical signal and outputs it.

[0118] Figure 20 is a schematic structural diagram of a microphone according to some embodiments of the present application. As Figure 20 shown, the bone conduction microphone 2000 may include a housing structure 2010, a sound-electricity conversion element 2020, and a vibration pickup portion 2022. Figure 20 The components of the bone conduction microphone 2000 shown may be the same as or similar to those of the Figure 18 microphone 1800 shown, for example, the sound-electricity conversion element 2020, the first acoustic cavity 2030, the second acoustic cavity 2040, the cavity 2050, the vibration transfer portion 2023, the support structure 2060, etc.

[0119] In some embodiments, the bone conduction microphone 2000 and the Figure 18The difference of the microphone 1800 shown lies in the different vibration pickup methods. The vibration pickup part 1822 of the microphone 1800 (for example, the first vibration pickup part 18221, the second vibration pickup part 18222, the third vibration pickup part 18223) picks up the vibration signal of the air transmitted into the first acoustic cavity 1830 through the hole part 1811, while the housing structure 2010 of the bone conduction microphone 2000 does not include a hole part. The bone conduction microphone 2000 generates a vibration signal through the vibration pickup part 2022 (for example, the third vibration pickup part 20223) in response to the vibration of the housing structure 2010. In some embodiments, the housing structure 2010 can generate vibration based on an external sound signal. The third vibration pickup part 20223 can generate a vibration signal in response to the vibration of the housing structure 2010, and transmit the vibration signal to the acoustic-electric conversion element 2020 through the vibration transmission part 2023. The acoustic-electric conversion element 2020 converts the vibration signal into an electric signal and outputs it.

[0120] It should be noted that Figure 5 the microphone 500 shown, Figure 8 the microphone 800 shown, Figure 10 the microphone 1000 shown, Figure 11 the microphone 1100 shown, Figure 12 the microphone 1200 shown can also be used as a bone conduction microphone. For example, the microphone here can be not provided with a hole part. The housing structure can generate vibration based on an external sound signal. The first vibration pickup part or the second vibration pickup part can generate a vibration signal in response to the vibration of the housing structure, and transmit the vibration to the acoustic-electric conversion element through the vibration transmission part. The acoustic-electric conversion element converts the vibration signal into an electric signal and outputs it.

[0121] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only an example and does not constitute a limitation to this application. Although not explicitly stated here, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are proposed in this application, so such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of this application.

[0122] Meanwhile, this application uses specific terms to describe the embodiments of this application. Such as "one embodiment", "an embodiment", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "an embodiment" or "one embodiment" or "an alternative embodiment" mentioned twice or more at different positions in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application can be appropriately combined.

[0123] In addition, those skilled in the art can understand that various aspects of this application can be illustrated and described by several patentable types or situations, including any new and useful processes, machines, products, or combinations of substances, or any new and useful improvements to them. Accordingly, various aspects of this application can be executed entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. The above-mentioned hardware or software can all be referred to as "data blocks", "modules", "engines", "units", "components", or "systems". In addition, various aspects of this application may be embodied as a computer product located in one or more computer-readable media, which includes computer-readable program code.

[0124] A computer storage medium may contain a propagated data signal containing computer program code, such as on a baseband or as part of a carrier wave. This propagated signal may have various forms of manifestation, including electromagnetic form, optical form, etc., or a suitable combination of forms. A computer storage medium can be any computer-readable medium other than a computer-readable storage medium, which can be connected to an instruction execution system, apparatus, or device to implement communication, propagation, or transmission for use of a program. The program code located on the computer storage medium can be propagated through any suitable medium, including radio, cable, fiber optic cable, RF, or similar media, or any combination of the above media.

[0125] The computer program code required for the operation of each part of this application can be written in any one or more programming languages, including object-oriented programming languages such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, etc., conventional procedural programming languages such as C language, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages such as Python, Ruby, and Groovy, or other programming languages. This program code can run entirely on the user's computer, or run as an independent software package on the user's computer, or run partially on the user's computer and partially on a remote computer, or run entirely on a remote computer or processing device. In the latter case, the remote computer can be connected to the user's computer through any network form, such as a local area network (LAN) or a wide area network (WAN), or connected to an external computer (for example, through the Internet), or in a cloud computing environment, or used as a service such as software as a service (SaaS).

[0126] In addition, unless clearly stated in the claims, the order of the processing elements and sequences, the use of numerical and alphabetical characters, or the use of other names described in this application are not used to limit the order of the processes and methods of this application. Although some currently useful embodiments of the invention are discussed through various examples in the above disclosure, it should be understood that such details are for illustrative purposes only. The appended claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that conform to the essence and scope of the embodiments of this application. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only through software solutions, such as installing the described system on existing processing devices or mobile devices.

[0127] Similarly, it should be noted that, in order to simplify the description of this application and thus help the understanding of one or more embodiments of the invention, in the previous description of the embodiments of this application, various features are sometimes grouped into one embodiment, drawing, or description thereof. However, this method of disclosure does not mean that the features required by the subject matter of this application are more than those mentioned in the claims. In fact, the features of the embodiments are less than all the features of the individual embodiments disclosed above.

[0128] In some embodiments, numbers describing the composition and quantity of attributes are used. It should be understood that such numbers used to describe the embodiments are modified by the modifiers "about", "approximate" or "substantially" in some examples. Unless otherwise stated, "about", "approximate" or "substantially" indicate that the stated numbers allow a variation of ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, and these approximate values may change according to the characteristics required by individual embodiments. In some embodiments, the numerical parameters should consider the specified significant digits and adopt the method of retaining the general number of digits. Although the numerical ranges and parameters used to confirm the breadth of the scope in some embodiments of this application are approximate values, in specific embodiments, the setting of such numerical values is as accurate as possible within a feasible range.

[0129] For each patent, patent application, patent application publication, and other materials cited in this application, such as articles, books, specifications, publications, documents, etc., their entire contents are hereby incorporated into this application as references. Except for the application history documents that are inconsistent with or conflict with the content of this application, and except for the documents that limit the broadest scope of the claims of this application (currently or subsequently appended to this application). It should be noted that if there are inconsistencies or conflicts between the descriptions, definitions, and / or uses of terms in the attached materials of this application and the content described in this application, the descriptions, definitions, and / or uses of terms in this application shall prevail.

[0130] Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of this application. Other variations may also fall within the scope of this application. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this application may be regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly presented and described in this application.

Claims

1. A microphone, characterized in that, Comprising: A housing structure; A vibration pickup unit that generates vibrations in response to an external sound signal transmitted to the housing structure; And At least two acoustic-electric conversion elements configured to receive the vibrations of the vibration pickup unit respectively and generate electrical signals, wherein the at least two acoustic-electric conversion elements have different frequency responses to the vibrations of the vibration pickup unit, and the difference in resonance frequencies between at least two of the at least two acoustic-electric conversion elements is greater than 2000 Hz; The vibration pickup unit includes a first vibration pickup unit and a second vibration pickup unit arranged in sequence from top to bottom. The first vibration pickup unit and the second vibration pickup unit are connected to the housing structure through their peripheral sides. A vibration transmission part in a tubular structure is provided between the first vibration pickup unit and the second vibration pickup unit. The vibration transmission part, the first vibration pickup unit, and the second vibration pickup unit form a cavity. The first vibration pickup unit and the second vibration pickup unit generate vibrations in response to an external sound signal transmitted to the housing structure; alternatively, the vibration pickup unit includes a first vibration pickup unit, a second vibration pickup unit, and a third vibration pickup unit. The first vibration pickup unit and the second vibration pickup unit are arranged opposite to each other up and down. A vibration transmission part in a tubular structure is provided between the first vibration pickup unit and the second vibration pickup unit. The vibration transmission part, the first vibration pickup unit, and the second vibration pickup unit form a cavity. The third vibration pickup unit is connected between the vibration transmission part and the inner wall of the housing structure. The third vibration pickup unit generates vibrations in response to an external sound signal transmitted to the housing structure.

2. The microphone according to claim 1, wherein The at least two acoustic-electric conversion elements are directly or indirectly connected to the first vibration pickup unit.

3. The microphone according to claim 1, characterized in that, Each of the acoustic-electric conversion elements includes a cantilever beam structure. One end of the cantilever beam structure is connected to the inner wall of the vibration transmission part, and the other end of the cantilever beam structure is suspended in the cavity; wherein, the cantilever beam structure deforms based on the vibration signal to convert the vibration signal into an electrical signal.

4. The microphone according to claim 3, characterized in that, The different cantilever beam structures are spaced apart at the inner wall of the vibration transmission part.

5. The microphone according to claim 3, characterized in that, The sizes or materials of the cantilever beam structures corresponding to the at least two acoustic-electric conversion elements are different.

6. The microphone according to claim 5, characterized in that, The at least two acoustic-electric conversion elements include a first cantilever beam structure and a second cantilever beam structure. The length of the first cantilever beam in the direction perpendicular to its vibration direction is greater than the length of the second cantilever beam in the direction perpendicular to its vibration direction. The resonance frequency corresponding to the first cantilever beam is lower than the resonance frequency corresponding to the second cantilever beam.

7. The microphone according to claim 2, characterized in that, Each of the acoustic-electric conversion elements includes a first cantilever beam structure and a second cantilever beam structure. The first cantilever beam structure and the second cantilever beam structure are arranged opposite to each other, and there is a first distance between the first cantilever beam structure and the second cantilever beam structure; wherein, the first distance between the first cantilever beam structure and the second cantilever beam structure changes based on the vibration signal to convert the vibration signal into an electrical signal.

8. The microphone according to claim 7, characterized in that, The first cantilever beam structure and the second cantilever beam structure corresponding to each acoustic-electric conversion element are distributed at intervals on the inner wall on the periphery of the vibration transmission part.

9. The microphone according to claim 8, characterized in that, The stiffness of the first cantilever beam structure is different from the stiffness of the second cantilever beam structure.

10. The microphone according to claim 1, characterized in that, The microphone includes a membrane structure, and the membrane structure is located on the upper surface and / or the lower surface of the acoustic-electric conversion element.

11. The microphone according to claim 10, wherein The membrane structure completely or partially covers the upper surface and / or the lower surface of the acoustic-electric conversion element.

12. The microphone according to claim 1, characterized in that, The microphone includes a support structure. One end of the support structure is connected to the first vibration pickup part of the vibration pickup part, and the other end of the support structure is connected to the second vibration pickup part of the vibration pickup part. The free ends of the at least two acoustic-electric conversion elements have a second distance from the support structure.

13. The microphone according to claim 1, characterized in that, The microphone further includes a sampling module configured to convert the electrical signals output by different acoustic-electric conversion elements into digital signals; wherein, the sampling module samples the electrical signals output by different acoustic-electric conversion elements at different sampling frequencies.

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