Reel-to-reel circuit board manufacturing apparatus
By employing a design in the roll circuit board manufacturing equipment where the rollers rotate separately from the film body, combined with the coating and bearing structure, the problems of friction and speed difference between the substrate and the rollers are solved, achieving efficient circuit board manufacturing and reducing the risk of damage.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-08-26
- Publication Date
- 2026-03-17
AI Technical Summary
In the roll manufacturing process, friction and speed differences between the substrate and the roller can cause damage to the circuit board, especially thin circuit boards, which are at higher risk of damage. Existing technologies are unable to effectively reduce this damage.
The design employs a roller rotating separately from the membrane body. The membrane body rotates together with the substrate but separately from the roller, and a coating is formed on the roller surface to reduce friction. At the same time, the membrane body moves in the width direction of the roller to adjust the tension difference, and bearings or coatings are used to reduce friction.
It effectively reduces damage to the substrate surface circuitry, especially to thin circuit boards, thereby improving the reliability and quality of circuit board manufacturing.
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Figure CN115915610B_ABST
Abstract
Description
[0001] Cross-references to related applications
[0002] This application is based on and claims priority to Korean Patent Application No. 10-2021-0130306, filed on September 30, 2021, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field
[0003] One or more embodiments of this disclosure relate to a reel-to-reel circuit board manufacturing apparatus. Background Technology
[0004] The industry group that manufactures circuit boards, where circuits are formed on reels or films, includes industries related to lead frames, flexible printed circuit boards (FPCBs), chips on film (COF), PCBs, etc. Semiconductor packaging is accomplished through the following processes: forming photoresist on a substrate; forming a circuit pattern layer through electroplating or etching; forming a solder resist layer on the circuit pattern layer; mounting a semiconductor chip; electrically connecting the circuit pattern layer and the semiconductor chip; and molding using molding materials.
[0005] Semiconductor circuit boards can be classified into rigid substrates such as those made of flame retardant-4 (FR-4) or bismaleimide triazine (BT) and flexible substrates such as polyimide. However, similar to flexible substrates, various rigid substrates with reduced thickness can be manufactured using roll-to-roll manufacturing methods. Specifically, thin semiconductor packages have recently been developed, and the thickness of the circuit boards has also been reduced. Therefore, roll-to-roll processes can be applied.
[0006] Methods for manufacturing circuit boards can be categorized into panel manufacturing methods and roll manufacturing methods. According to the panel manufacturing method, individual panels are conveyed and processed separately, and then laminated after finishing processes. According to the roll manufacturing method, a roll is wound onto a cylindrical paper tube and continuously conveyed for processing, and then wound into a roll after the completion of the process.
[0007] Figure 1A and Figure 1B This is a diagram used to describe the problems of a roll manufacturing method according to related technologies. Figure 1A A graph showing the difference in rotational speed between the roller and the substrate, and Figure 1B A diagram illustrating the velocity difference of the substrate in the width direction of the roller.
[0008] According to the roll manufacturing method, the structural contact between the substrate and the component in the device is less than that in the panel process, and therefore, the circuit is less likely to be damaged. However, in the roll manufacturing method, to prevent tension and skew, the roll may not be wound directly after the process, and the substrate may be wound up and down on various rollers. Since the product comes into contact with the rollers, the risk of damaging the circuit can increase. Therefore, the roller speed needs to match the substrate speed, and thus the substrate should not rub against the surface of the rollers.
[0009] However, since the substrate does not contact the roller parallel to it, localized friction can occur between the substrate and the roller, and as... Figure 1A As shown, the speed V1 of the substrate and the speed V2 of the roller may not be exactly equal to each other. In addition, even when the free roller rotates according to the speed of the substrate by freely driving the drive roller using the free roller, when there is a difference between the speed of the substrate and the roller, the roller with a relatively larger weight may still not match the speed of the substrate, and therefore the substrate and the roller may rub against each other.
[0010] In addition, such as Figure 1B As shown, the tensions on the left and right sides of the substrate contacting the roller can be different from each other, and therefore the difference between the rates (V3 and V4) on the left and right sides of the substrate can occur locally.
[0011] Furthermore, the drive roller can be made of plastic or metal. In this case, even with precise surface polishing, there are still limitations on controlling the surface roughness of the roller. The roughness of metal materials can be controlled by coating or precise polishing, but due to their heavy weight, the circuitry, which measures tens of micrometers in size, is inevitably damaged when it rubs against the roller. Summary of the Invention
[0012] One or more embodiments of this disclosure provide a roll-to-roll circuit board manufacturing apparatus capable of reducing damage to the substrate.
[0013] However, the above technical features are exemplary, and the scope of this disclosure is not limited thereto.
[0014] Additional aspects will be set forth in part in the description which follows, and will be apparent in part from the description, or may be learned by practice of embodiments of this disclosure.
[0015] A roll-to-roll circuit board manufacturing apparatus according to an embodiment of the present disclosure includes: a roller having a cylindrical shape, configured to rotate and a substrate wound thereon; and a film body formed between the roller and the substrate to surround the surface of the roller and rotatable, wherein the roller and the film body rotate separately from each other.
[0016] The frictional force between the membrane body and the substrate can be greater than the frictional force between the membrane body and the roller.
[0017] The membrane body may include a sheet membrane.
[0018] The reel-to-reel circuit board manufacturing equipment may further include a coating portion applied to the surface of the roller.
[0019] The coating portion can be positioned between the roller and the film body, and can rotate as a whole with the roller.
[0020] The coating may contain a fluoride-based release coating agent.
[0021] The coating may contain a silicone-based release coating agent.
[0022] The membrane body can move along the width of the rollers.
[0023] The roller may include a first roller and a second roller, and the membrane body may include a first membrane body and a second membrane body, wherein the first membrane body may surround the first roller and the second membrane body may surround the second roller.
[0024] The roll-to-roll circuit board manufacturing equipment may further include: a first coating portion disposed between a first roller and a first film body; and a second coating portion disposed between a second roller and a second film body.
[0025] The roll-to-roll circuit board manufacturing equipment may further include bearings arranged between the rollers and the film body.
[0026] Other aspects, features, and advantages of this disclosure will become better understood from the accompanying drawings, claims, and embodiments. Attached Figure Description
[0027] The above and other aspects, features, and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, wherein:
[0028] Figure 1A and Figure 1B This is a diagram used to describe the problems of a roll manufacturing method according to related technologies. Figure 1A A graph showing the difference in rotational speed between the roller and the substrate, and Figure 1B A graph showing the difference between the speeds of the substrate and the speeds of the rollers in the width direction.
[0029] Figure 2 This is a diagram of a reel-to-reel circuit board manufacturing apparatus according to an embodiment of the present disclosure.
[0030] Figure 3A and Figure 3B This is a diagram illustrating the structure of a scroll according to an embodiment of the present disclosure.
[0031] Figure 4 This is a diagram illustrating the movement structure of the membrane body in the width direction according to an embodiment of the present disclosure.
[0032] Figure 5 This is a diagram illustrating a belt roller structure according to another embodiment of the present disclosure.
[0033] Figure 6 This is a diagram illustrating the structure of a bearing roller according to another embodiment of the present disclosure.
[0034] Explanation of icon numbers
[0035] 10: Substrate;
[0036] 100: Scroll;
[0037] 110, 110": Roller;
[0038] 110a': First roller;
[0039] 110b': Second roller;
[0040] 120, 120": Membrane body;
[0041] 120a': First membrane body;
[0042] 120b': Second membrane body;
[0043] 130: Coating section;
[0044] 130a': First coating portion;
[0045] 130b': Second coating portion;
[0046] 140”: Bearing;
[0047] T: Tension;
[0048] V1, V2, V3, V4: speed. Detailed Implementation
[0049] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein similar reference numerals refer to similar elements throughout the text. In this respect, embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, embodiments are described below with reference to the accompanying drawings only to explain various aspects of this specification. As used herein, the term “and / or” includes any and all combinations of one or more of the associated enumerations. When preceding a list of elements, expressions such as “at least one of” modify the entire list of elements rather than individual elements of the list.
[0050] Because this disclosure allows for various variations and numerous embodiments, specific embodiments will be shown in the accompanying drawings and described in detail in written form. However, this is not intended to limit this disclosure to a particular mode of practice, and it should be understood that this disclosure covers all modifications, equivalents, and / or substitutions without departing from its spirit and technical scope. In describing this disclosure, similar reference numerals refer to the same elements even if elements are provided in another embodiment.
[0051] In the following description, embodiments will be presented in more detail with reference to the accompanying drawings. Regardless of the drawing numbers, the same or corresponding components are presented with the same reference numerals, and redundant explanations are omitted.
[0052] While terms such as "first" and "second" can be used to describe various components, such components are not limited to these terms. These terms are only used to distinguish one component from another.
[0053] Unless they have a distinctly different meaning in the context, expressions used in the singular form cover expressions used in the plural form.
[0054] In this specification, it should be understood that the terms “including,” “having,” and “comprising” are intended to indicate the presence of features, numbers, steps, actions, components, parts, or combinations thereof disclosed in the specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, actions, components, parts, or combinations thereof may be present or added.
[0055] In the accompanying drawings, the dimensions of the components may be enlarged for ease of explanation. In other words, since the dimensions and thicknesses of the components are arbitrarily shown in the drawings for ease of explanation, the following embodiments are not limited thereto.
[0056] When an embodiment can be implemented in different ways, a particular processing order may be performed differently from the described order. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of the described process.
[0057] The terminology used in this specification is for describing specific embodiments only and is not intended to limit this disclosure. It should be understood in this specification that the terms "including," "having," and "comprising" are intended to indicate the presence of features, numbers, steps, actions, components, parts, or combinations thereof disclosed in this specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, actions, components, parts, or combinations thereof may be present or added.
[0058] In the following text, see references Figure 2 , Figure 3A and Figure 3B The following describes a reel-to-reel circuit board manufacturing apparatus according to embodiments of the present disclosure.
[0059] Figure 2 This is a diagram of a reel-to-reel circuit board manufacturing apparatus according to an embodiment of the present disclosure. Figure 3A and Figure 3B This is a diagram illustrating the structure of a scroll according to an embodiment of the present disclosure.
[0060] refer to Figure 2 , Figure 3A and Figure 3B The roll-to-roll circuit board manufacturing apparatus according to an embodiment of the present disclosure includes: a roller 110, formed as a cylinder, rotatable, on which a substrate 10 is wound; and a film body 120, formed between the roller 110 and the substrate 10 to surround the surface of the roller 110 and rotatable. Here, the roller 110 and the film body 120 rotate separately.
[0061] Specifically, the frictional force between the membrane body 120 and the substrate 10 can be greater than the frictional force between the membrane body 120 and the roller 110. That is, the membrane body 120, formed to surround the surface of the roller 110, rotates together with the substrate 10 and rotates separately from the roller 110, thus ensuring a release characteristic between the rotation of the membrane body 120 and the roller 110. Figure 3A and Figure 3B As shown, the substrate 10 and the film body 120, which rotate together with the substrate 10, can rotate at a rate V1 in one direction, and the roller 110, which rotates separately from the film body 120, can rotate at a rate V2 in one direction or in another direction.
[0062] When the substrate 10 and the film body 120 rotate together at the same speed, the friction between the substrate 10 and the roll can be reduced, and various damages such as scratches to the circuit structures on the surface of the substrate 10, such as photoresist circuits, copper circuits, nickel, gold, etc., can be reduced.
[0063] The membrane body 120 according to an embodiment of the present disclosure may comprise a sheet membrane. Therefore, the increase in roll weight can be reduced by forming the membrane body 120 as a thin and lightweight sheet membrane structure.
[0064] The material of the thin-film can have lower hardness and stiffness than the material forming the substrate. Therefore, during the movement of the substrate, the thin-film can move at the same speed as the substrate with reduced friction.
[0065] According to embodiments of the present disclosure, the coating portion 130 may be further formed on the surface of the roller 110. The coating portion 130 may be disposed between the roller 110 and the film body 120, and may be coupled to the roller 110 to rotate integrally with the roller 110.
[0066] The surface of the coating portion 130 facing the film body 120 is formed to be smooth, which reduces the friction between the film body 120 and the coating portion 130, allowing the film body 120 to slide on the surface of the coating portion 130. Therefore, the film body 120 and the coating portion 130 can rotate separately. As described above, the coating portion 130 with a smooth surface can be formed using a fluorinated release agent or a silicone release agent.
[0067] In the roll-to-roll circuit board manufacturing equipment that forms the film body 120, the substrate 10 and the film body 120 can move at the same speed, thereby reducing the friction between the substrate 10 and the roll 100 and reducing damage to the substrate during the process of manufacturing the circuit substrate.
[0068] In the following text, refer to Figure 4 The following describes a movement structure of the membrane body in the width direction according to an embodiment of the present disclosure. Figure 4 Components not shown may be referenced. Figure 2 , Figure 3A and Figure 3B The description.
[0069] Figure 4 This is a diagram illustrating the movement structure of the membrane body 120 in the width direction according to an embodiment of the present disclosure.
[0070] refer to Figure 4 According to embodiments of the present disclosure, the membrane body 120 can move along the width direction of the roller 110 based on the roller 110. That is, the membrane body 120 moves separately from the roller 110, can rotate separately from the roller 110 along the rotation direction of the roller 110, and can move simultaneously along the width direction of the roller 110.
[0071] During roll-to-roll circuit board manufacturing, the tension on the left and right sides of the substrate wound on the roll and unwound / wound by the left and right sides of the rollers can be different from each other. The above situation is illustrated in... Figure 1BIn the event of the above, the left and right sides of the substrate wound on the spool may move at different speeds, which can then create friction between the substrate and the spool and damage the substrate.
[0072] According to this embodiment, the film body 120, which is formed as a cylinder surrounding the roller 110, is configured to move in the width direction of the roller 110, and thus move together with the substrate 10. The film body 120 is designed to move in the width direction of the roller 110 based on the difference between the tension on the left and right sides of the substrate 10. Therefore, the frictional force between the substrate 10 and the roller 110 in both the width direction and the rotation direction can be reduced.
[0073] In the following text, see references Figure 5 The following describes a belt reel-to-reel circuit board manufacturing apparatus according to another embodiment of the present disclosure. Figure 5 Components not shown and their descriptions may be referenced. Figures 2 to 4 The description.
[0074] Figure 5 This is a diagram illustrating a belt roller structure according to another embodiment of the present disclosure.
[0075] refer to Figure 5 According to another embodiment, the roller includes a first roller 110a' and a second roller 110b', a first membrane body 120a' is formed to surround the first roller 110a', and the second membrane body 120b' can be formed to surround the second roller 110b'.
[0076] In this paper, the first coating portion 130a' is arranged between the first roller 110a' and the first membrane body 120a'; and the second coating portion 130b' can be arranged between the second roller 110b' and the second membrane body 120b'.
[0077] As described above, when the first roller 110a' and the second roller 110b' are formed separately and the substrate 10 is formed to be wound around both the first roller 110a' and the second roller 110b', the friction between the substrate 10 and the rollers can be reduced by the first film body 120a' and the second film body 120b' on the respective rollers. At the same time, the tension T of the substrate 10 wound on the rollers can be adjusted by adjusting the distance between the first roller 110a' and the second roller 110b', thereby preventing the substrate 10 from separating from the rollers.
[0078] In the following text, see references Figure 6 The following describes a bearing-type reel-to-reel circuit board manufacturing apparatus according to another embodiment of the present disclosure. Figure 6 Components not shown and their descriptions may be referenced. Figures 2 to 4 The description.
[0079] Figure 6 This is a diagram illustrating the structure of a bearing roller according to another embodiment of the present disclosure.
[0080] refer to Figure 6 According to another embodiment of the present disclosure, the roll-to-roll circuit board manufacturing apparatus may further include a bearing 140" located between the roller 110" and the film body 120".
[0081] Since the bearing 140” is arranged between the membrane body 120” and the roller 110” instead of the coating portion, the membrane body 120” can be configured to move separately from the roller 110” in the rotational and width directions. Since there is very little friction between the membrane body 120” and the roller 110” due to the bearing 140”, the moving directions and moving speeds of the membrane body 120” and the roller 110” can be completely different from each other.
[0082] The specific embodiments shown and described herein are illustrative examples of embodiments and are not intended to limit the scope of the embodiments in any other way. For the sake of brevity and clarity in describing this disclosure, descriptions of general techniques and structures based on related technologies may be omitted.
[0083] Furthermore, the connecting lines or connectors shown in the accompanying drawings are intended to represent example functional relationships and / or physical or logical couplings between various components. It should be noted that many alternative or additional functional relationships, physical connections, or logical connections may exist in an actual device. Moreover, unless an component is explicitly described as “necessary” or “critical,” no item or component is critical to the practice of this disclosure.
[0084] Throughout this specification, and specifically in the claims, "the" or other similar references may refer to both the singular and plural forms. Unless otherwise defined, the scope defined herein is intended to include values within the individual application scope and may be considered identical to the individual values constituting the scope of the embodiment.
[0085] Furthermore, unless explicitly described in order or in reverse, the operations constituting the method may be performed in a suitable order. Exemplary embodiments are not necessarily limited to the order of operations given in this specification. Unless defined by the appended claims, the examples or exemplary terms used herein (e.g., etc.) merely describe exemplary embodiments in detail and are not intended to limit the embodiments. Moreover, those skilled in the art will readily understand that many substitutions, combinations, and modifications can be made based on the design conditions and factors within the scope of the appended claims and their equivalents.
[0086] In a roll-to-roll circuit board manufacturing apparatus according to an embodiment of the present disclosure, the substrate and the film body can move at the same rate through the film body, which is formed to surround the rollers and rotate.
[0087] Furthermore, in the roll-to-roll circuit board manufacturing apparatus according to embodiments of the present disclosure, the film body can be moved in the width direction of the roller, thereby reducing friction relative to the substrate in both the rotational and width directions of the roller.
[0088] The effects of this disclosure are not limited to those described above, and other effects of this disclosure can be understood from the following description and will become apparent from the embodiments of this disclosure.
[0089] It should be understood that the embodiments described herein are to be considered descriptive in nature only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made to the said embodiments without departing from the spirit and scope of this disclosure as defined by the appended claims.
Claims
1. A reel-to-reel circuit board manufacturing apparatus characterized by comprising: Comprising: a roller having a cylindrical shape configured to rotate and a substrate is wound thereon; and a film body formed between the roller and the substrate to surround a surface of the roller, the film body being rotatable, wherein the roller and the film body rotate separately from each other, the substrate is wound on at least a part of a circumferential surface of the roller along the circumferential surface of the roller, wherein a frictional force between the film body and the substrate is greater than a frictional force between the film body and the roller, the reel-to-reel circuit board manufacturing apparatus further comprises a coating portion coated on the surface of the roller, wherein the coating portion is located between the roller and the film body and rotates integrally with the roller.
2. The reel-to-reel circuit board manufacturing apparatus according to claim 1, wherein the film body includes a sheet film.
3. The reel-to-reel circuit board manufacturing apparatus according to claim 1, wherein the coating portion includes a fluorine-based release agent.
4. The reel-to-reel circuit board manufacturing apparatus according to claim 1, wherein the coating portion includes a silicone-based release agent.
5. The reel-to-reel circuit board manufacturing apparatus according to claim 1, wherein the film body moves in a width direction of the roller based on the roller.
6. The reel-to-reel circuit board manufacturing apparatus according to claim 1, wherein the roller includes a first roller and a second roller, the film body includes a first film body and a second film body, and the first film body surrounds the first roller and the second film body surrounds the second roller.
7. The reel-to-reel circuit board manufacturing apparatus according to claim 6, further comprising a first coating portion disposed between the first roller and the first film body; and a second coating portion disposed between the second roller and the second film body.
8. The reel-to-reel circuit board manufacturing apparatus according to claim 1, further comprising a bearing disposed between the roller and the film body.
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