Display panel, display device, and method for manufacturing display panel
By introducing side recesses into the electrodes of the display panel and utilizing galvanic etching technology, the problem of complex etching processes in the hole area in the prior art has been solved, thereby simplifying the manufacturing process, improving the packaging effect, and extending the service life of the display panel.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-10-31
- Publication Date
- 2026-03-10
AI Technical Summary
In existing technologies, when slots or holes are made in the display screen to integrate photosensitive elements in electronic devices, an additional etching process is required for the hole area of the side-etched structure, which leads to a complex manufacturing process.
Galvanic etching technology is used to introduce side recesses in the first electrode of the display panel. Galvanic etching is used instead of chemical etching to form the hole area side marking, which simplifies the manufacturing process. The recesses are filled with encapsulation material to isolate moisture.
It simplifies the manufacturing process of display panels, improves the packaging effect, extends the service life of display panels, and reduces process steps and costs.
Smart Images

Figure CN115915828B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the display field, and in particular to a display panel, a display device and a preparation method of the display panel. BACKGROUND
[0002] With the rapid development of electronic devices, users have higher and higher requirements for screen ratio, so that the full-screen display of electronic devices has attracted more and more attention in the industry.
[0003] Traditional electronic devices such as mobile phones and tablet computers need to integrate front cameras, receivers and infrared sensing elements. In the prior art, a notch or a hole can be opened on the display screen, and external light can enter the photosensitive element located below the screen through the notch or the hole on the screen. However, in order to confirm that the notch or the hole after punching can still play a role in isolating water vapor, a side etching structure is generally arranged at the hole position, and the side etching structure needs to add a separate hole etching process, so that the preparation process is complex. SUMMARY
[0004] The embodiments of the present application provide a display panel, a display device and a preparation method of the display panel, aiming to simplify the preparation process of the display panel.
[0005] The first aspect of the present application provides a display panel, characterized in that the display panel comprises a first area and a second area surrounding at least part of the first area, and the display panel comprises:
[0006] a substrate;
[0007] a first electrode located on the substrate and surrounding at least part of the first area, the first electrode comprising a first sub-layer and a second sub-layer, the first sub-layer being located on a side of the second sub-layer away from the substrate, a side of the second sub-layer facing the first area being recessed relative to a side of the first sub-layer facing the first area, and / or a side of the second sub-layer away from the first area being recessed relative to a side of the first sub-layer away from the first area;
[0008] a second electrode located on the substrate and arranged in the first area, the second electrode being electrically connected to the first electrode.
[0009] According to the embodiments of the first aspect of the present application, the first electrode further comprises a third sub-layer, the third sub-layer being located on a side of the second sub-layer away from the first sub-layer, a side of the second sub-layer facing the first area being recessed relative to a side of the third sub-layer facing the first area, and / or a side of the second sub-layer away from the first area being recessed relative to a side of the third sub-layer away from the first area.
[0010] According to any one of the preceding embodiments of the first aspect of the present application, the orthographic projection of the first sub-layer on the substrate and the orthographic projection of the third sub-layer on the substrate coincide.
[0011] According to any one of the preceding embodiments of the first aspect of the present application, the first sub-layer and the third sub-layer are made of the same material.
[0012] According to any one of the preceding embodiments of the first aspect of the present application, the metal material of the first sub-layer and the third sub-layer is less active than the metal material of the second sub-layer.
[0013] According to any one of the preceding embodiments of the first aspect of the present application, the material of the first sub-layer and the third sub-layer comprises titanium (Ti), and the material of the second sub-layer comprises aluminum (Al).
[0014] According to any one of the preceding embodiments of the first aspect of the present application, the display panel further comprises a conductive portion, and the first electrode and the second electrode are electrically connected through the conductive portion.
[0015] According to any one of the preceding embodiments of the first aspect of the present application, the plurality of conductive portions are distributed at intervals on the periphery of the second electrode.
[0016] According to any one of the preceding embodiments of the first aspect of the present application, the conductive portion is located between the substrate and the first electrode.
[0017] According to any one of the preceding embodiments of the first aspect of the present application, the first electrode is in a closed loop shape, and a plurality of first electrodes are arranged at intervals along the radial direction concentrically.
[0018] According to any one of the preceding embodiments of the first aspect of the present application, the conductive portion comprises a plurality of independent conductive sub-portions, the second electrode and the adjacent first electrode are electrically connected through the conductive sub-portions, and the adjacent first electrodes are electrically connected through the conductive sub-portions.
[0019] According to any one of the preceding embodiments of the first aspect of the present application, the metal material of the second sub-layer is more active than the metal material of the second electrode.
[0020] According to any one of the preceding embodiments of the first aspect of the present application, the first region is configured to be provided with a light sensing element.
[0021] According to any one of the preceding embodiments of the first aspect of the present application, the display panel further comprises an encapsulation layer, the encapsulation layer is located in the first region and the second region, and the encapsulation layer is located on the side of the first electrode away from the substrate.
[0022] According to any one of the preceding embodiments of the first aspect of the present application, the display panel further comprises an organic light emitting layer and a common organic material layer stacked along the thickness direction of the substrate, the organic light emitting layer is located in the second region, the common organic material layer is located in the first region and the second region, the common organic material layer is located on the side of the first electrode away from the substrate and is blocked by the first electrode, and the encapsulation layer is located on the side of the first electrode, the organic light emitting layer and the common organic material layer away from the substrate.
[0023] According to any one of the foregoing embodiments of the first aspect of the present application, the common organic material layer comprises one or more of an electron injection layer, an electron transport layer, a hole blocking layer, an electron blocking layer, a hole transport layer, and a hole injection layer.
[0024] Embodiments of the second aspect of the present application provide a display device, comprising a display panel, the display panel comprising a first area and a second area surrounding at least part of the first area, the first area being provided with an opening, the display panel comprising:
[0025] a substrate;
[0026] a first electrode disposed on the substrate and surrounding at least part of the first area, the first electrode comprising a first sub-layer and a second sub-layer, the first sub-layer being disposed on a side of the second sub-layer facing away from the substrate, a projection of the second sub-layer on the substrate being within a projection of the first sub-layer on the substrate, a side of the second sub-layer facing the first area being recessed relative to a side of the first sub-layer facing the first area, and / or a side of the second sub-layer facing away from the first area being recessed relative to a side of the first sub-layer facing away from the first area;
[0027] a conductive portion, the first electrode being connected to the conductive portion.
[0028] According to embodiments of the second aspect of the present application, the conductive portion extends to an edge of the opening.
[0029] According to any one of the foregoing embodiments of the second aspect of the present application, the display device further comprises a light sensing element, the display panel comprising a display side and a non-display side disposed opposite each other, the light sensing element being disposed on a side of the opening close to the non-display side.
[0030] Embodiments of the third aspect of the present application provide a method for manufacturing a display panel, the display panel comprising a first area and a second area surrounding at least part of the first area, the method comprising:
[0031] manufacturing a first metal material layer on the substrate and patterning the first metal material layer to form a first electrode, the first electrode being disposed around at least part of the first area, the first electrode comprising a first sub-layer and a second sub-layer, the first sub-layer being disposed on a side of the second sub-layer facing away from the substrate;
[0032] manufacturing a second metal material layer on the substrate and patterning the second metal material layer to form a second electrode, the second electrode being disposed in the first area, the second electrode being electrically connected to the first electrode;
[0033] etching the second sub-layer, a side of the second sub-layer facing the first area being recessed relative to a side of the first sub-layer facing the first area, and / or a side of the second sub-layer facing away from the first area being recessed relative to a side of the first sub-layer facing away from the first area.
[0034] According to the embodiment of the third aspect of the present application, in the step of preparing the second metal material layer on the substrate and patterning the second metal material layer to form the second electrode:
[0035] The second metal material layer is prepared on the substrate and is patterned to form the pixel electrode and the second electrode, the pixel electrode is located in the second area, and the second electrode is located in the first area.
[0036] According to any one of the preceding embodiments of the third aspect of the present application, in the step of etching the second sub-layer:
[0037] The pixel definition layer is prepared on the substrate, and the pixel definition layer and the second sub-layer are etched simultaneously, the pixel definition layer is etched to form the isolation part and the pixel opening enclosed by the isolation part, the first sub-layer is located on the side of the second sub-layer away from the substrate, the side of the second sub-layer facing the first area is recessed relative to the side of the first sub-layer facing the first area, and / or the side of the second sub-layer away from the first area is recessed relative to the side of the first sub-layer away from the first area.
[0038] According to any one of the preceding embodiments of the third aspect of the present application, after the step of etching the second sub-layer, further comprising:
[0039] The opening is formed by digging in the first area, and at least part of the second electrode is removed in the process of digging.
[0040] According to any one of the preceding embodiments of the third aspect of the present application, after the step of forming the opening by digging in the first area, further comprising:
[0041] The light sensing element is integrated on the side of the opening of the display panel.
[0042] According to the display panel of the embodiment of the present application, the display panel comprises a substrate and a first electrode and a second electrode arranged on the substrate. The first electrode comprises a first sub-layer and a second sub-layer arranged in layers. The second electrode is electrically connected with the first electrode, so that in the preparation process of the display panel, the second sub-layer of the first electrode can be galvanic corrosion, so that the second sub-layer is recessed relative to the first sub-layer, that is, the first electrode is recessed on the side. When the display panel is encapsulated, the encapsulation material will fill the side recess, which can better isolate the water vapor from entering the second area, so that the internal structure of the display panel is not easy to be corroded, and the service life of the display panel is prolonged. BRIEF DESCRIPTION OF DRAWINGS
[0043] Other features, objects, and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments with reference to the drawings, in which like or similar elements are designated with like or similar reference numerals, and in which the drawings are not drawn to scale.
[0044] Figure 1This is a top view of a display panel according to an embodiment of the first aspect of this application;
[0045] Figure 2 yes Figure 1 A magnified view of a portion of the image;
[0046] Figure 3 yes Figure 1 A partial sectional view at point AA in the middle;
[0047] Figure 4 This is a partial cross-sectional view of yet another embodiment of a display panel;
[0048] Figure 5 This is a top view structural diagram of another embodiment of a display panel;
[0049] Figure 6 A partial cross-sectional view of another embodiment of a display panel;
[0050] Figure 7 This is a partial cross-sectional view of another embodiment of a display panel;
[0051] Figure 8 yes Figure 5 A partial sectional view at point BB;
[0052] Figure 9 yes Figure 8 A magnified view of a portion of the image;
[0053] Figure 10 This is a partial cross-sectional view of another embodiment of a display panel;
[0054] Figure 11 This is a schematic flowchart of a method for manufacturing a display panel according to a third aspect embodiment of this application.
[0055] Explanation of reference numerals in the attached figures:
[0056] 10. Display panel;
[0057] 100. Substrate;
[0058] 200, First electrode; 210, First sublayer; 220, Second sublayer; 230, Third sublayer;
[0059] 300. Second electrode;
[0060] 400. Conductive part; 410. Conductive electronic part;
[0061] 500, Pixel definition layer; 510, Isolation section; 520, Pixel aperture; 530, Pixel electrode;
[0062] 600, Encapsulation layer;
[0063] 700. Shared organic material layer;
[0064] 800, opening; 810, photosensitive element;
[0065] AA1, Zone 1; AA2, Zone 2; AA3, Isolation Zone; AA4, Display Zone. Detailed Implementation
[0066] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.
[0067] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.
[0068] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.
[0069] In electronic devices such as mobile phones and tablets, it is necessary to integrate light-sensing components such as front-facing cameras, infrared light sensors, and proximity sensors on one side of the display panel. In some embodiments, a light-transmitting display area can be provided on the aforementioned electronic device, and the light-sensing components can be placed on the back of the light-transmitting display area. In order to improve the light-sensing performance of the light-sensing components, their light transmittance needs to be increased.
[0070] To house the photosensitive element, notches or holes can be made in the display screen, allowing external light to enter the photosensitive element located beneath the screen through these notches or holes. However, to ensure that the notches or holes still effectively prevent moisture from entering, a side-etched structure is typically added to the hole area. Implementing this side-etched structure requires an additional, separate etching process for the hole area, making the fabrication process complex.
[0071] To address the aforementioned problems, this application provides a display panel, a display device, and a method for manufacturing the display panel. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, display device, and method for manufacturing the display panel.
[0072] This application provides a display panel, which may be an organic light-emitting diode (OLED) display panel.
[0073] Please refer to the following: Figures 1 to 3 , Figure 1 This is a top view of a display panel according to an embodiment of the first aspect of this application; Figure 2 yes Figure 1 A magnified structural diagram of region AA1 in the middle; Figure 3 yes Figure 1 A partial sectional view at point AA.
[0074] like Figures 1 to 3 As shown, a first aspect embodiment of this application provides a display panel 10, which includes a first region AA1 and a second region AA2 surrounding at least a portion of the first region AA1. The display panel 10 includes a substrate 100, a first electrode 200, and a second electrode 300. The first electrode 200 is located on the substrate 100 and is disposed around at least a portion of the first region AA1. The first electrode 200 includes a first sublayer 210 and a second sublayer 220. The first sublayer 210 is located on the side of the second sublayer 220 away from the substrate 100. The side of the second sublayer 220 facing the first region AA1 is recessed relative to the side of the first sublayer 210 facing the first region AA1, and / or, the side of the second sublayer 220 away from the first region AA1 is recessed relative to the side of the first sublayer 210 away from the first region AA1. The second electrode 300 is located on the substrate 100 and disposed within the first region AA1, and the second electrode 300 is electrically connected to the first electrode 200.
[0075] According to an embodiment of this application, the display panel 10 includes a substrate 100 and a first electrode 200 and a second electrode 300 disposed on the substrate 100. The first electrode 200 includes a first sublayer 210 and a second sublayer 220 stacked together. During the fabrication process of the display panel 10, since the second electrode 300 is electrically connected to the first electrode 200, when the film layer of the display panel 10 is etched using an etching solution, the first electrode 200 can undergo galvanic corrosion. Galvanic corrosion is used instead of chemical corrosion in the prior art to form hole area side etching during normal development, replacing the side etching process in the prior art. This erodes part of the second sublayer 200, causing the first electrode 200 to form a side depression. This solves the problem in the prior art where an additional hole area process (including photolithography / etching / stripping) is added after the array process is completed, using acid to etch the hole area position to form side etching, resulting in too many processes. When the display panel 10 is encapsulated, the encapsulation material fills the side recesses, making the path of water and oxygen intrusion more tortuous. This better isolates water vapor from entering the second zone AA2, making the internal structure of the display panel 10 less susceptible to corrosion and extending the service life of the display panel 10.
[0076] After the first electrode 200 forms a side recess on the side of the second sublayer 220 near the first region AA1 and / or away from the first region AA1, the orthographic projection of the second sublayer 220 onto the substrate 100 lies within the orthographic projection of the first sublayer 210 onto the substrate 100.
[0077] There are many other ways to arrange the substrate 100. For example, the substrate 100 may include a substrate and an array substrate disposed on the substrate, or the substrate 100 may be the substrate itself. Alternatively, the substrate 100 may include a buffer layer and a support plate on the side facing away from the substrate.
[0078] Please see Figure 4 , Figure 4 This is a partial cross-sectional view of yet another embodiment of a display panel.
[0079] like Figure 4 As shown, in some optional embodiments, the first electrode 200 further includes a third sub-layer 230 located on the side of the second sub-layer 220 away from the first sub-layer 210, the side of the second sub-layer 220 facing the first region AA1 being recessed relative to the side of the third sub-layer 230 facing the first region AA1, and / or, the side of the second sub-layer 220 away from the first region AA1 being recessed relative to the side of the third sub-layer 230 away from the first region AA1.
[0080] Optionally, the orthographic projection of the second sublayer 220 onto the substrate 100 lies within the orthographic projection of the third sublayer 230 onto the substrate 100.
[0081] In these optional embodiments, the second sublayer 220 is located between the first sublayer 210 and the third sublayer 230, and at least one side of the second sublayer 220 facing the AA1 region and the AA2 region is recessed inward relative to the third sublayer 230. Therefore, the recess generated by the galvanic etching of the second sublayer 220 is located between the first sublayer 210 and the third sublayer 230 and is separated from the substrate 100. The second sublayer 220 is recessed relative to the first sublayer 210, that is, the first electrode 200 has a side recess, making the water and oxygen intrusion path more tortuous, so that the encapsulation material can better prevent water and oxygen from entering the second region AA2. The first electrode 200 may be H-shaped.
[0082] Optionally, the orthographic projection of the first sublayer 210 onto the substrate 100 and the orthographic projection of the third sublayer 230 onto the substrate 100 coincide. The coincidence of the orthographic projections of the first sublayer 210 and the third sublayer 230 onto the substrate 100 allows the first sublayer 210 and the third sublayer 230 to share the same mask, simplifying the fabrication process.
[0083] Optionally, the first sublayer 210 and the third sublayer 230 are made of the same material. Using the same material for the first sublayer 210 and the third sublayer 230 reduces the fabrication cost of the first electrode 200.
[0084] Optionally, the metallic materials of the first sublayer 210 and the third sublayer 230 are less reactive than the metallic material of the second sublayer 220. During galvanic corrosion, the metallic material of the second sublayer 220 is more reactive than that of the first sublayer 210 and the third sublayer 230. The second sublayer 220, as an electrode material, undergoes a chemical reaction and is corroded, resulting in a recess in the second sublayer 220 relative to the first sublayer 210 and the third sublayer 230. That is, the first electrode 200 has a side recess. When the display panel 10 is encapsulated, the encapsulation material fills the side recess, which can better prevent moisture from entering the second region AA2, making the internal structure of the display panel 10 less susceptible to corrosion and extending the service life of the display panel 10.
[0085] Optionally, the materials of the first sublayer 210 and the third sublayer 230 include titanium (Ti), and the material of the second sublayer 220 includes aluminum (Al). That is, the first electrode 200 includes a metal composite material such as Ti / Al / Ti (titanium / aluminum / titanium).
[0086] Please see Figure 5 , Figure 5 This is a top view structural diagram of another embodiment of a display panel.
[0087] like Figure 5As shown, the display panel 10 has a first region AA1 and a second region AA2 surrounding at least a portion of the first region AA1. Optionally, the second region AA2 may include a display region AA4 and an isolation region AA3. The display region AA4 may surround at least a portion of the isolation region AA3. The isolation region AA3 may surround at least a portion of the first region AA1. A first electrode 200 may be located in the isolation region AA3. Optionally, the first region AA1 is used to house a photosensitive element. The first electrode 200 may surround part or all of the first region AA1.
[0088] Please continue reading. Figures 2 to 4 In some optional embodiments, the display panel 10 further includes a conductive portion 400, through which the first electrode 200 and the second electrode 300 are electrically connected.
[0089] In these optional embodiments, during the galvanic corrosion of the first electrode 200, the conductive part 400 acts as a bridge in the galvanic corrosion, connecting the first electrode 200 and the second electrode 300, so that the first electrode 200 is etched as the electrode material in the galvanic corrosion reaction, causing the second sub-layer 220 to be recessed relative to the first sub-layer 210, that is, the first electrode 200 produces a side recess. When the display panel 10 is encapsulated, the encapsulation material will fill the side recess, which can better prevent moisture from entering the display area AA4 in the second area AA2.
[0090] Optional, such as Figure 2 As shown, multiple conductive parts 400 are spaced apart on the periphery of the second electrode 300. The second electrode 300 is connected to the first electrode 200 through the multiple conductive parts 400, which makes the electrode material of the first electrode 200 more fully and uniformly corroded, ensuring that the second region AA2 has better encapsulation performance.
[0091] Optionally, the conductive portion 400 is located between the substrate 100 and the first electrode 200. The conductive portion 400 is disposed between the substrate 100 and the first electrode 200, which increases the contact area between the conductive portion 400 and the first electrode 200, ensuring good contact between the first electrode 200 and the conductive portion 400, thereby enabling the second sublayer 220 of the first electrode 200 to undergo better galvanic corrosion reaction.
[0092] Please continue reading. Figure 2 In some alternative embodiments, the first electrode 200 is a closed ring.
[0093] Optionally, the multiple first electrodes 200 can be arranged in a layered, surrounding manner.
[0094] Optionally, multiple first electrodes 200 are arranged concentrically in a radial direction. The area where the first electrodes 200 are located can be an isolation zone AA3.
[0095] In these optional embodiments, the first electrode 200 is enclosed and surrounded by the first region AA1, so that the first region AA1 has good encapsulation performance at different positions in the circumferential direction, and multiple first electrodes 200 are arranged radially at intervals, so that the isolation region AA3 around the first region AA1 has good encapsulation performance in the radial direction. The isolation region AA3 around the first region AA1 of the display panel 10 can better isolate water and oxygen from entering, the internal structure is not easily corroded, and the service life of the display panel 10 is extended.
[0096] Please see Figure 6 , Figure 6 This is a partial cross-sectional view of another embodiment of a display panel.
[0097] like Figure 6 As shown, in some optional embodiments, the conductive part 400 includes a plurality of independent conductive sub-parts 410, and the second electrode 300 is electrically connected to the adjacent first electrode 200 through the conductive sub-parts 410.
[0098] In these optional embodiments, the second electrode 300 is electrically connected to the adjacent first electrode 200 via a conductive part 410, and the adjacent first electrodes 200 are also electrically connected to each other via conductive parts 410. This allows each first electrode 200 to be electrically connected to the second electrode 300, enabling each first electrode 200 to undergo galvanic corrosion reaction effectively, resulting in multiple side recesses. These side recesses allow the isolation area AA3 surrounding the first area AA1 of the display panel 10 to better prevent water and oxygen from entering, making the internal structure less susceptible to corrosion and extending the service life of the display panel 10. Furthermore, the multiple conductive parts 410 are independent of each other, preventing corrosion of the conductive parts 410 during use and avoiding interference with the normal function of other conductive parts 410.
[0099] In some alternative embodiments, the second sublayer 220 metal material has greater mobility than the second electrode 300 metal material.
[0100] In these optional embodiments, when the first electrode 200 and the second electrode 300 are electrically connected, since the metal material of the second sublayer 220 is more reactive than that of the second electrode 300, during the galvanic corrosion reaction, the second sublayer 220 acts as the anode and the second electrode 300 acts as the cathode, thereby enabling the second sublayer 220 to undergo corrosion. The second sublayer 220 is recessed relative to the first sublayer 210, meaning the first electrode 200 develops a side recess. Furthermore, the side recess of the first electrode 200 obtained through galvanic corrosion ensures that the display panel 10 is isolated from moisture, reducing the manufacturing process and surface treatment of the display panel 10, thus improving the yield of the display panel 10.
[0101] Please seeFigure 7 , Figure 7 This is a partial cross-sectional view of another embodiment of a display panel.
[0102] like Figure 7 As shown, optionally, the display panel 10 also includes a pixel definition layer 500, located in the second region AA2. The pixel definition layer 500 and the first electrode 200 can be fabricated simultaneously. A developing solution used for etching the pixel definition layer 500 or other organic or inorganic layers can be used as the electrolyte for the electrochemical etching of the first electrode 200 and the second electrode 300, eliminating the need for a separate etching process for the first electrode 200. This reduces one side etching process and lowers the production cost. The pixel definition layer 500 located in the second region AA2 and the first electrode 200 located around the first region AA1 can be fabricated simultaneously. While patterning the pixel definition layer 500, etching can be performed on the first electrode 200 around the first region AA1, avoiding an additional side etching process for the first electrode 200 and simplifying the fabrication process of the display panel 10.
[0103] Please refer to the following: Figure 8 and Figure 9 , Figure 8 yes Figure 5 A partial sectional view at point BB; Figure 9 yes Figure 8 A magnified view of a portion of the image.
[0104] Optional, such as Figure 8 and 9 As shown, the display panel 10 also includes an organic light-emitting layer and a common organic material layer 700 stacked along the thickness direction of the substrate 100. The organic light-emitting layer is located in the second region AA2, and the common organic material layer 700 is located in the first region AA1 and the second region AA2. The common organic material layer 700 is located on the side of the first electrode 200 away from the substrate 100 and is separated by the first electrode 200. The encapsulation layer 600 is located on the side of the first electrode 200, the organic light-emitting layer and the common organic material layer 700 away from the substrate.
[0105] In these optional embodiments, the common organic material layer 700 can be deposited using a universal photomask. During the deposition process of the common organic material layer 700, the first electrode 200 of the isolation region AA3 can effectively interrupt the common organic material layer 700 located in that region, thereby interrupting the water and oxygen intrusion path and improving the encapsulation effect of the display panel 10. The organic light-emitting layer can be located within the pixel opening 520 of the pixel definition layer 500.
[0106] Optionally, the common organic material layer 700 includes one or more of the following: an electron injection layer (EIL), an electron transport layer (ETL), a hole blocking layer (HBL), an electron blocking layer (EBL), a hole transport layer (HTL), and a hole injection layer (HIL). These layers can all be made from materials known in the art.
[0107] Optionally, the conductive portion 400 is located between the shared organic material layer 700 and the substrate 100. After etching the second sublayer 220 of the first electrode 200, the shared organic material layer 700 is prepared to be separated by the I-shaped first electrode 200.
[0108] Optionally, the display panel 10 also includes a cathode layer located on the side of the organic light-emitting layer and the shared organic material layer 700 away from the substrate 100.
[0109] Please continue reading. Figure 8 and Figure 9 In some optional embodiments, the display panel 10 further includes an encapsulation layer 600 located in the first region AA1 and the second region AA2, and the encapsulation layer 600 is located on the side of the first electrode 200 away from the substrate 100. Optionally, the encapsulation layer 600 is located on the side of the cathode layer away from the substrate 100.
[0110] In these optional embodiments, the encapsulation layer 600 fills the side recesses of the first electrode 200 and encapsulates the first region AA1 and the second region AA2, thereby preventing water and oxygen from entering the interior of the display panel 10, making the internal structure less susceptible to corrosion, and extending the service life of the display panel 10. The encapsulation layer 600 may be a thin-film encapsulation layer. The encapsulation layer 600 may include at least one inorganic layer and at least one organic layer alternately stacked along the thickness direction of the display panel 10. The encapsulation layer 600 may include a first inorganic layer, a first organic layer, and a second inorganic layer sequentially stacked along the thickness direction of the display panel 10.
[0111] The structural design in this embodiment can be applied to other display panels 10. The specific choice can be made according to the actual situation, and this application does not impose any specific restrictions on it.
[0112] Please see Figure 10 , Figure 10 This is a partial cross-sectional view of another embodiment of a display panel.
[0113] Based on the same inventive concept as the display panel 10 provided in the first aspect of this application, the second aspect of this invention also provides a display device, such as... Figure 10As shown, the display device includes a display panel 10, which includes a first region AA1 and a second region AA2 surrounding at least a portion of the first region AA1. An opening 800 is provided in the first region AA1. The display panel 10 includes a substrate 100, a first electrode 200, and a conductive portion 400. The first electrode 200 is located on the substrate 100 and is disposed around at least a portion of the first region AA1. The first electrode 200 includes a first sublayer 210 and a second sublayer 220. The first sublayer 210 is located on the side of the second sublayer 220 away from the substrate 100. The side of the second sublayer 220 facing the first region AA1 is recessed relative to the side of the first sublayer 210 facing the first region AA1, and / or the side of the second sublayer 220 away from the first region AA1 is recessed relative to the side of the first sublayer 210 away from the first region AA1. The first electrode 200 is connected to the conductive portion 400.
[0114] It should be noted that, through processes such as laser cutting, a hole 800 can be formed in the first area AA1 of the display panel 10 provided in the first aspect embodiment of this application, and part or all of the second electrode 300 is removed during the hole-cutting process, so as to form the display panel 10 in the second aspect embodiment of the present invention, thereby preventing the second electrode 300 from blocking ambient light from entering the photosensitive element 810.
[0115] Optionally, the orthographic projection of the second sublayer 220 onto the substrate 100 lies within the orthographic projection of the first sublayer 210 onto the substrate 100.
[0116] Optionally, the light transmittance of the second region AA2 is less than that of the first region AA1. According to the display panel of this embodiment, the light transmittance of the first region AA1 is greater than that of the second region AA2, allowing the display panel 10 to acquire more information during the information acquisition process of the photosensitive element in the first region AA1, thus making the information acquisition more accurate.
[0117] The display panel 10 provided in the first aspect of this application is equivalent to the original structure of the display device provided in the second aspect of this application. The display panel in the display device provided in the second aspect of this application is equivalent to the structure obtained by subsequent processing of the display panel 10 provided in the first aspect of this application. The display device provided in the second aspect of this application has the technical effects of the above embodiments, which will not be repeated here.
[0118] Optionally, the conductive part 400 extends to the edge of the opening 800. When the first area AA1 of the display panel 10 is drilled to form the opening 800, in order to allow ambient light to enter the photosensitive element 810 as much as possible, all the second electrodes 300 are removed, and part of the conductive part 400 is also removed. Thus, the conductive part 400 is disconnected at the opening 800, ensuring that the photosensitive element 810 has a better light-sensing effect.
[0119] Optionally, the display device further includes a photosensitive element 810. The display panel 10 includes a display side and a non-display side disposed opposite to each other, and the photosensitive element 810 is located on the side of the opening 800 closer to the non-display side. The display side may be the side of the display panel 10 away from the substrate 100 in the thickness direction, and the non-display side may be the side of the display panel 10 closer to the substrate 100 in the thickness direction. The thickness direction is perpendicular to the substrate 100.
[0120] When forming the display device, the display panel 10 includes only a substrate 100 and a first electrode 200 and a conductive portion 400 disposed on the substrate 100. The first region AA1 has no second electrode 300, has a larger transmittance, and is convenient for mounting photosensitive elements such as camera modules. The conductive portion 400 is suspended when the display panel displays an image and does not transmit signals.
[0121] The display devices in the embodiments of the present invention include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.
[0122] Optionally, the first electrode 200 further includes a third sub-layer 230 located on the side of the second sub-layer 220 away from the first sub-layer 210, the side of the second sub-layer 220 facing the first region AA1 being recessed relative to the side of the third sub-layer 230 facing the first region AA1, and / or, the side of the second sub-layer 220 away from the first region AA1 being recessed relative to the side of the third sub-layer 230 away from the first region AA1.
[0123] Optionally, the orthographic projection of the first sublayer 210 onto the substrate 100 and the orthographic projection of the third sublayer 230 onto the substrate 100 coincide.
[0124] Optionally, the first sublayer 210 and the third sublayer 230 are made of the same material.
[0125] Optionally, the metallic material mobility of the first sublayer 210 and the third sublayer 230 is weaker than that of the metallic material mobility of the second sublayer 220.
[0126] Optionally, the materials of the first sublayer 210 and the third sublayer 230 include titanium (Ti), and the material of the second sublayer 220 includes aluminum (Al). That is, the first electrode 200 includes a metal composite material such as Ti / Al / Ti (titanium / aluminum / titanium).
[0127] Optionally, multiple conductive portions 400 are distributed at intervals around the periphery of the first region AA1.
[0128] Optionally, the conductive portion 400 is located between the substrate 100 and the first electrode 200.
[0129] Optionally, the first electrode 200 is a closed ring, and multiple first electrodes 200 are arranged concentrically in the radial direction.
[0130] Optionally, the display panel 10 further includes an organic light-emitting layer and a common organic material layer 700 stacked along the thickness direction of the substrate 100. The organic light-emitting layer is located in the second region AA2, and the common organic material layer 700 is located on the side of the first electrode 200 facing away from the substrate 100 and is separated by the first electrode 200. The encapsulation layer 600 is located on the side of the first electrode 200, the organic light-emitting layer, and the common organic material layer 700 facing away from the substrate. The organic light-emitting layer may be located in the display region AA4. The common organic material layer 700 is located in the display region AA4 and the isolation region AA3.
[0131] Optionally, the shared organic material layer 700 display panel also includes a common layer, which may include one or more of the following: electron injection layer (EIL), electron transport layer (ETL), hole blocking layer (HBL), electron blocking layer (EBL), hole transport layer (HTL), and hole injection layer (HIL).
[0132] Optionally, the conductive portion 400 is located between the shared organic material layer 700 and the substrate 100.
[0133] Optionally, the display panel 10 also includes a cathode layer located on the side of the organic light-emitting layer and the shared organic material layer 700 away from the substrate 100.
[0134] Optionally, the display panel 10 further includes an encapsulation layer 600, which is located in the second region AA2 and on the side of the first electrode 200 facing away from the substrate 100. Optionally, the encapsulation layer 600 is located on the side of the cathode layer away from the substrate 100. The encapsulation layer 600 is located in the display region AA4 and the isolation region AA3.
[0135] Please see Figure 11 , Figure 11 This is a schematic flowchart of a method for manufacturing a display panel according to a third aspect embodiment of this application. The display panel 10 can be the display panel 10 provided in any of the first aspect embodiments or the display panel 10 in the display device provided in any of the second aspect embodiments.
[0136] like Figure 11 Please refer to the following as well. Figures 1 to 10 The display panel 10 shown includes a first region AA1 and a second region AA2 surrounding at least a portion of the first region AA1. The method for manufacturing the display panel 10 includes:
[0137] Step S01: A first metal material layer is prepared on the substrate 100, and the first metal material layer is patterned to form a first electrode 200. The first electrode 200 is disposed around at least a portion of the first region AA1. The first electrode 200 includes a first sub-layer 210 and a second sub-layer 220. The first sub-layer 210 is located on the side of the second sub-layer 220 away from the substrate 100.
[0138] Step S02: A second metal material layer is prepared on the substrate 100, and the second metal material layer is patterned to form a second electrode 300. The second electrode 300 is disposed in the first region AA1 and is electrically connected to the first electrode 200.
[0139] Step S03: Etch the second sublayer 220, such that the side of the second sublayer 220 facing the first region AA1 is recessed relative to the side of the first sublayer 210 facing the first region AA1, and / or the side of the second sublayer 220 away from the first region AA1 is recessed relative to the side of the first sublayer 210 away from the first region AA1.
[0140] According to the preparation method of the third aspect of this application, a first electrode 200 is prepared in step S01. The first electrode 200 includes a first sub-layer 210 and a second sub-layer 220 stacked together. A second electrode 300 is prepared in step S02. Since the second electrode 300 is electrically connected to the first electrode 200, when the film layer of the display panel 10 is etched with an etching solution in step S03, the second sub-layer 220 can undergo galvanic corrosion. Galvanic corrosion is used instead of chemical corrosion in the prior art to form the hole area side etching during the normal development process, replacing the side etching process in the prior art. This erodes part of the second sub-layer 200, causing the second sub-layer 220 to be recessed relative to the first sub-layer 210. That is, the first electrode 200 has a side recess, which solves the problem of excessive processes caused by adding a hole area process (including photolithography / etching / stripping) after the array process is completed in the prior art, using acid to etch the hole area position to form the side etching. When the display panel 10 is encapsulated, the encapsulation material fills the side recesses, making the path for water and oxygen intrusion more tortuous. This better isolates moisture from entering the second region AA2, making the internal structure of the display panel 10 less susceptible to corrosion and extending its service life. The execution order of steps S01 and S02 can be interchanged; that is, step S01 can be before or after step S02. This application does not limit this and can set it as needed.
[0141] After the first electrode 200 forms a side recess on the side of the second sublayer 220 near the first region AA1 and / or away from the first region AA1, the orthographic projection of the second sublayer 220 onto the substrate 100 lies within the orthographic projection of the first sublayer 210 onto the substrate 100.
[0142] In some optional embodiments, in the step of fabricating a second metal material layer on the substrate 100 and patterning the second metal material layer to form the second electrode 300:
[0143] A second metal material layer is prepared on the substrate 100, and the second metal material layer is patterned to form a pixel electrode 530 and a second electrode 300. The pixel electrode 530 is located in the second region AA2, and the second electrode 300 is located in the first region AA1.
[0144] In these optional embodiments, while fabricating the pixel electrode 530 located in the second region AA2, the second metal material layer located in the first region AA1 is patterned to obtain the second electrode 300. The second electrode 300 is fabricated in the same layer and with the same material as the pixel electrode 530, simplifying the fabrication process of the display panel 10. The pixel electrode 530 can be an anode.
[0145] In some alternative embodiments, during the etching step of the second sublayer 220:
[0146] A pixel definition layer 500 is prepared on the substrate 100, and the pixel definition layer 500 and the second sub-layer 220 are etched simultaneously. The pixel definition layer 500 is etched to form an isolation portion 510 and a pixel opening 520 formed by the isolation portion 510. The orthographic projection of the second sub-layer 220 on the substrate 100 is located within the orthographic projection of the first sub-layer 210 on the substrate 100.
[0147] In these alternative embodiments, in the same process, using the same developer, while preparing the pixel opening 520 located in the second region AA2 by etching the pixel definition layer 500, the second sub-layer 220 located on the periphery of the first region AA1 is etched. The side etching of the first electrode 200 and the etching of the pixel opening 520 are prepared simultaneously, avoiding the need for an additional process to side-etch the first electrode 200, reducing production costs and simplifying the manufacturing process of the display panel 10.
[0148] Optionally, after etching the second sublayer 220, the process further includes:
[0149] A hole 800 is formed by drilling in the first zone AA1, and at least a portion of the second electrode 220 is removed during the drilling process.
[0150] Optionally, after the drilling step 800 in the first zone AA1 to form the opening, the following steps are also included:
[0151] A photosensitive element 810 is integrated on one side of the opening 800 of the display panel 10.
[0152] In these alternative embodiments, an opening 800 is formed in the first region AA1 by laser cutting or other processes, and part or all of the second electrode 300 is removed during the drilling process to form the display panel 10 in the embodiment of the second aspect of the present invention, thereby preventing the second electrode 300 from blocking ambient light from entering the photosensitive element 810.
[0153] The embodiments described above are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.
Claims
1. A display panel, characterized by, The display panel comprises a first area and a second area surrounding at least part of the first area, and the display panel comprises: a substrate; a first electrode located on the substrate and arranged to surround at least part of the first area, the first electrode comprising a first sub-layer and a second sub-layer, the first sub-layer being located on a side of the second sub-layer away from the substrate, a side of the second sub-layer facing the first area being recessed relative to a side of the first sub-layer facing the first area, and / or a side of the second sub-layer away from the first area being recessed relative to a side of the first sub-layer away from the first area; a second electrode located on the substrate and arranged in the first area, the second electrode being electrically connected to the first electrode; a conductive part located on a side of the second electrode, the first electrode and the second electrode being electrically connected through the conductive part, the conductive part being used as an electric bridge in galvanic corrosion to connect and conduct the first electrode and the second electrode, so that the first electrode corrodes as electrode material in galvanic corrosion reaction, and so that the first electrode generates a side recess.
2. The display panel of claim 1, wherein, The first electrode further comprises a third sub-layer located on a side of the second sub-layer away from the first sub-layer, a side of the second sub-layer facing the first area being recessed relative to a side of the third sub-layer facing the first area, and / or a side of the second sub-layer away from the first area being recessed relative to a side of the third sub-layer away from the first area.
3. The display panel of claim 2, wherein, The first sub-layer and the third sub-layer are of the same material.
4. The display panel of claim 2, wherein, The first sub-layer and the third sub-layer are of the same material.
5. The display panel of claim 2, wherein, The metal material activity of the first sub-layer and the third sub-layer is weaker than that of the second sub-layer.
6. The display panel of claim 2, wherein, The material of the first sub-layer and the third sub-layer comprises titanium (Ti), and the material of the second sub-layer comprises aluminum (Al).
7. The display panel of claim 1, wherein, A plurality of the conductive parts are distributed at intervals on the side of the second electrode.
8. The display panel of claim 1, wherein, The conductive part is located between the substrate and the first electrode.
9. The display panel of claim 1, wherein, The first electrode is in a closed loop shape, and a plurality of the first electrodes are arranged at intervals in a radial concentric manner.
10. The display panel of claim 1, wherein, The conductive part comprises a plurality of independent conductive sub-parts, the second electrode and adjacent first electrodes are electrically connected through the conductive sub-parts, and adjacent first electrodes are electrically connected through the conductive sub-parts.
11. The display panel of claim 1, wherein, The metal material activity of the second sub-layer is stronger than that of the second electrode.
12. The display panel of claim 1, wherein, The first area is used to arrange a light sensing element.
13. The display panel of claim 1, wherein, The display panel further comprises an encapsulation layer located on the first area and the second area, and the encapsulation layer is located on a side of the first electrode away from the substrate.
14. The display panel of claim 13, wherein, The display panel further comprises an organic light emitting layer and a common organic material layer stacked in a thickness direction of the substrate, the organic light emitting layer is located in the second area, the common organic material layer is located in the first area and the second area, the common organic material layer is located on a side of the first electrode away from the substrate and is blocked by the first electrode, and the encapsulation layer is located on a side of the first electrode, the organic light emitting layer and the common organic material layer away from the substrate.
15. The display panel of claim 14, wherein, The common organic material layer comprises one or more of an electron injection layer, an electron transport layer, a hole blocking layer, an electron blocking layer, a hole transport layer, and a hole injection layer.
16. The display panel of claim 14, wherein, The conductive part is located between the common organic material layer and the substrate, the display panel further comprises a cathode layer located on a side of the organic light-emitting layer and the common organic material layer away from the substrate, and the encapsulation layer is located on a side of the cathode layer away from the substrate.
17. A display device comprising: The display panel comprises a first area and a second area surrounding at least part of the first area, the first area is provided with an opening, and the display panel comprises: a substrate; a first electrode located on the substrate and surrounding at least part of the first area, the first electrode comprising a first sub-layer and a second sub-layer, the first sub-layer being located on a side of the second sub-layer away from the substrate, a side of the second sub-layer facing the first area being recessed relative to a side of the first sub-layer facing the first area, and / or a side of the second sub-layer away from the first area being recessed relative to a side of the first sub-layer away from the first area; a conductive part, the first electrode being connected to the conductive part, the conductive part being used as an electric bridge in galvanic corrosion to connect the first electrode and the second electrode in conduction, so that the first electrode corrodes as electrode material in galvanic corrosion reaction, so that the first electrode generates side recess, and after the first electrode corrosion is completed, part or all of the second electrode is removed.
18. The display device of claim 17, wherein, The conductive part extends to the edge of the opening.
19. The display device of claim 17, wherein, The display device further comprises a light sensing element, the display panel comprises a display side and a non-display side arranged oppositely, and the light sensing element is located on a side of the opening close to the non-display side.
20. A method for manufacturing a display panel, comprising: The display panel comprises a first area and a second area surrounding at least part of the first area, and the preparation method comprises: preparing a first metal material layer on a substrate and patterning the first metal material layer to form a first electrode, the first electrode surrounding at least part of the first area, the first electrode comprising a first sub-layer and a second sub-layer, the first sub-layer being located on a side of the second sub-layer away from the substrate; preparing a second metal material layer on the substrate and patterning the second metal material layer to form a second electrode, the second electrode being arranged in the first area and electrically connected with the first electrode; etching the second sub-layer, a side of the second sub-layer facing the first area being recessed relative to a side of the first sub-layer facing the first area, and / or a side of the second sub-layer away from the first area being recessed relative to a side of the first sub-layer away from the first area.
21. The method of producing a display panel according to claim 20, wherein In the step of preparing a second metal material layer on the substrate and patterning the second metal material layer to form a second electrode: In the step of preparing a second metal material layer on the substrate and patterning the second metal material layer to form a second electrode:
22. The method of manufacturing a display panel according to claim 20, wherein, In the step of etching the second sub-layer: Preparation of a pixel definition layer on the substrate, and etching the pixel definition layer and the second sub-layer at the same time, the pixel definition layer etching forms an isolation part and a pixel opening formed by the isolation part, the first sub-layer is located on the side of the second sub-layer away from the substrate, the side of the second sub-layer facing the first area is recessed relative to the side of the first sub-layer facing the first area, and / or the side of the second sub-layer away from the first area is recessed relative to the side of the first sub-layer away from the first area.
23. The display panel of claim 20, wherein, After the step of etching the second sub-layer, further comprising: Hollowing out the first area to form an opening, and at least part of the second electrode is removed during the hollowing out process.
24. The display panel of claim 23, wherein, After the step of hollowing out the first area to form an opening, further comprising: Integrating a photosensitive element on the side of the opening of the display panel.
Citation Information
Patent Citations
Organic light emitting display panel and manufacturing method thereof
CN109802052A