Circuit board cleaning device

Abstract

This application discloses a circuit board cleaning device, comprising: a device housing, a conveying assembly, and a cleaning assembly. The conveying assembly and the cleaning assembly are both located within the device housing. The cleaning assembly includes a lower panel cleaning assembly and an upper panel cleaning assembly. The lower panel cleaning assembly is located below the conveying assembly. The lower panel cleaning assembly includes an applicator and a vibrating brush. The applicator is located on one side inside the device housing, and the vibrating brush is located on one side of the applicator. The lower panel cleaning assembly sequentially applies cleaning fluid to the lower surface of the circuit board to be cleaned using the applicator and the vibrating brush, followed by high-frequency vibrating brushing to remove dirt from the lower surface of the circuit board. This allows for different cleaning methods to be used on both sides of a single-sided circuit board, resulting in good cleaning performance without scratching the circuit board.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, and in particular to a circuit board cleaning device. Background Technology

[0002] Circuit boards may include ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, ultra-thin circuit boards, ultra-thin circuit boards, printed circuit boards (copper etching technology), etc.

[0003] After soldering or after prolonged use, circuit boards may accumulate flux, oil, and adhesive residue on their surface. To ensure proper operation, the surface needs to be cleaned.

[0004] In related technologies, the cleaning methods for circuit boards are relatively simple, especially for single-sided circuit boards. Both the side with concentrated components and the side with concentrated wires are cleaned with a cleaning brush. This cleaning method can easily scratch the side with concentrated delicate components, affecting the normal use of the circuit board. Summary of the Invention

[0005] This application aims to at least partially solve one of the technical problems in the aforementioned technologies.

[0006] Therefore, the first objective of this application is to provide a circuit board cleaning device that can use different cleaning methods on two different sides of a single-sided circuit board, achieving good cleaning results without scratching the circuit board and ensuring its normal use.

[0007] To achieve the above objectives, a first aspect of this application provides a circuit board cleaning device, comprising: a device housing, a conveying assembly, and a cleaning assembly. The conveying assembly is disposed within the device housing, and the cleaning assembly is also disposed within the device housing. The cleaning assembly includes a lower panel cleaning assembly and an upper panel cleaning assembly. The lower panel cleaning assembly is disposed below the conveying assembly. The lower panel cleaning assembly includes a coating device and a vibrating brush. The coating device is disposed on one side inside the device housing, and the vibrating brush is disposed on one side of the coating device. The lower panel cleaning assembly, through the coating device... The device and the vibrating brush are sequentially coated with cleaning fluid on the lower surface of the circuit board to be cleaned, and then high-frequency vibrating brushing is used to clean it to remove dirt from the lower surface of the circuit board. The upper panel cleaning assembly is located above the conveying assembly. The upper panel cleaning assembly includes a dry ice cleaning mechanism, an isolation cover, and a dust collection mechanism. The dry ice cleaning mechanism is connected to one side of the top of the isolation cover, and the dust collection mechanism is connected to the other side of the top of the isolation cover. The upper panel cleaning assembly uses the isolation cover as a relatively enclosed cleaning space. The dry ice cleaning mechanism cleans the upper surface of the circuit board to be cleaned, while the dust collection mechanism sucks up the blown dirt.

[0008] In one embodiment of this application, the conveying assembly includes two guide rails and a clamping plate. The two guide rails pass through the feed inlet on one side of the equipment housing and extend out from the discharge outlet on the other side of the equipment housing. The clamping plate includes a socket and two electric sliders. The socket is disposed on the front surface of the clamping plate, and slots are formed on the inner walls on both sides of the socket. The two electric sliders are respectively disposed on both sides of the clamping plate, and the electric sliders are connected to the guide rails.

[0009] In one embodiment of this application, the application device includes a roller, a cleaning fluid box, and a first upright rod. The roller is disposed inside the cleaning fluid box, and both ends of the roller are rotatably connected to the inner wall of the cleaning fluid box. Application brush strips are distributed around the surface of the roller. The cleaning fluid box contains cleaning fluid, and the bottom of the cleaning fluid box is connected to the first upright rod, which is installed at the inner bottom of the device housing. The vibrating brush includes a brush plate, vibrating brush strips, a vibration motor, a support plate, a silicone sheet, and a second upright rod. The vibrating brush strips are distributed on the upper surface of the brush plate. The top of the vibration motor is connected to the brush plate, and the bottom of the vibration motor is connected to the support plate. One side surface of the silicone sheet is connected to the support plate, and the other side surface of the silicone sheet is connected to the support plate. The bottom of the support plate is connected to the second upright rod, which is installed at the inner bottom of the device housing.

[0010] In one embodiment of this application, the dry ice cleaning mechanism includes a dry ice dispensing box, a pressurized fan, a dry ice delivery pipe, and a dry ice nozzle. The dry ice dispensing box is located on the top of the equipment housing. The pressurized fan is connected to the inner top of the equipment housing and communicates with the dry ice dispensing box. The pressurized fan is connected to the dry ice nozzle through the dry ice delivery pipe. The dry ice nozzle is connected to the inner top of the isolation cover. The dust collection mechanism includes a dust collection hood, a dust collection pipe, a dust collection fan, and a dust collection box. The dust collection hood is connected to the top of one side of the isolation cover. The dust collection hood is connected to the dust collection fan through the dust collection pipe. The dust collection fan is located on the top of the equipment housing and is connected to the dust collection box. The dust collection box is located on the top of the equipment housing. Barrier brush layers are provided on the bottom sides of the isolation cover.

[0011] In one embodiment of this application, the circuit board cleaning device further includes a cleaning component and a drying component. The cleaning component is disposed on one side of the vibrating brush and below the guide rail. The cleaning component includes a cleaning hood, a water tank, a cleaning water pump, and a recovery tank. Multiple water spray nozzles are distributed on the lower inner surface of the cleaning hood. A brush layer is disposed on one side of the top of the cleaning hood, and a water-absorbing layer is disposed on the other side of the top of the cleaning hood. The bottom of the cleaning hood is connected to the equipment housing via a straight rod. The water tank is disposed at the bottom inner interior of the equipment housing. The cleaning water pump is connected to the water tank and connected to the water spray nozzles via a water pipe. The recycling bin is connected to a drain pipe, which connects the recycling bin to the bottom inner side of the cleaning hood. The drying assembly is located on one side of the cleaning hood and below the guide rail. The drying assembly includes a water-absorbing roller, a drying pipe, a dryer, and a support. The support is located at the bottom inner side of the equipment housing. The water-absorbing roller is rotatably connected to the top of the support. The water-absorbing roller is made of water-absorbing material. The dryer is located on one side of the support. One end of the drying pipe is connected to the dryer, and the other end of the drying pipe is equipped with a drying nozzle. The drying nozzles are arranged side by side on one side of the water-absorbing roller.

[0012] The circuit board cleaning device provided in this application embodiment can use different cleaning methods on both sides of a single-sided circuit board. For the side of the single-sided circuit board where the components are concentrated, dry ice particles can be blown by a dry ice cleaning mechanism to quickly freeze and catalyze the dirt attached to the side where the components are concentrated, and finally remove it with the airflow. At the same time, a dust suction mechanism is used to vacuum the cleaning area covered by the isolation cover to suck up the removed dirt, thereby cleaning the side of the single-sided circuit board where the components are concentrated without scratching the circuit board or damaging the components. Meanwhile, for the side of the single-sided circuit board where the wires are concentrated, a cleaning solution can be applied to it, and then it can be cleaned by high-frequency brushing of a vibrating brush. After that, it can be rinsed by a cleaning component to remove the cleaning solution and dirt residue on the surface of the circuit board. Finally, the drying component removes water stains from the surface of the circuit board and dries it, thereby achieving cleaning of the single-sided circuit board with good cleaning effect and ensuring the integrity of the single-sided circuit board.

[0013] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0014] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0015] Figure 1 This is a schematic diagram of a circuit board cleaning device according to an embodiment of this application;

[0016] Figure 2 This is a schematic diagram of a circuit board cleaning apparatus according to another embodiment of this application;

[0017] Figure 3 This is a schematic diagram of the structure of an applicator according to another embodiment of this application;

[0018] Figure 4 This is a schematic diagram of the structure of a vibrating brush according to another embodiment of this application;

[0019] Figure 5 This is a schematic diagram of the structure of a cleaning assembly according to another embodiment of this application;

[0020] Figure 6 This is a schematic diagram of a circuit board cleaning device according to another embodiment of this application;

[0021] Figure 7 This is a schematic diagram of a circuit board cleaning device according to another embodiment of this application;

[0022] Figure 8 This is a schematic diagram of the structure of a top panel cleaning assembly according to another embodiment of this application.

[0023] Reference numerals: 1-Equipment housing, 2-Guide rail, 21-Clamping plate, 22-Electric slider, 23-Insert, 24-Slot, 3-Applying device, 31-Roller, 32-Applying brush strip, 33-Cleaning solution tank, 34-First upright, 4-Vibrating brush, 41-Vibrating brush strip, 42-Vibrating motor, 43-Brush plate, 44-Support plate, 45-Silicone sheet, 46-Support plate, 47-Second upright, 5-Cleaning assembly, 51-Cleaning hood, 511-Water spray head, 52-Water tank. 53-Cleaning water pump, 54-Recycling bin, 55-Water pipe, 56-Drain pipe, 57-Straight rod, 6-Upper panel cleaning assembly, 61-Isolation cover, 611-Barrier brush layer, 62-Dust suction hood, 63-Pressure blower, 64-Dry ice delivery pipe, 65-Dry ice dispensing box, 66-Dust suction pipe, 67-Dust suction blower, 68-Dust collection box, 69-Dry ice nozzle, 7-Drying assembly, 71-Water suction roller, 72-Drying nozzle, 73-Dryer, 74-Bracket, 75-Drying pipe. Detailed Implementation

[0024] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0025] The circuit board cleaning apparatus of this application embodiment is described below with reference to the accompanying drawings.

[0026] The circuit board cleaning device provided in this application embodiment can be applied to the cleaning of single-sided circuit boards. By adopting different cleaning methods, it can effectively clean both sides of a single-sided circuit board, achieving good cleaning results without damaging the circuit board.

[0027] Figure 1 This is a schematic diagram of a circuit board cleaning device according to an embodiment of the present application.

[0028] like Figure 1 As shown, the circuit board cleaning device includes: a device housing 1, a conveying component, and a cleaning component. The conveying component is disposed in the device housing 1, and the cleaning component is disposed in the device housing 1. The cleaning component includes a lower panel cleaning component and an upper panel cleaning component 6. The lower panel cleaning component is disposed below the conveying component. The lower panel cleaning component includes an applicator 3 and a vibrating brush 4. The applicator 3 is disposed on one side inside the device housing 1, and the vibrating brush 4 is disposed on one side of the applicator 3. The lower panel cleaning component applies cleaning fluid to the lower surface of the circuit board to be cleaned in sequence through the applicator 3 and the vibrating brush 4, and then performs high-frequency vibration brushing to clean it, so as to remove dirt from the lower surface of the circuit board to be cleaned.

[0029] Specifically, when cleaning a single-sided circuit board, the operator can place the single-sided circuit board on the conveyor assembly in the equipment housing 1, with the side of the single-sided circuit board with the components facing up and the side with the wires facing down. The single-sided circuit board first passes through the lower panel cleaning assembly located below it with the conveyor assembly. The lower panel cleaning assembly detects its arrival and starts operating. The applicator 3 applies cleaning fluid to the lower surface of the single-sided circuit board. Then, the vibrating brush 4 performs high-frequency vibration brushing to clean the lower surface of the single-sided circuit board coated with cleaning fluid, thereby effectively cleaning the dirt attached to its lower surface.

[0030] like Figure 2 As shown, the upper panel cleaning assembly 6 is located above the conveying assembly. The upper panel cleaning assembly 6 includes a dry ice cleaning mechanism, an isolation cover 61, and a dust collection mechanism. The dry ice cleaning mechanism is connected to one side of the top of the isolation cover 61, and the dust collection mechanism is connected to the other side of the top of the isolation cover 61. The upper panel cleaning assembly 6 uses the isolation cover 61 as a relatively enclosed cleaning space. The dry ice cleaning mechanism cleans the upper surface of the circuit board to be cleaned, while the dust collection mechanism sucks up the blown dirt.

[0031] Specifically, when cleaning the upper surface of a single-sided circuit board, the cleaning can be performed using the upper panel cleaning assembly 6 located above the equipment housing 1. The upper surface of the single-sided circuit board is covered by an isolation cover 61, and then a dry ice cleaning mechanism sprays dry ice particles onto the upper surface, rapidly freezing and catalyzing the dirt adhering to the surface, which is then removed and peeled off by the airflow. Simultaneously, a vacuuming mechanism vacuums the cleaning area covered by the isolation cover 61, sucking up the peeled dirt. This allows for concentrated cleaning of the components on one side of the single-sided circuit board, preventing scratches on the circuit board and damage to the components. The vacuuming mechanism is connected to the isolation cover 61 to suck up the peeled dirt, thus achieving a good cleaning effect on the single-sided circuit board.

[0032] It should be noted that displacement sensors are installed on the lower sides of the front and rear side walls of the isolation cover 61 described in the above embodiments. The controller can monitor the sensing of the displacement sensors. When the single-sided circuit board enters the isolation cover 61, the displacement sensor detects its entry and notifies the controller to activate the dry ice cleaning mechanism to clean the dirt. At the same time, the vacuuming mechanism sucks up the dirt. When the single-sided circuit board leaves the isolation cover 61, the displacement sensor detects its departure and notifies the controller to shut down the dry ice cleaning mechanism and the vacuuming mechanism.

[0033] In one embodiment of this application, such as Figure 1As shown, the conveying assembly may include two guide rails 2 and a clamping plate 21. The two guide rails 2 pass through the feed inlet on one side of the equipment housing 1 and extend out from the discharge outlet on the other side of the equipment housing 1. The clamping plate 21 includes a socket 23 and two electric sliders 22. The socket 23 is disposed on the front surface of the clamping plate 21, and slots 24 are provided on the inner walls on both sides of the socket 23. The two electric sliders 22 are respectively disposed on both sides of the clamping plate 21 and are connected to the guide rails 2.

[0034] Specifically, when it is necessary to fix a single-sided circuit board to the conveying assembly, two guide rails 2 can be installed on both sides inside the equipment housing 1. The guide rails 2 pass through the equipment housing 1 from the feed port on one side and extend out from the discharge port on the other side. A clamping plate 21 can be set between the two guide rails 2 to clamp the single-sided circuit board to be cleaned. Then, an insertion port 23 can be opened on the front surface of the clamping plate 21, and slots 24 can be opened on the inner walls on both sides of the insertion port 23, so that workers can insert the single-sided circuit board into it for fixing. At the same time, electric sliders 22 can be installed on both sides of the clamping plate 21, and the clamping plate 21 can move on the guide rails 2 via the electric sliders 22 to realize the conveying of the single-sided circuit board to be cleaned.

[0035] It should be noted that the conveying component described in the above embodiments can be controlled by a controller, and the controller can be manually operated to move the electric slider 22 on the guide rail 2.

[0036] In one embodiment of this application, such as Figure 3 As shown, the application device 3 includes a roller 31, a cleaning liquid box 33, and a first upright 34. The roller 31 is disposed inside the cleaning liquid box 33, and both ends of the roller 31 are rotatably connected to the inner wall of the cleaning liquid box 33. Application brush strips 32 are distributed around the surface of the roller 31. The cleaning liquid box 33 contains cleaning liquid. The bottom of the cleaning liquid box 33 is connected to the first upright 34, and the first upright 34 is installed at the inner bottom of the equipment housing 1.

[0037] Specifically, when the single-sided circuit board is brought into the equipment housing 1 by the conveying component, it first passes through the coating device 3. The cleaning box 33, which is filled with cleaning fluid, can be mounted inside the equipment housing 1 by the first upright 34. Then, a roller 31 with coating brushes 32 distributed around its surface can be installed in the cleaning box 33. The roller 31 can roll and contact the single-sided circuit board to be cleaned as it passes by, so that the coating brushes 32 can pick up the cleaning fluid in the cleaning box 33 and apply it to the lower surface of the single-sided circuit board, thereby achieving the application of cleaning fluid to facilitate subsequent cleaning.

[0038] It should be noted that when the cleaning solution is poured into the cleaning box 33, the roller 31 can be rotated in advance to ensure that the brush strip 32 on it is fully soaked in the cleaning solution, so as to avoid the situation where the brush strip 32 that first contacts the single-sided circuit board does not have cleaning solution when the roller 31 rolls and contacts the single-sided circuit board.

[0039] like Figure 4 As shown, the vibrating brush 4 includes a brush plate 43, vibrating brush strips 41, a vibrating motor 42, a support plate 44, a silicone sheet 45, a support plate 46, and a second upright 47. The vibrating brush strips 41 are distributed on the upper surface of the brush plate 43. The top of the vibrating motor 42 is connected to the brush plate 43, and the bottom of the vibrating motor 42 is connected to the support plate 44. One side of the silicone sheet 45 is connected to the support plate 44, and the other side of the silicone sheet 45 is connected to the support plate 46. The bottom of the support plate 46 is connected to the second upright 47, and the second upright 47 is installed at the bottom of the inner part of the equipment housing 1.

[0040] Specifically, after the single-sided circuit board is coated with cleaning solution, when it reaches the vibrating brush 4 located close to the coating device 3 via the conveying assembly, the vibrating brush 4 can perform high-frequency brushing cleaning on the lower surface of the single-sided circuit board. A brush plate 43 with vibrating brush strips 41 distributed on its surface can be set to brush and clean the lower surface of the single-sided circuit board. At the same time, a vibration motor 42 can be connected to the bottom of the brush plate 43. Then, a support plate 44, a silicone sheet 45, and a support plate 46 can be connected sequentially to the bottom of the vibration motor 42. The support plate 46 can be mounted inside the equipment housing 1 via a second upright 47, thereby enabling the vibration motor 42 to control the vibrating brush strips 41 to perform high-frequency vibration brushing to thoroughly clean the dirt on the lower surface of the single-sided circuit board.

[0041] In one embodiment of this application, such as Figure 2 and Figure 5 As shown, the circuit board cleaning device may further include a cleaning component 5 and a drying component 7. The cleaning component 5 is located on one side of the vibrating brush 4 and below the guide rail 2. The cleaning component 5 includes a cleaning hood 51, a water tank 52, a cleaning water pump 53, and a recycling bin 54. The inner lower surface of the cleaning hood 51 is provided with multiple water spray heads 511. A brush layer is provided on one side of the top of the cleaning hood 51, and a water absorption layer is provided on the other side of the top of the cleaning hood 51. The bottom of the cleaning hood 51 is connected to the equipment housing 1 through a straight rod 57. The water tank 52 is located at the inner bottom of the equipment housing 1. The cleaning water pump 53 is connected to the water tank 52 and is connected to the water spray heads 511 through a water pipe 55. The recycling bin 54 is connected to a drain pipe 56 and is connected to the inner bottom side of the cleaning hood 51 through the drain pipe 56. The drying component 7 is located on one side of the cleaning hood 51.

[0042] Specifically, after being washed by the vibrating brush 4, the lower surface of the single-sided circuit board will have residue of cleaning fluid and dirt mixture. A cleaning assembly 5 can be installed behind the vibrating brush 4 to clean it. A cleaning hood 51 with an upward-facing opening can be installed along the path of the single-sided circuit board. The cleaning hood 51 can be mounted inside the equipment housing 1 via a straight rod 57. Multiple water spray heads 511 are evenly arranged inside the cleaning hood 51, and one end of a water pipe 55 is connected to the multiple water spray heads 511. The other end of the water pipe 55 is connected to a cleaning water pump 53. The cleaning water pump 53 can then be connected to a water tank 52 located inside the equipment housing 1. This cleaning process is then applied to the lower surface of the single-sided circuit board. When cleaning the surface, cleaning water can be poured into the water tank 52, and then the cleaning water pump 53 can draw the cleaning water from it and send it into the spray head 511 through the water pipe 55. The spray head 511 can rinse the lower surface of the single-sided circuit board that enters the cleaning hood 51 to remove cleaning fluid and dirt residue. The wastewater after cleaning will fall into the cleaning hood 51. A drain pipe 56 can be connected to one side of the bottom of the cleaning hood 51 and connected to the recycling box 54 set in the equipment box 1 to recycle the wastewater after cleaning, so as to avoid the wastewater flowing randomly and polluting the working environment, as well as posing safety hazards to the equipment box 1 filled with electrical equipment.

[0043] It should be noted that the front and rear outer walls of the cleaning hood 51 described in the above embodiment are also equipped with displacement sensors. The arrival and departure of the circuit board are detected by the displacement sensors, and the controller is used for comprehensive management to control the operation and stop of the cleaning assembly 7.

[0044] The drying assembly 7 is located below the guide rail 2. The drying assembly 7 includes a water-absorbing roller 71, a drying pipe 75, a dryer 73, and a support 74. The support 74 is located at the bottom of the equipment housing 1. The water-absorbing roller 71 is rotatably connected to the top of the support 74. The water-absorbing roller 71 is made of water-absorbing material. The dryer 73 is located on one side of the support 74. One end of the drying pipe 75 is connected to the dryer 73, and the other end of the drying pipe 75 is equipped with a drying nozzle 72. The drying nozzles 72 are arranged side by side on one side of the water-absorbing roller 71.

[0045] Specifically, the cleaned single-sided circuit board continues to move towards the discharge port of the equipment housing 1. A drying component 7 can be installed near the discharge port below the guide rail 2. A bracket 74 can be installed and fixed inside the equipment housing 1. A water-absorbing roller 71 made of absorbent material is then mounted on the bracket 74, and a drying nozzle 71 is installed behind the water-absorbing roller 71. The drying nozzle 71 can be connected to the dryer 73 through the drying pipe 75, so that the water-absorbing roller 71 can roll and absorb the water stains on the lower surface of the cleaned single-sided circuit board. Then, the dryer 73 dries the lower surface of the single-sided circuit board through the drying nozzle 71 to thoroughly clean the single-sided circuit board.

[0046] It should be noted that a displacement sensor is installed at one end of the drying nozzle 72 near the water absorption roller 71 as described in the above embodiment. The controller detects the arrival of the circuit board through the displacement sensor, so as to realize the start and stop of the dryer 73 drying the lower surface of the single-sided circuit board through the drying nozzle 72.

[0047] In one embodiment of this application, such as Figure 2 and Figure 8 As shown, the dry ice cleaning mechanism includes a dry ice dispensing box 65, a pressurizing fan 63, a dry ice delivery pipe 64, and a dry ice nozzle 69. The dry ice dispensing box 65 is located on the top of the equipment housing 1. The pressurizing fan 63 is connected to the inner top of the equipment housing 1 and is connected to the dry ice dispensing box 65. The pressurizing fan 63 is connected to the dry ice nozzle 69 through the dry ice delivery pipe 64. The dry ice nozzle 69 is connected to the inner top of the isolation cover 61.

[0048] Specifically, when cleaning the components on the upper surface of a single-sided circuit board using a dry ice cleaning mechanism, a dry ice dispensing box 65 can be installed on the top of the equipment housing 1. The required dry ice can be placed in the box and crushed. A pressurizing fan 63 can also be installed and connected to the dry ice dispensing box 65. A dry ice conveying pipe 64 can be installed on the pressurizing fan 63 and connected to the isolation cover 61. This allows the pressurizing fan 63 to convey the dry ice from the dry ice dispensing box 65 to the isolation cover 61. A dry ice nozzle 69 can be installed inside the isolation cover 61 and connected to the dry ice conveying pipe 64. The dry ice particles conveyed by the dry ice nozzle 69 can then be used to clean the upper surface of the single-sided circuit board entering the isolation cover 61 to remove dirt from its surface.

[0049] In this embodiment, displacement sensors can be installed at both the front and rear ends of the isolation cover 61 to detect the arrival and departure of the circuit board. These sensors, combined with a controller, enable the automatic opening and closing of the dry ice cleaning mechanism and the vacuuming mechanism.

[0050] It should be noted that the dry ice dispensing box 65 is equipped with a crushing mechanism, which can crush the dry ice blocks put in into it into granules for dry ice cleaning, so that the pressurizing blower 63 can pressurize and blow them.

[0051] The dust collection mechanism includes a dust collection hood 62, a dust collection pipe 66, a dust collection fan 67, and a dust collection box 68. The dust collection hood 62 is connected to the top of one side of the isolation cover 61. The dust collection hood 62 is connected to the dust collection fan 67 through the dust collection pipe 66. The dust collection fan 67 is located on the top of the equipment housing 1 and is connected to the dust collection box 68. The dust collection box 68 is located on the top of the equipment housing 1. Barrier brush layers 611 are provided on the bottom of both sides of the isolation cover 61.

[0052] Specifically, while the dry ice cleaning mechanism cleans the single-sided circuit board, a vacuuming mechanism can be set up to remove the cleaned dirt. A vacuuming fan 67 and a dust collection box 68 can be installed on the top of the equipment housing 1. A vacuuming pipe 66 can be installed on the vacuuming fan 67, and a vacuuming hood 62 can be installed at the end of the vacuuming pipe 66. The vacuuming hood 62 can be connected to the top of one side of the isolation cover 61, so that the vacuuming fan 67 can suck up the dirt cleaned from the upper surface of the single-sided circuit board and transport it to the dust collection box 68 to prevent the cleaned dirt from falling back onto the cleaned circuit board. Furthermore, a barrier bristle layer 611 is provided on both sides of the bottom of the isolation cover 61 to isolate the upper surface of the single-sided circuit board from the outside with soft bristles.

[0053] In summary, the circuit board cleaning device of this application embodiment can use different cleaning methods on both sides of a single-sided circuit board. For the side of the single-sided circuit board where components are concentrated, dry ice particles can be blown by the dry ice cleaning mechanism to quickly freeze and catalyze the dirt attached to the side where components are concentrated, and finally remove it with the airflow. At the same time, the dust suction mechanism vacuums the cleaning area covered by the isolation cover and sucks up the removed dirt, thereby cleaning the side of the single-sided circuit board where components are concentrated without scratching the circuit board or damaging the components. Meanwhile, for the side of the single-sided circuit board where wires are concentrated, cleaning fluid can be applied to it, and then it can be cleaned by high-frequency brushing of the vibrating brush. After rinsing by the cleaning component, the cleaning fluid and dirt residue on the surface of the circuit board can be removed. Finally, the drying component removes water stains from the surface of the circuit board and dries it, thereby cleaning the single-sided circuit board with good cleaning effect and ensuring the integrity of the single-sided circuit board.

[0054] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0055] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0056] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A circuit board cleaning device, characterized by, The utility model relates to a kind of circuit board cleaning device, including: Device box, conveying assembly and cleaning assembly, wherein, The conveying assembly is arranged in the device box; The cleaning assembly is arranged in the device box, and the cleaning assembly includes lower panel cleaning assembly and upper panel cleaning assembly, wherein, The lower panel cleaning assembly is arranged below the conveying assembly, and the lower panel cleaning assembly includes smearing device and vibration brush, wherein, The smearing device is arranged at one side inside the device box, and the vibration brush is arranged at one side of the smearing device, and the lower panel cleaning assembly is sequentially smeared cleaning fluid and then high-frequency vibration brush cleaning to the lower surface of the circuit board to be cleaned by the smearing device and the vibration brush, to remove dirt on the lower surface of the circuit board to be cleaned; The upper panel cleaning assembly is arranged above the conveying assembly, and the upper panel cleaning assembly includes dry ice cleaning mechanism, isolation cover and dust collection mechanism, wherein, The dry ice cleaning mechanism is communicated with one side of the top of the isolation cover, and the dust collection mechanism is communicated with the other side of the top of the isolation cover, and the upper panel cleaning assembly uses the isolation cover as relatively closed cleaning space, and the upper surface of the circuit board to be cleaned is cleaned by the dry ice cleaning mechanism, while the dust collection mechanism sucks up the dirt blown up; The conveying assembly includes two guide rails and clamping plate, wherein, Two guide rails are penetrated from one side of the device box and extend out from the other side of the device box; The clamping plate includes socket and two electric sliding blocks, wherein, The socket is arranged on the front surface of the clamping plate, and the two side walls of the socket are provided with insertion grooves; Two electric sliding blocks are arranged on the two sides of the clamping plate respectively, and the electric sliding blocks are connected with the guide rails; The smearing device includes roller, cleaning fluid box and first vertical rod, wherein, The roller is arranged in the cleaning fluid box, and the two ends of the roller are rotatably connected with the inner wall of the cleaning fluid box, and the surface of the roller is surrounded by smearing brush strips; The cleaning fluid box stores cleaning fluid, and the bottom of the cleaning fluid box is connected with the first vertical rod, and the first vertical rod is installed on the inner bottom of the device box; The vibration brush includes brush plate, vibration brush strip, vibration motor, support plate, silica gel sheet, support plate and second vertical rod, wherein, The vibration brush strip is distributed on the upper surface of the brush plate; The top of the vibration motor is connected with the brush plate, and the bottom of the vibration motor is connected with the support plate; One side surface of the silica gel sheet is connected with the support plate, and the other side surface of the silica gel sheet is connected with the support plate; The bottom of the support plate is connected with the second vertical rod; The second vertical rod is installed on the inner bottom of the device box; The dry ice cleaning mechanism includes dry ice feeding box, pressure fan, dry ice conveying pipe and dry ice nozzle, wherein, The dry ice feeding box is arranged on the top of the device box; The pressure fan is connected with the inner top of the device box, and the pressure fan is communicated with the dry ice feeding box, and the pressure fan is connected with the dry ice nozzle through the dry ice conveying pipe; The dry ice nozzle is connected with the inner top of the isolation cover. The dust collection mechanism comprises a dust collection cover, a dust collection pipe, a dust collection fan and a dust collection box, wherein, The dust collection cover is connected with the top of one side of the isolation cover, and the dust collection cover is connected with the dust collection fan through the dust collection pipe; The dust collection fan is arranged on the top of the equipment box, and the dust collection fan is connected with the dust collection box, and the dust collection box is arranged on the top of the equipment box, and the bottom of the two sides of the isolation cover is provided with a barrier bristle layer.

2. The circuit board cleaning device of claim 1, wherein It also comprises a cleaning assembly and a drying assembly, wherein, The cleaning assembly is arranged on one side of the vibration brush, and the cleaning assembly is arranged below the guide rail, and the cleaning assembly comprises a cleaning cover, a water tank, a cleaning water pump and a recovery tank, wherein, The inner side of the cleaning cover is provided with a plurality of water spraying heads, the top of one side of the cleaning cover is provided with a brush layer, and the top of the other side of the cleaning cover is provided with a water absorbing layer, and the bottom of the cleaning cover is connected with the equipment box through a straight rod; The water tank is arranged on the inner bottom of the equipment box, the cleaning water pump is connected with the water tank, and the cleaning water pump is connected with the water spraying head through a water pipe; The recovery tank is connected with a drain pipe, and the recovery tank is connected with the inner bottom of one side of the cleaning cover through the drain pipe; The drying assembly is arranged on one side of the cleaning cover, and the drying assembly is arranged below the guide rail, and the drying assembly comprises a water absorbing roller, a drying pipe, a drying machine and a support, wherein, The support is arranged on the inner bottom of the equipment box; The water absorbing roller is rotatably connected with the top of the support, and the water absorbing roller is made of water absorbing material; The drying machine is arranged on one side of the support; One end of the drying pipe is connected with the drying machine, and the other end of the drying pipe is provided with a drying spraying head, and the drying spraying head is arranged on one side of the water absorbing roller in parallel.

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