A process for improving the post-stamping die symbol type problem

Abstract

This invention provides a process method to improve the conformity problem of post-process stamping dies, including the following steps: laser-cutting the first part; determining whether the stamped drawn part meets the pass rate requirements; locking the drawing pattern on the C / H holes of the drawn part; placing the drawn part on an OP20 die; performing blue light scanning on the OP20 die; inputting the scanned point cloud into the process data, adjusting it in the Z-axis and comparing it with the process data, and performing die surface compensation based on the point cloud data; and performing secondary processing on the surface of the OP20 die. The beneficial effects of this invention are: it is also applicable to conformity work in other processes, and has been verified as effective in multiple projects. It can effectively solve the conformity problem of process parts on the die, creating the necessary conditions to ensure that the final stamped parts are qualified and stable.

Description

Technical Field

[0001] This invention belongs to the technical field of stamping die process conformity, and in particular relates to a process method for improving the conformity problem of subsequent processes in stamping dies. Background Technology

[0002] In recent years, the domestic automotive industry has placed increasingly higher demands on the precision of stamped parts, not only pursuing higher single-item yield rates but also setting increasingly narrower tolerance zones. The initial requirement of simply meeting vehicle assembly standards has been upgraded to ±0.5, then to ±0.3, and even to requiring consistent tolerances. For the mold industry, every 0.1 reduction in tolerance zone exponentially increases the difficulty. Mold companies that do not improve their technical capabilities, manufacturing precision, and inspection accuracy will struggle to keep pace with the times and will eventually be eliminated. There are too many factors affecting part precision to list them all; this section will specifically discuss the issue of conformity to subsequent processes and develop a general method to guide mold manufacturing and development.

[0003] The quality of mold conformation in subsequent processes directly affects the final part's accuracy. This is a fundamental part of mold-making work, which consists of three key elements: conformation, positioning, and fitting. Because drawn parts experience springback deformation after demolding due to stress release, and in stamping processes, the second-stage trimming mold typically uses the same mold as the drawn part, placing the springback-deformed drawn part on the trimming mold will result in conformation problems. Poor conformation can cause the following issues:

[0004] 1. Poor positioning of the trimming die: Since trimming and punching dies are generally positioned by the shape surface, if the shape is not good, the positioning will be poor. The final result of poor positioning is that the dimensional accuracy of the part is unstable.

[0005] 2. Even with the addition of auxiliary positioning measures, such as crescent positioning, to ensure reliable positioning, the poor conformation of the part shape will cause secondary deformation of the part surface during the trimming and pressing core operation. This is a direct cause of unstable dimensional accuracy of the part in the later stages. Summary of the Invention

[0006] In view of this, the present invention aims to propose a process method to improve the conformity problem of post-process stamping dies, so as to effectively solve the conformity problem of post-process die parts and improve the stability of dimensional accuracy.

[0007] To achieve the above objectives, the technical solution of the present invention is implemented as follows:

[0008] A process method for improving the conformity problem of post-processing of stamping dies includes the following steps:

[0009] S1. The first piece is punched using laser cutting to obtain the cut drawn part;

[0010] S2. Punch the cut drawn parts and determine whether the punched drawn parts meet the pass rate requirements and the drawing type is locked. If yes, proceed to step S3; otherwise, proceed to the end.

[0011] S3. Punch C / H holes on the drawn part, match the C / H positioning holes on the OP20 mold with the C / H holes, and place the drawn part on the OP20 mold;

[0012] S4. The drawn part is placed on the OP20 mold and scanned with blue light.

[0013] S5. Input the scanned point cloud into the process model, and make adjustments in the Z direction to compare it with the process model. Perform surface compensation on the process model according to the point cloud data.

[0014] S6. Perform secondary processing on the surface of the OP20 mold according to the OP20 process parameters.

[0015] Furthermore, before placing the drawn part on the OP20 mold for blue light scanning in step S4, the OP20 mold needs to be placed on a standard platform or a blue light workbench for scanning.

[0016] Furthermore, before the drawn part is placed on the OP20 mold for blue light scanning in step S4, the following steps are included:

[0017] S41a. Locate the points on the OP20 mold based on the best fit result of the blue light scan;

[0018] S42a. Select support pads of different thicknesses according to the size of the deformation of the drawn part;

[0019] S43a, Place the support pad at the OP20 mold position in step S41a.

[0020] Furthermore, when the drawn part is placed on the OP20 mold for blue light scanning in step S4, the following steps are included:

[0021] S41b, First scan the three reference holes of the OP20 mold;

[0022] S42b: Locate the center of the OP20 mold based on the reference hole and establish the XYZ coordinate system;

[0023] S43b, Perform blue light scanning.

[0024] Furthermore, the C / H positioning hole on the OP20 mold is located on the X-axis of the OP20 mold.

[0025] Furthermore, the three reference holes of the OP20 mold are located on the X-axis and Y-axis of the OP20 mold, respectively.

[0026] Compared with existing technologies, the process method for improving the conformity problem of post-processing of stamping dies described in this invention has the following advantages:

[0027] The process method for improving the conformity problem of post-process stamping dies described in this invention is also applicable to conformity work in other processes and has been verified as effective in multiple projects. It effectively solves the conformity problem of process parts on the die, creating the necessary conditions for ensuring the final stamping of qualified and stable stamped parts. Attached Figure Description

[0028] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0029] Figure 1 This is a schematic diagram of the product digital model according to an embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of the OP10 stamping process layout according to an embodiment of the present invention;

[0031] Figure 3 The left side of the drawing is a schematic diagram of the blue light scanning results of the drawn part according to an embodiment of the present invention;

[0032] Figure 4 This is a schematic diagram of the drawn part being installed onto the OP20 mold according to an embodiment of the present invention;

[0033] Figure 5 This is the compensation cloud map after compensating the OP20 process type based on the blue light point cloud, as described in this embodiment of the invention;

[0034] Figure 6 This is a schematic diagram illustrating the overlay and comparison of UG data according to an embodiment of the present invention;

[0035] Figure 7 This is a schematic diagram of the final part inspection report according to an embodiment of the present invention;

[0036] Figure 8 This is a schematic diagram of the OP20 stamping process layout according to an embodiment of the present invention;

[0037] Figure 9 The diagram on the right shows the blue light scanning results of the drawn part according to an embodiment of the present invention.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1. OP20 mold; 2. Support pad; 3. Reference hole; 4. C / H hole. Detailed Implementation

[0040] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0041] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0042] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0043] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0044] like Figures 1 to 9 As shown, a process method for improving the conformity problem of post-processing of stamping dies includes the following steps:

[0045] S1. The first piece is punched using laser cutting to obtain the cut drawn part;

[0046] S2. Punch the cut drawn parts and determine whether the punched drawn parts meet the pass rate requirements and the drawing type is locked. If yes, proceed to step S3; otherwise, proceed to the end.

[0047] S3. Stamp C / H holes 4 on the drawn part, and place the drawn part on the OP20 mold 1 by matching C / H positioning holes 4 with C / H positioning holes on the OP20 mold 1.

[0048] S4. The drawn part is placed on OP20 mold 1 and scanned with blue light;

[0049] S5. Input the scanned point cloud into the process model, and make adjustments in the Z direction to compare it with the process model. Perform surface compensation on the process model according to the point cloud data.

[0050] S6. Perform secondary processing on the surface of OP20 mold 1 according to the OP20 process parameters.

[0051] This invention is also applicable to conformation work in other processes, and has been verified as effective in multiple projects. It effectively solves the conformation problem of process parts on the mold, creating the necessary conditions to ensure that qualified and stable stamped parts are produced in the final stamping.

[0052] In a preferred embodiment of the present invention, before placing the drawn part on the OP20 mold 1 for blue light scanning in step S4, the OP20 mold 1 needs to be placed on a standard platform or a blue light workbench for scanning.

[0053] In a preferred embodiment of the present invention, before the drawn part is placed on the OP20 mold 1 for blue light scanning in step S4, the following steps are included:

[0054] S41a. Locate the points on OP20 mold 1 based on the best fit result of blue light scanning;

[0055] S42a. Select support pads 2 of different thicknesses according to the size of the deformation of the drawn part;

[0056] S43a, Place the support pad 2 at point OP20 mold 1 in step S41a.

[0057] In a preferred embodiment of the present invention, when the drawn part is placed on the OP20 mold 1 for blue light scanning in step S4, the following steps are included:

[0058] S41b, First scan the three reference holes 3 of OP20 mold 1;

[0059] S42b. Locate the center of OP20 mold 1 based on the reference hole and establish the XYZ coordinate system;

[0060] S43b, Perform blue light scanning.

[0061] In a preferred embodiment of the present invention, the C / H positioning hole on the OP20 mold 1 is located on the X coordinate axis of the OP20 mold 1.

[0062] In a preferred embodiment of the present invention, the three reference holes 3 of the OP20 mold 1 are respectively located on the X-axis and Y-axis of the OP20 mold 1.

[0063] Example 1

[0064] like Figures 1 to 9As shown below, this is a case study of the OP20 trimming mold for aluminum plate top cover.

[0065] The current approach involves a fitter manually interfering with the work by conforming the shape of the drawn part. This is not only very labor-intensive, but also makes it difficult to guarantee the precision of the die. The common practice now is to scan the drawn part with white or blue light, and then process the OP20 trimming die according to the scan results. (See...) Figure 3 , Figure 9 .

[0066] How to minimize deviations during blue light scanning of drawn parts and how to compare the scanned point cloud with the process data are key issues we need to explore. Through long-term exploration and practice, we have developed a feasible method, as described below:

[0067] First principle: Since the quality of the OP20 trimming die greatly affects the final result, the first part should not be stamped with the OP20 die. Instead, laser cutting should be used, followed by other subsequent stamping processes.

[0068] The second principle is to address the conformity issue of the OP20 trimming mold only after the final product meets the pass rate requirements and the drawing type is locked.

[0069] The third principle: Place the drawn part on the OP20 punch with pads for blue light scanning. Place 3-4 pads at appropriate positions on the punch. Before scanning, find points with minimal springback based on the best-fit results of blue light scanning during previous part rectification processes, and place the pads at these points. Select pads of different thicknesses according to the magnitude of the drawn part's deformation. The purpose of adding pads is to prevent the collapsed parts of the part from interfering with the punch, affecting the scanning results. See [link to relevant documentation]. Figure 4 .

[0070] Fourth principle: The drawn part is positioned using C / H holes on OP20. The C / H holes need to be pre-stamped on the drawn part. After adding a shim to the punch, the part is completely separated from the punch; only positioning with the C / H holes can ensure the correspondence between the part and the die in the XY directions. See... Figure 4 .

[0071] Fifth principle: The OP20 mold must be placed on a standard platform or Blu-ray workbench for scanning; it should not be placed randomly on the ground. Uneven ground will cause mold deformation and affect scanning accuracy.

[0072] Sixth principle: After the above work is completed, the scanning work can begin. Before scanning, the three reference holes of the mold should be scanned first. The mold center should be found based on the reference holes and the XYZ coordinate system should be established. The purpose of doing this is to ensure the correspondence between the scanned point cloud and the mold coordinates, so as to provide convenient conditions for point cloud input and comparison with the stamping process model.

[0073] Seventh principle: Stamping process personnel input the point cloud into the process data model, make adjustments in the Z direction and compare it with the process data, and perform die surface compensation on the process data model according to the point cloud data.

[0074] Eighth principle: The manufacturing department shall perform secondary processing on the OP20 mold surface according to the latest OP20 process parameters to meet the conformity requirements.

[0075] Below is the compensation cloud map after compensating the OP20 process model based on the blue light point cloud. Figure 5 Comparison chart of ) and UG data overlay ( Figure 6 The final compensated data is overlaid and compared with the original data (green represents the compensated data):

[0076] After rectification, the overall pass rate of the part reached over 95%, and the pass rate of key dimensions reached 100%, fully meeting the customer's requirements. Figure 7 This is the final part inspection report.

[0077] The key to this invention lies in the following: C / H hole positioning scanning, shim scanning, and establishing a coordinate system for the mold reference hole, which can be extended to the mold manufacturing of all stamping parts.

[0078] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A process method for improving the conformity problem of subsequent processes in stamping dies, characterized in that: Includes the following steps: S1. Since the quality of the OP20 trimming die greatly affects the final result, laser cutting is used to punch the first part to obtain the cut drawn part. S2. Punch the cut drawing part and determine whether the punched drawing part meets the pass rate requirement and the drawing type is locked. If yes, proceed to step S3. No, then proceed to the end; S3. Punch C / H holes (4) on the drawn part, match the C / H positioning holes on the OP20 mold (1) through the C / H holes (4), and place the drawn part on the OP20 mold (1). The drawn part is positioned on the OP20 using C / H holes. The drawn part needs to have C / H holes punched in advance. After adding support pads (2) to the punch of the OP20 mold (1), the drawn part is completely separated from the punch. Only by relying on C / H holes for positioning can the correspondence between the drawn part and the OP20 mold (1) in the XY direction be guaranteed. S4. The drawn part is placed on the OP20 mold (1) and scanned with blue light; S5. Input the scanned point cloud into the process model, and make adjustments in the Z direction to compare it with the process model. Perform surface compensation on the process model according to the point cloud data. S6. Perform secondary processing on the surface of OP20 mold (1) according to the OP20 process number; before placing the drawn part on OP20 mold (1) for blue light scanning in step S4, OP20 mold (1) needs to be placed on a standard platform or blue light workbench for scanning; Before the drawn part in step S4 is placed on the OP20 mold (1) for blue light scanning, the following steps are included: S41a. Find the point on the OP20 mold (1) based on the best fitting result of the blue light scan; S42a. Select support pads of different thicknesses according to the size of the deformation of the drawn part (2); S43a. Place the support pad (2) at the punch position of the OP20 mold (1) in step S41a. The number of support pads (2) is 3-4. Before scanning, find the point with less springback based on the best fitting result of blue light scanning in the previous process of refining the drawn part and place the pad. Select support pads (2) of different thicknesses according to the size of the deformation of the drawn part. The purpose of adding support pads (2) is to prevent the collapsed part of the part from interfering with the punch and affecting the scanning result. When the drawn part in step S4 is placed on the OP20 mold (1) for blue light scanning, the following steps are included: S41b, First scan the three reference holes (3) of the OP20 mold (1); S42b. Find the center of OP20 mold (1) based on the reference hole (3) and establish the XYZ coordinate system to ensure the correspondence between the scanned point cloud and the mold coordinates, and provide convenient conditions for point cloud input and stamping process comparison. S43b, Perform blue light scanning; The C / H positioning hole on the OP20 mold (1) is located on the X coordinate axis of the OP20 mold (1); The three reference holes (3) of the OP20 mold (1) are located on the X-axis and Y-axis of the OP20 mold (1) respectively; Based on the compensation cloud map and UG data overlay comparison of the OP20 process model after compensation using blue light point cloud, the final compensation data is compared with the original data. After rectification, the overall pass rate of the part reached over 95%, and the pass rate of key dimensions reached 100%, fully meeting the customer's requirements. The C / H hole positioning scan, shim scanning, and establishment of a coordinate system for the die reference hole can be extended to the die manufacturing of all stamping parts.

2. An electronic device, comprising a processor and a memory communicatively connected to the processor and used for storing processor-executable instructions, characterized in that: The processor is used to execute the process method for improving the conformity problem of post-process of stamping die as described in claim 1.

3. A server, characterized in that: It includes at least one processor and a memory communicatively connected to the processor, the memory storing instructions executable by the at least one processor, the instructions being executed by the processor to cause the at least one processor to perform a process method for improving the conformity problem of post-processing of stamping dies as described in claim 1.

4. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by the processor, it implements the process method for improving the conformity problem of subsequent processes in stamping dies as described in claim 1.

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