Laser processing method and device for mechanical seal end surface waviness

Abstract

This application relates to the field of mechanical seal technology, and particularly to a method and apparatus for laser processing of the waviness of a mechanical seal end face. The method includes: determining the number of circumferential rotations based on a circumferential periodic structure; dividing the structure into multiple stepped regions according to radial taper; drawing a processing layer corresponding to each stepped region; importing the processing layer corresponding to the first stepped region along with the installation test piece, alignment, focusing, and setting process parameters to complete the processing of the first stepped region within a single periodic structure; completing the first stepped region processing after a certain number of circumferential rotations; and sequentially importing the remaining stepped regions until all stepped regions within the entire cycle are processed. This application's embodiment allows for rotational splicing based on a circumferential periodic structure and sequential processing of each stepped region. While achieving efficient operation, it ensures stable quality of the laser processing of the end face waviness, thereby reducing the operational difficulty of mechanical seals, improving the accuracy and pass rate of processing results, and making it more practical.

Description

Technical Field

[0001] This application relates to the field of mechanical seal technology, and in particular to a method and apparatus for laser processing of the waviness of a mechanical seal end face. Background Technology

[0002] Bode's end-face mechanical seal is a non-contact mechanical seal that utilizes the structural characteristics of the end face to generate a fluid dynamic and static pressure effect, forming a micron-level fluid film between the dynamic and static ring end faces to achieve non-contact operation. It is widely used in industries such as nuclear industry and chemical industry.

[0003] In related technologies, the processing defects of end face waviness will directly affect the formation of fluid film in the sealing gap and reduce the stability of the seal. Laser processing technology has advantages such as high processing efficiency, large degree of freedom in surface micro-texture processing, and controllable quality, and can be used for precision processing of surface texture.

[0004] However, the dynamic pressure grooves processed in the relevant technologies lack circumferential continuity and have a single processing depth variation, making them difficult to use for processing complex waviness textures. Furthermore, the process of end face waviness is constrained by external conditions, resulting in a cumbersome processing process, low pass rate, and inability to meet high-precision processing requirements, leading to insufficient processing accuracy, which urgently needs to be addressed. Summary of the Invention

[0005] This application provides a method and apparatus for laser processing of the waviness of mechanical seal end face, in order to solve the problems in the related technology where the processed dynamic pressure groove type lacks continuity in the circumferential direction, the processing depth varies only once, making it difficult to process complex waviness textures, and the process of end face waviness is constrained by external conditions, resulting in a cumbersome processing process, low pass rate, inability to meet high precision processing requirements, and insufficient processing accuracy.

[0006] The first aspect of this application provides a laser processing method for the waviness of a mechanical seal end face, comprising the following steps: determining the number of circumferential rotation processing times based on a circumferential periodic structure; determining the single processing depth based on the maximum height difference formed by the radial taper to divide multiple stepped regions; drawing a processing layer corresponding to each of the multiple stepped regions; importing the processing layer corresponding to the first stepped region of the multiple stepped regions, and installing the test piece, aligning, focusing, and setting process parameters to start processing using a laser; after completing the first stepped processing within a single periodic structure, rotating the circumferential rotation processing times to complete the first stepped processing within the entire cycle, and sequentially importing the remaining stepped regions until all stepped processing within the entire cycle is completed.

[0007] Optionally, in one embodiment of this application, the processing layer includes laser processing paths to form a circumferentially distributed waviness.

[0008] Optionally, in one embodiment of this application, the number of circumferential rotation processing operations is in the range of [0, 50].

[0009] Optionally, in one embodiment of this application, the single processing depth ranges from 0 to 50 μm, and the number of stepped regions ranges from 1 to 100.

[0010] Optionally, in one embodiment of this application, drawing the processing layer corresponding to each of the plurality of stepped regions includes: determining the outline of the corresponding processing layer by the end face geometry corresponding to each stepped region.

[0011] A second aspect of this application provides a mechanical seal end face waviness laser processing apparatus, comprising: an acquisition module for determining the number of circumferential rotation processing times based on a circumferential periodic structure; and a division module for determining the single processing depth based on the maximum height difference formed by the radial taper, so as to divide multiple stepped regions.

[0012] The drawing module is used to draw the processing layer corresponding to each of the multiple stepped areas; the import module is used to import the processing layer corresponding to the first stepped area of ​​the multiple stepped areas, and to install the test piece, align, focus, and set the process parameters to start processing using the laser; the processing module is used to complete the first stepped processing within a single cycle structure, rotate the circumferential rotation processing number of times, complete the first stepped processing within the entire cycle, and sequentially import the remaining stepped areas until all stepped processing within the entire cycle is completed.

[0013] Optionally, in one embodiment of this application, the processing layer includes laser processing paths to form a circumferentially distributed waviness.

[0014] Optionally, in one embodiment of this application, the number of circumferential rotation processing operations is in the range of [0, 50].

[0015] Optionally, in one embodiment of this application, the single processing depth ranges from 0 to 50 μm, and the number of stepped regions ranges from 1 to 100.

[0016] Optionally, in one embodiment of this application, the drawing module includes: a determining unit, used to determine the outline of the corresponding processing layer by the end face geometry corresponding to each stepped region.

[0017] A third aspect of this application provides an electronic device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the mechanical seal end face waviness laser processing method as described in the above embodiments.

[0018] A fourth aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described mechanical seal end face waviness laser processing method.

[0019] This application embodiment can determine the number of circumferential rotation processing times based on the circumferential periodic structure, and determine the single processing depth based on the maximum height difference formed by the radial taper, thereby dividing the structure into multiple stepped regions. A processing layer corresponding to each stepped region is drawn, and the processing layer corresponding to the first stepped region of the multiple stepped regions is imported. The sample is installed, aligned, focused, and process parameters are set to begin processing using a laser. After completing the first stepped processing within a single periodic structure, the circumferential rotation processing is repeated a certain number of times to complete the first stepped processing within the entire cycle. The remaining stepped regions are then imported sequentially until all stepped processing within the entire cycle is completed. This achieves efficient operation while ensuring stable quality of end-face waviness laser processing, thereby reducing the operational difficulty of mechanical seals, improving the accuracy and pass rate of processing results, and making it more practical. This solves the problems in related technologies where the processed dynamic pressure groove type lacks circumferential continuity, has a single processing depth variation, is difficult to use for processing complex waviness textures, and the end-face waviness process is constrained by external conditions, resulting in a cumbersome processing process, low pass rate, inability to meet high-precision processing requirements, and insufficient processing accuracy.

[0020] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0021] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0022] Figure 1 This is a flowchart illustrating a method for laser processing of the waviness of a mechanical seal end face according to an embodiment of this application.

[0023] Figure 2 This is a schematic diagram of the laser processing of the mechanical seal end face waviness according to an embodiment of this application;

[0024] Figure 3 This is a schematic diagram of the waviness of the mechanical seal end face according to an embodiment of this application;

[0025] Figure 4 This is a schematic diagram of the stepped region division according to an embodiment of this application;

[0026] Figure 5 This is a schematic diagram of the processing layer according to an embodiment of this application;

[0027] Figure 6This is a schematic diagram of the actual machining morphology of the radial taper region according to an embodiment of this application;

[0028] Figure 7 This is a schematic diagram of the mechanical seal end face waviness laser processing apparatus according to an embodiment of this application;

[0029] Figure 8 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application. Detailed Implementation

[0030] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0031] The following describes a method and apparatus for laser processing the waviness of a mechanical seal end face according to embodiments of this application, with reference to the accompanying drawings. Addressing the issues mentioned in the background art where the processed dynamic pressure grooves lack circumferential continuity, have a single processing depth variation, are difficult to use for processing complex waviness textures, and are subject to external constraints in the end face waviness processing, resulting in cumbersome processing, low yield, and inability to meet high-precision processing requirements, this application provides a laser processing method for the waviness of a mechanical seal end face. This method determines the number of circumferential rotation processing steps based on the circumferential periodic structure and determines the single processing depth based on the maximum height difference formed by the radial taper, thereby dividing the area into multiple stepped regions and drawing multiple stepped regions. The processing layer corresponding to each stepped area is imported, and the processing layer corresponding to the first stepped area of ​​multiple stepped areas is imported. This is followed by sample installation, alignment, focusing, and setting process parameters to begin laser processing. After completing the first stepped processing within a single-cycle structure, the first stepped processing within the entire cycle is completed after a certain number of circumferential rotations. The remaining stepped areas are then imported sequentially until all stepped processing within the entire cycle is completed. This achieves efficient operation while ensuring stable quality of end-face waviness laser processing, thereby reducing the operational difficulty of mechanical seals, improving the accuracy and pass rate of processing results, and making it more practical. This solves the problems in related technologies where the processed dynamic pressure groove type lacks circumferential continuity, has a single processing depth variation, is difficult to use for processing complex waviness textures, and the end-face waviness process is constrained by external conditions, resulting in cumbersome processing, low pass rate, and inability to meet high-precision processing requirements, leading to insufficient processing accuracy.

[0032] Specifically, Figure 1 This is a schematic flowchart of a mechanical seal end face waviness laser processing method provided in an embodiment of this application.

[0033] like Figure 1As shown, the laser processing method for the waviness of the mechanical seal end face includes the following steps:

[0034] In step S101, the number of circumferential rotation processing times is determined based on the circumferential periodic structure.

[0035] It is understood that the circumferential periodic structure in the embodiments of this application can be composed of several identical structures repeated along the circumferential direction. The circumferential periodic structure of the waviness end face can be composed of several end faces with the same waviness repeated along the circumferential direction. The periodicity can be obtained by analyzing the structural characteristics of the mechanical seal end face waviness, and the number of circumferential rotation processing can be determined accordingly. For example, if the end face is composed of 9 identical waviness parts repeated, the number of rotation processing can be determined to be 8.

[0036] The embodiments of this application can determine the number of circumferential rotational machining operations based on the circumferential periodic structure. By performing quantitative analysis on the end face waviness, the required number of machining operations can be provided for the rotational machining of each step in the following steps.

[0037] Optionally, in one embodiment of this application, the number of circumferential rotation processes is in the range of [0, 50].

[0038] It is understood that the number of circumferential rotation processing times in this embodiment is limited to 0 to 50 times. By specifying the maximum and minimum number of circumferential rotation processing times, redundancy in the execution of laser processing operations is avoided, thus ensuring the processing efficiency of the mechanical seal.

[0039] In step S102, the single processing depth is determined based on the maximum height difference formed by the radial taper, so as to divide multiple stepped areas.

[0040] It is understood that in the embodiments of this application, the maximum height difference can be determined by the radial taper region of the workpiece, thereby obtaining the single processing depth for the workpiece, and then determining the number of steps and confirming the location of each step region. The step region can be a step area formed by replacing the taper with several steps whose height is the set single processing depth value, based on the cross-sectional geometric parameters of the radial taper.

[0041] In actual execution, the cross-sectional shape of the radial taper region of the processed object can be a single taper, double taper, multiple tapers, stepped shape, various curves, etc., and the contour shape of the end face of the radial taper region can be an arc, a sine curve, a straight line, etc.

[0042] The embodiments of this application can determine the single processing depth based on the maximum height difference formed by the radial taper, so as to divide multiple stepped areas, thereby providing the necessary data basis for realizing the layered processing of mechanical seals in the following steps, and improving the precision level of the laser processing process.

[0043] Optionally, in one embodiment of this application, the single processing depth ranges from 0 to 50 μm, and the number of stepped regions ranges from 1 to 100.

[0044] In actual implementation, when dividing the stepped regions for laser processing of the mechanical seal end face waviness in this embodiment of the application, the single processing depth of each stepped region can be set to a range of 0 to 50 μm, and the number of stepped regions divided according to the single processing depth can be set to a range of 1 to 100. By limiting the range of single processing depth and the number of stepped regions, the operating conditions of the laser processing process are further improved, and the processing efficiency of the mechanical seal is further guaranteed.

[0045] In step S103, a processing layer corresponding to each of the multiple stepped areas is drawn.

[0046] It is understood that, in the embodiments of this application, the stepped areas divided in the above steps can be drawn separately to obtain the processing layers corresponding to each stepped area. For example, AutoCAD software can be used to draw each stepped area to obtain the corresponding processing layers, and then save them separately.

[0047] The embodiments of this application can draw a processing layer corresponding to each of the multiple stepped regions, thereby obtaining the processing basis for each of the divided stepped regions and providing processing schemes for each stepped region, further improving the executability of the mechanical seal laser processing process.

[0048] Optionally, in one embodiment of this application, the processing layer includes laser processing paths to form a circumferentially distributed waviness.

[0049] In some embodiments, the laser processing path spacing can be set to 0–1 mm. The processing layer in this application embodiment includes laser processing paths to form a circumferentially distributed waviness, thereby providing the required processing layer information for the rotational processing of the single-periodic structure in the following steps.

[0050] Optionally, in one embodiment of this application, drawing a processing layer corresponding to each of the multiple stepped regions includes: determining the outline of the corresponding processing layer by the end face geometry corresponding to each stepped region.

[0051] It is understood that the outline of the processing layer in this application embodiment can be obtained from the end face geometry of each step region obtained in the above steps, which can reflect the end face shape of the step region, thereby further obtaining the processing layer information.

[0052] In step S104, the processing layer corresponding to the first step area of ​​the multiple stepped areas is imported, and the test piece is installed, aligned, focused, and the process parameters are set to start processing using a laser.

[0053] In some embodiments, the process parameters can be set to a laser speed of 0–4000 m / s, a frequency of 0–120 kHz, and a power of 0–100% to perform laser processing. The installed test piece can be the object of laser processing of the mechanical seal end face. The test piece can be made of any material, such as cemented carbide, tungsten carbide, silicon nitride, and stainless steel.

[0054] This application embodiment can import the processing layer corresponding to the first step area of ​​multiple step areas, and install the test piece, align, focus, and set process parameters to start processing using a laser. By executing the operation preparation program for the first step area of ​​mechanical seal end face laser processing, an operating environment is provided for completing the first step processing of the single-cycle structure in the following steps, making the operation simpler and more efficient.

[0055] In step S105, after completing the first step machining within the single-cycle structure, after rotating circumferentially a number of times, the first step machining within the entire cycle is completed, and the remaining step areas are sequentially introduced until all step machining within the entire cycle is completed.

[0056] It is understood that the first step processing within the single-cycle structure of this application embodiment can be a laser processing operation performed on a single portion of the same waviness in the first step region. Then, the circumferential rotation processing number of the first step region obtained from the above steps is used for rotation processing to obtain the first step processing result within the entire cycle. Similarly, the processing layer of the remaining step regions is sequentially imported for laser processing operations. The processing surface should be ground before processing the next step region and after all processing is completed to obtain the full-cycle step processing result corresponding to each step region, that is, to obtain the final mechanical seal end face waviness laser processing state.

[0057] The embodiments of this application can complete the first step processing within a single-cycle structure after completing the first step processing, and then complete the circumferential rotation processing a number of times to complete the first step processing within the entire cycle. The remaining step areas are then sequentially introduced until all step processing within the entire cycle is completed. This achieves efficient operation while ensuring stable quality of end-face waviness laser processing and improving the accuracy of mechanical seal end-face waviness laser processing.

[0058] The following is combined Figure 2-6 The working content of the embodiments of this application will be described in detail with reference to a specific example, such as Figure 2 The diagram shown is a schematic diagram of the laser processing of the mechanical seal end face waviness according to an embodiment of this application.

[0059] First, based on the structural characteristics of the mechanical seal end face waviness, the periodicity of the operating object is analyzed to determine the corresponding number of circumferential rotation processing times M. Figure 3 This is a schematic diagram of the waviness of the mechanical seal end face according to an embodiment of this application. It can be seen that the end face consists of a planar dam area (1) and a radial taper area (2), with a tangent circular arc (3) at their junction. The end face is composed of nine identical wavinesses ① to ⑨, thus determining that the number of rotational machining operations M is 8. The expression for the height H of the taper area is H(r, θ) = (rR) / (rR) linjie (θ))·tan(β),

[0060] Where H is the height of the taper region, r is the radial coordinate, θ is the circumferential coordinate, β is the taper of the radial taper region, and R... linjie (θ) is the radius of the boundary line between the planar dam area and the radial taper area, and it has a periodic structure along the circumference.

[0061] Secondly, determine the individual processing depth h, and divide the area into N stepped regions. For example... Figure 4 The diagram shown is a schematic diagram of the stepped area division according to an embodiment of this application. The maximum height difference H of the radial taper area is set to 13μm, and the single processing depth h is 1.3μm. Then, N=10 stepped areas can be divided, which are ordered from high to low as stepped areas 1 to 10.

[0062] Next, draw the machining layer and import the first-step machining layer, install the test piece, align and focus it, and set the process parameters. Based on the location of each step area, draw the corresponding machining layer for each step area in AutoCAD, using the default line type to draw the laser machining path. For example... Figure 5 The diagram shown illustrates a processing layer according to an embodiment of this application. The drawn processing layer can be saved in DXF format and imported into the processing layer corresponding to the first step of the laser. The specimen is mounted on the processing table, and the X and Y axis coordinates of the table are adjusted to (112.249, -30), with the focal plane height coordinate set to 262. The specimen material is cemented carbide, and the process parameters are set as follows: laser speed 2000 m / s, frequency 60 kHz, power 65%. The processing platform is set to automatically rotate 40°, and the laser is then started to begin processing.

[0063] Finally, the first step of the machining process is completed by rotating the machine M times, and then the second to Nth machining layers are imported sequentially. This process is repeated to obtain the final result. The first step region within a single waviness is machined by rotating the machine 8 times to complete the machining of the first step region throughout the entire cycle. The second to tenth layers are then imported sequentially, and the process is repeated until completion.

[0064] like Figure 6The diagram shown is a schematic representation of the actual machining morphology of the radial taper region according to an embodiment of this application. A surface profilometer was used to measure the morphology of the widest part of the taper surface from the inner diameter to the outer diameter, revealing that the taper of the radial taper region is approximately 1400 μrad, which closely matches the ideal taper surface.

[0065] The mechanical seal end face waviness laser processing method proposed in this application can determine the number of circumferential rotation processing times based on the circumferential periodic structure, and determine the single processing depth based on the maximum height difference formed by the radial taper, thereby dividing the area into multiple stepped regions. A processing layer corresponding to each stepped region is drawn, and the processing layer corresponding to the first stepped region of the multiple stepped regions is imported. The method involves installing the test piece, aligning, focusing, and setting process parameters to begin processing using a laser. After completing the first stepped processing within a single periodic structure, the circumferential rotation processing times are repeated to complete the first stepped processing within the entire cycle. The remaining stepped regions are then imported sequentially until all stepped processing within the entire cycle is completed. This method achieves efficient operation while ensuring stable quality of end face waviness laser processing, thereby reducing the operational difficulty of mechanical seals, improving the accuracy and pass rate of processing results, and making it more practical. This solves the problems in related technologies, such as the lack of circumferential continuity in the processing of dynamic pressure grooves, the single variation in processing depth, the difficulty in processing complex waviness textures, and the fact that the end face waviness process is constrained by external conditions, making the processing cumbersome, the yield rate low, and unable to meet the requirements of high-precision processing, resulting in insufficient processing accuracy.

[0066] Next, the mechanical seal end face waviness laser processing apparatus according to the embodiments of this application is described with reference to the accompanying drawings.

[0067] Figure 7 This is a block diagram of a mechanical seal end face waviness laser processing device according to an embodiment of this application.

[0068] like Figure 7 As shown, the mechanical seal end face waviness laser processing device 10 includes: an acquisition module 100, a division module 200, a drawing module 300, an import module 400, and a processing module 500.

[0069] The acquisition module 100 is used to determine the number of circumferential rotation processing steps based on the circumferential periodic structure.

[0070] The dividing module 200 is used to determine the single processing depth based on the maximum height difference formed by the radial taper, so as to divide multiple stepped areas.

[0071] The drawing module 300 is used to draw the processing layer corresponding to each of the multiple stepped areas.

[0072] Import module 400 is used to import the processing layer corresponding to the first step area of ​​multiple stepped areas, and to install the test piece, align, focus, and set process parameters to start processing using the laser.

[0073] The processing module 500 is used to complete the first step processing within a single-cycle structure, and after rotating circumferentially a number of times, complete the first step processing within the entire cycle, and then sequentially import the remaining step areas until all step processing within the entire cycle is completed.

[0074] Optionally, in one embodiment of this application, the processing layer includes laser processing paths to form a circumferentially distributed waviness.

[0075] Optionally, in one embodiment of this application, the number of circumferential rotation processes is in the range of [0, 50].

[0076] Optionally, in one embodiment of this application, the single processing depth ranges from 0 to 50 μm, and the number of stepped regions ranges from 1 to 100.

[0077] Optionally, in one embodiment of this application, the drawing module 300 includes a determining unit.

[0078] The defining unit is used to determine the outline of the corresponding machining layer based on the end face geometry of each stepped region.

[0079] It should be noted that the foregoing explanation of the embodiment of the mechanical seal end face waviness laser processing method also applies to the mechanical seal end face waviness laser processing device of this embodiment, and will not be repeated here.

[0080] The mechanical seal end face waviness laser processing device proposed in this application can determine the number of circumferential rotation processing times based on the circumferential periodic structure, and determine the single processing depth based on the maximum height difference formed by the radial taper, so as to divide multiple stepped areas. A processing layer corresponding to each stepped area of ​​the multiple stepped areas is drawn, and the processing layer corresponding to the first stepped area of ​​the multiple stepped areas is imported. The device is then used to install the test piece, align, focus, and set process parameters to start processing using a laser. After completing the first stepped processing within a single periodic structure, the device rotates circumferentially a certain number of times to complete the first stepped processing within the entire cycle. The remaining stepped areas are then imported sequentially until all stepped processing within the entire cycle is completed. This achieves efficient operation while ensuring stable quality of the end face waviness laser processing, thereby reducing the operational difficulty of mechanical seals, improving the accuracy and pass rate of processing results, and making it more practical. This solves the problems in related technologies, such as the lack of circumferential continuity in the processing of dynamic pressure grooves, the single variation in processing depth, the difficulty in processing complex waviness textures, and the fact that the end face waviness process is constrained by external conditions, making the processing cumbersome, the yield rate low, and unable to meet the requirements of high-precision processing, resulting in insufficient processing accuracy.

[0081] Figure 8 A schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device may include:

[0082] The memory 801, the processor 802, and the computer program stored on the memory 801 and capable of running on the processor 802.

[0083] When the processor 802 executes the program, it implements the mechanical seal end face waviness laser processing method provided in the above embodiments.

[0084] Furthermore, electronic devices also include:

[0085] Communication interface 803 is used for communication between memory 801 and processor 802.

[0086] The memory 801 is used to store computer programs that can run on the processor 802.

[0087] The memory 801 may include high-speed RAM memory, and may also include non-volatile memory, such as at least one disk storage device.

[0088] If the memory 801, processor 802, and communication interface 803 are implemented independently, then the communication interface 803, memory 801, and processor 802 can be interconnected via a bus to complete communication between them. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be divided into address buses, data buses, control buses, etc. For ease of representation, Figure 8 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.

[0089] Optionally, in a specific implementation, if the memory 801, processor 802, and communication interface 803 are integrated on a single chip, then the memory 801, processor 802, and communication interface 803 can communicate with each other through an internal interface.

[0090] The processor 802 may be a central processing unit (CPU), an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of this application.

[0091] This embodiment also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described mechanical seal end face waviness laser processing method.

[0092] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or N embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0093] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this application, "N" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0094] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, fragment or portion of code comprising one or N executable instructions for implementing a custom logical function or process step, and the scope of the preferred embodiments of the present application includes alternative implementations in which functions may be performed in a different order than shown or discussed, including performing functions in a substantially simultaneous manner or in a reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present application pertain.

[0095] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable medium may be paper or other suitable media on which the program can be printed, since the program can be obtained electronically by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.

[0096] It should be understood that the various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, the N steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0097] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program includes one or a combination of the steps of the method embodiments.

[0098] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0099] The storage medium mentioned above can be a read-only memory, a disk, or an optical disk, etc. Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of this application.

Claims

1. A method for laser processing of the waviness of a mechanical seal end face, characterized in that, Includes the following steps: The number of circumferential rotational machining operations is determined based on the circumferential periodic structure. The depth of a single machining operation is determined based on the maximum height difference formed by the radial taper, in order to divide the area into multiple stepped zones; Draw the processing layer corresponding to each of the multiple stepped areas; Import the processing layer corresponding to the first step area of ​​the multiple stepped areas, and install the test piece, align, focus, and set the process parameters to begin processing using the laser; and After completing the first step processing within the single-cycle structure, the circumferential rotation processing is performed a certain number of times to complete the first step processing within the entire cycle, and the remaining step areas are sequentially introduced until all step processing within the entire cycle is completed. The processing layer contains laser processing paths to form a circumferentially distributed waviness.

2. The method according to claim 1, characterized in that, The number of circumferential rotation processing operations is in the range of [0, 50].

3. The method according to claim 1, characterized in that, The single processing depth ranges from 0 to 50 μm, and the number of stepped regions ranges from 1 to 100.

4. The method according to claim 1, characterized in that, The step of drawing the processing layer corresponding to each of the multiple stepped regions includes: The outline of the corresponding machining layer is determined by the end face geometry of each stepped region.

5. A laser processing device for the waviness of a mechanical seal end face, characterized in that, include: The acquisition module is used to determine the number of circumferential rotation processing steps based on the circumferential periodic structure. The segmentation module is used to determine the single processing depth based on the maximum height difference formed by the radial taper, so as to divide the area into multiple stepped regions. The drawing module is used to draw the processing layer corresponding to each of the multiple stepped areas; The import module is used to import the processing layer corresponding to the first step area of ​​the multiple stepped areas, and to install the test piece, align, focus, and set process parameters to begin processing using the laser; and The processing module is used to complete the first step processing within a single-cycle structure, rotate the circumferential rotation processing number of times, complete the first step processing within the entire cycle, and sequentially import the remaining step areas until all step processing within the entire cycle is completed. The processing layer contains laser processing paths to form a circumferentially distributed waviness.

6. The apparatus according to claim 5, characterized in that, The number of circumferential rotation processing operations is in the range of [0, 50].

7. The apparatus according to claim 5, characterized in that, The single processing depth ranges from 0 to 50 μm, and the number of stepped regions ranges from 1 to 100.

8. The apparatus according to claim 5, characterized in that, The drawing module includes: A determining unit is used to determine the outline of the corresponding processing layer based on the end face geometry corresponding to each stepped region.

9. An electronic device, characterized in that, include: A memory, a processor, and a computer program stored in the memory and executable on the processor, the processor executing the program to implement the mechanical seal end face waviness laser processing method as described in any one of claims 1-4.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, The program is executed by the processor to implement the mechanical seal end face waviness laser processing method as described in any one of claims 1-4.

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