Wafer loading device

Abstract

The application relates to the technical field of semiconductor production equipment, and discloses a wafer loading device. The wafer loading device comprises a supporting plate, a jacking mechanism and a regularizing mechanism. The jacking mechanism is arranged on the supporting plate, and the jacking mechanism comprises a jacking driving assembly and a supporting block assembly. The jacking driving assembly can drive the supporting block assembly to perform lifting movement relative to the supporting plate. The supporting block assembly is used for supporting a wafer. The forked part of a fork can be arranged around the outer periphery of the supporting block assembly. The regularizing mechanism is arranged on the supporting plate. The regularizing mechanism comprises a regularizing driving assembly, a first positioning assembly and a second positioning assembly. The regularizing driving assembly can drive the first positioning assembly and the second positioning assembly to move towards each other and clamp the circumferential surface of the wafer, so as to correct the position of the wafer on the supporting block assembly. The wafer loading device can avoid the interference between the supporting block assembly and the forked part of the fork with a large size, and can ensure that the position accuracy of the wafer on the supporting block assembly is high.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment technology, and more particularly to a wafer loading device. Background Technology

[0002] Wafers are the basic material for manufacturing semiconductor chips. They are often transported to wafer fabrication equipment by robotic arms to load the wafers. Other equipment then identifies the wafer's outline and positioning points to facilitate subsequent operations.

[0003] A common robotic arm includes a robotic arm and a Y-shaped fork. The main shaft of the fork is connected to the output end of the robotic arm, and the forked portion of the fork is used to support the wafer. In the prior art, wafer loading devices typically include a support platform, three support pillars, and a lifting drive source. The process of the robotic arm placing the wafer onto the wafer loading device is as follows: the drive source drives the three support pillars to rise relative to the support platform; then, the robotic arm drives the fork, which carries the wafer, to extend its fork between the three support pillars and move it downwards a certain distance, thereby placing the wafer on the three support pillars. Existing wafer loading devices have the following problems: First, the spacing between the three support pillars is limited. To avoid interference between the fork and the support pillars, the size of the fork's fork needs to be set relatively small, which will affect the stability of the fork's support of the wafer during handling; second, the position where the robotic arm places the wafer on the support pillars may be off, leading to difficulties in recognizing the contour and positioning points.

[0004] Therefore, there is an urgent need for a wafer loading device to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer loading device that can avoid interference between the support block assembly and the large fork of the tooth, and ensure high positioning accuracy of the wafer on the support block assembly.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A wafer loading device, comprising:

[0008] Support plate;

[0009] A lifting mechanism is provided on the support plate. The lifting mechanism includes a lifting drive assembly and a support block assembly. The lifting drive assembly can drive the support block assembly to move up and down relative to the support plate. The support block assembly is used to support the wafer. The forked portion of the tooth can be arranged around the outer periphery of the support block assembly.

[0010] A straightening mechanism is disposed on the support plate. The straightening mechanism includes a straightening drive component, a first positioning component, and a second positioning component. The straightening drive component can drive the first positioning component and the second positioning component to move towards each other and clamp the circumferential surface of the wafer to correct the position of the wafer on the support block assembly.

[0011] As an optional solution, the support block assembly is provided with an air passage, and the upper surface of the support block assembly is provided with an adsorption port. The two ends of the air passage are respectively connected to the adsorption port and the vacuum unit, so that the support block assembly can adsorb and fix the wafer.

[0012] As an optional solution, the support block assembly includes:

[0013] The lower support block is connected to the output end of the lifting drive assembly. The lower support block is provided with an air intake channel and an annular groove on its upper surface. The two ends of the air intake channel are respectively connected to the vacuum unit and the annular groove.

[0014] An upper support block is placed on top of the lower support block. The adsorption port is located on the upper surface of the upper support block. Multiple air passages are arranged circumferentially inside the upper support block. The two ends of each air passage are connected to the annular groove and the adsorption port, respectively.

[0015] As an alternative, the lifting drive assembly is a push rod electric cylinder.

[0016] As an optional solution, the first positioning component includes a first mounting plate and a first alignment plate. The first mounting plate is connected to the output end of the alignment driving component. The first alignment plate is used to clamp the circumferential surface of the wafer. The first alignment plate is detachably connected to the first mounting plate.

[0017] The second positioning component includes a second mounting plate and a second alignment plate. The second mounting plate is connected to the output end of the alignment drive component. The second alignment plate is used to clamp the circumferential surface of the wafer. The second alignment plate and the second mounting plate are detachably connected.

[0018] As an alternative, the first mounting plate is provided with a buffer assembly, which is configured to elastically abut against the circumferential surface of the wafer.

[0019] As an optional solution, the second straightening plate includes:

[0020] The plate body is connected to the second mounting plate;

[0021] Two adjusting members are respectively connected to the plate body. The positions of the adjusting members and the plate body are adjustable. The two adjusting members are used to abut against the circumferential surface of the wafer.

[0022] As an alternative, the first mounting plate and the second mounting plate are respectively provided with a first sink and a second sink on the side facing each other, and the first sink and the second sink are used to support the edge of the wafer.

[0023] As an optional solution, the warping drive component includes:

[0024] The first and second wheels are rotatably supported on the support plate, respectively;

[0025] A flexible element is wound around the first wheel and the second wheel and respectively engages in transmission with the first wheel and the second wheel. The flexible element forms a first straight segment and a second straight segment. The first positioning component and the second positioning component are respectively connected to the first straight segment and the second straight segment.

[0026] A drive source capable of driving the first wheel or the second wheel to rotate, so that the first positioning component and the second positioning component move away from or closer to each other.

[0027] As an alternative, the wafer loading device further includes a light source assembly connected to the support plate, the light source assembly being arranged around the support block assembly and located below the wafer supported on the support block assembly.

[0028] The beneficial effects of this invention are:

[0029] The lifting mechanism of this invention includes a support block assembly for supporting wafers, and the forked portion of the robotic arm's fork can be arranged around the outer periphery of the support block assembly. While the forked portion is relatively large to stably support the wafer, positional interference between the support block assembly and the forked portion is avoided. Furthermore, the support block assembly provides surface support for the wafer, improving the safety of the wafer loading process. The alignment mechanism can correct the position of the wafer located on the support block assembly, ensuring accurate positioning of the wafer on the carrier device, thereby guaranteeing the smooth identification of the wafer's outline and markings, and improving wafer loading efficiency. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of the wafer loading device provided in a specific embodiment of the present invention;

[0031] Figure 2 This is a partial structural schematic diagram of the wafer loading device provided in a specific embodiment of the present invention;

[0032] Figure 3 This is a schematic diagram of the structure of the regularization mechanism provided in a specific embodiment of the present invention from one perspective;

[0033] Figure 4This is a schematic diagram of the structure of the lower support block provided in a specific embodiment of the present invention;

[0034] Figure 5 This is a schematic diagram of the upper support block from one perspective, provided in a specific embodiment of the present invention;

[0035] Figure 6 This is a structural schematic diagram of the upper support block provided in a specific embodiment of the present invention from another perspective;

[0036] Figure 7 This is an exploded structural diagram of the buffer component provided in a specific embodiment of the present invention;

[0037] Figure 8 This is a schematic diagram of the regularization mechanism provided in a specific embodiment of the present invention from another perspective.

[0038] In the picture:

[0039] 100. Wafer;

[0040] 11. Support plate; 111. Clearance hole; 12. Bracket;

[0041] 2. Lifting mechanism; 21. Lifting drive assembly; 22. Support block assembly; 221. Lower support block; 2211. Air inlet channel; 2212. Annular groove; 222. Upper support block; 2221. Adsorption port; 2222. Air passage;

[0042] 3. Regulated organization;

[0043] 31. Regularized drive assembly; 311. First wheel; 312. Second wheel; 313. Flexible component; 3131. First straight segment; 3132. Second straight segment; 314. Drive source;

[0044] 32. First positioning component; 321. First mounting plate; 322. First leveling plate; 3221. First settling groove; 323. First shim;

[0045] 33. Second positioning component; 331. Second mounting plate; 332. Second leveling plate; 3321. Plate body; 3322. Slot; 3323. Adjusting component; 3324. Second recessed groove; 333. Second shim;

[0046] 34. Buffer assembly; 341. Fixing block; 342. Abutment block; 343. Slide rod; 344. Elastic element;

[0047] 35. Guide assembly; 351. Linear guide rail; 352. Slider;

[0048] 36. Circular arc groove;

[0049] 41. Light source assembly; 42. Mounting components. Detailed Implementation

[0050] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention and not the entire structure.

[0051] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0052] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0053] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0054] This embodiment provides a wafer loading device. A robotic arm can place a wafer 100 on the wafer loading device, so that other equipment can identify the wafer 100 on the wafer loading device and perform other processing steps on the wafer 100. The robotic arm includes a robotic arm and a Y-shaped toothed fork. The main part of the toothed fork is connected to the output end of the robotic arm, and the forked part of the toothed fork is used to support the wafer 100. The robotic arm is used to drive the toothed fork and the wafer on the toothed fork to move.

[0055] like Figure 1As shown, the wafer loading device includes a support plate 11 and a bracket 12. The bracket 12 is installed below the support plate 11 and supports the support plate 11 to an appropriate height. Specifically, the bracket 12 can be welded from multiple profiles, making it lightweight and high-strength. Figure 1 and Figure 2 As shown, the wafer loading device also includes a lifting mechanism 2 and a leveling mechanism 3. The lifting mechanism 2 is mounted on the support plate 11 and includes a lifting drive assembly 21 and a support block assembly 22. The support block assembly 22 supports the wafer 100. The lifting drive assembly 21 can drive the support block assembly 22 to move upward relative to the support plate 11, so that there is a certain space below the support block assembly 22. This avoids positional interference between the toothed fork and structures such as the leveling mechanism 3 in the height direction when the toothed fork places the wafer 100 onto the support block assembly 22. The forked part (the forked part is roughly U-shaped) can be arranged around the outer periphery of the support block assembly 22, so it can avoid positional interference between the support block assembly 22 and the forked part in the horizontal direction. Moreover, the size of the forked part can be set to be larger, so that the wafer 100 can be supported more stably. In addition, the support block assembly 22 supports the wafer 100 as a surface support, which improves the safety of the wafer 100 loading process. In this embodiment, the support block assembly 22 is constructed as a cylindrical structure. The alignment mechanism 3 is disposed on the support plate 11. The alignment mechanism 3 includes an alignment drive assembly 31, a first positioning assembly 32, and a second positioning assembly 33. The alignment drive assembly 31 can drive the first positioning assembly 32 and the second positioning assembly 33 to move towards each other and clamp the circumferential surface of the wafer 100 to correct the position of the wafer 100 on the support block assembly 22, so that the center of the wafer 100 coincides with the center of the support block assembly 22, realizing the centering of the wafer 100, ensuring the positional accuracy of the wafer 100 on the wafer carrier device, thereby ensuring that the outline of the wafer 100 and the marking points on it are successfully identified and the subsequent processing accuracy of the wafer 100 is improved, and the efficiency of wafer 100 loading is also improved.

[0056] The process of the robotic arm placing the wafer 100 onto the wafer loading device in this embodiment is as follows:

[0057] First, the lifting drive assembly 21 drives the support block assembly 22 upward to a first preset height. At this time, the robotic arm drives the toothed fork supporting the wafer 100 to move above the support block assembly 22. Next, the robotic arm drives the toothed fork and the wafer 100 to move downward together. At this time, the forked part of the toothed fork is arranged around the outer periphery of the support block assembly 22, and the wafer 100 just lands on the support block assembly 22. Then, the robotic arm moves horizontally to remove the forked part from the side of the support block assembly 22. Then, the lifting drive assembly 21 drives the support block assembly 22 to move upward to a first preset height. At this time, the robotic arm drives the toothed fork ... The component 22 moves downward to a second preset height, at which point the first positioning component 32 and the second positioning component 33 are located on both sides of the wafer 100, respectively. Then, the alignment drive component 31 drives the first positioning component 32 and the second positioning component 33 to move closer to each other and clamp the circumferential surface of the wafer 100, thereby aligning the wafer 100 relative to the support block component 22. Finally, the alignment drive component 31 drives the first positioning component 32 and the second positioning component 33 away from each other, so that other equipment can identify and process the wafer 100.

[0058] In this embodiment, as Figure 2 and Figure 3 As shown, the support plate 11 is provided with a clearance hole 111, and the lifting drive assembly 21 is located below the support plate 11. The output end of the lifting drive assembly 21 extends vertically and passes through the clearance hole 111 from bottom to top. The support block assembly 22 is located on the upper side of the support plate 11 and is connected to the output end of the lifting drive assembly 21. This not only realizes the lifting drive assembly 21 to drive the support block assembly 22, but also makes the structure of the entire wafer loading device compact. The first positioning component 32 and the second positioning component 33 are both located on the upper side of the support plate 11 and on both sides of the support block component 22. When the lifting drive component 21 drives the support block component 22 to a first preset height, there is a certain space between the support block component 22 and the upper surface of the straightening mechanism 3. When the lifting drive component 21 drives the support block to descend to a second preset height, the wafer 100 on the support block component 22 is located between the first positioning component 32 and the second positioning component 33, so that the first positioning component 32 and the second positioning component 33 can clamp the circumferential surface of the wafer 100.

[0059] Preferably, such as Figure 2As shown, the wafer loading device also includes a light source assembly 41 connected to the support plate 11. The light source assembly 41 is arranged in a ring around the support block assembly 22. When the support block assembly 22 descends to a second preset height, the light source assembly 41 is located below the wafer 100 on the support block assembly 22. Under the illumination of the light source assembly 41, the outline of the wafer 100 can be clearly identified by a camera or other structure, thereby obtaining the position of the wafer 100 and information about the marking points on it. In this embodiment, the light source assembly 41 is ring-shaped, and the hole at the center of the light source assembly 41 can avoid the lifting and lowering movement of the output end of the lifting drive assembly 21. Optionally, the light source assembly 41 can be an LED light. Optionally, the wafer loading device also includes two mounting members 42. The two ends of the light source assembly 41 are respectively connected to the mounting members 42. The mounting members 42 are connected to the side of the support plate 11, thereby fixing the position of the light source assembly 41. Preferably, the lifting drive assembly 21 is a push rod electric cylinder. The push rod electric cylinder has high movement accuracy, thereby ensuring that the support block assembly 22 moves accurately between the first preset height and the second preset height. The push rod electric cylinder is an existing mature component, and its specific structure and working principle will not be described in detail here.

[0060] Preferably, such as Figure 2 As shown, the support block assembly 22 has an air passage, and its upper surface has an adsorption port 2221. The two ends of the air passage are connected to the adsorption port 2221 and a vacuum unit, respectively. The vacuum unit creates a negative pressure between the air passage and the adsorption port 2221, causing the adsorption port 2221 to adsorb and fix the wafer 100 onto the support block assembly 22. During the process of the support block assembly 22 lifting or lowering the wafer 100, the adsorption port 2221 keeps the positions of the support block assembly 22 and the wafer 100 relatively fixed. This not only prevents the wafer 100 from shifting position or falling during lifting, but also prevents the wafer 100 from jumping or impacting relative to the support block assembly 22 due to inertia when the support block assembly 22 stops, thus preventing the wafer 100 from being shattered. The vacuum unit can be any existing vacuum generator, such as a vacuum pump. One end of the air passage can be connected to the vacuum unit via a conduit, connector, or other component; no limitation is made here. It should be noted that during the process of the straightening mechanism 3 clamping the wafer 100 and correcting the position of the wafer 100, the adsorption port 2221 no longer adsorbs the wafer 100, ensuring that the position of the wafer 100 can be adjusted. After the straightening mechanism 3 completes the position correction of the wafer 100, the adsorption port 2221 adsorbs and fixes the wafer 100 again to prevent the position of the wafer 100 from changing again.

[0061] Specifically, such as Figures 4-6As shown, the support block assembly 22 includes a lower support block 221 and an upper support block 222. The lower support block 221 is connected to the output end of the lifting drive assembly 21. The lower support block 221 has an air inlet channel 2211 and an annular groove 2212 on its upper surface. The two ends of the air inlet channel 2211 are connected to the vacuum unit and the annular groove 2212, respectively. The upper support block 222 covers the lower support block 221, forming an annular channel with the annular groove 2212. The adsorption port 2221 is located on the upper surface of the upper support block 222. Multiple air passages 2222 are arranged circumferentially within the upper support block 222. The two ends of each air passage 2222 are connected to the annular channel and the adsorption port 2221, respectively. Thus, the air passages 2222, the annular channel, and the air inlet channel 2211 constitute the air path within the entire support block assembly 22, and enable communication between the adsorption port 2221 and the vacuum unit. Furthermore, through the cooperation of the annular groove 2212 and multiple air passages 2222, the negative pressure state in the air passage is evenly distributed along the circumference of the support block assembly 22, thereby making the adsorption force of the adsorption port 2221 on various positions on the wafer 100 more even, and avoiding local stress concentration and deformation of the wafer 100. Optionally, there can be one or multiple adsorption ports 2221, preferably with the adsorption ports 2221 evenly distributed on the upper surface of the upper support block 222.

[0062] Preferably, such as Figure 2 and Figure 3 As shown, the first positioning component 32 includes a first mounting plate 321 and a first leveling plate 322. The first mounting plate 321 is connected to the output end of the leveling drive component 31. The first leveling plate 322 is used to clamp the circumferential surface of the wafer 100. The second positioning component 33 includes a second mounting plate 331 and a second leveling plate 332. The second mounting plate 331 is connected to the output end of the leveling drive component 31. The second leveling plate 332 is used to clamp the circumferential surface of the wafer 100. Specifically, as shown... Figure 3 As shown, the first straightening plate 322 and the second straightening plate 332 are respectively provided with arc grooves 36 on one side facing each other. The surface of the arc grooves 36 matches the contour of the wafer 100. When the two arc grooves 36 cooperate with each other and clamp the wafer 100, the position of the wafer 100 can be aligned.

[0063] Preferably, the first aligning plate 322 is detachably connected to the first mounting plate 321, and the second aligning plate 332 is detachably connected to the second mounting plate 331. When the size, shape, or other characteristics of the wafer 100 supported on the support block assembly 22 change, the first aligning plate 322 and the second aligning plate 332, which match the specifications of the wafer 100, can be replaced accordingly, thereby enabling the aligning mechanism 3 to correct the position of wafers 100 of different specifications. Specifically, the first aligning plate 322 is connected to the first mounting plate 321 by bolts or other fasteners, and the second aligning plate 332 is also connected to the second mounting plate 331 by bolts or other fasteners, resulting in a simple structure and convenient assembly and disassembly. In other embodiments, the detachable connection method between the first aligning plate 322 and the first mounting plate 321, and the detachable connection method between the second aligning plate 332 and the second mounting plate 331, can be any existing method and is not limited here.

[0064] Preferably, such as Figure 3 As shown, the wafer loading device also includes a guide assembly 35, which guides the movement of the first positioning assembly 32 and the second positioning assembly 33. Specifically, the guide assembly 35 includes a linear guide rail 351 and at least two sliders 352. The linear guide rail 351 is fixed to the support plate 11, and the first mounting plate 321 and the second mounting plate 331 are respectively connected to the sliders 352. The sliders 352 slide in cooperation with the linear guide rail 351, which ensures smooth movement of the first positioning assembly 32 and the second positioning assembly 33 and guarantees the accuracy of the movement direction. Preferably, the wafer loading device includes two guide assemblies 35, which are arranged in parallel. The two guide assemblies 35 further improve the movement accuracy and stability of the first mounting plate 321 and the second mounting plate 331.

[0065] Preferably, such as Figure 2 As shown, the first positioning component 32 further includes a first shim 323, which is installed between the first mounting plate 321 and the first leveling plate 322. The second positioning component 33 further includes a second shim 333, which is installed between the second mounting plate 331 and the second leveling plate 332. The first shim 323 creates a certain clearance space between the first mounting plate 321 and the first leveling plate 322, and the second shim 333 also creates a certain clearance space between the second mounting plate 331 and the second leveling plate 332. When the first positioning component 32 and the second positioning component 33 approach each other, the first clearance space and the second clearance space can avoid interference with the light source component 41.

[0066] Preferably, such as Figure 3As shown, a buffer assembly 34 is provided on the first mounting plate 321. The buffer assembly 34 is used to elastically abut against the circumferential surface of the wafer 100. During the process of the first positioning assembly 32 and the second positioning assembly 33 approaching each other and clamping the circumferential surface of the wafer 100, the buffer assembly 34 elastically contacts the circumferential surface of the wafer 100, thereby avoiding rigid collisions between the first positioning assembly 32 and the second positioning assembly 33 and the wafer 100, thus preventing the wafer 100 from being crushed. In this embodiment, the arc groove 36 on the first mounting plate 321 is provided with a notch, and the buffer assembly 34 is installed at the notch.

[0067] Specifically, such as Figure 3 and Figure 7 As shown, the buffer assembly 34 includes a fixing block 341, an abutment block 342, a slide rod 343, and an elastic element 344. The fixing block 341 is fixed on the first leveling plate 322. A linear bearing extending radially along the support block assembly 22 is provided on the fixing block 341. The slide rod 343 is T-shaped. The slide rod 343 passes through the linear bearing from the end away from the center of the support block assembly 22 and is connected to the abutment block 342. The elastic element 344 is sleeved on the slide rod 343 and elastically presses against the abutment block 342 and the fixing block 341. The abutment block 342 is used to abut against the circumferential surface of the wafer 100. During the process of the first positioning component 32 and the second positioning component 33 approaching each other and clamping the circumferential surface of the wafer 100, the abutment block 342 preferentially abuts against the circumferential surface of the wafer 100. At this time, the elastic element 344 undergoes elastic deformation, thereby making the clamping process of the first positioning component 32 and the second positioning component 33 on the wafer 100 a slow elastic abutment, thus avoiding the wafer 100 from breaking. In this embodiment, the buffer component 34 includes two slide rods 343 and two elastic elements 344, with each elastic element 344 correspondingly sleeved on one slide rod 343. Optionally, the elastic element 344 can be a spring, an elastic rubber ring, etc., which is not limited here.

[0068] The installation of the first positioning component 32 and the second positioning component 33 inevitably involves certain errors, resulting in the inability to precisely define the position of the wafer 100 after the arc grooves 36 on the first leveling plate 322 and the second leveling plate 332 are engaged. Therefore, preferably, as follows... Figure 3As shown, the second alignment plate 332 includes a plate body 3321 and two adjusting members 3323. The plate body 3321 is connected to the second mounting plate 331, and the two adjusting members 3323 are respectively connected to the plate body 3321. The positions of the adjusting members 3323 and the plate body 3321 are adjustable, and the two adjusting members 3323 are used to abut against the circumferential surface of the wafer 100. The two adjusting members 3323 and the abutment block 342 constitute three limiting points, which can define a circle that can define the position of the wafer 100 on the support block assembly 22. When there is a certain deviation in the installation of the first positioning assembly 32 and the second positioning assembly 33, by adjusting the position of the two adjusting members 3323 relative to the plate body 3321, the position of the center of the circle formed by the three limiting points of the two adjusting members 3323 and the buffer assembly 342 can be adjusted, thereby compensating for the installation error of the first positioning assembly 32 and the second positioning assembly 33, and ensuring that the center of the wafer 100 coincides with the center of the support block assembly 22. Specifically, in this embodiment, two slots 3322 are provided on the surface of the arc groove 36. The slots 3322 extend radially along the support block assembly 22, and the adjusting member 3323 is at least partially located within the slots 3322. The adjusting member 3323 is provided with a waist-shaped hole, and the fastener passes through the waist-shaped hole and connects to the plate body 3321. When adjusting the position of the adjusting member 3323, the position of the adjusting member 3323 relative to the waist-shaped hole is adjusted.

[0069] like Figure 3 As shown, the first mounting plate 321 and the second mounting plate 331 are respectively provided with a first recess 3221 and a second recess 3324 on their respective sides facing each other. For a large wafer 100, after it is supported on the support block assembly 22, the edge position will have a slight sinking tendency. After the first positioning assembly 32 and the second positioning assembly 33 complete the alignment of the wafer 100, the first positioning assembly 32 and the second positioning assembly 33 move a certain distance away from each other. At this time, the edge of the wafer 100 is still located above the first recess 3221 and the second recess 3324. The first recess 3221 and the second recess 3324 can play a certain supporting and protective role for the edge of the wafer 100.

[0070] Preferably, such as Figure 3 and Figure 8As shown, the alignment drive assembly 31 includes a drive source 314 and a transmission assembly. The drive source 314 is connected to the support plate 11, and the input end of the transmission assembly is connected to the output end of the drive source 314. The transmission assembly includes two output ends, and the first positioning assembly 32 and the second positioning assembly 33 are respectively connected to the two output ends of the transmission assembly. The drive source 314 drives the transmission assembly to move, causing the first positioning assembly 32 and the second positioning assembly 33 to move closer to or further away from each other synchronously. By setting the transmission assembly, the first positioning assembly 32 and the second positioning assembly 33 can be driven by a single drive source 314, and the synchronization of movement is good.

[0071] Specifically, such as Figure 8 As shown, the transmission assembly includes a first wheel 311, a second wheel 312, and a flexible member 313. The first wheel 311 and the second wheel 312 are rotatably supported on the support plate 11. The flexible member 313 wraps around the first wheel 311 and the second wheel 312 and engages with them in a transmission connection. The flexible member 313 forms a first straight segment 3131 and a second straight segment 3132, which constitute the two output ends of the transmission assembly. A first positioning component 32 and a second positioning component 33 are connected to the first straight segment 3131 and the second straight segment 3132, respectively. Therefore, when the drive source 314 drives the first wheel 311 or the second wheel 312 to rotate, the first straight segment 3131 and the second straight segment 3132 generate linear movements in opposite directions, thus allowing the first positioning component 32 and the second positioning component 33 to move away from or closer to each other. Optionally, in this embodiment, the first wheel 311 and the second wheel 312 are pulleys, and the flexible member 313 is a belt. In other embodiments, the structure of the regularization drive component 31 is not limited to this, and those skilled in the art can choose to set it as needed.

[0072] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. For those skilled in the art, based on the concept of the present invention, there will be changes in specific implementation methods and application scope. The content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the claims of the present invention.

Claims

1. A wafer loading device, characterized in that, include: Support plate (11); A lifting mechanism (2) is provided on the support plate (11). The lifting mechanism (2) includes a lifting drive assembly (21) and a support block assembly (22). The lifting drive assembly (21) can drive the support block assembly (22) to move up and down relative to the support plate (11). The support block assembly (22) is used to support the wafer. The forked portion of the tooth can be arranged around the outer periphery of the support block assembly (22). A straightening mechanism (3) is disposed on the support plate (11). The straightening mechanism (3) includes a straightening drive component (31), a first positioning component (32), and a second positioning component (33). The straightening drive component (31) can drive the first positioning component (32) and the second positioning component (33) to move towards each other and clamp the circumferential surface of the wafer to correct the position of the wafer on the support block assembly (22). The support block assembly (22) is provided with an air passage, and the upper surface of the support block assembly (22) is provided with an adsorption port (2221). The two ends of the air passage are respectively connected to the adsorption port (2221) and the vacuum unit, so that the support block assembly (22) can adsorb and fix the wafer. The support block assembly (22) includes a lower support block (221) and an upper support block (222). The lower support block (221) is connected to the output end of the lifting drive assembly (21). The lower support block (221) is provided with an air inlet channel (2211) and the upper support block (222) is provided with an air inlet channel (2211). The surface is provided with an annular groove (2212), and the two ends of the air inlet channel (2211) are respectively connected to the vacuum unit and the annular groove (2212); the upper support block (222) is covered on the lower support block (221), and the adsorption port (2221) is provided on the upper surface of the upper support block (222). Multiple air passages (2222) are provided circumferentially inside the upper support block (222), and the two ends of each air passage (2222) are respectively connected to the annular groove (2212) and the adsorption port (2221).

2. The wafer loading apparatus as described in claim 1, characterized in that, The lifting drive assembly (21) is a push rod electric cylinder.

3. The wafer loading apparatus according to any one of claims 1-2, characterized in that, The first positioning component (32) includes a first mounting plate (321) and a first aligning plate (322). The first mounting plate (321) is connected to the output end of the aligning drive component (31). The first aligning plate (322) is used to clamp the circumferential surface of the wafer. The first aligning plate (322) is detachably connected to the first mounting plate (321). The second positioning component (33) includes a second mounting plate (331) and a second alignment plate (332). The second mounting plate (331) is connected to the output end of the alignment drive component (31). The second alignment plate (332) is used to clamp the circumferential surface of the wafer. The second alignment plate (332) is detachably connected to the second mounting plate (331).

4. The wafer loading apparatus as described in claim 3, characterized in that, The first mounting plate (321) is provided with a buffer assembly (34), which is configured to elastically abut against the circumferential surface of the wafer.

5. The wafer loading apparatus as described in claim 4, characterized in that, The second regularization plate (332) includes: The plate body (3321) is connected to the second mounting plate (331); Two adjusting members (3323) are respectively connected to the plate body (3321). The positions of the adjusting members (3323) and the plate body (3321) are adjustable. The two adjusting members (3323) are used to abut against the circumferential surface of the wafer.

6. The wafer loading apparatus as claimed in claim 4, characterized in that, The first mounting plate (321) and the second mounting plate (331) are respectively provided with a first sink (3221) and a second sink (3324) on one side facing each other. The first sink (3221) and the second sink (3324) are used to support the edge of the wafer.

7. The wafer loading apparatus according to any one of claims 1-2, characterized in that, The regularization drive component (31) includes: The first wheel (311) and the second wheel (312) are rotatably supported on the support plate (11); A flexible member (313) is wound around the first wheel (311) and the second wheel (312) and is respectively driven to engage with the first wheel (311) and the second wheel (312). The flexible member (313) forms a first straight segment (3131) and a second straight segment (3132). The first positioning component (32) and the second positioning component (33) are respectively connected to the first straight segment (3131) and the second straight segment (3132). The drive source (314) can drive the first wheel (311) or the second wheel (312) to rotate so that the first positioning component (32) and the second positioning component (33) move away from or closer to each other.

8. The wafer loading apparatus according to any one of claims 1-2, characterized in that, The wafer loading device also includes a light source assembly (41) connected to the support plate (11), the light source assembly (41) being arranged around the support block assembly (22) and located below the wafer supported on the support block assembly (22).

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