Display panel

Abstract

The embodiment of the application discloses a display panel, which comprises a substrate and a thin film transistor layer which are stacked; the substrate comprises a first sub-layer and a second sub-layer which are stacked, and a binding terminal layer is arranged between the first sub-layer and the second sub-layer; the thin film transistor layer comprises an insulating layer and an electrode trace layer; a first connecting hole which penetrates through the first insulating layer and the first sub-layer is arranged between the binding terminal layer and the electrode trace layer, and the electrode trace layer is electrically connected with the binding terminal layer through the first connecting hole; a second connecting hole is arranged on the second sub-layer, and the second connecting hole exposes at least part of the binding terminal layer, so that the binding terminal is electrically connected with a flexible circuit board. The display panel does not need to be processed by mechanical stripping or laser stripping technology, the electrode trace layer can be connected with the flexible circuit board, and the narrow frame effect of the display panel and the production yield of the spliced display panel are effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel. BACKGROUND

[0002] Organic Light Emitting Diode (OLED) display devices have now become the first choice for high-end mobile phones, televisions and other products due to their lightness, bright colors, flexibility and other characteristics, and have a wider and wider application range in the fields of narrow frame and splicing.

[0003] In the design of narrow frame panels and splicing panels, a display panel back wiring method is usually used to achieve a narrow frame effect. The display panel back wiring method requires removing the substrate layer at the back of the display panel to expose the electrode, thereby achieving the electrode lapping of the display panel and the electrode of the flexible circuit board.

[0004] The sacrificial layer of the substrate on the side of the electrode of the thin film transistor layer of the OLED away from the light emitting layer is peeled off (usually by laser peeling or mechanical peeling), and then the electrode of the back flexible circuit board is bound and connected. During the whole-surface peeling of the sacrificial layer, there is a risk of film layer separation between adjacent film layers in the product or damage to the array substrate layer and the light emitting layer structure. SUMMARY

[0005] The embodiments of the present application provide a display panel, which does not need to use mechanical peeling or laser peeling technology, and can effectively improve the narrow frame effect of the display panel and the production yield of the splicing display panel.

[0006] The embodiments of the present application provide a display panel, comprising:

[0007] A substrate comprising a first sub-layer and a second sub-layer stacked;

[0008] A thin film transistor layer disposed on the side of the first sub-layer away from the second sub-layer, the thin film transistor layer comprising a first insulating layer, a second insulating layer, and an electrode wiring layer disposed between the first insulating layer and the second insulating layer, the first insulating layer being disposed on the side of the second insulating layer close to the substrate;

[0009] The first sub-layer and the second sub-layer are provided with a binding terminal layer therebetween, the first insulating layer and the first sub-layer are provided with a first connecting hole penetrating therethrough, the first connecting hole is disposed between the binding terminal layer and the electrode wiring layer, and the electrode wiring layer is electrically connected with the binding terminal layer through the first connecting hole; the second sub-layer is provided with a second connecting hole, and the second connecting hole exposes at least part of the binding terminal layer.

[0010] Optionally, the electrode trace layer comprises a plurality of sub-traces, the binding terminal layer comprises a plurality of binding terminals arranged at intervals, one sub-trace is connected to one binding terminal, the number of the second connecting holes is the same as the number of the binding terminals, and one second connecting hole is arranged corresponding to one binding terminal.

[0011] Optionally, the second connecting hole comprises a first opening close to the binding terminal and a second opening away from the binding terminal, the first opening has a first diameter, the second opening has a second diameter, the first diameter and the second diameter are different in size, and the inner wall of the second connecting hole has a first included angle with the direction perpendicular to the substrate.

[0012] Optionally, the inner wall of the second connecting hole is a rough surface, and the roughness Ra of the inner wall of the second connecting hole ranges from 0.1 to 100.

[0013] Optionally, the inner wall of the second connecting hole comprises a plurality of stepped structures extending along the axial direction of the second connecting hole or a plurality of protrusions arranged on the inner wall of the second connecting hole.

[0014] Optionally, the second sub-layer comprises a first material sub-layer and a second material sub-layer arranged in layers, the second connecting hole comprises a first sub-hole arranged on the first material sub-layer and a second sub-hole arranged on the second material sub-layer, and the materials of the first material sub-layer and the second material sub-layer are different.

[0015] Optionally, the first material sub-layer is located on the side of the second material sub-layer close to the binding terminal layer, the sidewall of the first sub-hole has at least one preset included angle with the direction perpendicular to the substrate, and the diameter of the first sub-hole is greater than or equal to the diameter of the second sub-hole.

[0016] Optionally, the first sub-hole comprises a third opening close to the binding terminal layer and a fourth opening close to the second material sub-layer, the diameter of the third opening is a third diameter, the diameter of the fourth opening is a fourth diameter, the diameter of the first sub-hole between the third opening and the fourth opening is a fifth diameter, the fifth diameter is greater than the third diameter, the fifth diameter is greater than the fourth diameter, and the sidewall of the first sub-hole is an arc-shaped sidewall.

[0017] Optionally, the display panel comprises a binding area and a display area, the binding terminal layer comprises a plurality of binding terminals and a light shielding portion, the plurality of binding terminals are located in the binding area, and the light shielding portion is located in the display area, the thin film transistor layer comprises a plurality of driving devices, the driving device comprises a channel portion, and the light shielding portion covers at least the channel portion.

[0018] Optionally, the display panel further includes a flexible circuit board, the second connection hole having conductive material, the flexible circuit board including a connection terminal corresponding to the bonding terminal, the connection terminal and the bonding terminal being electrically connected through the conductive material in the second connection hole.

[0019] The beneficial effects of this invention include at least the following:

[0020] This application sets a display panel including a substrate and a thin-film transistor layer disposed on the substrate, with a bonding terminal layer disposed between a first sub-layer and a second sub-layer. A first through-hole is formed on the first insulating layer where the first sub-layer and the thin-film transistor layer are disposed. The electrode wiring layer is electrically connected to the bonding terminal layer through the first through-hole. A second through-hole is formed on the second sub-layer, exposing part of the bonding terminal layer. When back-bonding with a flexible circuit board, silver paste can be filled into the second through-hole before being electrically connected to the connection terminals on the flexible circuit board. This avoids the use of mechanical or laser peeling to peel off the insulating layer on the electrode surface of the array substrate layer during the manufacturing process, reducing the risk of partial film layer detachment in the thin-film transistor layer and reduced lifespan of the light-emitting layer due to peeling stress or laser during product manufacturing. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure for peeling off the sacrificial layer bonding in the existing technology of display panels;

[0023] Figure 2 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0024] Figure 3 This is a schematic diagram of the structure of a substrate for a display panel provided in an embodiment of this application;

[0025] Figure 4 yes Figure 3 A schematic diagram of the structure in which the second connection hole on the substrate of the display panel is filled with conductive material;

[0026] Figure 5 This is a schematic diagram of the structure of a substrate for a display panel provided in an embodiment of this application;

[0027] Figure 6 yes Figure 5 A schematic diagram of the structure in which the second connection hole on the substrate of the display panel is filled with conductive material;

[0028] Figure 7 is Figure 5 A structure diagram of a second connection hole on a substrate of a display panel in the embodiment of the present application;

[0029] Figure 8 is a structure diagram of a substrate of a display panel provided by the embodiment of the present application;

[0030] Figure 9 is a structure diagram of a substrate of a display panel provided by the embodiment of the present application;

[0031] Figure 10 is Figure 9 A structure diagram of a second connection hole filled with conductive material on a substrate of a display panel in the embodiment of the present application;

[0032] Figure 11 is a structure diagram of a substrate of a display panel provided by the embodiment of the present application;

[0033] Figure 12 is a structure diagram of a display panel provided by the embodiment of the present application.

[0034] Reference signs:

[0035] Substrate-10, first sub-layer-101, second sub-layer-102, thin film transistor layer-20, first insulating layer-2031, second insulating layer-2032, binding terminal layer-103, binding terminal-1031, first connection hole-CH1, electrode trace layer-202, second connection hole-CH2, light emitting layer-30, conductive material-40, driving device-201, active layer-2013, gate-2012, source-2011a, drain-2011b, sacrificial layer-60, first diameter-H1, second diameter-H2, first material sub-layer-1021, second material sub-layer-1022, first sub-hole-CH21, second sub-hole-CH22, third diameter-H3, fourth diameter-H4, display area-A2, binding area-A1, light shielding part-1032; DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0037] The embodiment of the present application provides a display panel. The following is described in detail. It should be noted that the description order of the following embodiments is not regarded as the preferred order of the embodiments. In addition, in the description of the present application, the term "comprises" means "comprises but is not limited to". The terms first, second, third and the like are only used as labels and do not impose numerical requirements or establish an order. Various embodiments of the present application can exist in a range of forms; it should be understood that the description in a range of forms is only for the convenience and brevity, and should not be understood as a hard limit to the scope of the present application; therefore, it should be considered that the range described has been specifically disclosed all possible sub-ranges and single values in the range.

[0038] The display panel usually adopts a back wiring mode to achieve a narrow frame effect, for example, as shown in FIG. 1. Figure 1 As shown, the back wiring mode needs to remove the sacrificial layer 60 of the display panel back to expose the electrode wiring layer, so as to realize the electrode of the display panel and the electrode of the flexible circuit board FPC.

[0039] After the electrode wiring layer 202 of the thin film transistor layer 20 of the OLED is peeled off (usually laser peeling technology or mechanical peeling) from the sacrificial layer 60 of the substrate 10 on the side away from the light-emitting layer 30, and the electrode of the back flexible circuit board FPC is bound and connected. In the process of peeling off the whole surface of the sacrificial layer 60, there is a risk that the film layers between the adjacent film layers in the product are separated or the structure of the array substrate layer and the light-emitting layer 30 is damaged. In order to solve the above technical problems, the present application provides the following technical solutions, please refer to the following embodiments and drawings for details. Figures 2-12 .

[0040] The embodiment of the present application provides a display panel, as shown in FIG. 2, comprising: Figures 2-12

[0041] The substrate 10 comprises a first sub-layer 101 and a second sub-layer 102 arranged in layers;

[0042] The thin film transistor layer 20 is arranged on the side of the first sub-layer 101 away from the second sub-layer 102, and the thin film transistor layer 20 comprises a first insulating layer 2031, a second insulating layer 2032, and an electrode wiring layer 202 arranged between the first insulating layer 2031 and the second insulating layer 2032, wherein the first insulating layer 2031 is arranged on the side of the second insulating layer 2032 close to the substrate 10;

[0043] ​The first sub-layer 101 and the second sub-layer 102 are provided with a binding terminal layer 103, the first insulating layer 2031 and the first sub-layer 101 are provided with a first connecting hole CH1 penetrating through, the first connecting hole CH1 is arranged between the binding terminal layer 103 and the electrode trace layer 202, and the electrode trace layer 202 is electrically connected with the binding terminal layer 103 through the first connecting hole CH1; the second sub-layer 102 is provided with a second connecting hole CH2, and the second connecting hole CH2 exposes at least part of the binding terminal layer 103.

[0044] It should be noted that, as Figure 2 indicated, the display panel includes but is not limited to an OLED display panel, and the display panel includes a substrate 10, a thin film transistor layer 20 arranged on the substrate 10, and an emitting layer 30 arranged on the thin film transistor layer 20.

[0045] Specifically, the emitting layer 30 includes a plurality of sub-pixel units, and the emitting layer 30 includes an anode layer, a pixel definition layer arranged on the anode layer, an organic emitting layer arranged on the anode layer, and a cathode layer arranged on the organic emitting layer, wherein the anode layer includes a plurality of spaced anodes, the pixel definition layer is provided with a plurality of pixel openings for exposing the anodes, the pixel openings are filled with organic emitting materials (i.e. the organic emitting layer), and the cathode layer covers at least the organic emitting materials, one pixel opening corresponds to one sub-pixel unit, the cathode layer covers at least the organic emitting materials, and the anode layer and the cathode layer are electrically connected with a driving device 201 in the thin film transistor layer 20.

[0046] Specifically, as Figure 2 indicated, the thin film transistor layer 20 includes a plurality of driving devices 201, the driving devices 201 and the sub-pixel units can be arranged one by one, and the driving devices 201 are electrically connected with the anodes of the corresponding sub-pixel units.

[0047] Specifically, the driving device 201 includes an insulating active layer 2013, a gate 2012, a source 2011a and a drain 2011b, the source 2011a and the drain 2011b are respectively electrically connected with a channel part of the active layer 2013, and the source 2011a is electrically connected with the anode of the emitting layer 30.

[0048] Specifically, as Figure 2As shown, the thin film transistor layer 20 further comprises an insulating layer 203, the insulating layer 203 comprises a first insulating layer 2031 and a second insulating layer 2032, and an electrode trace layer 202 is arranged between the first insulating layer 2031 and the second insulating layer 2032. The material of the insulating layer 203 (including the first insulating layer 2031 and the second insulating layer 2032) comprises an organic insulating material or an inorganic insulating material, and can be silicon nitride or silicon oxide in particular.

[0049] Specifically, the substrate 10 can be a rigid substrate or a flexible substrate. The material of the substrate 10 comprises one of glass, sapphire, silicon, silicon dioxide, polyethylene, polypropylene, polystyrene, polylactic acid, polyethylene terephthalate, polyimide or polyurethane.

[0050] Specifically, the substrate 10 comprises a first sub-layer 101 and a second sub-layer 102, and a binding terminal layer 103 is arranged between the first sub-layer 101 and the second sub-layer 102. The binding terminal layer 103 can comprise a plurality of binding terminals 1031 arranged at intervals.

[0051] Specifically, the material of the first sub-layer 101 and the second sub-layer 102 can be the same or different, and is not specifically limited;

[0052] Specifically, the first sub-layer 101 or the second sub-layer 102 can comprise a first material layer and a second material layer. The first material layer can be an inorganic buffer layer, and the material of the inorganic buffer layer can be silicon nitride or silicon oxide. The second material layer can be a polyimide layer.

[0053] Specifically, the material of the binding terminal layer 103 is a conductive material, and can be a metal such as copper, aluminum or titanium or an alloy thereof.

[0054] Specifically, the two sides of the binding terminal layer 103 are inorganic buffer layers, and the polyimide layer is located outside the first material layer.

[0055] Specifically, the first insulating layer 2031 and the first sub-layer 101 are provided with a first connecting hole CH1 penetrating therethrough, the first connecting hole CH1 is arranged between the binding terminal layer 103 and the electrode trace layer 202, and the electrode trace layer 202 is electrically connected with the binding terminal layer 103 through the first connecting hole CH1, the first connecting hole CH1 can be filled with a conductive material 40 which is the same as the material of the electrode trace layer 202, so as to electrically connect the electrode trace layer 202 and the binding terminal layer 103, the first connecting hole CH1 can be formed by wet etching or dry etching, and the setting shape and opening area of the first connecting hole CH1 are not limited, and the structure capable of electrically connecting the binding terminal layer 103 and the electrode trace layer 202 is within the protection scope of the present application.

[0056] Specifically, the second sub-layer 102 is provided with a second connecting hole CH2, the second connecting hole CH2 exposes at least part of the binding terminal layer 103, and the second connecting hole CH2 exposes part of the binding terminal 1031, so that the exposed binding terminal 1031 can be bound with the connecting terminal of the flexible circuit board.

[0057] Specifically, one binding terminal 1031 can correspond to one second connecting hole CH2, and in the direction perpendicular to the substrate 10, the projection of the binding terminal 1031 covers at least the projection of the second connecting hole CH2.

[0058] Specifically, in the direction perpendicular to the substrate 10, the opening shape of the second connecting hole CH2 is not limited, which can be circular or square.

[0059] Specifically, the inner wall of the second connecting hole CH2 can be a plane or a curved surface, which is not limited in particular.

[0060] It can be understood that by setting the display panel to include the substrate 10, the thin film transistor layer 20 arranged on the substrate 10, the binding terminal layer 103 arranged between the first sub-layer 101 and the second sub-layer 102, the first connecting hole CH1 with a through hole arranged on the insulating layer 203 of the first sub-layer 101 and the thin film transistor layer 20, the electrode trace layer 202 is electrically connected with the binding terminal layer 103 through the first connecting hole CH1, the second connecting hole CH2 with a through hole is arranged on the second sub-layer 102, so that part of the binding terminal layer 103 is exposed, and when the back binding with the flexible circuit board is performed, the silver paste can be filled in the second connecting hole CH2 and then electrically connected with the connecting terminal on the flexible circuit board, which avoids the use of mechanical or laser stripping means to strip the sacrificial layer 60 on the surface of the electrode trace layer 202 of the thin film transistor layer 20 in the manufacturing process, reduces the risk of separation of part of the film layer in the thin film transistor layer 20 due to stress or laser in the product production process, and reduces the risk of reduction of the service life of the light-emitting layer 30.

[0061] In an embodiment, as shown in Figure 2 The electrode trace layer 202 includes a plurality of sub-traces, and the binding terminal layer 103 includes a plurality of binding terminals 1031 arranged at intervals, one sub-trace is connected to one binding terminal 1031, the number of the second connecting holes CH2 is the same as the number of the binding terminals 1031, and one second connecting hole CH2 is arranged corresponding to one binding terminal 1031.

[0062] Specifically, in actual production, the electrode trace layer 202 can be a data line connected to the source electrode 2011a and the drain electrode 2011b of the driving device 201, or can be a scanning line connected to the gate electrode 2012 of the driving device 201, and the present application does not limit this, and the specific adjustment can be made according to the binding condition of the display panel and the flexible circuit board in actual production.

[0063] Specifically, the plurality of sub-traces can be arranged in the same layer or different layers, and the specific adjustment can be made according to the actual arrangement of the thin film transistor trace.

[0064] Specifically, a plurality of binding terminal layers 103 can be arranged in the substrate 10 in an insulating manner, the depths of the second connecting holes CH2 corresponding to different binding terminal layers 103 are different, and the normal projections of the different second connecting holes CH2 corresponding to different binding terminal layers 103 in the vertical direction of the substrate 10 do not coincide.

[0065] Specifically, in one example, one sub-wire corresponds to one binding terminal 1031, and one binding terminal 1031 corresponds to one second connecting hole CH2, i.e., one-to-one correspondence is arranged, and in another example, one sub-wire can be connected to one binding terminal 1031 through a plurality of first connecting holes CH1, and one binding terminal 1031 corresponds to one second connecting hole CH2, so as to ensure that the sub-wire can be well electrically connected with the flexible circuit board.

[0066] It can be understood that, by arranging different electrode wires to correspond to different binding terminals 1031, the number of the second connecting holes CH2 is the same as the number of the binding terminals 1031, and one second connecting hole CH2 corresponds to one binding terminal 1031, which can further improve the conduction rate between the electrode wires and the connecting terminals of the flexible circuit board, prevent the electrode wires of the display panel and the connecting terminals of the flexible circuit board from being disconnected, and cause the problem of display failure.

[0067] In one embodiment, as shown in Figure 3 and Figure 4 , the second connecting hole CH2 includes a first opening close to the side of the binding terminal 1031 and a second opening away from the binding terminal 1031, the first opening has a first diameter H1, the second opening has a second diameter H2, the first diameter H1 and the second diameter H2 are different in size, and the inner wall of the second connecting hole CH2 has a first included angle with the direction perpendicular to the substrate 10.

[0068] Specifically, the diameter in the present embodiment and the following embodiments refers to the longest distance between the inner walls of the second connecting hole CH2 in the horizontal direction, and is not limited to the opening of the second connecting hole CH2 being circular or elliptical.

[0069] Specifically, as shown in Figure 3 and Figure 4 , the first diameter H1 is greater than the second diameter H2, and the cross section of the second connecting hole CH2 is in the shape of an inverted trapezoid. After the second connecting hole CH2 is filled with the conductive material 40, the adhesion strength between the display panel and the flexible circuit board is significantly improved.

[0070] Specifically, as shown in Figure 5 and Figure 6 , the first diameter H1 is less than the second diameter H2, and the cross section of the second connecting hole CH2 is in the shape of a trapezoid. After the second connecting hole CH2 is filled with the conductive material 40, the adhesion strength between the display panel and the flexible circuit board can be improved.

[0071] It can be understood that by setting the first opening and the second opening of the second connecting hole CH2 to have different diameters, the inner wall of the second connecting hole CH2 has a larger contact area with the conductive material 40 filled therein, and the adhesion strength between the display panel and the flexible circuit board can be further improved.

[0072] In an embodiment, the inner wall of the second connecting hole CH2 is a rough surface, and the roughness Ra of the inner wall of the second connecting hole CH2 ranges from 0.1 to 100.

[0073] Specifically, the inner wall of the second connecting hole CH2 is a rough surface, which means that the inner wall of the second connecting hole CH2 is a non-flat surface, and the roughness Ra value can be any one of 0.1, 0.2, 0.6, 0.8, 1.5, 1.8, 2.0, 50.0, and 100, which can be adjusted according to actual production conditions.

[0074] In an embodiment, as shown in Figure 5 and Figure 6 , the inner wall of the second connecting hole CH2 includes a plurality of stepped structures extending along the axial direction of the second connecting hole CH2 or a plurality of protrusions arranged on the inner wall of the second connecting hole CH2.

[0075] Specifically, as shown in Figure 5 , Figure 6 and Figure 7 , θ is the inclination angle of the side wall of the second connecting hole CH2 relative to the substrate 10, the first diameter H1 of the second connecting hole CH2 is set to be smaller than the second diameter H2, the cross section (in the axial direction of the second connecting hole CH2) of the second connecting hole CH2 is trapezoidal, and a plurality of stepped structures extending along the axial direction of the second connecting hole CH2 are arranged on the side wall of the second connecting hole CH2, as shown in Figure 7 , which plays a role in increasing the roughness of the inner wall of the second connecting hole CH2, further increases the adhesion strength between the conductive material 40 in the second connecting hole CH2 and the substrate 10, and thus improves the adhesion strength between the display panel and the flexible circuit board.

[0076] It can be understood that by setting the inner wall of the second connecting hole CH2 to be a rough surface, the adhesion strength between the display panel and the flexible circuit board can be significantly improved after the conductive material 40 is filled into the second connecting hole CH2.

[0077] In an embodiment, as shown in Figure 8As shown, the second sub-layer 102 includes a first material sub-layer 1021 and a second material sub-layer 1022 arranged in a stack, the second connection hole CH2 includes a first sub-hole CH21 arranged on the first material sub-layer 1021 and a second sub-hole CH22 arranged on the second material sub-layer 1022, and the materials of the first material sub-layer 1021 and the second material sub-layer 1022 are different.

[0078] Specifically, the diameter of the first sub-hole CH21 can be the same as or different from the diameter of the second sub-hole CH22, and preferably the diameter of the first sub-hole CH21 is greater than the diameter of the second sub-hole CH22.

[0079] Specifically, the material of the first material sub-layer 1021 can be silicon nitride or silicon oxide, and the material of the second material sub-layer 1022 can be polyimide.

[0080] It can be understood that the second connection hole CH2 is arranged to pass through two layers of different materials, so that the conductive material 40 filled into the second connection hole CH2 can generate different adhesion forces between the first material sub-layer 1021 and the second material sub-layer 1022, and can enhance the adhesion strength between the display panel and the flexible circuit board to a certain extent.

[0081] In an embodiment, as shown in Figure 9 , Figure 10 and Figure 11 , the first material sub-layer 1021 is located on the side of the second material sub-layer 1022 close to the binding terminal layer 103, the sidewall of the first sub-hole CH21 forms at least one preset angle with the direction perpendicular to the substrate 10, and the diameter of the first sub-hole CH21 is greater than or equal to the diameter of the second sub-hole CH22.

[0082] Specifically, the sidewall of the first sub-hole CH21 forms at least one preset angle with the direction perpendicular to the substrate 10 means that the sidewall of the first sub-hole CH21 is non-perpendicular to the sidewall, and the sidewall of the first sub-hole CH21 can be arc-shaped, zigzag-shaped, etc., as shown in Figure 9 and Figure 10 , when the sidewall of the first sub-hole CH21 is arc-shaped, the sidewall of the first sub-hole CH21 has a plurality of preset angles with the direction perpendicular to the substrate 10, as shown in Figure 11 , when the sidewall of the first sub-hole CH21 is zigzag-shaped (bent once), the sidewall of the first sub-hole CH21 has two preset angles (specifically 60°) with the direction perpendicular to the substrate 10, and the specific degree is not limited.

[0083] Specifically, the diameter of the first sub-hole CH21 being greater than or equal to the diameter of the second sub-hole CH22 means that the maximum diameter of the first sub-hole CH21 is greater than or equal to the maximum diameter of the second sub-hole CH22.

[0084] Specifically, when the opening shape of the first sub-hole CH21 is non-circular, the diameter is the diameter of the circumscribed circle of the opening shape of the first sub-hole CH21.

[0085] Specifically, the inner wall of the second sub-hole CH22 can be arranged in the same way as the first sub-hole CH21, or differently.

[0086] Specifically, the first sub-hole CH21 can be formed by wet etching, specifically, by using the principle of isotropic etching, by adding a buffer solution to change the concentration of the etching solution, or by raising / lowering the environmental temperature of etching, to control the etching rate, so that the inner wall of the first sub-hole CH21 can have at least one preset angle with the direction perpendicular to the substrate 10.

[0087] It can be understood that by arranging the inner wall of the first sub-hole CH21 to have at least one preset angle with the direction perpendicular to the substrate 10, and the diameter of the first sub-hole CH21 being greater than or equal to the diameter of the second sub-hole CH22, the conductive material 40 in the first sub-hole CH21 can be in a state of physical buckling with the first sub-hole CH21, and the adhesion strength between the display panel and the flexible circuit board can be further increased.

[0088] In an embodiment, as shown in Figure 9 and Figure 11 The first sub-hole CH21 includes a third opening close to the binding terminal layer 103 and a fourth opening close to the second material sub-layer 1022, the diameter of the third opening is a third diameter H3, the diameter of the fourth opening is a fourth diameter H4, the diameter of the first sub-hole CH21 between the third opening and the fourth opening is a fifth diameter, the fifth diameter is greater than the third diameter H3, the fifth diameter is greater than the fourth diameter H4, and the sidewall of the first sub-hole CH21 is an arc-shaped sidewall.

[0089] Specifically, the third diameter H3 and the fourth diameter H4 can be equal or not equal, which is not specifically limited.

[0090] Specifically, the fifth diameter is the diameter of the first sub-hole CH21 at any position between the third opening and the fourth opening.

[0091] Specifically, the fourth opening has the same diameter as the opening of the second sub-hole CH22 near the first material sub-layer 1021, so that the first sub-hole CH21 and the second sub-hole CH22 can be smoothly connected, and the difficulty of filling the conductive material 40 into the second connecting hole CH2 is reduced.

[0092] It can be understood that, by setting the first sub-hole CH21 to include a third opening near the binding terminal layer 103 and a fourth opening near the second material sub-layer 1022, the diameter of the third opening is a third diameter H3, the diameter of the fourth opening is a fourth diameter H4, the diameter of the first sub-hole CH21 between the third opening and the fourth opening is a fifth diameter, and the fifth diameter is greater than the third diameter H3 and the fourth diameter H4. The above setting makes the inner wall diameter of the first sub-hole CH21 present a trend of first increasing and then decreasing, so that the conductive material 40 in the second connecting hole CH2 can form a physical buckle state, and the adhesion strength between the display panel and the flexible circuit board can be further increased.

[0093] In an embodiment, as shown in Figure 12 The display panel includes a display area A2 and a binding area A1, the binding terminal layer 103 includes a plurality of binding terminals 1031 and a light shielding portion 1032, the plurality of binding terminals 1031 are located in the binding area A1, and the light shielding portion 1032 is located in the display area A2. The driving device 201 includes a channel portion, and the light shielding portion 1032 at least covers the channel portion.

[0094] Specifically, the binding area A1 can be located on one side of the display area A2, and the binding area A1 can also partially overlap the display area A2.

[0095] Specifically, the binding terminal layer 103 includes the binding terminals 1031 located in the binding area A1 and the light shielding portion 1032 located in the display area A2 and corresponding to the channel portion of the driving device 201.

[0096] Specifically, the binding terminals 1031 can be made by the same process as the light shielding portion 1032, and the materials of the binding terminals 1031 and the light shielding portion 1032 can be the same.

[0097] It can be understood that, by setting the binding terminals 1031 and the light shielding portion 1032 in the same layer, the production cost of the display panel can be further reduced, the production steps can be saved, the production efficiency can be improved, the service life of the driving device 201 can be prolonged, and the stability of the driving device 201 can be improved.

[0098] The display panel further comprises a flexible circuit board, the second connecting hole has conductive material, the flexible circuit board comprises connecting terminals corresponding to the binding terminals, and the connecting terminals are electrically connected with the binding terminals through the conductive material in the second connecting hole.

[0099] To sum up, the display panel provided by the application comprises a substrate 10 and a thin film transistor layer 20 arranged on the substrate 10, the binding terminal layer 103 is arranged between the first sub-layer 101 and the second sub-layer 102, the first connecting hole CH1 is arranged on the insulating layer 203 of the first sub-layer 101 and the thin film transistor layer 20, the electrode trace layer 202 is electrically connected with the binding terminal layer 103 through the first connecting hole CH1, the second connecting hole CH2 is arranged on the second sub-layer 102, and part of the binding terminal layer 103 is exposed, so that the silver paste can be filled in the second connecting hole CH2 when the back binding with the flexible circuit board is performed, and the connecting terminals on the flexible circuit board are electrically connected, the mechanical or laser stripping means is avoided in the manufacturing process to strip the sacrificial layer 60 on the surface of the electrode trace layer 202 of the thin film transistor layer 20, and the risk of the film layer in the thin film transistor layer 20 being separated due to the stress or laser in the product production process is reduced, and the service life of the light-emitting layer 30 is reduced.

[0100] The display panel provided by the application is described in detail above, and the principle and implementation mode of the application are described by applying specific examples in this paper, and the above description of the embodiments is only used to help understand the method of the application and its core idea; meanwhile, for those skilled in the art, according to the idea of the application, the specific implementation mode and application range will be changed, and the above description of the application should not be understood as the limitation of the application.

Claims

1. A display panel, characterized by, The application relates to a substrate, a thin film transistor layer and a binding terminal layer. The substrate comprises a first sub-layer and a second sub-layer arranged in a stack; The thin film transistor layer is arranged on a side of the first sub-layer away from the second sub-layer, and comprises a first insulating layer, a second insulating layer and an electrode trace layer arranged between the first insulating layer and the second insulating layer, wherein the first insulating layer is arranged on a side of the second insulating layer close to the substrate; The first sub-layer and the second sub-layer are provided with the binding terminal layer therebetween, the first insulating layer and the first sub-layer are provided with a first connecting hole penetrating through the first insulating layer and the first sub-layer, the first connecting hole is arranged between the binding terminal layer and the electrode trace layer, and the electrode trace layer is electrically connected with the binding terminal layer through the first connecting hole; the second sub-layer is provided with a second connecting hole, and the second connecting hole exposes at least part of the binding terminal layer; The second sub-layer comprises a first material sub-layer and a second material sub-layer arranged in a stack, the second connecting hole comprises a first sub-hole arranged on the first material sub-layer and a second sub-hole arranged on the second material sub-layer, and the materials of the first material sub-layer and the second material sub-layer are different; The binding terminal layer is arranged in a stack of insulating layers in the substrate, the depths of the second connecting holes corresponding to different binding terminal layers are different, and the normal projections of the different second connecting holes corresponding to different binding terminal layers in the direction perpendicular to the substrate do not coincide.

2. The display panel of claim 1, wherein, The electrode trace layer comprises a plurality of sub-traces, the binding terminal layer comprises a plurality of binding terminals arranged at intervals, one sub-trace is connected with one binding terminal, the number of the second connecting holes is the same as that of the binding terminals, and one second connecting hole is arranged corresponding to one binding terminal.

3. The display panel of claim 1, wherein, The second connecting hole comprises a first opening close to the binding terminal and a second opening away from the binding terminal, the first opening has a first diameter, the second opening has a second diameter, the first diameter and the second diameter are different in size, and the inner wall of the second connecting hole has a first included angle with the direction perpendicular to the substrate.

4. The display panel of claim 1, wherein, The inner wall of the second connecting hole is a rough surface, and the roughness Ra of the inner wall of the second connecting hole ranges from 0.1 to 100.

5. The display panel of claim 1, wherein, The inner wall of the second connecting hole comprises a plurality of step structures extending in the axial direction of the second connecting hole or a plurality of protrusions arranged on the inner wall of the second connecting hole.

6. The display panel of claim 1, wherein, The first material sub-layer is arranged on a side of the second material sub-layer close to the binding terminal layer, the sidewall of the first sub-hole has a second included angle with the direction perpendicular to the substrate, and the diameter of the first sub-hole is greater than or equal to the diameter of the second sub-hole.

7. The display panel of claim 6, wherein, The first sub-hole comprises a third opening close to the binding terminal layer and a fourth opening close to the second material sub-layer, the diameter of the third opening is a third diameter, the diameter of the fourth opening is a fourth diameter, the diameter of the first sub-hole between the third opening and the fourth opening is a fifth diameter, the fifth diameter is greater than the third diameter, the fifth diameter is greater than the fourth diameter, and the sidewall of the first sub-hole is an arc-shaped sidewall.

8. The display panel of claim 1, wherein, The display panel comprises a binding area and a display area, the binding terminal layer comprises a plurality of binding terminals and a light shielding part, the plurality of binding terminals are located in the binding area, the light shielding part is located in the display area, the thin film transistor layer comprises a plurality of driving devices, the driving device comprises a channel part, and the light shielding part covers at least the channel part.

9. The display panel of claim 1, wherein, The display panel further comprises a flexible circuit board, the second connecting hole is provided with conductive material, the flexible circuit board comprises a connecting terminal corresponding to the binding terminal, and the connecting terminal is electrically connected with the binding terminal through the conductive material in the second connecting hole.

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