Photosensitive Component with Anti-Shake Function, Camera Module and Its Assembly Method

Abstract

The present invention relates to a photosensitive component with an anti-shake function, which comprises: a photosensitive chip; and a planar moving actuator having an intermediate seat, a base and a MEMS driving structure; wherein, the base comprises a bottom plate and a support seat formed by extending upward along the periphery of the bottom plate, the intermediate seat is located within the base and there is a gap between the side surface of the intermediate seat and the support seat; the MEMS driving structure comprises a comb-shaped movable part and a comb-shaped fixed part which are mutually adapted, the top surface of the comb-shaped movable part is connected to the bottom surface of the intermediate seat, and the bottom surface of the comb-shaped fixed part is connected to the top surface of the bottom plate; wherein, the photosensitive chip is mounted on the top surface of the intermediate seat; and the intermediate seat is connected to the support seat through a plurality of elastic connection lines, and the electrical connection between the intermediate seat and the base is realized through the connection lines. The present invention also provides a corresponding camera module, as well as an assembly method of the photosensitive component and the camera module.

Description

[0001] Related Applications

[0002] This application claims the priority of the Chinese patent application with the title "Photosensitive Component with Anti-Shake Function, Camera Module and Its Assembly Method" and the application number 202010512053.7 filed on June 8, 2020, and hereby incorporates by reference the entire content of the above application. Technical Field

[0003] The present invention relates to the technical field of camera modules. Specifically, the present invention relates to a photosensitive component with anti-shake function, a camera module and its assembly method. Background Art

[0004] With the popularization of mobile electronic devices, the related technologies of camera modules used in mobile electronic devices to help users obtain images (such as videos or pictures) have developed rapidly and advanced. In recent years, camera modules have been widely used in many fields such as medical treatment, security, and industrial production. Currently, in the consumer electronics field (such as the mobile phone field), the optical image stabilization function has become one of the common functions of camera modules.

[0005] The anti-shake technology was first applied to cameras. Generally, for standard focal length or wide-angle lenses, due to their short focal lengths and small weights, hand-held shooting can meet the shooting requirements. However, during the shooting process of telephoto or macro lenses, with the aperture unchanged, sufficient exposure time is required. If shooting is done hand-held at this time, it is very easy to cause shooting jitter. The aperture of a mobile phone itself is limited, and the light input is worrying. To obtain sufficiently clear pictures, a sufficiently long exposure time is required, and at this time, the anti-shake technology is needed. Specifically, when taking pictures with a hand-held smart phone, the shaking of the hand will cause a slight tilt of the camera (generally within + / - 0.5 degrees). This tilt causes a change in the viewing angle of the lens. Taking the lens as a reference, it is equivalent to the object being photographed moving. Therefore, the formed image will also shift relative to its original position on the image sensor, resulting in the image always being in an unstable state with the shaking of the hand, affecting the imaging quality of the shooting device. Therefore, the anti-shake technology is needed.

[0006] At present, anti-shake technologies can be divided into optical image stabilization, electronic image stabilization, and body sensor image stabilization. If classified according to the degrees of freedom of movement for anti-shake adjustment, they can also be divided into two-axis, three-axis, four-axis, and five-axis anti-shake. Electronic image stabilization generally does not require additional hardware, but the DSP needs to have the ability to handle a large load. Electronic image stabilization usually analyzes the images on the CCD and then uses the edge images for compensation. However, this compensation method will lose some pixels at the edges. The currently common solution is to use a wide-angle lens. Electronic image stabilization only performs post-processing on the collected data and does not substantially improve the image quality. Instead, it may cause a certain degree of damage to the overall image quality.

[0007] Optical image stabilization generally requires hardware support. Optical image stabilization corrects the "optical axis deviation" through the floating lens of the lens. The principle is that the gyroscope inside the lens detects tiny movements and then transmits the signals to the microprocessor. The processor immediately calculates the displacement amount that needs to be compensated and then compensates through the compensation lens group according to the shaking direction and displacement amount of the lens, thus effectively compensating for the image blurring caused by the camera shake. This anti-shake technology has relatively high requirements for lens manufacturing (currently, the optical image stabilization applied in mobile phones mainly drives the entire lens to move together), and the cost is also relatively high. The effect of the optical image stabilization function is quite obvious. Generally, when this function is turned on, the shutter speed can be increased by 2 - 3 stops, making it possible to take handheld photos without blurring. Especially in cameras with large zoom ratios, the effect is even more obvious because generally, the larger the zoom ratio, even the slightest shake will have a great impact on the imaging quality. Therefore, there is a greater need for anti-shake functions in cameras with large zoom ratios. Compared with electronic image stabilization, all the pixels in the full-frame image of optical image stabilization are effective pixel points, with stronger practicality, and the image quality can be substantially improved. However, its disadvantages are high design cost, high component cost, large power consumption, and the need for a certain amount of space, resulting in a relatively large volume requirement during installation. Due to various limitations of optical image stabilization, currently, mobile phone manufacturers generally apply optical image stabilization technology to their mid-to-high-end models.

[0008] Among the existing optical image stabilization technologies, there are various design schemes based on different degrees of freedom of movement, including two-axis, three-axis, four-axis, five-axis anti-shake, etc. The biggest difference among these design schemes is the directions in which the lens can move. In the past, most mobile phones used two-axis and three-axis anti-shake. Four-axis anti-shake is a further improvement based on three-axis anti-shake, simultaneously compensating for shakes in the horizontal, vertical, forward-tilt, and side-tilt directions. Currently, in some four-axis optical image stabilization schemes, the gyroscope and acceleration sensor in the mobile phone are used to quickly detect shakes in 8 directions, transmit the signals to the microprocessor to immediately calculate the displacement amount that needs to be compensated, and then transfer the data to the micro-motor in real time to quickly adjust the posture of the camera module, thus effectively overcoming the image blurring caused by mobile phone shake.

[0009] Furthermore, analyze the jitters during daily shooting. First of all, the human eye itself has an extremely "precise" anti-shake system, and jitters have little impact on the human eye. However, for various scenarios of daily photography, jitters are often inevitable. The "jitters" in the daily mobile phone shooting scenarios can include: camera shake, motion blur, and rolling shutter effect.

[0010] Among them, camera shake mainly refers to the slight physiological muscle and hand vibrations, which are common in taking photos and recording videos. The main cause of camera shake is the shaking of the human hand. Handshake is the easiest type of jitter to overcome. Through certain exercises or some poses with better stability, the anti-shake effect can be improved to a certain extent; in addition, a support can be found for the body during shooting, or simply rely on external facilities (such as a tripod) to fix the mobile phone or camera.

[0011] Motion blur can also be called dynamic blur. Motion blur refers to the obvious blur and dragging traces caused by the rapid movement of the picture. There are mainly two reasons for motion blur. One is that the movement speed is faster than the exposure time. The longer the exposure time, the greater the "jitter" of motion blur. The other is that the continuous movement causes the lens to fail to capture each frame of the picture in detail, thus causing motion blur.

[0012] The rolling shutter effect is also called the jelly effect. The formation of this effect is determined by the characteristics of the CMOS sensor. Since most cameras with CMOS sensors use a rolling shutter, which achieves imaging by exposing line by line. For such CMOS sensors, during the shooting process, the image sensor scans line by line and exposes line by line until all pixel points are exposed, so as to obtain a complete picture. Generally speaking, all actions during the shooting process are completed in a very short time, so generally it will not affect the shooting. However, if the object being photographed moves at a high speed or vibrates rapidly relative to the camera, when shooting with the rolling shutter method, the line-by-line scanning speed is insufficient, and the shooting results may show situations such as "tilting", "shaking", or "partial exposure". The above phenomena that occur when shooting a high-speed moving or rapidly vibrating target object with the rolling shutter method are defined as the jelly effect or the rolling shutter effect.

[0013] It should be noted that the OIS technology on mobile phone modules currently only corrects the image offset caused by the tilt of the camera, and does not handle the image problems caused by the translational jitter of the camera in the up, down, left, and right directions (this is different from the public's perception, so it is necessary to explain). When shooting distant scenes, the image offset caused by the translational jitter of the camera can be considered non-existent and does not require compensation by the OIS system. The image instability completely comes from the tilt jitter of the camera. However, when shooting macro, the influence of the translational jitter of the camera will gradually become apparent. The current mobile phone OIS camera module chooses to ignore the macro shooting problems caused by the translational jitter in order to avoid an overly complex system architecture. Optical image stabilization has good shooting effects in some special environments: low-light environments, during zooming, during handheld shooting, during sports shooting, or during shooting in a bumpy state (at this time, the jitter of the external environment is much greater than the jitter caused by the hand, and OIS can greatly reduce the bumpy feeling).

[0014] In order to effectively cope with various jitters during the shooting process, a sensor image stabilization technology has emerged in the current market. Currently, the sensor image stabilization technology is mainly applied in the camera field. The technical principle of sensor image stabilization is to install the image sensor on a freely movable bracket, and also cooperate with the gyroscope to sense the direction and amplitude of the camera's jitter, and then control the movement of the sensor to perform corresponding displacement compensation. The irregularity of various jitters makes the sensor image stabilization technology usually rely on multi-axis movement technology in order to compensate for jitters in multiple directions at the same time. However, on the other hand, if multi-axis image stabilization is applied to the image sensor, it may lead to an increase in the module volume. Therefore, how to incorporate the sensor image stabilization technology based on multi-axis image stabilization into the limited space of electronic devices such as mobile phones is a major problem faced in the current market.

[0015] Furthermore, when applied to the field of consumer electronic devices such as mobile phones, the anti-shake design of the camera module also needs to consider issues such as the reliability of the device and the production yield. That is to say, the sensor image stabilization solution not only needs to solve the miniaturization problem, but also needs to have good operability in the production process in order to improve the reliability and yield of assembly. Summary of the Invention

[0016] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a sensor image stabilization solution that can achieve miniaturization.

[0017] To solve the above technical problems, the present invention provides a photosensitive component with an anti-shake function, which includes: a photosensitive chip; and a planar moving actuator having an intermediate seat, a base, and a MEMS driving structure; wherein, the base includes a bottom plate and a support seat formed by extending upward from the periphery of the bottom plate, the intermediate seat is located within the base and there is a gap between the side surface of the intermediate seat and the support seat; the MEMS driving structure includes a comb-shaped movable part and a comb-shaped fixed part that are mutually adapted, the top surface of the comb-shaped movable part is connected to the bottom surface of the intermediate seat, and the bottom surface of the comb-shaped fixed part is connected to the top surface of the bottom plate; wherein, the photosensitive chip is mounted on the top surface of the intermediate seat; and the intermediate seat is connected to the support seat through a plurality of elastic connection lines, and the electrical connection between the intermediate seat and the base is achieved through the connection lines.

[0018] Wherein, the photosensitive component with an anti-shake function further includes a circuit board; the bottom surface of the base is mounted on the surface of the circuit board.

[0019] Wherein, the elastic connection lines are SMA lines.

[0020] Wherein, the electrical connection between the photosensitive chip and the intermediate seat is achieved by wire bonding.

[0021] Wherein, the MEMS driving structure includes an x-axis driving structure and a y-axis driving structure, wherein the x-axis and the y-axis are perpendicular to each other and both are parallel to the photosensitive surface of the photosensitive chip; the x-axis driving structure includes the comb-shaped movable part that can translate in the x-axis direction and the comb-shaped fixed part adapted thereto, and the y-axis driving structure includes the comb-shaped movable part that can translate in the y-axis direction and the comb-shaped fixed part adapted thereto.

[0022] Wherein, the MEMS driving structure includes a rotational driving structure for driving rotation about the z-axis, the z-axis is perpendicular to the x-axis and the y-axis; the rotational driving structure includes the comb-shaped fixed part and the comb-shaped movable part.

[0023] Wherein, the intermediate seat, the base, and the MEMS driving structure are fabricated based on semiconductor processes; wherein, the gaps between the intermediate seat, the base, and the MEMS driving structure are formed by removing sacrificial materials.

[0024] Wherein, the photosensitive component with an anti-shake function further includes a filter, and the filter is mounted on the top surface of the support seat.

[0025] Wherein, the edge area of the circuit board has a lens mount, and the lens mount is adapted to mount a lens assembly.

[0026] Wherein, the middle seat is a first circuit board manufactured based on a lamination process, the bottom plate is a second circuit board manufactured based on a lamination process, and the support seat is mounted or directly formed on the peripheral area of the second circuit board; the MEMS driving structure is manufactured based on a semiconductor process, and the MEMS driving structure has a first mounting surface located on its top surface and connected to the comb-shaped movable part and a second mounting surface located on its bottom surface and connected to the comb-shaped fixed part. The first circuit board is mounted on the first mounting surface, and the second circuit board is mounted on the second mounting surface.

[0027] Wherein, both the first circuit board and the second circuit board are PCB boards.

[0028] According to another aspect of the present application, there is also provided an imaging module, which includes: a lens assembly; and a photosensitive component with an anti-shake function as described in any one of the foregoing items, wherein the bottom surface of the lens assembly is mounted on the top surface of the photosensitive component with an anti-shake function.

[0029] Wherein, the lens assembly includes a motor and an optical lens, and the motor is used to drive the optical lens to move to achieve a focusing function; in the photosensitive component with an anti-shake function, the planar movement actuator is used to drive the middle seat and drive the photosensitive chip to move to achieve an anti-shake function.

[0030] According to still another aspect of the present application, there is also provided an assembly method for a photosensitive component with an anti-shake function, which includes: Step 1) Prepare a planar movement actuator, which has a middle seat, a base, and an MEMS driving structure; wherein, the base includes a bottom plate and a support seat extending upward from the periphery of the bottom plate; the middle seat is located above the bottom plate and there is a gap between the side surface of the middle seat and the support seat; the MEMS driving structure includes a mutually adapted comb-shaped movable part and a comb-shaped fixed part, the top surface of the comb-shaped movable part is connected to the bottom surface of the middle seat, and the bottom surface of the comb-shaped fixed part is connected to the top surface of the bottom plate; Step 2) Inject a hydrogel into the gap between the middle seat and the base, and then cure the hydrogel to fix the middle seat in the base; Step 3) Mount a photosensitive chip on the top surface of the middle seat, form a plurality of elastic connection lines between the middle seat and the support seat through a WB process, and the connection lines electrically conduct the photosensitive chip and the base; and Step 4) Remove the hydrogel through a water washing process to release the middle seat.

[0031] Wherein, in the step 3), the elastic connection lines are SMA lines.

[0032] Wherein, the step 3) further includes: electrically connecting the photosensitive chip and the middle seat through a WB process.

[0033] Among them, in the step 1), the planar actuator is a MEMS actuator fabricated by semiconductor processes. The fabrication method of the MEMS actuator includes: 11) fabricating a base; 12) fabricating a lower connection layer on the upper surface of the base, the lower connection layer including a lower connection portion for connecting the base and the comb-shaped fixed portion and sacrificial materials filled between the lower connection portions; 13) fabricating a comb-shaped drive structure pattern layer on the upper surface of the lower connection layer, the comb-shaped drive structure pattern layer including a plurality of comb-shaped drive structure patterns and sacrificial materials filled between the comb-shaped drive structure patterns, each of the comb-shaped drive structure patterns including the comb-shaped fixed portion and the comb-shaped movable portion; 14) fabricating an upper connection layer on the upper surface of the comb-shaped drive structure pattern layer, the upper connection layer including an upper connection portion for connecting the intermediate base and the comb-shaped movable portion and sacrificial materials filled between the upper connection portions; 15) fabricating an intermediate base on the upper surface of the upper connection layer; and 16) removing the sacrificial materials to obtain the required MEMS actuator.

[0034] According to another aspect of the present application, there is also provided an assembly method of a camera module, which includes: a) assembling a photosensitive component based on the assembly method of any one of the foregoing photosensitive components having an anti-shake function; and b) assembling the lens component and the photosensitive component together to obtain the camera module.

[0035] Compared with the prior art, the present application has at least one of the following technical effects:

[0036] 1. The present application can achieve the anti-shake function of the photosensitive component at a relatively small space cost.

[0037] 2. The present application can achieve the anti-shake function of the photosensitive component in multiple directions.

[0038] 3. The present application can ensure good electrical conductivity between the chip and the base during the movement of the chip.

[0039] 4. The present application provides a structure for strengthening the chip strength, thereby effectively protecting the structural reliability of the chip.

[0040] 5. In some embodiments of the present application, the intermediate base and the base are connected by an elastic wire, so that good electrical conductivity between the two is ensured during the movement of the intermediate base relative to the base.

[0041] 6. In some embodiments of the present application, a method suitable for manufacturing the foregoing photosensitive component having an anti-shake function is provided, and a large-scale production of the anti-shake structure can be achieved by using this method.

[0042] 7. In some embodiments of the present application, before the wire bonding process and the chip installation step, the gap is filled with a hydrogel to fix the intermediate base, which can improve the production efficiency and the production yield.

[0043] 8. In some embodiments of the present application, the hydrocolloid can be removed by a water washing process. The water washing process is also beneficial for cleaning the dust generated during the manufacturing process, avoiding stains on the chip surface or the photosensitive path. Using this manufacturing method, the manufacturing process of the anti-shake module can be streamlined.

[0044] 9. In some embodiments of the present application, only the MEMS structure is required, and no other components are needed to cooperate to drive the chip to move to achieve the anti-shake effect. Corresponding to the original motor structure based on driving the lens to move in the module, a large number of component structures are streamlined. Description of the Drawings

[0045] Figure 1a Shows a side view schematic diagram of a photosensitive component with anti-shake function in an embodiment of the present application;

[0046] Figure 1b Shows a top view schematic diagram of a photosensitive component with anti-shake function in an embodiment of the present application;

[0047] Figure 2 Shows a top view schematic diagram of the MEMS driving structure 40 in an embodiment of the present application;

[0048] Figure 3 Shows a cross-sectional schematic diagram of a photosensitive component with anti-shake function in an embodiment of the present application;

[0049] Figure 4 Shows Figure 3 the cross-section of the photosensitive component and the top view structure of the rectangular driving structure therein;

[0050] Figure 5 Shows a schematic diagram of the structure of a camera module in an embodiment of the present application;

[0051] Figure 6a Shows a schematic diagram of the bottom of the base in an embodiment of the present application;

[0052] Figure 6b Shows a top view schematic diagram of a circuit board in an embodiment of the present application;

[0053] Figure 7 Shows a cross-sectional schematic diagram of a photosensitive component with a circuit board in an embodiment of the present application;

[0054] Figure 8 Shows a three-dimensional schematic diagram of a photosensitive component in another embodiment of the present application;

[0055] Figure 9 Shows a cross-sectional view of a photosensitive component in another embodiment of the present application;

[0056] Figure 10Shows a cross-sectional view of the MEMS actuator prepared in step S1 in an embodiment of the present application;

[0057] Figure 11 Shows a cross-sectional view of the semi-finished product after step S2 in an embodiment of the present application;

[0058] Figure 12 Shows a cross-sectional view of the semi-finished product after step S3 in an embodiment of the present application;

[0059] Figure 13 Shows a cross-sectional view of the photosensitive component after step S3 in an embodiment of the present application;

[0060] Figure 14 Shows a cross-sectional view of the base in an embodiment of the present application;

[0061] Figure 15 Shows a cross-sectional view of the semi-finished MEMS actuator after step S12 in an embodiment of the present application;

[0062] Figure 16 Shows a cross-sectional view of the semi-finished MEMS actuator after step S13 in an embodiment of the present application and the top view shape of the comb drive structure pattern layer therein;

[0063] Figure 17 Shows a cross-sectional view of the semi-finished MEMS actuator after step S14 in an embodiment of the present application;

[0064] Figure 18 Shows a cross-sectional view of the semi-finished MEMS actuator after step S15 in an embodiment of the present application;

[0065] Figure 19 Shows the assembly process of the photosensitive component in an embodiment of the present application;

[0066] Figure 20 Shows the manufacturing process of fabricating a MEMS actuator based on semiconductor processes in an embodiment of the present application. Detailed Description of the Invention

[0067] To better understand the present application, more detailed descriptions of various aspects of the present application will be made with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of the exemplary embodiments of the present application and do not limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0068] It should be noted that in this specification, the expressions such as first, second, etc. are only used to distinguish one feature from another, and do not represent any limitation on the features. Therefore, without departing from the teachings of the present application, the first body discussed below may also be referred to as the second body.

[0069] In the drawings, for ease of illustration, the thickness, dimensions, and shape of the objects have been slightly exaggerated. The drawings are only examples and are not drawn to an exact scale.

[0070] It should also be understood that the terms "comprises," "comprising," "has," "including," and / or "including having," when used in this specification, denote the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof. Further, when an expression such as "at least one of..." appears after a list of listed features, it modifies the entire list of listed features rather than individual elements in the list. Additionally, when describing embodiments of the present application, the use of "may" indicates "one or more embodiments of the present application." And the term "exemplary" is intended to refer to an example or illustration.

[0071] As used herein, the terms "substantially," "about," and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by a person of ordinary skill in the art.

[0072] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It should also be understood that terms (such as those defined in a common dictionary) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0073] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other.

[0074] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0075] Figure 1a A side view schematic diagram of an image sensor module with an anti-shake function in an embodiment of the present application is shown. Figure 1b A top view schematic diagram of an image sensor module with an anti-shake function in an embodiment of the present application is shown. Refer to Figure 1a and Figure 1b, in this embodiment, the photosensitive component with an anti-shake function may include a photosensitive chip 10 and a MEMS actuator. The MEMS actuator has an intermediate seat 20, a base 30, and a MEMS driving structure 40. Among them, the base 30 includes a bottom plate 31 and a support seat 32 formed by extending upward along the periphery of the bottom plate 31; the intermediate seat 20 is located above the bottom plate 31 and there is a gap between the side surface of the intermediate seat 20 and the support seat 32. In the MEMS actuator, there is a MEMS driving structure 40 between the upper surface of the bottom plate 31 of the base 30 and the lower surface of the intermediate seat 20, which can drive the intermediate seat 20 to move according to the instruction sent by the control center, so as to adjust the position of the photosensitive chip 10 and achieve the anti-shake effect. Figure 2 The top view schematic diagram of the MEMS driving structure 40 in an embodiment of the present application is shown. With reference to Figure 1a and Figure 2 , in this embodiment, the driving structure of the intermediate seat 20 is implemented as a MEMS actuator, and the photosensitive chip 10 is installed on the intermediate seat 20 and moves accordingly with the movement of the intermediate seat 20. The MEMS actuator (i.e., the MEMS driving structure 40) may include a plurality of rectangular driving structures 41 and a plurality of sector driving structures 42. Among them, the sector driving structure 42 can rotate its comb-shaped movable part by a certain angle under the drive of electrostatic force, and the size of the angle matches the voltage difference. For the rectangular driving structures 41 located at the four corners, their MEMS comb-shaped movable parts can move along the positive and negative directions of the X-axis or along the positive and negative directions of the Y-axis under the drive of electrostatic force, so as to drive the chip to compensate for the horizontal jitter. Whether it is the rectangular driving structure 41 or the sector driving structure 42, each driving structure may include a mutually adapted comb-shaped movable part 44 and a comb-shaped fixed part 43. Further, Figure 3 The cross-sectional schematic diagram of the photosensitive component with an anti-shake function in an embodiment of the present application is shown. Refer to Figure 3 , in this embodiment, the top surface of the comb-shaped movable part 44 is connected to the bottom surface of the intermediate seat 20, and the bottom surface of the comb-shaped fixed part 43 is connected to the top surface of the bottom plate 31 (it can be combined with reference to Figure 4 , Figure 4 shows Figure 3The cross-section of the photosensitive component and the top view of the rectangular drive structure therein). The photosensitive chip 10 is installed on the top surface of the middle seat 20. The middle seat 20 is connected to the support seat 32 through a plurality of elastic connection lines 60, and the electrical connection between the middle seat 20 and the base 30 is achieved through the connection lines 60. Specifically, the middle seat 20 can be suspended directly above the inner space of the base 30 through the elastic connection lines 60, and the two are indirectly connected together through the MEMS drive structure 40 (which can also be called the MEMS drive module). The edge part of the middle seat 20 and the support seat 32 of the base 30 are electrically connected through a plurality of connection lines 60 to realize the circuit supply of the middle seat 20. At the same time, the plurality of connection lines 60 can also play a role in suspending the middle seat 20 (combined with reference to Figure 1b ), so that the middle seat 20 can move relative to the base 30 under the drive of the MEMS drive structure 40. In an embodiment of the present application, the photosensitive chip 10 is installed on the middle seat 20, and the middle seat 20 and the photosensitive chip 10 are electrically connected by using the wire bonding (also known as bonding, that is, Wire Bonding, abbreviated as WB) process. In this way, the base 30 connected to the outside can be electrically connected through the middle seat 20 and the photosensitive chip 10, so as to ensure the normal operation of the photosensitive chip 10. Due to the action of the MEMS drive module, the middle seat 20 can move relative to the base 30. In order to ensure the conduction of the circuit, the connection line 60 between the middle seat 20 and the base 30 can be an elastic wire. In this embodiment, the connection line 60 can be selected as an SMA wire (SMA is the English abbreviation of shape memory alloy). Due to its own characteristics, the SMA wire can not only play the role of conducting the circuit, but also realize the change of its own shape during operation, so as to better adapt to the movement of the middle seat and avoid problems such as poor contact or open circuit in the electrical connection between the middle seat and the base caused by the movement of the middle seat.

[0076] In an embodiment of the present application, when manufacturing a MEMS actuator, the intermediate base with a photosensitive chip installed thereon can be suspended in the base cavity through a connecting wire. The intermediate base is electrically connected to the photosensitive chip (hereinafter sometimes referred to as the chip for short) through the WB (Wire Bonding) process to ensure the normal operation of the chip. The base and the intermediate base can be realized by releasing (i.e., removing) the sacrificial layer. Therefore, although the intermediate base and the base can be indirectly connected through the MEMS structure, there is still a large degree of mobility between the two. In this embodiment, the method of using hydrogel can be adopted. After releasing the sacrificial layer, the gap between the intermediate base and the base is filled with hydrogel material. After the glue solidifies, the intermediate base and the base are in a relatively fixed state at this time. In this way, the chip and the intermediate base are electrically connected by using the DB and WB processes. At the same time, the intermediate base and the base can also be electrically connected by using SMA wires to realize the circuit setting of the entire structure. When the circuit setting is completed, the hydrogel is removed by using a water washing process, and the intermediate base can be released to realize the relative movement between the intermediate base and the base. At the same time, the water washing process is also beneficial to cleaning the dust generated during the manufacturing process, avoiding stains on the chip surface or the photosensitive path, and thus greatly improving the imaging quality of the subsequent camera module.

[0077] Further, in an embodiment of the present application, the photosensitive component with an anti-shake function may further include a circuit board, and the bottom surface of the base may be installed on the upper surface of the circuit board. In this embodiment, the base can have various functions. A circuit structure can be provided inside the base. There can be electrical connection contacts at the connection between its support base and the SMA wire. The contacts can be connected to the SMA wire and then connected to the intermediate base. At the same time, the part of the base bottom connected to the circuit board also has array contacts, which can cooperate with the contacts on the circuit board to realize the circuit supply of the base.

[0078] In the present application, the electrical connection between the photosensitive chip and the intermediate base is not limited to the wire bonding process. For example, in another embodiment of the present application, a contact array may be provided on the back surface of the photosensitive chip and electrically connected to the intermediate base through the contact array.

[0079] Further, still referring to Figure 3 , in an embodiment of the present application, the filter 50 can be adhesively bonded to the top surface of the support base 32 in a direct bonding manner. In this embodiment, the contacts of the support base 32 can be arranged on the inner side surface of the support base 32, and the contacts can be connected to the contacts of the intermediate base 20 through SMA wires. In the manufacturing process, the SMA wires can be connected between the contacts of the support base and the contacts of the intermediate base through the wire bonding process (i.e., the WB process).

[0080] Figure 9The cross-sectional view of the photosensitive component according to another embodiment of the present application is shown. Refer to Figure 9 , in another embodiment of the present application, a molding seat 33 may be formed on the top surface of the support seat 32. In this embodiment, support seat contacts 32a may be provided on the top surface of the support seat 32, and the support seat contacts 32a are electrically connected to the contacts of the intermediate seat 20 by using SMA wires based on the wire bonding process. At this time, the SMA wires will be bridged between the intermediate seat 20 and the support seat 32 to achieve electrical connection between the intermediate seat 20 and the base 30. During actual use, due to the driving force, the intermediate seat 20 will continuously move relative to the base 30. In this embodiment, in order to protect the stability of the SMA wires connected to the contacts, a molding layer may be directly fabricated on the top surface of the support seat of the base through the molding process, thereby forming the molding seat 33 located on the top surface of the support seat. The molding seat 33 may directly mold (encapsulate) the contacts connected to the SMA wires inside the structural member, thereby effectively protecting the SMA wires during the movement process and preventing the SMA wires from falling off due to the frequent movement of the intermediate seat (referring to the movement relative to the base) during long-term use. Further, the filter 50 is mounted (e.g., pasted) on the molding seat 33 formed by molding. In this embodiment, the molding seat 33 and the support seat 32 may also be regarded as an integral composite support seat. The composite support seat includes a support seat fabricated based on the semiconductor process and a molding seat fabricated based on the molding process. The support seat contacts are located between the molding seat and the support seat fabricated based on the semiconductor process, and the support seat contacts and the section of the SMA wire close to the support seat contacts are encapsulated inside the composite support seat by the molding seat, thereby effectively protecting the SMA wires during the movement process and preventing problems such as poor electrical contact or open circuit in the circuit.

[0081] Further, in an embodiment of the present application, the photosensitive chip has a photosensitive surface. The MEMS driving structure includes an x-axis driving structure for driving translation along the x-axis, a y-axis driving structure for driving translation along the y-axis, and a rotational driving structure for driving rotation about the z-axis. Among them, the x-axis and the y-axis are perpendicular to each other and both parallel to the photosensitive surface; the combined shape of the comb-shaped fixed part and the comb-shaped movable part of the x-axis driving structure is rectangular, and the combined shape of the comb-shaped fixed part and the comb-shaped movable part of the y-axis driving structure is also rectangular; the MEMS driving structure includes a rotational driving structure for driving rotation about the z-axis, and the z-axis is perpendicular to the photosensitive surface (i.e., perpendicular to the x-axis and the y-axis); the combined shape of the comb-shaped fixed part and the comb-shaped movable part of the rotational driving structure is fan-shaped. It should be noted that the driving direction and shape combination of the MEMS driving structure in the present application are not limited to the situations described in this embodiment. For example, in some other embodiments of the present application, the MEMS driving structure may also only include an x-axis driving structure for driving translation along the x-axis and a y-axis driving structure for driving translation along the y-axis, without including a rotational driving structure for driving rotation about the z-axis; or only include a rotational driving structure for driving rotation about the z-axis, without including an x-axis driving structure for driving translation along the x-axis and a y-axis driving structure for driving translation along the y-axis; or only include an x-axis driving structure for driving translation along the x-axis, without including a y-axis driving structure for driving translation along the y-axis and a rotational driving structure for driving rotation about the z-axis.

[0082] Further, Figure 5 The structural schematic diagram of an imaging module in an embodiment of the present application is shown. Refer to Figure 5 , this embodiment provides an imaging module, which includes a photosensitive component with an anti-shake function and a lens component 200 mounted on the photosensitive component. The photosensitive component with an anti-shake function may include a circuit board 80 (the circuit board 80 may include a rigid PCB 80a, an FPC connection band 80b, and a connector 80c), and the bottom surface of the base 30 may be mounted on the upper surface of the circuit board 80. In this embodiment, a circuit structure may be provided inside the base, and there may be electrical connection contacts at the connection between its support seat and the SMA wire. The contacts may be connected to the SMA wire and then connected to the intermediate seat. At the same time, the part where the bottom of the base is connected to the circuit board also has array contacts, and these contacts can cooperate with the contacts on the circuit board to realize the circuit supply of the base. The edge area of the circuit board may have a lens holder, and the lens holder is suitable for mounting the lens component.

[0083] Further, Figure 6a The schematic diagram of the bottom of the base in an embodiment of the present application is shown. Figure 6bThe top view schematic diagram of the circuit board in an embodiment of the present application is shown. Refer to Figure 6a and Figure 6b , in this embodiment, power connection contacts are provided at the bottom of the base to achieve electrical conduction between the base and the circuit board, and at the same time supply current to the MEMS driving structure. Specifically, by matching the power connection contacts 34 of the base and the power connection contacts 82 of the circuit board 80, the current supply of the base 30 can be achieved. A fixing position 33 can be provided in the middle of the base 30, and this fixing position 33 is used to fix with the circuit board 80. At the fixing position 33, the form of bonding can be selected, or other fixing forms can be selected, as long as the power connection contacts between the base and the circuit board can be well matched.

[0084] In an embodiment of the present application, the MEMS actuator not only includes elements that provide driving force (i.e., the comb-shaped movable part and fixed part), but also includes elements such as the base and the intermediate base connected thereto. The base and the intermediate base can be conducted through the SMA wire, and the chip and the intermediate base can be conducted through the gold wire, thereby conducting the circuit of the entire photosensitive component. Among them, multiple power connection contacts on the bottom surface of the base can be arranged into a base contact array, and this contact array is mainly used to contact the corresponding contact array (i.e., the circuit board contact array) on the upper surface of the circuit board to achieve power supply to the entire MEMS driving structure. Since the MEMS actuator and the circuit board are directly fixed together, when the MEMS actuator is fixed on the upper surface of the circuit board, a filter 50 can be directly installed on the top surface of the support base of its base (refer to Figure 3 and Figure 7 ) to achieve the filtering of stray light, and at the same time, it can also play a role in protecting the chip surface and preventing dust from falling on the chip surface.

[0085] Figure 7 The cross-sectional schematic diagram of the photosensitive component with a circuit board in an embodiment of the present application is shown. Refer to Figure 7 , a lens holder 81 is installed in the edge area of the circuit board 80, and the top surface 81a of the lens holder 81 is suitable for installing a lens assembly with a driving motor ( Figure 7 the lens assembly is not shown in the figure), and this driving motor can drive the optical lens to move along the optical axis direction to achieve the automatic focusing function of the lens. The MEMS driving structure mainly realizes the function of jitter correction. The driving motor of the lens assembly and the MEMS driving structure in the photosensitive component cooperate with each other, which can effectively improve the imaging quality. At the same time, there is also a contact array on the circuit board that matches the base. The power supply terminal on the circuit board can be connected to the power supply of an electronic device (such as a mobile phone) through a connecting band to achieve power supply. There are conductive power connection contacts between the circuit board and the base to achieve the power supply of the circuit in the base. The base supplies power to the MEMS driving structure and the chip through its internal circuit setting (not shown in the figure) to ensure the normal operation of the entire camera module.

[0086] In an embodiment of the present application, the photosensitive component with an anti-shake function can be applied to a periscope camera module. Compared with the structure of a traditional camera module, in the periscope camera module of this embodiment, under the action of a driving device, the photosensitive chip can achieve horizontal movement and rotational adjustment (here, the horizontal direction refers to the direction parallel to the photosensitive surface). When jitter occurs during the photographing process, correction can be directly performed on the chip in the horizontal direction. Compared with using a traditional driving lens to achieve the correction effect, this embodiment can reduce the driving force while reducing the design difficulty of the driving structure, making the correction effect more significant. In this embodiment, the motor of the driving lens can only achieve the focusing function, while the photosensitive component can achieve the function of chip anti-shake, that is, using the movement of the chip to replace the movement of the optical lens to achieve anti-shake. In this embodiment, separating the focusing function and the anti-shake function (that is, the focusing function and the anti-shake function are respectively achieved by the motor of the driving lens and the MEMS driving structure for driving the photosensitive chip) will make the correction result more accurate and better meet the current requirements for the quality of photographed images. When assembling this camera module, this structure can be divided into a photosensitive component with an anti-shake function and a lens component. First, these two modules (i.e., the photosensitive component and the lens component) are prefabricated separately, and then these two modules are assembled together.

[0087] When manufacturing the photosensitive component, the MEMS actuator can be manufactured first, and then the MEMS actuator is fixed to the upper surface of the circuit board, and the contact array at the bottom of its base is made to match the contact array of the circuit board. Glue can be applied at the position of the bottom of the base, so that the base and the circuit board structure are fixed together, or other methods can be used to fix the combined structure of the circuit board and the base, such as welding. After the base is fixed, the lens holder can also be fixed on the upper surface of the circuit board. The lens holder can surround the outside of the base, so as to accommodate the entire base inside it. The lens component can be fixed on the top surface of the lens holder. Among them, the lens component can be a focusing motor and an optical lens. During the initial installation process, the optical axis of the optical lens and the center position of the chip can be aligned by mechanical correction (as long as the two are within a certain error range, they are considered aligned). It is also possible to ensure that the error between the corrected chip and the optical axis is within a certain error range during the subsequent correction process of the camera module, thereby effectively improving the imaging quality of the camera module.

[0088] In the above embodiments, the base and the intermediate base involved are both fabricated based on semiconductor processes, and together with the MEMS driving structure, they form an integral MEMS actuator. This MEMS actuator can be regarded as a planar movement actuator, which is used to achieve the planar movement of the photosensitive chip. Here, planar movement refers to the movement of the photosensitive chip on a plane parallel to its photosensitive surface, such as translation along the x-axis, translation along the y-axis, or rotation around the z-axis. However, the photosensitive component of the present application is not limited thereto. For example, in another embodiment of the present application, the base and the intermediate base can be fabricated using non-semiconductor processes, and only the MEMS driving structure is fabricated using semiconductor processes. Figure 8 FIG. shows a three-dimensional schematic diagram of a photosensitive component according to another embodiment of the present application. Referring to Figure 8 , in this embodiment, the base and the intermediate base can both be implemented using a circuit board fabricated based on a lamination process. Specifically, the MEMS driving structure 40 may include a comb-shaped movable part and a comb-shaped fixed part that matches it. The first mounting surface may be located on the comb-shaped movable part or connected to the comb-shaped movable part, and the second mounting surface may be located on the comb-shaped fixed part or connected to the comb-shaped fixed part. And, the first mounting surface may be located at the top of the MEMS driving structure, and the second mounting surface may be located at the bottom of the MEMS driving structure. The first circuit board 20a may be mounted on the first mounting surface, and the second circuit board 30a may be mounted on the second mounting surface. In this way, the first circuit board 20a, the second circuit board 30a, and the MEMS driving structure 40 can jointly form a planar movement actuator. Among them, the first circuit board 20a can constitute the movable part of the planar movement actuator, which can be regarded as the intermediate base in the foregoing embodiment, and the second circuit board 30a can constitute the fixed part of the planar movement actuator, which can be regarded as the base in the foregoing embodiment. Further, the peripheral edge of the second circuit board 30a can extend upward to form a support base ( Figure 8(not shown in the figure). The second circuit board and the support base can be integrally formed, or can be prefabricated separately and then assembled into a whole (for example, a separately formed support base can be fixed along the periphery of the second circuit board). In this embodiment, the first circuit board and the second circuit board can be PCB boards. In other embodiments, the first circuit board and the second circuit board can also be ceramic substrates. The support base formed along the periphery of the second circuit board can be a molding base. In this embodiment, after the first circuit board and the second circuit board are respectively installed on the first mounting surface and the second mounting surface of the MEMS driving structure, a hydrogel can be filled in the gap between the first circuit board and the second circuit board. After the hydrogel is cured, the first circuit board is temporarily fixed to the second circuit board. At this time, through the wire bonding process, the first circuit board and the second circuit board can be electrically connected by using SMA wires. In this embodiment, the photosensitive chip can be installed on the upper surface of the first circuit board and electrically connected to the first circuit board through the wire bonding process. After the photosensitive chip is installed and the wire bonding process is completed, after the electrical connection between the photosensitive chip and the first circuit board, and between the first circuit board and the second circuit board is achieved, the hydrogel can be removed by a water washing process, thereby releasing the first circuit board. In this embodiment, the SMA wire can not only achieve electrical connection, but also suspend the first circuit board in the central area of the second circuit board. Driven by the MEMS driving structure, the first circuit board can move relative to the second circuit board in a direction parallel to the photosensitive surface. The photosensitive component of this embodiment is particularly suitable for use in a periscope camera module. In this embodiment, although two circuit boards are used in the photosensitive component, since it is applied to a periscope module, the thickness direction of the circuit board is not the thickness direction of the electronic device (such as a mobile phone) carrying the periscope module. Therefore, the scheme of adding a circuit board will not cause an increase in the thickness of the electronic device (such as a mobile phone).

[0089] Further, according to an embodiment of the present application, there is also provided an assembling method for a photosensitive component with an anti-shake function, which includes the following steps.

[0090] Step S1, prepare a MEMS actuator. Figure 10 The cross-sectional view of the MEMS actuator prepared in step S1 in an embodiment of the present application is shown. Refer to Figure 10, the MEMS actuator has an intermediate seat 20, a base 30, and a MEMS driving structure; wherein, the base 30 includes a bottom plate and a support seat formed by extending upward along the peripheral edge of the bottom plate; the intermediate seat 20 is located above the bottom plate and there is a gap between the side surface of the intermediate seat 20 and the support seat; the MEMS driving structure includes a comb-shaped movable part 44 and a comb-shaped fixed part 43 which are mutually adapted, the top surface of the comb-shaped movable part 44 is connected to the bottom surface of the intermediate seat 20, and the bottom surface of the comb-shaped fixed part 43 is connected to the top surface of the bottom plate. The MEMS actuator of this embodiment can be fabricated using semiconductor processes. Further descriptions of the method for fabricating a MEMS actuator based on semiconductor processes will be provided in combination with other embodiments below.

[0091] Step S2, injecting a hydrogel. Figure 11 Shows a cross-sectional view of the semi-finished product after step S2 in an embodiment of the present application. Refer to Figure 11 , in this step, a hydrogel 90 is injected into the gap between the intermediate seat 20 and the base 30, and then the hydrogel 90 is cured to fix the intermediate seat 20, that is, the intermediate seat 20 is fixed in the base 30 through the cured hydrogel 90, so as to prevent the intermediate seat 20 from shaking relative to the base 30 during the execution of subsequent steps.

[0092] Step S3, installing a photosensitive chip and completing wire connection. Figure 12 Shows a cross-sectional view of the semi-finished product after step S3 in an embodiment of the present application. Refer to Figure 12 , in this step, a photosensitive chip 10 is installed on the top surface of the intermediate seat 20, and a plurality of elastic connection lines 60 are formed between the intermediate seat 20 and the support seat 30 through wire bonding technology, and the connection lines 60 electrically conduct the photosensitive chip 10 and the base 30 (wherein the photosensitive chip 10 can be electrically conducted to the intermediate seat 20 through a gold wire first, and then electrically conducted from the intermediate seat 20 to the base 30 through the connection lines 60). In this embodiment, the connection lines 60 can be SMA lines, and the photosensitive chip 10 can be electrically connected to the intermediate seat 20 through wire bonding technology.

[0093] Step S4, removing the hydrogel through a water washing process to release the intermediate seat. Figure 13 Shows a cross-sectional view of the photosensitive component after step S3 in an embodiment of the present application. Figure 19 Shows the assembly process of the photosensitive component in an embodiment of the present application (including cross-sectional views of the semi-finished products or finished products obtained after each step of steps S1 - S4 is executed). Further, in one embodiment, a molding seat 33 can also be continuously formed on the top surface of the support seat 32 of the base 30, so as to obtain a photosensitive component as shown in Figure 9 . Refer to Figure 9, the top surface of the molding base 33 can be further mounted with a filter 50.

[0094] Further, according to an embodiment of the present application, a method for fabricating a MEMS actuator based on semiconductor processes is also provided. This method can be applied in step S1 to obtain the required MEMS actuator. The method for fabricating a MEMS actuator based on semiconductor processes includes the following steps.

[0095] Step S11, fabricate a base. Figure 14 The cross-sectional view of the base in an embodiment of the present application is shown. The base includes a bottom plate 31 and a support base 32 extending upward from the periphery of the bottom plate 31. The support base 32 can be annular (in a top-down view), so as to form a receiving groove in the center of the base for accommodating the intermediate and photosensitive chips. In this embodiment, the base with the support base 32 can be fabricated in this step. In other embodiments, the bottom plate 31 can also be fabricated first, and then the support base 32 can be fabricated on the surface of the bottom plate 31 in subsequent steps.

[0096] Step S12, fabricate a lower connection layer. Figure 15 The cross-sectional view of the MEMS actuator semi-finished product after completing step S12 in an embodiment of the present application is shown. In this step, the lower connection layer is fabricated on the upper surface of the bottom plate 31 by semiconductor processes. The lower connection layer includes a lower connection portion 45 for connecting the base and the comb-shaped fixing portion and a sacrificial material 46 filled between the lower connection portions. The shape of the lower connection portion 45 can be the same as that of the comb-shaped fixing portion, that is, the lower connection portion 45 can completely overlap the bottom surface of the comb-shaped fixing portion. In another embodiment, the shape of the lower connection portion 45 can also be different from that of the comb-shaped fixing portion. For example, the lower connection portion 45 can only connect to the comb-shaped fixing portion in a partial area of the bottom surface of the comb-shaped fixing portion, as long as this connection has sufficient structural strength and reliability.

[0097] Step S13, fabricate a comb-shaped drive structure pattern layer. Figure 16 The cross-sectional view of the MEMS actuator semi-finished product after completing step S13 in an embodiment of the present application and the top-down shape of the comb-shaped drive structure pattern layer therein are shown. In this step, the comb-shaped drive structure pattern layer is fabricated on the upper surface of the lower connection layer by semiconductor processes. It includes a plurality of comb-shaped drive structure patterns and a sacrificial material 46 filled between the comb-shaped drive structure patterns. Each comb-shaped drive structure pattern can include a comb-shaped fixing portion 43 and a comb-shaped movable portion 44. The bottom surface of the comb-shaped fixing portion 43 is located on the top surface of the lower connection portion 45, so as to connect the two. The bottom surface of the comb-shaped movable portion 44 is fabricated on the sacrificial material 46 of the lower connection layer. In the present application, the shape and number of the comb-shaped drive structure patterns are not unique. In different embodiments, the number and shape of the comb-shaped drive structure patterns can be set according to actual situations.

[0098] Step S14: fabricate the upper connection layer. Figure 17 Fig. shows a cross-sectional view of the MEMS actuator semi-finished product after completing step S14 in an embodiment of the present application. In this step, the upper connection layer is fabricated on the upper surface of the comb drive structure pattern layer by semiconductor processes. The upper connection layer includes an upper connection portion 47 for connecting the intermediate base and the comb movable portion 44 and a sacrificial material 46 filled between the upper connection portions. The bottom surface of the upper connection portion 47 is fabricated on the top surface of the comb movable portion 44. The top surface of the comb fixed portion 43 is filled with the sacrificial material 46. The shape of the upper connection portion 47 can be the same as that of the comb movable portion, that is, the upper connection portion 47 can completely overlap the top surface of the comb movable portion. In another embodiment, the shape of the upper connection portion 47 can also be different from that of the comb movable portion. For example, the upper connection portion 47 can connect to the comb movable portion only in a partial area of the top surface of the comb movable portion, as long as the connection has sufficient structural strength and reliability.

[0099] Step S15: fabricate the intermediate base. Figure 18 Fig. shows a cross-sectional view of the MEMS actuator semi-finished product after completing step S15 in an embodiment of the present application. In this step, the intermediate base 20 is fabricated on the upper surface of the upper connection layer by semiconductor processes.

[0100] Step S16: remove the sacrificial material 46. For example, a corrosive material can be injected, which can corrode and remove the sacrificial material 46, but other structures of the MEMS actuator semi-finished product remain intact. After performing step S16, the required MEMS actuator can be obtained, as Figure 10 shown. Figure 20 Fig. shows the manufacturing process of the MEMS actuator fabricated based on semiconductor processes in an embodiment of the present application (including cross-sectional views of semi-finished products or finished products obtained after each step of steps S11 - S16). Further, steps S2, S3, and S4 can be continued to obtain a photosensitive component. The finished photosensitive component can be a photosensitive component as Figure 13 or Figure 9 shown.

[0101] In an embodiment of the present application, based on the above photosensitive component, a lens assembly can be further mounted on the photosensitive component to obtain an imaging module.

[0102] Further, in an embodiment of the present application, a circuit board can also be mounted on the bottom surface of the base of the above photosensitive component. The edge area of the circuit board can have a lens mount for mounting the lens assembly. The circuit board can include a rigid PCB, an FPC connection tape, and a connector. Among them, the bottom surface of the base is mounted on the surface of the rigid PCB, and the lens mount is also mounted on the edge area of the rigid PCB.

[0103] The above description is only a preferred embodiment of the present application and an explanation of the applied technical principles. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solutions formed by the specific combination of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the technical solutions formed by mutually replacing the above features with the technical features (but not limited to) disclosed in the present application that have similar functions.

Claims

1. A photosensitive component with an anti-shake function, characterized in that, Comprising: A photosensitive chip; And A planar moving actuator having an intermediate seat, a base, and a MEMS driving structure; wherein, the base includes a bottom plate and a support seat formed by extending upward along the periphery of the bottom plate, the intermediate seat is located within the base and there is a gap between the side surface of the intermediate seat and the support seat; the MEMS driving structure is disposed between the upper surface of the bottom plate of the base and the lower surface of the intermediate seat; wherein, the photosensitive chip is mounted on the top surface of the intermediate seat; and the intermediate seat is connected to the support seat by a plurality of elastic connection lines, and the electrical connection between the intermediate seat and the base is achieved through the connection lines, wherein the elastic connection lines are SMA lines, wherein the top surface of the support seat is provided with support seat contacts for connecting the SMA lines; wherein, a molding seat is formed on the top surface of the support seat to encapsulate the support seat contacts connected to the SMA lines and the section of the SMA line close to the support seat contacts inside.

2. The photosensitive component with an anti-shake function according to claim 1, wherein The photosensitive component with an anti-shake function further includes a circuit board; the bottom surface of the base is mounted on the surface of the circuit board.

3. The photosensitive component with an anti-shake function according to claim 2, wherein The photosensitive chip and the intermediate seat are electrically connected by wire bonding.

4. The photosensitive component with an anti-shake function according to claim 2, wherein The MEMS driving structure includes an x-axis driving structure and a y-axis driving structure, wherein the x-axis and the y-axis are perpendicular to each other and both are parallel to the photosensitive surface of the photosensitive chip; the x-axis driving structure includes a comb-shaped movable part that can be translated in the x-axis direction and a comb-shaped fixed part adapted thereto, and the y-axis driving structure includes the comb-shaped movable part that can be translated in the y-axis direction and the comb-shaped fixed part adapted thereto.

5. The photosensitive component with an anti-shake function according to claim 4, wherein The MEMS driving structure includes a rotation driving structure for driving rotation around the z-axis, the z-axis is perpendicular to the x-axis and the y-axis; the rotation driving structure includes the comb-shaped fixed part and the comb-shaped movable part.

6. The photosensitive component with an anti-shake function according to claim 1, wherein The intermediate seat, the base, and the MEMS driving structure are fabricated based on semiconductor processes; wherein, the gaps between the intermediate seat, the base, and the MEMS driving structure are formed by removing sacrificial materials.

7. The photosensitive component with an anti-shake function according to claim 1, wherein The photosensitive component with an anti-shake function further includes a filter, and the filter is mounted on the top surface of the support seat.

8. The photosensitive component with an anti-shake function according to claim 2, wherein The edge area of the circuit board has a lens mount, and the lens mount is adapted to mount a lens assembly.

9. The photosensitive component with an anti-shake function according to claim 1, wherein The intermediate base is a first circuit board fabricated by a lamination process, the bottom base is a second circuit board fabricated by a lamination process, and the support base is mounted or directly formed on the peripheral area of the second circuit board; The MEMS driving structure is fabricated by a semiconductor process, and the MEMS driving structure has a first mounting surface located on its top surface and connected to the comb-shaped movable part, and a second mounting surface located on its bottom surface and connected to the comb-shaped fixed part. The first circuit board is mounted on the first mounting surface, and the second circuit board is mounted on the second mounting surface.

10. The photosensitive component with an anti-shake function according to claim 9, wherein, Both the first circuit board and the second circuit board are PCB boards.

11. An imaging module, characterized in that, Comprising: A lens assembly; And The photosensitive component with an anti-shake function according to any one of claims 1-10, wherein the bottom surface of the lens assembly is mounted on the top surface of the photosensitive component with an anti-shake function.

12. The imaging module according to claim 11, wherein, The lens assembly includes a motor and an optical lens, and the motor is used to drive the optical lens to move to achieve a focusing function; in the photosensitive component with an anti-shake function, the planar movement actuator is used to drive the intermediate base and drive the photosensitive chip to move to achieve an anti-shake function.

13. An assembling method of a photosensitive component with an anti-shake function, characterized in that, Comprising: Step 1) Prepare a planar movement actuator, which has an intermediate base, a base, and a MEMS driving structure; wherein, the base includes a bottom base and a support base extending upward from the periphery of the bottom base; the intermediate base is located above the bottom base and there is a gap between the side surface of the intermediate base and the support base; the MEMS driving structure includes a mutually adapted comb-shaped movable part and a comb-shaped fixed part, the top surface of the comb-shaped movable part is connected to the bottom surface of the intermediate base, and the bottom surface of the comb-shaped fixed part is connected to the top surface of the bottom base; Step 2) Inject a hydrogel into the gap between the intermediate base and the base, and then cure the hydrogel to fix the intermediate base in the base; Step 3) Mount a photosensitive chip on the top surface of the intermediate base, form a plurality of elastic connection lines between the intermediate base and the support base through a WB process, and the connection lines electrically conduct the photosensitive chip and the base; and Step 4) Remove the hydrogel through a water washing process to release the intermediate base; Wherein, in the step 3), the elastic connection line is an SMA line; Wherein, a support base contact is provided on the top surface of the support base for connecting the SMA line; Wherein, the assembly method further includes the step of forming a molding base on the top surface of the support base to encapsulate the support base contact connected to the SMA line and the section of the SMA line close to the support base contact inside.

14. The assembling method of the photosensitive component with an anti-shake function according to claim 13, wherein, The step 3) further includes: electrically connecting the photosensitive chip and the intermediate base through a WB process.

15. The assembling method of the photosensitive component with an anti-shake function according to claim 13, wherein, In the step 1), the planar movement actuator is a MEMS actuator fabricated by a semiconductor process, and the manufacturing method of the MEMS actuator includes: 11) Fabricate the base; 12) Fabricate a lower connection layer on the upper surface of the base, the lower connection layer including a lower connection portion for connecting the base and the comb-shaped fixing portion and a sacrificial material filled between the lower connection portions; 13) Fabricate a comb-shaped drive structure pattern layer on the upper surface of the lower connection layer, the comb-shaped drive structure pattern layer including a plurality of comb-shaped drive structure patterns and a sacrificial material filled between the comb-shaped drive structure patterns, each of the comb-shaped drive structure patterns including the comb-shaped fixing portion and the comb-shaped movable portion; 14) Fabricate an upper connection layer on the upper surface of the comb-shaped drive structure pattern layer, the upper connection layer including an upper connection portion for connecting the intermediate base and the comb-shaped movable portion and a sacrificial material filled between the upper connection portions; 15) Fabricate an intermediate base on the upper surface of the upper connection layer; and 16) Remove the sacrificial material to obtain the required MEMS actuator.

16. An assembly method of a camera module, characterized in that it includes: a) Assembling a photosensitive component based on the assembly method of the photosensitive component with an anti-shake function according to any one of claims 13-15; and b) Assembling the lens component and the photosensitive component together to obtain the camera module.

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