Luminescent sheet structure and method for manufacturing a luminescent sheet structure

Abstract

The present application belongs to the field of printed electronics, and discloses a cold light sheet structure and a cold light sheet structure manufacturing method. The cold light sheet structure comprises an upper layer and a lower layer. The upper layer comprises an upper substrate and an upper electrode layer arranged on the upper substrate. The upper electrode layer is made of light-transmitting conductive material. The lower layer comprises a lower substrate, a lower electrode layer and a light-emitting layer. The lower electrode layer is arranged on the lower substrate. The lower electrode layer comprises a plurality of first electrodes and a plurality of second electrodes arranged alternately and at intervals. The light-emitting layer is arranged on the lower electrode layer. The upper layer and the lower layer are independent or connected by adhesive. The cold light sheet structure can reduce the cost of changing the light-emitting shape of the cold light sheet and improve the stability of the light-emitting of the cold light sheet. The cold light sheet structure manufacturing method processes the upper layer and the lower layer separately, and the first electrodes and the second electrodes are arranged in the lower layer of the light-emitting layer at the same time, thereby reducing the cost of changing the light-emitting shape of the cold light sheet, and eliminating the step of arranging the dielectric layer, thereby ensuring the stability of the light-emitting of the cold light sheet.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of printed electronics, in particular to a cold light sheet structure and a cold light sheet structure manufacturing method. BACKGROUND

[0002] EL (Electro Luminescent) is a physical phenomenon that causes electron transition, change and recombination between energy levels, resulting in light emission, by the impact of electrons excited by electric field on luminescent centers, through the voltage applied to two electrodes. The cold light sheet made by the electro luminescent technology can provide a green and environmentally friendly light source with uniform brightness and non-glaring light, and has the advantages of energy saving, no heat generation, ultra-thin, bendable folding, free cutting, etc. The existing cold light sheet has a luminescent layer sandwiched between two electrodes. The distance between the two electrodes is less than the electron transition distance of the luminescent layer, so as to excite the electron transition of the luminescent layer and emit light. The upper electrode is mostly transparent. The shape of the light emission of such cold light sheet is determined by the shape of the lower electrode, and the lower electrode is generally fixed.

[0003] However, the demand for cold light sheets is becoming more and more extensive, and there is a great demand for changing the shape of light emission. The existing cold light sheet needs to be redesigned in terms of electrode shape or light shielding if the shape is to be changed, which has the disadvantages of complex process, low efficiency and high cost. In order to avoid the two electrodes being too close, the existing cold light sheet places a dielectric layer between the two electrodes for insulation, so as to ensure that the electric field of the capacitance between the two electrodes is sufficient to excite electron transition. However, if the insulation effect of the dielectric layer is not good, the electric field of the capacitance will be lost, the excited electrons will be less or it will be difficult to excite electron transition, resulting in low light emission brightness or no light emission, which brings instability factors to the light emission stability of the cold light sheet.

[0004] Therefore, it is urgent to design a cold light sheet structure and a cold light sheet structure manufacturing method to solve the problems of high cost of changing the light emission shape of the cold light sheet and unstable light emission of the cold light sheet. SUMMARY

[0005] An object of the present application is to provide a cold light sheet structure which can reduce the cost of changing the light emission shape of the cold light sheet and improve the stability of the light emission of the cold light sheet.

[0006] To achieve this object, the present application adopts the following technical solutions:

[0007] The cold light sheet structure comprises:

[0008] The upper layer comprises an upper substrate and an upper electrode layer disposed on the upper substrate, the upper electrode layer is made of light-transmitting conductive material, and the upper substrate is light-transmitting; and

[0009] The lower layer comprises a lower substrate, a lower electrode layer and a light-emitting layer, the lower electrode layer is arranged on the lower substrate, the lower electrode layer comprises a plurality of first electrodes and a plurality of second electrodes arranged alternately and spaced apart, and the light-emitting layer is arranged on the lower electrode layer; the upper layer and the lower layer are independently connected or adhesively connected.

[0010] Optionally, when the upper layer and the lower layer are adhesively connected, the distance of electron transition of the light-emitting layer is a, the distance between adjacent first electrodes and second electrodes is b, and the distance between the upper electrode layer and the lower electrode layer is c when the upper layer and the lower layer are adhesively connected, c≤a<b.

[0011] Optionally, b is 0.4mm-1mm, and c is 50μm-100μm.

[0012] Optionally, the material of the upper electrode layer is any one of polyelectrolyte complex, nano-silver conductive ink or indium tin oxide.

[0013] Optionally, the upper layer further comprises an adhesive layer and a release paper layer, the adhesive layer is arranged on the side of the upper electrode layer away from the upper substrate, the release paper layer is arranged on the side of the adhesive layer away from the upper electrode layer, and the release paper layer and the adhesive layer are peelably arranged.

[0014] Optionally, the lower layer further comprises a protective layer, the protective layer is arranged on the side of the light-emitting layer away from the lower electrode layer, and the adhesive layer is attached to the protective layer when the upper layer and the lower layer are adhesively connected.

[0015] Optionally, the upper layer further comprises a pattern layer, and the pattern layer is arranged on the side of the upper substrate away from the upper electrode layer.

[0016] Another object of the present application is to provide a manufacturing method of the cold light sheet structure, which can reduce the cost of changing the light-emitting shape of the cold light sheet and improve the stability of the cold light sheet.

[0017] To achieve the above object, the present application adopts the following technical solutions:

[0018] The manufacturing method of the cold light sheet structure is used to manufacture the cold light sheet structure, the lower layer further comprises a protective layer, the protective layer is arranged on the side of the light-emitting layer away from the lower electrode layer, and the manufacturing method of the cold light sheet structure comprises the following steps:

[0019] S11: alternately arranging a plurality of first electrodes and a plurality of second electrodes of the lower electrode layer on the lower substrate;

[0020] S12: arranging the light-emitting layer on the lower electrode layer;

[0021] S13: disposing the protective layer on the light-emitting layer;

[0022] S21: covering the upper electrode layer on the upper substrate;

[0023] S30: cutting the upper layer and then bonding the upper layer to the lower layer or cutting the upper layer and the lower layer together after bonding the upper layer to the lower layer.

[0024] Optionally, the upper layer further comprises an adhesive layer and a release paper layer, the adhesive layer is located on the side of the upper electrode layer away from the upper substrate, and the release paper layer is located on the other side of the adhesive layer, and the cold light sheet structure manufacturing method further comprises:

[0025] S22: disposing the adhesive layer on the upper electrode layer;

[0026] S23: covering the release paper layer on the adhesive layer; S22 and S23 are located between S21 and S30, and S30 is: cutting the upper layer, and then covering the adhesive layer on the protective layer after tearing off the release paper layer, or cutting the upper layer and the lower layer together after covering the adhesive layer on the protective layer after tearing off the release paper layer.

[0027] Optionally, the upper electrode layer is processed on the upper substrate by any one of silk screen printing, inkjet printing, coating, dispensing and magnetron sputtering process.

[0028] The present application has the following beneficial effects:

[0029] The application provides a cold light sheet structure, which is divided into an upper layer and a lower layer, and the upper layer and the lower layer can be independently manufactured, the first electrode and the second electrode are located in the same layer and are arranged at intervals, the distance between the first electrode and the second electrode is insufficient to excite electron transition, after the upper layer and the lower layer are combined, the conductive material of the upper electrode layer is close to the lower electrode layer, a layer of conductor is added between the positive and negative plates of the capacitor between the first electrode and the second electrode, the capacitor with the distance between the original lower electrode plate and the first electrode and the second electrode is converted into a capacitor with the thickness of the lower electrode layer to the upper electrode layer as the distance between the positive and negative plates, i.e. a capacitor with the thickness of the light-emitting layer, the thickness of the light-emitting layer is very thin, which is within the distance of exciting electrons and far smaller than the distance between the first electrode and the second electrode, so the electric field strength is increased due to the constant voltage, so that the electron transition of the light-emitting layer can be excited, the upper electrode layer of the light-emitting layer covers part of the light-emitting layer, and the purpose of quickly producing different light-emitting patterns is achieved, the setting of the dielectric layer is omitted, and the stability of the cold light sheet is ensured; meanwhile, the upper layer and the lower layer are independent of each other, the upper layer can be quickly cut into a desired shape through cutting means, the needs of different customers are met, and the lower layer does not need to be replaced and can be used universally under the condition that the area of the lower layer is large enough, i.e. the design parameters of the lower layer do not need to be changed, and a new template does not need to be designed, so that the cost of replacing the light-emitting shape of the cold light sheet is greatly reduced.

[0030] The application also provides a cold light sheet structure manufacturing method, the upper layer and the lower layer are processed separately, and the first electrode and the second electrode are located in the lower layer of the light-emitting layer at the same time, so that the upper layer can be die-cut and combined with the lower layer, the upper layer and the lower layer are glued and then die-cut together, the cost of replacing the light-emitting shape of the cold light sheet is reduced, and the step of setting the dielectric layer is omitted, so that the stability of the cold light sheet is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is a structure diagram of an independent upper layer provided by the embodiment of the application;

[0032] Figure 2 is a structure diagram of an independent lower layer provided by the embodiment of the application;

[0033] Figure 3 is a structure diagram of a cold light sheet structure obtained by combining the upper layer and the lower layer provided by the embodiment of the application.

[0034] In the drawings:

[0035] 10, upper layer; 11, upper substrate; 12, upper electrode layer; 13, adhesive layer; 14, release paper layer; 15, pattern layer; 20, lower layer; 21, lower substrate; 22, lower electrode layer; 221, first electrode; 222, second electrode; 23, light emitting layer; 24, protective layer; 200, EL cell light emitting driving element. DETAILED DESCRIPTION

[0036] The application will be further described below in connection with the drawings and examples. It should be understood that the specific examples described herein are intended to be illustrative only and are not in any way limiting of the application. In addition, it should also be understood that, for the purpose of clarity, only those structures directly related to the application are shown in the drawings.

[0037] In the description of the application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0038] In the present application, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "upper", "above" and "on" of the first feature to the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "under" and "under" of the first feature to the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0039] In the description of the present embodiment, the terms "upper", "lower", "left", "right" and other orientation or position relationship are based on the orientation or position relationship shown in the drawings, which is only for the convenience of description and simplification of operation, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the application. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0040] The present embodiment provides a cold light sheet structure, which can reduce the cost of replacing the light-emitting shape of the cold light sheet and improve the stability of the cold light sheet light-emitting. As shown in Figures 1 to 3As shown, the cold light sheet structure includes an upper layer 10 and a lower layer 20. The upper layer 10 includes a light-transmitting upper substrate 11 and an upper electrode layer 12 placed on the upper substrate 11. The upper electrode layer 12 is made of a light-transmitting conductive material. The lower layer 20 includes a lower substrate 21, a lower electrode layer 22, and a light-emitting layer 23. The lower electrode layer 22 is placed on the lower substrate 21 and includes a plurality of first electrodes 221 and a plurality of second electrodes 222 arranged alternately and at intervals. The light-emitting layer 23 is placed on the lower electrode layer 22. The upper layer 10 and the lower layer 20 are independent of each other or bonded together. By dividing the cold light sheet structure into an upper layer 10 and a lower layer 20, which can be manufactured separately, and with the first electrode 221 and the second electrode 222 located on the same layer and spaced apart, the distance between the first electrode 221 and the second electrode 222 is insufficient to excite electron transitions. After the upper layer 10 and the lower layer 20 are combined, the conductive material of the upper electrode layer 12 approaches the lower electrode layer 22, which is equivalent to adding a conductor between the positive and negative plates of the capacitor between the first electrode 221 and the second electrode 222. This is equivalent to transforming the original capacitor, where the distance between the lower electrode plates was the size of the gap between the first electrode 221 and the second electrode 222, into a capacitor where the distance between the positive and negative plates is the thickness from the lower electrode layer 22 to the upper electrode layer 12, i.e., the thickness of the light-emitting layer 23. The thickness of the light-emitting layer 23 is very thin. The distance is within the range of the excited electrons and is much smaller than the distance between the first electrode 221 and the second electrode 222. Since the voltage is constant, the electric field strength is increased, which can excite the transition of electrons in the light-emitting layer 23, causing the upper electrode layer 12 of the light-emitting layer 23 to emit light. This achieves the purpose of rapid production of different light-emitting patterns, eliminates the need for a dielectric layer, and ensures the stability of the light emission of the cold light sheet. At the same time, since the upper layer 10 and the lower layer 20 are independent of each other, the upper layer 10 can be quickly cut into the desired shape by cutting means to meet the needs of different customers. When the area of ​​the lower layer 20 is large enough, there is no need to change the settings of the lower layer 20 for universal use. That is, the design parameters of the lower layer 20 do not need to be changed, and there is no need to redesign a new template, which greatly reduces the cost of changing the light emission shape of the cold light sheet.

[0041] Optionally, such as Figure 1 As shown, the upper layer 10 also includes an adhesive layer 13, which is located on the side of the upper electrode layer 12 facing away from the upper substrate 11. With this arrangement, the adhesive layer 13 is incorporated into the upper layer 10. When bonding the upper layer 10 and the lower layer 20, no additional glue or double-sided tape is needed, ensuring a fast and effective bond. Optionally, the adhesive layer 13 can be made of a transparent or semi-transparent material, such as 3M SP-7533 water-based screen printing adhesive, Japanese Sanpin TB1549B water-based screen printing adhesive, Japanese Sanpin TB3373C anisotropic conductive adhesive, 3M 9703Z-axis anisotropic conductive tape, etc., and is not limited here.

[0042] Preferably, such asFigure 1 As shown, the upper layer 10 also includes a release paper layer 14, which is placed on the side of the adhesive layer 13 opposite to the upper electrode layer 12. The release paper layer 14 and the adhesive layer 13 are peelable. Through this arrangement, the release paper layer 14 protects the adhesive layer 13, facilitating the independent storage or mass production of the upper layer 10, and allowing for easy curling and placement of the upper layer 10 as a whole. When bonding with the lower layer 20, simply peel off the release paper layer 14; it is simple, convenient, and quick.

[0043] Preferably, the upper layer 10 is die-cut into the required shape, which is a simple method. During the die-cutting process, the release paper layer 14 ensures that the adhesive layer 13 does not stick to the die-cutting rollers.

[0044] Preferably, such as Figure 1 As shown, the upper layer 10 also includes a pattern layer 15, which is located on the side of the upper substrate 11 opposite to the upper electrode layer 12. It is understood that patterns can be printed on the upper substrate 11 to ensure the aesthetics of the electroluminescent sheet after light emission, or to meet customer requirements for customized patterns, while also providing some protection for the upper substrate 11. Preferably, the pattern layer 15 is also printed with positioning marks to ensure accurate bonding position when bonded to the lower layer 20.

[0045] Preferably, the lower layer 20 further includes a protective layer 24, which is located on the side of the light-emitting layer 23 opposite to the lower electrode layer 22. When the upper layer 10 and the lower layer 20 are bonded, the adhesive layer 13 adheres to the protective layer 24. With this configuration, on the one hand, the protective layer 24 can protect the light-emitting layer 23; on the other hand, patterns or positioning marks can be printed on the protective layer 24 to form a three-dimensional effect with the pattern layer 15. The positioning marks on the protective layer 24 correspond to the positioning marks on the pattern layer 15, ensuring accurate bonding.

[0046] Optionally, the upper substrate 11 is made of a transparent polyester sheet (also known as PET film) or thermoplastic polyurethane (also known as TPU film), which has the advantages of transparency and high temperature resistance. Since the upper electrode layer 12 needs to be baked and shaped after being covered onto the upper substrate 11, its high temperature resistance ensures the stability of the shape of the upper layer 10. It should be noted that the upper substrate 11 can be made of other transparent and high temperature resistant materials, which will not be elaborated here.

[0047] Optionally, the material of the upper electrode layer 12 can be any one of a polyelectrolyte complex, nano-silver conductive ink, or indium tin oxide. Specifically, the polyelectrolyte complex can be a PEDOT:PSS dispersion, i.e., a dispersion formed by poly(3,4-ethylenedioxythiophene) and polystyrene sulfonic acid, which has the advantage of high stability.

[0048] Optionally, when the upper layer 10 and the lower layer 20 are bonded, the distance of the electron transition of the light-emitting layer 23 is a, the distance between the adjacent first electrode 221 and the second electrode 222 is b, and the distance between the upper electrode layer 12 and the lower electrode layer 22 is c when the upper layer 10 and the lower layer 20 are bonded, c≤a<b. The above setting makes the light-emitting layer 23 not emit light when only the first electrode 221 and the second electrode 222 are present, and the distance between the upper electrode layer 12 and the lower electrode layer 22 satisfies the electron transition distance of the light-emitting layer 23 after the upper layer 10 and the lower layer 20 are bonded.

[0049] It can be understood that the plurality of first electrodes 221 and the plurality of second electrodes 222 intersect to form an interdigital electrode, which is compact in structure and high in space utilization.

[0050] Preferably, b is 0.4 mm-1 mm, and c is 50 μm-100 μm. The above values are optimized after testing, and the order of magnitude of b and c is large, which ensures that the light-emitting layer 23 does not emit light when only the lower layer 20 is present, and emits light only after the upper layer 10 and the lower layer 20 are bonded. At the same time, it also avoids short circuiting of the first electrode 221 and the second electrode 222.

[0051] The embodiment also provides a method for manufacturing the cold light sheet structure, which specifically comprises the following steps:

[0052] S11: interleaving a plurality of first electrodes 221 and a plurality of second electrodes 222 of the lower electrode layer 22 on the lower substrate 21;

[0053] S12: disposing the light-emitting layer 23 on the lower electrode layer 22;

[0054] S13: disposing the protective layer 24 on the light-emitting layer 23;

[0055] S21: covering the upper electrode layer 12 on the upper substrate 11;

[0056] S30: cutting the upper layer 10 and bonding the upper layer 10 and the lower layer 20, or cutting the upper layer 10 and the lower layer 20 together after bonding the upper layer 10 and the lower layer 20.

[0057] In S11, the lower electrode layer 22 can be processed on the lower substrate 21 by screen printing, inkjet printing, magnetron sputtering, coating, etc. The lower electrode layer 22 can be any shape such as a rectangle or a circle, which is not limited herein. When the screen printing method is used, the screen mesh number is 200-300 meshes, the baking temperature is 80-120°C, and the baking time is 15-30 minutes, which are preferred parameter values.

[0058] In S12, the light-emitting layer 23 can be processed on the lower electrode layer 22 by screen printing, coating, dispensing, etc. When screen printing is used, the screen mesh is 200-300 mesh, the baking temperature is 70-90℃, and the baking time is 10-20 minutes, which are the preferred parameter values.

[0059] In S13, the protective layer 24 material can be UV ink, which plays a protective role such as waterproofing and dustproofing. The ink can also be used to draw patterns or positioning marks. After inkjet printing, a UV lamp is used for curing.

[0060] In S21, the upper electrode layer 12 can be processed on the upper substrate 11 by any of screen printing, inkjet printing, coating, dispensing, and magnetron sputtering. When screen printing PEDOT:PSS ink, the screen mesh is 250-300 mesh, the baking temperature is 80-120℃, and the baking time is 15-30 minutes, which are the preferred values.

[0061] In S30, the cutting method is preferably die cutting.

[0062] Preferably, the cold light sheet structure manufacturing method further comprises:

[0063] S22: providing an adhesive layer 13 on the upper electrode layer 12;

[0064] S23: laminating a release paper layer 14 on the adhesive layer 13; S22 and S23 are located between S21 and S30, and S30 is: cutting the upper layer 10, and after the release paper layer 14 is torn off, laminating the adhesive layer 13 on the protective layer 24, or tearing off the release paper layer 14, laminating the adhesive layer 13 on the protective layer 24, and then cutting together.

[0065] In S22, the adhesive layer 13 can be processed on the upper electrode layer 12 by screen printing, coating, or pasting.

[0066] S30 can be understood as follows: the upper layer 10 can be cut into the desired shape separately and then bonded to the lower layer 20, or the upper layer 10 and the lower layer 20 can be bonded together and then cut into the same shape. Both methods are acceptable.

[0067] Optionally, the above cold light sheet structure manufacturing method further comprises S20: providing a pattern layer 15 on the side of the upper substrate 11 away from the upper electrode layer 12, which is provided in the same way as the protective layer 24 and will not be described here.

[0068] Optionally, if the lower substrate 21 has multiple sets of interdigital electrodes formed by the first electrode 221 and the second electrode 222, the device formed by combining the upper layer 10 and the lower layer 20 also needs to be positioned and die cut. After die cutting, several cold light sheets that can emit light separately are obtained.

[0069] For example, Figure 3As shown, when the upper layer 10 and the lower layer 20 are bonded, one end of the first electrode 221 is gathered at one end, one end of the second electrode 222 is gathered at one end, two ends of the EL cell light-emitting driving element 200 are respectively electrically connected with one end of the first electrode 221 and one end of the second electrode 222, the power supply of the EL electroluminescent driving element 200 is turned on, the switch of the EL electroluminescent driving element 200 is opened, and the cold light sheet can emit light according to the shape of the upper electrode layer 12.

[0070] Obviously, the above-mentioned embodiments of the present application are only examples for clearly illustrating the present application, and are not intended to limit the implementation modes of the present application. Any obvious changes, re-adjustments and substitutions made by those skilled in the art without departing from the protection scope of the present application should be included in the protection scope of the claims of the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the claims of the present application.

Claims

1. A cold light sheet structure, characterized by, The application relates to a cold light sheet structure, which comprises: an upper layer (10) comprising an upper substrate (11) and an upper electrode layer (12) arranged on the upper substrate (11), the upper electrode layer (12) being made of a light-transmitting conductive material, and the upper substrate (11) being light-transmitting; and a lower layer (20) comprising a lower substrate (21), a lower electrode layer (22) arranged on the lower substrate (21), and a light-emitting layer (23), the lower electrode layer (22) comprising a plurality of first electrodes (221) and a plurality of second electrodes (222) arranged alternately and at intervals, and the light-emitting layer (23) being arranged on the lower electrode layer (22); the upper layer (10) and the lower layer (20) being independent of each other or being connected by adhesive connection. The upper layer (10) further comprises an adhesive layer (13) arranged on a side of the upper electrode layer (12) away from the upper substrate (11), and a release paper layer (14) arranged on a side of the adhesive layer (13) away from the upper electrode layer (12), the release paper layer (14) being arranged peelably with the adhesive layer (13). The lower layer (20) further comprises a protective layer (24) arranged on a side of the light-emitting layer (23) away from the lower electrode layer (22), and when the upper layer (10) and the lower layer (20) are connected by adhesive connection, the adhesive layer (13) is attached to the protective layer (24). The upper layer (10) further comprises a pattern layer (15) arranged on a side of the upper substrate (11) away from the upper electrode layer (12), and the pattern layer (15) is provided with positioning marks, and the protective layer (24) is provided with a pattern or positioning marks. When the upper layer (10) and the lower layer (20) are connected by adhesive connection, the distance of electron transition of the light-emitting layer (23) is a, the distance between adjacent first electrodes (221) and second electrodes (222) is b, the distance between the upper electrode layer (12) and the lower electrode layer (22) is c, and c<=a<b.

2. The luminescent sheet structure according to claim 1, wherein The b is 0.4mm-1mm, and the c is 50um-100um.

3. The luminescent sheet structure of claim 2, wherein The material of the upper electrode layer (12) is any one of polyelectrolyte complex, nano-silver conductive ink or indium tin oxide.

4. The luminescent sheet structure of claim 1, wherein The lower layer (20) further comprises a protective layer (24) arranged on a side of the light-emitting layer (23) away from the lower electrode layer (22), and the cold light sheet structure manufacturing method comprises the following steps:

5. A method of manufacturing a luminescent sheet structure, characterized by S11: alternately arranging a plurality of first electrodes (221) and a plurality of second electrodes (222) of the lower electrode layer (22) on the lower substrate (21); S12: arranging the light-emitting layer (23) on the lower electrode layer (22); S13: arranging the protective layer (24) on the light-emitting layer (23); S21: covering the upper electrode layer (12) on the upper substrate (11); and S22: arranging the upper layer (10) on the lower layer (20). S30: cutting the upper layer (10) after gluing the upper layer (10) with the lower layer (20) or cutting the upper layer (10) and the lower layer (20) together after gluing the upper layer (10) with the lower layer (20).

6. The method according to claim 5, wherein The upper layer (10) further comprises an adhesive layer (13) and a release paper layer (14), the adhesive layer (13) is located on the side of the upper electrode layer (12) away from the upper substrate (11), and the release paper layer (14) is placed on the other side of the adhesive layer (13), and the cold light sheet structure manufacturing method further comprises: S22: disposing the adhesive layer (13) on the upper electrode layer (12); S23: laminating the release paper layer (14) on the adhesive layer (13); S22 and S23 are located between S21 and S30, and S30 is: cutting the upper layer (10), laminating the adhesive layer (13) on the protective layer (24) after tearing off the release paper layer (14), or cutting the upper layer (10) and the lower layer (20) together after tearing off the release paper layer (14) and laminating the adhesive layer (13) on the protective layer (24).

7. The method according to claim 5, wherein The upper electrode layer (12) is processed on the upper substrate (11) by any one of screen printing, inkjet printing, coating, dispensing and magnetron sputtering process.

Images