A PCB board heating orthopedic buffer machine and orthopedic method

Abstract

The present invention discloses a PCB board heating and correction buffer machine and correction method, comprising a machine body, a working chamber provided inside the machine body, an inlet and an outlet provided on both sides of the machine body for feeding and removing PCB boards, the working chamber being divided into an upper temperature zone and a lower temperature zone for heating the PCB boards; and a hot air blower installed on the top of the machine body for supplying hot air into the machine body. The beneficial effects of the present invention are as follows: the hot air generated by the hot air blower is guided by an air guide plate so that the hot air is evenly distributed in the upper temperature zone and the lower temperature zone. The PCB boards coming out of the reflow furnace enter the working chamber through the inlet, and are gradually entered into the buffer mechanism for buffering under the action of a driving mechanism. Then, the hot air generated by the hot air blower heats the PCB boards, causing them to be in a rubbery state with strong plasticity. At this time, the PCB boards are pressed and corrected by a correction mechanism, thereby achieving the effect of completing the correction of the PCB boards during the buffering process.

Description

Technical Field

[0001] The present invention relates to the field of display screens, in particular to a PCB board heating orthopedic buffer machine and a orthopedic method. Background Art

[0002] With the continuous advancement of science and technology and the iteration of display screen production technology, the thickness of PCB boards is constantly decreasing to meet the development needs of high-quality display screens. When a PCB board with a thickness of 1.2 is heated in a reflow oven, the thinning of the PCB board makes the IC side (i.e., the side where components are mounted) more prone to irregular deformation such as PCB bending after printing and placement. This reduces the contact area between the clamping blocks on the PCB clamping fixture and the PCB board, making it impossible for the fixture to clamp the PCB board. Such PCB boards are prone to jitter and other phenomena during the subsequent placement process, leading to placement confusion, jump board and other abnormal situations. Existing solutions mostly rely on manual correction after the AOI inspection system comes out or through visual observation. However, manual correction force is difficult to control, the correction quality cannot be guaranteed, and it is time-consuming and labor-intensive, seriously affecting production efficiency and product quality. To address this problem, we provide a PCB board heating correction buffer machine and correction method to solve the above problems. Summary of the Invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a PCB board heating correction buffer machine and correction method.

[0004] The purpose of the present invention is achieved through the following technical solutions:

[0005] A PCB board heating and correction buffer machine comprises a machine body, a working chamber provided inside the machine body, a material inlet and a material outlet provided on both sides of the machine body for feeding and removing PCB boards, the working chamber being divided into an upper temperature zone and a lower temperature zone for heating the PCB boards; a hot air blower for supplying hot air into the machine body is mounted on the top of the machine body, and an air guide plate for diverting the hot air generated by the hot air blower is fixedly mounted on the upper end of the upper temperature zone; a buffer mechanism for buffering PCB boards and a drive mechanism for moving the buffer mechanism up and down are provided in the working chamber, and a correction mechanism for correcting the PCB boards is mounted on the buffer mechanism.

[0006] A further technical solution is that the driving mechanism includes a first mounting plate fixedly mounted on a fixed frame, a first driving motor is mounted on the first mounting plate, a first screw rod is mounted on the power output end of the first driving motor, and a guide column is fixedly mounted on the bottom surface of the first mounting plate.

[0007] A further technical solution is that the cache mechanism includes a second mounting plate fixedly connected to a slider mounted on the guide column, the second mounting plate is threadedly connected to the first screw rod, the bottom of the second mounting plate is fixedly connected to a mounting frame, and two cache plates are fixedly connected to the mounting frame, and the sides of the two cache plates close to each other are respectively fixedly installed with multiple isolation supporting bars, and the ends of the sides close to each other are rotatably connected to a rotating wheel adapted to the number of isolation supporting bars, and the ends of the sides of the two cache plates facing away from each other are both rotatably connected to a first driven gear fixed to the rotating wheel.

[0008] A further technical solution is that the sides of the two cache plates facing away from each other are also equipped with a driving mechanism that can drive each first driven gear, and the driving mechanism includes a second driving motor fixedly mounted on a mounting plate connected to the cache plate, a second screw rod fixedly mounted on the power output end of the second driving motor, a second guide rail fixedly mounted on the side of the cache plate, a second slide rail slidably connected to the second guide rail, the second slide rail is threadedly connected to the second screw rod, a third mounting plate fixedly connected to the second slide rail, a driving cylinder fixedly connected to the side of the third mounting plate, a connecting plate fixedly connected to the side of the connecting plate, a fifth mounting plate fixedly connected to the side of the connecting plate, the first guide rail fixedly mounted on the upper surface of the fifth mounting plate, a first slider adapted to the first guide rail fixedly connected to the bottom surface of the third mounting plate, a third driving motor fixedly mounted on the side of the fifth mounting plate, and a driving gear adapted to the first driven gear fixedly mounted on the power output end of the third driving motor.

[0009] A further technical solution is that one of the sides of one of the cache plates facing away from each other is also provided with a spacing adjustment mechanism, and the spacing adjustment mechanism includes a fourth drive motor fixedly mounted on the bottom of the side of the cache plate, and a driving pulley is installed at the power output end of the fourth drive motor, and four evenly distributed driven pulleys are rotatably connected to the side of the cache plate, and a third screw rod adapted to the four driven pulleys is rotatably connected between the two cache plates, and a belt is provided for transmission between the four driven pulleys and the driving pulley.

[0010] A further technical solution is that the correction mechanism includes a first rotating shaft rotatably connected to the side surfaces of the two cache plates, the side ends of the first rotating shaft close to each other are fixedly connected to a first cam, the two ends of the first rotating shaft are fixedly connected to a connecting block, and the connecting block is located above the isolation receiving bar or between two adjacent isolation receiving bars, and multiple groups of second rotating shafts are rotatably connected between the two cache plates, and each group of second rotating shafts is located below the isolation receiving bar or between two adjacent isolation receiving bars, and at least two second cams symmetrically arranged with each other are fixedly connected to the second rotating shaft; the end of each connecting block is rotatably connected to a transmission plate, and each transmission plate is provided with a through groove on a side facing away from the cache plate, and both ends of each second rotating shaft are fixedly connected to a fourth mounting plate, and each fourth mounting plate is fixedly connected to a transmission rod adapted to the through groove close to the side of the cache plate, and one end of each group of second rotating shafts is fixedly installed with a transmission gear.

[0011] A further technical solution is that two mutually symmetrical fixing plates are fixedly mounted on the frame in the upper temperature zone, and are detachably connected to the air guide plates located on the two fixing plates.

[0012] A further technical solution is that the apex of the rotating wheel and the upper surface of the isolation receiving strip are in the same plane.

[0013] A further technical solution is that the cross section of the air guide plate is triangular and the inclination angle is between 30° and 60°. The present invention also discloses a PCB board correction method, comprising a PCB board heating correction buffer machine as described in any one of the above, the method is as follows:

[0014] S1: The PCB board is transported from the feed port to the isolation receiving bar through the material driving mechanism.

[0015] S2: The PCB is buffered on the isolation strip for 180s to 230s until the PCB temperature reaches the correction temperature of 120℃ to 150℃;

[0016] S3: Start the correction mechanism to press the PCB board on the isolation support bar for 15s to 18s;

[0017] S4: After the PCB board on the isolation receiving bar is shaped, it is transported out from the discharge port through the linkage of the material feeding mechanism and the driving mechanism.

[0018] The present invention has the following advantages:

[0019] 1. The present invention guides the hot air generated by the hot air blower through an air guide plate, so that the hot air is evenly distributed in the upper and lower temperature zones. The PCB boards coming out of the reflow furnace enter the working chamber through the inlet. Under the action of the driving mechanism, the PCB boards are gradually entered into the buffer mechanism for buffering. Then, the hot air generated by the hot air blower heats the PCB boards and puts them into a rubbery state with strong plasticity. At this time, the PCB boards are pressed and corrected by the correction mechanism, thereby achieving the effect of completing the PCB board correction during the buffering process, solving the problems of low efficiency and low correction quality of traditional manual correction.

[0020] 2. The present invention, through the combined action of the material driving mechanism and the driving mechanism, can continuously allow PCB boards from the reflow furnace to enter the cache mechanism for caching. The PCB boards are supported by the isolation receiving strips, so that the PCB boards are placed on the isolation receiving strips to achieve a temporary caching effect. In addition, the distance between the two second mounting plates can be adjusted by the spacing adjustment mechanism, so that caching correction can be performed for PCB boards of different widths, thereby improving the practicality of the cache machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a front view structural diagram of the heating orthopedic buffer machine of the present invention;

[0022] Figure 2 This is a rear structural schematic diagram of the heating orthopedic buffer machine of the present invention;

[0023] Figure 3 This is a schematic diagram of the internal structure of the heating orthopedic buffer machine of the present invention;

[0024] Figure 4 Schematic diagram of the structure of the driving mechanism and the buffer mechanism of the present invention;

[0025] Figure 5 Schematic diagram of the spacing adjustment mechanism structure of the present invention;

[0026] Figure 6 Schematic diagram of the material driving mechanism structure of the present invention;

[0027] Figure 7 It is a structural schematic diagram of the correction mechanism of the present invention;

[0028] Figure 8 For the present invention Figure 7 Enlarged schematic diagram of point A in the middle.

[0029] In the figure, 1. machine body; 2. feeding port; 3. working room; 31. upper temperature zone; 32. lower temperature zone; 4. hot air blower; 5. feeding port; 6. air guide plate; 7. driving mechanism; 71. first driving motor; 72. first mounting plate; 73. guide column; 74. first screw rod; 81. buffer mechanism; 811. second mounting plate; 812. buffer plate; 813. isolation receiving bar; 814. rotating wheel; 815. first driven gear; 82. driving mechanism; 821. second driving motor; 822. second screw rod; 823. fifth mounting plate; 824. first guide rail; 825. first slider; 826. third mounting plate Mounting plate; 827, connecting plate; 828, third drive motor; 829, driving cylinder; 8210, driving gear; 8211, second slide rail; 8212, second guide rail; 83, spacing adjustment mechanism; 831, fourth drive motor; 832, driving pulley; 833, belt; 834, driven pulley; 835, third screw rod; 84, correction mechanism; 841, first rotating shaft; 842, connecting block; 843, transmission plate; 844, through groove; 845, fourth mounting plate; 846, transmission gear; 847, first cam; 848, second cam; 849, second rotating shaft; 8410, transmission rod. DETAILED DESCRIPTION

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0032] After exiting the reflow oven, conventional PCBs typically cool to 60-70°C at room temperature. At this temperature, the PCB's shape is essentially fixed, making it difficult to correct with external force. At temperatures between 115°C and 130°C, the PCB still exhibits a highly plastic, rubbery state, preferably at 120°C. Therefore, correction requires raising the PCB's temperature to approximately 120°C, followed by shaping and correction with external force. After correction, the PCB is cooled to room temperature, returning to a glassy state, to achieve the desired correction effect.

[0033] The existing method of heating PCB boards from glass state to rubber state generally involves adding a heating mechanism between the reflow oven and the AOI machine or closing the cooling zone in the reflow oven. However, there are the following problems:

[0034] Modify the reflow oven: Turn off the fan in the cooling zone at the rear of the reflow oven, add a heating rod for continuous heating, and further increase the temperature when the product comes out of the oven. However, this solution may cause fire due to excessive temperature, which poses a safety hazard. In addition, this solution requires modifying the existing reflow oven equipment, which is costly.

[0035] Adding heating equipment: Adding heating equipment at the exit of the reflow oven to heat the PCB board to ensure that the PCB board temperature is above 120°C, which meets the temperature required for correction. However, due to production line space constraints, the distance between the reflow oven and the AOI machine is only 50 cm. This distance makes it difficult to heat the normal reflow oven temperature (PCB board exit temperature is 60°C to 70°C) to 120°C to 130°C. Therefore, conventional heating mechanisms cannot be used;

[0036] Moreover, in actual production, PCB boards need to be transported and carried between various devices. Due to the difference in processing time between devices, a buffer mechanism is required to temporarily buffer the PCB boards.

[0037] Therefore, adding a heating mechanism between the reflow oven and the AOI machine or modifying the reflow oven will increase the length of the production line, which is costly, has low operability, is difficult to achieve, and is inconvenient to implement.

[0038] The temperature of the PCB board was tested without modifying the reflow oven: the indoor ambient temperature was 24.6°C. After the PCB board naturally cooled down in the reflow oven, the temperature out of the oven dropped from 150°C to 98°C~105°C. In the indoor environment, the temperature dropped to 95°C~100°C after 5 seconds, 90°C~96°C after 10 seconds, 90°C~95°C after 15 seconds, and 88°C~93°C after 20 seconds.

[0039] The above tests show that without changing the reflow oven structure, the maximum temperature of the PCB board after passing through the reflow oven can only reach 105°C, which cannot meet the required correction temperature. The temperature drops by 10°C to 12°C after 20 seconds at room temperature. Therefore, this method is not feasible.

[0040] like Figure 1—8 shows an embodiment of a PCB board heating and correction buffer machine, comprising a body 1, an interior of the body 1 being provided with a working room 3, with an inlet 2 and an outlet 5 respectively provided on both sides of the body 1 for feeding and removing PCB boards, the working room 3 being used to heat the incoming PCB boards, and the working room 3 being divided into an upper temperature zone 31 and a lower temperature zone 32; a hot air blower 4 being installed on the top of the body 1 for supplying hot air to the interior of the body 1, an air guide plate 6 being fixedly installed on the upper end of the upper temperature zone 31 for diverting the hot air generated by the hot air blower 4, two symmetrically arranged fixed plates being fixedly installed on the skeleton in the upper temperature zone 31, and the air guide plate 6 being detachably connected to the two fixed plates; a buffer mechanism 81 for buffering PCB boards, and a driving mechanism 7 for driving the buffer mechanism 81 to move up and down are provided in the working room 3, and a correction mechanism 84 for correcting the PCB boards is installed on the buffer mechanism 81;

[0041] The cross section of the air guide plate 6 is triangular, and the inclination angle is between 30° and 60°, preferably, the inclination angle is 45°.

[0042] Through the above implementation data and the comparison of various solutions, it can be seen that; since the temperature of the PCB board after coming out of the reflow oven will gradually decrease during the transportation process, it cannot reach the temperature at which the plasticity can be corrected. In order to make the PCB board closer to the temperature at which the plasticity is stronger and improve the correction effect, it is necessary to reheat the PCB board to increase the temperature of the PCB board. Therefore, the cache machine of the present invention is used, and the PCB board enters the interior of the machine body 1 through the feed port 2. Under the combined action of the drive mechanism 7 and the cache mechanism 81, the PCB board enters the cache mechanism 81 for caching. During the caching process, the hot air from the hot air blower 4 is guided by the air guide plate 6 into the interior of the working room 3, thereby raising the temperature of the working room 3 to a temperature at which the PCB board can be heated to a rubbery state with strong plasticity.

[0043] Since the lower temperature zone 32 is located below the upper temperature zone 31, a certain amount of heat will be dissipated when the hot air is directed to the lower temperature zone 32, causing the temperature of the lower temperature zone 32 to be slightly lower than that of the upper temperature zone 31. However, during the process of caching the PCB boards and the process of rotating the PCB boards out, the driving mechanism 7 drives the caching mechanism 81 equipped with the PCB boards to gradually move toward the upper temperature zone 31. During this movement, the PCB boards are heated to a temperature that is a rubber state with strong plasticity. The caching action can also be completed during the moving and heating process. Both the upper temperature zone 31 and the lower temperature zone 32 can bring the PCB boards to a temperature that is a rubber state, that is, both can reach 120°C to 150°C.

[0044] The cross section of the air guide plate 6 is triangular, and its angle can be adjusted according to actual needs, so that air guide plates 6 with different angles can be used for different PCB boards. The selection of the angle is well known to those skilled in the art or can be obtained based on a limited number of experiments.

[0045] The driving mechanism 7 includes a first mounting plate 72 fixedly mounted on a fixed frame, a first driving motor 71 being mounted on the first mounting plate 72, a first screw rod 74 being mounted on the power output end of the first driving motor 71, a guide column 73 being fixedly mounted on the bottom surface of the first mounting plate 72, the guide column 73 being slidingly connected to the cache mechanism 81, and the first screw rod 74 being threadedly connected to the cache mechanism 81; by starting the first driving motor 71, the first screw rod 74 is driven to rotate, and since the first screw rod 74 is threadedly connected to the cache mechanism 81, the cache mechanism 81 can be driven to move up and down, and under the action of the guide column 73, the up and down movement of the cache mechanism 81 is more stable.

[0046] The cache mechanism 81 includes a second mounting plate 811 fixedly connected to a slider installed on the guide column 73, the second mounting plate 811 is threadedly connected to the first screw rod 74, the bottom of the second mounting plate 811 is fixedly connected to a mounting frame, and two cache plates 812 are fixedly connected to the mounting frame, and the sides of the two cache plates 812 close to each other are respectively fixedly installed with a plurality of isolation receiving bars 813, and the ends of the sides close to each other are rotatably connected to a rotating wheel 814 adapted to the number of isolation receiving bars 813, and the ends of the sides of the two cache plates 812 facing away from each other are rotatably connected to a first driven gear 815 fixed to the rotating wheel 814; the PCB board coming out of the reflow oven enters the isolation receiving bar 813 for caching, and the cache mechanism 81 is moved up and down under the action of the driving mechanism 7, so that different PCB boards enter the isolation receiving bars 813 at different positions in turn, thereby achieving the effect of caching multiple PCB boards.

[0047] The sides of the two buffer plates 812 facing away from each other are also equipped with a driving mechanism 82 that can drive each first driven gear 815. The driving mechanism 82 includes a second driving motor 821 fixedly mounted on a mounting plate connected to the buffer plate 812, a second screw rod 822 fixedly mounted on the power output end of the second driving motor 821, a second guide rail 8212 fixedly mounted on the side of the buffer plate 812, a second slide rail 8211 slidably connected to the second guide rail 8212, the second slide rail 8211 is threadedly connected to the second screw rod 822, a third mounting plate 826 fixedly connected to the second slide rail 8211, and a driving cylinder 82 fixedly connected to the side of the third mounting plate 826. 9. The power output end of the driving cylinder 829 is fixedly connected to a connecting plate 827, and a fifth mounting plate 823 is fixedly connected to the side of the connecting plate 827. A first guide rail 824 is fixedly mounted on the upper surface of the fifth mounting plate 823. A first slider 825 adapted to the first guide rail 824 is fixedly connected to the bottom surface of the third mounting plate 826. A third driving motor 828 is fixedly mounted on the side of the fifth mounting plate 823. A driving gear 8210 adapted to the first driven gear 815 is fixedly mounted on the power output end of the third driving motor 828. The vertex of the rotating wheel 814 is in the same plane as the upper surface of the isolation receiving bar 813, which facilitates the entry of the PCB board onto the isolation receiving bar 813.

[0048] When the PCB board is to enter a different isolation receiving strip 813, not only the driving mechanism 7 is required to drive the cache mechanism 81 to move up and down, but also the driving cylinder 829, the third driving motor 828 and the second driving motor 821 are required to be started. When it is necessary to replace the isolation receiving strip 813 of the PCB board, the driving cylinder 829 is first started to drive the connecting plate 827 and the fifth mounting plate 823 to move. Since the first guide rail 824 fixedly mounted on the fifth mounting plate 823 and the first slider 825 fixedly mounted on the bottom surface of the third mounting plate 826 cooperate with each other, the fifth mounting plate 823 is more stable when moving. When the fifth mounting plate 823 drives the third driving motor 828 and the driving gear 8210 to move to another position to engage with the first driven gear 815, it is only necessary to start the second driving motor 821 to drive the third mounting plate 826 to move up and down through the second screw rod 822. After reaching the horizontal position of the first driven gear 815 adapted to it, the driving cylinder 829 is started again to drive the third driving motor 828 and the driving gear 8210 to return to the initial position. At this time, the driving gear 8210 and the adapted first driven gear 815 are engaged, and then the third driving motor 828 is started to drive the driving gear 8210 to rotate, thereby driving one of the first driven gears 815 to rotate. At this time, the rotating wheel 814 adapted to the first driven gear 815 also rotates, so that the PCB board on it is brought into another isolation receiving bar 813, thereby realizing the caching of the PCB board on different isolation receiving bars 813.

[0049] One of the sides of one of the cache plates 812 that are away from each other is also provided with a spacing adjustment mechanism 83, and the spacing adjustment mechanism 83 includes a fourth drive motor 831 fixedly mounted on the bottom of the side of the cache plate 812, and a driving pulley 832 is installed at the power output end of the fourth drive motor 831. Four evenly distributed driven pulleys 834 are rotatably connected to the side of the cache plate 812, and a third screw rod 835 adapted to the four driven pulleys 834 is rotatably connected between the two cache plates 812, and a belt 833 is provided for transmission between the four driven pulleys 834 and the driving pulley 832; due to the existing PCB board There are various specifications, and the widths of PCB boards of different specifications are different. Therefore, when PCB boards of different widths need to be processed, it is only necessary to start the fourth drive motor 831 to drive the belt 833 to rotate so that different driven pulleys 834 drive the third screw rod 835 to rotate, thereby adjusting the distance between the two cache plates 812, and performing cache correction on PCB boards of different sizes and widths, thereby improving the practicality of the heating orthopedic cache machine. The belt 833 is a synchronous belt. Compared with ordinary belts, the synchronous belt has the advantage of high precision, which is convenient for accurately adjusting the distance between the two cache plates 812.

[0050] The correction mechanism 84 includes a first rotating shaft 841 rotatably connected to the side of the two buffer plates 812, and the side ends of the first rotating shaft 841 close to each other are fixedly connected to the first cam 847. The two ends of the first rotating shaft 841 are fixedly connected to the connecting blocks 842, and the connecting blocks 842 are located above the isolation receiving bar 813 or between two adjacent isolation receiving bars 813. A plurality of groups of second rotating shafts 849 are rotatably connected between the two buffer plates 812, and each group of second rotating shafts 849 is located below the isolation receiving bar 813 or between two adjacent isolation receiving bars 813. At least two second rotating shafts 849 are fixedly connected to the second rotating shaft 849, which are symmetrically arranged. Cam 848; the end of each connecting block 842 is rotatably connected to a transmission plate 843, and a through slot 844 is provided on the side of each transmission plate 843 facing away from the buffer plate 812. Both ends of each second rotating shaft 849 are fixedly connected to a fourth mounting plate 845, and each fourth mounting plate 845 is fixedly connected to a transmission rod 8410 adapted to the through slot 844 on the side close to the buffer plate 812. A transmission gear 846 is fixedly installed at one end of each group of second rotating shafts 849; when the temperature of the PCB board on the isolation receiving bar 813 reaches a rubber state with strong plasticity, the lifting drive device connected to the correction mechanism 84 is started, and the lifting The power output end of the driving device is equipped with a gear that meshes with the transmission gear 846. The lifting driving device can move up and down and left and right. The lifting driving device is installed on one of the cache plates 812. It can be realized by technical personnel in the field. The working principle and the three-coordinate working principle can be the same. The lifting driving device can also realize the up and down and left and right movement of the structure of the driving mechanism 82. In this application, the structure of the driving mechanism 82 is preferably used to realize this function. When correction is required, the lifting driving device drives the transmission gear 846 and the second rotating shaft 849 to rotate. The transmission gear 846 is driven by the fourth mounting plate 845 and the transmission rod 8410. The transmission plate 843 is moved, thereby driving the first rotating shaft 841 to rotate. After the first rotating shaft 841 rotates, the first cam 847 presses and corrects the PCB board on the isolation support bar 813. At this time, the second cam 848 also rotates due to the rotation of the second rotating shaft 849, supporting the PCB board above it. The PCB board is now located between the second cam 848 and the first cam 847. It is corrected after cooling and shaping for a certain period of time. When it is necessary to cache the PCB on other isolation support bars 813, it can be moved left and right and up and down and the above operation can be repeated to correct the PCB board.

[0051] The present invention further discloses a PCB board correction method, comprising the PCB board heating correction buffer machine described in any one of the above items, and the method is as follows:

[0052] S1: The PCB boards are transported from the feed port 2 to the isolation receiving strips 813 by the material driving mechanism 82. During the storage process, the material driving mechanism 82 and the driving mechanism 7 work together to transfer each PCB board to a different isolation receiving strip 813;

[0053] S2: The PCB board is buffered on the isolation support bar 813 for 180s to 230s, so that the temperature of the PCB board reaches the correction temperature of 120°C to 150°C. Preferably, the PCB board is buffered on the isolation support bar 813 for 180s, and the PCB board temperature is preferably 120°C.

[0054] S3: Start the correction mechanism 84 to press the PCB board on the isolation support bar 813 for 15 seconds to 18 seconds; the preferred correction time is 18 seconds;

[0055] S4: After the PCB board on the isolation receiving bar 813 is shaped, it is transported out from the discharge port 5 through the linkage of the material driving mechanism 82 and the driving mechanism 7.

[0056] The working process of the present invention is as follows: when the heating correction buffer machine is used, the hot air blower 4 is first started to blow hot air into the body 1, forming an upper temperature zone 31 and a lower temperature zone 32. The PCB board coming out of the reflow furnace enters the body 1 through the feed port 2. At this time, the driving mechanism 7 is started to drive the isolation receiving bar 813 in the buffer mechanism 81 to be flush with the PCB board. The PCB board is then driven by the driving mechanism 82 to enter the isolation receiving bar 813. Next, the driving mechanism 7 drives the buffer mechanism 81 to rise, moving the PCB board in the buffer mechanism 81 to the upper temperature zone for buffer correction, and then repeating the above operation.

[0057] At this time, the PCB board on the isolation receiving bar 813 is located in the upper temperature zone 31 and is heated. After a certain period of time, the lifting drive device drives the transmission gear 846 to rotate, thereby driving the first cam 847 and the second cam 848 to press and correct the PCB board. This operation is repeated according to the preset time to correct the PCB board. The above operation is repeated until a PCB board is placed on each isolation receiving bar 813.

[0058] Next, the driving mechanism 7 conveys the PCB board to the lower temperature zone 32. At this time, the PCB board in the buffer mechanism 81 has been corrected. The driving mechanism 82 located at the discharge port 5 again conveys the PCB board on the isolation receiving bar 813 through the discharge port 5 to the next process. After being conveyed out, the driving mechanism 82 located at the inlet 2 conveys the PCB board to the isolation receiving bar 813 for heating and correction. When a new PCB board enters the first layer of isolation receiving bar 813, the above operation is repeated, thereby realizing repeated feeding, heating, correction and other operations, and achieving the effect of heating and correcting the PCB board.

[0059] The heating time, correction time, and movement speed of each component in the above operation can be adaptively adjusted according to actual needs.

[0060] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A PCB board heating and orthopedic buffer machine, comprising a machine body (1), a working chamber (3) provided inside the machine body (1), and a feed port (2) and a discharge port (5) provided on both sides of the machine body (1) for feeding and removing PCB boards, characterized in that: The working room (3) is divided into an upper temperature zone (31) and a lower temperature zone (32) for heating the PCB board; a hot air blower (4) for supplying hot air to the interior of the body (1) is installed on the top of the body (1); a wind deflector (6) for diverting the hot air generated by the hot air blower (4) is fixedly installed on the upper end of the upper temperature zone (31); a buffer mechanism (81) for caching the PCB board and a driving mechanism (7) for driving the buffer mechanism (81) to move up and down are provided in the working room (3); a correction mechanism (84) for correcting the PCB board is installed on the buffer mechanism (81); The driving mechanism (7) comprises a first mounting plate (72) fixedly mounted on a fixed frame, a first driving motor (71) being mounted on the first mounting plate (72), a first screw rod (74) being mounted on a power output end of the first driving motor (71), and a guide column (73) being fixedly mounted on the bottom surface of the first mounting plate (72); The cache mechanism (81) includes a second mounting plate (811) fixedly connected to a slider mounted on the guide column (73), the second mounting plate (811) is threadedly connected to the first screw rod (74), the bottom of the second mounting plate (811) is fixedly connected to a mounting frame, and two cache plates (812) are fixedly connected to the mounting frame, and the sides of the two cache plates (812) close to each other are respectively fixedly installed with a plurality of isolation connecting bars (813), and the ends of the sides close to each other are rotatably connected to a rotating wheel (814) adapted to the number of the isolation connecting bars (813), and the ends of the sides of the two cache plates (812) facing away from each other are both rotatably connected to a first driven gear (815) fixed to the rotating wheel (814); The correction mechanism (84) includes a first rotating shaft (841) rotatably connected to the side surfaces of the two buffer plates (812), the side ends of the first rotating shaft (841) close to each other are fixedly connected to a first cam (847), the two ends of the first rotating shaft (841) are fixedly connected to connecting blocks (842), and the connecting blocks (842) are located above the isolation connecting bar (813) or between two adjacent isolation connecting bars (813), and multiple groups of second rotating shafts (849) are rotatably connected between the two buffer plates (812), and each group of second rotating shafts (849) is located below the isolation connecting bar (813) or between two adjacent isolation connecting bars (813). At least two second cams (848) symmetrically arranged with respect to each other are fixedly connected to the second rotating shaft (849); the end of each connecting block (842) is rotatably connected to a transmission plate (843); a through slot (844) is provided on a side of each transmission plate (843) facing away from the buffer plate (812); both ends of each second rotating shaft (849) are fixedly connected to a fourth mounting plate (845); a transmission rod (8410) adapted to the through slot (844) is fixedly connected to the side of each fourth mounting plate (845) close to the buffer plate (812); and a transmission gear (846) is fixedly installed on one end of each group of second rotating shafts (849); The apex of the rotating wheel (814) and the upper surface of the isolation receiving bar (813) are in the same plane; The cross section of the wind guide plate (6) is triangular, and the inclination angle is between 30° and 60°.

2. A PCB board heating orthopedic buffer machine according to claim 1, characterized in that: The two sides of the two buffer plates (812) facing away from each other are also equipped with a driving mechanism (82) that can drive each first driven gear (815), and the driving mechanism (82) includes a second driving motor (821) fixedly mounted on a mounting plate connected to the buffer plate (812), a second screw rod (822) fixedly mounted on the power output end of the second driving motor (821), a second guide rail (8212) fixedly mounted on the side of the buffer plate (812), a second slide rail (8211) slidably connected to the second guide rail (8212), the second slide rail (8211) is threadedly connected to the second screw rod (822), and a third mounting plate (8211) is fixedly connected to the second slide rail (8211). 6), a driving cylinder (829) is fixedly connected to the side of the third mounting plate (826), a connecting plate (827) is fixedly connected to the power output end of the driving cylinder (829), a fifth mounting plate (823) is fixedly connected to the side of the connecting plate (827), a first guide rail (824) is fixedly installed on the upper surface of the fifth mounting plate (823), a first slider (825) adapted to the first guide rail (824) is fixedly connected to the bottom surface of the third mounting plate (826), a third driving motor (828) is fixedly installed on the side of the fifth mounting plate (823), and a driving gear (8210) adapted to the first driven gear (815) is fixedly installed on the power output end of the third driving motor (828).

3. A PCB board heating orthopedic buffer machine according to claim 1, characterized in that: One of the sides of the cache plates (812) facing away from each other is also provided with a spacing adjustment mechanism (83), and the spacing adjustment mechanism (83) includes a fourth drive motor (831) fixedly mounted on the bottom of the side of the cache plate (812), a driving pulley (832) is mounted on the power output end of the fourth drive motor (831), and the side of the cache plate (812) is rotatably connected to four evenly distributed driven pulleys (834), and a third screw rod (835) adapted to the four driven pulleys (834) is rotatably connected between the two cache plates (812), and a belt (833) is provided for transmission between the four driven pulleys (834) and the driving pulley (832).

4. A PCB board heating orthopedic buffer machine according to claim 1, characterized in that: Two mutually symmetrically arranged fixing plates are fixedly mounted on the frame in the upper temperature zone (31) and are detachably connected to the air guide plates (6) located on the two fixing plates.

5. A PCB board correction method, comprising any one of the above-mentioned PCB board heating correction buffer machines, characterized in that: S1: The PCB board is transported from the feed port (2) to the isolation receiving bar (813) via the material driving mechanism (82); S2: The PCB board is buffered on the isolation receiving bar (813) for 180s to 230s so that the temperature of the PCB board reaches the correction temperature of 120°C to 150°C; S3: starting the correction mechanism (84) to correct and press the PCB board located on the isolation receiving bar (813) for 15s to 18s; S4: After the PCB board on the isolation receiving bar (813) is shaped, it is transported out from the discharge port (5) by the linkage of the material driving mechanism (82) and the driving mechanism (7).

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