A conveying system for a vertical furnace and a control method thereof

Abstract

The application discloses a conveying system for a vertical furnace and a control method thereof, and the system comprises a transfer platform, wafer conveying manipulators and wafer box conveying manipulators arranged on the two sides of the transfer platform respectively; the transfer platform comprises a platform base, a stand, a bottom plate and a base, the stand is arranged on the platform base, the bottom plate is arranged on the stand, and the base is arranged on the bottom plate; the wafer box conveying manipulator draws or inserts a wafer box into the base, so that the wafer box is conveyed on the transfer platform; the stand is provided with a first lifting assembly and a push rod assembly; the first lifting assembly is used for driving the push rod assembly to reciprocatingly lift and reach the position of the wafer box; and the push rod assembly is used for pushing the wafer into the wafer box from the horizontal direction, so as to complete wafer slicing. The application further discloses a control method based on the conveying system. The application has the advantages of simple structure, easy operation, stable transmission, high positioning precision and the like, meets the production demand of full automation of the vertical furnace, and improves the production efficiency of the vertical furnace.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor equipment technology, and specifically relates to a conveying system and its control method for a vertical furnace. Background Technology

[0002] The booming development of the information industry has greatly driven the development of the integrated circuit industry. Furnace tube equipment is used in processes such as oxidation, diffusion, and alloying in integrated circuit manufacturing, and is one of the most important pieces of equipment on the integrated circuit production line. Vertical furnace tube equipment enables fully automated transfer. Wafer cassettes carrying wafers enter from the equipment's inlet, and after a series of transfers, the wafers finally enter the reaction chamber. This involves cassette transfer and wafer transfer. Wafer cassette transfer is completed by a cassette transfer robot, and wafer transfer is completed by a wafer transfer robot. Therefore, a transfer system is needed to realize the transfer from cassette to wafer. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a conveying system and its control method for a vertical furnace that is simple in structure, easy to operate, has stable transmission and high positioning accuracy.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] A conveying system for a vertical furnace includes: a transfer platform, on both sides of which are respectively provided a wafer conveying robot for conveying wafers and a wafer cassette conveying robot for conveying wafer cassettes; the transfer platform includes a platform base, a column, a base plate, and a base, the column is provided on the platform base, the base plate is mounted on the column, and the base is mounted on the base plate; the wafer cassette conveying robot pulls the wafer cassette out or inserts it into the base to realize the conveying of the wafer cassette on the transfer platform; the side of the column is provided with a first lifting component and a pusher component, the first lifting component is used to drive the pusher component to reciprocate vertically to reach the position of the wafer cassette, and the pusher component is used to push the wafer horizontally into the wafer cassette to complete the wafer arrangement.

[0006] As a further improvement of the present invention, the push rod assembly includes a first driving assembly and a push rod for pushing the wafer. The first driving assembly is connected to a first lifting assembly, and the output end of the first driving assembly is connected to the push rod. Under the drive of the first lifting assembly, the push rod reciprocates in the vertical direction, and under the drive of the first driving assembly, the push rod reciprocates in the horizontal direction.

[0007] As a further improvement of the present invention, a second sensor is provided at the bottom of the base, the second sensor being used to detect the placement status of the tablet cartridge on the base.

[0008] As a further improvement of the present invention, the bottom of the base plate is provided with a buffer and a second driving component, the output end of the second driving component is connected to the buffer; when the second sensor detects that the cartridge has entered the base, the second driving component drives the buffer to push the cartridge into the preset position of the base, thereby realizing the secondary positioning of the cartridge in the base.

[0009] As a further improvement of the present invention, a first sensor is provided on the side of the base plate, the first sensor being used to detect the placement status of the wafer in the wafer cassette.

[0010] As a further improvement of the present invention, the wafer transfer robot includes: a mounting base, a rotating base, a rotating platform, and a moving platform; the end of the mounting base is connected to the rotating base, the rotating base is provided with a rotating platform, the rotating platform is provided with a moving platform, the moving platform is used to carry the wafer, and the rotating base drives the rotating platform to rotate, so as to realize the reciprocating movement of the wafer in the horizontal direction, so as to complete the picking and placing of the wafer at the preset station of the wafer cassette.

[0011] As a further improvement of the present invention, the mobile platform includes a first mobile platform and a second mobile platform. Both the first mobile platform and the second mobile platform are provided with ceramic fingers for receiving wafers. The first mobile platform is used to carry a single wafer, and the second mobile platform is used to carry multiple wafers.

[0012] As a further improvement of the present invention, the wafer transfer robot further includes a third drive component and a fourth drive component. The output end of the third drive component is connected to the first moving platform, and the output end of the fourth drive component is connected to the second moving platform. The top of the rotating platform is provided with a first guide rail and a second guide rail. Driven by the third drive component, the first moving platform reciprocates along the first guide rail to realize the picking and placing of a single wafer. Driven by the fourth drive component, the second moving platform reciprocates along the second guide rail to realize the picking and placing of multiple wafers.

[0013] As a further improvement of the present invention, the mobile platform is provided with a third sensor and a fourth sensor. The third sensor is used to detect whether there is a wafer on the mobile platform and the overflow of the wafer in the forward direction on the mobile platform. The fourth sensor is used to detect the overflow of the wafer in the backward direction on the mobile platform.

[0014] As a general technical concept, the present invention also discloses a control method based on the above-mentioned transmission system, comprising the following steps:

[0015] S1. The chip box conveying robot places the chip box on the base of the transfer platform, realizing the first positioning of the chip box within the base;

[0016] S2. After the second sensor detects that the chip box has entered the base, it sends a positioning signal. The second drive component drives the buffer to push the chip box into the preset position of the base, realizing the second positioning of the chip box in the base.

[0017] S3. The first sensor detects whether there is a wafer overflow in the wafer cassette;

[0018] S4. If no wafer overflows from the wafer cassette, the first lifting component drives the first driving component and the push rod to move vertically up and down to reach the position where the wafer is located. The first driving component drives the push rod to move horizontally to push the wafer to the preset position in the wafer cassette, thereby realizing wafer ordering.

[0019] S5. After the wafer sorting is completed, the first drive component drives the push rod to return to the origin, the first lifting component drives the first drive component and the push rod to descend to the origin, and the wafer transfer robot grabs the wafer on the transfer platform.

[0020] S6. When picking up the wafer, the wafer transfer robot rises to the first preset height, the rotating platform rotates to the preset angle, and the moving platform moves the ceramic fingers to directly below the wafer to be picked up.

[0021] S7. The wafer transfer robot continues to rise to the second preset height, so that the ceramic fingers contact the wafer. The third sensor detects whether there is a wafer signal. If there is a wafer signal, the wafer transfer robot rises to the third preset height to complete the lifting action of the ceramic fingers on the wafer.

[0022] S8. The mobile platform returns to its origin, the rotating platform rotates to the preset wafer placement station, the mobile platform transports the wafer to the top of the wafer placement station, and the wafer transport robot descends to complete the wafer placement.

[0023] Compared with the prior art, the advantages of the present invention are as follows:

[0024] 1. This invention relates to a conveying system for a vertical furnace. A simple and mechanically strong transfer platform is formed by a platform base, columns, a base plate, and a subfloor. Wafer cassette transfer robots and wafer transfer robots are respectively installed on both sides of the transfer platform. This transfer platform serves as an interactive platform for wafer cassette-to-wafer transfer. The wafer cassette transfer robot picks up and places wafer cassettes on this platform, and the wafer transfer robot picks up and places wafers on this platform, completing the transfer from wafer cassette to wafer and achieving fully automated transfer for the vertical furnace. Furthermore, by installing a lifting assembly and a pusher assembly on the side of the transfer platform, and using the lifting assembly to drive the pusher assembly to the position of the wafer cassette, the pusher assembly then pushes the wafer into a preset station within the wafer cassette along a horizontal direction. This significantly improves the positioning accuracy of the wafer within the wafer cassette, reduces the wafer breakage rate during transfer, and increases the production efficiency of the vertical furnace equipment.

[0025] 2. The present invention relates to a conveying system for a vertical furnace. By setting a second sensor at the bottom of the base, the system monitors the placement status of the wafer cassette on the base in real time and associates the status information of the wafer cassette with a buffer and a second drive assembly set at the bottom of the base plate. When the second sensor detects that the wafer cassette has entered the base, the second drive assembly drives the buffer to push the wafer cassette into a preset position on the base. This achieves secondary positioning of the wafer cassette within the base, improves the repeatability of the wafer cassette positioning, increases the safety and reliability of wafer cassette conveying, and realizes high-precision wafer and wafer cassette transfer, which well meets the usage requirements of the vertical furnace.

[0026] 3. The present invention relates to a conveying system for a vertical furnace. By simultaneously setting a first moving platform for carrying a single wafer and a second moving platform for carrying multiple wafers on the moving platform of the wafer conveying robot, the simultaneous conveying of single wafers and multiple wafers is achieved. Furthermore, by setting sensors on the moving platforms, the working status of the moving platforms is accurately monitored, and the forward and backward directions of the wafers on the moving platforms are also accurately monitored, which significantly improves the accuracy and reliability of wafer conveying and greatly improves the automation level and production efficiency of the vertical furnace equipment.

[0027] 4. The control method of the conveying system for a vertical furnace of the present invention places the wafer cassette on the base of the transfer platform using a wafer cassette conveying robot, achieving the first positioning of the wafer cassette on the transfer platform. Then, through the cooperation of a second sensor, a second drive assembly, and a buffer, the wafer cassette is positioned a second time on the transfer platform, completing the high-precision transfer of the wafer cassette. Furthermore, the placement status of the wafers in the wafer cassette is detected by a first sensor, and the wafer arrangement within the wafer cassette is achieved through the cooperation of a first lifting assembly and a push rod assembly, completing the high-precision transfer of the wafers. Furthermore, during the wafer retrieval process by the wafer conveying robot, the presence of a wafer signal is detected by a third sensor, improving the reliability of wafer retrieval. Through the cooperation of a rotating base and a rotating platform, the moving platform is rotated to any wafer retrieval angle, achieving multi-angle wafer retrieval and improving the working efficiency of the vertical furnace equipment. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the three-dimensional structure of the conveying system for a vertical furnace according to the present invention.

[0029] Figure 2 This is a side view schematic diagram of the conveying system of the present invention used in a vertical furnace.

[0030] Figure 3 This is a schematic diagram illustrating the structural principle of the transfer platform in this invention.

[0031] Figure 4 This is a schematic diagram illustrating the installation principle of the chip box on the transfer platform in this invention.

[0032] Figure 5 This is a schematic diagram illustrating the structural principle of the wafer transfer robot in single-wafer transfer mode in this invention.

[0033] Figure 6 This is a schematic diagram illustrating the structural principle of the wafer transfer robot in the multi-wafer transfer mode of this invention.

[0034] Figure 7 This is a schematic diagram illustrating the structural principle of the wafer transfer robot in rotation mode in this invention.

[0035] Figure 8 This is a schematic diagram illustrating the installation structure of the wafer transfer robot in this invention.

[0036] Figure 9 This is a schematic diagram of the control flow of the transmission system in this invention.

[0037] Legend: 1. Transfer platform; 11. Platform base; 12. Column; 13. Base plate; 14. Base; 15. First sensor; 16. First lifting assembly; 161. Bracket; 17. Mounting plate; 18. First drive assembly; 19. Push rod; 110. Pressure rod; 111. Spring; 112. Second sensor; 113. Buffer; 114. Second drive assembly; 2. Wafer transfer robot; 21. Mounting base; 22. Rotating base; 23. Rotating platform; 231. First guide rail; 232. Second guide rail; 24. First moving platform; 25. Second moving platform; 26. Ceramic finger; 27. Third sensor; 28. Fourth sensor; 29. ​​Third drive assembly; 210. Fourth drive assembly; 211. Slider; 212. Second lifting assembly; 2121. Support column; 2122. Fifth drive assembly; 3. Wafer cassette transfer robot; 100. Wafer; 200. Wafer cassette. Detailed Implementation

[0038] The present invention will be further described below with reference to the accompanying drawings and specific preferred embodiments, but this does not limit the scope of protection of the present invention.

[0039] Example 1

[0040] like Figures 1 to 8As shown, the conveying system for a vertical furnace of the present invention includes: a transfer platform 1, with wafer conveying robots 2 for conveying wafers 100 and wafer cassette conveying robots 3 for conveying wafer cassettes 200 respectively provided on both sides of the transfer platform 1. The transfer platform 1 includes a platform base 11, columns 12, a base plate 13, and a base 14. Columns 12 are provided at the four vertices of the platform base 11, the base plate 13 is installed at the top and middle of the columns 12, and the base 14 is installed at the four vertices of the base plate 13. The wafer cassette conveying robots 3 pull out or insert the wafer cassettes 200 into the base 14 to realize the conveying of the wafer cassettes 200 on the transfer platform 1. A first lifting assembly 16 and a push rod assembly are provided on the side of the column 12. The first lifting assembly 16 is used to drive the push rod assembly to reciprocate vertically to reach the position of the wafer cassettes 200. The push rod assembly is used to push the wafers 100 into the wafer cassettes 200 from the horizontal direction to complete the wafer 100 wafer handling. In this embodiment, the conventional structure of the cassette conveying robot 3 is used, and will not be described in detail here.

[0041] like Figure 3 As shown, in this embodiment, the first lifting assembly 16 is mounted on the side of the column 12 of the transfer platform 1 via a mounting plate 17. The first lifting assembly 16 consists of a drive assembly (not shown in the figure) and a bracket 161 with a sliding groove. The output end of the drive assembly is connected to the push rod assembly. Under the drive of the drive assembly, the push rod assembly reciprocates up and down along the sliding groove of the bracket 161. The drive assembly can be in the form of a servo motor, a cylinder, or a hydraulic cylinder. The push rod assembly and the output end of the drive assembly can be connected by gear meshing, a lead screw, or a cable, as long as it can drive the push rod assembly to reciprocate up and down smoothly along the bracket 161.

[0042] In this embodiment, a simple and mechanically strong transfer platform 1 is formed by the platform base 11, column 12, base plate 13, and base 14. A wafer cassette transfer robot 3 and a wafer transfer robot 2 are respectively installed on both sides of the transfer platform 1. This transfer platform 1 is an interactive platform for wafer cassette-to-wafer transfer. The wafer cassette transfer robot 3 picks up and places wafer cassettes on this platform, and the wafer transfer robot 2 picks up and places wafers on this platform, completing the transfer from wafer cassette to wafer and realizing fully automated transfer of the vertical furnace. Furthermore, by installing a lifting assembly 16 and a pusher assembly on the side of the transfer platform 1, and using the lifting assembly 16 to drive the pusher assembly to the position of the wafer cassette 200, the pusher assembly then pushes the wafer 100 into the preset station in the wafer cassette 200 along the horizontal direction. This significantly improves the positioning accuracy of the wafer 100 in the wafer cassette 200, reduces the breakage rate of the wafer 100 during transfer, and improves the production efficiency of the vertical furnace equipment.

[0043] like Figure 3As shown, in this embodiment, the push rod assembly includes a first drive assembly 18 and a push rod 19 for pushing the wafer 100. The first drive assembly 18 is connected to the first lifting assembly 16, and the output end of the first drive assembly 18 is connected to the push rod 19. Under the drive of the first lifting assembly 16, the push rod 19 reciprocates vertically, and under the drive of the first drive assembly 18, the push rod 19 reciprocates horizontally. In this embodiment, the first drive assembly 18 can be in the form of a servo motor, a cylinder, or a hydraulic cylinder, as long as it can push the push rod 19 to move smoothly horizontally.

[0044] like Figure 4 As shown, in this embodiment, a pressure rod 110 is provided at the bottom of the base 14, a spring 111 is provided at the bottom of the pressure rod 110, and a second sensor 112 is provided at the bottom of the spring 111. The second sensor 112 is used to detect the placement status of the film cassette 200 on the base 14. Specifically, when the film cassette 200 is placed on the base 14, the film cassette 200 presses down the pressure rod 110, compresses the spring 111, and the second sensor 112 sends an electrical signal indicating that the film cassette 200 is in place; when there is no film cassette 200 on the base 14, the spring 111 pushes up the pressure rod 110, and the second sensor 112 does not send a detection signal.

[0045] Furthermore, a buffer 113 and a second drive assembly 114 are provided at the bottom of the base plate 13, and the output end of the second drive assembly 114 is connected to the buffer 113. When the second sensor 112 detects that the cartridge 200 has entered the base 14, the second drive assembly 114 drives the buffer 113 to push the cartridge 200 into a preset position in the base 14, thereby achieving secondary positioning of the cartridge 200 within the base 14. The second drive assembly 114 can be in the form of a servo motor, a cylinder, or a hydraulic cylinder, as long as it can drive the buffer 113 to push the cartridge 200 into the preset position within the base 14.

[0046] In this embodiment, by setting a second sensor 112 at the bottom of the base 14, the placement status of the wafer cassette 200 on the base 14 is monitored in real time, and the status information of the wafer cassette 200 is associated with the buffer 113 and the second drive component 114 set at the bottom of the base plate 13. When the second sensor detects that the wafer cassette has entered the base, the second drive component 114 drives the buffer 13 to push the wafer cassette 200 into the preset position of the base 14, thereby realizing the secondary positioning of the wafer cassette 200 in the base 14, improving the repeatability accuracy of the wafer cassette 200, increasing the safety and reliability of the wafer cassette 200 transfer, and realizing high-precision wafer and wafer cassette transfer, which well meets the usage requirements of the vertical furnace.

[0047] like Figure 3As shown, in this embodiment, a first sensor 15 is provided at the center of the side of the base plate 13. The first sensor 15 is used to detect the placement status of the wafer 100 in the wafer cassette 200. After the buffer 113 and the second drive assembly 114 have completed their operation, the first sensor 15 is used to detect whether there is any wafer 100 overflowing in the wafer cassette 200, so as to avoid excessive wafer 100 overflow causing the push rod 19 to damage the wafer 100 during the wafer sorting process.

[0048] like Figures 5 to 8 As shown, in this embodiment, to improve the working efficiency of the wafer transfer robot 2, the wafer transfer robot 2 is mounted on the second lifting assembly 212. The wafer transfer robot 2 includes: a mounting base 21, a rotating base 22, a rotating platform 23, and a moving platform. One end of the mounting base 21 is connected to the second lifting assembly 212, and the other end of the mounting base 21 is connected to the rotating base 22. The rotating platform 23 is equipped with a moving platform, which is used to carry the wafer 100. A rotary motor inside the rotating base 22 drives the rotating platform 23 to rotate around the rotating base 22, so as to realize the reciprocating movement of the wafer 100 in the horizontal direction. Figure 7 As shown. Driven by the second lifting assembly 212, the mounting base 21 drives the rotating base 22 and the rotating platform 23 to reciprocate in the vertical direction, so as to realize the reciprocating movement of the wafer 100 in the vertical direction and complete the picking and placing of the wafer 100 at the preset station of the wafer cassette 200.

[0049] In this embodiment, by connecting the mounting base 21 to the second lifting assembly 212 and the rotating base 22 respectively, and setting a rotating platform 23 on the rotating base 22, and setting a moving platform on the rotating platform 23 for receiving the wafer 100, the mounting base 21 drives the rotating base 22 and the rotating platform 23 to move back and forth in the vertical direction under the drive of the second lifting assembly 212, thus realizing the movement of the wafer 100 in the vertical direction. Under the drive of the rotating base 22, the rotating platform 23 drives the moving platform to rotate in the horizontal direction, thus realizing the movement of the wafer 100 in the horizontal direction. Finally, the precise placement and removal of the wafer 100 in the wafer cassette 200 is achieved. It has the advantages of simple structure, stable transmission, and high precision in wafer placement and removal, which well meets the automated production requirements of vertical furnace equipment.

[0050] like Figure 8 As shown, in this embodiment, the second lifting component 212 includes a support column 2121 and a fifth drive component 2122. The output end of the fifth drive component 2122 is connected to the mounting base 21. Under the drive of the fifth drive component 2122, the mounting base 21 reciprocates up and down along the support column 2121.

[0051] Furthermore, the mounting base 21 includes a slider 211, and the inner side of the support column 2121 is provided with a sliding groove. The slider 211 is connected to the output end of the fifth drive component 2122. Under the drive of the fifth drive component 2122, the slider 211 reciprocates up and down along the sliding groove of the support column 2121. It can be understood that the fifth drive component 2122 can be in the form of a servo motor, a cylinder, or a hydraulic cylinder. The slider 211 and the output end of the fifth drive component 2122 can be connected by gear meshing, a lead screw, or a cable, as long as it can drive the mounting base 21 to smoothly reciprocate up and down along the column 1.

[0052] like Figure 6 As shown, in this embodiment, the mobile platform includes a first mobile platform 24 and a second mobile platform 25. The first mobile platform 24 is used to carry a single wafer, and the second mobile platform 25 is used to carry multiple wafers. In this embodiment, the second mobile platform 25 can carry four wafers at a time.

[0053] like Figure 5 As shown, in this embodiment, both the first moving platform 24 and the second moving platform 25 are equipped with ceramic fingers 26, which are used to receive the wafer 100. The first moving platform 24 is equipped with a single ceramic finger 26, and the second moving platform 25 is equipped with four ceramic fingers 26. When the first moving platform 24 operates alone, it can realize the transfer of a single wafer; when the second moving platform 25 operates alone, it can realize the transfer of four wafers; when the first moving platform 24 and the second moving platform 25 operate simultaneously, they can realize the transfer of five wafers, which can maximize the high-efficiency operation of the vertical furnace equipment.

[0054] like Figure 6 As shown, in this embodiment, a third driving component 29 is also included. The output end of the third driving component 29 is connected to the first moving platform 24. The top of the rotating platform 23 is provided with a first guide rail 231 in the horizontal direction. Under the drive of the third driving component 29, the first moving platform 24 moves back and forth in the horizontal direction along the first guide rail 231 to realize the picking and placing of a single wafer 100.

[0055] Furthermore, in this embodiment, a fourth driving component 210 is also included. The output end of the fourth driving component 210 is connected to the second moving platform 25. The top of the rotating platform 23 is provided with a second guide rail 232 in the horizontal direction. Under the drive of the fourth driving component 210, the second moving platform 25 moves back and forth in the horizontal direction along the second guide rail 232 to realize the picking and placing of four wafers 100.

[0056] It is understood that in this embodiment, both the third drive component 29 and the fourth drive component 210 are servo motors. In other embodiments, the third drive component 29 and the fourth drive component 210 may also be in the form of cylinders or hydraulic cylinders, as long as they can drive the first moving platform 24 and the second moving platform 25 to move smoothly back and forth on the rotating platform 23.

[0057] like Figure 5 As shown, in this embodiment, a third sensor 27 is provided on the mobile platform. The third sensor 27 is used to detect whether there is a wafer 100 on the mobile platform and the overflow of the wafer 100 in the direction of movement on the mobile platform. Specifically, each ceramic finger 26 is provided with a third sensor 27 for detecting the wafer's position. By accurately controlling the position of the wafer 100, the efficiency of picking up and placing the wafer 100 can be improved.

[0058] Furthermore, a fourth sensor 29 is provided on the mobile platform. The fourth sensor 29 is used to detect the spillage of the wafer 100 in the backward direction on the mobile platform. Specifically, each ceramic finger 26 is provided with a fourth sensor 29 for detecting wafer spillage. When any wafer 100 is offset backward, a wafer offset signal is given.

[0059] In this embodiment, by simultaneously setting up a first moving platform 24 for carrying a single wafer and a second moving platform 25 for carrying multiple wafers on the moving platform, simultaneous transfer of single and multiple wafers is achieved. Furthermore, by installing sensors on the moving platform, the operating status of the platform is precisely monitored, as well as the forward and backward directions of the wafers on the platform are precisely monitored, significantly improving the accuracy and reliability of wafer transfer and greatly enhancing the automation level and production efficiency of the vertical furnace equipment.

[0060] Example 2

[0061] like Figure 9 As shown, the control method for the conveying system of a vertical furnace based on Embodiment 1 of the present invention includes the following steps:

[0062] S1. The cassette conveying robot 3 places the cassette 200 on the base 14 of the transfer platform 1. The cassette 200 presses down the pressure rod 110, realizing the first positioning of the cassette 200 in the base 14.

[0063] S2. After the second sensor 112 detects that the cartridge 200 has entered the base 14, it sends a positioning signal. The second drive assembly 114 drives the buffer 113 to push the cartridge 200 into the preset position of the base 14, thereby achieving the second positioning of the cartridge 200 in the base 14.

[0064] S3. The first sensor 15 detects whether there is any wafer 100 overflowing in the wafer cassette 200, so as to avoid excessive overflow of wafer 100 and damage to wafer 100 during the wafer sorting process by the push rod 19.

[0065] S4. If wafer 100 overflows from the wafer cassette 200, it is processed according to the conventional processing method; if wafer 100 does not overflow from the wafer cassette 200, the first lifting component 16 drives the first driving component 18 and the push rod 19 to move vertically up and down to reach the position where the wafer 100 is located. After the push rod 19 reaches the front of the wafer 100, the first driving component 18 drives the push rod 19 to move horizontally, pushing the wafer 100 to the preset position in the wafer cassette 200 to realize wafer 100 sorting.

[0066] S5. After the wafer sorting is completed, the first drive assembly 18 drives the push rod 19 to return to the origin in the horizontal direction, and the first lifting assembly 16 drives the first drive assembly 18 and the push rod 19 to descend to the origin in the vertical direction. The wafer transfer robot 2 then picks up the wafer 100 on the transfer platform 1.

[0067] S6. When picking up the wafer, the second lifting component 212 drives the mounting base 21 to rise to a preset height. For example, the ceramic finger 26 is 2mm lower than the height of the wafer 100 to be picked up. The rotating platform 23 rotates to a preset angle. For example, the line connecting the center of the ceramic finger 26 and the center of the wafer 100 to be picked up is parallel to the moving platform. The moving platform moves the ceramic finger 26 to directly below the wafer 100 to be picked up.

[0068] S7. The second lifting component 212 drives the mounting base 21 to rise 2mm, so that the ceramic finger 26 contacts the wafer 100. The third sensor 27 detects whether there is a wafer signal. If there is a wafer signal, the second lifting component 212 drives the mounting base 21 to rise 2mm again, completing the lifting action of the ceramic finger 26 on the wafer 100.

[0069] S8. The mobile platform returns to its origin, and the rotating base 22 drives the rotating platform 23 to rotate to the preset wafer placement position. After the rotating platform 23 rotates into place, the mobile platform transports the wafer 100 to a position 2mm above the wafer placement position. Then, the second lifting component 212 drives the mounting base 21 to descend by 4mm, completing the placement of the wafer 100.

[0070] In this embodiment, the wafer cassette 200 is placed on the base 14 of the transfer platform 1 by the wafer cassette transfer robot 3, achieving the first positioning of the wafer cassette 200 on the transfer platform 1. Then, through the cooperation between the second sensor 112, the second drive assembly 114, and the buffer 13, the wafer cassette 200 is positioned a second time on the transfer platform 1, completing the high-precision transfer of the wafer cassette. Furthermore, the first sensor 15 is used to detect the placement status of the wafer 100 in the wafer cassette 200, and the cooperation between the first lifting assembly 16 and the push rod assembly is used to arrange the wafer 100 in the wafer cassette 200, completing the high-precision transfer of the wafer. Furthermore, during the wafer retrieval process by the wafer transfer robot 2, the presence of a wafer signal is detected by the third sensor 27, improving the reliability of wafer retrieval. Through the cooperation of the rotating base 22 and the rotating platform 23, the moving platform is rotated to any wafer retrieval angle, realizing multi-angle wafer retrieval and improving the working efficiency of the vertical furnace equipment.

[0071] While the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the invention. Any person skilled in the art can make many possible variations and modifications to the technical solutions of the present invention, or modify them into equivalent embodiments, without departing from the spirit and technical essence of the invention. Therefore, any simple modifications, equivalent substitutions, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention, without departing from the content of the present invention, shall still fall within the scope of protection of the present invention.

Claims

1. A conveying system for a vertical furnace, characterized in that, The utility model relates to a wafer sorting and transferring device, which comprises: A transfer platform (1) is provided with a wafer transfer manipulator (2) and a cassette transfer manipulator (3) on both sides for conveying wafers (100) and cassettes (200) respectively; the transfer platform (1) comprises a platform base (11), a stand (12), a bottom plate (13) and a base (14), the stand (12) is arranged on the platform base (11), the bottom plate (13) is installed on the stand (12), and the base (14) is installed on the bottom plate (13); the cassette transfer manipulator (3) pulls out or inserts the cassette (200) into the base (14) to realize the conveying of the cassette (200) on the transfer platform (1); the stand (12) is provided with a first lifting assembly (16) and a push rod assembly on the side, the first lifting assembly (16) is used for driving the push rod assembly to reciprocatingly lift in the vertical direction to reach the position of the cassette (200), and the push rod assembly is used for pushing the wafer (100) into the cassette (200) from the horizontal direction to complete wafer (100) sorting; The wafer transfer manipulator (2) comprises a mounting base (21), a rotating base (22), a rotating platform (23) and a moving platform; the end of the mounting base (21) is connected with the rotating base (22), the rotating base (22) is provided with the rotating platform (23), the rotating platform (23) is provided with the moving platform, the moving platform is used for carrying the wafer (100), the rotating base (22) drives the rotating platform (23) to rotate, and is used for realizing the reciprocating movement of the wafer (100) in the horizontal direction to complete the taking and placing of the wafer (100) on the preset station of the cassette (200).

2. The conveying system for a vertical furnace according to claim 1, characterized in that, The push rod assembly comprises a first driving assembly (18) and a push rod (19) used for pushing the wafer (100); the first driving assembly (18) is connected with the first lifting assembly (16), and the output end of the first driving assembly (18) is connected with the push rod (19); under the driving of the first lifting assembly (16), the push rod (19) reciprocatingly moves along the vertical direction, and under the driving of the first driving assembly (18), the push rod (19) reciprocatingly moves along the horizontal direction.

3. The transfer system for a vertical furnace of claim 1, wherein, The bottom of the base (14) is provided with a second sensor (112), and the second sensor (112) is used for detecting the placement state of the cassette (200) on the base (14).

4. The conveying system for a vertical furnace according to claim 3, characterized in that, The bottom of the bottom plate (13) is provided with a buffer (113) and a second driving assembly (114), and the output end of the second driving assembly (114) is connected with the buffer (113); after the second sensor (112) detects that the cassette (200) enters the base (14), the second driving assembly (114) drives the buffer (113) to push the cassette (200) into the preset position of the base (14), so as to realize the secondary positioning of the cassette (200) in the base (14).

5. The transfer system for a vertical furnace of claim 1, wherein, The side of the bottom plate (13) is provided with a first sensor (15), and the first sensor (15) is used for detecting the placement state of the wafer (100) in the cassette (200).

6. The transfer system for a vertical furnace of claim 1, wherein, The mobile platform comprises a first mobile platform (24) and a second mobile platform (25), and ceramic fingers (26) for receiving wafers (100) are arranged on the first mobile platform (24) and the second mobile platform (25); the first mobile platform (24) is used for carrying single wafers, and the second mobile platform (25) is used for carrying multiple wafers.

7. The transfer system for a vertical furnace of claim 1, wherein, The wafer conveying manipulator (2) further comprises a third driving assembly (29) and a fourth driving assembly (210); the output end of the third driving assembly (29) is connected with the first mobile platform (24), and the output end of the fourth driving assembly (210) is connected with the second mobile platform (25); the rotating platform (23) is provided with a first guide rail (231) and a second guide rail (232) on the top; under the driving of the third driving assembly (29), the first mobile platform (24) reciprocates along the first guide rail (231) to realize the taking and placing of single wafers (100); under the driving of the fourth driving assembly (210), the second mobile platform (25) reciprocates along the second guide rail (232) to realize the taking and placing of multiple wafers (100).

8. The transfer system for a vertical furnace of claim 1, wherein, The third sensor (27) and the fourth sensor (28) are arranged on the mobile platform; the third sensor (27) is used for detecting whether there is a wafer (100) on the mobile platform and the overflow of the wafer (100) in the forward direction on the mobile platform; and the fourth sensor (28) is used for detecting the overflow of the wafer (100) in the backward direction on the mobile platform.

9. A control method for a transfer system of a vertical furnace according to any one of claims 1 to 8, characterized in that, The method comprises the following steps: S1, the cassette conveying manipulator (3) places the cassette (200) on the base (14) of the transfer platform (1), so as to realize the first positioning of the cassette (200) in the base (14); S2, the second sensor (112) sends a signal when detecting that the cassette (200) enters the base (14); the second driving assembly (114) drives the buffer (113) to push the cassette (200) to a preset position in the base (14), so as to realize the second positioning of the cassette (200) in the base (14); S3, the first sensor (15) detects whether there is wafer (100) overflow in the cassette (200); S4, if there is no wafer (100) overflow in the cassette (200), the first lifting assembly (16) drives the first driving assembly (18) and the push rod (19) to vertically ascend to the position of the wafer (100); the first driving assembly (18) drives the push rod (19) to horizontally move, so as to push the wafer (100) to a preset position in the cassette (200), and realize wafer sorting; S5, after the wafer sorting is completed, the first driving assembly (18) drives the push rod (19) to return to the original position, and the first lifting assembly (16) drives the first driving assembly (18) and the push rod (19) to descend to the original position; and the wafer conveying manipulator (2) grasps the wafer (100) on the transfer platform (1). S6, when taking the wafer, the wafer conveying manipulator (2) is lifted to a first preset height, the rotating platform (23) is rotated to a preset angle, and the moving platform moves the ceramic finger (26) to be directly below the wafer (100) to be grabbed; S7, the wafer conveying manipulator (2) continues to be lifted to a second preset height, so that the ceramic finger (26) is in contact with the wafer (100), the third sensor (27) detects whether there is a wafer (100) signal, if there is a wafer (100) signal, the wafer conveying manipulator (2) is further lifted to a third preset height, and the lifting action of the ceramic finger (26) on the wafer (100) is completed; S8, the moving platform is returned to the original position, the rotating platform (23) is rotated to a preset wafer placing station, the moving platform conveys the wafer (100) to be directly above the wafer placing station, and the wafer conveying manipulator (2) is lowered, so that the wafer (100) is placed.

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