Nickel sheet and flexible circuit board connection structure and manufacturing method thereof

Abstract

The application provides a manufacturing method of a connection structure of a nickel sheet and a flexible circuit board, comprising the following steps: providing a circuit substrate, wherein the circuit substrate comprises a first cover film and a copper layer arranged on the first cover film; forming at least one boss on the copper layer; forming a second cover film on the copper layer, wherein the second cover film is provided with a through hole, and the boss is arranged in the through hole, so as to obtain a flexible circuit board; providing a nickel sheet, wherein the nickel sheet is provided with a connecting hole; and connecting the nickel sheet and the flexible circuit board through tin paste, so that the nickel sheet is arranged in the through hole, and the boss is arranged in the connecting hole, thereby obtaining the connection structure. The application can improve the bonding force between the nickel sheet and the flexible circuit board. The application also provides a connection structure of a nickel sheet and a flexible circuit board manufactured by the method.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of circuit board, in particular to a connection structure of a nickel sheet and a flexible circuit board and a manufacturing method thereof. BACKGROUND

[0002] Under the premise of advocating global environmental protection today, the new energy automobile industry has become the development direction and goal of the future automobile industry. At present, due to the characteristics of high energy, high power and high energy density of the flexible circuit board (FPC), the power battery that provides power source for the new energy automobile usually uses FPC to replace the traditional wire harness design. At present, three devices of nickel sheet, temperature sensor (NTC) and connector are generally designed on the FPC to realize the function of collecting voltage and temperature. Among them, one end of the nickel sheet is usually connected with the FPC, and the other end is connected with the electrode of the battery plate to collect the electrode voltage signal.

[0003] However, due to the influence of vibration and other environments in the process of using the automobile, the bonding force between the nickel sheet and the FPC is weak. Therefore, at present, a layer of polyimide film (PI film) is usually pressed at the connection between the nickel sheet and the FPC to improve the bonding force between the nickel sheet and the FPC. However, this method has the following problems: it increases the production cost and has a low yield; part of the nickel sheet is a three-dimensional nickel sheet, which will deform after pressing; the NTC below the nickel sheet needs adhesive, and the adhesive is prone to crack after pressing, the resistance of the NTC is abnormal, thereby reducing the reliability of the NTC; the connector part will also deform after pressing. SUMMARY

[0004] Therefore, the present application provides a connection structure of a nickel sheet and a flexible circuit board which can improve the bonding force between the nickel sheet and the flexible circuit board.

[0005] An embodiment of the present application provides a manufacturing method of a connection structure of a nickel sheet and a flexible circuit board, comprising the following steps:

[0006] A circuit substrate is provided, which comprises a first cover film and a copper layer arranged on the first cover film;

[0007] At least one boss is formed on the copper layer;

[0008] A second cover film is formed on the copper layer, the second cover film is provided with a through hole, and the boss is located in the through hole, thereby obtaining a flexible circuit board;

[0009] A nickel sheet is provided, which is provided with a connecting hole; and

[0010] The nickel sheet and the flexible circuit board are connected by tin paste, the nickel sheet is located in the through hole, and the boss is located in the connecting hole, thereby obtaining the connection structure.

[0011] Another embodiment of the present application provides a manufacturing method of a connection structure of a nickel sheet and a flexible circuit board, comprising the following steps:

[0012] A circuit board is provided, which comprises a first cover film and a copper layer disposed on the first cover film;

[0013] At least one opening is formed in the copper layer;

[0014] A second cover film is formed on the copper layer, the second cover film is provided with a through hole, and the projection of the opening on the first cover film is located within the projection range of the through hole on the first cover film, thereby obtaining a flexible circuit board;

[0015] A nickel sheet is provided, one surface of the nickel sheet is partially outwardly protruded to form at least one protrusion; and

[0016] The nickel sheet and the flexible circuit board are connected by tin paste, the nickel sheet is located in the through hole, and the protrusion is located in the opening, thereby obtaining the connection structure.

[0017] An embodiment of the present application also provides a connection structure of a nickel sheet and a flexible circuit board, comprising:

[0018] A flexible circuit board, which comprises a first cover film, a copper layer and a second cover film which are sequentially stacked, the copper layer is provided with at least one protrusion, the second cover film is provided with a through hole, and the protrusion is located in the through hole;

[0019] A nickel sheet, which is provided with a connecting hole, the nickel sheet is located in the through hole, and the protrusion is located in the connecting hole; and

[0020] Tin paste, which is located between the flexible circuit board and the nickel sheet.

[0021] Another embodiment of the present application also provides a connection structure of a nickel sheet and a flexible circuit board, comprising:

[0022] A flexible circuit board, which comprises a first cover film, a copper layer and a second cover film which are sequentially stacked, the copper layer is provided with at least one opening, the second cover film is provided with a through hole, and the projection of the opening on the first cover film is located within the projection range of the through hole on the first cover film;

[0023] A nickel sheet, one surface of the nickel sheet is partially outwardly protruded to form at least one protrusion, the nickel sheet is located in the through hole, and the protrusion is located in the opening; and

[0024] Tin paste, which is located between the flexible circuit board and the nickel sheet.

[0025] This application forms the boss on the copper layer and opens a connecting hole in the nickel sheet, so that the boss is embedded in the connecting hole and fixed by the solder paste, thereby improving the bonding force between the nickel sheet and the flexible circuit board. Alternatively, this application opens the opening in the copper layer, designs the boss on the nickel sheet, so that the boss is located in the opening and fixed by the solder paste, thereby improving the bonding force between the nickel sheet and the flexible circuit board. Attached Figure Description

[0026] Figure 1 This is a cross-sectional schematic diagram of the first covering film provided in the first embodiment of this application.

[0027] Figure 2 Is Figure 1 The diagram shows a cross-sectional view of the first adhesive layer after a copper layer has been formed.

[0028] Figure 3 Is Figure 2 The diagram shows a cross-sectional view of the copper layer after the boss has been formed.

[0029] Figure 4 Is Figure 3 The diagram shows a cross-sectional view after the second cover film is formed on the copper layer.

[0030] Figure 5 This is a cross-sectional schematic diagram of the nickel sheet provided in the first embodiment of this application.

[0031] Figure 6 It is Figure 4 The flexible circuit board shown and Figure 5 The diagram shows a cross-sectional view of the connection structure obtained after the nickel sheets are connected by solder paste.

[0032] Figure 7 This is a cross-sectional schematic diagram of the nickel sheet provided in the second embodiment of this application.

[0033] Figure 8 It is Figure 4 The flexible circuit board shown and Figure 7 The diagram shows a cross-sectional view of the connection structure obtained after the nickel sheets are connected by solder paste.

[0034] Figure 9 Is Figure 2 The diagram shows a cross-sectional view of the copper layer after an opening has been made.

[0035] Figure 10 Is Figure 9 The diagram shows a cross-sectional view after the second cover film is formed on the copper layer.

[0036] Figure 11 This is a cross-sectional schematic diagram of the nickel sheet provided in the third embodiment of this application.

[0037] Figure 12 is a cross-sectional schematic view of a connection structure obtained after a flexible circuit board and a nickel sheet shown in Figure 10 are connected through a tin paste. Figure 11

[0038] Figure 13 is a cross-sectional schematic view of a connection structure provided by the fourth embodiment of the present application.

[0039] Figure 14 is a cross-sectional schematic view of a connection structure provided by the fifth embodiment of the present application.

[0040] Main element symbol explanation

[0041] Connection structure 100, 200, 300, 400, 500

[0042] First cover film 10

[0043] First protective layer 101

[0044] First adhesive layer 102

[0045] Copper layer 20

[0046] Opening 201

[0047] Circuit substrate 21

[0048] Boss 22, 71

[0049] Second cover film 30

[0050] Second adhesive layer 301

[0051] Second protective layer 302

[0052] Through hole 31

[0053] Flexible circuit board 40, 41

[0054] Nickel sheet 50, 51, 70

[0055] Connection hole 501, 502

[0056] Tin paste 60

[0057] The following detailed description will further illustrate the present application in conjunction with the above-mentioned drawings. Detailed description

[0058] The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. ​

[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application.

[0060] In order to make the technical means and effects taken by the present application to achieve the predetermined purpose further clear, the following will be described in detail in combination with the drawings and preferred embodiments.

[0061] The first embodiment of the present application provides a manufacturing method of a connection structure of a nickel sheet and a flexible circuit board, comprising the following steps:

[0062] Step S11, referring to Figure 1 , a first cover film 10 is provided.

[0063] In the present embodiment, the first cover film 10 comprises a first protective layer 101 and a first adhesive layer 102 disposed on the first protective layer 101.

[0064] The material of the first protective layer 101 can be selected from one of the following resins: epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In the present embodiment, the material of the first protective layer 101 is polyimide.

[0065] In the present embodiment, the first adhesive layer 102 can be acrylic hot melt adhesive (AD glue).

[0066] Step S12, referring to Figure 2 , a copper layer 20 is formed on the first adhesive layer 102 to obtain a circuit substrate 21.

[0067] Step S13, referring to Figure 3 , at least one boss 22 is formed on the copper layer 20.

[0068] Specifically, copper is electroplated on the copper layer 20 to form the boss 22.

[0069] As shown in Figure 3 , only two bosses 22 are shown. In fact, the number, shape and position of the boss 22 are not limited by the present application, and can be changed accordingly as needed.

[0070] Step S14, please refer to Figure 4 A second cover film 30 is formed on the copper layer 20 to obtain a flexible circuit board 40.

[0071] In this embodiment, the second cover film 30 includes a second adhesive layer 301 disposed on the copper layer 20 and a second protective layer 302 disposed on the second adhesive layer 301.

[0072] In this embodiment, the second adhesive layer 301 can be an acrylic hot melt adhesive (AD glue).

[0073] The material of the second protective layer 302 can be selected from one of resins such as epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the material of the second protective layer 302 is polyimide.

[0074] The second cover film 30 is provided with a through hole 31, and the through hole 31 penetrates the second protective layer 302 and the second adhesive layer 301 in sequence. The boss 22 is located in the through hole 31. In this embodiment, the end of the boss 22 away from the copper layer 20 protrudes from the surface of the second protective layer 302 away from the second adhesive layer 301.

[0075] Step S15, please refer to Figure 5 A nickel sheet 50 is provided.

[0076] The nickel sheet 50 is provided with at least one connecting hole 501. In this embodiment, the connecting hole 501 is a through hole, and the through hole penetrates the nickel sheet 50.

[0077] Step S16, please refer to Figure 6 The nickel sheet 50 is connected with the flexible circuit board 40 through the tin paste 60, and the nickel sheet 50 is located in the through hole 31, and the boss 22 is located in the connecting hole 501, thereby obtaining the connecting structure 100.

[0078] In this embodiment, the distance between the outer wall of the boss 22 and the inner wall of the connecting hole 501 is greater than or equal to 0.05 mm, so that the tin paste 60 is also located in the connecting hole 501, so as to improve the bonding force between the nickel sheet 50 and the flexible circuit board 40.

[0079] The tin paste 60 is also used to electrically connect the nickel sheet 50 and the flexible circuit board 40.

[0080] The second embodiment of the present application provides a manufacturing method of a connection structure of a nickel sheet and a flexible circuit board. The manufacturing method provided by the second embodiment is different from the manufacturing method provided by the first embodiment in that Figure 7 In step S15, a nickel sheet 51 is provided, and at least one connecting hole 502 is arranged in the nickel sheet 51. The connecting hole 502 is a groove, and the bottom of the groove is the nickel sheet 51. Please refer to Figure 8 In step S16, the nickel sheet 51 is connected with the flexible circuit board 40, so as to obtain the connection structure 200.

[0081] The third embodiment of the present application provides a manufacturing method of a connection structure of a nickel sheet and a flexible circuit board, which comprises the following steps:

[0082] Steps S31 to S32 are the same as steps S11 to S12, respectively, so as to obtain the circuit substrate 21. For details, please refer to steps S11 to S12, which will not be described here.

[0083] Step S33, please refer to Figure 9 At least one opening 201 is arranged in the copper layer 20.

[0084] In the embodiment, each of the openings 201 penetrates the copper layer 20. In the embodiment, the cross-sectional shape of the opening 201 is approximately rectangular.

[0085] Step S34, please refer to Figure 10 A second cover film 30 is formed on the copper layer 20, so as to obtain a flexible circuit board 41.

[0086] In the embodiment, the second cover film 30 comprises a second adhesive layer 301 arranged on the copper layer 20 and a second protective layer 302 arranged on the second adhesive layer 301.

[0087] In the embodiment, the second adhesive layer 301 can be an acrylic hot melt adhesive (AD adhesive).

[0088] The material of the second protective layer 302 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and the like. In this embodiment, the material of the second protective layer 302 is polyimide.

[0089] The second cover film 30 is provided with a through hole 31, and the projection of the opening 201 on the first cover film 10 is located within the projection range of the through hole 31 on the first cover film 10.

[0090] Step S35, please refer to Figure 11 , provide a nickel sheet 70.

[0091] One surface of the nickel sheet 70 is outwardly convex to form at least one boss 71.

[0092] In this embodiment, the cross-sectional shape of the boss 71 is approximately rectangular.

[0093] As Figure 11 shown, only two bosses 71 are shown. In fact, the number, shape and position of the bosses 71 are not limited by the present application, and can be changed accordingly as needed.

[0094] Step S36, please refer to Figure 12 , the nickel sheet 70 is connected to the flexible circuit board 41 by the tin paste 60, and the nickel sheet 70 is located in the through hole 31, and the boss 71 is located in the opening 201, thereby obtaining the connection structure 300.

[0095] In this embodiment, the distance between the outer wall of the boss 71 and the inner wall of the opening 201 is greater than or equal to 0.05mm, so that the tin paste 60 is also located in the opening 201, so as to improve the bonding force between the nickel sheet 70 and the flexible circuit board 41.

[0096] Please refer to Figure 13 , the fourth embodiment of the present application provides a method for manufacturing a connection structure 400 of a nickel sheet and a flexible circuit board, and the difference between the manufacturing method provided by the fourth embodiment and the manufacturing method provided by the third embodiment is that in step S33, the opening 201 does not penetrate the copper layer 20.

[0097] Please refer toFigure 14 The fifth embodiment of the present application provides a manufacturing method of a connection structure 500 of a nickel sheet and a flexible circuit board. The manufacturing method provided by the fifth embodiment is different from the manufacturing method provided by the third embodiment in that, in step S33, the cross-sectional shape of the opening 201 is substantially inverted trapezoidal. Correspondingly, in step S35, the cross-sectional shape of the boss 71 away from one end of the nickel sheet 70 is substantially trapezoidal.

[0098] Please refer to Figure 6 The first embodiment of the present application also provides a connection structure 100 of a nickel sheet and a flexible circuit board. The connection structure 100 comprises a flexible circuit board 40, a nickel sheet 50, and a tin paste 60.

[0099] In the present embodiment, the flexible circuit board 40 comprises a first cover film 10, a copper layer 20, and a second cover film 30 which are sequentially stacked.

[0100] In the present embodiment, the first cover film 10 comprises a first protective layer 101 and a first adhesive layer 102 arranged on the first protective layer 101.

[0101] The material of the first protective layer 101 can be selected from one of resins such as epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In the present embodiment, the material of the first protective layer 101 is polyimide.

[0102] In the present embodiment, the first adhesive layer 102 can be acrylic hot melt adhesive (AD glue).

[0103] The copper layer 20 is provided with at least one boss 22. In the present embodiment, the material of the boss 22 is copper. As shown in the figure, only two bosses 22 are shown. In fact, the number, shape, and position of the boss 22 are not limited by the present application, and can be changed accordingly as needed. Figure 6

[0104] In the present embodiment, the second cover film 30 comprises a second adhesive layer 301 arranged on the copper layer 20 and a second protective layer 302 arranged on the second adhesive layer 301.

[0105] In the present embodiment, the second adhesive layer 301 can be acrylic hot melt adhesive (AD glue).​

[0106] The material of the second protective layer 302 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and the like. In this embodiment, the material of the second protective layer 302 is polyimide.

[0107] The second cover film 30 is provided with a through hole 31, and the through hole 31 sequentially penetrates the second protective layer 302 and the second adhesive layer 301. The boss 22 is located in the through hole 31. In this embodiment, the end of the boss 22 away from the copper layer 20 protrudes from the surface of the second protective layer 302 away from the second adhesive layer 301.

[0108] The nickel sheet 50 is located in the through hole 31. The nickel sheet 50 is provided with at least one connecting hole 501. In this embodiment, the connecting hole 501 is a through hole, and the through hole penetrates the nickel sheet 50. The boss 22 is located in the connecting hole 501.

[0109] The tin paste 60 is located between the flexible circuit board 40 and the nickel sheet 50. In this embodiment, the distance between the outer wall of the boss 22 and the inner wall of the connecting hole 501 is greater than or equal to 0.05 mm, so that the tin paste 60 is also located in the connecting hole 501, so as to improve the bonding force between the nickel sheet 50 and the flexible circuit board 40. The tin paste 60 is also used to electrically connect the nickel sheet 50 and the flexible circuit board 40.

[0110] Referring to Figure 8 , the second embodiment of the application provides a connection structure 200 of a nickel sheet and a flexible circuit board. The connection structure 200 provided by the second embodiment and the connection structure 100 provided by the first embodiment are different in that the nickel sheet 51 is provided with at least one connecting hole 502. The connecting hole 502 is a groove, and the bottom of the groove is the nickel sheet 51. The nickel sheet 51 is connected with the flexible circuit board 40.

[0111] Referring to Figure 12 , the third embodiment of the application also provides a connection structure 300 of a nickel sheet and a flexible circuit board. The connection structure 300 includes a flexible circuit board 41, a nickel sheet 70, and a tin paste 60.

[0112] The flexible circuit board 41 comprises a first cover film 10, a copper layer 20 and a second cover film 30 which are sequentially stacked.

[0113] In the embodiment, the first cover film 10 comprises a first protective layer 101 and a first adhesive layer 102 disposed on the first protective layer 101.

[0114] The material of the first protective layer 101 can be selected from one of resins such as epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET) and polyethylene naphthalate (PEN). In the embodiment, the material of the first protective layer 101 is polyimide.

[0115] In the embodiment, the first adhesive layer 102 can be acrylic hot melt adhesive (AD adhesive).

[0116] At least one opening 201 is disposed in the copper layer 20. In the embodiment, each of the openings 201 penetrates the copper layer 20. In the embodiment, the cross-sectional shape of the opening 201 is substantially rectangular.

[0117] In the embodiment, the second cover film 30 comprises a second adhesive layer 301 disposed on the copper layer 20 and a second protective layer 302 disposed on the second adhesive layer 301.

[0118] In the embodiment, the second adhesive layer 301 can be acrylic hot melt adhesive (AD adhesive).

[0119] The material of the second protective layer 302 can be selected from one of resins such as epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET) and polyethylene naphthalate (PEN). In the embodiment, the material of the second protective layer 302 is polyimide.

[0120] The second covering film 30 has a through hole 31, and the projection of the opening 201 on the first covering film 10 is located within the projection range of the through hole 31 on the first covering film 10.

[0121] The nickel sheet 70 is located in the through hole 31. One surface portion of the nickel sheet 70 protrudes outward to form at least one boss 71. In this embodiment, the boss 71 has a generally rectangular cross-sectional shape. The boss 71 is located in the opening 201.

[0122] like Figure 12 As shown, only two of the aforementioned bosses 71 are illustrated. In fact, this application does not limit the number, shape, or position of the bosses 71, and can make corresponding changes as needed.

[0123] The solder paste 60 is located between the flexible circuit board 41 and the nickel sheet 70. In this embodiment, the distance between the outer wall of the boss 71 and the inner wall of the opening 201 is greater than or equal to 0.05 mm, so that the solder paste 60 is also located within the opening 201, thereby improving the bonding force between the nickel sheet 70 and the flexible circuit board 41. The solder paste 60 is also used for electrically connecting the nickel sheet 70 and the flexible circuit board 41.

[0124] Please see Figure 13 The fourth embodiment of this application provides a connection structure 400 between a nickel sheet and a flexible circuit board. The difference between the connection structure 400 provided in the fourth embodiment and the connection structure 300 provided in the third embodiment is that the opening 201 does not penetrate the copper layer 20.

[0125] Please see Figure 14 The fifth embodiment of this application provides a connection structure 500 between a nickel sheet and a flexible circuit board. The difference between the connection structure 500 provided in the fifth embodiment and the connection structure 300 provided in the third embodiment is that the cross-sectional shape of the opening 201 is approximately an inverted trapezoid. Correspondingly, the cross-sectional shape of the end of the boss 71 away from the nickel sheet 70 is approximately trapezoidal.

[0126] This application forms the boss 22 on the copper layer 20 and opens a connecting hole 501 in the nickel sheet 50, so that the boss 22 is embedded in the connecting hole 501 and fixed by the solder paste 60, thereby improving the bonding force between the nickel sheet 50 and the flexible circuit board 40. Alternatively, this application opens the opening 201 in the copper layer 20 and designs the boss 71 on the nickel sheet 70, so that the boss 71 is located in the opening 201 and fixed by the solder paste 60, thereby improving the bonding force between the nickel sheet 70 and the flexible circuit board 41.

[0127] In addition, the application solves the problem described in the background art by not pressing a layer of PI film at the connection between the nickel sheet and the FPC.

[0128] The above description is merely one specific implementation of the application, but in actual application, it cannot be limited to this implementation.

Claims

1. A method for fabricating a connection structure between a nickel sheet and a flexible circuit board, characterized in that, Includes the following steps: A circuit board is provided, the circuit board including a first cover film and a copper layer disposed on the first cover film; At least one boss is formed on the copper layer; A second cover film is formed on the copper layer, the second cover film has through holes, and the boss is located in the through holes to obtain a flexible circuit board; A nickel sheet is provided, wherein the nickel sheet has a connecting hole; and The nickel sheet is connected to the flexible circuit board using solder paste, with the nickel sheet positioned in the through hole and the boss positioned in the connection hole, thereby obtaining the connection structure.

2. The method for manufacturing the connection structure as described in claim 1, characterized in that, The distance between the outer wall of the boss and the inner wall of the connecting hole is greater than or equal to 0.05 mm, and the solder paste is also located inside the connecting hole.

3. The method for manufacturing the connection structure as described in claim 2, characterized in that, The connecting hole is a through hole, and the through hole penetrates the nickel sheet.

4. The method for manufacturing the connection structure as described in claim 2, characterized in that, The connection hole is a groove, and the bottom of the groove is the nickel sheet.

5. A method for fabricating a connection structure between a nickel sheet and a flexible circuit board, characterized in that, Includes the following steps: A circuit board is provided, the circuit board including a first cover film and a copper layer disposed on the first cover film; At least one opening is made in the copper layer; A second cover film is formed on the copper layer. The second cover film has through holes, and the projection of the opening on the first cover film is located within the projection range of the through hole on the first cover film, thereby obtaining a flexible circuit board. A nickel sheet is provided, wherein a portion of one surface of the nickel sheet protrudes outward to form at least one boss; as well as The nickel sheet is connected to the flexible circuit board using solder paste, with the nickel sheet positioned in the through-hole and the boss positioned in the opening, thereby obtaining the connection structure.

6. A connection structure between a nickel sheet and a flexible circuit board, characterized in that, include: A flexible circuit board, comprising a first cover film, a copper layer and a second cover film stacked sequentially, wherein the copper layer has at least one boss, the second cover film has a through hole, and the boss is located in the through hole; A nickel sheet, wherein a connecting hole is provided in the nickel sheet, the nickel sheet is located in the through hole, and the boss is located in the connecting hole; and Solder paste, which is located between the flexible circuit board and the nickel sheet.

7. The connection structure as described in claim 6, characterized in that, The distance between the outer wall of the boss and the inner wall of the connecting hole is greater than or equal to 0.05 mm, and the solder paste is also located inside the connecting hole.

8. The connection structure as described in claim 7, characterized in that, The connecting hole is a through hole, and the through hole penetrates the nickel sheet.

9. The connection structure as described in claim 7, characterized in that, The connection hole is a groove, and the bottom of the groove is the nickel sheet.

10. A connection structure between a nickel sheet and a flexible circuit board, characterized in that, include: A flexible circuit board, comprising a first cover film, a copper layer and a second cover film stacked sequentially, wherein the copper layer has at least one opening and the second cover film has a through hole, and the projection of the opening on the first cover film is located within the projection range of the through hole on the first cover film. A nickel sheet, wherein a portion of one surface of the nickel sheet protrudes outward to form at least one boss, the nickel sheet being located in the through hole and the boss being located in the opening; as well as Solder paste, which is located between the flexible circuit board and the nickel sheet.

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