Device and method for removing electronic components and method for manufacturing light emitting diode panel

Abstract

The present invention provides a device for removing electronic components, including a carrying platform, an energy beam generating device and a guiding mechanism, wherein the carrying platform is used to carry a substrate; the energy beam generating device generates and emits an energy beam to the carrying platform; and the guiding mechanism guides the energy beam to a specific position of the carrying platform according to a signal. In addition, the present invention also provides a method for removing electronic components using the above device, and a method for manufacturing a light-emitting diode panel including the above method. By utilizing the technical solution of the present invention, a specific electronic component can be selectively removed quickly from a plurality of electronic components, thereby improving the removal efficiency and reducing the risk of collision between devices.

Description

Technical Field

[0001] The present invention provides a device and method for removing electronic components, and a method for manufacturing a light-emitting diode panel, and particularly relates to a device that can quickly and selectively remove specific electronic components from multiple electronic components, a method for removing electronic components using the above device, and a method for manufacturing a light-emitting diode panel including the above removal method. Background Art

[0002] Diode panel displays are one of the mainstream display devices on the market. Generally speaking, during the production process of diode panel products, they need to go through processes such as epitaxy, mass transfer, and chip bonding. During the mass transfer process, the light-emitting diodes are configured on the target panel or substrate through micro-electromechanical array technology, and the configured light-emitting diodes are fixed to the target panel or substrate through solder or other fixing methods. In this way, the panel can have a high-density arrangement of light-emitting diodes. When powered on, each light-emitting diode excites different colors of light, thereby providing a highly saturated visual experience. Summary of the invention

[0003] However, during the transfer process, some diode chips may have defects, or the position or leveling height may deviate during the bonding process with the panel, so these defective chips need to be removed from the panel. However, it is difficult to remove chips at specific positions on the panel with the existing technology, so removal tools (such as clamps, laser welding knives, etc.) need to be moved sequentially to the top of the chips to be removed for removal. Not only is it time-consuming, but the removal tools are also prone to interference and collision with other devices around the panel, increasing the risk of damage to each device.

[0004] The inventor has devoted all his efforts to research and develop a device that can quickly and selectively remove a specific electronic component from a plurality of electronic components, in order to improve the removal efficiency and reduce the risk of collision between devices.

[0005] In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a device for removing electronic components, including a carrying platform, an energy beam generating device and a guiding mechanism, wherein the carrying platform is used to carry a substrate; the energy beam generating device generates and emits an energy beam onto the carrying platform; and the guiding mechanism guides the energy beam to a specific position of the carrying platform according to a signal.

[0006] Preferably, the guiding mechanism comprises a reflective galvanometer, and the reflective galvanometer reflects the energy beam to the above-mentioned specific position.

[0007] Preferably, the energy beam is a laser beam.

[0008] Preferably, the electronic component removal device further comprises a cleaning device. The cleaning device is arranged on the carrying platform and has a corresponding cleaning range, and the width of the cleaning range in the scanning direction is greater than or equal to the width of the substrate.

[0009] Preferably, the cleaning device is a blowing nozzle.

[0010] Preferably, the signal includes location coordinate information of the above-mentioned specific location.

[0011] In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention also provides a method for removing electronic components, comprising: providing a substrate, wherein a plurality of electronic components are arranged on the substrate, and these electronic components include at least one component to be removed; generating a signal, wherein the signal includes position coordinate information of the component to be removed; providing an energy beam; guiding the energy beam to the position coordinates of the component to be removed according to the signal, and reducing the binding force between the component to be removed and the substrate through the energy beam; and removing the component to be removed.

[0012] Preferably, the above method uses airflow to remove the component to be removed.

[0013] Preferably, the electronic component is a light emitting diode chip.

[0014] In order to solve the above technical problem, another technical solution adopted by the present invention further provides a method for manufacturing a light emitting diode panel, comprising removing a light emitting diode using the above method for removing an electronic component.

[0015] Thus, the device and method for removing electronic components of the present invention can guide the energy beam to a specific position of the carrier platform according to the signal through the guiding mechanism, and reduce the binding force between the component to be removed and the substrate through the energy beam, thereby achieving the effect of removing the component to be removed. In addition, the method for manufacturing a light-emitting diode panel provided by the present invention includes the above-mentioned method for removing electronic components, so that a specific electronic component can be selectively removed from multiple electronic components quickly, thereby improving the removal efficiency and reducing the risk of collision between devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. It should be understood that the drawings provided are only for reference and description, and are not used to limit the present invention.

[0017] Figure 1 The present invention is a front view schematically showing an embodiment of a device for removing electronic components provided by the present invention.

[0018] Figure 2 for Figure 1 Schematic top view of .

[0019] Figure 3 The present invention is a flowchart of one embodiment of a method for removing an electronic component provided by the present invention.

[0020] Figure 4 for Figure 1 The energy beam generating device emits an energy beam according to a signal and guides the energy beam to a specific position on the substrate through a guiding mechanism.

[0021] Figure 5 for Figure 4 Schematic top view of .

[0022] Figure 6 A top view schematic diagram of a cleaning device removing a component to be removed.

[0023] Figure 7 A schematic top view of a recovery device recovering a component to be removed.

[0024] Figure 8 It is a top view schematic diagram of the movement of the carrying platform relative to the energy beam generating device and the guiding mechanism.

[0025] Reference numerals

[0026] 1 electronic component removal device; 100 carrying platform; 110 substrate; 200 energy beam generating device; 300 guiding mechanism; 310 reflecting galvanometer; 400 signal unit; 500 cleaning device; 600 recovery device; 2 electronic component; 2' component to be removed; C cleaning range; E energy beam; R recovery range; S scanning direction; S100-S500 steps; W1, W2, W3 width. DETAILED DESCRIPTION

[0027] The other technical contents, features and effects of the present invention described above will be clearly presented in the following detailed description of the preferred embodiments with reference to the accompanying drawings. It is worth mentioning that the directional terms mentioned in the following embodiments, such as: up, down, left, right, front or back, etc., are only reference directions of the accompanying drawings. Therefore, the directional terms used are for illustration, not for limitation of the present invention. In addition, in the following embodiments, the same or similar components will be marked with the same or similar numbers.

[0028] Please refer to Figures 1 to 3 ,in Figure 1 A front view schematic diagram of an embodiment of a device for removing electronic components provided by the present invention, Figure 2 for Figure 1 A top view of Figure 3The present invention is a flowchart of the steps of an embodiment of the method for removing electronic components provided by the present invention. The electronic component removal device 1 of the present embodiment can remove a specific electronic component from a plurality of electronic components 2 by using the method for removing electronic components. Specifically, the electronic component removal device 1 includes a carrier platform 100, an energy beam generating device 200, and a guiding mechanism 300, wherein the carrier platform 100 is used to carry a substrate 110, and the energy beam generating device 200 and the guiding mechanism 300 are mounted on the carrier platform 100. On the other hand, the method for removing electronic components provided in this embodiment includes the following steps: providing a substrate 110, wherein a plurality of electronic components 2 are arranged on the substrate 110, and these electronic components 2 include at least one component 2' to be removed (step S100); generating a signal, and the signal includes position coordinate information of the component to be removed (step S200); providing an energy beam E (step S300); guiding the energy beam E to the position coordinate of the component to be removed 2' according to the signal, and reducing the bonding force between the component to be removed 2' and the substrate 110 through the energy beam E (step S400); and removing the component to be removed 2' (step S500).

[0029] In detail, the carrying platform 100 is, for example, a movable crawler or a rigid plate, which can be used to carry the substrate 110 configured with the electronic components 2. In this embodiment, the electronic components 2 are, for example, light-emitting diode chips, but can also be other electronic components with light-emitting capabilities, and the present invention is not limited to this. Among these electronic components 2, there are components 2' to be removed from the substrate 110, wherein the components 2' to be removed are, for example, diode chips that do not have light-emitting capabilities, or defective chips that have errors in position or configuration height during the transfer process, and therefore need to be removed using physical or energy means.

[0030] On the other hand, the energy beam generating device 200 is, for example, a laser generator, which can generate and emit a laser beam to the carrier platform 100, but in other possible embodiments, it can also be a device that generates high-heat, low-frequency visible light; and the guiding mechanism 300 can guide the energy beam generated by the energy beam generating device 200 to a specific position of the carrier platform 100 according to the received signal. Specifically, the guiding mechanism 300 includes, for example, a reflective galvanometer 310, wherein the reflective galvanometer 310 can reflect the energy beam to a specific position. Since the position and angle of the reflective galvanometer 310 relative to the energy beam generating device 200 are adjustable, in other words, the user can adjust the relative position or angle between the reflective galvanometer 310 and the energy beam generating device 200 to reflect the energy beam to the user's desired position. Of course, according to actual needs, the guiding mechanism 300 may also include components such as a lens used to focus or diverge the energy beam, a chamber for adjusting the power of the energy beam, and a slit for filtering or gathering other energy beam sources, and the present invention is not limited to this.

[0031] Preferably, the electronic component removal device 1 also includes a signal unit 400, a cleaning device 500 and a recovery device 600, wherein the signal unit 400 is electrically connected to the energy beam generating device 200 and the guiding mechanism 300, and is used to provide the energy beam generating device 200 with relevant information on generating the required energy beam E and guiding the guiding mechanism 300 to guide the above energy beam E; the cleaning device 500 and the recovery device 600 are configured on the supporting platform 100, and in this embodiment are mounted on the substrate 110, and are respectively used for cleaning and recovering the component 2' to be removed.

[0032] In detail, the signal unit 400 is, for example, a controller or a signal generator that can generate a programming signal, and can transmit the signal to the energy beam generating device 200 and the guiding mechanism 300 by wire or wireless means, wherein the signal transmitted to the energy beam generating device 200 includes, for example, the time point of emitting the energy beam, the power of the energy beam, and the time distance for maintaining the emitted energy beam, and the signal transmitted to the guiding mechanism 300 includes, for example, the position coordinate information of the specific position to which the energy beam is to be guided. When the guiding mechanism 300 receives the above position coordinate information, it can adjust the position and angle of the reflective galvanometer 310 relative to the energy beam generating device 200 so that the energy beam is accurately projected to the desired position. Furthermore, when there are multiple pieces of position coordinate information, the guiding mechanism 300 can accurately project the energy beam to the desired position in sequence after receiving these pieces of position coordinate information.

[0033] On the other hand, the cleaning device 500 is, for example, a nozzle, which can blow out a high-pressure airflow to move the component 2' to be removed away from the position originally arranged on the substrate 110 after the energy beam reduces the binding force between the component 2' to be removed and the substrate 110, thereby maintaining the cleanliness of the surface of the substrate 110. However, in other possible embodiments, the cleaning device 500 can also be a mechanism arm suitable for extending soft bristles, which can use the soft bristles to remove the component 2' to be removed once the binding force is reduced by the energy beam E, and the present invention is not limited to this.

[0034] In addition, the recycling device 600 is, for example, a suction nozzle, which can suck the components 2' to be removed removed by the cleaning device 500 into the interior of the suction nozzle through negative pressure. With such a configuration, if the luminous ability of the components 2' to be removed is normal, they can be used again in the transfer process after being recycled by the recycling device 600 without causing waste of the electronic components 2. Preferably, the recycling device 600 is, for example, arranged opposite to the cleaning device 500, preferably arranged on opposite sides of the carrying platform 100, and such a configuration can accelerate the removal process of the electronic components 2.

[0035] It is worth mentioning that in this embodiment, the signal unit 400 is also electrically connected to the cleaning device 500 and the recovery device 600. Therefore, when the energy beam generating device 200 and the guiding mechanism 300 successfully separate the component 2' to be removed from the substrate 110 according to the signal sent by the signal unit 400, the signal unit 400 can immediately transmit the signal to the cleaning device 500 and the recovery device 600, and the cleaning device 500 and the recovery device 600 sequentially clean and recover the component 2' to be removed.

[0036] Please refer to Figure 4 and Figure 5 ,in Figure 4 for Figure 1 The energy beam generating device in the embodiment emits an energy beam according to a signal and guides the energy beam to a specific position on the substrate through a guiding mechanism. Figure 5 for Figure 4 As shown in the figure, when the signal unit 400 generates a signal to the energy beam generating device 200 and the guiding mechanism 300, the energy beam generating device 200 will generate and emit an energy beam E with a specific power and time distance at a specific time according to the signal. On the other hand, the guiding mechanism 300 will adjust the reflective galvanometer 310 and other possible optical components according to the signal transmitted by the signal unit 400, and guide the energy beam E to the component 2' to be removed on the substrate 110 (at Figure 5 The position coordinates of the component 2' to be removed are indicated by black dotted squares in the figure, and the bonding force between the component 2' to be removed and the substrate 110 is reduced by the energy beam E. Specifically, the component 2' to be removed is fixed to the substrate 110 by solder, for example. The energy beam E can be focused on the solder to melt it through the guidance of the guide mechanism 300, so that the component 2' to be removed can be separated from the substrate 110.

[0037] In addition, in the present embodiment, the energy beam E emitted at the same time is, for example, an energy beam, and the reflective galvanometer 310 sequentially changes different positions and angles to reflect the energy beam E onto a single component 2' to be removed, but the present invention is not limited to this. In other possible embodiments, the energy beam generating device 200 may also emit multiple energy beams E at a time, and the guiding mechanism 300 may also include multiple reflective galvanometers 310 and corresponding optical components, and guide the emitted energy beam E to all components 2' to be removed within the processing range at one time, thereby further accelerating the automated process of removing the components 2' to be removed.

[0038] Please refer to Figure 6 , Figure 6Schematic diagram of a top view of a cleaning device removing a component to be removed. As shown in the figure, the cleaning device 500 has a corresponding cleaning range C, and the width W2 of the cleaning range C in the scanning direction S is greater than or equal to the width W1 of the substrate 110. In detail, when the component 2' to be removed is separated from the substrate 110, the cleaning device 500 can blow out an airflow to blow the component 2' to be removed separated from the substrate 110 away from the substrate according to the signal sent by the signal unit 400, and because the width W2 of the corresponding cleaning range C of the cleaning device 500 in the scanning direction S is greater than or equal to the width W1 of the substrate 110 (for example, the width of the blowing nozzle is greater than the width of the substrate 110), the cleaning device 500 can remove all the components 2' to be removed whose binding force is reduced by the energy beam E in the cleaning range C at one time, thereby greatly improving the efficiency of removing a specific electronic component 2. By the way, the cleaning device 500 can also move forward or backward along the scanning direction S to remove all the components 2' to be removed separated from the substrate 110 from the substrate 110.

[0039] Please refer to Figure 7 , Figure 7 Schematic diagram of a top view of the recovery device when recovering the components to be removed. Similarly, the recovery device 600 also corresponds to the recovery range R, and the width W3 of the recovery range R in the scanning direction S is greater than or equal to the width W1 of the substrate 110. When the cleaning device 500 drives the components 2' to be removed away from their original configuration positions, the recovery device 600 can generate negative pressure according to the signal sent by the signal unit 400 to recover the components 2' to be removed that have been driven away from their original configuration positions, and because the width W3 of the recovery range R in the scanning direction S is greater than or equal to the width W1 of the substrate 110, the recovery device 600 can recover at one time without recovering each component 2' to be removed one by one. It is worth mentioning that although in the process of this embodiment the component 2' to be removed is cleared first and then the recovery process is carried out, the present invention is not limited to this. According to the needs of the actual removal operation, the cleaning device 500 and the recovery device 600 can also be driven at the same time, so that the component 2' to be removed, whose bonding force with the substrate 110 is reduced by the energy beam E, is simultaneously affected by the airflow blown out by the cleaning device 500 and the negative pressure generated by the recovery device 600, thereby accelerating the removal process.

[0040] Please refer to Figure 8 , Figure 8Schematic diagram of the top view of the movement of the carrier platform relative to the energy beam generating device and the guide mechanism. After the components 2' to be removed in the removal range C and the recovery range R are removed from the substrate 110, the carrier platform 100 can move along the scanning direction S relative to the energy beam generating device 200, the guide mechanism 300, the cleaning device 500 and the recovery device 600, so that the next batch of components 2' to be removed that need to be removed are located within the removal range C and the recovery range R, which is beneficial to the overall operation. It is worth mentioning that although in this embodiment, the carrier platform 100 moves relative to the energy beam generating device 200, the guide mechanism 300, the cleaning device 500 and the recovery device 600 along the scanning direction S, in other possible embodiments, the energy beam generating device 200, the guide mechanism 300, the cleaning device 500 and the recovery device 600 can also move relative to the carrier platform 100 along the direction opposite to the scanning direction S, which can also achieve the same effect.

[0041] In addition, the present invention also provides a method for manufacturing an LED panel using the above method for removing electronic components, which can remove the LEDs to be removed from the substrate 110, thereby completing the manufacturing operation of the LED panel.

[0042] The contents disclosed above are only preferred feasible embodiments of the present invention and are not intended to limit the scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the scope of the claims of the present invention.

Claims

1. A device for removing electronic components, characterized in that include: A carrying platform, which is used to carry a substrate, on which a plurality of electronic components are arranged, and the plurality of electronic components include at least one component to be removed; An energy beam generating device, which generates and emits an energy beam onto the carrying platform; A guiding mechanism, which guides the energy beam to the position coordinates of the at least one component to be removed on the carrying platform according to the signal, and reduces the binding force between the at least one component to be removed and the substrate through the energy beam; A cleaning device, the cleaning device is arranged on the carrying platform and has a corresponding cleaning range, and the width of the cleaning range in the scanning direction is greater than or equal to the width of the substrate, and the cleaning device moves forward or backward along the scanning direction, so that the cleaning device can remove all the components to be removed in the cleaning range whose binding force is reduced by the energy beam at one time; as well as A recovery device, arranged opposite to the cleaning device and having a corresponding recovery range, and a width of the recovery range in the scanning direction is greater than or equal to a width of the substrate; The energy beam generating device emits multiple energy beams at a time, and the guiding mechanism includes multiple reflective galvanometers and corresponding optical components. The guiding mechanism guides the emitted energy beams to the at least one component to be removed within the processing range at one time, and the cleaning device and the recovery device sequentially clean and recover the at least one component to be removed.

2. The device according to claim 1, characterized in that The energy beam is a laser beam.

3. The device according to claim 1, characterized in that The cleaning device is a mouthpiece.

4. The device according to claim 1, characterized in that The signal includes location coordinate information of the at least one component to be removed.

5. A method for removing electronic components of the device according to any one of claims 1 to 4, characterized in that: include: Providing a substrate, on which a plurality of electronic components are disposed, and the plurality of electronic components includes at least one component to be removed; generating a signal, wherein the signal includes the position coordinate information of the at least one component to be removed; Provides multiple energy beams; directing the plurality of energy beams to the position coordinates of the at least one component to be removed according to the signal, and reducing the bonding force between the at least one component to be removed and the substrate by the plurality of energy beams; and The at least one component to be removed is cleared and recycled in sequence.

6. The method according to claim 5, characterized in that The energy beam is a laser beam.

7. The method according to claim 5, characterized in that The method removes the at least one component to be removed using a gas flow.

8. The method according to claim 5, characterized in that The plurality of electronic components are light emitting diode chips.

9. A method for manufacturing a light emitting diode panel, characterized in that: Comprising removing a light emitting diode using a method according to any one of claims 5 to 8.

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