A method for curing carbon fiber tube for semiconductor

Abstract

The present invention relates to a method for curing a carbon fiber tube for semiconductors, the curing method comprising the following steps: (1) subjecting a tube blank to be cured to a first heat treatment to obtain a first tube blank; (2) subjecting the first tube blank obtained in step (1) to a second heat treatment to obtain a second tube blank; (3) subjecting the second tube blank obtained in step (2) to a cooling treatment to obtain a carbon fiber tube. The curing method provided by the present invention can make the carbon fiber tube have good mechanical properties, good stability, and not easy to deform.

Description

Technical Field

[0001] The invention relates to the technical field of carbon fiber tubes, and in particular to a curing method for a carbon fiber tube for semiconductors. Background Art

[0002] Carbon fiber is a fibrous carbon material. It is a new type of material with high strength, low density, corrosion resistance, high temperature resistance and electrical conductivity. Aircraft made of composite materials made of carbon fiber and plastic are not only light, but also consume less power, have high thrust and low noise; using carbon fiber to make computer disks can increase the computer's storage capacity and computing speed; using carbon fiber reinforced plastics to make satellites, rockets and other spacecraft has high mechanical strength, low mass, and can save a lot of fuel.

[0003] The robot arm is a highly nonlinear, multi-input, multi-output and strongly coupled complex system. Due to its unique operational flexibility, it has been widely used in industrial assembly and other fields. Carbon fiber has excellent mechanical properties and is the fiber with the highest specific modulus and the highest specific strength among high-performance fibers produced in large quantities. In addition, carbon fiber also has the advantages of corrosion resistance, fatigue resistance and low thermal expansion coefficient. Therefore, more and more robot arms are using carbon fiber composites.

[0004] At present, people cannot directly use carbon or graphite to draw carbon fiber. They can only use some carbon-containing organic fibers (such as nylon, acrylic, rayon, etc.) as raw materials, combine the organic fibers with plastic resins, place them in a rare gas atmosphere, and carbonize them under a certain strong heat. Most of the current carbon fibers are made by solid phase carbonization of polyacrylonitrile fibers.

[0005] CN105128359A discloses a processing technology for a carbon fiber heating tube, comprising the following steps: weaving carbon fibers into long strips of carbon fiber filaments; weaving the obtained carbon fiber filaments into carbon fiber strips using a weaving machine; winding the obtained carbon fiber strips on a quartz tube in an interlaced manner; and molding and curing the carbon fiber strips wound on the quartz tube.

[0006] CN109454893A discloses a novel carbon fiber tube processing process, including a solution preparation process, a solution immersion process, a winding molding process and a curing process. The curing process includes curing the formed carbon fiber composite material at a constant temperature of 150°C in a curing furnace for one hour, then cooling the curing furnace to room temperature, and simultaneously using a vacuum pump to form a vacuum state in the curing furnace and curing it again for one hour to completely remove the solvent and avoid affecting its strength after molding.

[0007] However, the curing process of high-performance composite materials such as carbon fiber is a complex process in which thermal, chemical and mechanical properties change drastically. Thermal and chemical reaction effects will cause residual stress and deformation. Therefore, it is of great significance to provide a curing method for semiconductor carbon fiber tubes with good curing effect and mass production. Summary of the invention

[0008] In view of the above problems, the purpose of the present invention is to provide a method for curing a carbon fiber tube for semiconductors. Compared with the prior art, the curing method provided by the present invention can make the carbon fiber tube have good mechanical properties, good stability, and not easy to deform.

[0009] In order to achieve the purpose of the invention, the present invention adopts the following technical solutions:

[0010] The present invention provides a method for curing a carbon fiber tube for semiconductor, the curing method comprising the following steps:

[0011] (1) subjecting the tube blank to be solidified to a first heat treatment to obtain a first tube blank;

[0012] (2) subjecting the first tube blank obtained in step (1) to a second heat treatment to obtain a second tube blank;

[0013] (3) The second tube blank obtained in step (2) is subjected to a cooling treatment to obtain a carbon fiber tube.

[0014] The curing method provided by the present invention can ensure the quality requirements of the carbon fiber tube, improve the mechanical properties of the carbon fiber tube, reduce the vibration recovery time, and improve the stability of the carbon fiber tube through the combined effects of the first heat treatment, the second heat treatment and the temperature reduction treatment.

[0015] Preferably, the endpoint temperature of the first heat treatment is 70-80°C, for example, 70°C, 72°C, 74°C, 76°C, 78°C or 80°C, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0016] The present invention preferably sets the endpoint temperature of the first heat treatment within a specific range, which can further improve the mechanical properties and stability of the carbon fiber tube.

[0017] Preferably, the holding time of the first heat treatment in step (1) is 10-20 min, for example, 10 min, 12 min, 14 min, 16 min, 18 min or 20 min, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0018] Preferably, pressurization is performed during the first heat treatment in step (1).

[0019] Preferably, the pressure in the first heat treatment is 1-1.4 MPa, for example, 1 MPa, 1.1 MPa, 1.2 MPa, 1.3 MPa or 1.4 MPa, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0020] The present invention preferably sets the pressure of the first heat treatment within a specific range, which can further improve the mechanical properties and stability of the carbon fiber tube.

[0021] Preferably, the endpoint temperature of the second heat treatment is 120-128°C, for example, 120°C, 122°C, 124°C, 126°C or 128°C, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0022] The present invention preferably sets the end point temperature of the second heat treatment within a specific range, which can further improve the mechanical properties and stability of the carbon fiber tube.

[0023] Preferably, the holding time of the second heat treatment in step (2) is 1.5-2h, for example, it can be 1.5h, 1.6h, 1.7h, 1.8h, 1.9h or 2h, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0024] Preferably, in step (2), pressurization is performed during the second heat treatment.

[0025] Preferably, the pressure of the second heat treatment is 2.2-2.6 MPa, for example, 2.2 MPa, 2.3 MPa, 2.4 MPa, 2.5 MPa or 2.6 MPa, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0026] The present invention preferably sets the end point temperature of the second heat treatment within a specific range, which can further improve the mechanical properties and stability of the carbon fiber tube.

[0027] Preferably, the terminal temperature of the cooling treatment is 70-90°C, for example, it can be 70°C, 72°C, 74°C, 76°C, 78°C, 80°C, 82°C, 84°C, 86°C, 88°C or 90°C, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0028] Preferably, the holding time for the cooling treatment in step (3) is 30-50 min, for example, it can be 30 min, 32 min, 34 min, 36 min, 38 min, 40 min, 42 min, 44 min, 46 min, 48 min or 50 min, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0029] As a preferred technical solution of the present invention, the curing method comprises the following steps:

[0030] (1) heating the tube blank to be solidified to an end point temperature of 70-80° C., keeping the temperature for 10-20 min, and performing a first heat treatment to obtain a first tube blank; pressurizing during the first heat treatment, wherein the pressure during the first heat treatment is 1-1.4 MPa;

[0031] (2) heating the first tube blank obtained in step (1) to an end point temperature of 120-128° C., keeping the temperature for 1.5-2 hours, and performing a second heat treatment to obtain a second tube blank; applying pressure during the second heat treatment, and the pressure of the second heat treatment is 2.2-2.6 MPa;

[0032] (3) Cooling the second tube blank obtained in step (2) to an end point temperature of 70-90° C., and keeping the temperature for 30-50 minutes to obtain a carbon fiber tube.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] The curing method provided by the present invention can improve the mechanical properties of the carbon fiber tube. The obtained carbon fiber tube has high strength, good stability, and is not easy to deform. The vibration recovery time of the carbon fiber tube can be reduced to less than 39 seconds, and can be reduced to less than 21 seconds under optimal conditions. DETAILED DESCRIPTION

[0035] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0036] Example 1

[0037] This embodiment provides a method for curing a carbon fiber tube for semiconductor, the curing method comprising the following steps:

[0038] (1) heating the tube blank to be solidified to an end point temperature of 75° C. and keeping the temperature for 15 min to perform a first heat treatment to obtain a first tube blank; pressurizing during the first heat treatment, the pressure in the first heat treatment being 1.2 MPa;

[0039] (2) heating the first tube blank obtained in step (1) to an end point temperature of 125° C., maintaining the temperature for 1.8 h, and performing a second heat treatment to obtain a second tube blank; applying pressure during the second heat treatment, and the pressure of the second heat treatment is 2.4 MPa;

[0040] (3) Cooling the second tube blank obtained in step (2) to an end point temperature of 80° C. and keeping the temperature for 40 minutes to obtain a carbon fiber tube.

[0041] Example 2

[0042] This embodiment provides a method for curing a carbon fiber tube for semiconductor, the curing method comprising the following steps:

[0043] (1) heating the tube blank to be solidified to an end point temperature of 80° C. and keeping the temperature for 10 min to perform a first heat treatment to obtain a first tube blank; pressurizing during the first heat treatment, wherein the pressure during the first heat treatment is 1.1 MPa;

[0044] (2) heating the first tube blank obtained in step (1) to an end point temperature of 120° C., maintaining the temperature for 2 hours, and performing a second heat treatment to obtain a second tube blank; applying pressure during the second heat treatment, and the pressure of the second heat treatment is 2.5 MPa;

[0045] (3) Cooling the second tube blank obtained in step (2) to an end point temperature of 70° C. and keeping the temperature for 30 minutes to obtain a carbon fiber tube.

[0046] Example 3

[0047] This embodiment provides a method for curing a carbon fiber tube for semiconductor, the curing method comprising the following steps:

[0048] (1) heating the tube blank to be solidified to an end point temperature of 70° C. and keeping the temperature for 20 min to perform a first heat treatment to obtain a first tube blank; pressurizing during the first heat treatment, wherein the pressure during the first heat treatment is 1.3 MPa;

[0049] (2) heating the first tube blank obtained in step (1) to an end point temperature of 128° C., maintaining the temperature for 1.5 h, and performing a second heat treatment to obtain a second tube blank; applying pressure during the second heat treatment, and the pressure of the second heat treatment is 2.3 MPa;

[0050] (3) Cooling the second tube blank obtained in step (2) to an end point temperature of 90° C. and keeping the temperature for 50 minutes to obtain a carbon fiber tube.

[0051] Example 4

[0052] This embodiment provides a method for curing a carbon fiber tube for semiconductors, which is different from Embodiment 1 only in that the pressure in the first heat treatment is 0.8 MPa.

[0053] Example 5

[0054] This embodiment provides a method for curing a carbon fiber tube for semiconductors. The only difference from Embodiment 1 is that the pressure in the first heat treatment is 2 MPa.

[0055] Example 6

[0056] This embodiment provides a method for curing a carbon fiber tube for semiconductors. The only difference from Embodiment 1 is that the pressure in the second heat treatment is 1.5 MPa.

[0057] Example 7

[0058] This embodiment provides a method for curing a carbon fiber tube for semiconductors. The only difference from Embodiment 1 is that the pressure in the second heat treatment is 3 MPa.

[0059] Comparative Example 1

[0060] This comparative example provides a method for curing a carbon fiber tube for semiconductors, which is different from Example 1 only in that the first heat treatment is not performed, and the tube blank to be cured is directly subjected to the second heat treatment and the temperature reduction treatment.

[0061] Comparative Example 2

[0062] This comparative example provides a method for curing a carbon fiber tube for semiconductors, which is different from Example 1 only in that the second heat treatment is not performed, and the first tube blank is directly subjected to a temperature reduction treatment.

[0063] The vibration recovery time of the carbon fiber tubes prepared in Examples 1-7 and Comparative Examples 1-2 was determined by hanging a 2 kg weight on one end of the carbon fiber tube and fixing the other end. The weight was removed and the time for the carbon fiber tube to stop vibrating was tested. The results are shown in Table 1.

[0064] Table 1

[0065]

[0066]

[0067] From Table 1, we can see the following points:

[0068] (1) It can be seen from the data of Examples 1-7 that the curing method provided by the present invention can make the vibration recovery time of the carbon fiber tube reach less than 39 seconds, and less than 21 seconds under optimal conditions.

[0069] (2) Comprehensive comparison of the data of Example 1 and Examples 4-5 shows that the pressure of the first heat treatment in Example 1 is 1.2 MPa, compared with 0.8 MPa and 2 MPa in Examples 4-5, respectively. The vibration recovery time in Example 1 is significantly lower than that in Examples 4-5. It can be seen that the present invention preferably controls the pressure of the first heat treatment, which can further improve the stability of the carbon fiber tube.

[0070] (3) Comprehensive comparison of the data of Example 1 and Examples 6-7 shows that the pressure of the second heat treatment in Example 1 is 2.4 MPa, compared with 1.5 MPa and 3 MPa in Examples 6-7, respectively. The vibration recovery time in Example 1 is significantly lower than that in Examples 6-7. It can be seen that the present invention preferably controls the pressure of the second heat treatment, which can further improve the stability of the carbon fiber tube.

[0071] (4) Comprehensive comparison of the data of Example 1 and Comparative Examples 1-2 shows that the only difference between Comparative Example 1 and Example 1 is that the first heat treatment is not performed, and the only difference between Comparative Example 2 and Example 1 is that the second heat treatment is not performed. The vibration recovery time in Example 1 is significantly lower than that in Comparative Examples 1-2. It can be seen that the curing method provided by the present invention can improve the stability of the carbon fiber tube.

[0072] In summary, the curing method provided by the present invention can improve the mechanical properties of the carbon fiber tube, and the obtained carbon fiber tube has high strength, good stability, and is not easy to deform.

[0073] The applicant declares that the above is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention shall fall within the protection scope and disclosure scope of the present invention.

Claims

1. A method for curing a carbon fiber tube for semiconductor, characterized in that: The curing method comprises the following steps: (1) subjecting the tube blank to be solidified to a first heat treatment to obtain a first tube blank; the terminal temperature of the first heat treatment is 70-80° C.; pressurizing is performed during the first heat treatment; the pressure during the first heat treatment is 1-1.4 MPa; (2) subjecting the first tube blank obtained in step (1) to a second heat treatment to obtain a second tube blank; the terminal temperature of the second heat treatment is 120-128° C.; pressurizing is performed during the second heat treatment; the pressure of the second heat treatment is 2.2-2.6 MPa; (3) The second tube blank obtained in step (2) is subjected to a cooling treatment to obtain a carbon fiber tube.

2. The curing method according to claim 1, characterized in that: The holding time of the first heat treatment in step (1) is 10-20 minutes.

3. The curing method according to claim 1, characterized in that: The holding time of the second heat treatment in step (2) is 1.5-2h.

4. The curing method according to claim 1, characterized in that: The terminal temperature of the cooling treatment in step (3) is 70-90°C.

5. The curing method according to claim 1, characterized in that: The holding time of the cooling treatment in step (3) is 30-50 minutes.

6. The curing method according to claim 1, characterized in that: The curing method comprises the following steps: (1) heating the tube blank to be solidified to an end point temperature of 70-80° C., keeping the temperature for 10-20 min, and performing a first heat treatment to obtain a first tube blank; pressurizing during the first heat treatment, wherein the pressure during the first heat treatment is 1-1.4 MPa; (2) heating the first tube blank obtained in step (1) to an end point temperature of 120-128° C., keeping the temperature for 1.5-2 hours, and performing a second heat treatment to obtain a second tube blank; applying pressure during the second heat treatment, and the pressure of the second heat treatment is 2.2-2.6 MPa; (3) Cooling the second tube blank obtained in step (2) to an end point temperature of 70-90° C., and keeping the temperature for 30-50 minutes to obtain a carbon fiber tube.

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