A method for designing a polar conversion device aging board and a structure thereof
By setting up commutation sockets and plug-in boards on the aging board, the automatic polarity switching of semiconductor devices is realized, which solves the problems of easy device damage, poor quality consistency and low efficiency in the existing technology, and improves production efficiency and reduces costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
- Filing Date
- 2022-12-15
- Publication Date
- 2026-04-21
AI Technical Summary
Existing bidirectional device power aging equipment is prone to damaging devices during polarity reversal, resulting in poor quality consistency, low production efficiency, high cost, and low efficiency of manual operation.
Design an aging board with a polarity conversion device. By setting multiple reversing sockets and plugs on the aging board, the polarity conversion of the device electrodes can be automatically realized, avoiding manual operation one by one.
It improves device quality reliability and consistency, enhances commutation operation efficiency, and reduces costs.
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Figure CN115980534B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of semiconductor devices, and more specifically to the field of power aging of discrete semiconductor devices. In particular, it relates to a design method and structure of a semi-aging plate with a polarity conversion device. Background Technology
[0002] Bidirectional devices (such as bidirectional Zener diodes and bidirectional transient voltage suppressor diodes) are widely used in electronic circuits. To ensure the long-term quality and reliability of these bidirectional electronic devices, the device manufacturers will conduct electrical aging screening tests on them before they are put into use to eliminate early failure products and ensure the quality and reliability of the devices.
[0003] With the advancement of technology, existing aging equipment not only performs aging screening but also has real-time monitoring capabilities. However, for this type of aging equipment, such as... Figure 1 As shown, if it is used for screening bidirectional devices, due to the limitations of the equipment, when the electrodes loaded on both ends of the bidirectional device need to be changed, the polarity of each device needs to be reversed one by one. The whole process is time-consuming and the work efficiency is extremely low, which cannot meet the needs of the current increase in contract volume.
[0004] Meanwhile, to solve the above problems, if the equipment is modified to have a polarity reversal function, the cost of modifying the equipment would be huge because the wiring of the aging board includes sampling lines (data acquisition lines) and loading lines (power lines). The sampling lines and loading lines cannot be interchanged.
[0005] For this type of aging equipment, the reversing operation during the power aging process mainly relies on manual operation (reversing the devices one by one in the screening station). This reversing technology has the following problems:
[0006] 1) During the commutation operation, scratches may inevitably be caused to the coating on the surface of the device, affecting the solderability of the device.
[0007] 2) Scratches on the surface coating expose the substrate material to the external environment, causing corrosion and oxidation of the substrate material, which in turn introduces foreign matter into the electronic circuit and reduces the reliability of the electronic circuit.
[0008] 3) The reversing operation is carried out manually by changing the orientation of each device in the screening station. The reversing operation is inefficient and labor-intensive.
[0009] In view of this, the present invention is hereby proposed. Summary of the Invention
[0010] The technical problem this invention aims to solve is to address the issues of easy damage to devices, poor quality consistency, low production efficiency, significant quality risks, and high costs associated with existing bidirectional device power aging equipment during polarity reversal. This invention eliminates the need for individual reversal operations on each device in the screening station, thus avoiding plating scratches and pin damage caused by the reversal process, improving device reliability, and increasing reversal operation efficiency.
[0011] Therefore, the present invention provides a method for designing an aging plate with a polarity conversion device, comprising the following methods:
[0012] (1) According to the polarity of the semiconductor device, multiple reversing sockets (slot-shaped or hole-shaped structures) that are electrically connected to the electrodes of the semiconductor device are set on the aging board.
[0013] (2) Based on the aging circuit structure of semiconductor devices, a commutation plug-in that matches the commutation socket is set up. The commutation plug-in is an integrated circuit with electrode jumper connection and is inserted into the commutation socket in the form of gold fingers.
[0014] (3) The polarity conversion is achieved by combining different reversing plugs and reversing sockets in electrical connection.
[0015] An aging board structure employing the aforementioned design method for an aging board with a polarity conversion device, such as... Figure 2-6 As shown. It includes the aging board motherboard, sampling switching device, and loading switching device.
[0016] The sampling reversing device consists of a reversing device socket and a sampling reversing device insert plate. The loading reversing device consists of a reversing device socket and a loading reversing device insert plate. There are at least two reversing device sockets, which are installed on the aging board motherboard. By inserting the sampling reversing device insert plate and the loading reversing device insert plate into different reversing device sockets, the polarity of the power loading can be reversed.
[0017] The aging board motherboard includes: aging board motherboard body 101, aging board motherboard plug 102, aging board motherboard interface electrode 103, aging board motherboard device under test fixture 104, aging board motherboard circuit module 105, steering device socket A106, and steering device socket B107.
[0018] The aging board motherboard body 101 is provided with an aging board motherboard plug 102, an aging board motherboard interface electrode 103, an aging board motherboard device under test fixture 104, an aging board motherboard circuit module 105, a steering device socket A106 and a steering device socket B107, and is electrically connected through metal wiring on the aging board motherboard body 101 according to the aging circuit design requirements.
[0019] The sampling reversing device includes: a sampling reversing device plug plate 2, a sampling reversing device plug plate body 201, a sampling reversing device plug plate plug 202, a sampling reversing device plug plate station electrode 203, a sampling reversing device plug plate circuit module 204, a sampling reversing device plug plate station electrode through hole 205, a reversing device socket A106, and a reversing device socket B107.
[0020] The sampling steering device insert plate body 201 is provided with a sampling steering device insert plate plug 202, a sampling steering device insert plate station electrode 203, a sampling steering device insert plate circuit module 204, and a sampling steering device insert plate station electrode through hole 205. According to the sampling steering circuit design requirements, electrical connections are made through the metal wiring on the sampling steering device insert plate body 201 and the steering device socket A106 and steering device socket B107.
[0021] The loading reversing device includes: a loading reversing device insert plate 3, a loading reversing device insert plate body 301, a loading reversing device insert plate plug 302, a loading reversing device insert plate polarity electrode 303, a loading reversing device insert plate station electrode 304, a loading reversing device insert plate circuit module 305, a loading reversing device insert plate polarity electrode through hole 306, a steering device socket A106, and a steering device socket B107.
[0022] The loading commutation device plug body 301 is provided with a loading commutation device plug 302, a loading commutation device plug polarity electrode 303, a loading commutation device plug station electrode 304, a loading commutation device plug circuit module 305, and a loading commutation device plug polarity electrode through hole 306. According to the loading commutation circuit design requirements, electrical connections are made through the metal wiring on the loading commutation device plug body 301 and the steering device socket A106 and steering device socket B107. Beneficial effects
[0023] This patent solves the problem of low polarity commutation efficiency in the aging and screening process of semiconductor devices. By inserting sampling commutation device inserts and loading commutation device inserts into different commutation device sockets, batch commutation of semiconductor devices during the aging process can be achieved without damaging the devices, with high quality consistency, high reliability, high production efficiency, and low cost.
[0024] It can be widely used in the fields of aging and screening of multipolar and multi-power semiconductor devices. Attached Figure Description
[0025] Figure 1 A schematic diagram of the power supply connection for an existing bidirectional device.
[0026] Figure 2 A schematic diagram of an aging board with a polarity conversion device.
[0027] Figure 3 Schematic diagram of a single-station sampling device.
[0028] Figure 4 Schematic diagram of a single-station loading device.
[0029] Figure 5 Schematic diagram of the multi-station sampling device.
[0030] Figure 6 Schematic diagram of the multi-station loading device.
[0031] Figure 7 Schematic diagram of a power strip with reversed power polarity for bidirectional devices.
[0032] Figure 8 Schematic diagram of the single-station sampling device and loading device placed in different positions.
[0033] Figure 9 Schematic diagram of the multi-station sampling device and loading device placed in different positions Figure 1 .
[0034] Figure 10 Schematic diagram of the multi-station sampling device and loading device placed in different positions Figure 2 .
[0035] In the diagram, 1 is the aging board mainboard, 101 is the aging board mainboard body, 102 is the aging board mainboard connector, 103 is the aging board mainboard interface electrode, 104 is the aging board mainboard device under test fixture, 105 is the aging board mainboard circuit module, 106 is the steering device socket A, 107 is the steering device socket B, 2 is the sampling commutation device board, 201 is the sampling commutation device board body, 202 is the sampling commutation device board connector, 203 is the sampling commutation device board station electrode, 204 is the sampling commutation device board circuit module, 205 is the sampling commutation device board station electrode through hole, 3 is the loading commutation device board, 301 is the loading commutation device board body, 302 is the loading commutation device board connector, 303 is the loading commutation device board polarity electrode, 304 is the loading commutation device board station electrode, 305 is the loading commutation device board circuit module, and 306 is the loading commutation device board polarity electrode through hole. Detailed Implementation
[0036] like Figure 2-10 As shown, taking the aging test of a semiconductor bidirectional Zener diode or a bidirectional transient voltage suppressor diode as an example, the specific implementation of the semi-aging board with a polarity reversal device is as follows:
[0037] like Figure 7As shown, the device under test is a bidirectional device D. One end of the bidirectional device D is connected to terminal a1 of the normally open socket interface, and terminal a2 of the normally open socket interface is connected to the negative terminal of the power supply through ammeter A. The other end of the bidirectional device D is connected to terminal b1 of the normally open socket interface, and terminal b2 of the normally open socket interface is connected to the negative terminal of the power supply through ammeter A. The positive terminal of the power supply is connected in series with two normally closed sockets and left floating. When no socket is inserted, the normally open socket interfaces a1 and a2 or b1 and b2 are open circuits. When no socket is inserted, the two ends of the socket interface are closed.
[0038] like Figure 3 As shown, for a single-station device, the sampling reversing device insert plate 2 is made by fabricating sampling reversing device insert plate station electrode 203 on the sampling reversing device insert plate body 201. The sampling reversing device insert plate station electrode 203 is located on the bottom and top surfaces of the sampling reversing device insert plate body 201 and is electrically connected through the sampling reversing device insert plate station electrode through hole 205.
[0039] like Figure 5 As shown, for a multi-station device, the sampling reversing device insert plate station electrode 203 has multiple electrodes, and its structure is the same as that of a single-station device.
[0040] like Figure 4 As shown, for a single-station device, the loading commutation device plug 302 has a loading commutation device plug plate polarity electrode 303 fabricated at one end of the loading commutation device plug plate body 301. The loading commutation device plug plate polarity electrode 303 is located on the bottom and top surfaces of the loading commutation device plug plate body 301 and is electrically connected through the loading commutation device plug plate polarity electrode through hole 306. A loading commutation device plug plate station electrode 304 is fabricated on the bottom surface of the other end of the loading commutation device plug plate body 301. The loading commutation device plug plate station electrode 304 and the loading commutation device plug plate polarity electrode 303 are electrically connected through bottom surface metal wiring.
[0041] like Figure 6 As shown, for a multi-station device, there are multiple station electrodes 304 of the loading commutation device insert plate, all of which are electrically connected to the polarity electrode 303 of the loading commutation device insert plate through bottom metal wiring. The structure of each station electrode is the same as that of the single station.
[0042] like Figure 8 As shown, during single-station aging, when the single-station sampling commutation device board and the single-station loading commutation device board are swapped, the current flow direction of the aging circuit is reversed, achieving the purpose of bidirectional device polarity commutation.
[0043] like Figure 9 , Figure 10As shown, during multi-station aging, when the multi-station sampling commutation device board and the multi-station loading commutation device board are swapped, the current flow direction of the batch aging circuit is reversed as a whole, achieving the purpose of overall polarity reversal of the batch bidirectional devices.
[0044] The operating mechanism is as follows:
[0045] Prior to the development of this invention, the schematic diagram of the single-station wiring circuit of the power aging equipment was as follows: Figure 1 As shown in the diagram, ammeter A is used to detect the current flowing through bidirectional device D, where D is a bidirectional device and FU is a fuse. As can be seen from the workstation wiring circuit diagram, to reverse the polarity of device D, its physical location must be changed.
[0046] like Figure 7 As shown, to achieve polarity reversal without changing the physical position of device D, when terminal a is negative, terminal b must be positive; conversely, when terminal b is negative, terminal a must be positive. Therefore, the anode and cathode are separated. If the anode is connected to a1, and b1 and b2 are connected, the current flows from terminal a1 through the bidirectional device D to terminal b1 and finally to the cathode. If the anode is connected to b1, and a1 and a2 are connected, the current flows from terminal b1 through the bidirectional device D to terminal a1 and finally to the cathode.
[0047] Single-station device such as Figure 8 As shown, to achieve the polarity reversal function, a polarity reversal device needs to be designed. The sampling device is responsible for connecting a1 and a2 or b1 and b2, and the loading device is responsible for applying a positive potential to a1 or b1. When the sampling device and the loading device are placed in different positions, the current direction is different.
[0048] Multi-station devices such as Figure 9-10 As shown, the current direction is different when the sampling device and the loading device are placed in different positions.
[0049] In practical use, simply swapping the positions of the sampling device and the loading device enables bidirectional device polarity switching, allowing multiple stations to switch polarities simultaneously. This avoids affecting the reliability of single-station devices by physically switching their polarities, while also improving the efficiency of polarity switching.
[0050] Finally, it should be noted that the above embodiments are merely examples for clear illustration. This invention includes, but is not limited to, the above embodiments, and it is neither necessary nor possible to exhaustively describe all possible implementations. Those skilled in the art can make other variations or modifications based on the above description. All implementation schemes that meet the requirements of this invention are within the protection scope of this invention.
Claims
1. A design method for an aging plate with a polarity conversion device, characterized in that, Including the following methods: (1) Based on the polarity of the semiconductor bidirectional device, multiple reversing sockets electrically connected to the electrodes of the semiconductor bidirectional device are set on the aging board; (2) Based on the aging circuit structure of the semiconductor bidirectional device, a commutation plug-in that matches the commutation socket is set. The commutation plug-in is an integrated circuit with electrode jumper connection and is inserted into the commutation socket in the form of gold fingers. (3) The polarity conversion is achieved by combining different reversing plugs and reversing sockets in electrical connection. The structure of the aging board includes an aging board main board, a sampling switching device, and a loading switching device; The sampling reversing device consists of a reversing device socket and a sampling reversing device plug-in plate. The loading reversing device consists of a reversing device socket and a loading reversing device plug-in plate. There are at least two reversing device sockets, which are installed on the aging board motherboard. By inserting the sampling reversing device plug-in plate and the loading reversing device plug-in plate into different reversing device sockets, the reversal of the power loading polarity can be achieved. The aging board motherboard includes: aging board motherboard body (101), aging board motherboard plug (102), aging board motherboard interface electrode (103), aging board motherboard device under test fixture (104), aging board motherboard circuit module (105), steering device socket A (106), steering device socket B (107). The aging board motherboard body (101) is provided with an aging board motherboard plug (102), an aging board motherboard interface electrode (103), an aging board motherboard device under test fixture (104), an aging board motherboard circuit module (105), a steering device socket A (106) and a steering device socket B (107). According to the aging circuit design requirements, electrical connections are made through the metal wiring on the aging board motherboard body (101). The sampling reversing device includes: a sampling reversing device plug plate (2), a sampling reversing device plug plate body (201), a sampling reversing device plug plate plug (202), a sampling reversing device plug plate station electrode (203), a sampling reversing device plug plate circuit module (204), a sampling reversing device plug plate station electrode through hole (205), a reversing device socket A (106), and a reversing device socket B (107). The sampling steering device plug body (201) is provided with a sampling steering device plug plug (202), a sampling steering device plug station electrode (203), a sampling steering device plug circuit module (204), and a sampling steering device plug station electrode through hole (205). According to the sampling steering circuit design requirements, electrical connections are made through the metal wiring on the sampling steering device plug body (201) and the steering device socket A (106) and steering device socket B (107). The loading reversing device includes: a loading reversing device insert plate (3), a loading reversing device insert plate body (301), a loading reversing device insert plate plug (302), a loading reversing device insert plate polarity electrode (303), a loading reversing device insert plate station electrode (304), a loading reversing device insert plate circuit module (305), a loading reversing device insert plate polarity electrode through hole (306), a steering device socket A (106), and a steering device socket B (107). The loading commutation device plug body (301) is provided with a loading commutation device plug (302), a loading commutation device plug polarity electrode (303), a loading commutation device plug station electrode (304), a loading commutation device plug circuit module (305), and a loading commutation device plug polarity electrode through hole (306). According to the loading commutation circuit design requirements, electrical connections are made through the metal wiring on the loading commutation device plug body (301) and the steering device socket A (106) and steering device socket B (107).
2. The design method of an aging plate with a polarity conversion device as described in claim 1, characterized in that, The reversing socket has a slot-shaped or hole-shaped structure.
3. The aging board structure of the aging board design method with polarity conversion device as described in claim 1, characterized in that, For a single-station device, the sampling reversing device insert plate (2) is made by fabricating sampling reversing device insert plate station electrode (203) on the sampling reversing device insert plate body (201). The sampling reversing device insert plate station electrode (203) is located on the bottom and top surfaces of the sampling reversing device insert plate body (201) and is electrically connected through the sampling reversing device insert plate station electrode through hole (205).
4. The aging board structure of the aging board design method with polarity conversion device as described in claim 1, characterized in that, For multi-station devices, the sampling reversing device inserts multiple station electrodes (203), and the structure is the same as that of single-station devices.
5. The aging board structure of the aging board design method with polarity conversion device as described in claim 1, characterized in that, For a single-station device, the loading commutation device plug (302) is made by creating a loading commutation device plug polarity electrode (303) at one end of the loading commutation device plug body (301). The loading commutation device plug polarity electrode (303) is located on the bottom and top surfaces of the loading commutation device plug body (301) and is electrically connected through the loading commutation device plug polarity electrode through hole (306). A loading commutation device plug station electrode (304) is made on the bottom surface of the other end of the loading commutation device plug body (301). The loading commutation device plug station electrode (304) and the loading commutation device plug polarity electrode (303) are electrically connected through bottom surface metal wiring.
6. The aging board structure according to the design method of the aging board with polarity conversion device as described in claim 1, characterized in that, For a multi-station device, there are multiple loading commutation device insert plate station electrodes (304), all of which are electrically connected to the loading commutation device insert plate polarity electrodes (303) through bottom metal wiring. The structure of each station electrode is the same as that of a single station.
7. The aging board structure according to the design method of the aging board with polarity conversion device as described in claim 1, characterized in that, The aging unit circuit is as follows: the device under test is a bidirectional device D. One end of the bidirectional device D is connected to the a1 end of the normally open socket interface, and the a2 end of the normally open socket interface is connected to the negative terminal of the power supply through ammeter A; the other end of the bidirectional device D is connected to the b1 end of the normally open socket interface, and the b2 end of the normally open socket interface is connected to the negative terminal of the power supply through ammeter A; the positive terminal of the power supply is connected in series with two normally closed sockets and then left floating.
8. The aging board structure of the aging board design method with polarity conversion device as described in claim 7, characterized in that, The multi-station aging circuit consists of aging unit circuits connected in parallel to form a batch aging circuit.
9. The aging board structure of the aging board design method with polarity conversion device as described in claim 8, characterized in that, When the positions of the multi-station sampling commutator plug and the multi-station loading commutator plug are interchanged, the current flow direction of the batch aging circuit is reversed.
Citation Information
Patent Citations
Burn-in board structure of semiconductor bidirectional device
CN220188649U