Semiconductor laser fiber-coupled module

Abstract

A semiconductor laser fiber coupling module comprises a tube shell, a fiber jumper, a nickel stainless steel sleeve and a Kovar alloy ring; the tube shell comprises a copper ring frame and a copper base, the copper ring frame is open at both ends in the up-down direction, the copper ring frame is provided with a through hole penetrating through the copper ring frame in the direction intersecting the up-down direction, and the copper base seals and closes the copper ring frame from below; the copper base and the copper ring frame are integrally formed as a single piece; the Kovar alloy ring is sealingly installed in the through hole of the copper ring frame, the Kovar alloy ring has an outer peripheral surface and an axial outer end surface, the outer peripheral surface of the Kovar alloy ring is sealed with the through hole of the copper ring frame, and the axial outer end surface of the Kovar alloy ring is exposed outside the copper ring frame; the nickel stainless steel sleeve is sleeved on the outer periphery of the end portion of the fiber jumper and exposes the end portion of the fiber jumper, and the nickel stainless steel sleeve has an axial end surface; the exposed end portion of the fiber jumper is inserted into the Kovar alloy ring from the outside of the copper ring frame; and the axial end surface of the nickel stainless steel sleeve and the axial outer end surface of the Kovar alloy ring face each other and are laser welded together.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor lasers, and more specifically to a semiconductor laser fiber coupling module. Background Technology

[0002] Semiconductor laser fiber coupling modules are widely used in fields such as laser pumping, medical applications, and industrial processing.

[0003] Chinese Utility Model Patent Application Publication No. CN204758877U, authorized on November 11, 2015, discloses a fiber coupling module for a high-power semiconductor laser. To reduce the weight of the housing, it employs a separate structure with an aluminum upper shell and a copper bottom heat sink. The fiber optic patch cord is clamped and sealed by grooves that mate with the upper shell and the bottom heat sink. This separate structure requires sealing during assembly, and the sealing between the upper shell and the bottom heat sink, as well as between the upper shell / bottom heat sink and the fiber optic patch cord, complicates the sealing process. Furthermore, the differences in thermal expansion coefficients, thermal conductivity, and strength between the different materials of the upper shell and the bottom heat sink can cause deformation during high-temperature welding, affecting the sealing performance and leading to uneven heat dissipation during use. Summary of the Invention

[0004] In view of the problems existing in the background art, the purpose of this disclosure is to provide a semiconductor laser fiber coupling module that can at least reduce the complexity of the housing sealing operation and improve the airtightness.

[0005] Therefore, in some embodiments, a semiconductor laser fiber coupling module includes a housing, a fiber optic patch cord, a nickel-stainless steel sleeve, and a Kovar alloy ring. The housing includes a copper ring frame and a copper base. The copper ring frame is open at both ends in the vertical direction and has a through hole extending through it in a direction intersecting the vertical direction. The copper base seals the copper ring frame from below, and the copper base and the copper ring frame are integrally formed single pieces. The Kovar alloy ring is sealed and installed in the through hole of the copper ring frame. The Kovar alloy ring has an outer peripheral surface and an axial outer end face. The outer peripheral surface of the Kovar alloy ring forms a seal with the through hole of the copper ring frame, and the axial outer end face of the Kovar alloy ring is exposed outside the copper ring frame. The nickel-stainless steel sleeve is fitted around the outer periphery of the end of the fiber optic patch cord, exposing the end of the fiber optic patch cord. The nickel-stainless steel sleeve has an axial end face. The exposed end of the fiber optic patch cord is inserted into the Kovar alloy ring from outside the copper ring frame. The axial end face of the nickel-stainless steel sleeve and the axial outer end face of the Kovar alloy ring face each other and are laser-welded together.

[0006] In some embodiments, the through-hole of the tube shell includes a first through-hole, a second through-hole, and a connecting surface; the diameter of the first through-hole is larger than the diameter of the second through-hole, the second through-hole communicates with the first through-hole, the second through-hole is located inside the copper ring frame relative to the first through-hole, the connecting surface is transverse to the first through-hole and the second through-hole, the connecting surface connects the first through-hole and the second through-hole, and the first through-hole and the connecting surface form a receiving recess; the Kovar alloy ring includes a cylinder and a flange, the outer peripheral surface of the Kovar alloy ring is formed by the outer peripheral surface of the cylinder and the outer peripheral surface of the flange, and the axial outer end face of the Kovar alloy ring is formed by the axial outer surface of the flange; the flange extends radially outward from the outer peripheral edge of the cylinder, the flange is sealed and positioned in the receiving recess, and the cylinder is sealed and positioned in the second through-hole.

[0007] In some embodiments, the outer peripheral surface of the flange has an arcuate portion and a flat portion; the first through hole has an arcuate portion and a flat portion, the arcuate portion of the first through hole is complementary in shape to the arcuate portion of the flange, and the flat portion of the first through hole is complementary in shape to the flat portion of the flange.

[0008] In some embodiments, the axial outer surface of the flange is flush with the surface surrounding the through hole of the copper ring frame.

[0009] In some embodiments, the semiconductor laser fiber coupling module further includes a cover plate that seals the copper ring frame from above.

[0010] In some embodiments, the semiconductor laser fiber coupling module further includes an annular solder pad, and the cover plate is eutectic welded to the top surface of the copper ring frame via the annular solder pad.

[0011] In some embodiments, the semiconductor laser fiber coupling module further includes an optical window that seals the through-hole of the copper ring frame from the inside.

[0012] In some embodiments, the Kovar alloy ring includes a cylinder and a groove, the groove being located within the cylinder and extending radially outward from the cylinder, with the light window seal positioned within the groove.

[0013] In some embodiments, the semiconductor laser fiber coupling module further includes a solder ring disposed on the outer periphery of the optical window, the optical window abutting against a groove and the solder ring located within the groove, the solder ring sintering the peripheral surface of the optical window to the wall of the groove of the Kovar alloy ring.

[0014] In some embodiments, the Kovar alloy ring includes a cylindrical body, the inner end face of which is spaced apart from the inner wall of the copper ring frame, and the semiconductor laser fiber coupling module further includes a solder ring; the optical window abuts against the inner end face of the cylindrical body, and the solder ring is disposed on the outer periphery of the optical window, and the solder ring sintersects the peripheral surface of the optical window with the wall at the through hole of the copper ring frame.

[0015] The beneficial effects of this disclosure are as follows: In the fiber optic coupling module of the semiconductor laser, the copper base and copper ring frame are integrally formed as a single piece, eliminating the need for a connection and sealing process between the upper shell and the bottom heat sink, which is a separate design as mentioned in the background art. This reduces the complexity of the shell sealing operation. Furthermore, since both the copper base and the copper ring frame are made of copper, the differences in thermal expansion coefficients, thermal conductivity, and strength between the upper shell and the bottom heat sink due to different materials, as mentioned in the background art, avoid the problems of deformation of the upper shell and bottom heat sink during high-temperature welding, affecting sealing performance, and causing uneven heat dissipation during use, thus improving airtightness. In addition, the copper ring frame itself has through holes, and the fiber optic patch cord is sealed at these holes, avoiding the sealing operation complexity caused by the grooves used to clamp the upper shell and bottom heat sink, as mentioned in the background art. Furthermore, by laser welding the axial end face of the nickel-stainless steel sleeve fitted onto the end of the fiber optic patch cord to the axial outer end face of the Kovar alloy ring sealed in the through hole of the copper ring frame, the characteristic that both contain nickel is fully utilized. Thus, the axial end face and the axial outer end face will form a nickel alloy through laser melting, which greatly improves the sealing performance and connection strength of the axial end face of the nickel-stainless steel sleeve 3 and the axial outer end face of the Kovar alloy ring. Attached Figure Description

[0016] Figure 1 This is an assembly diagram of a semiconductor laser fiber coupling module according to the present disclosure.

[0017] Figure 2 yes Figure 1 An exploded view of the portion with the cover plate removed.

[0018] Figure 3 yes Figure 2 A further exploded view, in which fiber optic patch cords are not shown.

[0019] Figure 4 yes Figure 3 A three-dimensional view of the housing of a semiconductor laser fiber coupling module from another angle.

[0020] Figure 5 From and Figure 4 A three-dimensional view of the tube shell viewed from the opposite angle.

[0021] Figure 6 yes Figure 2 A three-dimensional view of the fiber optic patch cord of the semiconductor laser fiber coupling module from another angle.

[0022] Figure 7 yes Figure 3 A three-dimensional view of the Kovar alloy ring of the semiconductor laser fiber coupling module from another angle.

[0023] Figure 8 From and Figure 7 A three-dimensional view of the Kovar alloy ring viewed from the opposite angle.

[0024] Figure 9 This is a three-dimensional view of the optical window and solder ring of the semiconductor laser fiber coupling module from another angle.

[0025] Figure 10 From and Figure 9 A three-dimensional view of the light window and solder ring viewed from opposite angles.

[0026] The reference numerals in the attached figures are explained below.

[0027] 100 Semiconductor Laser Fiber Coupler Module with Nickel-Stainless Steel Sleeve

[0028] D Up and down direction 31 Axial end face

[0029] 1. Shell and 4. Kovar alloy rings

[0030] 11 Copper Ring Frame 41 Outer Peripheral Surface

[0031] 111 Through Hole 42 Axial Outer End Face

[0032] 111a First through hole 43 cylinder body

[0033] 111a1 arc face 431 inner end face

[0034] 111a2 Flat part 44 flange

[0035] 111b Second Through Hole 441 Arc-shaped Part

[0036] 111c connecting surface 442 flat part

[0037] R receiving recess 443 axial outer surface

[0038] 112 Inner wall 45 groove

[0039] 113 Top Surface 5 Cover Plate

[0040] 12 copper bases and 6 ring-shaped welding pieces

[0041] 2 fiber optic patch cords and 7 transition rings

[0042] 21 end 8 light windows

[0043] 22 fiber cores and 9 solder rings

[0044] 23-layer cladding 10A positive terminal

[0045] 24 Insulating Protective Cover 10B Negative Terminal Detailed Implementation

[0046] The accompanying drawings illustrate embodiments of this disclosure, and it will be understood that the disclosed embodiments are merely examples of this disclosure, which can be implemented in various forms. Therefore, the specific details disclosed herein should not be construed as limiting, but are intended only as the basis for the claims and as an illustrative basis to teach those skilled in the art how to implement this disclosure in various ways.

[0047] Reference Figures 1 to 3 as well as Figure 6 and Figure 7 The semiconductor laser fiber coupling module 100 includes a housing 1, a fiber optic patch cord 2, a nickel-stainless steel sleeve 3, and a Kovar alloy ring 4. The housing 1 includes a copper ring frame 11 and a copper base 12. The copper ring frame 11 is open at both ends in the vertical direction D. The copper ring frame 11 has a through hole 111 extending through it in a direction intersecting the vertical direction D. The copper base 12 seals the copper ring frame 11 from below. The copper base 12 and the copper ring frame 11 are integrally formed. The Kovar alloy ring 4 is sealed and installed within the through hole 111 of the copper ring frame 11. The Kovar alloy ring 4 has an outer peripheral surface 41 and an axial outer end face 42. The outer peripheral surface 41 of the Kovar alloy ring 4 forms a seal with the through hole 111 of the copper ring frame 11, while the axial outer end face 42 of the Kovar alloy ring 4 protrudes outward from the copper ring frame 11. A nickel-stainless steel sleeve 3 is fitted around the outer periphery of the end 21 of the fiber optic patch cord 2, exposing the end 21. The nickel-stainless steel sleeve 3 has an axial end face 31. The exposed end 21 of the fiber optic patch cord 2 is inserted into a Kovar alloy ring 4 from outside the copper ring frame 11. The axial end face 31 of the nickel-stainless steel sleeve 3 and the axial outer end face 42 of the Kovar alloy ring 4 face each other and are laser welded together.

[0048] In the semiconductor laser fiber coupling module 100, the copper base 12 and the copper ring frame 11 are integrally formed as a single piece, eliminating the need for a connection and sealing process between the upper shell and the bottom heat sink, which is a separate design as mentioned in the background art. This reduces the complexity of the shell sealing operation. Furthermore, since both the copper base 12 and the copper ring frame 11 are made of copper, the differences in thermal expansion coefficients, thermal conductivity, and strength between the upper shell and the bottom heat sink due to different materials, as mentioned in the background art, avoid the problems of deformation of the upper shell and bottom heat sink during high-temperature welding, affecting sealing performance, and causing uneven heat dissipation during use, thus improving airtightness. In addition, the copper ring frame 11 itself has a through hole 111, and the fiber optic patch cord 2 is sealed at the through hole 111, avoiding the sealing operation complexity caused by the grooves used to clamp the upper shell and bottom heat sink, as mentioned in the background art. Furthermore, by laser welding the axial end face 31 of the nickel-stainless steel sleeve 3 fitted onto the end 21 of the fiber optic patch cord 2 to the axial outer end face 42 of the Kovar alloy ring 4 sealed within the through hole 111 of the copper ring frame 11, the characteristic that both contain nickel is fully utilized. Thus, the axial end face 31 and the axial outer end face 42 will form a nickel alloy through laser melting, which greatly improves the sealing performance and connection strength of the axial end face 31 of the nickel-stainless steel sleeve 3 and the axial outer end face 42 of the Kovar alloy ring 4.

[0049] The through hole 111 preferably extends through the copper ring frame 11 in a direction perpendicular to the vertical direction D.

[0050] like Figure 4 , Figure 5 , Figure 7 and Figure 8As shown, the through hole 111 of the casing 1 may include a first through hole 111a, a second through hole 111b, and a connecting surface 111c. The diameter of the first through hole 111a is larger than the diameter of the second through hole 111b. The second through hole 111b is connected to the first through hole 111a. The second through hole 111b is located inside the copper ring frame 11 relative to the first through hole 111a. The connecting surface 111c is transversely intersecting the first through hole 111a and the second through hole 111b. The connecting surface 111c connects the first through hole 111a and the second through hole 111b. The first through hole 111a and the connecting surface 111c form a receiving recess R. Accordingly, the Kovar alloy ring 4 may include a cylindrical body 43 and a flange 44. The outer peripheral surface 41 of the Kovar alloy ring 4 is formed by the outer peripheral surface of the cylindrical body 43 and the outer peripheral surface of the flange 44. The axial outer end face 42 of the Kovar alloy ring 4 is formed by the axial outer surface 443 of the flange 44. The flange 44 extends radially outward from the outer peripheral edge of the cylindrical body 43 and is sealed and positioned within the receiving recess R. The cylindrical body 43 is sealed and positioned within the second through hole 111b. Through the cooperation of the flange 44 and the receiving recess R, the Kovar alloy ring 4 is positioned in the through hole 111 of the shell 1. Since the receiving recess R is formed by the first through hole 111a and the connecting surface 111c forming a step, the sealing performance between the flange 44 and the receiving recess R is enhanced. Through the cooperation between the cylindrical body 43 and the second through hole 111b, the sealing performance between the Kovar alloy ring 4 and the through hole 111 is further enhanced. The sealing of flange 44 can be achieved through an interference fit between the outer peripheral surface of flange 44 and the wall of the first through hole 111a. Similarly, the sealing of cylinder 43 can be achieved through an interference fit between the outer peripheral surface of cylinder 43 and the wall of the second through hole 111b. Furthermore, to further enhance the sealing performance, a curable adhesive can be injected between the outer peripheral surface of flange 44 and the wall of the first through hole 111a, and between the outer peripheral surface of cylinder 43 and the wall of the second through hole 111b. Of course, the curable adhesive can be used alone to replace the interference fit. In one example, the connecting surface 111c is perpendicular to both the first through hole 111a and the second through hole 111b.

[0051] like Figure 4 , Figure 7 and Figure 8 As shown, the outer peripheral surface of the flange 44 may have an arcuate portion 441 and a flat portion 442. Correspondingly, the first through hole 111a has an arcuate portion 111a1 and a flat portion 111a2. The arcuate portion 111a1 of the first through hole 111a is complementary in shape to the arcuate portion 441 of the flange 44, and the flat portion 111a2 of the first through hole 111a is complementary in shape to the flat portion 442 of the flange 44. Thus, it is not only convenient to position the cylinder 43 in the through hole 111, but also the stability of the cylinder 43 fixed in the through hole 111 is improved (especially under the aforementioned interference fit).

[0052] like Figure 2As shown, the axial outer surface 443 of the flange 44 is flush with the surface surrounding the through hole 111 of the copper ring frame 11. Therefore, the Kovar alloy ring 4 does not occupy additional space, improving the space utilization of the copper ring frame 11.

[0053] Similarly, the inner end face 431 of the cylinder 43 does not protrude into the inner wall 112 of the copper ring frame 11, thereby improving the utilization rate of the internal space of the copper ring frame 11.

[0054] Reference Figure 2 and Figure 6 The fiber optic patch cord 2 includes a fiber core 22, a cladding 23, and an insulating protective sleeve 24 arranged radially from the inside out.

[0055] Nickel-stainless steel sleeves 3 can be, for example, but are not limited to, 304 stainless steel. Note that nickel-stainless steel is sometimes also referred to as nickel-containing stainless steel. (See reference...) Figure 1 The semiconductor laser fiber coupling module 100 also includes a cover plate 5. The cover plate 5 seals the copper ring frame 11 from above. The material of the cover plate 5 is, for example, but not limited to, 4J42.

[0056] Furthermore, such as Figure 3 As shown, the semiconductor laser fiber coupling module 100 also includes an annular solder pad 6, and the cover plate 5 is eutectic welded to the top surface 113 of the copper ring frame 11 via the annular solder pad 6. Eutectic welding improves the robustness, reliability, and airtightness of the connection between the cover plate 5 and the copper ring frame 11. Eutectic welding is achieved through high-temperature reflow soldering.

[0057] The material of the annular solder pad 6 is, for example, but not limited to, indium (In) solder pad.

[0058] Furthermore, the semiconductor laser fiber coupling module 100 also includes a transition ring 7. The transition ring 7 is disposed between the cover plate 5 and the annular solder pad 6 along the vertical direction D. The transition ring is an AgCu ring.

[0059] Reference Figure 2 , Figure 3 , Figure 9 and Figure 10 The semiconductor laser fiber coupling module 100 also includes an optical window 8. The optical window 8 seals the through hole 111 of the copper ring frame 11 from the inside. The material of the optical window 8 is, for example, but not limited to, glass.

[0060] like Figure 8 As shown, the Kovar alloy ring 4 includes a cylinder 43 and a groove 45. The groove 45 is located inside the cylinder 43 and extends radially outward from the cylinder 43. The light window 8 is sealed and positioned inside the groove 45.

[0061] Furthermore, the semiconductor laser fiber coupling module 100 also includes a solder ring 9, which is disposed on the outer periphery of the optical window 8. The optical window 8 abuts against the groove 45, and the solder ring 9 is located within the groove 45. The solder ring 9 sintersects the peripheral surface of the optical window 8 with the wall of the Kovar alloy ring 4 at the groove 45. Through sintering, the robustness, reliability, and hermeticity of the connection between the optical window 8 and the Kovar alloy ring 4 are improved.

[0062] In an alternative embodiment (not shown), the inner end face 431 of the cylindrical body 43 is spaced apart from the inner wall 112 of the copper ring frame 11. The semiconductor laser fiber coupling module 100 also includes a solder ring 9. The optical window 8 abuts against the inner end face 431 of the cylindrical body 43, and the solder ring 9 is disposed on the outer periphery of the optical window 8. The solder ring 9 sintersects the peripheral surface of the optical window 8 with the wall at the through hole 111 of the copper ring frame 11. The optical window 8 and the solder ring 9 further enhance the seal between the cylindrical body 43 and the through hole 111. Similarly, through sintering, the robustness, reliability, and airtightness of the connection between the optical window 8 and the copper ring frame 11 at the through hole 111 are improved.

[0063] The material of solder ring 9 is, for example, but not limited to, AuSn.

[0064] like Figure 2 , Figure 3 As shown, the semiconductor laser fiber coupling module 100 also includes a positive terminal 10A and a negative terminal 10B, which are sealed through the copper ring frame 11 for connection to a laser chip (not shown) disposed on the copper base 12 and located within the copper ring frame 11.

[0065] Several exemplary embodiments have been described in detail above, but this document is not intended to limit itself to the explicitly disclosed combinations. Therefore, unless otherwise stated, the various features disclosed herein can be combined to form several other combinations, which are not shown for simplicity.

Claims

1. A semiconductor laser fiber coupling module (100), characterized in that, It includes a housing (1), an optical fiber patch cord (2), a nickel-stainless steel sleeve (3), and a Kovar alloy ring (4). The shell (1) includes a copper ring frame (11) and a copper base (12). The copper ring frame (11) is open at both ends in the vertical direction (D). The copper ring frame (11) is provided with a through hole (111) that runs through the copper ring frame (11) in the direction intersecting with the vertical direction (D). The copper base (12) seals the copper ring frame (11) from below. The copper base (12) and the copper ring frame (11) are a single piece integrally formed. Kovar alloy ring (4) is sealed and installed in the through hole (111) of copper ring frame (11). Kovar alloy ring (4) has an outer peripheral surface (41) and an axial outer end face (42). The outer peripheral surface (41) of Kovar alloy ring (4) forms a seal with the through hole (111) of copper ring frame (11), and the axial outer end face (42) of Kovar alloy ring (4) is exposed to the outside of copper ring frame (11). The nickel-stainless steel sleeve (3) is fitted around the outer periphery of the end (21) of the fiber optic patch cord (2) and exposes the end (21) of the fiber optic patch cord (2). The nickel-stainless steel sleeve (3) has an axial end face (31). The exposed end (21) of the fiber optic patch cord (2) is inserted into the Kovar alloy ring (4) from the outside of the copper ring frame (11). The axial end face (31) of the nickel stainless steel sleeve (3) and the axial outer end face (42) of the Kovar alloy ring (4) face each other and are laser welded together; The through hole (111) of the shell (1) includes a first through hole (111a), a second through hole (111b) and a connecting surface (111c). The diameter of the first through hole (111a) is larger than the diameter of the second through hole (111b). The second through hole (111b) is connected to the first through hole (111a). The second through hole (111b) is located inside the copper ring frame (11) relative to the first through hole (111a). The connecting surface (111c) is transverse to the first through hole (111a) and the second through hole (111b). The connecting surface (111c) connects the first through hole (111a) and the second through hole (111b). The first through hole (111a) and the connecting surface (111c) form a receiving recess (R). Kovar alloy ring (4) includes a cylinder (43) and a flange (44). The outer peripheral surface (41) of Kovar alloy ring (4) is formed by the outer peripheral surface of the cylinder (43) and the outer peripheral surface of the flange (44). The axial outer end face (42) of Kovar alloy ring (4) is formed by the axial outer surface (443) of the flange (44). The flange (44) extends radially outward from the outer periphery of the cylinder (43), and the flange (44) is sealed and positioned in the receiving recess (R), and the cylinder (43) is sealed and positioned in the second through hole (111b).

2. The semiconductor laser fiber coupling module (100) according to claim 1, characterized in that, The outer peripheral surface of the flange (44) has an arc-shaped portion (441) and a flat portion (442). The first through hole (111a) has an arcuate portion (111a1) and a flat portion (111a2). The arcuate portion (111a1) of the first through hole (111a) is complementary in shape to the arcuate portion (441) of the flange (44), and the flat portion (111a2) of the first through hole (111a) is complementary in shape to the flat portion (442) of the flange (44).

3. The semiconductor laser fiber coupling module (100) according to claim 1, characterized in that, The axial outer surface (443) of the flange (44) is flush with the surface around the through hole (111) of the copper ring frame (11).

4. The semiconductor laser fiber coupling module (100) according to claim 1, characterized in that, The semiconductor laser fiber coupling module (100) also includes a cover plate (5) that seals the copper ring frame (11) from above.

5. The semiconductor laser fiber coupling module (100) according to claim 4, characterized in that, The semiconductor laser fiber coupling module (100) also includes a ring-shaped solder pad (6). The cover plate (5) is eutectic welded to the top surface (113) of the copper ring frame (11) via annular weld pad (6).

6. The semiconductor laser fiber coupling module (100) according to claim 1, characterized in that, The semiconductor laser fiber coupling module (100) also includes an optical window (8). The light window (8) seals the through hole (111) of the copper ring frame (11) from the inside.

7. The semiconductor laser fiber coupling module (100) according to claim 6, characterized in that, The Kovar alloy ring (4) includes a cylindrical body (43) and a groove (45). The groove (45) is located inside the cylinder (43) and extends radially outward from the cylinder (43), and the light window (8) is sealed and positioned inside the groove (45).

8. The semiconductor laser fiber coupling module (100) according to claim 7, characterized in that, The semiconductor laser fiber coupling module (100) also includes a solder ring (9). The solder ring (9) is set on the outer periphery of the light window (8), the light window (8) abuts against the groove (45) and the solder ring (9) is located in the groove (45). The solder ring (9) sintersects the periphery of the light window (8) with the wall of the groove (45) of the Kovar alloy ring (4).

9. The semiconductor laser fiber coupling module (100) according to claim 6, characterized in that, The Kovar alloy ring (4) includes a cylindrical body (43), the inner end face (431) of which is spaced apart from the inner wall (112) of the copper ring frame (11). The semiconductor laser fiber coupling module (100) also includes a solder ring (9); The light window (8) abuts against the inner end face (431) of the cylinder (43), and the solder ring (9) is set on the outer periphery of the light window (8). The solder ring (9) sintersects the periphery of the light window (8) with the wall at the through hole (111) of the copper ring frame (11).

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