Radio frequency transceivers and communication equipment

Abstract

This application relates to a radio frequency transceiver and communication equipment. The radio frequency transceiver comprises a circuit board, multiple radio frequency transceiver links disposed on the circuit board, and multiple grounding units, with each radio frequency transceiver link and grounding unit spaced apart. The radio frequency transceiver links transmit radio frequency signals, and the grounding units isolate the radio frequency signals between adjacent radio frequency transceiver links. The radio frequency transceiver provided in this application achieves low cost while ensuring isolation.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a radio frequency transceiver and communication equipment. Background Art

[0002] With the rapid development of mobile communications, mobile communications are widely used in people's work, study, and daily life. Mobile networks have become an indispensable part of life and production. However, in some special application scenarios, communication devices using mobile networks face additional security challenges, thus requiring higher security requirements for communication equipment. For example, when communication equipment uses multiple RF transceiver links to transmit RF signals, certain isolation requirements are required between the transceiver channels.

[0003] Traditionally, DC blocks have been installed between multiple RF transceiver links to increase isolation between transceiver channels. However, this method is costly. Summary of the Invention

[0004] Based on this, it is necessary to provide a radio frequency transceiver device and communication equipment with low cost while ensuring isolation between multiple radio frequency transceiver links in order to address the above technical problems.

[0005] In a first aspect, the present application provides a radio frequency transceiver device, the radio frequency transceiver device comprising: a circuit board, a plurality of radio frequency transceiver links and a plurality of grounding units arranged on the circuit board, wherein each radio frequency transceiver link is spaced apart from the grounding unit;

[0006] RF transceiver link, used to transmit RF signals;

[0007] The grounding unit is used to isolate radio frequency signals between adjacent radio frequency transceiver links.

[0008] In one embodiment, the radio frequency transceiver link includes a radio frequency transceiver circuit, an isolation circuit, and an antenna connector connected in sequence, and the grounding unit includes a radio frequency ground, an isolation ground, and an antenna ground that are independent of each other;

[0009] Radio frequency grounds are arranged at intervals on both sides of the radio frequency transceiver circuit, isolation grounds are arranged at intervals on both sides of the isolation circuit, and antenna grounds are arranged at intervals on both sides of the antenna connector.

[0010] In one embodiment, a radio frequency ground is further provided between two isolation grounds between two adjacent isolation circuits; and a radio frequency ground is further provided between two antenna grounds between two adjacent antenna connectors.

[0011] In one embodiment, the circuit board includes a top layer and a bottom layer, the radio frequency ground includes a first sub-radio frequency ground and a second sub-radio frequency ground, the isolation ground includes a first sub-isolation ground and a second sub-isolation ground, and the antenna ground includes a first sub-antenna ground and a second sub-antenna ground;

[0012] The RF transceiver link, the first sub-RF ground, the first sub-isolation ground, and the first sub-antenna ground are arranged on the top layer. The first sub-RF ground is arranged on both sides of the RF transceiver circuit, the first sub-isolation ground is arranged on both sides of the isolation circuit, and the first sub-antenna ground is arranged on both sides of the antenna connector.

[0013] The second sub-RF ground, the second sub-isolation ground and the second sub-antenna ground are arranged on the bottom layer; the position of the second sub-RF ground corresponds to the position of the first sub-RF ground and the RF transceiver circuit; the position of the second sub-isolation ground corresponds to the position of the first sub-isolation ground and the isolation circuit; the position of the second sub-antenna ground corresponds to the position of the first sub-antenna ground and the antenna connector.

[0014] In one embodiment, a first isolation capacitor is connected between the second sub-radio ground and the second sub-isolation ground, and a second isolation capacitor is connected between the second sub-isolation ground and the second sub-antenna ground.

[0015] In one embodiment, the radio frequency transceiver device further includes a radio frequency shielding cavity, and the radio frequency shielding cavity is provided on the first sub-radio frequency ground.

[0016] In one embodiment, the circuit board further includes at least one middle layer, on which a third sub-RF ground, a third sub-isolation ground, and a third sub-antenna ground are provided;

[0017] The position of the third sub-RF ground corresponds to the position of the first sub-RF ground and the RF transceiver circuit;

[0018] The position of the third sub-isolation ground corresponds to the positions of the first sub-isolation ground and the isolation circuit;

[0019] The position of the third sub-antenna ground corresponds to the positions of the first sub-antenna ground and the antenna connector.

[0020] In one embodiment, a hollow area is provided in the third sub-isolation ground, and the position of the hollow area corresponds to the position of the isolation capacitor in the isolation circuit.

[0021] In one embodiment, the first sub-RF ground, the second sub-RF ground and the third sub-RF ground are connected through multiple grounding holes, the first sub-isolation ground, the second sub-isolation ground and the third sub-isolation ground are connected through multiple grounding holes, and the first sub-antenna ground, the second sub-antenna ground and the third sub-antenna ground are connected through multiple grounding holes.

[0022] In one embodiment, the radio frequency transceiver device further includes a casing, and the plurality of grounding units and the plurality of radio frequency transceiver links are disposed in an accommodating cavity of the casing.

[0023] In a second aspect, an embodiment of the present application further provides a communication device, including the radio frequency transceiver device provided by the first embodiment.

[0024] The embodiments of the present application provide a radio frequency transceiver device and a communication device. The radio frequency transceiver device includes a circuit board, a plurality of radio frequency transceiver links and a plurality of grounding units arranged on the circuit board, and each radio frequency transceiver link is arranged at intervals from the grounding unit. The radio frequency transceiver link is used to transmit radio frequency signals; the grounding unit is used to isolate radio frequency signals between adjacent radio frequency transceiver links. In this embodiment, by arranging grounding units at intervals on both sides of each radio frequency transceiver link, isolation between radio frequency transceiver links is achieved through the grounding units. Compared with a dedicated DC block, the cost of the grounding unit is lower, which can reduce the cost of the radio frequency transceiver device. In addition, the multiple radio frequency transceiver links and the multiple grounding power supplies in this embodiment are all integrated on the circuit board, which can reduce the volume of the radio frequency transceiver device, making the radio frequency transceiver device have higher practicality and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of the structure of a radio frequency transceiver in one embodiment;

[0026] Figure 2 A schematic structural diagram of a radio frequency transceiver device in another embodiment;

[0027] Figure 3 This is a schematic diagram of the structure of the radio frequency transceiver device on the top layer of the circuit board in one embodiment;

[0028] Figure 4 This is a schematic diagram of the structure of the radio frequency transceiver device at the bottom layer of the circuit board in one embodiment;

[0029] Figure 5 This is a schematic structural diagram of a radio frequency transceiver device in the middle layer of a circuit board in one embodiment;

[0030] Figure 6 A schematic structural diagram of a radio frequency transceiver device in another embodiment;

[0031] Figure 7 Schematic diagram of input echo, output echo and insertion loss of a radio frequency transceiver device in one embodiment;

[0032] Figure 8 Schematic diagram of input isolation of a radio frequency transceiver device in one embodiment;

[0033] Figure 9 FIG. 1 is a schematic diagram of output isolation of a radio frequency transceiver in an embodiment.

[0034] Description of reference numerals:

[0035] 10. RF transceiver; 100. Circuit board; 200. RF transceiver link; 210. RF transceiver circuit; 220. Isolation circuit; 230. Antenna connector; 300. Grounding unit; 310. RF ground; 311. First sub-RF ground; 312. Second sub-RF ground; 313. Third sub-RF ground; 320. Isolation ground; 321. First sub-isolation ground; 322. Second sub-isolation ground; 323. Third sub-isolation ground; 330. Antenna ground; 331. First sub-antenna ground; 332. Second sub-antenna ground; 333. Third sub-antenna ground; 400. Housing; 1. First isolation capacitor; 2. Second isolation capacitor; 3. Hollow area; 4. Grounding hole. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0037] Before specifically introducing the technical solutions of the embodiments of the present application, the technical background or technical evolution context on which the embodiments of the present application are based is first introduced. With the rapid development of mobile communications, mobile communications are widely used in people's work, study, and daily life. Mobile networks such as cellular networks, WiFi (Wireless-Fidelity), LTE (LongTerm Evolution), 5G (5th Generation Mobile Communication Technology), etc. have become an indispensable part of life and production. However, in some special application scenarios, for example, in coal mines, refineries, gas stations, etc. where there are certain flammable or explosive gases, communication equipment using mobile networks will face more safety tests. In order to avoid additional risks of communication equipment in flammable or explosive gas environments, higher requirements need to be placed on the safety of communication equipment.

[0038] With the development of 5G technology, communication equipment usually uses multiple RF transceiver links to realize the transmission of RF signals. At this time, there are certain requirements for the isolation between the transceiver channels to avoid performance deterioration caused by poor isolation between the transceiver channels.

[0039] Traditionally, isolation between transceiver channels is increased by installing dedicated DC blockers between multiple RF transceiver links. However, dedicated DC blockers are expensive. To address this issue, the present application provides a low-cost RF transceiver device that can increase isolation between transceiver channels. This device implements a low-cost, highly integrated, multi-channel, high-performance, and high-voltage RF circuit, meeting safety and explosion-proof requirements for MIMO wireless coverage.

[0040] See Figure 1 One embodiment of the present application provides a radio frequency transceiver device 10. The radio frequency transceiver device 10 includes a circuit board 100, a plurality of radio frequency transceiver links 200 disposed on the circuit board 100, and a plurality of grounding units 300, wherein each radio frequency transceiver link 200 is spaced apart from the grounding unit 300.

[0041] The RF transceiver link 200 is used to transmit RF signals; the grounding unit 300 is used to isolate RF signals between adjacent RF transceiver links 200 .

[0042] The circuit board 100 can be a printed circuit board, and the RF transceiver link 200 and the grounding unit 300 are both integrated on the circuit board 100. The RF transceiver link 200 is a link in the RF transceiver device 10 used to receive RF signals sent by external devices and to transmit RF signals to external devices. A single RF transceiver device 10 can have multiple RF transceiver links 200, meaning that the RF transceiver device 10 is capable of receiving and transmitting RF signals through multiple channels. This embodiment does not limit the specific structure and number of RF transceiver links 200 in the RF transceiver device 10, as long as their functions can be achieved.

[0043] The grounding unit 300 may be a grounding layer with good conductivity laid on the circuit board 100. Alternatively, the grounding unit 300 may be formed of copper laid on the circuit board 100. This embodiment does not impose any restrictions on the material and structure of the grounding unit 300, as long as it can achieve its function.

[0044] Each RF transceiver chain 200 is spaced apart from the ground unit 300. Figure 1 As shown, grounding units 300 are provided on both sides of each RF transceiver link 200. That is, a grounding unit 300 is provided between adjacent RF transceiver links 200, and a grounding unit 300 is also provided between the RF transceiver link 200 and the edge of the circuit board 100. Furthermore, a certain distance is provided between the RF transceiver link 200 and the grounding unit 300 for isolation.

[0045] The RF transceiver device 10 provided in this embodiment includes a circuit board 100, multiple RF transceiver links 200 disposed on the circuit board 100, and multiple grounding units 300. Each RF transceiver link 200 is spaced apart from the grounding units 300. The RF transceiver links 200 are used to transmit RF signals; the grounding units 300 are used to isolate RF signals between adjacent RF transceiver links 200. In this embodiment, grounding units 300 are spaced apart on both sides of each RF transceiver link 200 to achieve isolation between the RF transceiver links 200. Compared to dedicated DC blocks, the grounding units 300 are less expensive, thereby reducing the cost of the RF transceiver device 10. Furthermore, in this embodiment, the multiple RF transceiver links 200 and the multiple grounding units 300 are integrated on the circuit board 100, which reduces the size of the RF transceiver device 10, making it more practical and reliable.

[0046] See Figure 2 In one embodiment, the RF transceiver link 200 includes a RF transceiver circuit 210, an isolation circuit 220, and an antenna connector 230, which are connected in sequence. The isolation circuit 220 includes an input and an output. The output of the RF transceiver circuit 210 is connected to the input of the isolation circuit 220, and the output of the isolation circuit 220 is connected to the antenna connector 230. The antenna connector 230 is used to connect to an antenna.

[0047] When the RF transceiver device 10 transmits an RF signal, the RF signal is emitted from the RF transmitting circuit in the RF transceiver circuit 210 and transmitted to the isolation circuit 220. The isolation circuit 220 isolates the DC in the received RF signal before transmitting it to the antenna connector 230 and then transmitting it from the antenna connected to the antenna connector 230. When the RF transceiver device 10 receives an RF signal, the RF signal is received from the antenna, isolated by the isolation circuit 220, and then transmitted to the RF receiving circuit in the RF transceiver circuit 210. This embodiment does not limit the specific structure of the RF transceiver circuit 210 and the isolation circuit 220, as long as their functions can be achieved.

[0048] In an optional embodiment, the isolation circuit 220 is composed of two capacitors connected in series.

[0049] The ground unit 300 includes a mutually independent radio frequency ground 310, an isolation ground 320, and an antenna ground 330. In other words, there is a certain distance between the radio frequency ground 310 and the isolation ground 320, a certain distance between the isolation ground 320 and the antenna ground 330, and a certain distance between the radio frequency ground 310 and the antenna ground 330. In other words, the radio frequency ground 310, the isolation ground 320, and the antenna ground 330 do not share a common ground.

[0050] Radio frequency grounds 310 are disposed at intervals on both sides of the radio frequency transceiver circuit 210 , isolation grounds 320 are disposed at intervals on both sides of the isolation circuit 220 , and antenna grounds 330 are disposed at intervals on both sides of the antenna connector 230 .

[0051] RF grounds 310 are provided on both sides of the RF transceiver circuit 210. These grounds are used to isolate interference signals generated by adjacent RF transceiver circuits 210. Isolation grounds 320 are provided on both sides of the isolation circuit 220. These grounds are used to isolate interference signals generated by adjacent isolation circuits 220. Antenna grounds 330 are provided on both sides of the antenna connector 230. These grounds are used to isolate interference signals generated by adjacent antenna connectors 230.

[0052] In this embodiment, corresponding radio frequency grounds 310, isolation grounds 320, and antenna grounds 330 are respectively provided for the radio frequency transceiver circuit 210, isolation circuit 220, and antenna connector 230 in the radio frequency transceiver link 200. The mutually independent radio frequency grounds 310, isolation grounds 320, and antenna grounds 330 can be used to isolate adjacent radio frequency transceiver circuits 210, isolation circuits 220, and antenna connectors 230, thereby improving the isolation of the radio frequency transceiver device 10 and thus enabling the radio frequency transceiver device 10 to have good transmission performance.

[0053] In one embodiment, a radio frequency ground 310 is further provided between the two isolation grounds 320 between two adjacent isolation circuits 220 ; and a radio frequency ground 310 is further provided between the two antenna grounds 330 between two adjacent antenna connectors 230 .

[0054] Each isolation circuit 220 has an isolation ground 320 on both sides of the isolation circuit 220. Thus, there are two isolation grounds 320 between two adjacent isolation circuits 220. A radio frequency ground 310 is also provided between the two isolation grounds 320. There is a certain distance between the radio frequency ground 310 and the two isolation grounds 320. The radio frequency ground 310 is used to isolate the two isolation grounds 320.

[0055] Each antenna connector 230 has an antenna ground 330 on both sides. Thus, there are two antenna grounds 330 between two adjacent antenna connectors 230. A radio frequency ground 310 is also provided between these two antenna grounds 330. There is a certain distance between the radio frequency ground 310 and the two antenna grounds 330. The radio frequency ground 310 is used to isolate the two antenna grounds 330.

[0056] The radio frequency ground 310 , the radio frequency ground 310 between the two isolation circuits 220 , and the radio frequency ground 310 between the two antenna connectors 230 may be connected as one.

[0057] In this embodiment, by setting the radio frequency ground 310 between the two isolation grounds 320 and setting the radio frequency ground 310 between the two antenna grounds 330, the two isolation grounds 320 and the two antenna grounds 330 can be isolated, and the isolation between adjacent radio frequency transceiver links 200 can be improved, thereby improving the transmission performance of each radio frequency transceiver link 200.

[0058] In one embodiment, circuit board 100 includes a top layer and a bottom layer, i.e., circuit board 100 has a double-layer structure. RF ground 310 includes a first sub-RF ground 311 and a second sub-RF ground 312. Isolation ground 320 includes a first sub-isolation ground 321 and a second sub-isolation ground 322. Antenna ground 330 includes a first sub-antenna ground 331 and a second sub-antenna ground 332.

[0059] like Figure 3 As shown, the RF transceiver link 200, the first sub-RF ground 311, the first sub-isolation ground 321, and the first sub-antenna ground 331 are all disposed on the top layer of the circuit board 100. On the top layer of the circuit board 100, the first sub-RF ground 311 is disposed on both sides of the RF transceiver circuit 210, for isolating interference signals generated by adjacent RF transceiver circuits 210. The first sub-isolation ground 321 is disposed on both sides of the isolation circuit 220, for isolating interference signals generated by adjacent isolation circuits 220. The first sub-antenna ground 331 is disposed on both sides of the antenna connector 230, for isolating interference signals generated by adjacent antenna connectors 230. The first sub-radio ground 311 , the first sub-isolation ground 321 and the first sub-antenna ground 331 are independent of each other, that is, there is a certain distance between the first sub-radio ground 311 and the first sub-isolation ground 321 , and there is a certain distance between the first sub-isolation ground 321 and the first sub-antenna ground 331 .

[0060] In one embodiment, Figure 3 As shown, a first sub-radio ground 311 is further provided between the two first sub-isolation grounds 321 between two adjacent isolation circuits 220. A first sub-radio ground 311 is further provided between the two first sub-antenna grounds 331 between two adjacent antenna connectors 230. There is a certain distance between the first sub-radio ground 311 and the first sub-antenna ground 331.

[0061] In an optional embodiment, the distance between the first sub-radio ground 311 and the first sub-isolation ground 321 is 0.7 mm, the distance between the first sub-isolation ground 321 and the first sub-antenna ground 331 is 2 mm, and the distance between the first sub-radio ground 311 and the first sub-antenna ground 331 is 2 mm.

[0062] like Figure 4As shown, the second sub-RF ground 312, the second sub-isolation ground 322, and the second sub-antenna ground 332 are all disposed on the bottom layer of the circuit board 100. The position of the second sub-RF ground 312 corresponds to the position of the first sub-RF ground 311 and the RF transceiver circuit 210; the position of the second sub-isolation ground 322 corresponds to the position of the first sub-isolation ground 321 and the isolation circuit 220; and the position of the second sub-antenna ground 332 corresponds to the position of the first sub-antenna ground 331 and the antenna connector 230.

[0063] A second sub-RF ground 312 is provided on the bottom layer of the circuit board 100 at a position relative to the RF transceiver circuit 210 and the first sub-RF ground 311 on the top layer of the circuit board 100. Specifically, the second sub-RF ground 312 is provided on the bottom layer of the circuit board 100 at a position relative to the RF transceiver circuit 210 on the top layer, and a second sub-RF ground 312 is also provided at a position relative to the first sub-RF ground 311 on the top layer. The second sub-RF grounds 312 on the bottom layer are connected as a whole.

[0064] A second sub-isolation ground 322 is provided on the bottom layer of circuit board 100 at a position relative to the isolation circuit 220 and first sub-isolation ground 321 on the top layer of circuit board 100. Specifically, on the bottom layer of circuit board 100, second sub-isolation ground 322 is provided at a position relative to the isolation circuit 220 on the top layer, and second sub-isolation ground 322 is also provided at a position relative to the first sub-isolation ground 321 on the top layer. The second sub-isolation grounds 322 on the bottom layer are connected as a whole.

[0065] A second sub-antenna ground 332 is provided on the bottom layer of circuit board 100 at a position opposite to antenna connector 230 and first sub-antenna ground 331 on the top layer of circuit board 100. Specifically, second sub-antenna ground 332 is provided on the bottom layer of circuit board 100 at a position opposite to antenna connector 230 on the top layer, and second sub-antenna ground 332 is also provided at a position opposite to first sub-antenna ground 331 on the top layer. Second sub-antenna ground 332 on the bottom layer is integrally connected.

[0066] The second sub-radio ground 312 , the second sub-isolation ground 322 and the second sub-antenna ground 332 are independent of each other, that is, there is a certain distance between the second sub-radio ground 312 and the second sub-isolation ground 322 , and there is a certain distance between the second sub-isolation ground 322 and the second sub-antenna ground 332 .

[0067] In one embodiment, Figure 4 As shown, a second sub-radio ground 312 is provided between two adjacent second sub-isolation grounds 322. A second sub-radio ground 312 is provided between two adjacent second sub-antenna grounds 332. There is a certain distance between the second sub-radio ground 312 and the second sub-antenna ground 332.

[0068] In an optional embodiment, the distance between the second sub-radio ground 312 and the second sub-isolation ground 322 is 2.3 mm, the distance between the second sub-isolation ground 322 and the second sub-antenna ground 332 is 2.3 mm, and the distance between the second sub-radio ground 312 and the second sub-antenna ground 332 is 2 mm.

[0069] In this embodiment, the configuration structure of the RF transceiver link 200 and the grounding unit 300 is described when the circuit board 100 includes a top layer and a bottom layer. This structure is simple and easy to implement. The RF transceiver device 10 in this embodiment has a simple structure, high integration, and high practicality and reliability.

[0070] Please continue to see Figure 4 In one embodiment, a first isolation capacitor 1 is connected between the second sub-RF ground 312 and the second sub-isolation ground 322, and a second isolation capacitor 2 is connected between the second sub-isolation ground 322 and the second sub-antenna ground 332. The first isolation capacitor 1 and the second isolation capacitor 2 form a path between the second sub-RF ground 312, the second sub-isolation ground 322, and the second sub-antenna ground 332. The capacitance values ​​of the first isolation capacitor 1 and the second isolation capacitor 2 can be set based on the user's voltage withstand requirements for the RF transceiver device 10, and this embodiment does not impose any restrictions on this.

[0071] In this embodiment, by providing a first isolation capacitor 1 connected to the second sub-radio ground 312 and the second sub-isolation ground 322, and a second isolation capacitor 2 connected to the second sub-isolation ground 322 and the second sub-antenna ground 332, the RF transceiver 10 ensures isolation between the second sub-radio ground 312, the second sub-isolation ground 322, and the second sub-antenna ground 332 while providing a return path for the signal, thereby improving the transmission performance of the RF transceiver 10.

[0072] In one embodiment, the capacitance of the capacitors in the isolation circuit 220, as well as the first isolation capacitor 1 and the second isolation capacitor 2 on the bottom layer, can be adjusted according to the frequency band corresponding to the RF transceiver 10 to improve the voltage resistance of the RF transceiver 10. For example, when used in the n41 frequency band (2515MHz-2675MHz), the capacitance is 5.1pF; when used in the n28 frequency band (703MHz-803MHz), the capacitance is 68pF.

[0073] In one embodiment, the RF transceiver 10 further includes an RF shielding cavity, which is disposed over the first sub-RF ground plane 311. In other words, the first sub-RF ground plane 311 disposed on the top layer of the circuit board 100 is covered with an RF shielding cavity. The size and shape of the RF shielding cavity correspond to the size and shape of the first sub-RF ground plane 311 on the top layer. This embodiment does not impose any restrictions on the material, size, or shape of the RF shielding cavity, as long as it can achieve its function.

[0074] In this embodiment, by covering the first sub-RF ground 311 set on the top layer of the circuit board 100 with a RF shielding cavity, the interference signals between the RF transceiver links 200 on the top layer can be better isolated, thereby improving the isolation between the RF transceiver links 200, and further improving the transmission performance of each RF transceiver link 200.

[0075] In one embodiment, the circuit board 100 further includes at least one middle layer, on which the third sub-radio ground 313 , the third sub-isolation ground 323 and the third sub-antenna ground 333 are disposed.

[0076] When the circuit board 100 has a multi-layer structure, the circuit board 100 may include at least one intermediate layer in addition to the top layer and the bottom layer. When the circuit board 100 has a three-layer structure, the circuit board 100 includes one intermediate layer; when the circuit board 100 has a four-layer structure, the circuit board 100 includes two intermediate layers.

[0077] like Figure 5 As shown, the radio frequency ground 310 in the ground unit 300 further includes a third sub-radio frequency ground 313, the isolation ground 320 further includes a third sub-isolation ground 323, and the antenna ground 330 further includes a third sub-antenna ground 333. There is a certain distance between the third sub-radio frequency ground 313 and the third sub-isolation ground 323, and there is a certain distance between the third sub-isolation ground 323 and the third sub-antenna ground 333.

[0078] The position of the third sub-RF ground 313 corresponds to the position of the first sub-RF ground 311 and the RF transceiver circuit 210. That is, on the middle layer of the circuit board 100, the third sub-RF ground 313 is provided at a position corresponding to the position of the RF transceiver circuit 210 on the top layer, and the third sub-RF ground 313 is also provided at a position corresponding to the first sub-RF ground 311 on the top layer; or the third sub-RF ground 313 is provided at a position corresponding to the second sub-RF ground 312 on the bottom layer.

[0079] The position of the third sub-isolation ground 323 corresponds to the position of the first sub-isolation ground 321 and the isolation circuit 220. That is, on the middle layer of the circuit board 100, the third sub-isolation ground 323 is provided at a position corresponding to the isolation circuit 220 on the top layer, and is also provided at a position corresponding to the first sub-isolation ground 321 on the top layer; or is provided at a position corresponding to the second sub-isolation ground 322 on the bottom layer.

[0080] The position of third sub-antenna ground 333 corresponds to the positions of first sub-antenna ground 331 and antenna connector 230. Specifically, on the middle layer of circuit board 100, third sub-antenna ground 333 is provided at a position corresponding to antenna connector 230 on the top layer, and also at a position corresponding to first sub-antenna ground 331 on the top layer; or at a position corresponding to second sub-antenna ground 332 on the bottom layer.

[0081] In one embodiment, Figure 5 As shown, a third sub-radio ground 313 is provided between two adjacent third sub-isolation grounds 323. A third sub-radio ground 313 is provided between two adjacent third sub-antenna grounds 333. There is a certain distance between the third sub-radio ground 313 and the third sub-antenna ground 333.

[0082] In an optional embodiment, the distance between the third sub-radio ground 313 and the third sub-isolation ground 323 is 2.3 mm, the distance between the third sub-isolation ground 323 and the third sub-antenna ground 333 is 2.3 mm, and the distance between the third sub-radio ground 313 and the third sub-antenna ground 333 is 2 mm.

[0083] In this embodiment, when the circuit board 100 further includes multiple intermediate layers, a structure in which a third sub-RF ground 313, a third sub-isolation ground 323, and a third sub-antenna ground 333 are provided at corresponding positions of the intermediate layers is described. This structure is simple and easy to implement, and can better achieve isolation between the RF transceiver links 200 in the RF transceiver device 10, so that the RF transceiver device 10 has high practicality and reliability.

[0084] Please continue to see Figure 5 In one embodiment, a hollowed-out region 3 is provided in the third sub-isolation ground 323. The location of the hollowed-out region 3 corresponds to the location of the isolation capacitor in the isolation circuit 220. In other words, the third sub-isolation ground 323 on the middle layer of the circuit board 100 is hollowed out at the location corresponding to the isolation capacitor in the isolation circuit 220 on the top layer. That is, there is no third sub-isolation ground 323 at this location. If the isolation circuit 220 includes two isolation capacitors, the third sub-isolation ground 323 has two hollowed-out regions 3 at the locations corresponding to the two isolation capacitors.

[0085] In this embodiment, by setting a hollow area 3 on the middle layer of the circuit board 100 at a position corresponding to the isolation capacitor in the isolation circuit 220 in the top layer (if the RF transceiver device 10 is set perpendicular to the ground, the hollow area 3 on the middle layer is directly below the isolation circuit 220), the impedance mismatch problem caused by the solder pad of the isolation capacitor can be avoided, thereby improving the transmission performance of the RF transceiver link 200.

[0086] In one embodiment, the first sub-radio ground 311, the second sub-radio ground 312 and the third sub-radio ground 313 are connected through multiple grounding holes 4, the first sub-isolation ground 321, the second sub-isolation ground 322 and the third sub-isolation ground 323 are connected through multiple grounding holes 4, and the first sub-antenna ground 331, the second sub-antenna ground 332 and the third sub-antenna ground 333 are connected through multiple grounding holes 4.

[0087] like Figure 3 As shown, a plurality of grounding holes 4 are provided on the first sub-radio ground 311, the first sub-isolation ground 321 and the first sub-antenna ground 331. Figure 4 As shown, a plurality of grounding holes 4 are provided on the second sub-radio ground 312, the second sub-isolation ground 322 and the second sub-antenna ground 332. Figure 5 As shown, a plurality of grounding holes 4 are provided on the third sub-radio ground 313 , the third sub-isolation ground 323 and the third sub-antenna ground 333 .

[0088] The setting position of the grounding hole 4 on the first sub-radio ground 311 corresponds to the setting position of the grounding hole 4 on the second sub-radio ground 312, and the setting position of the grounding hole 4 on the third sub-radio ground 313, so that the first sub-radio ground 311, the second sub-radio ground 312 and the third sub-radio ground 313 are connected through the grounding holes 4.

[0089] The setting position of the grounding hole 4 on the first sub-isolation ground 321 corresponds to the setting position of the grounding hole 4 on the second sub-isolation ground 322 and the setting position of the grounding hole 4 on the third sub-isolation ground 323, so that the first sub-isolation ground 321, the second sub-isolation ground 322 and the third sub-isolation ground 323 are connected through the grounding hole 4.

[0090] The setting position of the grounding hole 4 on the first sub-antenna ground 331 corresponds to the setting position of the grounding hole 4 on the second sub-antenna ground 332 and the setting position of the grounding hole 4 on the third sub-antenna ground 333, so that the first sub-antenna ground 331, the second sub-antenna ground 332 and the third sub-antenna ground 333 are connected through the grounding holes 4.

[0091] In this embodiment, by providing a grounding hole 4 on each RF ground, each isolation ground, and each antenna ground, the first sub-RF ground 311 on the top layer of the circuit board 100 is connected to the third sub-RF ground 313 on the middle layer and the second sub-RF ground 312 on the bottom layer, the first sub-isolation ground 321 on the top layer is connected to the third sub-isolation ground 323 on the middle layer and the second sub-isolation ground 322 on the bottom layer, and the first sub-antenna ground 331 on the top layer is connected to the third sub-antenna ground 333 on the middle layer and the second sub-antenna ground 332 on the bottom layer. This can achieve isolation of each RF transceiver link 200 and improve the transmission performance of the RF transceiver link 200.

[0092] See Figure 6 In one embodiment, the RF transceiver device 10 further includes a housing 400 , and the plurality of grounding units 300 and the plurality of RF transceiver chains 200 are disposed in an accommodating cavity of the housing 400 .

[0093] The housing 400 can be made of an alloy or a metal. The housing 400 can be a cube, a rectangular parallelepiped, or another irregularly shaped three-dimensional structure. The size of the housing 400 is determined based on the size of the RF transceiver link 200 and the grounding unit 300. This embodiment imposes no restrictions on the material, structure, or size of the housing 400, as long as it can achieve its intended function. Furthermore, the housing 400 is insulated from the RF shielding cavity.

[0094] In this embodiment, the grounding unit 300 and the RF transceiver link 200 are disposed in the accommodating cavity of the housing 400 , thereby protecting the RF transceiver link 200 and the grounding unit 300 and improving the reliability of the RF transceiver device 10 .

[0095] In one embodiment, the RF transceiver device 10 further includes a chassis ground, which is connected to the chassis 400 to protect the chassis 400 and improve the reliability of the RF transceiver device 10 .

[0096] An embodiment of the present application provides a communication device, which includes the RF transceiver 10 provided in the above embodiment. The communication device receives RF signals sent by other communication devices through the RF transceiver 10, or sends RF signals to other communication devices.

[0097] The communication device provided in this embodiment includes the radio frequency transceiver device 10 provided in the above embodiment, and the communication device has all the beneficial effects of the radio frequency transceiver device 10, which will not be described in detail here.

[0098] When the RF transceiver 10 provided in this embodiment is used in the n41 frequency band, the input echo, output echo and insertion loss of the RF transceiver 10 are as follows: Figure 7 As shown, the input isolation of the radio frequency transceiver 10 is as follows: Figure 8As shown, the output isolation is as follows Figure 9 shown. Figure 7 The curve containing solid circles in is the insertion loss of the radio frequency transceiver 10 , the curve containing hollow circles is the input echo, and the curve containing triangles is the output echo. Figure 8 Here, m1 indicates a frequency of 2.515 GHZ, and m2 indicates a frequency of 2.675 GHZ. Figure 9 The m1 in the equation represents a frequency of 2.515 GHZ, and the m2 represents a frequency of 2.675 GHZ. Figure 8 and Figure 9 As can be seen in the figure, within the operating frequency band of 2.515 GHz to 2.675 GHz, an isolation of over 45 dB is achieved, meeting the isolation requirements of communication equipment. Furthermore, if a radio frequency shielding cavity is provided over the first sub-radio ground plane 311 in the radio frequency transceiver 10, the isolation of the radio frequency transceiver 10 can be increased to over 45 dB.

[0099] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A radio frequency transceiver, characterized in that: The RF transceiver device includes: a circuit board, multiple RF transceiver links and multiple grounding units arranged on the circuit board, each of the RF transceiver links being spaced apart from the grounding unit; the RF transceiver link includes a RF transceiver circuit, an isolation circuit and an antenna connector connected in sequence, the isolation circuit is composed of two capacitors connected in series, and the grounding unit includes a mutually independent RF ground, an isolation ground and an antenna ground; the RF grounds are spaced apart on both sides of the RF transceiver circuit, the isolation grounds are spaced apart on both sides of the isolation circuit, the antenna grounds are spaced apart on both sides of the antenna connector, the RF ground is further disposed between the two isolation grounds between two adjacent isolation circuits, and the RF ground is further disposed between the two antenna grounds between two adjacent antenna connectors; The radio frequency transceiver link is used to transmit radio frequency signals; The grounding unit is used to isolate radio frequency signals between adjacent radio frequency transceiver links.

2. The radio frequency transceiver according to claim 1, wherein: The circuit board includes a top layer and a bottom layer, the radio frequency ground includes a first sub-radio frequency ground and a second sub-radio frequency ground, the isolation ground includes a first sub-isolation ground and a second sub-isolation ground, and the antenna ground includes a first sub-antenna ground and a second sub-antenna ground; The RF transceiver link, the first sub-RF ground, the first sub-isolation ground, and the first sub-antenna ground are arranged on the top layer, the first sub-RF ground is arranged on both sides of the RF transceiver circuit, the first sub-isolation ground is arranged on both sides of the isolation circuit, and the first sub-antenna ground is arranged on both sides of the antenna connector; The second sub-RF ground, the second sub-isolation ground and the second sub-antenna ground are arranged on the bottom layer; the position of the second sub-RF ground corresponds to the position of the first sub-RF ground and the RF transceiver circuit; the position of the second sub-isolation ground corresponds to the position of the first sub-isolation ground and the isolation circuit; the position of the second sub-antenna ground corresponds to the position of the first sub-antenna ground and the antenna connector.

3. The radio frequency transceiver according to claim 2, wherein: The first sub-RF ground, the first sub-isolation ground and the first sub-antenna ground are independent of each other, the second sub-isolation ground on the bottom layer is connected as a whole, and the second sub-antenna ground on the bottom layer is connected as a whole.

4. The radio frequency transceiver according to claim 2, wherein: A first isolation capacitor is connected between the second sub-RF ground and the second sub-isolation ground, and a second isolation capacitor is connected between the second sub-isolation ground and the second sub-antenna ground.

5. The radio frequency transceiver according to claim 2, wherein: The radio frequency transceiver device further includes a radio frequency shielding cavity, and the radio frequency shielding cavity is provided on the first sub-radio frequency ground.

6. The radio frequency transceiver according to claim 4, characterized in that: The circuit board further comprises at least one middle layer, on which a third sub-RF ground, a third sub-isolation ground and a third sub-antenna ground are provided; The position of the third sub-RF ground corresponds to the positions of the first sub-RF ground and the RF transceiver circuit; The position of the third sub-isolation ground corresponds to the positions of the first sub-isolation ground and the isolation circuit; The position of the third sub-antenna ground corresponds to the positions of the first sub-antenna ground and the antenna connector.

7. The radio frequency transceiver according to claim 6, wherein: A hollow area is provided in the third sub-isolation ground, and a position of the hollow area corresponds to a position of an isolation capacitor in the isolation circuit.

8. The radio frequency transceiver according to claim 6, wherein: The first sub-RF ground, the second sub-RF ground and the third sub-RF ground are connected through multiple grounding holes, the first sub-isolation ground, the second sub-isolation ground and the third sub-isolation ground are connected through multiple grounding holes, and the first sub-antenna ground, the second sub-antenna ground and the third sub-antenna ground are connected through multiple grounding holes.

9. The radio frequency transceiver according to claim 1, wherein: The radio frequency transceiver device further includes a casing, and the plurality of grounding units and the plurality of radio frequency transceiver links are arranged in an accommodating cavity of the casing.

10. A communication device, characterized in that: It comprises the radio frequency transceiver according to any one of claims 1 to 9.

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