A compatible PCB contact manufacturing method and PCB

Abstract

The application provides a manufacturing method of a compatible PCB contact and a PCB. The method comprises the following steps: stacking sensors up and down, rotating and adjusting the sensors, adjusting the relative positions between the contacts of different sensors, determining the positions of the PCB contacts, and manufacturing the PCB containing the PCB contacts. The manufacturing method is simple, the manufactured PCB can be compatible with different contact sensors, the time cost and material cost of redesigning the PCB are saved, and the method has good applicability.

Description

Technical Field

[0001] This invention relates to the field of sensors, and in particular to a method for manufacturing compatible PCB board contacts and a PCB board. Background Technology

[0002] A sensor is a detection device that can receive measured information and transform that information into other forms of information (such as electrical signals) according to certain rules. Sensors come in different types and functions and are widely used in various fields.

[0003] Contact connection methods are widely used in industrial fields. Contact sensors connect to the PCB board via exposed contacts to achieve corresponding functions. When using different contact sensors, the contact position and size specifications vary between different brands (see attached diagram). Figure 1 To be continued Figure 3 When connecting to the PCB board, a new PCB board needs to be designed to match the sensor contacts in order to achieve suitable assembly of the sensor. When using different sensors, the time cost of PCB board design is high and the applicability is poor. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a method for manufacturing compatible PCB board contacts that are compatible with multiple sensors, and a PCB board thereof.

[0005] This invention provides a method for manufacturing compatible PCB board contacts, comprising the following steps:

[0006] S1. Stack M sensors with at least two contacts in the vertical direction, so that the center points of the reference contacts of the sensors are coaxial, where M≥2;

[0007] S2. Rotate the sensor around the axis containing the center point of the reference contact so that the other contacts of the sensor, except for the reference contact, are in the closest possible positions.

[0008] S3. Draw the outline of the PCB contact corresponding to the reference contact, so that the outline of the PCB contact can completely enclose the outermost outline of the reference contact.

[0009] S4. Draw the outlines of the PCB contacts corresponding to the other contacts besides the reference contact, so that the outlines of the PCB contacts can completely enclose the outermost outline of the other contacts besides the reference contact located at the closest position.

[0010] In one embodiment, the following steps are included: S5, drawing the outline of the PCB contact corresponding to the individual contact, such that the outline of the PCB contact can completely enclose the outermost outline of the individual contact.

[0011] In one embodiment, the following step is also included: S6, fabricating the body of the PCB contact according to the outline of the PCB contact.

[0012] In one embodiment, the main body of the PCB contact is made of metal.

[0013] In one embodiment, the following step is also included: S7, connecting the body of the PCB contact to the PCB board.

[0014] The present invention also proposes a PCB board manufactured by the above method.

[0015] This invention also proposes another method for manufacturing compatible PCB board contacts, comprising the following steps:

[0016] S1. Stack M sensors with N contacts in the vertical direction. The geometric figure formed by connecting the contacts of the sensors in sequence is an approximate figure and has a geometric center. Make the center points of the functional surfaces of the sensors coaxial, or make the geometric centers of the geometric figures coaxial, where M≥2 and N≥2.

[0017] S2. Rotate the sensor around the axis so that the center points of the sensor's reference contacts have the same diameter;

[0018] S3. Draw the outline of the PCB contact corresponding to the reference contact, so that the outline of the PCB contact can completely enclose the outermost outline of the reference contact.

[0019] In one embodiment, the following step is also included: S4, fabricating the body of the PCB contact according to the outline of the PCB contact.

[0020] In one embodiment, the following step is also included: S5, connecting the PCB contact body to the PCB board.

[0021] The present invention also proposes a PCB board manufactured by the above method.

[0022] The beneficial effects of this invention are as follows:

[0023] The above manufacturing method is simple and can produce a PCB board with good compatibility for various sensors, so that a single PCB board can be used for sensors of different specifications. This eliminates the time and material costs of redesigning and adjusting the PCB board every time a sensor is changed, resulting in good economic benefits and strong applicability. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the contact structure of the first sensor involved in the present invention;

[0026] Figure 2 This is a schematic diagram of the contact structure of the second sensor involved in the present invention;

[0027] Figure 3 This is a schematic diagram of the contact structure of the third sensor involved in the present invention;

[0028] Figure 4 This is a schematic diagram of a structure according to an embodiment of the present invention;

[0029] Figure 5 This is a schematic diagram of a structure according to an embodiment of the present invention.

[0030] In the picture:

[0031] 11-First sensor; 12-Second sensor; 13-Third sensor; 14-Functional surface; 20-Contact; 21-Reference contact; 22-PCB contact. Detailed Implementation

[0032] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of the present invention. Based on the description of the present invention, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present invention.

[0033] In the description of this invention, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0034] The terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0035] The terms “first,” “second,” “third,” etc., are used merely to distinguish elements with similar properties, not to indicate or imply relative importance or a specific order.

[0036] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0037] The method for manufacturing compatible PCB board contacts proposed in this invention is mainly aimed at contact-type sensors, combined with the attached... Figure 1 To be continued Figure 3 , attached Figure 1 To be continued Figure 3 Three different types of sensors with the same number of contacts 22 are listed: the first sensor 11, the second sensor 12, and the third sensor 13. All three sensors have three contacts 20. This embodiment uses a sensor with three contacts 22 to illustrate the technical solution of the present invention.

[0038] To facilitate the description and understanding of the technical solution of the present invention, any contact point in the sensor is defined as a reference contact point 21, and the surface of the sensor used to set the contact point 20 is defined as a functional surface 14.

[0039] Example 1:

[0040] The specific method for manufacturing compatible PCB board contacts proposed in this invention includes the following steps:

[0041] S1. Stack M (M≥2) sensors with at least two contacts vertically, ensuring the center points of the sensor's reference contacts 21 are coaxial, as shown in the attached diagram. Figure 4 As shown in (A);

[0042] S2. Rotate the sensor about the axis containing the center point of the reference contact 21, so that the other contacts 20 of the sensor, excluding the reference contact 21, are in the closest possible positions, as shown in the attached diagram. Figure 4 As shown in (B);

[0043] For ease of understanding and description, the closest position of other contacts 20 is defined as follows: when the center point of other contacts 20 (excluding the reference contact 21) is connected to the center point of the reference contact 21, the line connecting the center point of other contacts 20 and the center point of the reference contact 21 coincides when the sensor is rotated.

[0044] Understandably, the number of times the sensor is rotated depends on the number of sensors M. The optimal number of rotations is (M-1) times, that is, taking one sensor as the reference for rotation, keeping the position of the reference contact 21 of that sensor fixed, and rotating the other (M-1) sensors until all the other contacts 20 of all sensors except the reference contact 21 are in the closest position.

[0045] S3. Draw the outline of the PCB contact corresponding to the reference contact 21, so that the outline of the PCB contact completely encloses the outermost outline of the reference contact 21, as shown in the attached figure. Figure 4 As shown in (C);

[0046] Understandably, the above encirclement means that the outermost contour of the reference contact 21 is completely contained within the contour of the PCB contact, or partially or completely coincides with the contour of the PCB contact.

[0047] Combined with appendix Figure 4 (A) Appendix Figure 4 (B) and Appendix Figure 4 (C) To facilitate processing and save materials, the outline of the reference contact 21 with the largest diameter can be directly used as the outline of the PCB contact. Of course, it is also possible to use the outline of the reference contact 21 with the largest diameter.

[0048] S4. Draw the outlines of the PCB contacts corresponding to the other contacts besides the reference contact, so that the outlines of the PCB contacts completely enclose the outermost outline of the other contacts 20 located closest to the reference contact, as shown in the attached diagram. Figure 4 As shown in (C);

[0049] Understandably, the aforementioned "encirclement" refers to the outermost contour of the other contacts 20 being completely contained within the contour of the PCB contacts, or partially or completely overlapping with the contour of the PCB contacts. Figure 4 (C) lists two cases: elliptical and rectangular. Of course, other shapes are also possible, and this embodiment is not limited to them.

[0050] It is understandable that the order of steps S3 and S4 can be changed, or they can be placed in the same step.

[0051] The above steps apply to the case where the number and distribution of contacts 20 of each sensor are the same. When the number and distribution of contacts 20 of each sensor are different, in order to apply the manufacturing method of this embodiment, it should be satisfied that when rotating around the axis where the center point of the reference contact 22 is located, as many contacts 20 as possible can be located in the closest position. In the latter case, the reference contact 22 determines the outline of the PCB contact 22 according to the above step S3, and the contacts 20 that can be located in the closest position determine the outline of the PCB contact 22 according to the above step S4. The extra individual contacts 20 use their outermost outline as the outline of the PCB contact 22. Of course, the outline and body of the PCB contact 22 can also be designed by the principle of enclosing.

[0052] Based on the latter case, for ease of description, each individual contact 20 other than the reference contact 21 and the other contacts 20 located closest to it is defined as an individual contact. Therefore, the above steps further include:

[0053] S5. When the number of contacts of each sensor is different, draw the outline of the PCB contact corresponding to the individual contact so that the outline of the PCB contact 22 can completely enclose the outermost outline of the individual contact.

[0054] Understandably, using the outermost contour of a single contact as the contour of the PCB contact 22 is the most material-efficient and time-saving design method. Of course, the contour of the PCB contact 22 can also be designed by enclosing it. S6. Based on the above steps S3 and S4, and / or S5, fabricate the main body of the PCB contact 22 according to the contour of the PCB contact 22;

[0055] S7. Connect the body of PCB contact 22 to the PCB board.

[0056] In steps S6 and S7, the main body of the PCB contact 22 is made of metal, such as copper. The copper sheet can be cut according to the outline of the PCB contact 22 to form the main body of the PCB contact 22, and then attached to the PCB board by means of adhesive dispensing or other connection methods.

[0057] In this embodiment, the PCB contact 22 corresponding to the reference contact 21 can be directly determined based on the reference contact 21 with the largest outer diameter, and the PCB contact 22 corresponding to the other (N-1) contacts 20 can be determined based on the outermost contour.

[0058] Example 2:

[0059] The method for manufacturing compatible PCB board contacts proposed in this invention includes the following steps:

[0060] S1. Stack M (M≥2) sensors with N (N≥2) contacts vertically. The geometric shape formed by connecting the contacts of the same sensor sequentially is an approximate shape with a geometric center. The center points of the functional surfaces 14 of the sensors are coaxial, or the geometric centers of the geometric shapes are coaxial, as shown in the attached diagram. Figure 5 As shown in (A);

[0061] S2. Rotate the sensor around its axis so that the center points of the sensor's reference contact 21 share the same diameter, as shown in the attached diagram. Figure 5 As shown in (B); at this time, the center points of the other contacts 20, except for the reference contact 21, also share the same diameter;

[0062] Understandably, the number of times the sensor is rotated depends on the number of sensors M. The optimal number of rotations is (M-1) times, that is, taking one sensor as the reference for rotation, keeping the position of the reference contact 21 of that sensor fixed, and rotating the other (M-1) sensors until the center points of the reference contacts 21 of all sensors have the same diameter.

[0063] The common diameter of the center point of the reference contact 21 is defined as follows: when the center point of the reference contact 21 is connected to the center point of the functional surface 14 of the sensor, all the line segments formed by connecting them are located on the same straight line containing the same diameter of the sensor or the reference contact 21.

[0064] In existing technology, to facilitate contact processing, contacts 20 are typically evenly distributed relative to the center point of the functional surface 14 of the sensor. The differences between contacts 20 of different sensor models lie only in the distance between their center points and the center point of the functional surface 14, and the diameter of the contacts 20. For different sensor models, the angle between the lines connecting the center points of two adjacent contacts 20 to the center point of the functional surface 14 is the same. Figures 1 to 3 For the three sensors, the angle is 120°, which is perfectly applicable to the manufacturing method of this embodiment.

[0065] S3. Draw the outline of the PCB contact corresponding to the reference contact 21, so that the outline of the PCB contact completely encloses the outermost outline of the reference contact, as shown in the attached figure. Figure 5 As shown in (C); the number and diameter of the contacts of sensors of the same specification are usually the same. Therefore, it is only necessary to draw the outline of the PCB contacts corresponding to the reference contact 21.

[0066] Understandably, the aforementioned enclosure refers to the outermost contour of the reference contact 21 being completely contained within the contour of the PCB contact, or partially or completely coinciding with the contour of the PCB contact. Figure 5(C) lists two cases where the outline of the elliptical PCB contact completely coincides with the outermost outline of the reference contact 21. Of course, other shapes are also possible, and this embodiment is not limited to them.

[0067] S4. Based on step S3 above, the main body of PCB contact 22 is made according to the outline of PCB contact 22. In this step, the main body of PCB contact is made of metal material, such as copper, and copper sheet can be cut into the outline of PCB contact 22.

[0068] S5. Attach the PCB contact body to the PCB board. In this step, it can be attached to the PCB board by dispensing adhesive.

[0069] In this embodiment, the PCB contacts 22 corresponding to the N contacts 20 can be set to the same shape, which is convenient for processing and easy for mass production.

[0070] In this embodiment, in addition to the three-contact sensors listed above, the present invention is also applicable to two-contact, four-contact and above sensors, and the number and distribution of the contacts 20 of each sensor should be the same, and the contacts 20 of the same sensor connected in sequence should be able to form a geometric figure with a geometric center, and the geometric figures formed by the sequential connection of the contacts 20 of different sensors are approximate figures.

[0071] The present invention also proposes a PCB board made based on the manufacturing method of the compatible PCB board contacts in Embodiments 1 and 2 above. The PCB board has good compatibility and can be applied to sensors of different specifications. It has strong applicability and eliminates the need to redesign the PCB board processing time and program every time a sensor is changed.

[0072] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0073] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A method for making compatible PCB board contacts, suitable for sensors with the same number of contacts and the same contact distribution, characterized in that: Includes the following steps: S1. Using any contact point on the sensor as the reference contact point, stack M sensors with at least two contacts in the vertical direction so that the center points of the reference contacts of the sensors are coaxial, where M≥2; S2. Rotate the sensor around the axis containing the center point of the reference contact so that the other contacts of the sensor, excluding the reference contact, are in the closest position. The closest position means connecting the center points of the other contacts to the center point of the reference contact respectively. Rotate the sensor so that the lines connecting the center points of the other contacts of the M sensors to the center point of the reference contact coincide. S3. Draw the outline of the PCB contact corresponding to the reference contact, so that the outline of the PCB contact can completely enclose the outermost outline of the reference contact. S4. Draw the outlines of the PCB contacts corresponding to the other contacts besides the reference contact, so that the outlines of the PCB contacts can completely enclose the outermost outline of the other contacts besides the reference contact located at the closest position.

2. The method of claim 1, wherein: It also includes the following steps: S5. Make the main body of the PCB contact according to the outline of the PCB contact.

3. The method of claim 2, wherein: The main body of the PCB contact is made of metal.

4. The method for manufacturing compatible PCB board contacts according to claim 2, characterized in that: It also includes the following steps: S6. Connect the main body of the PCB contact to the PCB board.

5. A PCB board, characterized in that: It is manufactured by the method for manufacturing compatible PCB board contacts as described in any one of claims 1 to 4.

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