Submerged liquid-cooled server

Abstract

The embodiment of the application discloses an immersed liquid cooling server, comprising a circuit board, a packaging cover, a first sealing element, a base plate, a connector and a chip; the packaging cover comprises a cover plate and a side plate, the cover plate is arranged at intervals from the circuit board; the side plate is arranged between the cover plate and the circuit board, and one end of the side plate is connected with the periphery of the cover plate; the first sealing element is located between the end of the side plate facing the circuit board and the circuit board, and a first sealing cavity is formed between the packaging cover, the first sealing element and the circuit board; the base plate is located in the first sealing cavity; the chip is located in the first sealing cavity and arranged on the side of the base plate away from the circuit board; and the connector is located in the first sealing cavity and connected between the base plate and the circuit board. Thus, the chip and the connector are sealed in the first sealing cavity, and the chip and the connector are isolated from the cooling working medium liquid.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation technology of electronic devices, and in particular to an immersion liquid cooling server. BACKGROUND

[0002] With the development of communication technology, the requirement for chip performance is getting higher and higher. The evolution trend of high-performance chips is that the transmission rate performance is improved, and the power consumption is also correspondingly improved. Taking the server field as an example, the power consumption of the chip also rapidly increases with the improvement of its performance. The energy efficiency of the traditional air cooling scheme is low, and a large part of the energy consumption is used for air conditioning refrigeration. The PUE (Power Usage Effectiveness, power utilization efficiency, which is an index for evaluating the energy efficiency of a data center, and is the ratio of all energy consumed by the data center to the energy consumed by the IT load) of the entire computer room is between 2 and 3. The PUE of the computer room using liquid cooling can be PUE<1.5, or even lower. Therefore, liquid cooling is also the trend of future evolution.

[0003] However, the current liquid cooling scheme has the following disadvantages: without setting a cooling working fluid immersion scene, the sealing protection of the chip and the connector is not good, and the cooling working fluid can be immersed into the chip and the connector, resulting in performance degradation of the chip and the connector. SUMMARY

[0004] Therefore, the embodiments of the present application provide an immersion liquid cooling server to solve the technical problem that the cooling working fluid is immersed into the chip and the connector, resulting in performance degradation of the chip and the connector.

[0005] In a first aspect, the embodiments of the present application provide an immersion liquid cooling server, comprising: a circuit board, a packaging cover, a first sealing member, a substrate, a connector and a chip.

[0006] The packaging cover comprises a cover plate and a side plate, and the cover plate is arranged in a spaced manner with the circuit board. The side plate is arranged between the cover plate and the circuit board, and one end of the side plate is connected with the periphery of the cover plate.

[0007] The first sealing member is located between the end of the side plate facing the circuit board and the circuit board, and a first sealing cavity is formed between the packaging cover, the first sealing member and the circuit board.

[0008] The substrate is located in the first sealing cavity, and the chip is located in the first sealing cavity and arranged on the side of the substrate away from the circuit board.

[0009] The connector is located in the first sealing cavity and connected between the substrate and the circuit board.

[0010] Thus, the side plate of the packaging cover surrounds the side surface of the substrate and extends to be adjacent to the circuit board, and a first sealed cavity is formed between the side plate and the circuit board through the first sealing piece, so that the connector, the substrate and the chip are all located in the first sealed cavity. When the immersion liquid cooling server is immersed in the cooling working fluid, the first sealing piece can prevent the cooling working fluid from directly contacting the connector and the chip of the immersion liquid cooling server, without affecting the performance of the connector and the chip.

[0011] With reference to the first aspect, in some implementations of the first aspect, the immersion liquid cooling server further comprises a first adhesive piece, which is arranged between the end of the side plate towards the circuit board and the first sealing piece and / or between the first sealing piece and the circuit board.

[0012] Thus, when the first adhesive piece is bonded between the first sealing piece and the end of the side plate, the sealing performance between the first adhesive piece and the first sealing piece can be improved, and relative movement between the first sealing piece and the side plate caused by external force can be avoided, thereby increasing the structural stability between the first sealing piece and the side plate. When the first adhesive piece is bonded between the first sealing piece and the circuit board, the sealing performance between the first sealing piece and the circuit board can be improved, and relative movement between the first sealing piece and the circuit board caused by external force can be avoided, thereby increasing the structural stability between the first sealing piece and the circuit board.

[0013] With reference to the first aspect, in some implementations of the first aspect, a first recess is formed in the other end of the side plate towards the circuit board, a first protrusion is formed on the first sealing piece corresponding to the position of the first recess, and the first protrusion is engaged with the first recess.

[0014] Thus, when the end of the side plate of the packaging cover is close to the first sealing piece, the first recess of the side plate and the first protrusion of the first sealing piece are matched, which can play a positioning role in the assembly between the packaging cover and the first sealing piece, and further improve the sealing performance between the side plate, the first sealing piece and the circuit board.

[0015] With reference to the first aspect, in some implementations of the first aspect, a second protrusion is arranged at the end of the side plate towards the circuit board, a second recess is arranged on the first sealing piece corresponding to the position of the second protrusion, and the second protrusion is engaged with the second recess.

[0016] Thus, when the end of the side plate of the packaging cover is close to the first seal, the second protrusion of the side plate is matched with the second groove of the first seal, which can position the assembly between the packaging cover and the first seal, and further increase the sealing between the side plate, the first seal and the circuit board.

[0017] With reference to the first aspect, in some implementations of the first aspect, the substrate includes an upper surface and a lower surface arranged oppositely, and a first side surface connected between the upper surface of the substrate and the lower surface of the substrate; the server further includes a second seal arranged around the substrate and connected between the inner side surface of the side plate and the first side surface of the substrate; a second sealed cavity is formed between the packaging cover, the substrate and the second seal, and the chip is arranged in the second sealed cavity.

[0018] Thus, the chip is double-protected by the first sealed cavity and the second sealed cavity, further improving the sealing reliability and better protecting the performance of the chip from the influence of the cooling working fluid.

[0019] With reference to the first aspect, in some implementations of the first aspect, a side wall of the connector is provided with a first guide portion, and an end of the side plate is provided with a second guide portion, and the first guide portion is in contact with the second guide portion.

[0020] With reference to the first aspect, in some implementations of the first aspect, the first guide portion and the second guide portion are wedge surfaces.

[0021] With reference to the first aspect, in some implementations of the first aspect, one of the first guide portion and the second guide portion is a guide protrusion, and the other is a guide groove matched with the guide protrusion.

[0022] Thus, in the actual assembly process, the packaging cover, the chip arranged in the packaging cover, the packaging substrate, the substrate and the second seal are an integral whole that needs to be assembled as a whole on the connector. Since the connector has a plurality of first connection points, the substrate has a plurality of second connection points, and the plurality of first connection points and the plurality of second connection points have a one-to-one correspondence, misconnection can cause the substrate and the connector to not work normally, and even be burned out due to short circuit. Therefore, when the integral whole is installed on the connector, the second guide portion on the side plate needs to abut against the first guide portion on the connector, the first guide portion and the second guide portion are in contact, the first guide portion and the second guide portion guide the accurate positioning of the packaging cover and the connector, and thus the accurate positioning and connection between the substrate and the connector are realized.

[0023] In some implementations of the first aspect, the server further includes a heat sink and a plurality of first fasteners; the heat sink is arranged on a side surface of the cover plate away from the circuit board; and the plurality of first fasteners are connected between the heat sink and the circuit board.

[0024] Therefore, the heat sink not only has a heat dissipation effect, but also enhances the overall structural strength of the immersion liquid-cooled server due to its good structural strength.

[0025] In some implementations of the first aspect, the server includes a first reinforcing member arranged around the side plate and fixed on a surface of the circuit board facing the packaging cover.

[0026] Therefore, the first reinforcing member can limit the warping deformation of the circuit board, enhance the structural strength of the circuit board, and provide mounting positions for the first fasteners.

[0027] In some implementations of the first aspect, the server further includes a second reinforcing member arranged on a surface of the circuit board away from the packaging cover, and a plurality of second fasteners connecting the first reinforcing member, the circuit board, and the second reinforcing member; and projections of the plurality of first fasteners and the plurality of second fasteners on the surface of the circuit board do not coincide.

[0028] Therefore, the second reinforcing member and the first reinforcing member are fixed on the two opposite surfaces of the circuit board through the plurality of second fasteners, which can limit the warping deformation of the circuit board on the two opposite surfaces, control the overall deformation rate of the circuit board within a certain range, thereby ensuring the reliable connection between the connector and the circuit board, and avoiding poor contact between the connector and the circuit board due to the deformation of the circuit board. The first fasteners and the second fasteners can be fixed on the first reinforcing member, which facilitates the installation of the first fasteners and the second fasteners. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0030] Figure 1A structural schematic diagram of an immersion liquid cooling server provided by the first embodiment of the present application is shown.

[0031] Figure 2 For Figure 1 A sectional view at II-II.

[0032] Figure 3 For Figure 2 An enlarged view at III.

[0033] Figure 4 A partial enlarged schematic diagram of an immersion liquid cooling server provided by the second embodiment of the present application is shown.

[0034] Figure 5 A partial enlarged schematic diagram of an immersion liquid cooling server provided by the third embodiment of the present application is shown.

[0035] Figure 6 A partial enlarged schematic diagram of an immersion liquid cooling server provided by the fourth embodiment of the present application is shown.

[0036] Figure 7 A partial enlarged schematic diagram of an immersion liquid cooling server provided by the first embodiment of the present application at VII is shown.

[0037] Figure 8 A partial enlarged schematic diagram of an immersion liquid cooling server provided by the fifth embodiment of the present application is shown.

[0038] Figure 9 A planar position schematic diagram of a connector, a first reinforcing member, a first fastener, a second fastener and a circuit board of an immersion liquid cooling server provided by an embodiment of the present application is shown.

[0039] Figure 10 A module schematic diagram of a server system in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0040] In order to enable persons skilled in the art to better understand the present application, the technical solutions in the present application will be described clearly and completely below with reference to the accompanying drawings in the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by persons skilled in the art without creative work should belong to the protection scope of the present application.

[0041] The terms "first", "second", and the like, if any, in the description and claims of this application and in the above drawings, are used only to distinguish similar objects, and are not necessarily used to describe a particular sequential or chronological order. It is to be understood that the use of the terms so construed herein can be interchanged, under appropriate circumstances, to describe the embodiments of the application described herein in other than the particular order discussed herein. Furthermore, the terms "comprise" and "comprising" and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, product, or apparatus that comprises a list of steps or elements not necessarily limited to those specifically listed, but can include additional steps or elements not expressly listed or inherent to such process, method, product, or apparatus.

[0042] Referring to Figure 1 , Figure 2 and Figure 3 , Figure 1 , a structure schematic diagram of an immersion liquid cooling server 1 provided by a first embodiment of the application is shown; Figure 2 is Figure 1 a sectional view at II-II; Figure 3 is Figure 2 an enlarged view at III. The immersion liquid cooling server 1 comprises a circuit board 11, a packaging cover 12, a first sealing member 13, a base plate 14, a connector 15, and a chip 16. The packaging cover 12 comprises a cover plate 121 and a side plate 122, and the cover plate 121 is arranged spaced apart from the circuit board 11. The side plate 122 is arranged between the cover plate 121 and the circuit board 11. One end of the side plate 122 is connected to the periphery of the cover plate 121. The first sealing member 13 is located between the end of the side plate 122 facing the circuit board 11 and the circuit board 11. A first sealed cavity 101 is formed between the packaging cover 12, the first sealing member 13, and the circuit board 11. The base plate 14 is located in the first sealed cavity 101. The chip 16 is located in the first sealed cavity 101 and arranged on the side of the base plate 14 away from the circuit board 11. The connector 15 is located in the first sealed cavity 101 and connected between the base plate 14 and the circuit board 11.

[0043] Therefore, the side plate 122 of the packaging cover 12 does not abut on the upper surface of the base plate 14, but extends to be adjacent to the circuit board 11, and a first sealed cavity 101 is formed between the circuit board 11 and the side plate 122 through the first sealing member 13, so that the connector 15 and the chip 16 are both located in the first sealed cavity 101. When immersed in the cooling working fluid, the first sealing member 13 can prevent the cooling working fluid from directly contacting the connector 15 and the chip 16, avoiding the immersion of the cooling working fluid from affecting the performance of the connector 15 and the chip 16.

[0044] The cooling working fluid can be selected from insulating cooling liquids such as silicon mineral oil or electronic fluorinated liquid, etc. In the present embodiment, the cooling working fluid is selected to be electronic fluorinated liquid.

[0045] The circuit board 11 can be, but is not limited to, a PCB (Printed Circuit Board) circuit board, which can be used as a mainboard or the like.

[0046] The substrate 14 can be a chip packaging substrate or the like.

[0047] The chip 16 includes, but is not limited to, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an HBM (High Bandwidth Memory), or the like.

[0048] In an embodiment, the chip 16 includes one CPU 161 and two HBMs 162, and the two HBMs 162 are located on two sides of the CPU 161. In other embodiments, the chip 16 can be one or more chips 16 of various types, which are not strictly limited herein.

[0049] In some embodiments, the first seal 13 is arranged around the connector 15, and the side plate 122 is arranged around the substrate 14.

[0050] Therefore, the circumferential shape of the first seal 13 is adapted to the circumferential shape of the side plate 122, and the circumferential size of the first seal 13 is adapted to the circumferential size of the side plate 122. The circumferential direction of the first seal 13 refers to the direction around the substrate 14. The circumferential direction of the side plate 122 refers to the direction around the substrate 14. By sealing the gap between the side plate 122 and the circuit board 11 with the first seal 13, the first seal cavity 101 is formed, which protects the connector 15 and the chip 16 from the cooling working fluid. In addition, the shape of the first seal 13 and the shape of the side plate 122 can be adjusted according to actual structural needs, so that the actual design process is more flexible.

[0051] In some embodiments, the first seal 13 and the side plate 122 are not limited in shape by the connector 15 and the substrate 14. The first seal 13 can be any structure capable of being disposed around the connector 15, and the side plate 122 can be any structure capable of being disposed around the substrate 14, as long as the annular shape of the first seal 13 is adapted to the annular shape of the side plate 122. In addition, it should be noted that the cover plate 121 is adapted in shape to the periphery of the side plate 122 and is connected to the side plate 122. In this embodiment, the chip 16 and the connector 15 are square, including but not limited to square or rectangular. The first seal 13 and the side plate 122 are square or rectangular rings adapted to the chip 16 and the connector 15. In some example embodiments, the first seal 13 and the side plate 122 are any structure capable of being disposed around the chip 16 and the connector 15, for example, a square seal ring, a circular seal ring, or a triangular seal ring.

[0052] In some embodiments, the first seal 13 can be an elastic polymer material. The first seal 13 forms a seal between the end of the side plate 122 and the circuit board 11 by compression deformation. The material of the first seal 13 can be a silicone rubber, a butadiene rubber, or a fluorine rubber, etc. In this embodiment, the first seal 13 made of a silicone rubber, a butadiene rubber, or a fluorine rubber, etc. has good compatibility with electronic fluorination liquid as the cooling working fluid, and has corrosion resistance, tear resistance, and compression deformation resistance, which can ensure the long-term reliability of the immersion liquid cooling server 1.

[0053] Please refer to Figure 4 , Figure 4 Fig. 2 shows a partial enlarged schematic view of an immersion liquid cooling server 1 provided by a second embodiment of the present application. The immersion liquid cooling server 1 in the second embodiment is similar in structure to the immersion liquid cooling server 1 in the first embodiment, and the difference lies in that, as shown in Figure 3 Fig. 2, in the first embodiment, the end of the side plate 122 facing the circuit board 11 is in plane contact with the circuit board 11. In the second embodiment, the end of the side plate 122 facing the circuit board 11 is provided with a first recess 1221, and the first seal 13 is provided with a first protrusion 131 corresponding to the position of the first recess 1221, and the first protrusion 131 is engaged with the first recess 1221.

[0054] Therefore, the first recess 1221 of the side plate 122 of the packaging cover 12 is engaged with the first protrusion 131 of the first seal 13, which can play a positioning role in the assembly between the packaging cover 12 and the first seal 13, and further increase the sealing between the side plate 122 and the first seal 13.

[0055] In some embodiments, the first recess 1221 is in a dot shape with the first protrusion 131, for example, the first recess 1221 is discontinuous in the circumferential direction of the lower end surface of the side plate 122 and / or the radial direction of the side plate 122. The circumferential direction of the side plate 122 refers to the direction in which the side plate 122 surrounds the substrate 14, and the radial direction of the side plate 122 refers to the radial direction of the side plate 122 in a ring structure. The first protrusion 131 is discontinuous in the circumferential direction of the upper surface of the first seal 13 and / or the radial direction of the first seal 13. The circumferential direction of the upper surface of the first seal 13 refers to the direction in which the first seal 13 surrounds the substrate 14, and the radial direction of the first seal 13 refers to the radial direction of the first seal 13 in a ring structure. The number of the first recess 1221 and the first protrusion 131 can be one or more.

[0056] In other embodiments, the first recess 1221 is in a ring structure shape with the first protrusion 131, for example, the first recess 1221 is continuous in the circumferential direction of the lower end surface of the side plate 122, and the first protrusion 131 is continuous in the circumferential direction of the upper surface of the first seal 13. Thus, when the first recess 1221 and the first protrusion 131 are engaged and fixed, the difficulty of the cooling working fluid entering the inside of the first sealed cavity 101 through the gap between the side plate 122 and the first seal 13 can be increased, thereby further improving the sealing performance between the first seal 13 and the side plate 122.

[0057] In other embodiments, the number of the first recess 1221 opened on the end of the side plate 122 towards the circuit board 11 can not be limited to one, but can also be two or more. The two or more first recesses 1221 are arranged in the radial direction of the lower end surface of the side plate 122 on the lower end surface of the side plate 122. Correspondingly, the number of the first protrusion 131 provided on the upper surface of the side plate 122 towards the first seal 13 can not be limited to one, but can also be two or more. The two or more first protrusions 131 are arranged in the radial direction of the first seal 13 on the upper surface of the first seal 13 towards the side plate 122. Thus, by arranging two or more first recesses 1221 and two or more first protrusions 131 engaged with the first recesses 1221 in parallel, the difficulty of the cooling working fluid entering the inside of the first sealed cavity 101 through the gap between the side plate 122 and the first seal 13 can be further increased, thereby further improving the sealing performance between the first seal 13 and the side plate 122.

[0058] In some embodiments, the shape of the first recess 1221 and the first protrusion 131 is adapted to each other, which can be, but is not limited to, a square shape, a triangular shape, an arc shape, etc. For example, the shape of the first recess 1221 and the first protrusion 131 is a square shape.

[0059] Please refer to Figure 5 , Figure 5Fig. 3 shows a partial enlarged schematic view of the immersion liquid cooling server 1 provided by the third embodiment of the present application. The immersion liquid cooling server 1 in the third embodiment is similar to the immersion liquid cooling server 1 in the first embodiment in structure, except that, as shown in Fig. 3, in the third embodiment, the end of the side plate 122 towards the circuit board 11 is provided with a second protrusion 1222, and the first sealing member 13 is provided with a second groove 132 corresponding to the position of the second protrusion 1222, and the second protrusion 1222 is engaged with the second groove 132. Figure 3

[0060] Thus, the second protrusion 1222 of the side plate 122 of the packaging cover 12 is engaged with the second groove 132 of the first sealing member 13, which can play a positioning role in the assembly of the packaging cover 12 and the first sealing member 13.

[0061] In some embodiments, the second protrusion 1222 and the second groove 132 are in a dot shape, for example, the second protrusion 1222 is discontinuous in the circumferential direction and / or radial direction of the lower end surface of the side plate 122, and the second groove 132 is discontinuous in the circumferential direction and / or radial direction of the upper surface of the first sealing member 13. The number of the second protrusion 1222 and the second groove 132 can be one or more.

[0062] In other embodiments, the second protrusion 1222 and the second groove 132 are in a ring shape, for example, the second protrusion 1222 is continuous in the circumferential direction of the lower end surface of the side plate 122, and the second groove 132 is continuous in the circumferential direction of the upper surface of the first sealing member 13. Thus, when the second protrusion 1222 is engaged and fixed with the second groove 132, it can increase the difficulty of the cooling working fluid entering the inside of the first sealing cavity 101 through the gap between the side plate 122 and the first sealing member 13, thereby further improving the sealing performance between the first sealing member 13 and the side plate 122.

[0063] ​In some other embodiments, the number of the second protrusions 1222 protruding from the end of the side plate 122 towards the circuit board 11 can not be limited to one, but can also be two or more, and the two or more second grooves 132 are arranged along the radial direction of the side plate 122 on the lower end surface of the side plate 122. Correspondingly, the number of the second grooves 132 opened on the upper surface of the side plate 122 towards the side of the first sealing member 13 can not be limited to one, but can also be two or more, and the two or more second protrusions 1222 are arranged along the radial direction of the first sealing member 13 on the upper surface of the first sealing member 13. Thus, by arranging two or more second protrusions 1222 and the two or more second grooves 132 respectively engaged with the second protrusions 1222 in parallel, the difficulty of the cooling working fluid entering the first sealing cavity 101 through the gap between the side plate 122 and the first sealing member 13 can be further increased, and thus the sealing performance between the first sealing member 13 and the side plate 122 can be further improved.

[0064] In some embodiments, the shapes of the second protrusions 1222 and the second grooves 132 are engaged with each other, and the shapes can be, but are not limited to, square, triangle, arc, etc. For example, the shapes of the second protrusions 1222 and the second grooves 132 are both square.

[0065] In some embodiments, the first grooves 1221, the first protrusions 131, the second grooves 132 and the second protrusions 1222 can all be omitted. Please refer to Figure 6 Figure 6 ​Fig. 4 is a partial enlarged view of the immersion liquid cooling server 1 provided by the fourth embodiment of the present application. The immersion liquid cooling server 1 in the fourth embodiment is similar to the immersion liquid cooling server 1 in the first embodiment in structure, except that the immersion liquid cooling server 1 in the fourth embodiment further comprises a first adhesive 17, which is attached between the end of the side plate 122 and the first sealing member 13. The first adhesive 17 can improve the sealing performance between the first sealing member 13 and the side plate 122, and can avoid the relative movement between the first sealing member 13 and the side plate 122 caused by external force, thereby increasing the structural stability between the first sealing member 13 and the side plate 122. In another embodiment, the first adhesive 17 can also be arranged between the first sealing member 13 and the circuit board 11, so as to improve the sealing performance between the first sealing member 13 and the circuit board 11, and to avoid the relative movement between the first sealing member 13 and the circuit board 11 caused by external force, thereby increasing the structural stability between the first sealing member 13 and the circuit board 11. The first adhesive 17 can be, but is not limited to, glue, adhesive tape, and the like. In another embodiment, the first adhesive 17 can be attached between the first sealing member 13 provided with the first protrusion 131 and the end of the side plate 122 provided with the first groove 1221, so as to improve the sealing performance between the first sealing member 13 and the side plate 122. In another embodiment, the first adhesive 17 can also be attached between the first sealing member 13 provided with the second groove 132 and the end of the side plate 122 provided with the second protrusion 1222, so as to improve the sealing performance between the first sealing member 13 and the side plate 122.

[0066] In another embodiment, the first sealing member 13 can also be connected to the side plate 122 of the packaging cover 12 and the circuit board 11 without compression deformation. For example, in some embodiments, the two opposite surfaces of the first sealing member 13 can be attached to the end of the side plate 122 of the packaging cover 12 and the circuit board 11, respectively, so as to connect the end of the side plate 122 of the packaging cover 12 and the circuit board 11.

[0067] In some embodiments, please refer to Figure 2 and Figure 7 , Figure 7 for Figure 2 the partial enlarged view at VII. The substrate 14 comprises an upper surface 143 and a lower surface 144 arranged oppositely, and a first side surface 141 connected between the upper surface 143 of the substrate 14 and the lower surface 144 of the substrate 14; the immersion liquid cooling server 1 further comprises a second sealing member 170, which is arranged around the substrate 14 and connected between the first inner side surface 1223 of the side plate 122 and the first side surface 141 of the substrate 14, so as to form a second sealing cavity 102 between the packaging cover 12, the substrate 14 and the second sealing member 170, and the chip 16 is arranged in the second sealing cavity 102.

[0068] Thus, the second sealing member 170 forms a second sealing protection, further improving the sealing performance of the second sealing cavity 102, and better protecting the performance of the chip 16 from the cooling working fluid.

[0069] In some embodiments, the second sealing member 170 is a sealant filled between the first inner side surface 1223 of the side plate 122 and the first side surface 141 of the substrate 14. During assembly, the sealant is first applied to the corresponding position of the first inner side surface 1223 of the side plate 122 and / or the first side surface 141 of the substrate 14. When the packaging cover 12 is placed on the substrate 14, the sealant is filled into the gap between the first inner side surface 1223 of the side plate 122 and the first side surface 141 of the substrate 14 to form the second sealing member 170 to achieve the sealing effect.

[0070] In some embodiments, the first side surface 141 of the substrate 14 is provided with a protrusion and / or a groove for increasing friction at the mounting position corresponding to the second sealing member 170. Thus, when the sealant is applied to the first side surface 141 of the substrate 14, the protrusion and / or the groove can improve the adhesion between the sealant and the first side surface 141 of the substrate 14.

[0071] In some embodiments, the first inner side surface 1223 of the side plate 122 is provided with a protrusion and / or a groove for increasing friction at the mounting position corresponding to the second sealing member 170. Thus, when the sealant is applied to the first inner side surface 1223 of the side plate 122, the protrusion and / or the groove can improve the adhesion between the sealant and the first inner side surface 1223 of the side plate 122.

[0072] In some embodiments, the first side surface 141 of the substrate 14 and the first inner side surface 1223 of the side plate 122 are both provided with a protrusion and / or a groove for increasing friction at the mounting position corresponding to the second sealing member 170. Thus, the adhesion between the sealant and the first side surface 141 of the substrate 14 and the first inner side surface 1223 of the side plate 122 can be further increased.

[0073] In other embodiments, the second sealing member 170 can be an elastic polymer material. The material of the second sealing member 170 can be a silicone rubber, a butadiene rubber, or a fluorine rubber, etc.

[0074] In some embodiments, when the second sealing member 170 is an elastic polymer material, the second sealing member 170 can be sleeved on the first side surface 141 of the substrate 14. When the packaging cover 12 is placed on the substrate 14, the first inner side surface 1223 of the side plate 122 of the packaging cover 12 extrudes the second sealing member 170, causing the second sealing member 170 to be compressed and deformed to form a seal between the first inner side surface 1223 of the side plate 122 and the first side surface 141 of the substrate 14.

[0075] In some embodiments, referring to FIG. 1, Figure 8 , Figure 8 FIG. 1 is a partial enlarged schematic view of an immersion liquid cooling server 1 provided by a fifth embodiment of the present application. The immersion liquid cooling server 1 in the fifth embodiment is similar to the immersion liquid cooling server 1 in the first embodiment in structure, except that a third groove 142 is arranged on the first side surface 141 of the substrate 14, and a third protrusion 171 is arranged on the second sealing member 170, and the third protrusion 171 is arranged in the third groove 142.

[0076] Thus, the third protrusion 171 corresponds to being inserted into the third groove 142, and can play a fitting positioning role between the second sealing member 170 and the first side surface 141 of the substrate 14.

[0077] In some embodiments, the third protrusion 171 and the third groove 142 are in a point shape, that is, the third protrusion 171 is discontinuous in the circumferential direction and / or the height direction of the second inner side surface 172 of the second sealing member 170; wherein the circumferential direction of the second inner side surface 172 of the second sealing member 170 refers to the direction around the substrate 14, and the height direction of the second inner side surface 172 of the second sealing member 170 refers to the direction perpendicular to the surface of the circuit board 11 toward the packaging cover 12 side. The third groove 142 is discontinuous in the circumferential direction and / or the height direction of the first side surface 141 of the substrate 14. Wherein the circumferential direction of the first side surface 141 of the substrate 14 refers to the direction around the substrate 14, and the height direction of the first side surface 141 of the substrate 14 refers to the direction perpendicular to the surface of the circuit board 11 toward the packaging cover 12 side. The number of the third protrusion 171 and the third groove 142 can be one or more.

[0078] In some embodiments, the third protrusion 171 and the third groove 142 are in a surrounding structure shape, that is, the third protrusion 171 is continuous in the circumferential direction of the second inner side surface 172 of the second sealing member 170, and the third groove 142 is continuous in the circumferential direction of the first side surface 141 of the substrate 14. Thus, the third protrusion 171 cooperates with the third groove 142, which can increase the difficulty of the cooling working fluid entering the inside of the second sealing cavity 102 through the gap between the substrate 14 and the second sealing member 170, thereby further improving the sealing performance between the second sealing member 170 and the substrate 14.

[0079] In some embodiments, the number of third protrusions 171 on the second inner side 172 of the second sealing member 170 can not be limited to one, but can also be two or more. The two or more third protrusions 171 are arranged side by side in the height direction of the second inner side 172 of the second sealing member 170. Correspondingly, the number of third grooves 142 arranged on the first side 141 of the substrate 14 can not be limited to one, but can also be two or more. The two or more third grooves 142 are arranged side by side in the height direction of the first side 141 of the substrate 14. When each third protrusion 171 is buckled with the corresponding third groove 142, the difficulty of the cooling working fluid entering the inside of the second sealing cavity 102 through the gap between the second sealing member 170 and the substrate 14 is further increased, thereby further improving the sealing performance between the second sealing member 170 and the substrate 14.

[0080] In some embodiments, the shapes of the third protrusions 171 and the third grooves 142 are matched, which can be, but are not limited to, square, triangular, arc-shaped, etc.

[0081] In some embodiments, the positions of the third protrusions 171 and the third grooves 142 can also be interchanged. For example, a fourth protrusion is arranged on the first side 141 of the substrate 14, and a fourth groove is arranged on the second inner side 172 of the second sealing member 170. The fourth protrusion is arranged in the fourth groove, which also can achieve the effect of further improving the sealing performance between the second sealing member 170 and the substrate 14.

[0082] In some embodiments, the outer side of the second sealing member 170 and the first inner side 1223 of the side plate 122 can also be respectively provided with matched protrusions and / or grooves to increase the sealing performance of the outer side of the second sealing member 170 and the first inner side 1223 of the side plate 122. For example, a fifth groove is arranged on the first inner side 1223 of the side plate 122, and a fifth protrusion is arranged on the outer side of the second sealing member 170. The fifth protrusion is arranged in the fifth groove. For another example, a sixth protrusion is arranged on the first inner side 1223 of the side plate 122, and a sixth groove is arranged on the second sealing member 170. The sixth protrusion is arranged in the sixth groove. Thus, the sealing performance between the second sealing member 170 and the side plate 122 is further improved.

[0083] Please refer to Figure 2 The immersion liquid cooling server 1 further comprises a packaging substrate 164. The chip 16 is packaged on the substrate 14 through the packaging substrate 164. The packaging substrate 164 can provide the chip 16 with electrical connection, protection, support, heat dissipation, assembly, etc. to achieve multi-pin, reduce the size of the packaged product, improve electrical performance and heat dissipation, and achieve the purpose of ultra-high density or multi-chip modularization.

[0084] The bottom filling glue 165 can be used for filling the gap between the package substrate 164 and the substrate 14. When the package substrate 164 is mounted on the surface of the substrate 14 in the form of a solder ball array, the bottom filling glue 165 can be used to wrap the solder balls. The bottom filling glue 165 can be selected from epoxy resin or other plastics commonly used in the art.

[0085] In the embodiment, the bottom filling glue 165 can effectively improve the mechanical strength of the solder balls, and make the connection of the solder balls and the substrate 14 and the package substrate 164 more solid, and enhance the drop resistance of the immersion liquid cooling server 1. In addition, the bottom filling glue 165 made of epoxy resin has good heat conduction performance, and the heat of the chip 16 can be quickly dissipated to the substrate 14 through the package substrate 164 and the bottom filling glue 165, and then conducted to the package cover 12 through the substrate 14, avoiding the heat accumulation at the bottom of the chip 16, which helps to further improve the heat dissipation efficiency of the chip 16. In addition, the epoxy resin also has excellent insulation performance, which can ensure the insulation of the chip 16 through the insulating layer, avoiding short circuit caused by chip 16 electric leakage. Therefore, the bottom filling glue 165 made of epoxy resin helps to improve the packaging reliability of the chip 16, and can optimize the working temperature environment of the chip 16, and improve the service life of the chip 16.

[0086] The side filling glue 166 can be arranged between the cover plate 121 and the substrate 14. The side filling glue 166 surrounds the package substrate 164, and can be used to fill the gap between the cover plate 121 and the substrate 14. The side filling glue 166 can be selected from epoxy resin or other plastics commonly used in the art.

[0087] In the embodiment, the side filling glue 166 provides a pulling force between the cover plate 121 and the substrate 14, which is used to offset the force for separating the solder balls and the substrate 14 and the package substrate 164 when the solder balls and the substrate 14 and the package substrate 164 are subjected to external force. The side filling glue 166 can further improve the mechanical strength of the solder balls, and make the connection of the solder balls and the substrate 14 and the package substrate 164 more solid, and enhance the drop resistance of the immersion liquid cooling server 1.

[0088] In some embodiments, the package substrate 164 can be mounted on the surface of the substrate 14 in the form of a solder ball array. For example, the side of the package substrate 164 facing the substrate 14 can be flip-chip soldered on the surface of the substrate 14 through a plurality of matrix arranged solder balls, and electrically connected to the substrate 14. In other embodiments, the package substrate 164 can also be fixed to the substrate 14 by other means, which is not limited in the application.

[0089] It can be understood that the connector 15 can be a double-sided probe connector, a one-side probe and one-side solder connector, or a double-side solder connector, etc.

[0090] In the embodiment, one side of the connector 15 is soldered on the circuit board 11, and the other side of the connector 15 is connected to the substrate 14 in a contact manner. In other embodiments, the two sides of the connector 15 can be soldered on the circuit board 11 and the substrate 14 respectively. In another embodiment, the two sides of the connector 15 can be connected to the circuit board 11 and the substrate 14 in a contact manner respectively.

[0091] In some embodiments, referring again to Figure 3 , the connector 15 is provided with a first guide portion 151, and the side plate 122 is provided with a second guide portion 1224. When the package cover 12 is arranged above the connector 15, the first guide portion 151 and the second guide portion 1224 are in contact and fit.

[0092] In some embodiments, the first guide portion 151 is a wedge surface provided on the side wall of the connector 15, and the second guide portion 1224 is a wedge surface provided on the first inner side surface 1223 of the side plate 122. The wedge surface of the first guide portion 151 and the wedge surface of the second guide portion 1224 are in contact and fit to guide.

[0093] In an example embodiment, the first guide portion 151 is a guide protrusion provided on the side wall of the connector 15, and the second guide portion 1224 is a guide groove provided on the first inner side surface 1223 of the side plate 122 and matched with the guide protrusion.

[0094] In an example embodiment, the first guide portion 151 is a guide groove provided on the side wall of the connector 15, and the second guide portion 1224 is a guide protrusion provided on the first inner side surface 1223 of the side plate 122 and matched with the guide groove.

[0095] In an example embodiment, the side plate 122 forms a stepped groove on the inner side of the end portion close to the circuit board 11, and a guide protrusion is arranged on the top surface of the stepped groove, which is the second guide portion 1224. The position of the connector 15 corresponding to the guide protrusion is provided with a guide hole, which is the first guide portion 151.

[0096] In some embodiments, the connector 15 is a square connector. The first guide portion 151 is discontinuous in the circumferential direction of the connector 15. Here, the circumferential direction of the connector 15 refers to the direction around the connector 15. Accordingly, the second guide portion 1224 is discontinuous in the circumferential direction of the first inner side surface 1223 of the side plate 122. Here, the circumferential direction of the first inner side surface 1223 refers to the direction around the connector 15. For example, the first guide portion 151 is arranged on at least one of the top corners of the connector 15. Accordingly, the second guide portion 1224 is arranged on the corresponding top corner of the side plate 122 of the package cover 12. In some embodiments, the first guide portion 151 can be arranged not only on the top corner of the connector 15, but also on at least one of the side walls of the connector 15. Accordingly, the second guide portion 1224 can also be arranged on the corresponding first inner side surface 1223 of the side plate 122 of the package cover 12. In some embodiments, the first guide portion 151 can be arranged only on at least one of the side walls of the connector 15, and accordingly, the second guide portion 1224 can also be arranged on the corresponding first inner side surface 1223 of the side plate 122 of the package cover 12. In some embodiments, the number of first guide portions 151 is not limited to one, and can also be multiple, with the multiple first guide portions 151 being arranged at intervals in the circumferential direction of the connector 15. Accordingly, the number of second guide portions 1224 is not limited to one, and can also be multiple, with the multiple second guide portions 1224 being arranged at intervals in the circumferential direction of the first inner side surface 1223 of the side plate 122. In some embodiments, the first guide portion 151 is continuous in the circumferential direction of the connector 15. Accordingly, the second guide portion 1224 is continuous in the circumferential direction of the first inner side surface 1223 of the side plate 122. In some embodiments, the number of first guide portions 151 is not limited to one, and can also be multiple, with the multiple first guide portions 151 being arranged side by side. Accordingly, the number of second guide portions 1224 is not limited to one, and can also be multiple, with the multiple second guide portions 1224 being arranged side by side. Here, no strict limitation is made.

[0097] Therefore, in the actual assembly process, the package cover 12 and the chip 16, the package substrate 164, the substrate 14 and the second sealing member 170 arranged in the package cover 12 are an assembled whole, and this whole needs to be assembled as a whole to the connector 15. Since the connector 15 has multiple first connection points, the substrate 14 has multiple second connection points, and the multiple first connection points and the multiple second connection points have a one-to-one correspondence, misconnection will cause the substrate 14 and the connector 15 to not work normally, and even be burned out due to short circuit. Therefore, when the whole is mounted on the connector 15, the second guide portion 1224 on the side plate 122 needs to abut against the first guide portion 151 on the connector 15. The first guide portion 151 and the second guide portion 1224 are in contact and cooperation, the first guide portion 151 and the second guide portion 1224 guide the accurate positioning of the package cover 12 and the connector 15, and thus the accurate positioning and connection between the substrate 14 and the connector 15 are realized.

[0098] In some embodiments, referring again to Figure 2 The packaging cover 12 can be made of a metal material, such as copper, copper alloy, aluminum, aluminum alloy, carbon compound, steel, and steel alloy. The packaging cover 12 made of a metal material has high hardness and high thermal conductivity. The chip 16 is located on the inner side of the packaging cover 12, which not only provides protection and fixation for the chip 16, but also helps to optimize the heat dissipation effect of the immersion liquid cooling server 1. In other embodiments, the packaging cover 12 can also be made of other materials with good thermal conductivity, which is not strictly limited in the present application. The packaging cover 12 can use metal as the base material, and a protective layer is arranged on the surface of the metal base material. For example, the packaging cover 12 can use copper as the base material, and nickel is plated on the surface of the copper. In the present embodiment, plating nickel on the surface of the metal base material can improve the corrosion resistance and wear resistance of the packaging cover 12.

[0099] In some embodiments, referring again to Figure 1 and Figure 2 The immersion liquid cooling server 1 further comprises a heat sink 18, which is arranged on the outer surface of the cover plate 121 away from the circuit board 11; the immersion liquid cooling server 1 further comprises a plurality of first fasteners 191, which are connected between the heat sink 18 and the circuit board 11; the plurality of first fasteners 191 provide a pulling force between the heat sink 18 and the circuit board 11 to cause the first sealing member 13 to compress and deform, so that a sealed cavity 101 is formed between the packaging cover 12, the first sealing member 13, and the circuit board 11.

[0100] The heat sink 18 can be a heat sink plate, a heat sink fin, or a heat pipe structure according to different situations. The heat sink 18 is made of a metal material or an alloy material, such as but not limited to aluminum, magnesium, copper, stainless steel, ceramic, graphite, etc. The alloy material is, for example, but not limited to, aluminum alloy, magnesium alloy, etc. It should be noted that the material of the heat sink 18 can be selected according to actual needs, and the embodiments of the present application do not make specific limitations. For example, the first fastener 191 can be a stud, a fastener, a latch, a rod, a clamp, etc. In the present embodiment, the first fastener 191 is a stud. The plurality of first fasteners 191 are arranged around the periphery of the heat sink 18.

[0101] Therefore, the heat sink 18 not only can play a role of heat dissipation, but also can play a role of enhancing the overall structural strength of the liquid immersion cooling server 1 due to the good structural strength of the heat sink 18 itself. A spring (not shown in the figure) is further arranged on the first fastener 191. When installed, one end of the first fastener 191 passes through the heat sink 18 and is connected between the heat sink 18 and the circuit board 11 from the top end of the heat sink 18. The spring is located between the top surface of the heat sink 18 and the head of the first fastener 191. Through the cooperation of the first fastener 191 and the spring, a suitable loading force can be provided between the heat sink 18 and the circuit board 11, which can overcome the elastic restoring force of the first sealing member 13 and increase the sealing between the side plate 122, the first sealing member 13 and the circuit board 11.

[0102] In some embodiments, the liquid immersion cooling server 1 further comprises a first thermal conductive layer and a second thermal conductive layer. The first thermal conductive layer is arranged between the inner surface of the cover plate 121 and the chip 16, and is used to realize heat transfer between the chip 16 and the cover plate 121. The second thermal conductive layer is arranged between the outer surface of the cover plate 121 and the heat sink 18, and is used to realize heat transfer between the cover plate 121 and the heat sink 18.

[0103] In some embodiments, the first thermal conductive layer and the second thermal conductive layer can both adopt thermal interface material (TIM). Thermal interface material, also known as interface thermal conductive material, has good thermal conductivity and can effectively transfer heat.

[0104] In the present embodiment, the heat generated by the chip 16 is transferred to the packaging cover 12 through the first thermal conductive layer, and then transferred to the heat sink 18 through the second thermal conductive layer for heat dissipation. The heat of the chip 16 can be more quickly conducted to the heat sink 18 through the first thermal conductive layer and the second thermal conductive layer, thereby improving the overall heat dissipation efficiency of the circuit board 11.

[0105] In some embodiments, the materials of the first thermal conductive layer and the second thermal conductive layer can be the same or different, and the present application does not make specific limitations thereon, which can be selected as needed in practice. For example, the materials for preparing the first thermal conductive layer and the second thermal conductive layer can adopt conventional carbon fiber thermal conductive pads, thermal conductive silica gel pads, gels, silicon grease, phase change thermal conductive materials (such as phase change silicon grease) or metal (such as metal indium, nano-silver, indium / silver alloy) and other thermal interface materials.

[0106] In some embodiments, referring to Figure 1 , Figure 2 and Figure 9 , the liquid immersion cooling server 1 comprises a first reinforcing member 192, which is arranged around the side plate 122 and fixed on the side of the circuit board 11 facing the packaging cover 12.

[0107] In an example embodiment, the first reinforcing member 192 has a ring structure. The circumferential dimension of the first reinforcing member 192 is consistent with the circumferential dimension of the side plate 122. For example, the side plate 122 is a square ring, and the first reinforcing member 192 is a square ring with a circumferential dimension consistent with that of the square ring of the side plate 122. For another example, the side plate 122 is a circular ring, and the first reinforcing member 192 is a circular ring with a circumferential dimension consistent with that of the circular ring of the side plate 122. In another embodiment, the circumferential dimension of the first reinforcing member 192 is inconsistent with the circumferential dimension of the side plate 122. For example, the side plate 122 is a square ring, and the first reinforcing member 192 is a rectangular ring, a circular ring, a polygonal ring, or another ring structure with a regular or irregular shape around the side plate 122.

[0108] Thus, the first reinforcing member 192 can limit the warping deformation of the circuit board 11, enhance the structural strength of the circuit board 11, and provide a mounting position for the first fastener 191.

[0109] In some embodiments, the liquid-submerged server 1 further includes a second reinforcing member 193 arranged on the surface of the side of the circuit board 11 away from the packaging cover 12, and a plurality of second fasteners 194 connecting the first reinforcing member 192, the circuit board 11, and the second reinforcing member 193. For example, the second fastener 194 can be a stud, a buckle, a latch, a rod, a clamp, or the like. In this embodiment, the second fastener 194 is a stud. The plurality of second fasteners 194 are arranged around the periphery of the heat sink 18.

[0110] In some embodiments, the second reinforcing member 193 and the first reinforcing member 192 are fixed on the opposite surfaces of the circuit board 11 by the plurality of second fasteners 194, clamping the circuit board 11, limiting the warping deformation of the circuit board 11 on the opposite surfaces of the circuit board 11, and controlling the overall deformation rate of the circuit board 11 within a certain range, thereby ensuring the reliable connection between the connector 15 and the circuit board 11 and avoiding poor contact between the connector 15 and the circuit board 11 due to the deformation of the circuit board 11.

[0111] In some example embodiments, the second reinforcing member 193 has a plate structure and is attached to the surface of the side of the circuit board 11 away from the packaging cover 12. In other embodiments, the second reinforcing member 193 can also have a partially hollow plate structure or a ring structure. This is not strictly limited here.

[0112] In some embodiments, the projections of the first fastener 191 and the second fastener 194 on the surface of the circuit board 11 do not coincide.

[0113] Therefore, the first fastener 191 and the second fastener 194 can be fixed at different positions of the first reinforcing member 192, so that the first fastener 191 and the second fastener 194 can be screwed deeper in the mounting hole of the first reinforcing member 192 respectively, thereby ensuring the connection reliability.

[0114] In some other embodiments, the projections of the first fastener 191 and the second fastener 194 on the surface of the circuit board 11 coincide.

[0115] Therefore, the first fastener 191 and the second fastener 194 can be fixed on opposite surfaces of the first reinforcing member 192 and respectively pass through the same mounting hole of the first reinforcing member 192 from the opposite surfaces of the first reinforcing member 192, so that only one mounting hole penetrating up and down is required to be arranged at the corresponding position of the first reinforcing member 192 for each group of the first fastener 191 and the second fastener 194, thereby facilitating the processing of the mounting hole.

[0116] It can be understood that the immersion server further includes a shell for accommodating the liquid cooling working medium, and the circuit board, the packaging cover, the first sealing member, the substrate, the connector, the chip and the heat sink and other components are immersed in the liquid cooling working medium.

[0117] It can be understood that the immersion server further includes a shell for accommodating the liquid cooling working medium, and the circuit board, the packaging cover, the first sealing member, the substrate, the connector, the chip and the heat sink and other components are immersed in the liquid cooling working medium. Figure 10 The server system 3 provided by the embodiment of the present application includes the immersion liquid cooling server 1 and a liquid cooling working medium supply device 2, wherein the liquid cooling working medium supply device 2 provides the liquid cooling working medium for the immersion liquid cooling server 1.

[0118] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described systems, devices and units can refer to the corresponding processes in the foregoing method embodiments, which will not be described herein. In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0119] It should be noted that, for the foregoing method embodiments, in order to simply describe, they are all expressed as a series of action combinations, but those skilled in the art should know that the present application is not limited to the action sequence described, because according to the present application, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should know that the embodiments described in the specification all belong to preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0120] In several embodiments provided by the present application, it should be understood that the disclosed system, device and method can be implemented in other ways. For example, the device embodiments described above are only schematic.

[0121] The above, the above examples are only to illustrate the technical solutions of the present application, rather than limit them; although the present application is described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still be modified to the technical solutions recorded in the foregoing examples, or equivalent replacement is made to part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An immersion liquid cooling server, characterized in that: The server comprises a circuit board, a packaging cover, a first sealing member, a substrate, a connector and a chip. The packaging cover comprises a cover plate and a side plate, the cover plate is arranged in a spaced manner with the circuit board, and the side plate is arranged between the cover plate and the circuit board, and one end of the side plate is connected with the periphery of the cover plate. The first sealing member is located between the end of the side plate facing the circuit board and the circuit board, and a first sealing cavity is formed between the packaging cover, the first sealing member and the circuit board. The substrate is located in the first sealing cavity, and the chip is located in the first sealing cavity and arranged on the side of the substrate away from the circuit board. The connector is located in the first sealing cavity and connected between the substrate and the circuit board. The substrate comprises an upper surface and a lower surface arranged in a back-to-back manner, and a first side surface is connected between the upper surface of the substrate and the lower surface of the substrate. The server further comprises a second sealing member, which is arranged around the substrate and connected between the inner side of the side plate and the first side surface of the substrate. A second sealing cavity is formed between the packaging cover, the substrate and the second sealing member, and the chip is arranged in the second sealing cavity. The server further comprises a first adhesive member, which is arranged between the other end of the side plate facing the circuit board and the first sealing member and / or between the first sealing member and the circuit board.

2. The liquid submersion cooled server of claim 1, wherein, A first recess is formed in the other end of the side plate facing the circuit board, the first sealing member is provided with a first protrusion corresponding to the position of the first recess, and the first protrusion is engaged with the first recess; or 3. The liquid submersion cooled server of claim 1 or 2, wherein, A second protrusion is arranged at the end of the side plate facing the circuit board, the first sealing member is provided with a second recess corresponding to the position of the second protrusion, and the second protrusion is engaged with the second recess. A first guide portion is arranged on the side wall of the connector, and a second guide portion is arranged on the end of the side plate, and the first guide portion is in contact with the second guide portion.

4. The liquid submersion cooled server of any of claims 1 to 3, wherein, The first guide portion and the second guide portion are wedge-shaped surfaces.

5. The liquid submersion cooled server of claim 4, wherein, One of the first guide portion and the second guide portion is a guide protrusion, and the other is a guide recess matched with the guide protrusion.

6. The liquid submersion cooled server of claim 4, wherein, The server further comprises a heat sink and a plurality of first fasteners; the heat sink is arranged on the side surface of the cover plate away from the circuit board; and the plurality of first fasteners are connected between the heat sink and the circuit board.

7. The liquid submersion cooled server of any of claims 1 to 6, wherein, The server comprises a first reinforcing member, which is arranged around the side plate and fixed on the surface of the circuit board facing the packaging cover.

8. The liquid submersion cooled server of any of claims 1 to 7, wherein, The server further comprises a second reinforcing member and a plurality of second fasteners, the second reinforcing member is arranged on the surface of the circuit board away from the packaging cover, and the plurality of second fasteners connect the first reinforcing member, the circuit board and the second reinforcing member; wherein the projections of the plurality of first fasteners and the plurality of second fasteners on the surface of the circuit board do not coincide.

9. The liquid submersion cooled server of claim 8, wherein, ​

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