Endoscope tip assembly using a lumen inserter to allow coplanar camera and LED

Abstract

A cavity inserter having a cavity; a first bonding pad adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bonding pad coupled to a second bonding pad at the base of the inserter at a second level via a feedthrough; and a third bonding pad adapted to couple to a light emitting diode (LED), the third bonding pad being at a third level. The third bonding pad is coupled to a fourth bonding pad at the base of the inserter at the second level; the second bonding pad and the fourth bonding pad are coupled to conductors of a cable, the first level, the second level, and the third level being different. An endoscopic optical device comprising a cavity inserter, an LED, and a chip-type camera cube electrically coupled to the first bonding pad; the LED coupled to the third bonding pad; the top of the chip-type camera cube and the top of the LED being at the same level.

Description

Technical Field

[0001] The present disclosure relates to endoscopy technology, and more particularly to a cavity inserter, an endoscope optical head, and an endoscope imaging system including an endoscope. Background Art

[0002] Endoscopes have become common in medicine for examining tissues or observing and guiding surgery without having to make large incisions so that the tissues can be seen with the naked eye, and similar devices are often used to inspect small areas of mechanical equipment to avoid the need for disassembly. Typically, the distal end of the endoscope is inserted into a small area or body, and the doctor or other user observes the displayed image through a display device near the proximal end of the endoscope.

[0003] Endoscopes in the past often had a camera with a lens that focused light onto one end of a coherent fiber optic bundle at the distal end of the endoscope, and directed light from an external illuminator through the fiber optics onto the tissue or area to be examined at the front end of the lens; the fiber optics brought the image from the distal end of the endoscope to a display device near the proximal end of the endoscope.

[0004] As electronic cameras become smaller, there is a growing trend to place a light source such as a light emitting diode (LED) or laser diode along with the electronic camera at the distal end of the endoscope and transmit the signal from the electronic camera to a display device near the proximal end of the endoscope.

[0005] Chip-based electronic cameras have become common in mobile phones and similar devices. They are formed at the wafer level by bonding a wafer of image sensor integrated circuits to a spacer wafer, and then bonding a wafer of lenses to the spacer wafer. This positions the lenses in front of each image sensor and spaced apart by the focal length. The composite wafer is then sawed into individual cameras, which are then surface-mounted onto a substrate.

[0006] If the LED and chip-type electronic camera are surface mounted on a single planar substrate at the distal end of the endoscope, the camera may obstruct part of the field of view in front of the distal end of the endoscope because the LED is much thinner than the chip-type electronic camera. Summary of the Invention

[0007] In an embodiment, a cavity interposer has a cavity, a first bonding pad adapted to couple to a chip camera cube disposed within a base of the cavity at a first level, the first bonding pad coupled to a second bonding pad at the base of the interposer at a second level via a feedthrough; and a third bonding pad adapted to couple to a light emitting diode (LED), the third bonding pad being at a third level. The third bonding pad is coupled to a fourth bonding pad at the base of the interposer at the second level; the second bonding pad and the fourth bonding pad are coupled to conductors of a cable, wherein the first level, the second level, and the third level are different. In an embodiment, an endoscopic optical device comprises a cavity interposer, an LED, and a chip camera cube electrically coupled to the first bonding pad; the LED is coupled to the third bonding pad; and the top of the chip camera cube and the top of the LED are at the same level.

[0008] In an embodiment, an endoscopic optical head includes the above-mentioned cavity inserter, at least one LED and a chip-type camera cube, wherein: the chip-type camera cube is ball-bonded to the first bonding pad; the LED is connected to the third bonding pad; and the top of the chip-type camera cube and the top of the LED are at the same level.

[0009] In an embodiment, the endoscopic optical head further comprises: a cable comprising a plurality of electrical conductors coupled to a bonding pad of the second bonding pad or the fourth bonding pad.

[0010] In an embodiment, the LED ball is bonded to the third bond pad.

[0011] In an embodiment, the LED is wire bonded to the third bond pad, and wherein the third bond pad is at the same level as the top of the LED.

[0012] In an embodiment, the camera cube has a tiled pattern that includes an infrared filter.

[0013] In an embodiment, the endoscope optical head has a plurality of LEDs, and at least one LED is a white light LED and at least one LED is a fluorescence stimulation wavelength LED.

[0014] In an embodiment, the camera cube has a tiled pattern that includes an infrared filter.

[0015] In an embodiment, the endoscope optical head has a plurality of LEDs, and at least one LED is a white light LED and at least one LED is a fluorescence stimulation wavelength LED.

[0016] In an embodiment, an endoscopic imaging system includes an endoscope including a cavity inserter having a body configured with a cavity, the body including a plurality of first bonding pads, the plurality of first bonding pads being adapted to couple to bonding pads of a chip camera cube (C-cube), the first bonding pads being disposed within a base of the cavity at a first level, the first bonding pads being coupled to second bonding pads at the base of the cavity inserter at a second level via a feedthrough; and a plurality of third bonding pads, the plurality of third bonding pads being adapted to couple to bonding pads of a light emitting diode (LED), the third bonding pads being disposed at a third level; The three bonding pads are coupled to a fourth bonding pad at the base of the cavity inserter at a second level through a feedthrough; the second bonding pad and the fourth bonding pad are suitable for coupling to a conductor of a cable; and the first level, the second level and the third level are different; a chip-type camera cube, the chip-type camera cube is disposed in the cavity and has a bonding pad electrically coupled to the cavity inserter; a light-emitting diode, the light-emitting diode is mounted to the third bonding pad; a cable, the cable having a first end coupled to the second bonding pad and the fourth bonding pad and a second end coupled to the connector; and a connector, the connector is electrically connected to the digital image display and processing system.

[0017] In an embodiment, the endoscope further comprises a second LED coupled to a bonding pad of the cavity inserter, the second LED being adapted to provide light at a fluorescence stimulation wavelength, and the chip-type camera cube has a color filter array segmented in a pattern, the color filter array comprising filters configured to block light at the fluorescence stimulation wavelength while passing light at the fluorescence emission wavelength. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In the drawings, the same reference numerals in the first and second drawings denote structures having substantially the same description and function as illustrated in the first and second drawings.

[0019] Figure 1 is a schematic diagram of a cross section of a cavity inserter – the base plate allows mounting a camera with a lens at the same level as the adjacent LEDs.

[0020] Figure 2 is included Figure 1 Schematic diagram of the optical endoscope head of the cavity inserter.

[0021] Figure 3 is a schematic cross-sectional view of an alternative embodiment of a cavity inserter showing an attached LED.

[0022] Figure 4 is a top view of the circular optical endoscope head showing the mounted LED and camera cube.

[0023] Figure 5is a top view of the rectangular optical endoscope head showing the mounted LED and camera cube.

[0024] Figure 6 is included Figure 4 End view of an endoscope with an optical endoscope head.

[0025] Figure 7 is included Figure 2 or Figure 4 Schematic diagram of a cross section of an endoscope with an optical endoscope head. DETAILED DESCRIPTION

[0026] Cavity inserter 100 ( Figure 1 ) includes a substrate 102 having feedthrough conductors 104, 110 connecting bonding pads 108, 114 suitable for ball-bonding (also known as spherical bonding or ball bonding) mounting light emitting diodes to bonding pads 106, 112 suitable for attaching to conductors of a connecting cable. The interposer 100 has a cavity 115 suitable for accommodating a chip-type "camera cube" having a cavity 115 suitable for ball-bonding to mount a chip-type camera cube (such as a Figure 2 1 . The bonding pads 118, 122 are coupled to the cavity inserter 100 via conductive feedthroughs 116, 124 to bonding pads 120, 126 at the base 125 of the cavity inserter 100, which is adapted to be individually attached to the conductors of the connecting cable. The cable may have as few as five conductors, although many embodiments, including those with fluorescent stimulating LEDs (see below), may have more than five conductors.

[0027] In an embodiment, the cavity inserter 100 is assembled into an endoscope optical head assembly 200 ( Figure 2), wherein the camera cube 202 is positioned in the cavity 115, and the bonding pads of the camera cube 202 are coupled to the bonding pads 118, 122. The optical head assembly also includes at least one light emitting diode (LED) 204 coupled to the bonding pads 108, 114 and configured to illuminate an object within the field of view imaged by the camera cube 202. In a particular embodiment, the LED 204 is a white light LED. The optical head assembly 200 also has a transparent protective window 205 that is sealed with a waterproof material and positioned to protect the camera cube 202 and the LED 204; in order to support the transparent protective window 205 above the camera cube 202 and the LED 204, in some embodiments, the cavity inserter may have an edge 216 to support the transparent protective window 205. The camera cube 202 includes an imaging lens 203 and an image sensor 208, as well as a spacer ( Figure 2 122 of the cavity interposer 100. In an endoscopic optical head, the bonding pads 106, 112, 120, 126 of the lower surface of the cavity inserter 100 are attached to conductors 209 formed on a flexible substrate 210 to form a flexible endoscope cable 212. In an embodiment, the top of the camera cube 202 is at the same level as the top of the LED 204.

[0028] In an embodiment, the cavity interposer 100 is a multilayer ceramic structure having a cavity 115, which is formed in one or more layers before the layers are fired together. In an alternative embodiment, the cavity interposer 100 is formed from a composite material such as an injection-molded plastic or printed circuit board material, in which alternative embodiment, the holes for the feedthroughs 116, 124, 104, 110 can be formed by laser drilling, and the cavity 115 can be formed by mechanical drilling; in embodiments where the cavity interposer is formed from printed circuit board material, the cavity interposer can be formed from one or more layers of insulating material, two or three layers of conductive material, and one or more layers of insulating support material. Once formed, in some embodiments, the holes for the feedthroughs are plated through to form the feedthroughs 116, 124, 104, 110, while in other embodiments, the feedthroughs 116, 124, 104, 110 are formed by chemical vapor deposition (CVD) or evaporated metal deposition.

[0029] In an embodiment, the flexible substrate 210 is formed of a flexible printed circuit material and the conductors 209 are covered with an insulating material except for locations at the distal end where they are coupled to bond pads of the cavity inserter and at the proximal end where they are coupled to additional circuitry.

[0030] In an alternative embodiment, a cavity inserter 300 ( Figure 3 ) so that the bonding pad 302 associated with the LED 304 is not directly below the LED (e.g. Figure 1 and 2 302 ), but rather is adjacent to and at a higher level than shelf 306 such that the upper surface of LED 304 and the upper surface of bond pad 302 are coplanar. In this embodiment, rather than solder ball bonding LED 304, LED 304 may be wire bonded to bond pad 302, coupled to bond pad 302 through anisotropic conductive film 310, or coupled to bond pad 302 through a thin flexible printed circuit. In this embodiment, feedthrough 312 associated with the LED is thinner than Figure 1 and Figure 2 The feedthrough 104 associated with the LED of the embodiment is long.

[0031] In the circular inserter 400 ( Figure 4 ) embodiment, there is a first LED 402, an optional second LED 404, an optional third LED 406, and an optional fourth LED 408 below the window 205, which are located on the side of the camera cube 410. In the square inserter 500 ( Figure 5 ) embodiment, there is also a first LED 402, an optional second LED 404, an optional third LED 406, and an optional fourth LED 408 below the window 205, which are on the side of the camera cube 410.

[0032] In alternative embodiments, there may be more than one LED, and in some embodiments, at least one white light LED is provided for white light color imaging, a separate fluorescence imaging LED is provided, and the fluorescence imaging LED is adapted to provide a fluorescence stimulation wavelength, and the fluorescence imaging LED may have a filter to block light of a wavelength that passes through the fluorescence imaging block of the color filter array 214. In embodiments having a fluorescence stimulation or excitation wavelength LED, a fluorescence stimulation wavelength blocking filter may be incorporated into the tiled pattern of the color filter array 214, the fluorescence stimulation wavelength blocking filter being configured to pass light of the fluorescence emission wavelength of the fluorophore of interest, and the color filter array 214 may be tiled with a color filter tiled pattern that includes three more filters than the traditional Bayer pattern filters of red, green, and blue. In certain embodiments, in addition to the red, green, and blue filters in each tiled pattern, there are color filters having passbands in the near infrared, and one or more color filters having passbands associated with individual fluorophores in the one or more fluorophores. For example, Figure 5 An embodiment may be assembled with two white light LEDs 402, 404 and two fluorescence stimulation wavelength LEDs 406, 408 positioned on opposite sides of a camera cube 410. In alternative embodiments, there may be several different wavelength fluorescence stimulation wavelength LEDs to allow detection and differentiation of multiple fluorophores in tissue.

[0033] The endoscope optical head assembly 200 is used as a component of an endoscope or other device that requires imaging into narrow spots, such as a borescope, for optical inspection of the interior of an engine cylinder bore or a gun barrel. Medical applications for endoscopes using the optical head assembly include colonoscopy, hysteroscopy, laparoscope, sigmoidoscopy, and laryngoscopes. In certain embodiments, the entire endoscope optical head 400 or 500, including the inserter, has an outer diameter of less than 1.5 mm and is particularly suitable for use with small-diameter endoscopes such as bronchoscopes, fallopian tube scopes, and cystoscopes.

[0034] In a typical endoscope application, the endoscope tip 600 ( Figure 6) includes an end of an endoscope body 602, an endoscope optical tip 400, attachment points for one or more steering wires (not shown), and an opening through a lumen 604 of the endoscope body 602 through which operating tools such as, but not limited to, electrocautery, linear snares, and cell samplers can pass to reach a field of view in front of the endoscope optical tip 400. The endoscope tip 600 forms the end of an endoscope 700 having an endoscope body 702, an optical endoscope head 400, an operating handle 706 that may include controls for steering wires, and a connector 708 for connection to an electronic digital image display & processing system 710 that displays images for guidance by a physician or other user.

[0035] In an embodiment, the endoscopic optical head is formed by manufacturing a wafer of a cavity inserter, which has a cavity inserter as shown in FIG. Figure 1 or Figure 3 The described shape, but not yet cut into individual cavity interposers. The individual cut chip cameras are then inserted into the respective cavities of the cavity interposers and connected to the first-level bond pads in the respective cavities of the cavity interposers, and the LEDs are also attached and connected to the third-level bond pads of the cavity interposers. The bond pads of the first and third-level interposers are coupled to the bond pads of the second-level cavity interposer via feedthroughs.

[0036] In embodiments lacking edge 216, a spacer wafer can be bonded to the cavity interposer wafer. A protective window wafer is then bonded to the top of the cavity interposer or to the top of the spacer wafer. The cavity interposer is then cut, typically by sawing, and the conductors of the cable are attached to the second horizontal bond pads of the cavity interposer.

[0037] combination

[0038] a cavity interposer labeled A having a body configured with a cavity; a plurality of first bonding pads adapted to couple to bonding pads of a chip camera cube (C-cube), the first bonding pads disposed within a base of the cavity at a first level, the first bonding pads coupled to second bonding pads at the base of the cavity interposer at a second level via a feedthrough; and

[0039] A plurality of third bond pads adapted to be coupled to bond pads of light emitting diodes (LEDs), the third bond pads being disposed at a third level, the third bond pads being coupled to fourth bond pads of a base of the cavity insert at a second level via a feedthrough, the second bond pads and the fourth bond pad being adapted to be coupled to conductors of a cable, wherein the first level, the second level, and the third level are different.

[0040] The endoscopic optical head labeled AA includes a cavity inserter labeled A, at least one LED, and a chip-type camera cube, wherein the chip-type camera cube is electrically connected to the first bonding pad; the LED is connected to the third bonding pad; and the top of the chip-type camera cube and the top of the LED are at the same level.

[0041] The endoscopic optical head labeled AB includes the endoscopic optical head labeled AA and has a cable including a plurality of electrical conductors coupled to a bond pad of the second bond pad or the fourth bond pad.

[0042] The endoscopic optical head labeled AC includes the endoscopic optical head labeled AA or AB and has an LED ball-bonded to the third bond pad.

[0043] The endoscopic optical head labeled AD includes the endoscopic optical head labeled AA or AB and has an LED line coupled to the third bond pad and wherein the third bond pad is at the same level as the top of the LED.

[0044] The endoscopic optical head labeled AE includes an endoscopic optical head labeled AA, AB, AC, or AD, wherein the camera cube has a segmented pattern that includes an infrared filter.

[0045] The endoscope optical head labeled AF includes an endoscope optical head labeled AA, AB, AC, AD or AE, wherein there are multiple LEDs, and at least one LED is a white light LED and at least one LED is a fluorescence stimulation wavelength LED.

[0046] The above methods and systems may be modified without departing from the scope of the present invention. Therefore, it should be noted that the matter contained in the above description or shown in the accompanying drawings is to be understood as illustrative and not restrictive. The following claims are intended to cover all general and specific features described herein, as well as all statements of the scope of the present methods and systems that can be said to fall between the two in terms of language. It is also contemplated that the steps of the method may be performed in an order different from that shown and still fall within the meaning of the appended claims.

Claims

1. An endoscope optical head, comprising: A cavity inserter having a body configured with a cavity, the body comprising: a plurality of first bonding pads adapted to couple to bonding pads of a chip camera cube, the first bonding pads being disposed within the cavity and on a base of the cavity at a first level, the first bonding pads being coupled to second bonding pads on the base of the cavity interposer at a second level via a feedthrough, and a plurality of third bonding pads adapted to be coupled to bonding pads of at least one light emitting diode (LED), the third bonding pads being disposed at a third level; the third bond pad coupled to a fourth bond pad at the base of the cavity interposer at the second level through a feedthrough; The second bond pad and the fourth bond pad are adapted to be coupled to a conductor of a cable, and the first level, the second level, and the third level are different; At least one LED and chip-type camera cube, wherein: The chip-type camera cube is ball-bonded to the first bonding pad; wherein the chip-type camera cube includes an imaging lens and an image sensor; The at least one LED is coupled to the third bond pad; and A top of the chip camera cube and a top of the at least one LED are at the same level.

2. The endoscopic optical head according to claim 1, further comprising: A cable includes a plurality of electrical conductors coupled to a bond pad of the second bond pad or the fourth bond pad. 3 . The endoscopic optical pickup of claim 2 , wherein the at least one LED comprises a first LED ball-bonded to the third bonding pad.

4. The endoscopic optical head of claim 3, wherein the camera cube has a tiled pattern including an infrared filter.

5. The endoscopic optical tip of claim 4, wherein there are a plurality of LEDs, and at least one LED is a white light LED and at least one LED is a fluorescence stimulation wavelength LED.

6. The endoscopic optical head of claim 4 , wherein the at least one LED comprises a second LED coupled to a third bonding pad of the cavity inserter, the second LED being adapted to provide light at a fluorescence stimulation wavelength, and the chip-type camera cube having a color filter array segmented in a pattern, the color filter array comprising filters configured to block the light at the fluorescence stimulation wavelength while passing light at a fluorescence emission wavelength.

7. The endoscopic optical head of claim 2, wherein the at least one LED is wire-bonded to the third bond pad, and wherein the third bond pad is at the same level as the top of the LED.

8. The endoscopic optical head of claim 7, wherein the camera cube has a tiled pattern including an infrared filter.

9. The endoscopic optical tip of claim 8, wherein there are a plurality of LEDs, and at least one LED is a white light LED and at least one LED is a fluorescence stimulation wavelength LED.

10. A method of forming an endoscope wherein the top of the LED is coplanar with the top of the camera cube, the method comprising: coupling a camera cube to a first bond pad of the cavity interposer of claim 1 , the first bond pad of the cavity interposer being at a first height relative to a bottom of the cavity interposer; and coupling at least one light emitting diode (LED) to a third bonding pad of the cavity interposer, the third bonding pad of the cavity interposer being at a second height relative to the bottom of the cavity interposer, the first height being different from the second height, the third bonding pad of the cavity interposer being coupled to a fourth bonding pad of the cavity interposer, the fourth bonding pad of the cavity interposer being on the bottom of the cavity interposer; Wherein the first height and the second height are selected such that a top of the LED is flush with a top of the camera cube.

11. The method of claim 10, further comprising attaching a transparent window over the top of the LED and the camera cube.

12. The method of claim 11, further comprising attaching a gasket to the cavity inserter before attaching the transparent window over the top of the LED and the camera cube.

13. An endoscopic imaging system comprising an endoscope, the endoscope comprising: A cavity inserter having a body configured with a cavity, the body comprising: a plurality of first bonding pads adapted to couple to bonding pads of a chip camera cube, the first bonding pads being disposed within the cavity and on a base of the cavity at a first level, the first bonding pads being coupled to second bonding pads on the base of the cavity interposer at a second level via a feedthrough, and a plurality of third bonding pads adapted to be coupled to bonding pads of at least one light emitting diode (LED), the third bonding pads being arranged at a third level, the third bond pad being coupled to a fourth bond pad at the base of the cavity interposer at the second level through a feedthrough, The second bond pad and the fourth bond pad are adapted to be coupled to a conductor of a cable, and the first level, the second level, and the third level are different; a chip-type camera cube disposed within the cavity of the cavity interposer and having a bonding pad electrically coupled to the first bonding pad of the cavity interposer; a light emitting diode mounted to the third bonding pad of the cavity interposer; a cable having a first end coupled to the second and fourth bond pads of the cavity inserter and a second end coupled to a connector; and The connector is electrically connected to a digital image display and processing system.

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