A memory alloy driving device and its installation method

Abstract

The present invention discloses a memory alloy drive device, which belongs to the field of drive technology. The device comprises a core and an output device, a memory alloy actuator and a transmission device arranged in the core. The transmission device is located between the output device and the memory alloy actuator. The memory alloy actuator realizes the driving function by heating the memory alloy wire by electricity. The transmission device can attenuate the pressure transmitted from the output device to the memory alloy actuator, thereby improving the working reliability of the memory alloy actuator. When the memory alloy actuator is energized, the lock on the transmission pin on the transmission device is released, the output device is activated, and the driving function is realized. The present invention also discloses a corresponding installation method for the memory alloy drive device. The present invention realizes a memory alloy drive device with an integrated structure, and ensures the overall performance reliability by setting the transmission device, and has the advantages of large output force and large stroke.

Description

Technical Field

[0001] The present invention belongs to the technical field of drive devices, and in particular relates to a memory alloy drive device and an installation method thereof. Background Art

[0002] Based on the principle that memory alloy wire deforms after being heated, a spring made of memory alloy wire can be used as a driving element. Combined with the existing piston motion mechanism, the spring made of memory alloy wire is nested on the piston. The piston movement can be driven by energizing the spring. At the same time, in order to facilitate the recovery of the device, a bias spring is generally provided. After the spring made of memory alloy wire is powered off, the bias spring can slowly restore the entire device to its initial state. This device has been applied in the field of drive technology.

[0003] For example, patent CN108757357A discloses a laser-induced liquid metal-coordinated shape memory alloy drive device, which uses a memory alloy spring for drive. However, structurally, its output force and stroke are relatively small, limiting its application in certain situations.

[0004] To overcome the aforementioned shortcomings of the memory alloy drive, patent CN113428390A discloses a memory alloy-driven satellite release device. This patent utilizes a memory alloy wire as the separation power source, resulting in high energy density, simple structure, and excellent reliability. It also employs a toggle-type separation mechanism, which is easy to use and maintain, fast to unlock, highly reliable, and shock-free, providing a smooth and safe environment for satellite separation. However, the memory alloy wire and slip ring drive spring in this patent are housed in separate components, making them incompatible with a single integrated system. Consequently, the prior art lacks a single-piece memory alloy drive device with high driving force and long travel. Summary of the Invention

[0005] In response to one or more of the above-mentioned defects or improvement needs in the prior art, the present invention provides a memory alloy drive device and an installation method thereof, which realizes an integrated memory alloy drive device and ensures reliable overall performance by providing a transmission device.

[0006] To achieve the above-mentioned object, the present invention provides a memory alloy driving device, comprising a core and an output device, a memory alloy actuator and a transmission device arranged in the core;

[0007] The core is provided with a movement cavity, a constraint cavity and a transfer cavity arranged therebetween to laterally connect the movement cavity and the constraint cavity;

[0008] The memory alloy actuator is disposed in the constraint cavity and includes a housing and a constraint rod. The constraint rod includes a cylindrical section and a disc section. The disc section is disposed in the inner cavity of the housing. A bias spring is disposed above the disc section, and a memory alloy spring is disposed below the disc section. In the power-off state, the forces between the memory alloy spring and the bias spring are balanced. When power is applied, the memory alloy spring contracts, thereby driving the constraint rod to contract. The cylindrical section of the constraint rod can extend into the transfer cavity to constrain the transfer device.

[0009] The transmission device is arranged in the transmission cavity, and includes a transmission pin and a force-eliminating spring. One end of the transmission pin can extend into the motion cavity under the action of the force-eliminating spring.

[0010] The output device is arranged in the motion cavity, and includes a driving rod and a driving spring. An annular groove is provided on the outer side of the driving rod along the circumference, and the annular groove is used to clamp one end of the transmission pin extending into the motion cavity; the component force of the driving spring acting on the transmission pin is greater than the resistance of the force-dissipating spring, so that the transmission pin retracts when the constraint rod contracts and releases the constraint on the transmission pin, thereby causing the driving rod to extend from the motion cavity.

[0011] As a further improvement of the present invention, the memory alloy actuator also includes a pressure screw, which is arranged on the top of the shell. The outside of the pressure screw has an external thread, which is matched with the internal thread of the shell. The middle of the pressure screw has a through hole, and the cylindrical section of the constraint rod passes through the through hole of the pressure screw.

[0012] As a further improvement of the present invention, the transmission device also includes a limiting screw plug, which is threadedly connected to the transmission cavity, and the end face of the limiting screw plug is flush with the movement cavity of the core body; a blind hole is provided in the limiting screw plug, and under the action of the force-dissipating spring, one end of the transmission pin can extend out of the blind hole.

[0013] As a further improvement of the present invention, the transfer chamber includes a threaded hole, one side of the threaded hole is connected to the motion chamber, and the other side is provided with an annular groove and a circular hole. The limiting screw is threadedly connected to the threaded hole, and the force-eliminating spring is arranged in the annular groove. The end of the circular hole is connected to the threaded hole, and the side is connected to the upper end of the constraint chamber.

[0014] As a further improvement of the present invention, the output device further includes a guide fixed body, one end of the guide fixed body is a cylinder, and the other end is a disk with a radius larger than the cylinder, and the drive spring is sleeved on the outside of the cylinder;

[0015] One end of the driving rod is a moving column, and the other end is a constraint column. The moving column passes through the through hole at the top of the moving cavity. The upper end of the constraint column has a chamfer, and the lower end of the constraint column has a tapered portion. The constraint column is provided with an annular groove along the circumference, and a blind hole is provided inside the constraint column. The cylinder of the guide fixed body is provided inside the blind hole.

[0016] As a further improvement of the present invention, the disc of the guide fixing body is provided with a threaded hole, and the bottom of the movement cavity is provided with a corresponding threaded hole, so that the guide fixing body is fixed to the core body by screws.

[0017] As a further improvement of the present invention, the bottom of the memory alloy spring is connected to a wire and is led out through a corresponding through-hole on the side of the constraint cavity.

[0018] As a further improvement of the present invention, a tooling hole is provided above the constraint cavity and vertically penetrates the constraint cavity, for inserting a mounting tool, so as to manually press the memory alloy actuator to release the constraint state of the transfer device.

[0019] As a further improvement of the present invention, a mounting hole is provided on the outside of the movement cavity, the mounting position of the mounting hole corresponds to the transfer cavity, and the mounting hole is used for installing a screw plug.

[0020] According to another aspect of the present invention, there is provided a method for installing the memory alloy drive device, comprising the following steps:

[0021] S1 installs the transfer device into the transfer cavity of the core body;

[0022] Place the force elimination spring and the transmission pin into the transmission cavity, and connect the limit screw plug to the transmission cavity with threads. S2 installs the output device in the motion cavity of the core body;

[0023] S21: The driving rod is installed from the bottom of the motion cavity of the core body. The chamfered upper end of the constraint column of the driving rod pushes the transmission pin to move toward the memory alloy actuator, removing the obstruction to the driving rod.

[0024] After the S22 drive rod is assembled in place, assemble the drive spring and the guide fixing body, and fix the guide fixing body to the core body with screws. Then press the drive rod from the top end so that the end face of the moving column of the drive rod is flush with the end face of the core body.

[0025] S3 installs a memory alloy actuator in the constraint cavity of the core;

[0026] Install the memory alloy actuator from the bottom of the constraint cavity of the core body, and connect the memory alloy actuator to the core body by threading, so that the memory alloy actuator constrains the transmission device. Then remove the external force on the driving rod and lead the wire of the memory alloy actuator out through the through hole of the constraint cavity.

[0027] S4 Install screw plugs in the mounting holes of the core.

[0028] In general, the above technical solutions conceived by the present invention have the following beneficial effects compared with the prior art:

[0029] (1) The memory alloy driving device of the present invention provides a transmission device between the output device of the core and the memory alloy driver, thereby significantly attenuating the pressure transmitted from the output device to the memory alloy driver. The friction resistance encountered by the memory alloy actuator when it is energized is greatly reduced, thereby improving the working reliability of the memory alloy actuator. After the memory alloy actuator is energized, the constraint on the transmission device is released, and the transmission pin in the transmission device is squeezed toward the memory alloy actuator side by the output device, and the driving rod of the output device is extended to realize the pushing function.

[0030] (2) The present invention realizes a memory alloy driving device with an integrated structure, and ensures the overall performance is reliable by setting a transmission device, and has the advantages of large output force and large stroke. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic structural diagram of the initial state of the memory alloy driving device according to an embodiment of the present invention.

[0032] Figure 2 This is a structural diagram of the memory alloy actuator according to an embodiment of the present invention, when the output device has just started to move, and the actuator has reached its full motion.

[0033] Figure 3 This is a structural schematic diagram of the memory alloy driving device according to an embodiment of the present invention in a moving position state;

[0034] Figure 4 This is a schematic diagram of the structure of the embodiment of the present invention at the initial moment when the action is completed and the state is restored to the original state;

[0035] Figure 5 This is a schematic diagram of the structure of the embodiment of the present invention at the intermediate moment when the action is restored to the original state after the action is completed;

[0036] Figure 6 This is a schematic diagram of the structure of the embodiment of the present invention at the time of returning to the original state after the action is completed;

[0037] Figure 7 Schematic diagram of the structure of an output device involved in an embodiment of the present invention;

[0038] Figure 8 A cross-sectional view of the initial state of the memory alloy actuator according to an embodiment of the present invention;

[0039] Figure 9 A cross-sectional view of a memory alloy actuator according to an embodiment of the present invention in a position in position;

[0040] Figure 10 A structural diagram of a transmission device according to an embodiment of the present invention;

[0041] Figure 11This is a cross-sectional view of the core structure involved in an embodiment of the present invention.

[0042] In all the drawings, the same reference numerals represent the same technical features, specifically: 1-output device, 2-memory alloy actuator, 3-transmission device, 4-core, 5-screw plug, 6-installation tool;

[0043] 101-driving rod, 102-driving spring, 103-guide fixing body; 201-memory alloy spring, 202-constraint rod, 203-bias spring, 204-housing, 205-pressure screw; 301-transmission pin, 302-force elimination spring, 303-limiting screw plug; 401-movement cavity, 402-constraint cavity, 403-transmission cavity, 404-tooling hole, 405-mounting hole. DETAILED DESCRIPTION

[0044] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only intended to illustrate the present invention and are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

[0045] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0047] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0048] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0049] See also Figures 1 to 6 The memory alloy driving device of the present invention includes a core body 4 and an output device 1, a memory alloy actuator 2, and a transmission device 3 arranged in the core body 4; the output device 1 and the memory alloy actuator 2 are arranged in the cavity corresponding to the core body 4, and the transmission device 3 is arranged between the output device 1 and the memory alloy actuator 2.

[0050] Specifically, the structure of the core 4 is as follows Figure 11 As shown, core body 4 is provided with a motion chamber 401, a restraining chamber 402, and a transfer chamber 403 disposed therebetween and laterally interconnecting motion chamber 401 and restraining chamber 402. Motion chamber 401, restraining chamber 402, and transfer chamber 403 are respectively configured to accommodate output device 1, memory alloy actuator 2, and transfer device 3. A tooling hole 404 is provided above restraining chamber 402, extending vertically therethrough, for inserting and mounting tool 6.

[0051] Furthermore, the specific structure of the output device 1 is as follows: Figure 7As shown, the output device 1 is housed within the motion cavity 401 of the core 4 and comprises a drive rod 101, a drive spring 102, and a guide fixture 103. The drive rod 101 has a motion post at one end and a constraint post at the other. The motion post passes through a through-hole at the top of the motion cavity 401 of the core 4. The constraint post is provided with an annular groove along its circumference and has a blind hole inside. The guide fixture 103 has a cylindrical end and a disc with a larger radius than the cylinder at the other end. The drive spring 102 is sleeved around the cylinder, which is located within the blind hole. The drive spring 102 is initially in a compressed state. The cylindrical structure of the guide fixture guides the drive spring 102, preventing it from twisting in its compressed state and affecting the movement of the drive rod 101.

[0052] In addition, the disc of the guide fixing body 103 has a threaded hole, and correspondingly, the bottom of the movement cavity 401 of the core body 4 is provided with a threaded hole, so that after the output device 1 is installed in the movement cavity 401, the guide fixing body 103 and the core body 4 are fixed by screws.

[0053] In a preferred embodiment, the depth of the annular groove of the restraining column is 2 mm to 3 mm, the upper and lower ends of the annular groove are symmetrical inclined surfaces, and the angle formed by the two inclined surfaces is 70° to 80°.

[0054] In a preferred embodiment, the upper end of the restraining column further has a chamfer. The chamfer is used to prevent the driving rod 101 from scratching the core 4 when it moves in the core 4. On the other hand, when the driving rod 101 is installed in the core 4, it can push the transmission pin 301 to move toward the memory alloy actuator 2.

[0055] The lower end of the constraint column also has a tapered portion, which is used to push the transmission pin 301 to move toward the memory alloy actuator 2 when the driving rod 101 moves downward.

[0056] In a preferred embodiment, the driving rod 101 is made of 30CrMnSiNi2A, which has good strength and hardness.

[0057] Furthermore, the specific structure of the memory alloy actuator 2 is as follows: Figure 8 and Figure 9As shown, the memory alloy actuator 2 is housed within the constraint cavity 402 of the core 4 and comprises a memory alloy spring 201, a constraint rod 202, a bias spring 203, a housing 204, and a compression screw 205. The housing 204 has an external thread on the outside that mates with the internal thread of the constraint cavity 402. A compression screw 205 is located at the top of the housing 204. The compression screw 205 also has an external thread on the outside that mates with the internal thread of the housing 204. A through-hole is located in the center of the compression screw 205 to provide space for the movement of the constraint rod 202 and to serve as a guide. The constraint rod 202 is a stepped cylindrical structure, comprising a cylindrical section and a disc section. The disc section is located within the inner cavity of the housing 204, while the cylindrical section passes through the through-hole of the compression screw 205 to provide a constraint. A bias spring 203 is provided above the disc segment, and a memory alloy spring 201 is provided below. The bias spring 203 is constrained between the disc segment and the compression screw 205, and the memory alloy spring 201 is constrained between the disc segment and the housing 204. The bias spring 203 and the memory alloy spring 201 are both in a compressed state after being installed in place.

[0058] The memory alloy spring 201 is a spring that contracts when heated and energized. A wire is connected to the bottom of the memory alloy spring 201 and leads out through the corresponding through-holes on the side of the constraint cavity 402 . The resistance of the memory alloy spring 201 is greater than that of the bias spring 203 .

[0059] In a preferred embodiment, the compression amount of the memory alloy spring 201 is 10%±1%, and the compression amount of the bias spring 103 is 20%±1%.

[0060] In a preferred embodiment, the housing 204 is made of a polysulfone rod material with good thermal insulation.

[0061] When the power is off, the force between the memory alloy spring 201 and the bias spring 203 is balanced, and the constraint rod 202 is placed in the initial state (the constraint rod 202 constrains the transmission device 3). When the memory alloy spring 202 is powered on and heated, it begins to shrink, causing the bias spring 203 in a compressed state above the constraint rod 202 to begin to recover. The original force balance between the memory alloy spring 201 and the bias spring 203 is broken, and the constraint rod 202 is pushed downward.

[0062] When the memory alloy spring 201 is powered off, the memory alloy spring 201 changes from retracting to slowly moving upward, pushing the extended bias spring 203 to retract again until the memory alloy spring 201 and the bias spring 203 return to the initial force balance state.

[0063] Furthermore, the specific structure of the transmission device 3 is as follows Figure 10As shown, it includes a transmission pin 301, a force-dissipating spring 302, and a stopper screw 303. The stopper spring 302, transmission pin 301, and stopper screw 303 are sequentially installed in the transmission cavity 403 of the core body 4. The stopper screw 303 includes a conical section and a cylindrical section. The cylindrical section has an external thread that mates with the internal thread of the transmission cavity 403 of the core body 4, thereby sealing the transmission pin 301 and the force-dissipating spring 302 within the transmission cavity 403 of the core body 4. After the threads are assembled, the end face of the stopper screw 303 is flush with the movement cavity 401 of the core body 4, ensuring that the movement of the drive rod 101 within the movement cavity 401 is not obstructed.

[0064] The transfer pin 301 can move within the transfer cavity 403 of the core 4. A blind hole is provided transversely through the stop screw 303. Under the action of the force-dissipating spring 302, one end of the transfer pin 301 can extend through the blind hole into the movement cavity, preferably protruding 1.5 mm ± 0.2 mm from the end surface of the stop screw 303. When subjected to an opposing external force, the transfer pin 301 can overcome the resistance of the force-dissipating spring 302 and fully retract into the stop screw 303.

[0065] Combine Figure 11 The transfer chamber 403 includes a threaded hole, one side of the threaded hole is connected to the motion chamber 401, and the other side is provided with an annular groove and a circular hole. The limiting screw plug 303 is threadedly connected to the threaded hole, the force dissipation spring 302 is arranged in the annular groove, and one end of the transfer pin 301 close to the memory alloy actuator 2 is arranged in the circular hole; the end of the circular hole is connected to the threaded hole, and the side is connected to the upper end of the constraint chamber 402.

[0066] In a preferred embodiment, the material of the transfer pin 301 is 30CrMnSiNi2A.

[0067] Furthermore, a mounting hole 405 is provided on the outside of the core movement cavity 401. The installation position of the mounting hole 405 corresponds to the transfer cavity 403. The mounting hole 405 is used to install a screw plug 5, thereby closing the entire structure to prevent foreign matter from entering the core 4 and affecting the movement of the driving rod 101.

[0068] In a specific embodiment of the present invention, the drive spring 102 is initially compressed by 25% ± 2%. After reaching its full position, it remains compressed by 10% ± 1%. The corresponding resistance in the initial position is 25 N ± 2 N, and the resistance in the fully-moved position is 10 N ± 2 N. The travel of the drive spring is 15 mm. The compression of the force-dissipating spring 302 is 20% ± 2%, corresponding to a resistance of 20 N ± 2 N.

[0069] The working process and principle of the memory alloy driving device of the present invention are as follows:

[0070] In the initial state, if Figure 1As shown, when the driving rod 101 is pressed downward until the end face of the moving column is flush with the end face of the core body 4, one end of the transfer pin 301 completely enters the annular groove of the driving rod 101, and the other end of the transfer pin 301 does not protrude from the constraint cavity 402 of the core body 401, and the constraint rod 202 constrains the transfer pin 301.

[0071] When the product is working, the drive rod 101 needs to be extended upward. At this time, the memory alloy actuator 2 is powered, and the memory alloy spring 201 contracts, breaking the force balance between the memory alloy spring 201 and the bias spring 203. The constraint rod 202 contracts accordingly, thereby releasing the memory alloy actuator 2 from the constraint on the transmission device 3. The output device 1 moves upward under the resistance of its internal drive spring 102, and the transmission pin 301 of the compression transmission device 3 moves to the left (toward the memory alloy actuator 2). The drive rod 101 of the output device 1 moves upward to realize the driving function.

[0072] It should be noted that when the drive spring pushes the drive rod 101 to extend upward, its component force acting on the transmission pin must be greater than the resistance of the force-dissipating spring, so that when the memory alloy actuator 2 releases the constraint on the transmission device 3, the transmission pin can be retracted under the action of the drive spring.

[0073] When the product is working properly and the drive device needs to be restored to its original state, Figures 4 to 6 As shown, the installation tool 6 is inserted into the tool hole 404 of the core body 4, and the memory alloy actuator 2 is manually pressed to a state where the constraint on the transfer device 3 is released. Since the tool hole 404 is biased to the left side of the constraint cavity 402, the insertion of the installation tool 6 will not constitute a constraint on the transfer device 3. At this time, the driving rod 101 is pressed downward from the upper end of the driving rod 101, and the tapered part of the lower end of the driving rod 101 contacts the transfer pin 301, pushing the transfer pin 301 to overcome the resistance of the force dissipation spring 302 and move to the left (move toward the memory alloy actuator 2) until the transfer pin 301 is completely pushed into the limiting screw plug 303, and the driving rod 101 continues to overcome the resistance of the driving spring 102 and move downward until the end face of the driving rod 101 is flush with the end face of the core 4. At the same time, the transfer pin 301 is pushed to the right (toward the output device 1) under the action of the force dissipation spring 302 in a compressed state until the transfer pin 301 enters the annular groove of the driving rod 101, and the end of the transfer pin 301 close to the memory alloy actuator 2 does not protrude from the constraint cavity 402. Then, the installation tool 6 is removed at this time, and the constraint rod 202 extends upward into the transfer cavity to constrain the transfer pin 301, thereby restoring to the initial state.

[0074] It should be noted that, in the initial state, when the drive spring 102 pushes the drive rod 101 upward, the drive rod 101 cannot move due to the obstruction of the transmission pin 301. When the drive spring 102 pushes the drive rod 101 upward, its thrust is transmitted to the transmission pin 301 through the annular groove on the drive rod 101. Due to the presence of the force dissipation spring 302, the resistance transmitted from the drive spring 102 to the transmission pin 301 can be attenuated (assuming that the force transmitted from the drive spring 101 to the transmission pin 301 is N1 and the resistance of the force dissipation spring 302 is N2, then the resistance N ultimately received by the transmission pin 301 is N1-N2). Therefore, by setting the parameters of the force dissipation spring 302, the pressure transmitted from the transmission pin 301 to the memory alloy actuator 2 can be significantly attenuated.

[0075] The present invention provides a transmission device between the output device of the core and the memory alloy driver, thereby significantly attenuating the pressure transmitted from the output device to the memory alloy driver. The friction resistance encountered by the memory alloy actuator when it is energized is greatly reduced, thereby improving the working reliability of the memory alloy actuator. After the memory alloy actuator is energized, the constraint on the transmission device is released, and the transmission pin in the transmission device is squeezed toward the memory alloy actuator side by the output device, and the drive rod of the output device is extended to realize the pushing function.

[0076] The memory alloy driving device of the present invention has an installation method comprising the following steps:

[0077] (1) Install the transfer device 3 in the transfer cavity 403 of the core 4;

[0078] Place the force dissipation spring 302 and the transfer pin 301 into the transfer cavity 403 of the core body 4, and tighten the limiting screw 303. The limiting screw 303 is threadedly connected to the transfer cavity 403 of the core body 4, thereby enclosing the force dissipation spring 302 and the transfer pin 301 in the transfer cavity 403 of the core body 4.

[0079] At this time, under the resistance of the force-dissipating spring 302, the transmission pin 301 protrudes 1.5mm±0.2mm from the outer end surface of the limiting screw plug 3-3, and the transmission pin 301 can move in the cavity formed by the transmission cavity 403 and the limiting screw plug 303, and the movement stroke is preferably 2mm.

[0080] (2) Install the output device 1 in the motion cavity 401 of the core 4;

[0081] Insert the driving rod 101 from the bottom of the motion cavity 401 of the core 4. The chamfered upper end of the constraint column of the driving rod 101 pushes the transmission pin 301 toward the memory alloy actuator 2, removing the obstruction to the driving rod 101.

[0082] After the driving rod 101 is assembled in place, the driving spring 102 and the guide fixing body 103 are assembled, and the guide fixing body 103 is fixed to the core body 4 by screws. Then, the driving rod 101 is pressed from the upper end so that the end face of the moving column of the driving rod 101 is flush with the end face of the core body 4.

[0083] (3) Installing the memory alloy actuator 2 in the constraint cavity 402 of the core 4;

[0084] Install the memory alloy actuator 2 from the bottom end of the constraint cavity 402 of the core body 4, and thread the memory alloy actuator 2 to the core body 4 so that the memory alloy actuator 2 constrains the transmission device 3. Then remove the external force on the driving rod 101 and lead the wire of the memory alloy actuator 2 out through the through hole of the constraint cavity 402.

[0085] (4) Install the screw plug 5 in the mounting hole 405 of the core 4.

[0086] It will be easily understood by those skilled in the art that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A memory alloy driving device, characterized in that: It includes a core body and an output device, a memory alloy actuator and a transmission device arranged in the core body; The core is provided with a movement cavity, a constraint cavity and a transfer cavity arranged between the two and laterally connecting the movement cavity and the constraint cavity; The memory alloy actuator is disposed in the constraint cavity and includes a housing and a constraint rod. The constraint rod includes a cylindrical section and a disc section. The disc section is disposed in the inner cavity of the housing. A bias spring is disposed above the disc section, and a memory alloy spring is disposed below the disc section. In the power-off state, the forces between the memory alloy spring and the bias spring are balanced. When power is applied, the memory alloy spring contracts, thereby driving the constraint rod to contract. The cylindrical section of the constraint rod can extend into the transfer cavity to constrain the transfer device. The transmission device is arranged in the transmission cavity, and includes a transmission pin and a force-eliminating spring. One end of the transmission pin can extend into the motion cavity under the action of the force-eliminating spring. The output device is disposed in the motion chamber and includes a drive rod and a drive spring. An annular groove is provided on the outer side of the drive rod along the circumference thereof, and the annular groove is used to clamp the end of the transmission pin extending into the motion chamber. The component force of the drive spring acting on the transmission pin is greater than the resistance force of the force-dissipating spring, so that when the constraint rod contracts and releases the constraint on the transmission pin, the transmission pin retracts, thereby causing the drive rod to extend from the motion chamber. The output device further includes a guide fixed body, one end of which is a cylinder and the other end is a disc with a radius larger than the cylinder, and the drive spring is sleeved on the outside of the cylinder; One end of the driving rod is a moving column, and the other end is a constraint column. The moving column passes through the through hole at the top of the moving cavity. The upper end of the constraint column has a chamfer, and the lower end of the constraint column has a tapered portion. The constraint column is provided with an annular groove along the circumference, and a blind hole is provided inside the constraint column. The cylinder of the guide fixed body is provided inside the blind hole.

2. The memory alloy driving device according to claim 1, characterized in that: The memory alloy actuator also includes a pressure screw, which is arranged on the top of the shell. The outside of the pressure screw has an external thread that matches the internal thread of the shell. The middle of the pressure screw has a through hole, and the cylindrical section of the constraint rod passes through the through hole of the pressure screw.

3. The memory alloy driving device according to claim 1, characterized in that: The transmission device also includes a limiting screw plug, which is threadedly connected to the transmission cavity, and the end face of the limiting screw plug is flush with the movement cavity of the core body; a blind hole is provided in the limiting screw plug, and under the action of the force-dissipating spring, one end of the transmission pin can extend out of the blind hole.

4. The memory alloy driving device according to claim 3, characterized in that: The transfer chamber includes a threaded hole, one side of the threaded hole is connected to the motion chamber, and the other side is provided with an annular groove and a circular hole. The limiting screw is threadedly connected to the threaded hole, and the force-eliminating spring is arranged in the annular groove. The end of the circular hole is connected to the threaded hole, and the side is connected to the upper end of the constraint chamber.

5. The memory alloy driving device according to any one of claims 1 to 4, characterized in that: The disc of the guide fixing body is provided with a threaded hole, and the bottom of the movement cavity is provided with a corresponding threaded hole, so that the guide fixing body and the core body are fixed by screws.

6. The memory alloy driving device according to any one of claims 1 to 4, characterized in that: The bottom of the memory alloy spring is connected to a wire and is led out through a corresponding through-hole on the side of the restraint cavity.

7. The memory alloy driving device according to any one of claims 1 to 4, characterized in that: A tooling hole is provided above the constraint cavity and vertically penetrates the constraint cavity, which is used for inserting an installation tool, so that the memory alloy actuator can be manually pressed to release the constraint state of the transmission device.

8. The memory alloy driving device according to any one of claims 1 to 4, characterized in that: A mounting hole is provided on the outside of the movement cavity. The mounting position of the mounting hole corresponds to the transfer cavity, and the mounting hole is used for installing a screw plug.

9. A method for installing the memory alloy driving device according to any one of claims 1 to 8, characterized in that: The steps include: S1 installs the transfer device into the transfer cavity of the core body; Place the force elimination spring and the transmission pin into the transmission cavity, and connect the limit screw plug to the transmission cavity through threads; S2 installs the output device in the motion cavity of the core; S21: The driving rod is installed from the bottom of the motion cavity of the core body. The chamfered upper end of the constraint column of the driving rod pushes the transmission pin to move toward the memory alloy actuator, removing the obstruction to the driving rod. After the S22 driving rod is assembled in place, assemble the driving spring and the guide fixing body, and fix the guide fixing body to the core body with screws. Then press the driving rod from the top end to make the end face of the driving rod's moving column flush with the end face of the core body. S3 installs a memory alloy actuator in the constraint cavity of the core; Install the memory alloy actuator from the bottom end of the constraint cavity of the core body, and connect the memory alloy actuator to the core body by threading, so that the memory alloy actuator constrains the transmission device, then remove the external force on the driving rod, and lead the wire of the memory alloy actuator out through the through hole of the constraint cavity; S4 Install screw plugs in the mounting holes of the core.

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