ASIC communication programming device and control method

Abstract

The present invention provides an ASIC communication and programming device and a control method. The ASIC communication and programming device comprises a main control module and an adaptive communication module; the adaptive communication module comprises a first communication port, a second communication port, and a third communication port; the main control module can confirm the communication protocol of the ASIC chip by adjusting the output signals of the three communication ports, and perform subsequent communication and programming processes based on the type of the communication protocol. The control method is used to cooperate with the ASIC communication and programming device to complete the expected workflow. With such a configuration, it can adapt to ASIC chips with a variety of different communication protocols, thereby improving the adaptability of the ASIC communication and programming device, and thereby reducing software and hardware costs, improving flexibility and versatility, and solving the problem of the lack of ASIC communication and programming devices with adaptive functions in the prior art.

Description

Technical Field

[0001] The present invention relates to the technical field of ASIC chips, and in particular to an ASIC communication burning device and a control method. Background Art

[0002] ASIC (Application Specific Integrated Circuit) signal conditioning chips refer to integrated circuits designed and manufactured for specific user requirements or the needs of specific electronic systems. They are widely used in smart terminals such as artificial intelligence equipment, consumable printing equipment, and military and defense equipment. Among them, signal conditioning circuits that match specific MEMS (Micro ElectroMechanical System), such as pressure sensor MEMS and thermopile sensor MEMS, have the advantages of smaller size, lower power consumption, improved reliability, improved performance, enhanced confidentiality, and reduced cost compared to general integrated circuits. As MEMS devices gradually develop towards miniaturization and intelligence, and related application fields expand, higher requirements are placed on device signal strength, functional diversity, and algorithm integration. Therefore, high integration of MEMS devices and ASIC signal conditioning chips is imperative.

[0003] The ASIC signal conditioning chip amplifies, filters, performs ADC analog-to-digital conversion, and calibrates the temperature drift and nonlinearity of the output microvoltage of the MEMS sensor. The final result is output in digital (IIC, SPI, OWI, the above names are the names of specific modes. Those skilled in the art can clearly understand the specific rules of the above communication methods based on the above English abbreviations. The English abbreviations are retained in this application for reference) or analog form.

[0004] The current mainstream ASIC signal conditioning chip communication and programming implementation solutions mainly include the following two:

[0005] 1. Use modular instruments: For example, laboratories often use dedicated communication devices to communicate with ASIC signal conditioning circuits, such as National Instruments' compact and portable NI-8451 device or portable PCI-e FPGA (Field Programmable Gate Array) boards. Using the low-cost NI-8451 device, I / O or SPI communication can be used to communicate with the ASIC signal conditioning circuit to acquire MEMS signals. Users must connect the ASIC signal conditioning circuit output to the NI-8451 signal input using DuPont cables or ribbon cables. Different communication interfaces (I / O or SPI) must be connected to different device interfaces. After completing the hardware wiring, dedicated programming software and a separate driver for the device must be installed. The device can then be programmed and configured on a host PC. After collecting signals from the ASIC signal conditioning circuit, a separate power supply or module is required for programming, as the NI-8451 does not include a dedicated programming power module. When users need to use OWI communication, they cannot perform custom programming using this device, making OWI communication and chip programming impossible. If a high-performance FPGA board is used, users can insert the board into the card slot of a workstation or server PC, which offers improved portability and reusability. This board can then be connected to the product board using a shielded cable and a shielded junction box for communication and chip programming. However, chip programming requires an additional power board and module, which are then connected to the target product board via additional wiring.

[0006] 2. Use customized devices and equipment: For example, customized acquisition and calibration control boards are generally used in production lines to communicate with ASIC signal conditioning chips and burn chips. The equipment used by different products and different users varies greatly. Generally, the control board is highly bound to the target product board. Different communication methods use different control boards, which lacks high reusability and portability. The user first develops the corresponding target product board according to the definition of the final product, and then leads to the corresponding communication interface on the target product board, which is connected to the self-designed control board. The corresponding data acquisition and burning modules are designed on the control board. However, the communication interface of this method is relatively simple, and most of the time, different hardware interfaces need to be designed according to the different communication interfaces of the product. The reusability and portability are poor, and the shielding performance is weak. Users design software separately according to different hardware control boards to configure and program the system. The development cycle and difficulty are increased.

[0007] The disadvantages of using modular instruments are as follows:

[0008] 1. Hardware is expensive. Taking National Instruments as an example, the price of modular instruments ranges from several thousand to hundreds of thousands of yuan. Even the lowest-end NI-8451 is relatively expensive and does not have customized programming, so it cannot use OWI communication. It also does not have the ability to burn ASIC signal conditioning chips.

[0009] 2. Some modular instruments have complex wiring, requiring users to connect to different interfaces based on different communication methods, resulting in low fault tolerance. Improper operation can easily damage the instrument.

[0010] 3. The manufacturer's software must be purchased, which is also very expensive. The software consists of the basic LabVIEW software and modular device (NI-8451 and FPGA) drivers. LabVIEW first requires the development of usage scenarios and user interfaces, as well as background program scheduling. The modular device drivers perform independent communication and programming, generating subroutines that can be called by the LabVIEW host computer. This presents significant development challenges and a long development cycle. Furthermore, a separate power supply module is required for product programming, which exponentially increases costs.

[0011] Disadvantages of customized equipment currently used in production lines:

[0012] 1. The communication and programming board functions are relatively simple, generally using one communication method for connection, and the reusability is not high.

[0013] 2. The equipment has a low degree of modularity and is highly bound to the product board. Generally, after replacing the ASIC signal conditioning product, the control board needs to be replaced for communication and product burning.

[0014] 3. Low shielding resistance and no shielding device.

[0015] 4. Use different interfaces according to different communication methods. The communication method cannot be automatically determined and needs to be set manually.

[0016] In summary, the prior art lacks an ASIC communication and programming device with adaptive functions, which leads to problems such as increased costs, complicated processing procedures, and proneness to errors. Summary of the Invention

[0017] The present invention provides an ASIC communication and programming device and a control method to solve the problems in the prior art of lacking an ASIC communication and programming device with adaptive functions, as well as the resulting increased costs, complicated processing procedures, and prone errors.

[0018] In order to solve the above technical problems, the present invention provides an ASIC communication and programming device, which includes a control circuit board, the control circuit board including a main control module, a computer communication module, a voltage conversion module, a voltage regulation matrix and an adaptive communication module; wherein the computer communication module is used to establish a two-way communication connection between the main control module and the computer; the voltage conversion module is used to provide a preset voltage for the main control module by adjusting its connection relationship with the voltage regulation matrix, and the preset voltage includes an operating voltage and a programming voltage; the adaptive communication module includes a first communication port, a second communication port and a third communication port, and the adaptive communication module is used to connect to an ASIC chip; the main control module is used to confirm the communication protocol of the ASIC chip by adjusting the output signals of the first communication port, the second communication port and the third communication port, and to communicate and program the ASIC chip through the first communication port, the second communication port and the third communication port.

[0019] Optionally, the step in which the main control module confirms the communication protocol of the ASIC chip by adjusting the output signals of the first communication port, the second communication port, and the third communication port includes: driving the second communication port to output an OWI waveform to determine whether the ASIC chip generates an OWI response signal; if so, determining that the communication protocol of the ASIC chip is OWI; otherwise, determining that the communication protocol of the ASIC chip is not OWI; if the communication protocol of the ASIC chip is not OWI, driving the first communication port and the second communication port to output an IIC waveform to determine whether the ASIC chip generates an IIC response signal; if so, determining that the communication protocol of the ASIC chip is IIC; otherwise, determining that the communication protocol of the ASIC chip is neither OWI nor IIC; if the communication protocol of the ASIC chip is neither OWI nor IIC, driving the first communication port, the second communication port, and the third communication port to output an SPI waveform to determine whether the ASIC chip generates an SPI response signal; if so, determining that the communication protocol of the ASIC chip is SPI; otherwise, determining that the ASIC chip is an invalid chip.

[0020] Optionally, the computer communication module includes a USB interface circuit and a bridge chip, the USB interface circuit is used to communicate with the computer and the bridge chip, the bridge chip is used to transmit instructions generated by the computer to the main control module, and is used to transmit instructions generated by the main control module to the computer.

[0021] Optionally, the voltage transformation module includes a switching sub-module, a working voltage generating circuit and a burning voltage generating circuit, the working voltage generating circuit generates the working voltage based on the external power supply and the voltage regulation matrix; the burning voltage generating circuit generates the burning voltage based on the external power supply and the voltage regulation matrix; the switching sub-module is used to select the voltage output generated by one of the working voltage generating circuit and the burning voltage generating circuit.

[0022] Optionally, the voltage regulation matrix includes a working voltage regulation matrix and a burning voltage regulation matrix; wherein, the working voltage regulation matrix includes at least two working voltage regulation output terminals and one working voltage regulation input terminal, and the working voltage generating circuit realizes voltage regulation based on connecting one of the working voltage regulation output terminals and the working voltage regulation input terminal; the burning voltage regulation matrix includes at least two burning voltage regulation output terminals and one burning voltage regulation input terminal, and the burning voltage generating circuit realizes voltage regulation based on connecting one of the burning voltage regulation output terminals and the burning voltage regulation input terminal.

[0023] Optionally, the working voltage regulation matrix includes 30 working voltage regulation output terminals, the minimum output resistance of the working voltage regulation matrix is ​​30 kilo-ohms, the maximum output resistance of the working voltage regulation matrix is ​​98 kilo-ohms, and the resistance difference between the output resistances of adjacent working voltage regulation output terminals is 2 kilo-ohms; the burning voltage regulation matrix includes 30 burning voltage regulation output terminals, the minimum output resistance of the burning voltage regulation matrix is ​​90 kilo-ohms, the maximum output resistance of the burning voltage regulation matrix is ​​148 kilo-ohms, and the resistance difference between the output resistances of adjacent burning voltage regulation output terminals is 2 kilo-ohms; the output voltage range of the working voltage generating circuit is 2.5V~5.3V, and the output voltage range of the burning voltage regulating generating circuit is 4.8V~7.1V.

[0024] Optionally, the burning device includes a metal shell, and the metal shell completely covers the control circuit board.

[0025] Optionally, a first indicator light and a second indicator light are provided on the metal casing. When the transformer module adjusts the connection relationship between itself and the voltage regulation matrix, the first indicator light flashes at a first frequency and the second indicator light is off; when the main control module works normally, the second indicator light flashes at a second frequency and the first indicator light is off; wherein, the first frequency is greater than the second frequency.

[0026] Optionally, a power switch, an adaptive communication interface, a USB interface and a power interface are provided on the metal shell; the first communication port, the second communication port and the third communication port are connected to the ASIC chip through the adaptive communication interface, the computer communication module is connected to the computer through the USB interface, and the transformer module is connected to an external power supply through the power interface, and generates the preset voltage based on the external power supply.

[0027] In order to solve the above technical problems, the present invention also provides a control method, which is applied to the above-mentioned ASIC communication burning device, and the control method includes: the main control module obtains the voltage regulation target from the computer through the computer communication module; and the main control module drives the transformer module to adjust the connection relationship between itself and the voltage regulation matrix so that the preset voltage meets the requirements of the voltage regulation target.

[0028] Optionally, after the main control module drives the transformer module to adjust the connection relationship between itself and the voltage regulation matrix so that the preset voltage meets the requirements of the voltage regulation target, the control method also includes: the transformer module outputs the working voltage; the main control module outputs the working voltage to the adaptive communication module; and the main control module drives the output signals of the first communication port, the second communication port and the third communication port to confirm the communication protocol of the ASIC chip.

[0029] Optionally, after the main control module drives the output signals of the first communication port, the second communication port and the third communication port to confirm the communication protocol of the ASIC chip, the control method further includes: the main control module obtains a communication target from the computer through the computer communication module; and the main control module communicates with the ASIC chip through the adaptive communication module based on the communication target and the confirmed communication protocol of the ASIC chip.

[0030] Alternatively, the control method further includes: the main control module obtaining a communication target from the computer via the computer communication module; the main control module communicating with the ASIC chip via the adaptive communication module based on the communication target and the confirmed communication protocol of the ASIC chip; and the main control module sending at least a portion of the communication result to the computer via the computer communication module, and causing at least a portion of the communication result to be stored.

[0031] Optionally, after the main control module drives the output signals of the first communication port, the second communication port and the third communication port to confirm the communication protocol of the ASIC chip, the control method further includes: the main control module obtains a burning target from the computer through the computer communication module; the main control module drives the voltage conversion module to output the burning voltage; the main control module outputs the burning voltage to the ASIC chip through the adaptive communication module; and the main control module drives the adaptive communication module to burn the ASIC chip based on the burning target and the confirmed communication protocol of the ASIC chip.

[0032] Compared to the prior art, the present invention provides an ASIC communication and programming device and control method, wherein the ASIC communication and programming device includes a main control module and an adaptive communication module; the adaptive communication module includes a first communication port, a second communication port, and a third communication port; the main control module can confirm the communication protocol of the ASIC chip by adjusting the output signals of the three communication ports, and perform subsequent communication and programming processes based on the type of the communication protocol. The control method is used to cooperate with the ASIC communication and programming device to complete the expected workflow. This configuration can adapt to ASIC chips with a variety of different communication protocols, improve the adaptability of the ASIC communication and programming device, and thereby reduce software and hardware costs, improve flexibility and versatility, and solve the problem of the lack of ASIC communication and programming devices with adaptive functions in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Those skilled in the art will appreciate that the accompanying drawings are provided for a better understanding of the present invention and do not constitute any limitation on the scope of the present invention.

[0034] Figure 1 This is a schematic structural diagram of a control circuit board according to an embodiment of the present invention;

[0035] Figure 2 is a circuit diagram of an adaptive communication module according to an embodiment of the present invention;

[0036] Figure 3 1 is a circuit diagram of an MSP430 single-chip microcomputer according to an embodiment of the present invention;

[0037] Figure 4 is a circuit diagram of a USB interface circuit according to an embodiment of the present invention;

[0038] Figure 5 is a circuit diagram of a bridge chip according to an embodiment of the present invention;

[0039] Figure 6 is a circuit diagram of a switching submodule according to an embodiment of the present invention;

[0040] Figure 7 This is a circuit of a working voltage generating circuit and a working voltage regulating matrix according to an embodiment of the present invention;

[0041] Figure 8 This is a circuit diagram of a programming voltage generating circuit and a programming voltage regulating matrix according to an embodiment of the present invention;

[0042] Figure 9 FIG. 1 is an overall appearance diagram of a programming device according to an embodiment of the present invention.

[0043] In the attached figure:

[0044] 1- Main control module; 2- Computer communication module; 3- Voltage conversion module; 4- Voltage regulation matrix; 5- Adaptive communication module; 6- Computer; 7- External power supply; 8- ASIC chip; 9- Metal casing;

[0045] 11-MSP430 single-chip microcomputer; 21-USB interface circuit (including the first high-precision LDO chip); 22-bridge chip; 31-switching submodule; 311-switch switching chip; 312-high-precision ADC sampling chip; 321-working voltage generation circuit; 322-writing voltage generation circuit; 33-second high-precision LDO chip; 34-matrix switching chip; 41-working voltage regulation matrix; 42-writing voltage regulation matrix; 91-first indicator light; 92-second indicator light; 93-power switch; 94-adaptive communication interface; 95-USB interface; 96-power interface. DETAILED DESCRIPTION

[0046] To make the objects, advantages, and features of the present invention more clearly apparent, the present invention is further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale. They are only used to conveniently and clearly assist in illustrating the purposes of the embodiments of the present invention. In addition, the structures shown in the drawings are often part of the actual structure. In particular, different drawings may need to illustrate different focuses and sometimes use different scales.

[0047] As used in the present invention, the singular forms "a", "an", and "the" include plural referents, the term "or" is generally used to include "and / or", the term "several" is generally used to include "at least one", and the term "at least two" is generally used to include "two or more". In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features specified as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features, "one end" and "the other end" and "proximal end" and "distal end" generally refer to two corresponding parts, which not only include endpoints, and the terms "mounted", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be a communication between two elements or an interaction relationship between two elements. In addition, as used in the present invention, "one element is disposed on another element" generally only indicates that there is a connection, coupling, cooperation, or transmission relationship between the two elements, and the connection, coupling, cooperation, or transmission between the two elements may be direct or indirect through an intermediate element. It should not be understood as indicating or implying a spatial positional relationship between the two elements. That is, one element can be in any orientation, such as inside, outside, above, below, or to one side of another element, unless the content clearly indicates otherwise. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] The core idea of ​​the present invention is to provide an ASIC communication and programming device to solve the problems of the prior art, such as the lack of ASIC communication and programming devices with adaptive functions, as well as the resulting increased costs, complicated processing procedures, and proneness to errors.

[0049] The following description is given with reference to the accompanying drawings.

[0050] Please refer to Figures 1 to 9 ,in, Figure 1 This is a schematic structural diagram of a control circuit board according to an embodiment of the present invention; Figure 2 is a circuit diagram of an adaptive communication module according to an embodiment of the present invention; Figure 3 1 is a circuit diagram of an MSP430 single-chip microcomputer according to an embodiment of the present invention; Figure 4 is a circuit diagram of a USB interface circuit according to an embodiment of the present invention; Figure 5 is a circuit diagram of a bridge chip according to an embodiment of the present invention; Figure 6 is a circuit diagram of a switching submodule according to an embodiment of the present invention; Figure 7This is a circuit of a working voltage generating circuit and a working voltage regulating matrix according to an embodiment of the present invention; Figure 8 This is a circuit diagram of a programming voltage generating circuit and a programming voltage regulating matrix according to an embodiment of the present invention; Figure 9 FIG. 1 is an overall appearance diagram of a programming device according to an embodiment of the present invention.

[0051] like Figure 1 As shown, this embodiment provides an ASIC communication programming device, which includes a control circuit board, which includes a main control module 1, a computer communication module 2, a voltage transformation module 3, a voltage regulation matrix 4, and an adaptive communication module 5. The main control module 1 is communicatively connected to the computer communication module 2, the main control module 1 is communicatively and electrically connected to the voltage transformation module 3, the main control module 1 is communicatively and electrically connected to the adaptive module 5, and the voltage module 3 is electrically connected to the voltage regulation matrix.

[0052] The computer communication module 2 is used to establish a bidirectional communication connection between the main control module 1 and the computer 6. The voltage conversion module 3 is used to provide a preset voltage to the main control module 1 by adjusting its connection with the voltage regulation matrix 4. The preset voltage includes an operating voltage VDD and a programming voltage VPP. The energy for the voltage conversion module 3 comes from an external power supply 7. In one embodiment, the external power supply is a 12V DC voltage source.

[0053] For further information, please refer to Figure 2 The adaptive communication module 5 includes an Auto_CLK port, which is configured as a first communication port for transmitting a standard communication clock signal; an Auto_DATA port, which is configured as a second communication port for transmitting a standard communication data signal; and an Auto_CS port, which is configured as a third communication port for transmitting a chip select signal in an SPI communication mode. The adaptive communication module 5 is used to connect to an ASIC chip 8; the main control module 1 is used to confirm the communication protocol of the ASIC chip 8 by adjusting the output signals of the first, second, and third communication ports, and to communicate and program the ASIC chip 8 through the first, second, and third communication ports. The communication protocols of the ASIC chip 8 include OWI, IIC, and SPI. The adaptive communication module also includes a VDD_OUT port (for powering the ASIC chip) and a GND port (for grounding).

[0054] As described in the background, different types of ASIC chips may have different communication protocols. Therefore, the prior art requires the development of specialized ASIC communication devices or ASIC communication programming devices tailored to each communication protocol. In this embodiment, by providing a first communication port, a second communication port, and a third communication port, the ASIC communication programming device can adaptively connect to an ASIC chip using any communication protocol. This improves the versatility and flexibility of the ASIC communication programming device, reduces hardware and software costs, eliminates product dependency, simplifies the ASIC chip manufacturing process, reduces interface complexity, and reduces or eliminates the potential for introducing additional errors, resulting in superior performance.

[0055] Specifically, according to the different characteristics of OWI, IIC and SPI protocols, the main control module 1 confirms the communication protocol of the ASIC chip 8 by adjusting the output signals of the first communication port, the second communication port and the third communication port, including: driving the second communication port to output an OWI waveform, judging whether the ASIC chip 8 generates an OWI response signal, and if so, judging that the communication protocol of the ASIC chip 8 is OWI; otherwise, judging that the communication protocol of the ASIC chip 8 is not OWI; if the communication protocol of the ASIC chip 8 is not OWI, driving the first communication port and the second communication port to output an OWI waveform, and judging whether the ASIC chip 8 generates an OWI response signal; The first communication port outputs an IIC waveform to determine whether the ASIC chip 8 generates an IIC response signal. If so, the communication protocol of the ASIC chip 8 is determined to be IIC. Otherwise, the communication protocol of the ASIC chip 8 is determined to be neither OWI nor IIC. If the communication protocol of the ASIC chip 8 is neither OWI nor IIC, the first communication port, the second communication port, and the third communication port are driven to output an SPI waveform to determine whether the ASIC chip 8 generates an SPI signal. If so, the communication protocol of the ASIC chip 8 is determined to be SPI. Otherwise, the ASIC chip 8 is determined to be an invalid chip. Specifically, the step of determining whether the ASIC chip 8 generates an SPI signal includes: when the signal of the third communication port is low, if the ASIC chip generates a response signal at the second communication port, the judgment result is yes; otherwise, the judgment result is no. This configuration can quickly and accurately confirm the communication protocol of the ASIC chip 8, make necessary preparations for subsequent communication and programming work, and facilitate the implementation of the overall workflow of the ASIC communication and programming device.

[0056] In the above process, the specific details such as the output of the waveform of the relevant protocol and the judgment of the response signal can be set by those skilled in the art according to the relevant instruction documents of the OWI, IIC and SPI protocols. They are common knowledge in the art and will not be described in detail here.

[0057] Please refer to Figure 3In one embodiment, the main control module 1 includes an MSP430 single-chip microcomputer 11. The MSP430 single-chip microcomputer 11 includes a DVcc port, a P6.3 / A3 port, a P6.3 / A4 port, a P6.3 / A5 port, a P6.3 / A6 port, a P6.3 / A7 port, a VREF+ port, an XIN port, an XOUT port, a VEref+ port, a VREF- / VEref- port, a P1.0 / TACLK port (for transmitting a Dig0 signal), a P1.1 / TA0 port (for transmitting a Dig1 signal), a P1.2 / TA1 port (for transmitting a Dig2 signal), a P1.3 / TA2 port (for transmitting a Dig3 signal), a P1.4 / SMCLK port (for transmitting a Dig4 signal), and a P1. 5 / TA0 port, P1.6 / TA1 port, P1.7 / TA2 port, P2.0 / ACLK port (for transmitting Dig5 signal), P2.1 / TAINCLK port (for transmitting Dig6 signal), P2.2 / CAOUT / TA0 port (for transmitting Dig7 signal), P2.3 / CA0 / TA1 port (for transmitting Dig8 signal), P2.4 / CA1 / TA2 port (for transmitting Dig9 signal), P2.5 / Rosc port, P2.6 / ADC12CLK port, P2.7 / TA0 port, P3.0 / UCB0STE port, P3.1 / UCB0SIMO port, P3.2 / U CB0SOMI port, P3.3 / UCB0CLK port, P3.4 / UCA0TXD port (for transmitting F149_TXD signal), P3.5 / UCA0RXD port (for transmitting F149_RXD signal), P3.6 / UCA1TXD port, P3.7 / UCA1RXD port, P4.0 / TB0 port (for outputting Auto_CLK signal to the adaptive communication module 5, driving the Auto_CLK port of the adaptive communication module 5 to output a signal of the same waveform), P4.1 / TB1 port (for outputting Auto_DATA signal to the adaptive communication module 5, driving the A of the adaptive communication module 5 Auto_DATA port outputs a signal of the same waveform), P4.2 / TB2 port (used to output the Auto_CS signal to the adaptive communication module 5, driving the Auto_CS port of the adaptive communication module 5 to output a signal of the same waveform), P4.3 / TB3 port, P4.4 / TB4 port, P4.5 / TB5 port, P4.6 / TB6 port, P4.7 / TBCLK port, P5.0 / UCB1STE port (used to transmit the SCL_IO signal), P5.1 / UCB1SIMO port (used to transmit the SDA_IO signal), P5.2 / UCB1SOMI port, P5.3 / UCB1CLK port, P5.4 / MCLK port (for transmitting Sel signal), P5.5 / SMCLK port, P5.6 / ACLK port, P5.7TBOUTH port, XTOUT port, TDO / TDI port (for transmitting TDO signal), TDI / TCLK port (for transmitting TDI signal).

[0058] ————signal), TMS port (for transmitting TMS signals), TCK port (for transmitting TCK signals), RST / NMI port (for transmitting RESET signals), P6.0 / A0 port, P6.1 / A1 port, P6.2 / A2 port, AVss port, DVss port, and AVcc port. Ports and signals not explained in detail in the above description can be understood based on the naming and common knowledge in the field and are not detailed in this specification.

[0059] The main control module 1 also includes capacitors C1, C2, C3, C4, C5, C6 and crystal oscillators Y1 and Y2. The main parameters of the above components can be referred to Figure 3 For understanding, the connection method of the above components and the MSP430 microcontroller 11 can refer to Figure 3 The main control module 1 further includes a download submodule, a reset submodule and a power supply submodule (the above three submodules are not shown in the figure), which assist the MSP430 microcontroller 11 in completing the control of various functional modules.

[0060] Preferably, the computer communication module 2 includes a USB interface circuit 21 and a bridge chip 22, wherein the USB interface circuit 21 is used to communicate with the computer 6 and the bridge chip 22, and the bridge chip 22 is used to transmit the instructions generated by the computer 6 to the main control module 1, and to transmit the instructions generated by the main control module 1 to the computer 6.

[0061] In one embodiment, the USB interface circuit 21 is as follows Figure 4 As shown, the USB interface circuit includes capacitors C7-C10, magnetic beads FB1, USB type B interface J1 and the first high-precision LDO chip U1 (as a peripheral auxiliary power supply). Please refer to the connection relationship and main parameters of the above components. Figure 4 The USB type B interface J1 includes a VCC port, a D- port, a D+ port, and a GND port. The functions of the above ports can be understood with reference to common knowledge in the art. The working principles of the USB type B interface J1 and the first high-precision LDO chip U1 can be understood with reference to common knowledge in the art.

[0062] In one embodiment, the bridge chip 22 is as follows: Figure 5As shown, the bridge chip includes ports 1 to 28, wherein port 1 is used to transmit the MCU_RXD signal, port 2 is used to transmit the DTR signal, port 3 is used to transmit the RTS signal, port 5 is used to transmit the MCU_TXD signal, port 6 is used to transmit the 2303_RI signal, port 8, port 19, port 20 and port 24 are used to receive the VDD5V voltage, port 9 is used to transmit the 2303_DSR signal, port 10 is used to transmit the 2303_DCD signal, port 11 is used to transmit the 2303_CTS signal, and port 12 is used to transmit the SHTD signal. The above signals can be understood according to the naming and common knowledge in the field, and will not be elaborated in this specification. The computer communication module 2 also includes capacitors C19, C20, C21, C22 and C23, a crystal oscillator Y3, and resistors R35, R36, R37 and R41. The connection relationship between the above components and the bridge chip 22 is as shown in FIG. Figure 5 shown.

[0063] Furthermore, the voltage transformation module 3 includes a switching submodule 31, an operating voltage generating circuit 321 and a writing voltage generating circuit 322. The operating voltage generating circuit 321 generates the operating voltage VDD based on the external power supply 7 and the voltage regulation matrix 4; the writing voltage generating circuit 322 generates the writing voltage VPP based on the external power supply 7 and the voltage regulation matrix 4; the switching submodule 31 is used to select the voltage output generated by one of the operating voltage generating circuit 321 and the writing voltage generating circuit 322.

[0064] In one embodiment, the switching submodule 31 is as follows: Figure 6 As shown, the switching submodule 31 includes a switch chip 311 and a high-precision ADC sampling chip 312. The switch chip 311 includes an IN1 port (for transmitting a Sel signal), an IN2 port, an S1A port (for outputting the working voltage VDD), S2A (for outputting the programming voltage VPP), an S1B port, an S2B port, a VDD port (for receiving an internal power supply voltage VCC), a VSS port, a GND port, a D1 port (for outputting a voltage VDD_OUT to the adaptive communication module 5), and a D2 port. The switch chip 311 is used to switch the working voltage VDD and the programming voltage VPP. The high-precision ADC sampling chip 312 includes five AGND ports, a VDD port (for receiving an internal power supply voltage VCC), a REFin port (for receiving an internal power supply voltage VCC), an SCL port (for transmitting an SCL_IO signal), an SDA port (for receiving an internal power supply voltage VCC), and a VDD_OUT port (for receiving an internal power supply voltage VCC).

[0065] ————————transmit SDA_IO signal), Alert / Busy port, CONVST port, AS port, Vin1 port (for receiving the programming voltage VPP), Vin2 port (for receiving the working voltage VDD), Vin3 port and Vin4 port. The switching submodule 31 also includes capacitors C69, C70, C71, C72, C73, and C74. The parameters of the above capacitors are as follows Figure 6 The connection relationship between the above capacitor and the high-precision ADC sampling chip 312 is shown as follows. Figure 6 The ports and signals not explained in the above description can be understood based on the naming and common knowledge in the field, and will not be described in detail in this specification.

[0066] Preferably, the voltage regulation matrix 4 includes a working voltage regulation matrix 41 and a programming voltage regulation matrix 42. The working voltage regulation matrix 41 includes at least two working voltage regulation output terminals VDD_Ri and one working voltage regulation input terminal VDD_R_IN, and the working voltage generation circuit 321 achieves voltage regulation by connecting one of the working voltage regulation output terminals VDD_Ri to the working voltage regulation input terminal VDD_R_IN. The programming voltage regulation matrix 42 includes at least two programming voltage regulation output terminals VPP_Ri and one programming voltage regulation input terminal VPP_R_IN, and the programming voltage generation circuit 322 achieves voltage regulation by connecting one of the programming voltage regulation output terminals VPP_Ri to the programming voltage regulation input terminal VPP_R_IN. The value range of i corresponds to the number of corresponding output terminals.

[0067] In a preferred embodiment, the working voltage regulation matrix 41 includes 30 working voltage regulation output terminals VDD_R1~VDD_R30, the minimum output resistance of the working voltage regulation matrix 41 is 30 kilohms, the maximum output resistance of the working voltage regulation matrix 41 is 98 kilohms, and the resistance difference between the output resistances of adjacent working voltage regulation output terminals VDD_Ri is 2 kilohms; the burning voltage regulation matrix 42 includes 30 burning voltage regulation output terminals VPP_R1~VPP_R30, the minimum output resistance of the burning voltage regulation matrix 42 is 90 kilohms, the maximum output resistance of the burning voltage regulation matrix 42 is 148 kilohms, and the resistance difference between the output resistances of adjacent burning voltage regulation output terminals VPP_Ri is 2 kilohms; the output voltage range of the working voltage generation circuit 321 is 2.5V~5.3V, and the output voltage range of the burning voltage regulation generation circuit 322 is 4.8V~7.1V. It should be understood that the concept of output resistance is the resistance that can be measured by using a resistance measuring instrument to connect one of the working voltage regulation output terminals VDD_Ri and the working voltage regulation input terminal VDD_R_IN, or to connect one of the programming voltage regulation output terminals VPP_Ri and the programming voltage regulation input terminal VPP_R_IN.

[0068] The working voltage regulation matrix 41 is as follows Figure 7 As shown, the minimum output resistance is achieved by resistor R3, the maximum output resistance is achieved by resistor R4, there are 28 other resistors between R3 and R4, indicated by double arrows, and there are 28 other VDD_Ri between VDD_R1 and VDD_R30, also indicated by double arrows. Figure 8 As shown, the minimum output resistance is achieved by resistor R5, the maximum output resistance is achieved by resistor R6, there are 28 other resistors between R5 and R6, which are omitted by double arrows, and there are 28 other VPP_Ri between VPP_R1 and VPP_R30, which are also omitted by double arrows. The internal structure of the working voltage regulation matrix 41 and the burning voltage regulation matrix 42 can be referred to Figure 7 and Figure 8 It is understood that other solutions are also possible, such as connecting multiple resistors in series, and setting VDD_Ri and VPP_Pi at the connection points of different resistors.

[0069] Please refer to Figure 7 The working voltage generating circuit 321 includes a second high-precision LDO chip 33 (for generating the working voltage VDD) and a matrix switching chip 34, wherein the second high-precision LDO chip 33 includes two GND ports, an EN port, an OUT port, an IN port, and an ADJ port, and the matrix switching chip 34 includes A0 to A4 ports (for transmitting Dig5 to 9 signals), S1 to S32 ports (where S1 to S30 are respectively connected to VDD_R1 to VDD_R30 in a one-to-one correspondence), a CS port, an EN port, a WR port, a D port, three NC ports, a VDD1 port, a VDD2 port, a VSS port, and a GND port. The working voltage generating circuit 321 also includes capacitors C11, C12, C13, C14, and C15, and a resistor R2. For the main parameters of the above components, please refer to Figure 7 For understanding, please refer to the connection relationship between the above components and the second high-precision LDO chip 33 and the matrix switching chip 34. Figure 7 The ports and signals not explained in the above description can be understood based on the naming and common knowledge in the field, and will not be described in detail in this specification.

[0070] Please refer to Figure 8The programming voltage generating circuit 322 also includes the second high-precision LDO chip 33 (for generating the programming voltage VPP) and the matrix switching chip 34, wherein the S1 to S30 ports of the matrix switching chip 34 are respectively connected to VPP_R1 to VPP_R30 in a one-to-one correspondence. The rest of the introduction about the second high-precision LDO chip 33 and the matrix switching chip 34 can be understood by referring to the relevant content of the working voltage generating circuit 321. The programming voltage generating circuit 322 also includes capacitors C16, C17, C18, C19 and C20, resistor R1, electrolytic capacitor E1 and transformer socket input terminal CON1. ​​For the main parameters of the above components, please refer to Figure 8 For understanding, please refer to the connection relationship between the above components and the second high-precision LDO chip 33 and the matrix switching chip 34. Figure 8 The ports and signals not explained in the above description can be understood based on the naming and common knowledge in the field, and will not be described in detail in this specification.

[0071] Please refer to Figure 9 The programming device includes a metal housing 9 that completely encloses the control circuit board. In one embodiment, the metal housing 9 is made of aluminum. By completely enclosing the control circuit board, the metal housing 9 effectively prevents external electromagnetic radiation and interference, enhancing the device's EMC capability. Furthermore, the device is portable and can be reused across different production lines and equipment.

[0072] In one embodiment, the size of the metal shell 9 is 50cm*20cm*15cm. Such a configuration is convenient for carrying and placement.

[0073] The metal housing 9 is provided with a first indicator light 91 and a second indicator light 92. When the voltage transformation module 3 adjusts its connection with the voltage regulation matrix 4, the first indicator light 91 flashes at a first frequency and the second indicator light 92 turns off. When the main control module 1 is operating normally, the second indicator light 92 flashes at a second frequency and the first indicator light 91 turns off. The first frequency is greater than the second frequency. In one embodiment, the second frequency is once per second, simulating a heartbeat indication function.

[0074] The metal housing 9 is provided with a power switch 93, an adaptive communication interface 94, a USB interface 95, and a power interface 96. The first, second, and third communication ports are connected to the ASIC chip 8 via the adaptive communication interface 94, and the computer communication module 2 is connected to the computer 6 via the USB interface 95. In one embodiment, the USB interface 95 is a USB type B interface. The voltage conversion module 3 is connected to the external power supply 7 via the power interface 96 and generates the preset voltage based on the external power supply 7. In one embodiment, the external power supply 7 is converted by a 220VAC to 12VDC transformer.

[0075] In one embodiment, the workflow of the ASIC communication programming device includes the following steps:

[0076] S101 connects the power interface 96 to the 220VAC~12VDC transformer plug, connects the USB type B cable to the USB interface 95, and connects to the computer 6.

[0077] S102 connects the ASIC chip interface to the adaptive communication interface 94 .

[0078] S103 turns on the power switch 93.

[0079] S104: The ASIC communication programming device performs voltage self-calibration according to the pre-configured settings on the computer, including the operating voltage VDD and the programming voltage VPP (where VDD can be self-calibrated within a range of 2.5 to 5.3 V, and VPP can be self-calibrated within a range of 4.8 to 7.1 V). Simultaneously, the first indicator light flashes rapidly, prompting the user that the ASIC communication programming device is undergoing self-calibration. During this process, the main control module 1 drives the switch chip 311 to perform the necessary switching between VDD and VPP. The main control module 1 also drives the voltage transformation module 3 to change its connection with the voltage regulation module 4, adjusting VDD and VPP to their target values.

[0080] After the voltage self-calibration in step S105 is completed, the main control module 1 drives the voltage transformation module 3 to output the working voltage VDD. At the same time, the second indicator light flashes once per second to simulate a heartbeat, prompting the user that the ASIC communication programming device is in normal working condition.

[0081] S106: The system then automatically determines the communication mode: Based on the connected product's communication mode, the main control module 1 drives the first, second, and third communication interfaces to operate according to pre-set logic. The specific process of this step can be understood by referring to the description of the ASIC chip communication protocol determination process previously described in this specification. If the determination result is OWI, the MCU records the OWI flag; if the determination result is IIC, the MCU records the IIC flag; if the determination result is SPI, the MCU records the SPI flag; if the determination result is an invalid chip, an alarm is generated and the process is terminated.

[0082] S107 When the communication protocol of the ASIC chip is judged to be finished, the system can carry out the normal data collection work of the ASIC chip according to the control instruction output by the computer 6. After the data collection is completed, the data is stored in the database of the computer 6.

[0083] S108 After the required data collection is completed, the ASIC chip is burned. At this time, the main control module 1 drives the voltage conversion module 3 to switch the power supply from VDD to VPP to burn the ASIC chip. This process does not require the participation of external power supply equipment.

[0084] After all the data collection, burning and adjustment are completed, the ASIC chip can be removed and connected, and the whole process is completed.

[0085] The ASIC communication programming device can set different configuration voltages, waveform parameters, etc. on the host PC according to different ASIC product requirements, which greatly expands the reusability and convenience of the device and also greatly reduces costs.

[0086] This embodiment also provides a control method, which is applied to the above-mentioned ASIC communication burning device, and the control method includes: the main control module obtains a voltage regulation target from the computer through the computer communication module; and the main control module drives the voltage transformation module to adjust the connection relationship between itself and the voltage regulation matrix so that the preset voltage meets the requirements of the voltage regulation target.

[0087] Optionally, after the main control module drives the transformer module to adjust the connection relationship between itself and the voltage regulation matrix so that the preset voltage meets the requirements of the voltage regulation target, the control method also includes: the transformer module outputs the working voltage; the main control module outputs the working voltage to the adaptive communication module; and the main control module drives the output signals of the first communication port, the second communication port and the third communication port to confirm the communication protocol of the ASIC chip.

[0088] Optionally, after the main control module drives the output signals of the first communication port, the second communication port and the third communication port to confirm the communication protocol of the ASIC chip, the control method further includes: the main control module obtains a communication target from the computer through the computer communication module; and the main control module communicates with the ASIC chip through the adaptive communication module based on the communication target and the confirmed communication protocol of the ASIC chip.

[0089] Alternatively, the control method further includes: the main control module obtaining a communication target from the computer via the computer communication module; the main control module communicating with the ASIC chip via the adaptive communication module based on the communication target and the confirmed communication protocol of the ASIC chip; and the main control module sending at least a portion of the communication result to the computer via the computer communication module and causing at least a portion of the communication result to be stored. The at least a portion of the communication result may be stored in the computer or stored in another computer device via the computer.

[0090] Optionally, after the main control module drives the output signals of the first communication port, the second communication port and the third communication port to confirm the communication protocol of the ASIC chip, the control method further includes: the main control module obtains a burning target from the computer through the computer communication module; the main control module drives the voltage conversion module to output the burning voltage; the main control module outputs the burning voltage to the ASIC chip through the adaptive communication module; and the main control module drives the adaptive communication module to burn the ASIC chip based on the burning target and the confirmed communication protocol of the ASIC chip.

[0091] The above control method is combined with the ASIC communication and programming device to determine the communication protocol of the ASIC chip 8 according to design expectations and perform subsequent communication and programming work.

[0092] In summary, the ASIC communication and programming device and control method provided in this embodiment include a main control module 1 and an adaptive communication module 5; the adaptive communication module 5 includes a first communication port, a second communication port, and a third communication port; the main control module 1 can confirm the communication protocol of the ASIC chip 8 by adjusting the output signals of the three communication ports, and perform subsequent communication and programming processes based on the type of the communication protocol. The control method is used to cooperate with the ASIC communication and programming device to complete the intended workflow. This configuration can adapt to ASIC chips 8 with multiple different communication protocols, improve the adaptability of the ASIC communication and programming device, and thereby reduce software and hardware costs, improve flexibility and versatility, and solve the problem of the lack of ASIC communication and programming devices with adaptive functions in the prior art.

[0093] In addition, this embodiment also achieves the following beneficial effects through other technical features:

[0094] 1. In the specific field of pressure sensor and thermopile sensor signal acquisition and conditioning, the hardware cost of this device is extremely low, and the price is only about 1 / 10 of the similar modular products of National Instruments.

[0095] 2. This device is highly integrated, integrating sensor signal acquisition and coefficient programming, eliminating the need for additional power modules and boards for programming, further reducing hardware costs.

[0096] 3. This device is easy to connect to the final sensor product and has a high fault tolerance rate. By making the three communication methods into a composite interface, the complexity of user connection is reduced.

[0097] 4. The software and hardware systems cooperate to realize adaptive judgment and communication of the communication interface.

[0098] 5. This device can communicate with a variety of ASIC signal conditioning circuits, achieving compatibility and reuse between different products.

[0099] 6. Good shielding and anti-interference characteristics.

[0100] 7. The device has a self-calibration feature. When the voltage drifts or temperature drifts, the device can be calibrated to improve the accuracy and stability of the system.

[0101] The above description is only a description of the preferred embodiment of the present invention and does not limit the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure are within the scope of protection of the technical solution of the present invention.

Claims

1. An ASIC communication programming device, characterized in that: The ASIC communication programming device includes a control circuit board, which includes a main control module, a computer communication module, a voltage conversion module, a voltage regulation matrix and an adaptive communication module; wherein, The computer communication module is used to establish a two-way communication connection between the main control module and the computer; The voltage transformation module is used to provide a preset voltage for the main control module by adjusting the connection relationship between itself and the voltage regulation matrix, and the preset voltage includes an operating voltage and a programming voltage; The adaptive communication module includes a first communication port, a second communication port and a third communication port, and the adaptive communication module is used to connect to the ASIC chip; The main control module is used to confirm the communication protocol of the ASIC chip by adjusting the output signals of the first communication port, the second communication port and the third communication port, and to communicate and burn the ASIC chip through the first communication port, the second communication port and the third communication port; The adaptive communication module includes an Auto_CLK port, which is configured as a first communication port for transmitting a standard communication clock signal; the adaptive communication module also includes an Auto_DATA port, which is configured as a second communication port for transmitting a standard communication data signal; the adaptive communication module also includes an Auto_CS port, which is configured as a third communication port for transmitting a chip select signal in an SPI communication mode; the communication protocols of the ASIC chip include OWI, IIC and SPI; The step of the main control module confirming the communication protocol of the ASIC chip by adjusting the output signals of the first communication port, the second communication port, and the third communication port includes: driving the second communication port to output an OWI waveform, and determining whether the ASIC chip generates an OWI response signal; if so, determining that the communication protocol of the ASIC chip is OWI; otherwise, determining that the communication protocol of the ASIC chip is not OWI; If the communication protocol of the ASIC chip is not OWI, driving the first communication port and the second communication port to output an IIC waveform, and determining whether the ASIC chip generates an IIC response signal; if so, determining that the communication protocol of the ASIC chip is IIC; otherwise, determining that the communication protocol of the ASIC chip is neither OWI nor IIC; If the communication protocol of the ASIC chip is neither OWI nor IIC, the first communication port, the second communication port, and the third communication port are driven to output an SPI waveform, and it is determined whether the ASIC chip generates an SPI response signal. If so, it is determined that the communication protocol of the ASIC chip is SPI; otherwise, the ASIC chip is determined to be an invalid chip.

2. The ASIC communication programming device according to claim 1, characterized in that: The computer communication module includes a USB interface circuit and a bridge chip. The USB interface circuit is used to communicate with the computer and the bridge chip. The bridge chip is used to transmit instructions generated by the computer to the main control module, and to transmit instructions generated by the main control module to the computer.

3. The ASIC communication programming device according to claim 1, characterized in that: The voltage transformation module includes a switching submodule, an operating voltage generating circuit and a burning voltage generating circuit. The operating voltage generating circuit generates the operating voltage based on an external power supply and the voltage regulation matrix; the burning voltage generating circuit generates the burning voltage based on the external power supply and the voltage regulation matrix; the switching submodule is used to select the voltage output generated by one of the operating voltage generating circuit and the burning voltage generating circuit.

4. The ASIC communication programming device according to claim 3, characterized in that: The voltage regulation matrix includes a working voltage regulation matrix and a writing voltage regulation matrix; wherein, the working voltage regulation matrix includes at least two working voltage regulation output terminals and one working voltage regulation input terminal, and the working voltage generation circuit realizes voltage regulation based on connecting one of the working voltage regulation output terminals and the working voltage regulation input terminal; the writing voltage regulation matrix includes at least two writing voltage regulation output terminals and one writing voltage regulation input terminal, and the writing voltage generation circuit realizes voltage regulation based on connecting one of the writing voltage regulation output terminals and the writing voltage regulation input terminal.

5. The ASIC communication programming device according to claim 4, characterized in that: The working voltage regulation matrix includes 30 working voltage regulation output terminals, the minimum output resistance of the working voltage regulation matrix is ​​30 kilo-ohms, the maximum output resistance of the working voltage regulation matrix is ​​98 kilo-ohms, and the resistance difference between the output resistances of adjacent working voltage regulation output terminals is 2 kilo-ohms; the burning voltage regulation matrix includes 30 burning voltage regulation output terminals, the minimum output resistance of the burning voltage regulation matrix is ​​90 kilo-ohms, the maximum output resistance of the burning voltage regulation matrix is ​​148 kilo-ohms, and the resistance difference between the output resistances of adjacent burning voltage regulation output terminals is 2 kilo-ohms; the output voltage range of the working voltage generating circuit is 2.5V~5.3V, and the output voltage range of the burning voltage regulation generating circuit is 4.8V~7.1V.

6. The ASIC communication programming device according to claim 1, characterized in that: The programming device comprises a metal shell, and the metal shell completely covers the control circuit board.

7. The ASIC communication programming device according to claim 6, characterized in that: A first indicator light and a second indicator light are provided on the metal casing. When the transformer module adjusts its connection relationship with the voltage regulation matrix, the first indicator light flashes at a first frequency and the second indicator light is off; when the main control module is working normally, the second indicator light flashes at a second frequency and the first indicator light is off; wherein, the first frequency is greater than the second frequency.

8. The ASIC communication programming device according to claim 6, characterized in that: The metal shell is provided with a power switch, an adaptive communication interface, a USB interface and a power interface; the first communication port, the second communication port and the third communication port are connected to the ASIC chip through the adaptive communication interface, the computer communication module is connected to the computer through the USB interface, and the transformer module is connected to the external power supply through the power interface, and generates the preset voltage based on the external power supply.

9. A control method, applied to the ASIC communication programming device according to any one of claims 1 to 8, characterized in that: The control method includes: The main control module obtains the voltage regulation target from the computer through the computer communication module; and The main control module drives the voltage transformation module to adjust the connection relationship between itself and the voltage regulation matrix so that the preset voltage meets the requirements of the voltage regulation target.

10. The control method according to claim 9, characterized in that: After the main control module drives the voltage transformation module to adjust the connection relationship between itself and the voltage regulation matrix so that the preset voltage meets the voltage regulation target requirement, the control method further includes: The voltage transformation module outputs the operating voltage; The main control module outputs the operating voltage to the adaptive communication module; and The main control module drives the output signals of the first communication port, the second communication port, and the third communication port to confirm the communication protocol of the ASIC chip.

11. The control method according to claim 10, characterized in that: After the main control module drives the output signals of the first communication port, the second communication port, and the third communication port to confirm the communication protocol of the ASIC chip, the control method further includes: The main control module obtains a communication target from the computer via the computer communication module; and The main control module communicates with the ASIC chip through the adaptive communication module based on the communication target and the confirmed communication protocol of the ASIC chip; Alternatively, the control method further includes: The main control module obtains the communication target from the computer through the computer communication module; The main control module communicates with the ASIC chip through the adaptive communication module based on the communication target and the confirmed communication protocol of the ASIC chip; and The main control module sends at least a portion of the communication result to the computer through the computer communication module, and drives at least a portion of the communication result to be stored.

12. The control method according to claim 10, characterized in that: After the main control module drives the output signals of the first communication port, the second communication port, and the third communication port to confirm the communication protocol of the ASIC chip, the control method further includes: The main control module obtains the programming target from the computer through the computer communication module; The main control module drives the voltage conversion module to output the programming voltage; The main control module outputs the programming voltage to the ASIC chip through the adaptive communication module; and The main control module drives the adaptive communication module to program the ASIC chip based on the programming target and the confirmed communication protocol of the ASIC chip.

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