A multi-channel isolated group power supply miniaturized board card structure

Abstract

The application discloses a kind of miniaturization board card structures of multi-channel isolated group power supply, including PCB board main body;Processor, the processor is connected with the PCB board main body;The processor includes ARM class chip;Several isolated groups, several the isolated groups are connected with the PCB board main body;Each the isolated group includes several functional elements encapsulated to form integrated structure;Each the isolated group is respectively connected with an isolated power module;Each processor connection interface included in each the isolated group is connected with the processor by digital isolator.The structure simple and reasonable, without affecting the isolation effect, reduce the size of board card, more suitable for the use scene of small equipment.Keep the number of isolated groups, provide convenience for the expansion of entire equipment system, and reduce failure rate.Worth widely using.

Description

Technical Field

[0001] This invention relates to the field of electronic circuit board technology, and in particular to a miniaturized circuit board structure that includes multiple isolated power supplies and communicates with multiple components of the whole machine through a multi-channel isolated power supply. Background Technology

[0002] A circuit board is a type of printed circuit board (PCB). During manufacturing, it includes a slot to be inserted into the main circuit board (motherboard) of a computer. It controls the operation of hardware devices such as monitors and data acquisition cards. After installing drivers, the corresponding hardware functions are implemented. In the field of electronic circuit board applications, the size of the circuit board is often greatly limited by the overall size of the product. Therefore, miniaturization of the circuit board is necessary to adapt it to the structure of the entire machine.

[0003] To ensure the electromagnetic compatibility performance of the entire machine, the various components in the machine are isolated from each other to ensure that they are not affected by the failure of other components. The core control board communicates with multiple components in the machine, so there are multiple isolation channels at the same time, which require special design for its isolation capability.

[0004] Currently available circuit boards with group isolation functions suffer from excessively large board sizes, making them difficult to adapt to small devices such as small drones. Existing technologies typically address this size issue by reducing the number of isolation groups to decrease the number of isolation power modules required on the board, or by compressing the isolation area on the PCB. However, this reduces the isolation between groups, impacting isolation performance and increasing the risk of overall system failure.

[0005] Therefore, how to provide a core control board that reduces the board size without affecting the isolation effect, making it more suitable for use in small devices, is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] In view of the above problems, the present invention provides a miniaturized board structure for multi-channel isolated group power supply to overcome or at least partially solve the above problems.

[0007] This invention provides the following solution:

[0008] A miniaturized board structure for multi-channel isolated power supply includes:

[0009] PCB board body;

[0010] A processor, which is connected to the main body of the PCB board; the processor includes an ARM-based chip.

[0011] A plurality of isolation groups are connected to the main body of the PCB board; each isolation group includes a plurality of functional components packaged to form an integral structure; each isolation group is connected to an isolated power supply module; each processor connection interface contained in each isolation group is connected to the processor through a digital isolator.

[0012] The processor is located in the middle of the PCB board, and several isolation groups are arranged around the processor at intervals.

[0013] Preferably, the PCB board body is also provided with several external interfaces.

[0014] Preferably, a plurality of the external interfaces are evenly distributed along the circumferential outer edge of the PCB board body.

[0015] Preferably, both the isolated power supply module and the external interface are surface-mount devices.

[0016] Preferably, the isolation power supply module has an isolation withstand voltage of 1500 volts or higher.

[0017] Preferably, at least one of the upper and lower layers of the power supply copper in each isolation group is a reference ground of the same isolation group.

[0018] According to specific embodiments provided by the present invention, the present invention discloses the following technical effects:

[0019] This application provides a miniaturized board structure for multi-channel isolation group power supply. The structure is simple and reasonable, reducing the board size without compromising isolation performance, making it more suitable for small devices. It maintains the number of isolation groups, facilitating the expansion of the entire device system and reducing the failure rate. It is worthy of widespread adoption.

[0020] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0022] Figure 1 This is a component block diagram of a miniaturized board structure for multi-channel isolated power supply provided in an embodiment of the present invention;

[0023] Figure 2This is a framework diagram of a miniaturized board structure for multi-channel isolated power supply provided in an embodiment of the present invention.

[0024] In the diagram: PCB board body 1, processor 2, isolation group 3, external interface 4, host computer 5. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention are within the scope of protection of the present invention.

[0026] See Figure 1 , Figure 2 This invention provides a miniaturized board structure for multi-channel isolated power supply, such as... Figure 1 , Figure 2 As shown, the structure may include:

[0027] PCB board body 1;

[0028] Processor 2, which is connected to the PCB board body 1; processor 2 includes an ARM-based chip;

[0029] A plurality of isolation groups 3 are connected to the PCB board body 1; each isolation group 3 includes a plurality of functional components packaged to form an integral structure; each isolation group 3 is connected to an isolation power module; each processor connection interface contained in each isolation group is connected to the processor through a digital isolator.

[0030] The processor 2 is located in the middle of the PCB board body 1, and several isolation groups 3 are arranged at intervals around the processor 2. Figure 1 , Figure 2 As shown in the embodiment of this application, eight isolation groups can be provided, namely isolation group 31, isolation group 32, isolation group 33, isolation group 34, isolation group 35, isolation group 36, isolation group 37, and isolation group 38.

[0031] The miniaturized board structure for multi-channel isolated power supply provided in this application uses an ARM-based chip as the core processor. It features a sufficient number of interfaces, high interface voltage withstand capability, and resistance to damage. It can also be expanded with common serial ports such as UART and RS232, facilitating debugging and data processing. The various functional components can be packaged together to form an integrated structure, creating several isolated groups. Each isolated group is powered by an independent isolated power supply module. This structure does not require reducing the number of isolated groups; miniaturization is achieved by reducing the distance between the isolated groups. Simultaneously, it ensures that the isolated groups do not interfere with each other, achieving good isolation while reducing the board size.

[0032] To facilitate the connection of the board structure provided in this embodiment with other components of the machine without occupying excessive board space, this embodiment can provide the PCB board body 1 with a plurality of external interfaces 4. Furthermore, the plurality of external interfaces 4 are evenly distributed along the circumferential outer edge of the PCB board body 1.

[0033] To further reduce the size of the board provided in this application embodiment, this application embodiment may also provide that the isolated power supply module and the external interface are both surface-mount devices. In terms of PCB layout, modules from different isolation groups are placed separately to improve isolation capabilities. Surface-mount devices are selected for the external interface and power supply module as much as possible to facilitate reversible mounting, and the core processor is placed in a central position.

[0034] In the structure provided in this application embodiment, both isolated power supply modules and digital isolators are used for power and signal isolation, respectively. Specifically, the isolated power supply module has an isolation withstand voltage of 1500 volts or higher. The isolated power supply module selected is a small isolated power supply module from GigaDevice, whose isolation withstand voltage is all above 1500V, providing sufficient isolation, a small size, and coverage of 5V-24V power supply. Each isolation group can be connected to the processor via one digital isolator, or multiple digital isolators; the number of digital isolators depends on the number of interfaces connected to the processor included in the isolation group.

[0035] The PCB board body provided in this application embodiment can adopt a stacked layout. Specifically, this application embodiment can also provide that at least one of the upper and lower layers of the power copper routing of each isolation group is the reference ground of the same isolation group.

[0036] In summary, the miniaturized board structure for multi-channel isolation group power supply provided in this application is simple and reasonable. It reduces the board size without compromising isolation performance, making it more suitable for small-scale equipment applications. It maintains the number of isolation groups, facilitating the expansion of the entire equipment system and reducing the failure rate. It is worthy of widespread adoption.

[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0038] As can be seen from the above description of the embodiments, those skilled in the art can clearly understand that this application can be implemented by means of software plus necessary general-purpose hardware platforms. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in various embodiments or some parts of the embodiments of this application.

[0039] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for system or system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and relevant parts can be referred to the descriptions in the method embodiments. The systems and system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without creative effort.

[0040] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the scope of protection of the present invention.

Claims

1. A miniaturized board structure for multi-channel isolated power supply, characterized in that, include: PCB board body; A processor, which is connected to the main body of the PCB board; the processor includes an ARM-based chip. A plurality of isolation groups are connected to the main body of the PCB board; each isolation group includes a plurality of functional components packaged to form an integral structure; each isolation group is connected to an isolated power supply module; each processor connection interface contained in each isolation group is connected to the processor through a digital isolator. The processor is located in the middle of the PCB board, and several isolation groups are arranged around the processor at intervals.

2. The miniaturized board structure for multi-channel isolated power supply according to claim 1, characterized in that, The PCB board body is also equipped with several external interfaces.

3. The miniaturized board structure for multi-channel isolated power supply according to claim 2, characterized in that, Several of the external interfaces are evenly distributed along the circumferential outer edge of the PCB board body.

4. The miniaturized board structure for multi-channel isolated power supply according to claim 2, characterized in that, Both the isolated power supply module and the external interface are surface-mount devices.

5. The miniaturized board structure for multi-channel isolated power supply according to claim 1, characterized in that, The isolation power supply module has an isolation withstand voltage of over 1500 volts.

6. The miniaturized board structure for multi-channel isolated power supply according to claim 1, characterized in that, At least one of the upper and lower layers of the power supply copper for each isolation group is the reference ground of the same isolation group.

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