Circuit board and electronic device thereof

Abstract

The embodiment of the present invention discloses a circuit board and an electronic device thereof. The circuit board includes: a substrate; an insulating ink layer, which is arranged on the substrate; at least one component, which is arranged on a side of the insulating ink layer away from the substrate; the component is welded to the substrate through a window area on the substrate; a packaging layer, which is arranged on a side of the component away from the substrate; the insulating ink layer includes a first water-discoloring material; the first water-discoloring material changes from a first color to a second color after the humidity exceeds a first humidity threshold. By adopting the above scheme, when testing the waterproof performance of the circuit board, it can be preliminarily judged whether water vapor has entered the inside of the circuit board according to the color change inside the circuit board, and there is no need to power on the circuit boards one by one for performance testing, which brings convenience to the waterproof performance testing work, simplifies the waterproof performance testing process of the circuit board, and reduces the waterproof performance testing cost of the circuit board.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a circuit board and electronic equipment thereof. Background Art

[0002] At present, printed circuit board products need to undergo waterproof, artificial sweat, salt spray and other test items before use. In the prior art, the product must first be placed in the above test environment, and then powered on, and the various performance of the product after powering on is used to determine whether water vapor has entered the product. The above judgment process is cumbersome, requires a lot of manpower and material resources, is costly, and cannot achieve rapid judgment. Summary of the invention

[0003] The embodiment of the present invention provides a circuit board and an electronic device thereof, which can perform a waterproof performance test in a fast, simple and low-cost manner.

[0004] In a first aspect, an embodiment of the present invention provides a circuit board, including: a substrate;

[0005] An insulating ink layer is disposed on the substrate;

[0006] At least one element is disposed on a side of the insulating ink layer away from the substrate; the element is welded to the substrate through a window area on the substrate;

[0007] A packaging layer, disposed on a side of the element away from the substrate;

[0008] The insulating ink layer includes a first water-chromic material; the first water-chromic material changes from a first color to a second color when the humidity exceeds a first humidity threshold.

[0009] In a second aspect, an embodiment of the present invention provides an electronic device, including the circuit board described in the first aspect of the present invention;

[0010] The electronic device also includes: a display panel and a device housing; the side of the device housing that is in contact with the display panel is the inner side of the device housing, and the inner side of the device housing is provided with a fourth water-chromic material; the fourth water-chromic material changes from the seventh color to the eighth color when the humidity exceeds a fourth humidity threshold.

[0011] The circuit board provided by the embodiment of the present invention comprises: a substrate; an insulating ink layer, arranged on the substrate; at least one component, arranged on the side of the insulating ink layer away from the substrate; the component is welded on the substrate through the window area on the substrate; a packaging layer, arranged on the side of the component away from the substrate; the insulating ink layer comprises a first water-discoloring material; the first water-discoloring material changes from a first color to a second color after the humidity exceeds a first humidity threshold. By adopting the above scheme, when testing the waterproof performance of the circuit board, it can be preliminarily judged whether there is water vapor entering the inside of the circuit board according to the color change inside the circuit board, and there is no need to power on the circuit boards one by one for performance testing, which brings convenience to the waterproof performance testing work, simplifies the waterproof performance testing process of the circuit board, and reduces the waterproof performance testing cost of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 A schematic diagram of a cross-sectional structure of a circuit board in a related technology provided by an embodiment of the present invention;

[0013] Figure 2 A schematic diagram of a cross-sectional structure of a circuit board provided in an embodiment of the present invention;

[0014] Figure 3 A schematic diagram of water vapor entering a circuit board according to an embodiment of the present invention;

[0015] Figure 4 A schematic cross-sectional structure diagram of another circuit board provided by an embodiment of the present invention;

[0016] Figure 5 A schematic diagram of a top view structure of a circuit board provided in an embodiment of the present invention;

[0017] Figure 6 A schematic diagram of a top view of another circuit board provided by an embodiment of the present invention;

[0018] Figure 7 A schematic diagram of a top view of another circuit board provided in an embodiment of the present invention;

[0019] Figure 8 A schematic cross-sectional structure diagram of another circuit board provided in an embodiment of the present invention;

[0020] Fig. 9 A schematic cross-sectional structure diagram of another circuit board provided in an embodiment of the present invention;

[0021] Fig.10 A schematic cross-sectional structure diagram of another circuit board provided in an embodiment of the present invention;

[0022] Fig.11 A schematic cross-sectional structure diagram of another circuit board provided in an embodiment of the present invention;

[0023] Fig.12 A structural schematic diagram of a sealed communication structure provided by an embodiment of the present invention;

[0024] Fig.13 A schematic structural diagram of another sealed communication structure provided by an embodiment of the present invention;

[0025] Fig.14 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention;

[0026] Fig.15 A schematic structural diagram of a device housing provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0027] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0028] Figure 1 A schematic diagram of a cross-sectional structure of a circuit board in a related art provided by an embodiment of the present invention, referring to Figure 1 In the related art, a circuit board generally includes a substrate 1, a component 2 located on one side of the substrate 1, and a pin 0 of the component 2 is electrically connected to the substrate 1. The pins 0 of the component 2 are electrically insulated by an insulating ink layer 3. An encapsulation layer 4 is arranged above the component 2 and the insulating ink layer 3, and the encapsulation layer 4 completely covers the exposed component 2 to protect the component 2. If water vapor does not enter the encapsulation layer 4, it will not affect the component 2. If water vapor enters the encapsulation layer 4, it will corrode the component 2 and affect the normal performance of the component 2. When testing the waterproof performance of a circuit board with the above structure, it is impossible to visually observe whether water vapor has entered the interior of the circuit board, and it can only be determined by a power-on test whether the component 2 is corroded by water vapor.

[0029] In view of this, the inventor proposes the technical solution in this application. Specifically, the circuit board provided in this application includes:

[0030] Base material;

[0031] An insulating ink layer is disposed on a substrate;

[0032] At least one element is disposed on a side of the insulating ink layer away from the substrate; the element is welded to the substrate through a window area on the substrate;

[0033] The encapsulation layer is arranged on the side of the component away from the substrate; the insulating ink layer includes a first water-chromic material; the first water-chromic material changes from a first color to a second color when the humidity exceeds a first humidity threshold.

[0034] Through the above scheme, when the waterproof performance of the circuit board is tested, it is possible to preliminarily judge whether water vapor has entered the inside of the circuit board based on the color change inside the circuit board. There is no need to power on the circuit boards one by one to perform performance tests, which brings convenience to the waterproof performance testing work, simplifies the waterproof performance testing process of the circuit board, and reduces the waterproof performance testing cost of the circuit board.

[0035] The above is the core idea of ​​the present invention. The technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] Figure 2 A schematic diagram of a cross-sectional structure of a circuit board provided in an embodiment of the present invention, referring to Figure 2 The circuit board provided in the present application includes: a substrate 1; an insulating ink layer 3, which is arranged on the substrate 1; at least one component 2, which is arranged on the side of the insulating ink layer 3 away from the substrate 1; the component 2 is welded to the substrate 1 through the window area A on the substrate 1; an encapsulation layer 4, which is arranged on the side of the component 2 away from the substrate 1; the insulating ink layer 3 includes a first water-chromic material 5; the first water-chromic material 5 changes from a first color to a second color after the humidity exceeds a first humidity threshold.

[0037] Specifically, Figure 2 As shown, the circuit board is provided with a substrate 1, an insulating ink layer 3, at least one component 2 and a packaging layer 4. The substrate 1 may include at least one substrate layer 7 and at least one conductive layer 6. For example, the substrate 1 may include a substrate layer 7 and a conductive layer 6 located on one side of the substrate layer 7. In this case, the circuit board is a single-layer circuit board. The substrate 1 may also include a substrate layer 7 and a first conductive layer 61 and a second conductive layer 62 located on both sides of the substrate layer 7 (such as Figure 2 As shown in ), the circuit board is a double-layer circuit board. Of course, in actual application, the structure of the substrate 1 is not limited to this. A plurality of base layers 7 and conductive layers 6 stacked in sequence may be provided in the substrate 1 to form a multi-layer circuit board. This application will not be described in detail one by one. Those skilled in the art may select a substrate 1 of any structure according to actual needs.

[0038] Among them, the base layer 7 can be a flexible base layer, such as a polyimide film layer or a polyester film layer, etc., but not limited to this; the base layer 7 can also be a rigid base layer, such as a phenolic resin paper laminate, an epoxy laminate, a polyester sandwich glass felt laminate or an epoxy glass cloth laminate, etc., but not limited to this. The conductive layer 6 can be a copper foil layer, a copper-nickel alloy layer or a conductive coating layer; the copper foil layer can be an electrolytic copper foil layer or a rolled copper foil layer; the conductive coating layer is formed by a conductive coating; the conductive coating is a slurry composed of a conductive material (such as silver, carbon, etc.) mixed with a polymer adhesive (such as a resin). The conductive layer 6 may include a conductive circuit (not shown in the figure), which can be obtained by patterning the conductive layer 6, but not limited to this. The specific formation method of the conductive layer 6 and the conductive circuit is not elaborated or limited in the embodiment of the present invention.

[0039] In addition, the embodiment of the present invention does not limit the thickness parameters of each film layer in the substrate 1, and those skilled in the art can set them according to actual needs.

[0040] Continue to refer Figure 2 The substrate 1 also includes a window area A, which refers to the area in the substrate 1 that is welded to the pin 0 of the component 2. One side surface of the substrate 1 ( Figure 2 As shown in the figure, the insulating ink layer 3 is also provided on the surface of the first conductive layer 61 facing away from the base layer 7. The insulating ink layer 3 covers part of the conductive circuit on the surface of the substrate 1 to prevent the conductive circuit from being exposed to the air and corroded or damaged. It should be pointed out that since the window area A is used for subsequent binding with the component 2, the insulating ink layer 3 should not be provided in the window area A, that is, the window area A of the substrate 1 is not covered by the insulating ink layer 3. In this setting, the insulating ink layer 3 can also play a solder resist role to avoid short circuits between the conductive circuits or components 2.

[0041] Among them, at least one component 2 is arranged on the side of the insulating ink layer 3 facing away from the substrate 1. The component 2 can be an integrated circuit chip, a capacitor, a resistor, a booster, a flash memory, a connector or a plug-in component. The pin 0 of the component 2 is welded to the conductive layer 6 in the substrate 1 exposed in the window area A to achieve electrical connection between the component 2 and the conductive circuit in the substrate 1. Optionally, the component 2 can be welded to the conductive layer 6 of the substrate 1 through solder paste 8, but it is not limited to this. In actual application, those skilled in the art can select any welding process to achieve electrical connection between the component 2 and the substrate 1 according to actual needs.

[0042] In addition, the embodiment of the present invention does not limit the specific preparation method of the insulating ink layer 3, and those skilled in the art can set it according to actual needs. For example, in a possible embodiment, the upper surface of the substrate 1 can be covered with a liquid insulating ink material, and then the insulating ink is cured; or, the insulating ink layer 3 can be prepared by a screen printing process, but is not limited to the above method.

[0043] Among them, it is mentioned above that the insulating ink layer 3 is not provided in the window area A, that is, the insulating ink layer 3 includes a hollow area B, and the hollow area B coincides with the projection of the window area A in the direction perpendicular to the surface of the substrate 1, and the hollow area B corresponds to the window area A of the substrate 1, and the pin 0 of the component 2 is electrically connected to the substrate 1 through the hollow area B. In the embodiment of the present application, when preparing the insulating ink layer 3, a whole layer of the insulating ink layer 3 can be prepared first, and then the insulating ink layer 3 is patterned to form the hollow area B. In this way, the position accuracy of the hollow area B (or the window area A) can be improved, thereby improving the quality of the circuit board. Alternatively, the insulating ink layer 3 can be prepared only on a part of the surface of the substrate 1, and the area not covered by the insulating ink layer 3 corresponds to the window area A, thereby reducing the process steps and improving the production efficiency of the circuit board. In addition, the size, quantity, shape and position of the window area A can be set by those skilled in the art according to actual needs, and the embodiment of the present invention does not repeat or limit this.

[0044] Further, continue to refer to Figure 2 The encapsulation layer 4 is located on the side of the component 2 facing away from the substrate 1, and the encapsulation layer 4 covers the component 2 and the insulating ink layer 3. The encapsulation layer 4 protects the component 2 and the conductive layer 6 inside the substrate 1 as a whole, thereby preventing damage to the internal circuits or components 2 of the circuit board. In this application, the side of the insulating ink layer 3 facing away from the substrate 1 can be defined as the surface of the insulating ink layer 3, and the side of the component 2 facing away from the substrate 1 can be defined as the surface of the component 2.

[0045] Among them, the embodiment of the present invention does not limit the specific setting method of the encapsulation layer 4, and those skilled in the art can make a choice according to actual needs. For example, in a possible embodiment, the encapsulation layer 4 can be a sealing layer or a fluorinated liquid coating, but is not limited to this. Among them, the sealing layer can be a silicone potting glue, an epoxy resin potting glue or a polyurethane potting glue, and the sealing layer can be prepared by a dispensing process. Fluorinated liquid is a colorless and transparent substance. The fluorinated liquid coating is formed after the fluorinated liquid is cured. The fluorinated liquid coating has good chemical inertness. When it comes into contact with electronic components 2, it will not cause any corrosion to the components 2. The circuit board is encapsulated using a fluorinated liquid coating. While avoiding damage to the circuit board, the thickness of the circuit board can also be reduced. The specific setting method of the actual encapsulation layer 4 is not limited to this. Those skilled in the art can choose an appropriate packaging method according to actual needs, and this application will not be described in detail one by one.

[0046] When testing the waterproof performance of the circuit board, water vapor may pass through the encapsulation layer 4 and enter the inside of the circuit board, thereby causing damage and failure of the components 2 and the conductive circuit. In order to intuitively determine whether water vapor has entered the inside of the circuit board, in this application, a first water-chromic material 5 is provided in the insulating ink layer 3, and the first water-chromic material 5 changes color after contacting water. In the figure, the horizontal line filling pattern inside the insulating ink layer 3 represents the first water-chromic material 5, which does not represent the actual structure of the first water-chromic material 5.

[0047] Specifically, the color of the first hydrochromic material 5 changes from the first color to the second color after the humidity it contacts exceeds the first humidity threshold. The first color can be understood as the color of the first hydrochromic material 5 when it is not in contact with water vapor, and the second color can be understood as the color of the first hydrochromic material 5 after it contacts with water vapor. The first humidity threshold is used to characterize whether the first hydrochromic material 5 contacts with water vapor. It can also be understood that the first hydrochromic material 5 changes from the original first color to the second color after contacting water vapor.

[0048] It can be understood that the humidity value in the current environment can reflect the water content in the current environment. The larger the humidity value, the higher the water content of the current environment. Under normal circumstances, no water vapor enters the inside of the circuit board, and the humidity value of the insulating ink layer 3 should be a relatively low humidity value. The first water-chromic material 5 in the insulating ink layer 3 is not in contact with water vapor, and the first water-chromic material 5 is the first color. When conducting a waterproof performance test, if no water vapor enters the inside of the circuit board, the first water-chromic material 5 still maintains the first color; if water vapor enters the inside of the circuit board, the water vapor enters the insulating ink layer 3 through the encapsulation layer 4 and contacts the first water-chromic material 5, and the humidity value in the insulating ink layer 3 (or the humidity value contacted by the first water-chromic material 5) becomes larger, and this larger humidity value is the first humidity threshold, at which time the first water-chromic material 5 changes to the second color.

[0049] It should be noted that the first humidity threshold is not a fixed value, and is related to parameters such as the type and concentration of the first hydrochromic material. The present application does not limit the specific value of the first humidity threshold, and when the specific design parameters of the first hydrochromic material 5 are different, the magnitude of the first humidity threshold is also different.

[0050] In the present application, when testing the waterproof performance of the circuit board, it can be intuitively judged whether water vapor has entered the inside of the circuit board by whether the color of the first water-discoloring material 5 has changed. If the color of the first water-discoloring material 5 has not changed, it means that water has not entered the inside of the circuit board, and the component 2 and the conductive circuit will not be corroded; if the color of the first water-discoloring material 5 has changed, it means that water has entered the inside of the circuit board, and the component 2 and the conductive circuit may be corroded, and further performance testing of the circuit board is required. In this way, the tester can preliminarily judge the water vapor entering the inside of the circuit board by naked eye observation, without having to power on the circuit boards one by one for performance testing, which brings convenience to the waterproof performance testing work, simplifies the waterproof performance testing process of the circuit board, and reduces the cost of waterproof performance testing of the circuit board.

[0051] Figure 3 A schematic diagram of water vapor entering a circuit board according to an embodiment of the present invention, referring to Figure 3 , water vapor C enters the insulating ink layer 3 through the encapsulation layer 4, so that the humidity of the insulating ink layer 3 increases to be greater than or equal to the first humidity threshold. The humidity in contact with the first hydrochromic material 5 increases, and then changes from the first color (represented by a horizontal line plus a dotted filling pattern) to the second color (represented by a dotted filling pattern). Figure 3 The first hydrochromic material 5 that contacts the water vapor C changes color, while the first hydrochromic material 5 that does not contact the water vapor C remains unchanged in color.

[0052] The circuit board provided by the embodiment of the present invention comprises: a substrate; an insulating ink layer, arranged on the substrate; at least one component, arranged on the side of the insulating ink layer away from the substrate; the component is welded on the substrate through the window area on the substrate; a packaging layer, arranged on the side of the component away from the substrate; the insulating ink layer comprises a first water-discoloring material; the first water-discoloring material changes from a first color to a second color after the humidity exceeds a first humidity threshold. By adopting the above scheme, when testing the waterproof performance of the circuit board, it can be preliminarily judged whether there is water vapor entering the inside of the circuit board according to the color change inside the circuit board, and there is no need to power on the circuit boards one by one for performance testing, which brings convenience to the waterproof performance testing work, simplifies the waterproof performance testing process of the circuit board, and reduces the waterproof performance testing cost of the circuit board.

[0053] Optional, you can continue to refer to Figure 2 In the embodiment of the present application, the circuit board may further include at least one layer of covering film 9, and the stacking direction of each film layer of the substrate 1 may be defined as the up-down direction, and the covering film 9 may be located on any one of the upper and lower sides or both upper and lower sides of the outermost portion of the substrate 1. The covering film 9 is an insulating material and may protect the conductive circuit inside the substrate 1. Figure 2In the illustrated embodiment, the covering film 9 includes two layers, the first covering film 91 is located on the side of the substrate 1 away from the insulating ink layer 3, and the second covering film 92 is located on the side of the substrate 1 facing the insulating ink layer 3. In this arrangement, an opening D may be provided in the second covering film 92, and the first conductive layer 61 is exposed at the opening D. The window area A of the substrate 1 is located in the opening D, and the second covering film 92 is located between the substrate 1 and the insulating ink layer 3, thereby improving the packaging effect of the circuit board. In other embodiments not shown, the covering film 9 may only include the first covering film 91 located on the side of the substrate 1 away from the insulating ink layer 3. In this case, the first conductive layer 61 of the substrate 1 except the window area A is only covered by the insulating ink layer 3, which can reduce one preparation process.

[0054] Among them, the covering film 9 can be hot-pressed with polyester material or spray-coated on the surface of the substrate 1. The specific preparation process of the covering film 9 can be selected by technical personnel in this field according to actual needs, and this application will not provide detailed descriptions.

[0055] In addition, the embodiment of the present invention does not limit the type of the first hydrochromic material 5 and the distribution in the insulating ink layer 3, etc., and those skilled in the art can make a selection according to actual needs. When the type and other parameters of the first hydrochromic material 5 are different, the actual colors of the first color and the second color are also different. In addition, it should be noted that the second color does not refer to a fixed color. When the humidity to which the first hydrochromic material 5 is exposed is different, the degree of color change of the first hydrochromic material 5 may also be different.

[0056] Exemplarily, the first water-discoloring material 5 may be anhydrous copper sulfate, anhydrous cobalt chloride, or sodium peroxide. Anhydrous copper sulfate changes from white to blue when in contact with water, and anhydrous cobalt chloride changes from dark blue to pink when in contact with water. In practical applications, the selection of the first water-discoloring material 5 is not limited thereto, and the embodiments of the present invention will not be listed one by one.

[0057] Optionally, in a possible embodiment, the encapsulation layer 4 and the insulating ink layer 3 may be both transparent film layers, so that the color change of the first water-chromic material 5 is more obvious.

[0058] Optionally, in a possible embodiment, the first water-chromic material 5 can withstand a high temperature environment of a first temperature value; the first temperature value is the welding temperature of the component 2 in a welding furnace.

[0059] The entire preparation process of the circuit board can be simply described as follows: first, a substrate 1 is provided, and then an insulating ink layer 3 is prepared on one side of the substrate 1; and then the component 2 is welded to the conductive layer 6 of the substrate 1. Among them, the surface mounting technology (SMT) is widely used for welding the component 2. When the component 2 is welded to the substrate 1 using SMT, the solder paste 8 can be first coated on the window area A, and the pin 0 of the component 2 is fitted with the solder paste 8, and then the component 2 and the substrate 1 are placed in a welding furnace, and the solder paste 8 is melted at high temperature to achieve welding of the component 2 and the substrate 1. It can be seen that the preparation process of the insulating ink layer 3 is before the component 2 is mounted. Therefore, in this embodiment, in order to avoid the influence of the welding temperature in the welding furnace on the performance of the first water-chromic material 5, the first water-chromic material 5 can be set to be resistant to high temperature.

[0060] Specifically, the first hydrochromic material 5 can be set to have its hydrochromic performance unchanged at the welding temperature. The welding temperature can be defined as the first temperature. In layman's terms, after the first hydrochromic material 5 has been subjected to a high temperature environment at the first temperature value, it can still change from the first color to the second color when the humidity of the environment exceeds the first humidity threshold.

[0061] Optionally, in a possible embodiment, the first water-discoloring material 5 may be anhydrous copper sulfate, which can withstand high temperatures of about 600° C. The general welding temperature is around 260° C. The welding temperature will not affect the water-discoloring performance of anhydrous copper sulfate.

[0062] Of course, the first water-chromic material 5 is not limited thereto, and any material that can achieve water-chromic properties and withstand high temperatures of about 260° C. is within the scope of the technical solution protected by the embodiments of the present invention.

[0063] Optionally, in a possible embodiment, when the humidity changes, the first hydrochromic material 5 at least partially maintains the color at the highest humidity.

[0064] Specifically, in this embodiment, when the humidity of the environment in which the first hydrochromic material 5 is located changes, the first hydrochromic material 5 can maintain the color at the highest humidity it has been exposed to. In other words, to a certain extent, the color change of the first hydrochromic material 5 is irreversible. Exemplarily, when the ambient humidity increases from below the first humidity threshold to above the first humidity threshold, the first hydrochromic material 5 changes to a second color, and the second color can refer to the color at the highest humidity contacted by the first hydrochromic material 5; at this time, if the ambient humidity starts to decrease from the highest humidity, the color of the first hydrochromic material 5 will not change back to the first color, but remain the second color. Under this setting, even if the circuit board product is taken out of the test environment for a period of time, the water vapor inside the circuit board evaporates, and the internal humidity value decreases, the first hydrochromic material 5 can still maintain the changed color, so that the tester can accurately distinguish the circuit board with water vapor entering the inside; to avoid that after the water vapor evaporates, the tester cannot distinguish between the circuit board without water vapor and the circuit board with water vapor entering.

[0065] In addition, since the water vapor ingress into different areas of the circuit board may be different, during the waterproof performance test, some areas may have water vapor ingress, while some areas may not have water vapor ingress. The color of the first water-chromic material 5 in the area where water vapor has entered will change, while the color of the first water-chromic material in the area where no water vapor has entered will not change, so that the naked eye can judge which areas of the circuit board product have water vapor ingress. Optionally, in this embodiment, the first water-chromic material can still be selected from anhydrous copper sulfate, which is irreversible after changing color when exposed to water, meeting the actual application requirements.

[0066] In other possible embodiments, the first hydrochromic material 5 may also be a material whose color change is reversible. When a material whose color change is reversible is used as the first hydrochromic material 5, it is necessary to check the color change inside the circuit board immediately within a short period of time after the product is taken out of the test environment.

[0067] Optionally, in a possible embodiment, after the humidity exceeds a first humidity threshold, the first hydrochromic material 5 changes color to different degrees in different humidity ranges.

[0068] Specifically, in this embodiment, the color change of the first hydrochromic material 5 under different humidity conditions can be set to be different, that is, when the amount of water vapor contacted by the first hydrochromic material 5 is different, its color change conditions are also different. In this way, the degree of water vapor entering the circuit board can be determined according to the color change conditions of different areas of the circuit board, and then the leak position of the circuit board (that is, the water vapor entry path) can be determined according to the color change conditions, so that the process flow of the circuit board can be adjusted according to the leak position of the product.

[0069] Taking anhydrous copper sulfate as an example, if the water vapor content in contact with anhydrous copper sulfate is small (i.e. the humidity of the environment is slightly higher than the first humidity threshold), the color change of anhydrous copper sulfate is weak (turning to light blue); if the water vapor content in contact with anhydrous copper sulfate is high (i.e. the humidity of the environment is much higher than the first humidity threshold), the color change of anhydrous copper sulfate is strong (turning to dark blue). The darker areas in the circuit board are closer to the path where water vapor enters the circuit board, and the lighter areas are farther from the path where water vapor enters, thereby preliminarily determining the location of the leak in the circuit board.

[0070] You can continue to refer to Figure 2 In a possible embodiment, the first water-chromic material 5 may be distributed in the insulating ink layer 3 .

[0071] Specifically, Figure 2 As shown, the first hydrochromic material 5 can be arranged to be evenly distributed in the insulating ink layer 3. Under this arrangement, the first hydrochromic material 5 in the insulating ink layer 3 is distributed relatively evenly, and the color change of the first hydrochromic material 5 can be used to judge the water vapor entry into different areas of the insulating ink layer 3. Figure 2 The insulating ink layer 3 is filled with a horizontal line pattern to indicate that the first water-discoloring material 5 is dispersed therein.

[0072] Among them, the first hydrochromic material 5 can be added to the liquid insulating ink first, and the two can be mixed evenly, and then the insulating ink dispersed with the first hydrochromic material 5 can be applied to the surface of the substrate 1. After the coating is completed, the insulating ink is cured to form an insulating ink layer 3 with the first hydrochromic material 5 distributed. In this way, the curing process of the insulating ink layer 3 can remain unchanged, and the curing difficulty of the insulating ink layer 3 will not be increased.

[0073] In addition, in this embodiment, the parameters such as the particle size and / or distribution concentration of the first hydrochromic material 5 in the insulating ink layer 3 can also be limited. For example, the particle size of the first hydrochromic material 5 in the insulating ink layer 3 can be set to be smaller than the first particle size threshold, and / or the distribution concentration of the first hydrochromic material 5 in the insulating ink layer 3 can be set to be smaller than the first distribution concentration threshold. Within the range of the first particle size threshold and the first distribution concentration threshold, the doping of the first hydrochromic material 5 will not affect the normal curing of the insulating ink layer 3.

[0074] The embodiment of the present invention does not limit the specific setting values ​​of the first particle size threshold and the first distribution concentration threshold. When the material selected for the insulating ink layer 3 is different, the first particle size threshold and the first distribution concentration threshold may be different. Those skilled in the art can set appropriate first particle size threshold and first distribution concentration threshold according to actual conditions.

[0075] Figure 4A schematic diagram of a cross-sectional structure of another circuit board provided in an embodiment of the present invention, referring to Figure 4 In other possible embodiments, the insulating ink layer 3 may include an insulating coating 10 and a first hydrochromic layer 11, the first hydrochromic layer 11 is located on the side of the insulating coating 10 away from the substrate 1, and the first hydrochromic layer 11 includes a first hydrochromic material 5.

[0076] Specifically, Figure 4 As shown, in this embodiment, the insulating ink layer 3 can be composed of a laminated insulating coating 10 and a first hydrochromic layer 11. The insulating coating 10 can be first applied to one side of the substrate 1. The insulating coating 10 is the insulating ink layer 3 in the related art. Then the first hydrochromic layer 11 is applied to the side of the insulating coating 10 away from the substrate 1. The first hydrochromic material 5 is distributed in the first hydrochromic layer 11. In this arrangement, the first hydrochromic material 5 is distributed as a whole on one side of the insulating ink layer 3 close to the encapsulation layer 4. After the water vapor passes through the encapsulation layer 4, it first enters the first hydrochromic layer 11, causing the first hydrochromic material 5 to change color.

[0077] Among them, optionally, in this embodiment, the first hydrochromic material 5 can be evenly mixed with organic glue and then coated on the surface of the insulating coating 10. There is no water in the organic glue, which will not cause the first hydrochromic material 5 to change color. Of course, the setting method of the first hydrochromic layer 11 is not limited to this, and those skilled in the art can choose according to actual needs.

[0078] Figure 5 A schematic diagram of a top view of a circuit board provided in an embodiment of the present invention, optionally, refer to Figure 5 In a possible embodiment, the first hydrochromic material 5 may be disposed in at least a portion of the edge region of the substrate 1 .

[0079] Specifically, in Figure 5 In the illustrated embodiment, the first hydrochromic material 5 may be provided only in a portion of the edge region of the substrate 1. Since the edge region of the circuit board is susceptible to water vapor intrusion, in this embodiment, the first hydrochromic material 5 may be provided only in the insulating ink layer 3 corresponding to the edge of the substrate 1. On the basis of ensuring accurate identification of whether water vapor has entered, the cost of providing the insulating ink layer 3 is reduced.

[0080] Figure 6 A schematic diagram of a top view of another circuit board provided in an embodiment of the present invention, optionally, refer to Figure 6 In another possible embodiment, the first water-chromic material 5 is arranged around the edge area of ​​the substrate 1.

[0081] Specifically, in Figure 6In the illustrated embodiment, a first hydrochromic material 5 may be disposed in the insulating ink layer 3 corresponding to the edge of the substrate 1, that is, the orthographic projection of the overall structure of the first hydrochromic material 5 on the substrate 1 surrounds the edge of the substrate 1. In this arrangement, the color change of the first hydrochromic material 5 can reflect the water vapor entering the edge of the circuit board.

[0082] Figure 7 A schematic diagram of a top view structure of another circuit board provided in an embodiment of the present invention, optionally, refer to Figure 7 In other possible embodiments, the first water-chromic material 5 may be arranged around the window area A.

[0083] Specifically, Figure 7 As shown, a first hydrochromic material 5 can be arranged at the edge of the insulating ink layer 3 corresponding to the window area A of the substrate 1, so that the orthographic projection of the overall structure of the first hydrochromic material 5 on the substrate 1 surrounds the window area A. Since the window area A is used to bind with the component 2, the humidity requirements for the window area A and the edge of the window area A are relatively high. The first hydrochromic material 5 is arranged around the window area A to accurately reflect the water vapor entering around the pin 0 of the component 2.

[0084] in, Figure 5 to Figure 7 In the illustrated embodiment, the first water-chromic material 5 can be distributed in the insulating ink layer 3 in the corresponding area; or, the insulating coating 10 can be formed first, and then the first water-chromic layer 11 can be prepared on the surface of the insulating coating 10 in the corresponding area. The specific implementation methods of the above two schemes are the same as those in the above embodiments, and will not be repeated here.

[0085] In addition, in the embodiment of the present invention, only the shape of the window area A is square for illustration, but it is not limited to this. In other embodiments not shown, the shape of the window area A can also be circular or polygonal.

[0086] Optional, Figure 8 A schematic diagram of a cross-sectional structure of another circuit board provided in an embodiment of the present invention, referring to Figure 8 In a possible embodiment, the circuit board may further include: a second hydrochromic layer 12, which is arranged on the side of the component 2 away from the substrate 1; the second hydrochromic layer 12 includes a second hydrochromic material 13, and the second hydrochromic material 13 changes from the third color to the fourth color after the humidity exceeds the second humidity threshold.

[0087] Specifically, Figure 8As shown, the circuit board is also provided with a second hydrochromic layer 12, and a second hydrochromic material 13 is provided in the second hydrochromic layer 12. When the humidity of the environment in which the second hydrochromic material 13 is located exceeds the second humidity threshold, the second hydrochromic material 13 changes from the third color to the fourth color. Among them, the third color can be understood as the color of the second hydrochromic material 13 when it is not in contact with water vapor, and the fourth color can be understood as the color of the second hydrochromic material 13 after it is in contact with water vapor. The second humidity threshold is used to characterize whether the second hydrochromic material 13 is in contact with water vapor. It can also be understood that the second hydrochromic material 13 changes from the original third color to the fourth color after it is in contact with water vapor. In the figure, the vertical line filling pattern between the element 2 (insulating ink layer 3) and the encapsulation layer 4 represents the second hydrochromic material 13, which does not represent the actual structure of the second hydrochromic material 13.

[0088] Similarly, the second humidity threshold is not a fixed value, which is related to the type and concentration of the second hydrochromic material. The present application does not limit the specific value of the second humidity threshold. When the specific setting parameters of the second hydrochromic material 13 are different, the size of the second humidity threshold is also different.

[0089] Among them, the second water-chromic layer 12 can be arranged on the side of the component 2 away from the substrate 1, so that the preparation process of the second water-chromic layer 12 is located after the welding process of the component 2. Therefore, in this embodiment, the second water-chromic material 13 does not need to be resistant to high temperatures, thereby reducing the preparation cost of the circuit board. Optionally, the second water-chromic material 13 can be selected from any one of the anhydrous copper sulfate and anhydrous cobalt chloride mentioned in the above embodiment, but is not limited thereto.

[0090] In this embodiment, a second water-chromic layer 12 is provided in the circuit board, and by observing the color change of the second water-chromic layer 12, it can be determined whether water vapor has entered the packaging layer 4. Since the packaging layer 4 is closer to the outer layer of the circuit board, when part of the second water-chromic layer 12 changes from the third color to the fourth color, it indicates that water vapor has entered the packaging layer 4 corresponding to the area, and the packaging layer 4 may be damaged or leaky.

[0091] For example, please refer to Figure 8 In a possible embodiment, the second water-chromic layer 12 may be disposed between the element 2 and the encapsulation layer 4 .

[0092] Specifically, Figure 8As shown, as an optional embodiment, after the component 2 is welded to the substrate 1, a second water-chromic layer 12 can be prepared on the side of the component 2 facing away from the substrate 1. The second water-chromic layer 12 covers the insulating ink layer 3 and the component 2, and the encapsulation layer 4 covers the second water-chromic layer 12. In this way, when the humidity of a part of the encapsulation layer 4 exceeds the second humidity threshold, the tester can intuitively observe that the second water-chromic layer 12 corresponding to the area changes color. This further indicates that the encapsulation layer 4 in the area is damaged or leaking.

[0093] For example, Fig. 9 A schematic cross-sectional structure diagram of another circuit board provided by an embodiment of the present invention. Fig. 9 In another possible embodiment, the second water-chromic layer 12 may also be disposed on the side of the encapsulation layer 4 away from the substrate 1 .

[0094] Specifically, Fig. 9 As shown, as another optional embodiment, after the encapsulation layer 4 is prepared, a second hydrochromic layer 12 can be prepared on the side of the encapsulation layer 4 away from the substrate 1, that is, the second hydrochromic layer 12 covers the outer surface of the encapsulation layer 4. In this way, the second hydrochromic layer 12 is closer to the outside of the circuit board, and it can be more clearly observed whether the second hydrochromic layer 12 changes color, and then the encapsulation effect of the encapsulation layer 4 can be judged according to the color of the second hydrochromic layer 12.

[0095] Optional, Figure 8 In the illustrated embodiment, the second water-chromic material 13 can be uniformly mixed with organic glue and then coated on the surface of the element 2 and the insulating ink layer 3; Fig. 9 In the embodiment shown, the second hydrochromic material 13 can be uniformly mixed with organic glue and then coated on the surface of the encapsulation layer 4. Of course, the configuration of the second hydrochromic layer 12 is not limited thereto, and those skilled in the art can select it according to actual needs.

[0096] Fig.10 A schematic diagram of a cross-sectional structure of another circuit board provided by an embodiment of the present invention. Fig.10 In other possible embodiments, a third water-chromic material 14 is distributed in the encapsulation layer 4; the third water-chromic material 14 changes from the fifth color to the sixth color when the humidity exceeds the third humidity threshold.

[0097] Specifically, Fig.10As shown, in another optional embodiment, a third hydrochromic material 14 is also doped inside the encapsulation layer 4. When the humidity of the environment in which the third hydrochromic material 14 is located exceeds the third humidity threshold, the third hydrochromic material 14 changes from the fifth color to the sixth color. Among them, the fifth color can be understood as the color of the third hydrochromic material 14 when it is not in contact with water vapor, and the sixth color can be understood as the color of the third hydrochromic material 14 after it is in contact with water vapor. The third humidity threshold is used to characterize whether the third hydrochromic material 14 is in contact with water vapor. It can also be understood that the third hydrochromic material 14 changes from the original fifth color to the sixth color after it is in contact with water vapor. In the figure, the rectangular filling pattern inside the encapsulation layer 4 represents the third hydrochromic material 14, which does not represent the actual structure of the third hydrochromic material 14.

[0098] The third hydrochromic material 14 may be the same as or different from the second hydrochromic material 13. The third humidity threshold is not a fixed value, and is related to parameters such as the type and concentration of the third hydrochromic material. The present application does not limit the specific value of the third humidity threshold. When the specific setting parameters of the third hydrochromic material 14 are different, the value of the third humidity threshold is also different.

[0099] In this configuration, the third hydrochromic material 14 is distributed more evenly in the encapsulation layer 4 , and the color change of the third hydrochromic material 14 can be used to judge the water vapor ingress conditions in different areas of the encapsulation layer 4 .

[0100] Among them, taking the encapsulation layer 4 as a sealing glue layer as an example, the third water-chromic material 14 can be first added to the liquid potting glue, and the two can be mixed evenly, and then the potting glue dispersed with the third water-chromic material 14 is applied to the surface of the component 2 and the insulating ink layer 3. After the coating is completed, the potting glue is cured to form a sealing glue layer with the third water-chromic material 14 distributed. In this way, the curing process of the sealing glue layer can remain unchanged, and the curing difficulty of the insulating ink sealing glue layer will not be increased. When the encapsulation layer 4 is a fluorinated liquid coating, the method of adding the third water-chromic material 14 can be the same as the above process.

[0101] In addition, in the present embodiment, parameters such as the particle size and / or distribution concentration of the third hydrochromic material 14 in the insulating ink layer 3 can also be limited. For example, the particle size of the third hydrochromic material 14 in the encapsulation layer 4 can be set to be smaller than the second particle size threshold, and / or the distribution concentration of the third hydrochromic material 14 in the encapsulation layer 4 can be set to be smaller than the second distribution concentration threshold. Within the range of the second particle size threshold and the second distribution concentration threshold, the doping of the third hydrochromic material 14 will not affect the normal curing of the encapsulation layer 4.

[0102] The embodiment of the present invention does not limit the specific setting values ​​of the second particle size threshold and the second distribution concentration threshold. When the material selected for the encapsulation layer 4 is different, the second particle size threshold and the second distribution concentration threshold may be different. Those skilled in the art can set appropriate second particle size threshold and second distribution concentration threshold according to actual conditions.

[0103] Optional, Fig.11 A schematic diagram of a cross-sectional structure of another circuit board provided in an embodiment of the present invention is shown in FIG. Fig.11 In a possible embodiment, a plurality of sealed communicating structures 15 are formed in the encapsulation layer 4 ; and the third water-discoloring material 14 is disposed in the sealed communicating structure 15 .

[0104] Fig.11 In the embodiment shown, the third water-chromic material 15 is also arranged inside the encapsulation layer 4. Fig.10 The difference from the embodiment shown is that in this embodiment, a sealed communication structure 15 filled with the third water-chromic material 14 can be formed first, and then the sealed communication structure 15 is embedded in the packaging layer 4. In this way, when a part of the area in the packaging layer 4 is damaged or cracked, water vapor enters the sealed communication structure 15 in the area through the crack, causing the third water-chromic material 14 to change color.

[0105] The specific configuration of the sealed communication structure 15 is not limited, and those skilled in the art can configure it according to actual needs, as long as the third water-discoloring material 14 is present in the sealed communication structure 15. The following describes the optional preparation methods of the sealed communication structure 15 with several specific embodiments.

[0106] Exemplarily, as an optional embodiment, the third water-chromic material 14 can be mixed with glue and then cured to form a sealed connecting structure 15, in which the third water-chromic material 14 is evenly dispersed; then, the encapsulation layer 4 is coated, and the sealed connecting structure 15 is placed in the uncured encapsulation layer 4; finally, the encapsulation layer 4 is cured to obtain the encapsulation layer 4 inlaid with the sealed connecting structure 15.

[0107] For example, Fig.12 A schematic diagram of a sealed communication structure provided by an embodiment of the present invention, referring to Fig.12 As another optional embodiment, the sealed communication structure 15 may include a sealed porous film layer 16 and a third water-chromic material 14 filled in the porous film layer 16. When the packaging layer 4 cracks and water vapor penetrates into the packaging layer 4, the water vapor penetrates the porous film layer 16 into the sealed communication structure 15, causing the third water-chromic material 14 to change color.

[0108] For example, Fig.13 A schematic diagram of another sealed communication structure provided by an embodiment of the present invention, Fig.13The sealing communication structure 15 in the embodiment shown is Fig.12 The sealing communication structure 15 is further refined based on the above. Fig.13 In this embodiment, the sealed communication structure 15 further includes a water-absorbing film layer 17 located at the outermost layer, and the water-absorbing film layer 17 covers the porous film layer 16 .

[0109] The water-absorbing film layer 17 can be made of a water-soluble material, which is a highly hydrophilic polymer material. When the encapsulation layer 4 cracks and water vapor penetrates into the encapsulation layer 4, the water-absorbing film layer 17 near the crack is hydrolyzed and damaged, and the water vapor penetrates through the porous film layer 16 into the sealed communication structure 15, causing the third water-discoloring material 14 to change color.

[0110] The preparation method of the above-mentioned sealed connecting structure 15 is only an example and is not a limitation of the technical solution of the present application. In addition to the above-mentioned technical solution, any method that can prepare the required sealed connecting structure 15 is within the scope of the technical solution protected by the embodiment of the present invention.

[0111] The circuit board provided in the embodiment of the present application can be tested for waterproof performance after the preparation process is completed. In addition, the circuit board provided in the embodiment of the present invention can also include any structure known to those skilled in the art, which is not elaborated or limited in the embodiment of the present invention.

[0112] Based on the same inventive concept, an embodiment of the present invention further provides an electronic device, including the circuit board provided by any embodiment of the present invention. Fig.14 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention, Fig.15 A schematic diagram of the structure of a device housing provided by an embodiment of the present invention, Fig.14 The circuit board is not shown. Fig.14 and Fig.15 The electronic device also includes: a display panel 18 and a device housing 19; the side of the device housing 19 that is in contact with the display panel 18 is the inner side E of the device housing 19, and the inner side E of the device housing 19 is provided with a fourth water-chromic material 20; the fourth water-chromic material 20 changes from the seventh color to the eighth color when the humidity exceeds the fourth humidity threshold.

[0113] The electronic device may be a mobile phone, a computer, a smart wearable device (e.g., a smart watch), or a vehicle-mounted display device, but is not limited thereto. This application takes a mobile phone as an example for explanation. Fig.14As shown, the electronic device is composed of a circuit board (not shown in the figure), a display panel 18 and a device housing 19. The device housing 19 is bonded to the display panel 18, and the circuit board can be located in a partial area between the device housing 19 and the display panel 18. The side where the device housing 19 is bonded to the display panel 18 is defined as the inner side E of the device housing 19, and the side away from the display panel 18 is the outer side of the device housing 19. In this embodiment, the fourth hydrochromic material 20 can be coated on a partial area of ​​the inner side E of the device housing 19. When the humidity of the environment in which the fourth hydrochromic material 20 is located exceeds the fourth humidity threshold, the fourth hydrochromic material 20 changes from the seventh color to the eighth color. Among them, the seventh color can be understood as the color of the fourth hydrochromic material 20 when it is not in contact with water vapor, the eighth color can be understood as the color of the fourth hydrochromic material 20 after it is in contact with water vapor, and the fourth humidity threshold is used to characterize whether the fourth hydrochromic material 20 is in contact with water vapor. It can also be understood that the fourth hydrochromic material 20 changes from the original seventh color to the eighth color after contacting water vapor. The fourth water-chromic material 20 is represented by a grid-like filling pattern in the figure, which does not represent the actual structure of the fourth water-chromic material 20.

[0114] Among them, the fourth water-chromic material 20 also does not need to be resistant to high temperatures. The fourth water-chromic material 20 can be the same as or different from the second water-chromic material 13 (or the third water-chromic material 14) in the above embodiment. The fourth humidity threshold is not a fixed value, which is related to the type and concentration parameters of the fourth water-chromic material. The present application does not limit the specific value of the fourth humidity threshold. When the specific setting parameters of the fourth water-chromic material 20 are different, the size of the fourth humidity threshold is also different.

[0115] The waterproof function of the device housing 19 is one of the key points to consider in product application. The electronic device provided in the embodiment of the present application can be tested for waterproof performance after preparation, or it can be determined whether water has entered the electronic device during user application. A fourth water-discoloring material 20 is provided on the inner side E of the device housing 19. After opening the device housing 19, it can be determined whether the waterproof performance of the product has failed by observing whether the fourth water-discoloring material 20 changes color. The determination method is efficient and convenient.

[0116] The coating method of the fourth water-chromic material 20 can refer to the coating method of the second water-chromic material 13, which will not be repeated here. In addition, the embodiment of the present invention does not limit the specific coating area of ​​the fourth water-chromic material 20 on the inner side E of the device housing 19, and those skilled in the art can set it according to actual needs.

[0117] Exemplarily, in a possible embodiment, at least a portion of an edge region of the inner side E of the device housing 19 includes a fourth hydrochromic material 20 .

[0118] For details, please refer to Fig.15 , the fourth water-chromic material 20 may be coated on at least part of the edge area of ​​the inner side E of the device housing 19. Since the edge area of ​​the device housing 19 is more susceptible to water ingress, in this embodiment, the fourth water-chromic material 20 may be disposed only on at least part of the edge area of ​​the inner side E of the device housing 19. In this way, the coating area of ​​the fourth water-chromic material 20 is small, which will not increase the manufacturing cost and process difficulty of the electronic device too much.

[0119] Optional, you can continue to refer to Fig.15 The fourth water-chromic material 20 is arranged around the edge area of ​​the inner side E of the device housing 19.

[0120] like Fig.15 As shown, the fourth hydrochromic material 20 can be coated around the inner edge E of the device housing 19, and any area of ​​the edge of the electronic device where water vapor enters can cause the fourth hydrochromic material 20 to change color. After removing the device housing 19, the area where water vapor enters can be directly and accurately determined, and then the performance test of the component 2 in the area can be performed.

[0121] Of course, in other embodiments not shown, the fourth water-chromic material 20 may be coated on the entire surface of the inner side E of the device housing 19, but is not limited thereto. In actual application, those skilled in the art may coat the fourth water-chromic material 20 on any area of ​​the inner side E of the device housing 19 according to actual needs.

[0122] The display device provided by the embodiment of the present invention has the corresponding beneficial effects of the circuit board provided by the embodiment of the present invention, which will not be described in detail here. In addition, the electronic device provided by the embodiment of the present invention may also include any structure known to those skilled in the art, which will not be described or limited in detail by the embodiment of the present invention.

[0123] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A circuit board, characterized in that: include: Base material; An insulating ink layer is disposed on the substrate; at least one element disposed on a side of the insulating ink layer away from the substrate; The element is welded to the substrate through the window area on the substrate; A packaging layer, disposed on a side of the element away from the substrate; The insulating ink layer includes a first water-chromic material; the first water-chromic material changes from a first color to a second color when the humidity exceeds a first humidity threshold.

2. The circuit board according to claim 1, characterized in that: The first water-chromic material can withstand a high temperature environment of a first temperature value; the first temperature value is the welding temperature of the component in a welding furnace.

3. The circuit board according to claim 1, characterized in that: When the humidity changes, the first hydrochromic material at least partially maintains the color at the highest humidity.

4. The circuit board according to claim 1, characterized in that: After the humidity exceeds the first humidity threshold, the first water-chromic material changes color to different degrees in different humidity ranges.

5. The circuit board according to claim 1, characterized in that: The first water-chromic material is distributed in the insulating ink layer.

6. The circuit board according to claim 1, characterized in that: The insulating ink layer includes an insulating coating and a first hydrochromic layer, wherein the first hydrochromic layer is located on a side of the insulating coating away from the substrate, and the first hydrochromic layer includes the first hydrochromic material.

7. The circuit board according to claim 1, characterized in that: The first water-chromic material is disposed on at least a portion of an edge region of the substrate.

8. The circuit board according to claim 1, characterized in that: The first water-chromic material is arranged around the edge area of ​​the substrate.

9. The circuit board according to claim 7, characterized in that: The first water-chromic material is arranged around the window area.

10. The circuit board according to claim 1, characterized in that: Also includes: The second hydrochromic layer is arranged on a side of the element away from the substrate; the second hydrochromic layer comprises a second hydrochromic material, and the second hydrochromic material changes from a third color to a fourth color when the humidity exceeds a second humidity threshold.

11. The circuit board according to claim 10, characterized in that: The second water-discoloring layer is arranged between the element and the packaging layer.

12. The circuit board according to claim 10, characterized in that: The second water-discoloring layer is arranged on a side of the encapsulation layer away from the substrate.

13. The circuit board according to claim 1, characterized in that: A third water-chromatic material is distributed in the encapsulation layer; the third water-chromatic material changes from a fifth color to a sixth color when the humidity exceeds a third humidity threshold.

14. The circuit board according to claim 13, characterized in that: A plurality of sealed communicating structures are formed in the encapsulation layer; and the third water-discoloring material is arranged in the sealed communicating structures.

15. An electronic device, characterized in that: A circuit board comprising any one of claims 1 to 14; The electronic device also includes: a display panel and a device housing; the side of the device housing that is in contact with the display panel is the inner side of the device housing, and the inner side of the device housing is provided with a fourth water-chromic material; the fourth water-chromic material changes from the seventh color to the eighth color when the humidity exceeds a fourth humidity threshold.

16. The electronic device according to claim 15, characterized in that: At least a portion of the edge area of ​​the inner side of the device housing includes the fourth hydrochromic material.

17. The electronic device according to claim 15, characterized in that: The fourth water-chromic material is arranged around an inner edge area of ​​the device housing.

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