A display device

Abstract

The application relates to a display device, which comprises an OLED display panel and an IC module, the OLED display panel is electrically connected with the IC module, the OLED display panel comprises a wafer circuit back plate, a display area, a gate row driving area, a source signal driving area and a circuit binding area are arranged on the front surface of the wafer circuit back plate, a plurality of connecting electrodes are arranged in the circuit binding area, the connecting electrodes are electrically connected with the IC module, the OLED display panel and the IC module are vertically stacked, and the IC module is arranged on the front surface or the back surface of the OLED display panel. The application can realize separate process manufacturing, simplify a process technology, shorten a development cycle, reduce manufacturing cost, and improve the effective display area of the display panel.

Description

Technical Field

[0001] This invention relates to the field of OLED display technology, specifically a display device. Background Technology

[0002] In existing silicon-based OLED products, the chip (IC module) is essentially integrated directly into the silicon-based OLED display panel. However, compared to the OLED display pixels in the display area, the chip contains a greater variety of components, especially the modules used to process digital signals. These modules have more complex manufacturing processes and higher requirements, which necessitates production on higher-generation production lines, resulting in significantly higher manufacturing costs. Furthermore, integrating all modules onto the display panel would greatly increase the area of ​​the non-light-emitting regions, leading to a larger overall product size and preventing smaller designs. Additionally, the need to integrate so many modules in a silicon-based OLED display panel significantly increases product development cycles, resulting in long development times, wasted capacity on high-generation production lines, and significantly higher costs.

[0003] In addition, due to the serious heat generation problem of display panels in existing silicon-based OLED products, the current cooling methods mainly include physical heat conduction cooling and fan cooling. However, these two heat dissipation methods have the problem of slow heat dissipation, resulting in short light-emitting life and poor user experience of existing silicon-based OLED products. Summary of the Invention

[0004] The purpose of this invention is to provide a display device that can be manufactured in separate processes, simplifying the manufacturing process, shortening the development cycle, reducing manufacturing costs, and increasing the effective display area of ​​the display panel.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] The present invention provides a display device, including an OLED display panel and an IC module. The OLED display panel is electrically connected to the IC module. The OLED display panel includes a wafer circuit backplane. The front side of the wafer circuit backplane is provided with a display area, a gate row driving area, a source signal driving area, and a circuit bonding area. The circuit bonding area has multiple connection electrodes, which are electrically connected to the IC module. The OLED display panel and the IC module are stacked vertically. The IC module is located on the front or back side of the OLED display panel.

[0007] The applicant has further optimization measures for the above technical solution.

[0008] Optionally, the IC module is bonded and fixed to the front side of the OLED display panel, and the connection terminals of the IC module are electrically connected to the connection electrodes of the line bonding area.

[0009] Furthermore, the IC module and the OLED display panel are manufactured independently, and the IC module is located in the line bonding area.

[0010] Optionally, the IC module is fixedly connected to the back of the OLED display panel, and multiple conductive pillars are provided in the line bonding area through a silicon through-hole process. One end of the conductive pillar is electrically connected to the connection electrode, and the other end is electrically connected to the corresponding connection terminal of the IC module.

[0011] Furthermore, the IC module is fixedly connected to the back side of the wafer circuit backplane, one end of the conductive post is located on the front side of the wafer circuit backplane and is electrically connected to the connection electrode, the conductive post passes through the wafer circuit backplane and the other end is located on the back side of the wafer circuit backplane, and the other end of the wafer circuit backplane is electrically connected to the connection terminal of the IC module.

[0012] Furthermore, the IC module and the OLED display panel are processed independently, the IC module is correspondingly located below the line bonding area, and the IC module is bonded and fixed to the OLED display panel.

[0013] Optionally, a semiconductor cooling module is fixed on the back of the OLED display panel, and the cooling surface of the semiconductor cooling module is in contact with the back of the OLED display panel. The electrical control terminals of the semiconductor cooling module are electrically connected to the corresponding connection terminals of the IC module.

[0014] Furthermore, the IC module is fixedly connected to the back side of the wafer circuit backplane, and the thickness of the semiconductor cooling module is no greater than the thickness of the IC module.

[0015] Furthermore, a heat dissipation connection line is integrated within the OLED display panel. A first conductive post is connected to one end of the heat dissipation connection line, and a second conductive post is connected to the other end. Both the first and second conductive posts penetrate the wafer circuit backplane through a silicon through-hole process. The first conductive post is electrically connected to the electrical control terminal of the semiconductor cooling module, and the second conductive post is electrically connected to the connection terminal of the IC module.

[0016] Optionally, the semiconductor cooling module is disposed below the display area, and the semiconductor cooling module is bonded or glued to the backplane of the wafer circuit backplane.

[0017] Compared with the prior art, the advantages of this invention patent application are as follows:

[0018] The display device of this application achieves a reduction in development cycle and manufacturing cost by manufacturing the OLED display panel and IC module separately in different processes, and then vertically stacking them using a bonding method. Furthermore, the novel structure allows the IC module to be fixed to the back of the OLED display panel, thus increasing the area of ​​the front display region.

[0019] In addition, by introducing a semiconductor cooling module, it can be vertically stacked with the OLED display panel through bonding or adhesive. The semiconductor cooling module is set on the back of the OLED display panel and corresponding to the display area. This can effectively control the temperature of the display area during operation, effectively improve the problem of severe heat generation in silicon-based OLED display panels, and can also level the IC module when it is placed behind it, thus providing a certain degree of protection for the IC module. Attached Figure Description

[0020] The following sections will describe some specific embodiments of the invention in detail by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or portions. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0021] Figure 1 This is a schematic diagram of the main view structure of the display device according to Embodiment 1 of the present invention;

[0022] Figure 2 This is a cross-sectional structural schematic diagram of the display device according to Embodiment 1 of the present invention;

[0023] Figure 3 This is a schematic diagram of the main view structure of the display device according to Embodiment 2 of the present invention;

[0024] Figure 4 This is a cross-sectional structural schematic diagram of the display device according to Embodiment 2 of the present invention;

[0025] Figure 5 This is a schematic diagram of the main view structure of the display device according to Embodiment 3 of the present invention;

[0026] Figure 6 This is a cross-sectional structural schematic diagram of a display device according to Embodiment 3 of the present invention.

[0027] The annotations in the attached figures are explained as follows:

[0028] 1. OLED display panel; 11. Display area; 12. Gate row driving area; 13. Source signal driving area; 14. Line bonding area; 15. Wafer circuit backplane.

[0029] 2. IC module;

[0030] 3. Semiconductor cooling module;

[0031] 41. First conductive post; 42. Second conductive post; 43. Third conductive post; 44. Heat dissipation connection wire. Detailed Implementation

[0032] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0035] Example 1:

[0036] This embodiment describes a display device, including an OLED display panel 1 and an IC module 2. The OLED display panel 1 is electrically connected to the IC module 2. The OLED display panel 1 includes a wafer circuit backplane 15. A display area 11, a gate row driving area 12, a source signal driving area 13, and a line bonding area 14 are disposed on the front side of the wafer circuit backplane 15. The gate row driving area 12, the source signal driving area 13, and the line bonding area 14 are distributed around the display area 11. In this embodiment, as... Figure 1 and 2As shown, on the front side of the OLED display panel 1, the gate row driving region 12 is disposed on the left and right sides of the display region 11, the source signal driving region 13 is disposed on the lower side of the display region 11, and the line bonding region 14 is disposed on the lower side of the source signal driving region 13. The line bonding region 14 has multiple connecting electrodes, which are electrically connected to the IC module 2. The IC module 2 transmits signals to the display region 11, the gate row driving region 12, and the source signal driving region 13 through the connecting electrodes. The OLED display panel 1 and the IC module 2 are vertically stacked and processed independently. In this embodiment, the IC module 2 is fixed to the front side of the OLED display panel 1.

[0037] Specifically, the IC module 2 is permanently bonded to the line bonding area 14 on the front side of the OLED display panel 1. The IC module 2 is stacked vertically with the OLED display panel 1. At the same time, the connection terminal of the IC module 2 for external electrical connection is electrically connected to the connection electrode of the line bonding area 14. This electrical connection can be made by soldering, plugging in terminals, or bonding.

[0038] Example 2:

[0039] In this embodiment of the display device, the OLED display panel 1 and the IC module 2 are structurally configured the same as in the aforementioned embodiment 1, as shown below. Figure 3 and 4 As shown, the difference is that a semiconductor cooling module 3 is fixed on the back of the OLED display panel 1, and the cooling surface of the semiconductor cooling module 3 is in contact with the back of the OLED display panel 1. The electrical control terminal of the semiconductor cooling module 3 is electrically connected to the corresponding connection terminal of the IC module 2.

[0040] A heat dissipation connection line 44 is integrated in the OLED display panel 1. A first conductive post 41 is connected to one end of the heat dissipation connection line 44. The first conductive post 41 penetrates the wafer circuit backplane 15 through silicon through-hole process. The first conductive post 41 is electrically connected to the electrical control terminal of the semiconductor cooling module 3, and the other end is electrically connected to the connection terminal of the IC module 2.

[0041] Example 3:

[0042] This embodiment describes a display device, including an OLED display panel 1 and an IC module 2. The OLED display panel 1 is electrically connected to the IC module 2. The OLED display panel 1 includes a wafer circuit backplane 15. A display area 11, a gate row driving area 12, a source signal driving area 13, and a line bonding area 14 are disposed on the front side of the wafer circuit backplane 15. The gate row driving area 12, the source signal driving area 13, and the line bonding area 14 are distributed around the display area 11. In this embodiment, as... Figure 5 and 6 As shown, on the front side of the OLED display panel 1, gate row driving regions 12 are disposed on the left and right sides of the display region 11, source signal driving regions 13 are disposed on the lower side of the display region 11, and line bonding regions 14 are disposed on the lower side of the source signal driving regions 13. The line bonding regions 14 have multiple connecting electrodes, which are electrically connected to the IC module 2. The IC module 2 transmits signals to the display region 11, gate row driving regions 12, and source signal driving regions 13 through the connecting electrodes. The OLED display panel 1 and the IC module 2 are manufactured independently, and the IC module 2 is fixed to the back side of the OLED display panel 1. The IC module 2 is vertically stacked with the OLED display panel 1, correspondingly disposed below the line bonding regions 14, and bonded to the OLED display panel 1. Since the IC module 2 is independently disposed on the back side of the OLED display panel 1, its size can be larger than the area of ​​the line bonding regions 14, making it easier to install the IC module 2 and reducing the manufacturing difficulty of the IC module 2.

[0043] Specifically, the IC module 2 is fixedly connected to the back of the wafer circuit backplane 15. Multiple third conductive pillars 43 are provided in the circuit bonding area 14 through silicon via process. One end of the third conductive pillar 43 is electrically connected to the connection electrode, and the other end is electrically connected to the corresponding connection terminal of the IC module 2.

[0044] That is, one end of the conductive post is located on the front side of the wafer circuit backplane 15 and is electrically connected to the connection electrode, the conductive post passes through the wafer circuit backplane 15 and the other end is located on the back side of the wafer circuit backplane 15, and the other end of the wafer circuit backplane 15 is electrically connected to the connection terminal of the IC module 2.

[0045] In summary, the display device of this application achieves a reduction in development cycle and manufacturing cost by manufacturing the OLED display panel 1 and IC module 2 separately and then vertically stacking them using a bonding method. Furthermore, the novel structure allows the IC module 2 to be fixed to the back of the OLED display panel 1, thereby increasing the arrangement area of ​​the front display area 11.

[0046] In a further embodiment, a semiconductor cooling module 3 is fixed on the back of the OLED display panel 1, and the cooling surface of the semiconductor cooling module 3 is in contact with the back of the OLED display panel 1. The electrical control terminals of the semiconductor cooling module 3 are electrically connected to the corresponding connection terminals of the IC module 2.

[0047] The IC module 2 is fixedly connected to the back side of the wafer circuit backplane 15, and the thickness of the semiconductor cooling module 3 is no greater than the thickness of the IC module 2. This design allows the lower surface of the semiconductor cooling module 3 to be basically flush with the lower surface of the IC module 2, thus enabling the semiconductor cooling module 3 to level the bottom of the IC module 2 and provide a certain degree of protection for the IC module 2.

[0048] A heat dissipation connection line 44 is integrated in the OLED display panel 1. A first conductive post 41 is connected to one end of the heat dissipation connection line 44, and a second conductive post 42 is connected to the other end. Both the first conductive post 41 and the second conductive post 42 penetrate the wafer circuit backplane 15 through silicon through-hole technology. The first conductive post 41 is electrically connected to the electrical control terminal of the semiconductor cooling module 3, and the second conductive post 42 is electrically connected to the connection terminal of the IC module 2.

[0049] The semiconductor cooling module 3 is positioned below the display area 11, thus better dissipating the heat generated during operation of the display area 11. The semiconductor cooling module 3 is bonded or adhesively fixed to the backplane of the wafer circuit backplane 15. By introducing the semiconductor cooling module 3, it can be vertically stacked with the OLED display panel 1 through bonding or adhesive methods. By placing the semiconductor cooling module 3 on the back of the OLED display panel 1 and corresponding to the display area 11, the temperature of the display area 11 during operation can be effectively controlled, effectively improving the problem of severe overheating of the silicon-based OLED display panel 1. Moreover, when the IC module 2 is placed behind it, it can level the IC module 2 and provide a certain degree of protection for the IC module 2.

[0050] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A display device comprising an OLED display panel (1) and an IC module (2), wherein the OLED display panel (1) is electrically connected to the IC module (2), the OLED display panel (1) comprising a wafer circuit backplane (15), wherein a display area (11), a gate row driving area (12), a source signal driving area (13), and a line bonding area (14) are disposed on the front side of the wafer circuit backplane (15), characterized in that, The line bonding area (14) has multiple connecting electrodes, which are electrically connected to the IC module (2). The OLED display panel (1) and the IC module (2) are stacked vertically, and the IC module (2) is fixedly connected to the back of the OLED display panel (1). Multiple conductive pillars are provided in the line bonding area (14) by through-silicon via (TSV) process. One end of the conductive pillar is located on the front side of the wafer line backplane (15) and is electrically connected to the connection electrode. The conductive pillar passes through the wafer line backplane (15) and the other end is located on the back side of the wafer line backplane (15). The other end of the wafer line backplane (15) is electrically connected to the connection terminal of the IC module (2). The IC module (2) is fixedly connected to the back side of the wafer circuit backplane (15). One end of the conductive post is located on the front side of the wafer circuit backplane (15) and is electrically connected to the connection electrode. The conductive post passes through the wafer circuit backplane (15) and the other end is located on the back side of the wafer circuit backplane (15). The other end of the wafer circuit backplane (15) is electrically connected to the connection terminal of the IC module (2). The IC module (2) and the OLED display panel (1) are processed independently. The IC module (2) is located below the line bonding area (14) and is bonded and fixed to the OLED display panel (1).

2. The display device according to claim 1, characterized in that, A semiconductor cooling module (3) is fixed on the back of the OLED display panel (1), and the cooling surface of the semiconductor cooling module (3) is in contact with the back of the OLED display panel (1). The electrical control terminal of the semiconductor cooling module (3) is electrically connected to the corresponding connection terminal of the IC module (2).

3. The display device according to claim 2, characterized in that, The IC module (2) is fixedly connected to the back of the wafer circuit backplane (15), and the thickness of the semiconductor cooling module (3) is not greater than the thickness of the IC module (2).

4. The display device according to claim 2, characterized in that, A heat dissipation connection line (44) is integrated in the OLED display panel (1). A first conductive post (41) is connected to one end of the heat dissipation connection line (44), and a second conductive post (42) is connected to the other end. Both the first conductive post (41) and the second conductive post (42) penetrate the wafer circuit backplane (15) through silicon through-hole technology. The first conductive post (41) is electrically connected to the electrical control terminal of the semiconductor cooling module (3), and the second conductive post (42) is electrically connected to the connection terminal of the IC module (2).

5. The display device according to any one of claims 2 to 4, characterized in that, The semiconductor cooling module (3) is disposed below the display area (11), and the semiconductor cooling module (3) is bonded or glued to the back plate of the wafer circuit backplane (15).

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