Temperature monitoring methods, computer devices and storage media for reflow soldering products

Abstract

This application provides a method, computer device, and storage medium for monitoring the temperature of reflow soldering products. The method includes: acquiring first historical data and second historical data of a first product; training a regression model based on the first and second historical data to obtain a temperature prediction model; acquiring real-time data of a second product; inputting the real-time data into the temperature prediction model to obtain the real-time predicted temperature value of the second product; plotting a real-time temperature prediction curve of the second product passing through multiple temperature zones of the reflow oven; calculating control parameters for real-time reflow soldering quality based on the real-time temperature prediction curves; and comparing the control parameters with a preset control range, issuing an early warning when the control parameters exceed the control range. This application can help improve the solder quality of reflow soldering products.

Description

Technical Field

[0001] This application relates to the field of reflow soldering temperature monitoring technology, and in particular to a method for monitoring the temperature of reflow soldering products, a computer device, and a storage medium. Background Technology

[0002] Currently, the temperature of reflow soldering products in the reflow oven is mostly monitored using oven temperature testers such as KIC. However, this method is difficult to use for real-time monitoring of the temperature of reflow soldering products in the reflow oven, thus making it impossible to control the real-time temperature of the reflow soldering products and ensuring the solder quality of the reflow soldering products. Summary of the Invention

[0003] In view of the above, it is necessary to provide a method, computer device and storage medium for monitoring the temperature of reflow soldering products, which can realize precise control of the temperature of reflow soldering products and real-time anomaly monitoring.

[0004] The reflow soldering product temperature monitoring method includes: acquiring first historical data and second historical data of the first product during reflow soldering in a reflow oven;

[0005] A training set is obtained based on the first historical data and the second historical data;

[0006] The regression model is trained using the training set to obtain the temperature prediction model;

[0007] Acquire real-time data of the second product during reflow soldering in the reflow oven;

[0008] The real-time data is input into the temperature prediction model to obtain the real-time temperature prediction value of the second product when it is reflow soldered in the reflow oven, and the real-time temperature prediction curve of the second product passing through multiple temperature zones of the reflow oven is plotted.

[0009] Based on the real-time temperature prediction curve, calculate the control parameters for real-time reflow soldering quality; and

[0010] The control parameters are compared with the preset control range. When it is determined that the control parameters exceed the control range, an early warning is issued.

[0011] Optionally, the multiple temperature zones of the reflux furnace include a preheating zone, a constant temperature zone, and a reflux zone.

[0012] Optionally, obtaining the first historical data of the first product during reflow soldering in the reflow oven includes:

[0013] Using temperature sensor devices pre-installed in each temperature zone, the first historical temperature of the first product in each temperature zone of the reflow oven is obtained;

[0014] The historical running speed of the chain in the reflow oven is obtained using a chain speed sensor device pre-installed in the reflow oven; and

[0015] Using a wind speed sensor device pre-installed in the reflow oven, the first historical air velocity at the air inlet and the second historical air velocity at the air outlet of the reflow oven are obtained.

[0016] Optionally, obtaining the second historical data of the first product during reflow soldering in the reflow oven includes:

[0017] The second historical temperature of the first product in each temperature zone of the reflow oven is obtained using a pre-installed furnace temperature tester.

[0018] Optionally, obtaining the training set based on the first historical data and the second historical data includes:

[0019] The first acquisition time for the temperature sensor device of each temperature zone to acquire the first historical temperature is obtained;

[0020] Select the second historical temperature from the second historical temperatures that corresponds to the first acquisition time;

[0021] The set of the first historical data and the second historical temperature corresponding to the first acquisition time is used as the training set.

[0022] Optionally, the regression model includes: a gradient boosting decision tree regression model or a random forest model.

[0023] Optionally, acquiring real-time data of the second product during reflow soldering in the reflow oven includes:

[0024] Using the temperature sensor device, the real-time temperature of the second product in each temperature zone is obtained;

[0025] The chain speed sensor device is used to obtain the real-time running speed of the chain in the reflow oven; and

[0026] The wind speed sensor device is used to obtain the first real-time air velocity at the air inlet and the second real-time air velocity at the air outlet of the reflux furnace.

[0027] Optionally, the real-time reflow quality control parameters include:

[0028] The first time during which the real-time temperature of the second product in the preheating zone increases from a preset first temperature to a preset second temperature;

[0029] The second product in the constant temperature zone experiences a second time interval during which its real-time temperature increases from the preset second temperature to the preset third temperature.

[0030] The second product's reflux duration and peak temperature in the reflux zone; and

[0031] The second product's real-time temperature during reflow soldering exceeds the preset fourth temperature for a total duration.

[0032] The computer-readable storage medium stores at least one instruction, which, when executed by a processor, implements the reflow soldering product temperature monitoring method.

[0033] The computer device includes a memory and at least one processor. The memory stores at least one instruction, which, when executed by the at least one processor, implements the reflow soldering product temperature monitoring method.

[0034] Compared with existing technologies, the reflow soldering product temperature monitoring method, computer device and storage medium can monitor the furnace temperature and chain speed of the reflow oven in real time, and track the real-time product temperature change curve of the simulated reflow soldering product in real time, so as to achieve precise control of the temperature of the reflow soldering product and real-time anomaly monitoring. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0036] Figure 1 This is a flowchart of the reflow soldering product temperature monitoring method provided in the embodiments of this application.

[0037] Figure 2 This is an architectural diagram of the computer device provided in the embodiments of this application.

[0038] Explanation of main component symbols

[0039] Computer devices 3 processor 32 memory 31 Reflow soldering product temperature monitoring system 30 Display device 33

[0040] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0041] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0042] Numerous specific details are set forth in the following description to provide a thorough understanding of this application. The described embodiments are merely some, not all, of the embodiments described herein. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0044] See Figure 1 The diagram shown is a flowchart of a reflow soldering product temperature monitoring method according to a preferred embodiment of this application.

[0045] In this embodiment, the reflow soldering product temperature monitoring method can be applied to a computer device (e.g., Figure 2 In the computer device 3) shown, for computer devices that need to monitor the temperature of reflow soldering products, the function for monitoring the temperature of reflow soldering products provided by the method of this application can be directly integrated into the computer device, or it can be run on the computer device in the form of a software development kit (SDK).

[0046] like Figure 1 As shown, the reflow soldering product temperature monitoring method specifically includes the following steps. Depending on different needs, the order of the steps in this flowchart can be changed, and some steps can be omitted.

[0047] Step S1: Computer device 3 acquires first historical data and second historical data of the first product during reflow soldering in the reflow oven.

[0048] In embodiments of this application, the first product may be multiple (e.g., 500) historical products from the same batch that have been successfully reflow soldered, such as printed circuit boards (PCBs).

[0049] The acquisition of first historical data and second historical data of the first product during reflow soldering in the reflow oven includes: acquiring first historical data and second historical data of each of the multiple first products in the same batch during reflow soldering in the reflow oven.

[0050] In one embodiment, the multiple temperature zones of the reflux furnace include a preheating zone, a constant temperature zone, a reflux zone, and a cooling zone. Specifically, the reflux furnace is internally configured with multiple smaller temperature zones (e.g., temperature zones 1 to 8), which can be functionally divided into four larger temperature zones: the preheating zone, the constant temperature zone, the reflux zone, and the cooling zone. Each smaller temperature zone is of uniform size. For ease of description, the smaller temperature zones will be referred to as "temperature zones" below.

[0051] The reflow oven includes a conveying device (e.g., a conveyor belt) comprising multiple rotating shafts, and the conveying device operates at a constant speed. Products undergoing reflow soldering in the reflow oven can enter the reflow oven via the conveying device and sequentially pass through the preheating zone, the isothermal zone, the reflow zone, and the cooling zone.

[0052] The reflux furnace includes an air inlet system and an air outlet system. The air inlet system includes an air inlet, and the air outlet system includes an air outlet. The air inlet system and the air outlet system are used to provide gas circulation and exhaust gas discharge functions.

[0053] In one embodiment, obtaining the first historical data of the first product during reflow soldering in the reflow oven includes:

[0054] Using temperature sensor devices pre-installed in each temperature zone, the first historical temperature of the first product in each temperature zone of the reflow oven is obtained;

[0055] The historical running speed of the chain in the reflow oven is obtained using a chain speed sensor device pre-installed in the reflow oven; and

[0056] Using a wind speed sensor device pre-installed in the reflow oven, the first historical air velocity at the air inlet and the second historical air velocity at the air outlet of the reflow oven are obtained.

[0057] For example, the temperature sensor may be a thermocouple sensor or an infrared thermometer installed at two pre-set temperature measurement points in each temperature zone;

[0058] The chain speed sensor device can be a gear speed sensor pre-installed on any shaft of the conveying device.

[0059] The wind speed sensor device may be a first wind speed sensor installed at the air inlet and a second wind speed sensor installed at the air outlet, wherein the first wind speed sensor is used to acquire the first historical air flow rate and the second wind speed sensor is used to acquire the second historical air flow rate.

[0060] In one embodiment, the temperature sensor, chain speed sensor, and wind speed sensor can be connected to a multi-channel recorder (e.g., a TP700 multi-channel recorder) to record the first historical data, such as, but not limited to, one or more of the above-mentioned first historical temperature, chain historical running speed, first historical airflow velocity, and second historical airflow velocity.

[0061] The multi-channel recorder can communicate with the computer device 3 (e.g., via Wi-Fi), and the computer device 3 can obtain the first historical data from the multi-channel recorder.

[0062] In one embodiment, obtaining the second historical data of the first product during reflow soldering in the reflow oven includes:

[0063] The second historical temperature of the first product in each temperature zone of the reflow oven is obtained using a pre-installed furnace temperature tester (e.g., a KIC furnace temperature tester).

[0064] The furnace temperature tester includes multiple temperature sensing points, which are connected to different parts of the product.

[0065] The furnace temperature tester can be inserted into the reflow oven along with the product to collect the second historical temperature and obtain the temperature curve of the second historical temperature.

[0066] The furnace temperature tester can communicate with the computer device 3 (e.g., via socket communication), and the computer device 3 can obtain the second historical data from the furnace temperature tester, such as, but not limited to, the second historical temperature mentioned above.

[0067] In step S2, the computer device 3 obtains a training set based on the first historical data and the second historical data.

[0068] In one embodiment, the computer device 3 obtains the first acquisition time of the first historical temperature acquired by the temperature sensor device of each temperature zone;

[0069] Select the second historical temperature from the second historical temperatures that corresponds to the first acquisition time;

[0070] The set of the first historical data and the second historical temperature corresponding to the first acquisition time is used as the training set.

[0071] In one embodiment, the first acquisition time includes the entire time period during which each first product is reflow soldered in the reflow oven, and the length of the time period is the same for different first products.

[0072] Specifically, the computer device 3 can integrate the first historical data and the second historical data of each first product during the entire time cycle of reflow soldering into a small set, and then integrate the multiple small sets of the multiple first products into the training set. For example, when there are 500 first products among the multiple first products, the training set includes 500 small sets.

[0073] Step S3: Computer device 3 uses the training set to train a regression model to obtain a temperature prediction model.

[0074] In one embodiment, the computer device 3 uses second historical data from any small set as the dependent variable Y and first historical data from the same small set as the independent variable X. The independent variable X includes multiple independent variables Xi (i represents a positive integer), including: a first historical temperature X1, a historical operating speed X2, a first historical airflow velocity X3, and a second historical airflow velocity X4 obtained by each temperature sensor device. For example, when the reflow oven includes eight temperature zones and each zone is equipped with two infrared thermometers, the first historical temperature X1 includes 16 independent variables.

[0075] In one embodiment, the regression model includes a Gradient Boosting Decision Tree (GBDT) model or a Random Forest model. The computer device 3 trains the regression model using the plurality of independent variables and the dependent variable to obtain the dependency relationship (e.g., linear relationship) and fitting curve between the plurality of independent variables Xi and the dependent variable Y, thereby obtaining the temperature prediction model. The fitting curve can be plotted in a first rectangular coordinate system, where the length of the horizontal axis of the first rectangular coordinate system represents the length of the time period, and the vertical axis of the first rectangular coordinate system represents the value of the second temperature.

[0076] In other embodiments, the computer device 3 may also acquire a validation set using the method for acquiring the training set, the validation set including first historical data and second historical data of a third product that was successfully reflow soldered in the same batch as the first product, the third product having the same length of reflow soldering time period as the first product in the reflow oven.

[0077] Computer device 3 can use the validation set to obtain the prediction accuracy of the temperature prediction model. For example, it can use the temperature prediction model to obtain the temperature prediction curve of the third product (i.e., the curve of the predicted temperature of the third product during the entire time period of reflow soldering), calculate the similarity between the temperature prediction curve of the third product and the actual temperature cycle curve of the third product (i.e., the curve of the actual temperature of the third product during the entire time period of reflow soldering), and use the similarity as the prediction accuracy of the temperature prediction model.

[0078] The computer device 3 can iteratively update the temperature prediction model based on the prediction accuracy (e.g., obtain an updated training set and train the temperature prediction model based on the temperature prediction model obtained in the previous iteration using the updated training set), thereby obtaining a temperature prediction model with high accuracy (e.g., an accuracy of 95%).

[0079] Step S4: Computer device 3 acquires real-time data of the second product during reflow soldering in the reflow oven.

[0080] In one embodiment, the second product includes products currently undergoing reflow soldering from the same batch as the first product, and the second product undergoes the same reflow soldering time period as the first product in the reflow oven.

[0081] In one embodiment, acquiring real-time data of the second product during reflow soldering in the reflow oven includes:

[0082] Using the temperature sensor device, the real-time temperature of the second product in each temperature zone is obtained;

[0083] The chain speed sensor device is used to obtain the real-time running speed of the chain in the reflow oven; and

[0084] The wind speed sensor device is used to obtain the first real-time air velocity at the air inlet and the second real-time air velocity at the air outlet of the reflux furnace.

[0085] It should be noted that the method for obtaining the real-time data is the same as the method for obtaining the first historical data in step S1, and will not be described again.

[0086] Step S5: The computer device 3 inputs the real-time data into the temperature prediction model to obtain the real-time temperature prediction value of the second product when it is reflow soldered in the reflow oven, and plots the real-time temperature prediction curve of the second product passing through multiple temperature zones of the reflow oven.

[0087] In one embodiment, similar to step S4, the real-time data includes multiple independent variables xi (i represents a positive integer), wherein the multiple independent variables xi include: real-time temperature x1 obtained by each temperature sensor device, real-time operating speed x2, first real-time airflow velocity x3, and second real-time airflow velocity x4. For example, when the reflow oven includes 8 temperature zones and each temperature zone is equipped with two infrared thermometers, the real-time temperature x1 includes 16 independent variables.

[0088] In one embodiment, the computer device 3 inputs the plurality of independent variables xi into the temperature prediction model and obtains the dependent variable y corresponding to the plurality of independent variables xi according to the dependency relationship. The dependent variable y includes the real-time temperature prediction value of the product throughout the entire time period during which the second product undergoes reflow soldering.

[0089] The step of plotting the real-time temperature prediction curve of the second product passing through multiple temperature zones of the reflow oven includes: plotting the curve of the real-time predicted temperature of the second product during the entire time period of reflow soldering in a second coordinate system, wherein the length of the horizontal axis of the second coordinate system represents the length of the time period, the vertical axis of the second coordinate system represents the value of the real-time predicted temperature, and the computer device 3 can display the real-time temperature prediction curve using a display device (e.g., a computer screen).

[0090] Step S6: The computer device 3 calculates the control parameters for real-time reflow quality based on the real-time temperature prediction curve; and compares the control parameters with the preset control range. When it is determined that the control parameters exceed the control range, an early warning is issued.

[0091] In one embodiment, the real-time reflow quality control parameters include:

[0092] The second product in the preheating zone increases its real-time temperature from a preset first temperature (e.g., 120 degrees Celsius) to a preset second temperature (e.g., 150 degrees Celsius) for a first duration (e.g., 50 seconds).

[0093] The second product in the constant temperature zone increases from the preset second temperature to the preset third temperature (e.g., 221 degrees Celsius) for a second duration (e.g., 80 seconds).

[0094] The reflux duration (e.g., 50 s) and peak temperature (e.g., 250 degrees Celsius) of the second product in the reflux zone; and

[0095] The second product's real-time temperature during reflow soldering exceeds the preset fourth temperature (e.g., 230 degrees Celsius) for a total duration (e.g., 20 seconds).

[0096] In one embodiment, since the conveyor belt of the reflow oven rotates at a constant speed and the reflow oven includes four large temperature zones, the time period can be divided into four equal segments, and the time corresponding to the second product being in each large temperature zone can be obtained according to the chronological order.

[0097] In one embodiment, the control range of the first duration is [40s, 80s], the control range of the second duration is [70s, 110s], the control range of the reflux duration is [35s, 75s], the control range of the peak temperature is [230 degrees Celsius, 260 degrees Celsius], and the control range of the total duration exceeding the preset fourth temperature is [15s, 45s].

[0098] In one embodiment, when it is determined that the control parameter exceeds the control range, the computer device 3 can issue a warning prompt using a display device. The warning prompt can be a warning image displayed on the display device or a warning sound emitted. In other embodiments, a voice warning can also be issued via other devices (e.g., a speaker). Furthermore, the warning prompt can be sent to a preset terminal device (e.g., a designated user's mobile phone) to remind the user of the reflow soldering product temperature control.

[0099] The above Figure 1 This application details the temperature monitoring method for reflow soldering products. The following section combines... Figure 2 The hardware architecture for implementing the temperature monitoring method for reflow soldering products is described below.

[0100] It should be understood that the embodiments described are for illustrative purposes only and are not limited to this structure in the scope of the patent application.

[0101] See Figure 2 The diagram shown is a structural schematic of a computer device provided in a preferred embodiment of this application.

[0102] In a preferred embodiment of this application, the computer device 3 includes a memory 31, at least one processor 32, and a display device 33. Those skilled in the art should understand that... Figure 2 The structure of the computer device shown does not constitute a limitation of the embodiments of this application. It can be a bus structure or a star structure. The computer device 3 may also include more or fewer other hardware or software than shown, or different component arrangements.

[0103] In some embodiments, the computer device 3 includes a terminal capable of automatically performing numerical calculations and / or information processing according to pre-set or stored instructions, the hardware of which includes, but is not limited to, microprocessors, application-specific integrated circuits, programmable gate arrays, digital processors, and embedded devices.

[0104] It should be noted that the computer device 3 described is merely an example. Other existing or future electronic products that are suitable for this application should also be included within the scope of protection of this application and are incorporated herein by reference.

[0105] In some embodiments, the memory 31 is used to store program code and various data. For example, the memory 31 can be used to store a reflow soldering product temperature monitoring system 30 installed in the computer device 3, and to enable high-speed, automatic access to programs or data during the operation of the computer device 3. The memory 31 includes read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), one-time programmable read-only memory (OTPROM), electrically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, disk storage, magnetic tape storage, or any other computer-readable storage medium capable of carrying or storing data.

[0106] In some embodiments, the at least one processor 32 may be composed of integrated circuits, such as a single-packaged integrated circuit or multiple integrated circuits packaged with the same or different functions, including combinations of one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and various control chips. The at least one processor 32 is the control unit of the computer device 3, connecting various components of the computer device 3 via various interfaces and lines. It executes programs or modules stored in the memory 31 and calls data stored in the memory 31 to perform various functions of the computer device 3 and process data, such as executing... Figure 1 The temperature monitoring function of the reflow soldering product is shown.

[0107] In some embodiments, the reflow soldering product temperature monitoring system 30 operates in a computer device 3. The reflow soldering product temperature monitoring system 30 may include multiple functional modules composed of program code segments. The program code of each program segment in the reflow soldering product temperature monitoring system 30 may be stored in the memory 31 of the computer device 3 and executed by at least one processor 32 to achieve... Figure 1 The temperature monitoring function of the reflow soldering product is shown.

[0108] In this embodiment, the reflow soldering product temperature monitoring system 30 can be divided into multiple functional modules according to the functions it performs. A module, as referred to in this application, is a series of computer program segments that can be executed by at least one processor and perform a fixed function, and is stored in memory.

[0109] Although not shown, the computer device 3 may also include a power supply (such as a battery) to power the various components. Preferably, the power supply can be logically connected to the at least one processor 32 via a power management device, thereby enabling functions such as charging, discharging, and power consumption management. The power supply may also include one or more DC or AC power supplies, recharging devices, power fault detection circuits, power converters or inverters, power status indicators, and other arbitrary components. The computer device 3 may also include various sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be described in detail here.

[0110] It should be understood that the embodiments described are for illustrative purposes only and are not limited to this structure in the scope of the patent application.

[0111] The integrated unit implemented as a software functional module described above can be stored in a computer-readable storage medium. This software functional module, stored in a storage medium, includes several instructions to cause a computer device (which may be a server, personal computer, etc.) or processor to execute portions of the methods described in the various embodiments of this application.

[0112] The memory 31 stores program code, and the at least one processor 32 can call the program code stored in the memory 31 to execute related functions. The program code stored in the memory 31 can be executed by the at least one processor 32 to realize the functions of each module to achieve the purpose of temperature monitoring of reflow soldering products.

[0113] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and other division methods may be used in actual implementation.

[0114] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0115] Furthermore, the functional modules in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or in the form of hardware plus software functional modules.

[0116] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application. No reference numerals in the claims should be construed as limiting the scope of the claims. Furthermore, it is clear that the word "comprising" does not exclude other elements or, and the singular does not exclude the plural. Multiple elements or devices recited in the apparatus claims may also be implemented by a single element or device in software or hardware. The terms "first," "second," etc., are used to indicate names and do not indicate any particular order.

[0117] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A reflow soldering product temperature monitoring method, characterized by, The method comprises: obtaining first historical data and second historical data of a first product during reflow soldering in a reflow furnace, wherein the obtaining of the first historical data comprises: obtaining first historical temperatures of the first product in each temperature zone of the reflow furnace by using temperature sensor devices pre-installed in each temperature zone of the reflow furnace; obtaining a historical running speed of a chain of the reflow furnace by using a chain speed sensor device pre-installed in the reflow furnace; and obtaining a first historical air flow rate of an air inlet and a second historical air flow rate of an air outlet of the reflow furnace by using air speed sensor devices pre-installed in the reflow furnace; the obtaining of the second historical data comprises: obtaining second historical temperatures of the first product in each temperature zone by using a furnace temperature tester pre-installed; obtaining a training set based on the first historical data and the second historical data; training a regression model by using the training set to obtain a temperature prediction model, comprising: taking the second historical data as a dependent variable and taking a plurality of data in the first historical data as a plurality of independent variables; training the regression model by using the plurality of independent variables and the dependent variable to obtain a dependent relationship and a fitting curve between the plurality of independent variables and the dependent variable; obtaining real-time data of a second product during reflow soldering in the reflow furnace; inputting the real-time data into the temperature prediction model to obtain a real-time product temperature prediction value of the second product during reflow soldering in the reflow furnace, and drawing a real-time temperature prediction curve of the second product passing through a plurality of temperature zones of the reflow furnace; calculating a real-time reflow quality control parameter according to the real-time temperature prediction curve; and comparing the control parameter with a preset control range, and issuing a warning prompt when it is determined that the control parameter exceeds the control range.

2. The reflow soldering process temperature monitoring method according to claim 1, characterized by, The plurality of temperature zones of the reflow furnace comprise a preheating zone, a constant temperature zone and a reflow zone.

3. The reflow soldering process temperature monitoring method according to claim 1, characterized by, The obtaining of the training set based on the first historical data and the second historical data comprises: obtaining a first collection time of the first historical temperature collected by the temperature sensor device of each temperature zone; selecting a second historical temperature corresponding to the first collection time from the second historical temperature; taking a set of the first historical data and the second historical temperature corresponding to the first collection time as the training set.

4. The reflow soldering process temperature monitoring method according to claim 1, characterized by, The regression model comprises a gradient boosting decision tree regression model or a random forest model.

5. The reflow soldering process temperature monitoring method according to claim 2, wherein The obtaining of the real-time data of the second product during reflow soldering in the reflow furnace comprises: obtaining real-time temperatures of the second product in each temperature zone by using the temperature sensor device; obtaining a real-time running speed of a chain of the reflow furnace by using the chain speed sensor device; and obtaining a first real-time air flow rate of an air inlet and a second real-time air flow rate of an air outlet of the reflow furnace by using the air speed sensor device.

6. The reflow soldering product temperature monitoring method according to claim 5, wherein the real-time reflow quality control parameter comprises: a first time length during which a real-time temperature of the second product in the preheating zone increases from a preset first temperature to a preset second temperature. a second time length for the real-time temperature of the second product to increase from the preset second temperature to a preset third temperature in the constant temperature zone; a reflow time length and a peak temperature of the second product in the reflow zone; and a total time length for the real-time temperature of the second product to exceed a preset fourth temperature in the reflow soldering.

7. A computer readable storage medium characterized by The computer readable storage medium stores at least one instruction, which, when executed by a processor, implements the reflow soldering product temperature monitoring method according to any one of claims 1 to 6.

8. A computer apparatus, comprising: The computer device comprises a memory and at least one processor, wherein the memory stores at least one instruction, which, when executed by the at least one processor, implements the reflow soldering product temperature monitoring method according to any one of claims 1 to 6.

Images