A laser cutting method and apparatus

Abstract

The application relates to the technical field of laser cutting, and provides a laser cutting method and device. A main controller looks up an internal database according to obtained parameter characteristics of a to-be-cut piece and current laser related information to obtain an initial driving signal required for cutting a corresponding aperture size in the to-be-cut piece; the initial driving signal comprises a first signal group used for forming a first hole and a second signal group used for subsequent graphic cutting in the to-be-cut piece except the first hole. The method process can directly form a first hole in compliance with parameters on a target cutting track, and the cutting efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser cutting, in particular to a laser cutting method and device. BACKGROUND

[0002] In the prior art, before cutting any contour, the laser must first penetrate the material. The piercing time should be kept to a minimum to optimize productivity. One major aspect of laser piercing is the reliability of the process, as industrial laser cutting machines are programmed for the shortest reliable piercing time.

[0003] The cutting system is usually composed of two parts: the main controller and the laser. As shown in Figure 1 , the main controller sends digital input DI and analog input AI control signals to the laser. As shown in Figure 2 , the cutting starts from position 0 and stays at this position for a period of time to ensure that the piercing passes through the workpiece. Then it moves from 0 to 1, 2, 3, 4, 5, 6, and then returns to 1.

[0004] The problems of the prior art include:

[0005] 1. A large hole is left at position 0;

[0006] 2. The entire process will take longer due to the piercing time and the additional contour (black line).

[0007] 3. If the piercing is done by a short high-power pulse instead of a long piercing time at position 0, the main controller needs precise timing control of DI and AI.

[0008] In view of this, overcoming the defects of the prior art is a problem that needs to be solved in this technical field. SUMMARY

[0009] The technical problem to be solved by the present application is that in the prior art, in order to avoid the inconsistency between the size of the first hole formed in the cutting process and the size of the hole diameter in the subsequent cutting process, a first hole is usually formed in the waste area, and then transferred to the effective cutting track. However, this method greatly reduces the cutting efficiency, and the waste of this efficiency is particularly prominent when the target cutting track is poor in continuity and the number of cuts is large.

[0010] The present application adopts the following technical solutions:

[0011] In a first aspect, the present application provides a laser cutting method, wherein a main controller obtains parameter characteristics of a workpiece to be cut, the parameter characteristics including one or more of the number of layers of material constituting the workpiece to be cut, the type of material constituting each layer, the thickness of each layer, and the size of the hole diameter produced by cutting; the method comprising:

[0012] The main controller looks up an internal database according to the acquired parameter characteristics of the to-be-cut piece and current laser-related information to obtain an initial driving signal required for cutting a corresponding aperture size in the to-be-cut piece; the initial driving signal includes a first signal group for forming a first hole and a second signal group for subsequent pattern cutting in the to-be-cut piece except the first hole.

[0013] The laser-related information includes one or more of a laser wavelength, a laser intensity, and a spot shape.

[0014] Preferably, the material layers of the to-be-cut piece include a first material layer, and the method further includes:

[0015] The laser intensity of the laser driving signal of the first signal group exceeds the vaporization temperature of the first material by a second preset value, so that the first material layer forms a complete first hole via vaporization; and the laser driving signal of the second signal group is a periodic square wave signal or a continuous constant voltage signal, so that the first material layer completes a continuous cutting process after the first hole.

[0016] Preferably, the material layers of the to-be-cut piece include a first material layer and a second material layer, and the first material layer is attached to the second material layer and is preferentially cut by the laser compared to the second material layer, and the method further includes:

[0017] The first signal group is composed of a first step portion and an adjacent second step portion.

[0018] The laser driving signal of the first step portion is composed of a stepped waveform signal, and a step peak value of the corresponding waveform signal causes the laser-irradiated part of the first material layer to complete vaporization;

[0019] The start position of the second step portion is connected to the end position of the first step portion, and a start step height of the corresponding second step portion causes the temperature T1 of the first material layer located at the periphery of the first hole and the temperature T2 of the second material directly irradiated by the laser to reach equilibrium after the laser is driven; and a duration t0 of the start step height of the second step portion causes the temperature T1 to drop to a terminal point and the temperature T2 to rise to a terminal point, and the difference between the two terminal points is less than a first preset threshold value.

[0020] The subsequent step height of the second step portion is connected to the end position of the start step, so that the second material forms a complete first hole via vaporization.

[0021] Preferably, the subsequent step height of the second step portion is connected to the end position of the start step, so that the second material forms a complete first hole via vaporization, and specifically includes:

[0022] When the laser emitted by the starting step-driven laser increases the temperature of the second material to below its own melting point, the duration t0 of the starting step height ensures that the difference between the cooling endpoint of temperature T1 and the heating endpoint of temperature T2 is less than a first preset threshold.

[0023] The height of the second step is connected to the end position of the starting step, instantly increasing the laser intensity by an amount exceeding the vaporization temperature of the second material to reach the second preset value.

[0024] Preferably, the first preset threshold is 0-20 degrees; the second preset value is 50-100 degrees.

[0025] Preferably, the laser includes a first light source and a second light source. In the emitted laser spot pattern, the first light source is a spot located at the center of the pattern, and the second light source is a ring-shaped spot located around the first light source in the pattern. Specifically:

[0026] When the first signal group is in working state, the second light source is in sleep or standby working state;

[0027] When entering the advanced working state of the second signal group, the second light source enters the working state and outputs laser intensity to make the temperature difference between the upper surface of the first material around the first hole and the temperature of the lower surface of the first material adjacent to the second material less than a third preset value.

[0028] Preferably, a detector is provided on one side of the laser to detect the intensity of the reflected light from the first light source, thereby determining whether the first hole has been penetrated; wherein, an isolator is also provided on the detection optical path of the detector, the isolator being used to isolate the reflected light from the second light source and only transmit the reflected light from the first light source that illuminates the surface of the workpiece to be cut.

[0029] Preferably, if the detector detects that the first hole has not been effectively formed after the laser is driven by the first signal; or if the first hole is formed before the first signal ends during the operation of the laser driven by the first signal, then the method further includes:

[0030] Based on the detector's detection results, the initial driving signal is updated by adjusting the intensity of the laser signal driven by the second step unit and / or the duration of the driving signal maintained by the second step unit.

[0031] Through a recursive process, after one or more adjustments and updates, the corresponding initial driving signal is made to form the first hole precisely after the second step section drives the laser to work.

[0032] Preferably, the first signal group and the second signal group constituting the laser are both composed of one or more square wave signals; wherein the difference in amplitude of the square wave signals and the difference in the holding time of the square wave signals at different amplitudes are combined to form steps; wherein the steps with specified functions form the first step part and / or the second step part.

[0033] In a second aspect, the present application further provides a laser cutting device for implementing the laser cutting method of the first aspect, the device comprising:

[0034] at least one processor; and a memory connected to the at least one processor in communication; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the processor to execute the laser cutting method of the first aspect.

[0035] In a third aspect, the present application further provides a non-volatile computer storage medium, the computer storage medium storing computer executable instructions, the computer executable instructions being executed by one or more processors to complete the laser cutting method of the first aspect.

[0036] The present application proposes an improved method for the cutting of the first hole, by splitting the laser driving signal, and pre-generating a high feasibility driving signal according to the parameters of the to-be-cut part and the laser involved in the actual scene, to ensure that the method proposed by the present application can directly form a parameter-compliant first hole on the target cutting track.

[0037] In the preferred implementation scheme of the present application, the characteristics of the laser driving signal are further improved for the to-be-cut part of the multi-layer material structure, so that the two material layers can ensure the stability of their own material structure while ensuring that the size of the corresponding first hole meets the precision requirements of the cutting contour during the formation of the first hole.

BRIEF DESCRIPTION OF DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0039] Figure 1 is a schematic diagram of the architecture of a laser cutting machine provided by the embodiments of the present application;

[0040] Figure 2 is a schematic diagram of the effect of a laser cutting track provided by the embodiments of the present application;

[0041] Figure 3 This is a schematic diagram of a laser cutting method provided in an embodiment of the present invention;

[0042] Figure 4 This is a schematic diagram of a laser cutting drive signal provided in an embodiment of the present invention;

[0043] Figure 5 This is a schematic diagram of a laser cutting trajectory effect provided by an embodiment of the present invention;

[0044] Figure 6 This is a schematic diagram of the architecture of a laser cutting machine provided in an embodiment of the present invention;

[0045] Figure 7 This is a schematic diagram illustrating the energy required for the vaporization of a material in the periodic table, provided by an embodiment of the present invention.

[0046] Figure 8 This is a schematic diagram illustrating the relationship between material state, energy density, and duration for laser cutting, provided by an embodiment of the present invention.

[0047] Figure 9 This is a schematic diagram illustrating the absorption efficiency of different laser types in different materials, as provided in the embodiments of the present invention.

[0048] Figure 10 This is a schematic diagram of a laser cutting method provided in an embodiment of the present invention;

[0049] Figure 11 This is a schematic diagram of the relationship between the driving signals of the first step section and the second step section provided in an embodiment of the present invention;

[0050] Figure 12 This is a schematic diagram of another driving signal relationship between the first step section and the second step section provided in an embodiment of the present invention;

[0051] Figure 13 This is a schematic diagram illustrating the effect of a ring-shaped second light source in laser cutting, provided by an embodiment of the present invention.

[0052] Figure 14 This is a schematic diagram of the light spot effect produced by the dual-source laser provided in an embodiment of the present invention;

[0053] Figure 15 This is a schematic diagram of a laser device structure provided in an embodiment of the present invention.

Detailed Implementation Methods

[0054] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0055] In the description of the present application, the terms "inner", "outer", "longitudinal", "transverse", "upper", "lower", "top", "bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and do not require the present application to be necessarily constructed and operated in a particular orientation, and therefore should not be understood as a limitation on the present application.

[0056] In addition, the technical features involved in each embodiment of the present application described below can be combined with each other as long as there is no conflict.

[0057] Example 1:

[0058] The embodiment 1 of the present application provides a laser cutting method, a main controller acquires parameter characteristics of a to-be-cut part, the parameter characteristics including one or more of the number of layers of materials constituting the to-be-cut part, the types of materials constituting each layer, the thickness of each layer, and the size of a hole to be cut; as Figure 3 shown, the method comprises:

[0059] In step 201, the main controller acquires the parameter characteristics of the to-be-cut part and the current laser-related information.

[0060] The laser-related information includes one or more of the laser wavelength, the laser intensity, and the spot shape.

[0061] In step 202, the main controller finds the initial driving signal required to cut the corresponding hole size in the to-be-cut part according to the acquired parameter characteristics of the to-be-cut part and the current laser-related information.

[0062] The initial driving signal includes a first signal group for forming a first hole and a second signal group for subsequent pattern cutting in the to-be-cut part except for the first hole. As Figure 4 shown, it is a schematic diagram of the initial driving signal in the case of a single-layer material constituting the to-be-cut part, in which d1 is the first signal group and d2 is the second signal group (in the case of Figure 4 , the second signal group can also be described as a cyclic signal group).

[0063] In specific application scenarios, the second signal group does not necessarily present as Figure 4The equal-intensity cycle effect shown in the actual implementation process, according to the thickness of the cutting piece may appear inconsistent, pre-generated signal strength inconsistent (or individual specified cycle signal duration length changes with the thickness of the way) second signal group, and even, can also maintain the signal periodicity in the second signal group, and through the detector detection method to ensure effective cutting after the cutting track step process.

[0064] In step 203, the main controller transmits the obtained initial driving signal to the driver of the laser to control the laser to complete the first hole and the subsequent cutting process after the first hole according to the initial driving signal after obtaining the working instruction.

[0065] The embodiment of the present application proposes an improved method for the special cutting of the first hole, which splits the laser driving signal and pre-generates a high feasibility driving signal according to the parameters of the cutting piece and the laser involved in the actual scene, so as to ensure that the method proposed in the present application can directly form a parameter-compliant first hole on the target cutting track. Thus, the similar Figure 2 The cutting track shown in the prior art is changed to the cutting track shown in Figure 5 The cutting track shown in the prior art is changed to the cutting track shown in

[0066] As shown in Figure 6 The present application transfers part of the control from the main controller to the driver of the laser itself, tightly combines the perforation and cutting, so there is no need to stop, and the single-line control makes the response time between gateOn and beamOn less than 100uSec. When the cutting head moves to the starting cutting point, the gateOn signal will be sent to the laser, and the laser beam should be turned on quickly to ensure the cutting accuracy.

[0067] In order to ensure the effective formation of the first hole and the subsequent cutting process, the laser intensity of the laser driving signal of the first signal group exceeds the gasification temperature of the first material by a second preset value (for example: the second preset value is 50-100 degrees), so that the first material layer forms a complete first hole through gasification; the laser driving signal of the second signal group is a periodic square wave signal or a continuous constant voltage signal, so that the first material layer completes the continuous cutting process after the first hole.

[0068] As shown in Figures 7-9 As shown in Figure 7 The energy required for the gasification of various materials is shown, and Figure 8 A curve showing the relationship between the laser energy density and the duration of a material in three states is shown, andFigure 9 The energy absorption rates of different materials under different laser types are shown; and Figures 7-9 The temperature required to reach the vaporization of the specified material can be calculated.

[0069] As the method process proposed in the embodiments of the present application, similar to the above-mentioned reference Figure 4 The cutting of a single material layer is only a brief application scenario, and in order to fully express the creative idea of the present application, the following will be described with two material layers including a first material layer and a second material layer (it should be noted that this is to describe two material layers, but the application scenario of the present application does not stop here, and according to the description of the subsequent embodiments, it can be inferred that there are three material layers or more, which will not be described here), and the first material layer is attached to the second material layer. When the second material layer is preferentially cut by laser, the first signal group is composed of a first step and an adjacent second step, as shown in Figure 10 The first hole is formed, and the cutting process after the first hole is formed is a conventional means and will not be described in detail here) :

[0070] In step 301, the laser driving signal of the first step is composed of a stepped waveform signal, and the stepped peak value of the corresponding waveform signal causes the first material layer to be partially vaporized by laser irradiation.

[0071] In step 302, the start position of the second step is connected to the end position of the first step, and the start step height of the corresponding second step causes the temperature T1 of the first material layer around the first hole to reach equilibrium with the temperature T2 of the second material directly subjected to laser irradiation after the laser is driven.

[0072] Wherein, the start step height duration t0 of the second step makes the temperature T1 of the first material layer around the first hole to reach equilibrium with the temperature T2 of the second material directly subjected to laser irradiation after the laser is driven.

[0073] In step 303, the second step height of the second step is connected to the end position of the start step, so that the second material forms a complete first hole through vaporization.

[0074] In the preferred implementation of the present application, for the multi-layer material structure to be cut, the characteristics of the laser driving signal are further improved, so that the two material layers can ensure the stability of their own material structure while ensuring that the size of the corresponding first hole meets the precision requirements of the cutting contour. As shown in Figure 11 and Figure 12The first and second step driving signal waveform effect schematic diagrams are shown under two different complexities.

[0075] Based on the above-mentioned first hole generation expansion implementation scheme for the two-layer material to-be-cut piece, the advanced step height of the second step is connected at the end position of the starting step, so that the second material forms a complete first hole through vaporization, and an optional specific implementation manner is also given, which includes:

[0076] Under the condition that the laser emitted by the starting step driving laser increases the temperature of the second material less than its own melting point, the starting step height duration t0 makes the temperature difference between the temperature drop end point T1 and the temperature rise end point T2 less than a first preset threshold value; the advanced step height of the second step is connected at the end position of the starting step, and the laser intensity is instantaneously pulled up to exceed the vaporization temperature of the second material by a second preset value. In the embodiment of the application, the first preset threshold value can be selected in the range of 0-20 degrees; and the second preset value can be selected in the range of 50-100 degrees.

[0077] In combination with the embodiment of the application, in addition to the above-mentioned balancing means of steps 301-303 in the implementation process, if the first material layer has a certain thickness, the upper and lower surfaces of the first material layer may still have elements that affect the structural stability of the to-be-cut piece during the formation of the first hole; therefore, in combination with the embodiment of the application, an improved means is proposed for the above-mentioned case. The laser includes a first light source and a second light source, and in the emitted laser spot pattern, the first light source is a spot located at the center of the pattern, and the second light source is a ring-shaped spot located at the periphery of the first light source in the pattern. As shown in Figure 13 In the specific implementation process, the collimated first light source and the ring-shaped second light source can be coupled through a prism or a combiner to form a coupled spot shape as shown in Figure 14 The corresponding cutting implementation process using the improved spot combination method includes:

[0078] In the first signal group working state, the second light source is in a dormant or standby working state; when entering the advanced step working state of the second signal group, the second light source enters the working state and outputs laser intensity to make the temperature difference between the upper surface of the first material located at the periphery of the first hole and the lower surface of the first material located at the periphery of the first hole and the adjacent part of the second material less than a third preset value.

[0079] In combination with the embodiment of the present application, there is also a preferred extension, specifically, a detector is arranged on one side of the laser, for detecting the reflected light intensity of the first light source, so as to determine whether the first hole is formed; wherein, an isolator is further arranged on the detection light path of the detector, and the isolator is used for isolating the reflected light from the second light source, and only transmitting the reflected light from the first light source irradiated to the surface of the workpiece to be cut.

[0080] After the first detector detects that the laser is driven by the first signal and the first hole is not effectively formed, or the first hole is formed before the first signal is ended during the driving of the laser by the first signal, the method further comprises:

[0081] According to the detection result of the detector, the intensity of the laser signal driven by the second step part and / or the time length of the driving signal maintained by the second step part is adjusted, and the initial driving signal is updated;

[0082] Through the recursive process, after one or more adjustments and updates are completed, the corresponding initial driving signal can form the first hole after the driving of the laser by the second step part is completed.

[0083] In the present application, the first signal group and the second signal group constituting the laser are both composed of one or more square wave signals; wherein, the difference of the amplitude of the square wave signal and the difference of the maintaining time of the square wave signal under different amplitudes are combined to form a step; wherein, the steps with specified functions constitute the first step part and / or the second step part.

[0084] Example 2:

[0085] As Figure 15 shown is a schematic diagram of the architecture of the laser cutting device of the embodiment of the present application. The laser cutting device of the present embodiment comprises one or more processors 21 and a memory 22. Among them, Figure 15 take one processor 21 as an example.

[0086] The processor 21 and the memory 22 can be connected through a bus or other means, Figure 15 take the connection through the bus as an example.

[0087] The memory 22 is a non-volatile computer readable storage medium, which can be used to store non-volatile software programs and non-volatile computer executable programs, such as the laser cutting method in embodiment 1. The processor 21 executes the laser cutting method by running the non-volatile software programs and instructions stored in the memory 22.

[0088] The memory 22 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other non-volatile solid-state memory device. In some embodiments, the memory 22 can optionally include a memory disposed remotely from the processor 21, which can be connected to the processor 21 through a network. Examples of the network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0089] The program instructions / modules are stored in the memory 22, and when executed by the one or more processors 21, perform the laser cutting method in Embodiment 1 described above, for example, perform the above-described Figure 3 and Figure 10 each step shown.

[0090] It is worth noting that the information interaction, execution process, and the like between the modules and units in the above-described apparatus and system are based on the same concept as the processing method embodiments of the present application, and the specific content can be referred to the description in the method embodiments of the present application, which will not be described here.

[0091] Those of ordinary skill in the art can understand that all or part of the steps in the various embodiments of the method can be completed by a program instructing relevant hardware, and the program can be stored in a computer readable storage medium, which can include a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and the like.

[0092] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A laser cutting method, characterized by, The main controller acquires the parameter characteristics of the workpiece to be cut, including one or more of the following: the number of material layers constituting the workpiece, the type of material constituting each layer, the thickness of each layer, and the size of the hole produced by cutting; the method includes: The main controller searches its internal database based on the acquired parameters and characteristics of the workpiece to be cut, as well as the current laser information, to obtain the initial drive signal required to cut the corresponding aperture size in the workpiece. The initial drive signal includes a first signal group for forming the first hole, and a second signal group for performing subsequent pattern cutting in the workpiece other than the first hole. The main controller transmits the obtained initial drive signal to the laser driver, so that the corresponding driver, after receiving the working instruction, controls the laser to complete the first hole and the subsequent cutting process according to the initial drive signal; Among them, laser-related information includes one or more of the following: laser wavelength, laser intensity, and laser spot shape; When the material layers of the workpiece to be cut include a first material layer and a second material layer, and the first material layer is attached to the second material layer, and the laser preferentially cuts the second material layer, the method further includes: The first signal group consists of a first step section and an adjacent second step section; The laser driving signal of the first step section is composed of a stepped waveform signal, and the step peak of the corresponding waveform signal causes the part of the first material layer irradiated by the laser to be vaporized. The starting position of the second step section is connected to the ending position of the first step section. The corresponding starting step height of the second step section makes the temperature T1 of the first material layer located around the first hole reach equilibrium with the temperature T2 of the second material directly irradiated by the laser after the laser is driven. The duration t0 of the starting step height of the second step section makes the difference between the cooling endpoint of temperature T1 and the heating endpoint of temperature T2 less than a first preset threshold. The height of the second step is connected to the end position of the starting step, so that the second material forms a complete first hole through vaporization.

2. The laser cutting method according to claim 1, characterized in that, In a material layer comprising a first material layer, the method further includes: The laser intensity of the laser driving signal of the first signal group exceeds the vaporization temperature of the first material by a second preset value, so that the first material layer forms a complete first hole through vaporization; the laser driving signal of the second signal group is a periodic square wave signal or a continuous constant pressure signal, so that the first material layer completes a continuous cutting process after the first hole.

3. The laser cutting method of claim 1, wherein, The height of the second step section connects to the end position of the initial step, allowing the second material to form a complete first cavity through vaporization, specifically including: When the laser emitted by the starting step-driven laser increases the temperature of the second material to below its own melting point, the duration t0 of the starting step height ensures that the difference between the cooling endpoint of temperature T1 and the heating endpoint of temperature T2 is less than a first preset threshold. The height of the second step is connected to the end position of the starting step, instantly increasing the laser intensity by an amount exceeding the vaporization temperature of the second material to reach the second preset value.

4. The laser cutting method according to claim 3, characterized in that, The first preset threshold is 0-20 degrees; and the second preset threshold is 50-100 degrees.

5. The laser cutting method of claim 3, wherein, The laser includes a first light source and a second light source, and in the emitted laser spot pattern, the first light source is a spot at the center of the pattern, and the second light source is a ring-shaped spot at the periphery of the first light source in the pattern. In the first signal group working state, the second light source is in a dormant or standby working state. In the second signal group advanced stage working state, the second light source enters the working state and outputs laser intensity to make the temperature of the upper surface of the first material located at the periphery of the first hole differ from the temperature of the adjacent part of the second material located at the lower surface of the first material by less than a third preset value.

6. The laser cutting method of claim 5, wherein, One side of the laser is provided with a detector for detecting the reflected light intensity of the first light source to determine whether the first hole is formed; wherein an isolator is further arranged on the detection light path of the detector, and the isolator is used to isolate the reflected light from the second light source and only transmit the reflected light from the first light source irradiated to the surface of the cutting piece.

7. The laser cutting method of claim 6, wherein, If the detector detects that the first hole is not effectively formed after the laser is driven by the first signal; Or, the first hole is formed before the first signal ends during the process of driving the laser by the first signal, and the method further includes: According to the detection result of the detector, the laser signal intensity driven by the second step part and / or the driving signal time length maintained by the second step part are adjusted, and the initial driving signal is updated; Through the recursive process, after one or more adjustments and updates are completed, the corresponding initial driving signal can form the first hole after the laser is driven by the second step part.

8. The laser cutting method according to any one of claims 1 to 7, characterized in that, The first signal group and the second signal group of the laser are both composed of one or more square wave signals; wherein the difference in amplitude of the square wave signals and the difference in the maintenance time of the square wave signals with different amplitudes are combined to form steps; wherein the steps with specified functions form the first step part and / or the second step part.

9. A laser cutting apparatus characterized by, The device includes: At least one processor; and a memory connected in communication with the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the processor to execute the laser cutting method of any one of claims 1-8.

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