An electronic expansion valve control method, device, equipment and storage medium

Abstract

The embodiment of the present invention relates to an electronic expansion valve control method, device, equipment and storage medium, the method comprising: obtaining the operating parameters of the frequency conversion module of the device; obtaining the ambient temperature around the frequency conversion module; determining the target opening of the electronic expansion valve corresponding to the operating parameters and / or the ambient temperature from the association relationship, wherein the association relationship stores the correspondence between multiple groups of operating parameters, ambient temperature and the target opening of the electronic expansion valve; adjusting the actual opening of the electronic expansion valve according to the target opening. In this way, it is possible to avoid frequent adjustment of the opening size of the electronic expansion valve, increase the service life of the electronic expansion valve, and at the same time, there is no need to add a buffer chamber to the radiator. By controlling the refrigerant through the electronic expansion valve, less refrigerant can be used to take away the heat of the module when the ambient temperature is high, thereby achieving the purpose of cooling the module.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of air conditioning equipment, and in particular, to an electronic expansion valve control method, device, equipment and storage medium. Background Art

[0002] Compared with fixed-frequency air conditioners, variable-frequency air conditioners have the characteristics of accurate temperature control, rapid temperature adjustment, low noise and energy saving. A frequency converter is installed inside a variable-frequency air conditioner, and the frequency converter generates a very large amount of heat. Therefore, a radiator needs to be designed to dissipate heat from it. The frequency conversion module in the frequency converter plays a role of power conversion and amplification. A large amount of heat will be generated by the switching loss and the resistance of the module itself during operation. If these heats are not dissipated in time, the performance of the frequency conversion module will be seriously affected or even the frequency conversion module will be burned out.

[0003] At present, to dissipate heat from the power devices in the frequency converter through a radiator, the most commonly used cooling methods are air cooling, water cooling and refrigerant cooling. The electronic expansion valve can be used to adjust the refrigerant and the amount of heat dissipated. The present invention solves the problem that the electronic expansion valve needs to frequently adjust its opening size during the heat dissipation process, resulting in a short service life. Summary of the Invention

[0004] In view of this, to solve the above technical problem of the service life of the electronic expansion valve, the embodiments of the present invention provide an electronic expansion valve control method, device, equipment and storage medium.

[0005] In a first aspect, the embodiments of the present invention provide an electronic expansion valve control method, including:

[0006] Obtain the operating parameters of the frequency conversion module in the equipment;

[0007] Obtain the ambient temperature around the frequency conversion module;

[0008] Determine the target opening of the electronic expansion valve of the equipment corresponding to the operating parameters and / or the ambient temperature from the association relationship, where multiple sets of corresponding relationships among the operating parameters, the ambient temperature and the target opening of the electronic expansion valve are stored in the association relationship;

[0009] Adjust the actual opening of the electronic expansion valve according to the target opening.

[0010] In a possible implementation manner, the obtaining the operating parameters of the frequency conversion module in the equipment includes:

[0011] During the operation of the frequency conversion module, obtain the current bus voltage of the frequency conversion module;

[0012] Obtain the current operating frequency of the frequency conversion module;

[0013] Determine the bus voltage and the operating frequency as the operating parameters.

[0014] In a possible implementation, before obtaining the operating parameters of the frequency conversion module in the obtaining device, the method further includes:

[0015] Obtain multiple groups of historical operating parameters of the frequency conversion module to obtain a set of historical operating parameters, where the historical operating parameters include: historical operating frequency and historical bus voltage;

[0016] Control the frequency conversion module to operate respectively according to any one of the historical bus voltages and any one of the historical operating frequencies;

[0017] Determine the corresponding heating power when the frequency conversion module operates according to each group of the historical operating parameters;

[0018] Determine the heat dissipation of each of the heating powers within a preset time period to obtain a set of heat dissipations.

[0019] In a possible implementation, before obtaining the operating parameters of the frequency conversion module in the obtaining device, the method further includes:

[0020] Obtain multiple historical ambient temperatures to obtain a set of historical ambient temperatures;

[0021] At any one of the historical ambient temperatures, when the frequency conversion module operates with any one group of historical operating parameters, adjust the historical opening degree of the electronic expansion valve to adjust the refrigerant flow rate in the radiator, where the radiator is arranged adjacent to the frequency conversion module;

[0022] For each of the historical opening degrees, obtain the heat absorption amount of the refrigerant within the preset time period to obtain a set of heat absorption amounts.

[0023] In a possible implementation, the corresponding relationship is generated in the following manner:

[0024] During each process of adjusting the historical opening degree of the electronic expansion valve, determine whether the heat absorption amount matches the heat dissipation amount;

[0025] When it is determined that they match, generate the corresponding relationship among the current historical opening degree, historical operating parameters, and historical ambient temperature;

[0026] Determine multiple corresponding relationships among the set of historical ambient temperatures, the set of historical operating parameters, and the corresponding set of historical opening degrees according to the set of heat dissipations and the set of heat absorption amounts, and generate the association relationship according to the multiple corresponding relationships.

[0027] In a possible implementation, the method further includes:

[0028] When the device corresponding to the electronic expansion valve receives a first operation, determine a predicted ambient temperature and predicted operating parameters according to the first operation;

[0029] Determine a predicted opening degree corresponding to the predicted ambient temperature and predicted operating parameters;

[0030] Determine a predicted heat dissipation amount according to the predicted operating parameters;

[0031] When the predicted heat dissipation amount is greater than a first set threshold, adjust the opening degree of the current electronic expansion valve to the predicted opening degree.

[0032] In a possible implementation manner, the method further includes:

[0033] Obtain time information predicted for the device corresponding to the electronic expansion valve to be closed;

[0034] When the time information is less than a second set threshold and the current heat dissipation amount is less than a third set threshold, control the radiator to close.

[0035] In a second aspect, an embodiment of the present invention provides an electronic expansion valve control device, including:

[0036] An acquisition module, configured to acquire operating parameters of a frequency conversion module in a device;

[0037] The acquisition module is further configured to acquire the ambient temperature around the frequency conversion module;

[0038] A determination module, configured to determine a target opening degree of the electronic expansion valve of the device corresponding to the operating parameters and / or the ambient temperature from an association relationship, where multiple sets of corresponding relationships among operating parameters, ambient temperature, and the target opening degree of the electronic expansion valve are stored in the association relationship;

[0039] An adjustment module, configured to adjust the actual opening degree of the electronic expansion valve according to the target opening degree.

[0040] In a third aspect, an embodiment of the present invention provides a device, including: a processor and a memory, where the processor is configured to execute an electronic expansion valve control program stored in the memory to implement the electronic expansion valve control method according to any one of the first aspects above.

[0041] In a fourth aspect, an embodiment of the present invention provides a storage medium, where the storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the electronic expansion valve control method according to any one of the first aspects above.

[0042] The electronic expansion valve control scheme provided by the embodiment of the present invention obtains the operating parameters of the frequency conversion module in the device; obtains the ambient temperature around the frequency conversion module; determines the target opening of the electronic expansion valve corresponding to the operating parameters and the ambient temperature from the association relationship, wherein the association relationship stores the correspondence between multiple groups of operating parameters, ambient temperature and the target opening of the electronic expansion valve; and adjusts the actual opening of the electronic expansion valve according to the target opening. In this way, it is possible to avoid frequent adjustment of the opening size of the electronic expansion valve, increase the service life of the electronic expansion valve, and at the same time, there is no need to add a buffer chamber to the radiator. By controlling the refrigerant through the electronic expansion valve, less refrigerant can be used to take away the heat of the module when the ambient temperature is high, thereby achieving the purpose of cooling the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 A schematic flow chart of an electronic expansion valve control method provided by an embodiment of the present invention;

[0044] Figure 2 A schematic diagram of a flow chart of a method for generating an association relationship provided by an embodiment of the present invention;

[0045] Figure 3 A schematic flow chart of another electronic expansion valve control method provided by an embodiment of the present invention;

[0046] Figure 4 A schematic diagram of the structure of an electronic expansion valve control device provided by an embodiment of the present invention;

[0047] Figure 5 A schematic diagram of the structure of a device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] To facilitate understanding of the embodiments of the present invention, specific embodiments will be further explained below in conjunction with the accompanying drawings. The embodiments do not constitute a limitation on the embodiments of the present invention.

[0050] Figure 1 A flow chart of an electronic expansion valve control method provided by an embodiment of the present invention is shown in FIG. Figure 1 As shown, the method specifically includes:

[0051] S11. Obtain the operating parameters of the frequency conversion module of the device.

[0052] The electronic expansion valve control method provided by the embodiment of the present invention is applied to an intelligent air conditioner device, which can be: a variable frequency air conditioner. Specifically, the target opening of the electronic expansion valve is determined according to the current ambient temperature, bus voltage, and operating frequency, and the electronic expansion valve is adjusted.

[0053] In this embodiment, the intelligent air conditioner device includes modules such as a frequency converter, a radiator, a condenser, an electronic expansion valve, a frequency converter drive board, and a gas-liquid separator. Among them, the radiator is tightly installed on the back of the frequency converter. There is a copper tube installed in the radiator. The liquid inlet of the copper tube is connected to the main circuit of the condenser. An electronic expansion valve is provided between the liquid inlet and the main circuit of the condenser. The opening of the electronic expansion valve is controlled by the frequency converter drive board. The liquid outlet of the copper tube in the radiator is connected to the gas-liquid separator.

[0054] Furthermore, the frequency conversion module in this embodiment includes a frequency converter and a frequency converter drive board. The frequency converter drive board can control the electronic expansion valve to adjust the opening. The radiator can dissipate heat from the frequency converter. The electronic expansion valve is used to control the refrigerant flow between the radiator and the condenser. Each electronic expansion valve corresponds to a radiator and a frequency conversion module. The operating parameters include: the bus voltage V and frequency F when the frequency converter is working.

[0055] The specific method for obtaining the bus voltage and frequency is not specifically limited in this embodiment. For example, the bus voltage and power can be detected through the built-in detection function and the bus voltage detection circuit on the frequency converter drive board.

[0056] S12. Obtain the ambient temperature around the frequency conversion module.

[0057] In this embodiment, the method for obtaining the ambient temperature can include, but is not limited to, obtaining the ambient temperature around the frequency conversion module through a temperature detection device such as a temperature sensor, and the frequency converter drive board obtaining the current ambient temperature value T through an ambient temperature thermosensitive package, etc. The specific method for obtaining the ambient temperature is not limited in this embodiment.

[0058] S13. Determine the target opening of the electronic expansion valve of the device corresponding to the operating parameters and / or the ambient temperature from the association relationship. Multiple sets of corresponding relationships among the operating parameters, ambient temperature, and the target opening of the electronic expansion valve are stored in the association relationship.

[0059] In an embodiment of the present invention, determining the target opening degree of the electronic expansion valve of the device corresponding to the operating parameter and the ambient temperature from the association relationship includes: pre-generating a first association relationship, which may be an AD table storing the target opening degree of the electronic expansion valve corresponding to the operating parameter and the ambient temperature, and can represent the corresponding relationship among the operating parameter - ambient temperature - target opening degree. Each set of operating parameter and ambient temperature corresponds to a target opening degree. The presentation form of this association relationship can be in the form of a table, a node diagram, etc., and this embodiment does not make specific limitations on this.

[0060] In an example, when the operating parameter includes F and V, the first association relationship may include the following two AD tables:

[0061]

[0062]

[0063] Further, according to the obtained T, F, and V, the current T can be queried from the association relationship, and the corresponding target AD table is determined according to T, and the target opening degree of the electronic expansion valve corresponding to the current F and V is determined in the target AD table.

[0064] For example, when T is 25, V is 543, and F is 60, the corresponding target opening degree determined from the association relationship is 374.

[0065] In a possible implementation manner, determining the target opening degree of the electronic expansion valve of the device corresponding to the operating parameter or the ambient temperature from the association relationship includes: pre-generating a second association relationship, which may be an AD table storing the target opening degree of the electronic expansion valve corresponding to the operating parameter, and can represent the corresponding relationship between the operating parameter - target opening degree. Each set of operating parameters corresponds to a target opening degree.

[0066] Or, pre-generate an association relationship, which may be an AD table storing the target opening degree of the electronic expansion valve corresponding to the ambient temperature, and can represent the corresponding relationship between the ambient temperature - target opening degree. Each ambient temperature corresponds to a target opening degree.

[0067] S14. Adjust the actual opening degree of the electronic expansion valve according to the target opening degree.

[0068] In this embodiment, it is judged whether the target opening degree S of the electronic expansion valve is equal to the actual opening degree Z. If the target opening degree S is not equal to the actual opening degree Z, the electronic expansion valve is controlled by the frequency converter drive board to adjust the number of steps to the target opening degree. If the target opening degree is equal to the actual opening degree, no adjustment is made, and steps S11 - S14 are repeatedly executed at intervals of a preset time.

[0069] The electronic expansion valve control method provided by the embodiment of the present invention obtains the operating parameters of the frequency conversion module of the device; obtains the ambient temperature around the frequency conversion module; determines the target opening of the electronic expansion valve corresponding to the operating parameters and / or the ambient temperature from the association relationship, wherein the association relationship stores the correspondence between multiple groups of operating parameters, ambient temperature and the target opening of the electronic expansion valve; and adjusts the actual opening of the electronic expansion valve according to the target opening. In this way, it is possible to avoid frequent adjustment of the opening size of the electronic expansion valve, increase the service life of the electronic expansion valve, and at the same time, there is no need to add a buffer chamber to the radiator. By controlling the refrigerant through the electronic expansion valve, less refrigerant can be used to take away the heat of the module when the ambient temperature is high, thereby achieving the purpose of cooling the module.

[0070] Figure 2 A flowchart of a method for generating an association relationship provided by an embodiment of the present invention is shown as follows: Figure 2 As shown, the method specifically includes:

[0071] S21. Acquire multiple groups of historical operating parameters of the frequency conversion module to obtain a historical operating parameter set.

[0072] In this embodiment, it is necessary to determine the corresponding historical opening degree and generate an association relationship through historical operating parameters and historical ambient temperature.

[0073] Specifically, a plurality of historical operating frequencies and a plurality of historical bus voltages in the historical operation process are obtained, and the plurality of historical operating frequencies and the plurality of historical bus voltages are used as a plurality of groups of historical operation parameter sets.

[0074] S22, controlling the frequency conversion module to operate according to any historical bus voltage and any historical operating frequency; determining the corresponding heat generation power when the frequency conversion module operates according to each set of historical operating parameters; determining the heat dissipation of each heat generation power within a preset time period, and obtaining a heat dissipation set.

[0075] In this embodiment, the frequency conversion module is controlled to operate according to any historical bus voltage and any historical operating frequency in the historical operating parameter set, that is, multiple historical operating frequencies and multiple historical bus voltages in the historical operating parameter set are arranged and combined one by one to obtain multiple combinations, and the frequency conversion module is controlled to operate according to each combination, and the heating power P of the inverter corresponding to each combination is determined. The heat dissipation of each heating power in a preset time period is determined to obtain a heat dissipation set, wherein the preset time period corresponding to each heating power is the same.

[0076] In a possible implementation, multiple sets of historical operating parameters can be preset by developers, and the heating power P of the frequency converter module can be calculated using the software provided by the manufacturer of the frequency converter module at different historical bus voltages V and different historical operating frequencies F. For example, the heating power calculation can be performed through the simulation software of the frequency converter manufacturer, including but not limited to the Infineon iposim online simulation system and the Mitsubishi melcosim offline simulation software.

[0077] S23. Obtain multiple historical ambient temperatures to obtain a set of historical ambient temperatures; at any historical ambient temperature, when the frequency conversion module operates with any set of historical operating parameters, adjust the historical opening degree of the electronic expansion valve; for each historical opening degree, obtain the heat absorption amount of the refrigerant within the preset time period to obtain a set of heat absorption amounts.

[0078] In this embodiment, multiple historical ambient temperatures during the historical operation of the frequency converter are obtained as a set of historical ambient temperatures, and the frequency converter is controlled to operate at each historical ambient temperature. During the operation at each historical ambient temperature, the frequency converter is controlled to operate in sequence with each set of historical operating parameters for the above-mentioned preset time period. During each operation, the historical opening degree of the electronic expansion valve is adjusted to adjust the refrigerant flow rate in the radiator by controlling the historical opening degree of the electronic expansion valve, absorb heat from the frequency converter through the refrigerant flow rate, so that the temperature of the frequency converter after heat absorption is less than the set threshold, and determine the heat absorption amount of the refrigerant during the heat absorption process.

[0079] In a possible implementation, multiple historical ambient temperatures can be preset by developers, and the heat absorption amount Q that the refrigerant can absorb during evaporation at different historical opening degrees S of the electronic expansion valve at different historical ambient temperatures T can be calculated using simulation software. The heat simulation software can include FLUENT.

[0080] In a possible implementation, obtain the suitable operating temperature range T1 - T2 of the frequency converter module from the data manual of the frequency converter module. Control multiple historical ambient temperatures within the temperature range. For example, the junction temperature range of the module is -30 to 150 °C. In actual use, a suitable temperature upper limit, such as 100 °C, will be determined with reference to this junction temperature range. When adjusting the opening degree of the electronic expansion valve, ensure that the module temperature does not exceed the set upper limit of 100 °C.

[0081] S24. During the process of adjusting the historical opening degree of the electronic expansion valve each time, determine whether the heat absorption amount matches the heat dissipation amount; when it is determined that they match, generate the corresponding relationship among the current historical opening degree, historical operating parameters, and historical ambient temperature.

[0082] In this embodiment, each time the historical ambient temperature or historical operating parameter changes, the historical target opening degree is re-determined and the opening degree adjustment is re-performed. After each adjustment of the historical opening degree of the electronic expansion valve, it is determined whether the heat absorption amount matches the heat dissipation amount. The determination method may include: determining a match when the heat absorption amount is the same as the heat dissipation amount, or determining a match when the difference between the heat absorption amount and the heat dissipation amount is less than a preset value. When a match is determined, a corresponding relationship among the current historical opening degree, historical operating parameter, and historical ambient temperature is generated. When they do not match, the step of adjusting the historical opening degree continues.

[0083] S25. Determine multiple corresponding relationships among the historical ambient temperature set, historical operating parameter set, and corresponding historical opening degree set according to the heat dissipation amount set and the heat absorption amount set, and generate the association relationship according to the multiple corresponding relationships.

[0084] In this embodiment, through the steps of S21 - S24, multiple matching heat absorption amounts and heat dissipation amounts in the heat absorption amount set and the heat dissipation amount set can be determined. Each set of matching heat absorption amount and heat dissipation amount corresponds to a set of historical ambient temperature, historical operating parameter, and historical opening degree. Therefore, a corresponding relationship is generated according to the historical ambient temperature, historical operating parameter, and historical opening degree corresponding to each set of matching heat absorption amount and heat dissipation amount. Thus, multiple sets of corresponding relationships can be obtained, and the multiple sets of corresponding relationships are generated into the AD table in S13 as the association relationship.

[0085] In a possible implementation manner, the generated association relationship is tested. After adjusting the actual opening degree of the electronic expansion valve by querying the AD table, the actual temperature rise of the frequency converter module is obtained, and it is determined whether the heat dissipation amount matches the heat absorption amount according to the actual temperature rise. Thus, the accuracy of the AD table can be verified, and the AD table is compensated and adjusted in combination with the actual test data of the laboratory where the deviation of the AD table is large.

[0086] As an example, when the ambient temperature T, bus voltage V, and operating frequency F are determined, a target opening degree S can be obtained through the association relationship.

[0087] The AD table example in the specific program processing is as follows

[0088] convert[T][V][F]=

[0089] {

[0090] {{s1,s2,…sF}1,{…}2,{…}3,…{…}V}1,

[0091] …

[0092] {{…}1,{…}2,{…}3,…{…}V}T

[0093] }

[0094] The generated correlation relationship examples include: the ambient temperature T is 25, 26, and 27 respectively; the bus voltage V is 543, 544, and 545 respectively; when the operating frequency F is 60, 61, 62, and 63, the generated correlation relationships are as follows, including three AD tables, and the numbers in the tables are the target opening degrees corresponding to different F, T, and V.

[0095]

[0096]

[0097]

[0098] The following is a specific program example

[0099] convert[3][3][4] =

[0100] {

[0101] {{374, 376, 378, 380} 543, {375, 377, 379, 381} 544, {376, 378, 380, 382} 545} 25,

[0102] {{375, 377, 379, 381} 543, {376, 378, 380, 382} 544, {377, 379, 381, 383} 545} 26,

[0103] {{376, 378, 380, 382} 543, {377, 379, 381, 383} 544, {378, 380, 382, 384} 545} 27,

[0104] }

[0105] Use a three-dimensional array to process the AD table. For example, determine the current ambient temperature T = 26, the current bus voltage V = 544, and the current operating frequency F = 61.

[0106] Determine {{375, 377, 379, 381} 543, {376, 378, 380, 382} 544, {377, 379, 381, 383} 545} 26 in the AD table from T = 26

[0107] Further determine {376, 378, 380, 382} 544 in the AD table from V = 544

[0108] Further determine {376, 378, 380, 382} 544 in the AD table from F = 61

[0109] Therefore, when T=26, V=544, and F=61, the target opening S of the electronic expansion valve is 378.

[0110] The method for generating the association relationship provided by the embodiment of the present invention obtains multiple groups of historical operating parameters of the frequency conversion module, controls the frequency conversion module to operate according to any historical bus voltage and any historical operating frequency respectively; determines the corresponding heating power during operation; determines the heat dissipation of each heating power, and obtains a set of historical ambient temperatures; at any historical ambient temperature, when the frequency conversion module operates with any set of historical operating parameters, adjusts the historical opening of the electronic expansion valve; for each historical opening, obtains the heat absorption of the refrigerant in the preset time period, and in the process of adjusting the historical opening of the electronic expansion valve each time, determines whether the heat absorption matches the heat dissipation; when it is determined to match, generates the corresponding relationship between the current historical opening, historical operating parameters and historical ambient temperature, and generates the association relationship according to the multiple corresponding relationships. In this way, the opening of the electronic expansion valve can be directly determined by calculating the heating power of the frequency conversion module at different voltages and frequencies and the heat absorbed by the refrigerant evaporation when the electronic expansion valve has different openings at different ambient temperatures, and generates an association relationship according to the bus voltage, operating frequency, ambient temperature and the opening of the electronic expansion valve.

[0111] The generated association relationship can improve the accuracy of determining the target opening, and the opening of the electronic expansion valve can be adjusted without pressure and temperature feedback, avoiding the problem of short service life of the electronic expansion valve due to the extremely fast temperature response speed and the need to frequently adjust the opening size. At the same time, it is no longer necessary to install a pressure sensor and a temperature sensor at the liquid outlet, which reduces the cost of the whole machine. At the same time, the radiator does not need to add a buffer chamber, and the heat exchange efficiency is high. When the ambient temperature is high, less refrigerant can be used to take away the heat of the module, thereby achieving the purpose of cooling the module.

[0112] Figure 3 A flow chart of another electronic expansion valve control method provided by an embodiment of the present invention is shown as follows: Figure 3 As shown, the method specifically includes:

[0113] S31. When a device corresponding to the electronic expansion valve receives a first operation, a predicted ambient temperature and a predicted operating parameter are determined according to the first operation.

[0114] In this embodiment, the device is an intelligent air conditioning device where the electronic expansion valve is located, and the first operation may include an operation of adjusting the air conditioning temperature triggered by a user, or an operation of adjusting the air conditioning working mode and working time (for example, controlling the air outlet temperature to decrease or increase, setting a timer to turn off the air conditioning, adjusting the air conditioning wind speed, etc.). The predicted ambient temperature around the frequency conversion module after a period of time is predicted according to the first operation, and the predicted operating parameters after a period of time are determined according to the specific content adjusted by the first operation.

[0115] Specifically, during the historical operation process, every time the air conditioner receives a first operation, it obtains the corresponding ambient temperature and operating parameters after a preset time, uses the ambient temperature and operating parameters as the predicted ambient temperature and predicted operating parameters corresponding to the first operation, stores them in the storage area, and searches for the corresponding predicted ambient temperature and predicted operating parameters in the storage area after receiving the first operation currently.

[0116] S32. Determine the predicted opening degree corresponding to the predicted ambient temperature and predicted operating parameters; determine the predicted heat dissipation amount according to the predicted operating parameters; when the predicted heat dissipation amount is greater than the first set threshold, adjust the opening degree of the current electronic expansion valve to the predicted opening degree.

[0117] In this embodiment, the predicted opening degree corresponding to the predicted ambient temperature and predicted operating parameters is determined through the above association relationship, and the predicted heat dissipation amount is determined through the simulation software in step S22, or the predicted heat dissipation amount corresponding to the predicted operating parameters is determined according to the heat dissipation amount corresponding to the historical operating parameters. When the predicted heat dissipation amount is greater than the first set threshold, it indicates that the predicted heat dissipation amount is too large, and it will take too long to absorb heat through the radiator. Therefore, there is no need to wait until the operating parameters become the predicted operating parameters. Immediately adjust the opening degree to the predicted opening degree at the current moment to increase the heat dissipation speed of the frequency converter, or adjust the actual opening degree of the electronic expansion valve to be greater than the predicted opening degree to achieve the effect of rapid heat dissipation. When the predicted heat dissipation amount is less than or equal to the first set threshold, the opening degree can be adjusted to the predicted opening degree when the actual operating parameters reach the predicted operating parameters.

[0118] In a possible implementation manner, obtain the time information of the predicted shutdown of the device corresponding to the electronic expansion valve; when the time information is less than the second set threshold and the current heat dissipation amount is less than the third set threshold, control the radiator to shut down.

[0119] Specifically, when the user sets a timed shutdown for the device, obtain the predicted shutdown duration at this time, determine the duration from the current moment to the predicted shutdown moment as the time information. When the time information is less than the second set threshold and the current heat dissipation amount is less than the third set threshold, it indicates that the heat dissipation amount is small at this time and the device is about to shut down, and there is no need to dissipate heat anymore. At this time, control the radiator to shut down to achieve resource consumption savings.

[0120] The electronic expansion valve control method provided by the embodiment of the present invention is as follows: when the device corresponding to the electronic expansion valve receives a first operation; determine the predicted ambient temperature and predicted operating parameters according to the first operation. Determine the predicted opening corresponding to the predicted ambient temperature and predicted operating parameters; determine the predicted heat dissipation according to the predicted operating parameters; when the predicted heat dissipation is greater than a first set threshold, adjust the opening of the current electronic expansion valve to the predicted opening. It can flexibly adjust the actual opening of the electronic expansion valve, quickly dissipate heat under specific circumstances, save power for the device, and avoid frequent adjustment of the opening.

[0121] Figure 4 The following is a schematic structural diagram of an electronic expansion valve control device provided by the embodiment of the present invention, as Figure 4 shown, the device specifically includes:

[0122] An acquisition module 41, configured to acquire the operating parameters of the frequency conversion module in the device;

[0123] The acquisition module 41 is further configured to acquire the ambient temperature around the frequency conversion module;

[0124] A determination module 42, configured to determine the target opening of the electronic expansion valve of the device corresponding to the operating parameters and / or the ambient temperature from an association relationship, where multiple sets of corresponding relationships among the operating parameters, ambient temperature, and the target opening of the electronic expansion valve are stored in the association relationship;

[0125] An adjustment module 43, configured to adjust the actual opening of the electronic expansion valve according to the target opening.

[0126] In a possible implementation manner, the acquisition module 41 is specifically configured to acquire the current bus voltage of the frequency conversion module during the operation of the frequency conversion module;

[0127] acquire the current operating frequency of the frequency conversion module;

[0128] The determination module 42 is specifically configured to determine the bus voltage and the operating frequency as the operating parameters.

[0129] In a possible implementation manner, the acquisition module 41 is further configured to acquire multiple sets of historical operating parameters of the frequency conversion module to obtain a historical operating parameter set, where the historical operating parameters include: historical operating frequency and historical bus voltage;

[0130] A control module 44, configured to control the frequency conversion module to operate respectively according to any one of the historical bus voltages and any one of the historical operating frequencies;

[0131] The determining module 42 is further configured to determine the heat generation power corresponding to the variable frequency module when operating according to each group of the historical operating parameters;

[0132] Determine the heat dissipation amount of each of the heat generation powers within a preset time period to obtain a heat dissipation amount set.

[0133] In a possible implementation manner, the obtaining module 41 is further configured to obtain a plurality of historical ambient temperatures to obtain a historical ambient temperature set;

[0134] The adjusting module 43 is further configured to, when the variable frequency module operates with any group of historical operating parameters at any one of the historical ambient temperatures, adjust the historical opening degree of the electronic expansion valve to adjust the refrigerant flow rate in the radiator, where the radiator is disposed adjacent to the variable frequency module;

[0135] The obtaining module 41 is further configured to, for each of the historical opening degrees, obtain the heat absorption amount of the refrigerant within the preset time period to obtain a heat absorption amount set.

[0136] In a possible implementation manner, the determining module 43 is specifically configured to, during each process of adjusting the historical opening degree of the electronic expansion valve, determine whether the heat absorption amount matches the heat dissipation amount;

[0137] When it is determined that they match, generate a corresponding relationship among the current historical opening degree, historical operating parameters, and historical ambient temperature;

[0138] Determine multiple corresponding relationships among the historical ambient temperature set, historical operating parameter set, and corresponding historical opening degree set according to the heat dissipation amount set and the heat absorption amount set, and generate the association relationship according to the multiple corresponding relationships.

[0139] In a possible implementation manner, the determining module 42 is further configured to, when the device corresponding to the electronic expansion valve receives a first operation, determine a predicted ambient temperature and predicted operating parameters according to the first operation;

[0140] Determine a predicted opening degree corresponding to the predicted ambient temperature and predicted operating parameters;

[0141] Determine a predicted heat dissipation amount according to the predicted operating parameters;

[0142] The adjusting module 43 is further configured to, when the predicted heat dissipation amount is greater than a first set threshold, adjust the opening degree of the current electronic expansion valve to the predicted opening degree.

[0143] In a possible implementation manner, the obtaining module 41 is further configured to obtain time information predicted for the device corresponding to the electronic expansion valve to be closed;

[0144] The control module 44 is further configured to control the radiator to turn off when the time information is less than a second set threshold and the current heat dissipation is less than a third set threshold.

[0145] The electronic expansion valve control device provided in this embodiment may be a device as shown in Figure 4 and can execute all steps of the method as shown in Figures 1-3 so as to achieve the technical effects of the method shown in Figures 1-3 . For specific reference, please refer to Figures 1-3 the relevant description. For the sake of concise description, it will not be elaborated here.

[0146] Figure 5 FIG. is a schematic structural diagram of a device provided by an embodiment of the present invention. Figure 5 The device 500 shown includes at least one processor 501, a memory 502, at least one network interface 504, and other user interfaces 503. Each component in the device 500 is coupled together through a bus system 505. It can be understood that the bus system 505 is used to realize the connection and communication between these components. In addition to the data bus, the bus system 505 also includes a power bus, a control bus, and a status signal bus. However, for the sake of clear illustration, in Figure 5 all kinds of buses are labeled as the bus system 505.

[0147] Among them, the user interface 503 may include a display, a keyboard, or a pointing device (such as a mouse, a trackball, a touchpad, or a touch screen, etc.).

[0148] It can be understood that the memory 502 in the embodiments of the present invention can be a volatile memory or a non-volatile memory, or can include both volatile and non-volatile memories. Among them, the non-volatile memory can be a read-only memory (ROM), a programmable ROM (PROM), an erasable programmable ROM (EPROM), an electrically erasable programmable ROM (EEPROM), or a flash memory. The volatile memory can be a random access memory (RAM), which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synch link DRAM (SLDRAM), and direct rambus RAM (DRRAM). The memory 502 described herein is intended to include but not be limited to these and any other suitable types of memories.

[0149] In some embodiments, the memory 502 stores the following elements, executable units, or data structures, or subsets thereof, or extended sets thereof: an operating system 5021 and an application program 5022.

[0150] Among them, the operating system 5021 includes various system programs, such as a framework layer, a core library layer, a driver layer, etc., and is used to implement various basic services and process hardware-based tasks. The application program 5022 includes various application programs, such as a media player and a browser, etc., and is used to implement various application services. The program for implementing the method of the embodiments of the present invention can be included in the application program 5022.

[0151] In the embodiments of the present invention, by calling the programs or instructions stored in the memory 502, specifically, the programs or instructions stored in the application program 5022, the processor 501 is used to execute the method steps provided in each method embodiment, for example, including:

[0152] Obtain the operating parameters of the frequency conversion module in the device;

[0153] Obtain the ambient temperature around the frequency conversion module;

[0154] Determine the target opening degree of the electronic expansion valve of the device corresponding to the operating parameter and / or the ambient temperature from the association relationship, and multiple sets of corresponding relationships among the operating parameter, the ambient temperature, and the target opening degree of the electronic expansion valve are stored in the association relationship;

[0155] Adjust the actual opening degree of the electronic expansion valve according to the target opening degree.

[0156] The method disclosed in the above embodiments of the present invention can be applied to or implemented by the processor 501. The processor 501 may be an integrated circuit chip with signal processing capabilities. During implementation, each step of the above method can be completed by the integrated logic circuit in hardware or instructions in software form in the processor 501. The above processor 501 may be a general-purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. It can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present invention. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. The steps of the method disclosed in combination with the embodiments of the present invention can be directly embodied as being executed by a hardware decoding processor or executed by a combination of hardware and software units in the decoding processor. The software unit may be located in a mature storage medium in the art such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory, or an electrically erasable programmable memory, a register, etc. This storage medium is located in the memory 502, and the processor 501 reads the information in the memory 502 and combines its hardware to complete the steps of the above method.

[0157] It will be appreciated that the embodiments described herein may be implemented using hardware, software, firmware, middleware, microcode, or any combination thereof. For a hardware implementation, the processing unit may be implemented in one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), general-purpose processors, controllers, microcontrollers, microprocessors, other electronic units for performing the functions described in this application, or any combination thereof.

[0158] For a software implementation, the techniques described herein may be implemented by units that execute the functions described herein. The software code may be stored in a memory and executed by a processor. The memory may be implemented within the processor or externally to the processor.

[0159] The device provided in this embodiment may be a device as shown in Figure 5 and may execute all the steps of the method as shown in Figures 1-3 to achieve the technical effects of the method shown in Figures 1-3 For specific details, please refer to the relevant description in Figures 1-3 For the sake of brevity, it will not be elaborated herein.

[0160] The embodiments of the present invention also provide a storage medium (computer-readable storage medium). The storage medium stores one or more programs. Here, the storage medium may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as read-only memory, flash memory, hard disk, or solid-state drive; the memory may further include a combination of the above types of memory.

[0161] When one or more programs in the storage medium can be executed by one or more processors to implement the method executed on the device side as described above.

[0162] The processor is used to execute the programs stored in the memory to implement the steps of the following method executed on the device side:

[0163] Obtain the operating parameters of the frequency conversion module in the device;

[0164] Obtain the ambient temperature around the frequency conversion module;

[0165] Determine the target opening degree of the electronic expansion valve of the device corresponding to the operating parameter and / or the ambient temperature from the association relationship, where multiple sets of corresponding relationships among the operating parameter, the ambient temperature, and the target opening degree of the electronic expansion valve are stored in the association relationship;

[0166] Adjust the actual opening degree of the electronic expansion valve according to the target opening degree.

[0167] Those skilled in the art should also be able to further realize that, for the units and algorithm steps of each example described in combination with the embodiments disclosed herein, they can be implemented by electronic hardware, computer software, or a combination of the two. To clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Skilled professionals can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present invention.

[0168] The steps of the method or algorithm described in combination with the embodiments disclosed herein can be implemented by hardware, software modules executed by a processor, or a combination of the two. The software modules can be placed in a random access memory (RAM), internal memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium well-known in the technical field.

[0169] The specific embodiments described above further elaborate on the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above description is only the specific embodiments of the present invention and is not used to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An electronic expansion valve control method, characterized in that, Including: Obtaining the operating parameters of the frequency conversion module in the device; Obtaining the ambient temperature around the frequency conversion module; Determining the target opening degree of the electronic expansion valve of the device corresponding to the operating parameters and the ambient temperature from the association relationship, where multiple sets of corresponding relationships among the operating parameters, the ambient temperature, and the target opening degree of the electronic expansion valve are stored in the association relationship. The electronic expansion valve is used to control the refrigerant flow between the radiator and the condenser in the device. The radiator is arranged adjacent to the frequency conversion module, and the radiator is used to dissipate heat from the frequency converter in the frequency conversion module; Adjusting the actual opening degree of the electronic expansion valve according to the target opening degree; The obtaining the operating parameters of the frequency conversion module in the device includes: During the operation of the frequency conversion module, obtaining the current bus voltage of the frequency conversion module; Obtaining the current operating frequency of the frequency conversion module; Determining the bus voltage and the operating frequency as the operating parameters.

2. The method according to claim 1, wherein Before obtaining the operating parameters of the frequency conversion module in the device, the method further includes: Obtaining multiple sets of historical operating parameters of the frequency conversion module to obtain a historical operating parameter set, where the historical operating parameters include: historical operating frequency and historical bus voltage; Controlling the frequency conversion module to operate respectively according to any one of the historical bus voltages and any one of the historical operating frequencies; Determining the heat generation power corresponding to when the frequency conversion module operates according to each set of historical operating parameters; Determining the heat dissipation amount of each heat generation power within a preset time period to obtain a heat dissipation amount set.

3. The method according to claim 2, characterized in that, Before obtaining the operating parameters of the frequency conversion module in the device, the method further includes: Obtaining multiple historical ambient temperatures to obtain a historical ambient temperature set; At any one of the historical ambient temperatures, when the frequency conversion module operates according to any one set of historical operating parameters, adjusting the historical opening degree of the electronic expansion valve to adjust the refrigerant flow rate in the radiator through the electronic expansion valve; For each historical opening degree, obtaining the heat absorption amount of the refrigerant within the preset time period to obtain a heat absorption amount set.

4. The method according to claim 3, characterized in that The corresponding relationship is generated by the following method: During each process of adjusting the historical opening degree of the electronic expansion valve, determining whether the heat absorption amount matches the heat dissipation amount; When it is determined that they match, generating the corresponding relationship among the current historical opening degree, historical operating parameters, and historical ambient temperature; Determining multiple corresponding relationships among the historical ambient temperature set, the historical operating parameter set, and the corresponding historical opening degree set according to the heat dissipation amount set and the heat absorption amount set, and generating the association relationship according to the multiple corresponding relationships.

5. The method according to claim 1, wherein The method further includes: When the device corresponding to the electronic expansion valve receives a first operation, determining a predicted ambient temperature and predicted operating parameters according to the first operation; Determining the predicted opening degree corresponding to the predicted ambient temperature and predicted operating parameters; Determining the predicted heat dissipation amount according to the predicted operating parameters; When the predicted heat dissipation amount is greater than a first set threshold, adjusting the opening degree of the current electronic expansion valve to the predicted opening degree.

6. The method according to claim 3, wherein The method further includes: Obtaining the time information predicted for the device corresponding to the electronic expansion valve to be closed; When the time information is less than a second set threshold and the current heat dissipation amount is less than a third set threshold, control the radiator to turn off.

7. An electronic expansion valve control device, characterized in that, Comprising: An acquisition module, configured to acquire the operating parameters of a frequency conversion module in the device; The acquisition module is further configured to acquire the ambient temperature around the frequency conversion module; A determination module, configured to determine the target opening degree of an electronic expansion valve of the device corresponding to the operating parameters and the ambient temperature from an association relationship, where multiple sets of corresponding relationships among the operating parameters, the ambient temperature, and the target opening degree of the electronic expansion valve are stored in the association relationship, the electronic expansion valve is used to control the refrigerant flow between a radiator and a condenser in the device, the radiator is disposed adjacent to the frequency conversion module, and the radiator is used to dissipate heat from a frequency converter in the frequency conversion module; An adjustment module, configured to adjust the actual opening degree of the electronic expansion valve according to the target opening degree; The acquisition module is specifically configured to acquire the current bus voltage of the frequency conversion module during the operation of the frequency conversion module; Acquire the current operating frequency of the frequency conversion module; The determination module is specifically configured to determine the bus voltage and the operating frequency as the operating parameters.

8. A device, characterized in that, Comprising: A processor and a memory, the processor is configured to execute an electronic expansion valve control program stored in the memory to implement the electronic expansion valve control method according to any one of claims 1 to 6.

9. A storage medium, characterized in that, The storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the electronic expansion valve control method according to any one of claims 1 to 6.

Images