A communication module switching method and device based on module image recognition

Abstract

The embodiment of the present application relates to a kind of based on module image recognition's communication module switching method and equipment, the method includes: continuously listening to control instruction;When instruction code is switching instruction code, test circuit type, test-switching relationship table and test-module relationship summary table are extracted;Call camera to generate corresponding first image by shooting the overhead view of spring needle array that communication module is pressed into;And image recognition is carried out to first image to obtain panoramic segmentation graph;According to panoramic segmentation graph, test circuit type and test-module relationship summary table, the connection of communication module and spring needle array is confirmed and the connection of test circuit and communication module is confirmed;According to test-switching relationship table, module-switching relationship table and test-module relationship table, switching switch of switching module is switch on or off or disconnecting operation.It can reduce test complexity, improve test efficiency, save test cost by the present application.

Description

Technical Field

[0001] This invention relates to the field of data processing technology, and in particular to a communication module switching method and device based on module image recognition. Background Technology

[0002] A wireless communication module (hereinafter referred to as a communication module) is a functional module or assembly that integrates baseband chips, memory, power amplifiers, and other components on a circuit board and provides wireless communication capabilities, such as the common 4G / 5G communication module. Communication modules have various packaging methods, one of which is the leadless chip carrier (LLC) packaging method. This packaging method uses an LLC interface. Modules with this packaging method do not have external module pins; their pins are embedded in the package edge, bent inwards, and tightly attached to the module.

[0003] When testing LLC interface communication modules, an adapter is typically used to connect the module pins embedded in the communication module to the test ports of the test circuit, thereby enabling the testing of the communication module using the test circuit. There are two common approaches to using such adapters: 1) The communication module is directly soldered onto the printed circuit board (PCB) of the adapter; 2) A pin adapter supporting the LLC interface is added to the PCB of the adapter to allow for pluggable communication modules.

[0004] During the testing process, we found that both of these conventional approaches suffer from resource waste and low testing efficiency: 1) The first conventional approach requires a custom adapter for each communication module of each model from each manufacturer, resulting in the lowest testing efficiency and the highest degree of resource waste; 2) Although the second conventional approach enables pluggable communication modules, it still requires a custom adapter for testing communication modules from different manufacturers with different pin counts or communication modules from different manufacturers with the same pin count but different pin function definitions. This still cannot effectively solve the problem of improving testing efficiency and avoiding resource waste. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a communication module switching method and device based on module image recognition. The communication module switching device includes a switching module, a spring pin array, a camera, and a main control module. A test circuit is connected to the switching module, and the connection relationship between the test ports of the test circuit and the switching module is confirmed. The communication module is pressed into the spring pin array, and the camera captures a top view of the spring pin array with the communication module. Image recognition technology is used to analyze the top view to obtain the connection relationship between the spring pins and the module pins. Based on the known correspondence between the test ports of the test circuit and the module pins of the communication module, the connection relationship between the spring pins and the module pins, the fixed connection relationship between the spring pin array and the switching module, and the connection relationship between the test ports of the test circuit and the switching module, the internal switching switch of the switching module is closed or opened. This invention enables the testing of communication modules of any manufacturer, model, size, and pin count from any single communication module switching device, thereby reducing testing complexity, improving testing efficiency, avoiding resource waste, and saving testing costs.

[0006] To achieve the above objectives, a first aspect of the present invention provides a communication module switching method based on module image recognition, the method comprising:

[0007] The first main control module of the communication module adapter continuously listens for control commands issued by the first control device and uses each heard control command as a corresponding first control command. The communication module adapter is connected to the first control device, the first communication module to be tested, and a first test circuit for testing the first communication module. The first communication module has an LLC package type. The communication module adapter includes a first adapter module, a first spring pin array, a first camera, and the first main control module. The first main control module is connected to the first control device, the first adapter module, and the first camera. The first adapter module is connected to the first spring pin array and the first test circuit. The first communication module is pressed into the first spring pin array. The first control command includes a first instruction code and first instruction data.

[0008] When the first instruction code is a transfer instruction code, the first test circuit type, the first test-transfer relationship table, and the test-module relationship table are extracted from the first instruction data; the first test-transfer relationship table is a correspondence table that reflects the connection relationship between the first test circuit and the first transfer module; the test-module relationship table is a correspondence table that reflects the connection relationship between various types of test circuits and various communication modules.

[0009] The first camera is used to capture a top-down view of the first spring pin array that has been pressed into the first communication module, generating a corresponding first image; and the first image is processed by image recognition to obtain a corresponding first panoramic segmentation map.

[0010] Based on the first panoramic segmentation map, the first test circuit type, and the test-module relationship table, the connection relationship between the first communication module and the first spring pin array is confirmed to obtain the corresponding first module-transfer relationship table, and the connection relationship between the first test circuit and the first communication module is confirmed to obtain the corresponding first test-module relationship table.

[0011] The switching switch of the first switching module is closed or opened according to the first test-transfer relationship table, the first module-transfer relationship table and the first test-module relationship table.

[0012] Preferably, the first transfer module includes multiple first-type ports, multiple second-type ports, and multiple first transfer switches; each first-type port is connected to a second-type port through a first transfer switch; the closing and opening operations of each first transfer switch are controlled by the first main control module; each first-type port, second-type port, and first transfer switch corresponds to a first-type port identifier, a second-type port identifier, and a first transfer switch identifier.

[0013] The first test circuit includes multiple first test ports; each first test port corresponds to a first test port identifier; each first test port is connected to a first type port of the first adapter module;

[0014] The first spring pin array is a rectangular array composed of M×N first spring pins, where M and N ≥ 1; each first spring pin corresponds to a first array coordinate (x, y); the first spring pin includes a pin head, a spring cavity, and a pin tail; the pin tail of each first spring pin is connected to a second type port of the first adapter module; a first reference mark is preset on the first spring pin array, the first reference mark corresponds to the first first spring pin, and the first first spring pin corresponds to the first array coordinate (x = 1, y = 1);

[0015] The first communication module includes a plurality of first module pins; each first module pin corresponds to a first module pin identifier; each first module pin is connected to the tip of a first spring pin of the first spring pin array; a second reference mark is preset on the first communication module, the second reference mark corresponds to the first first module pin; the first communication module has a module product information printing surface, and at least the module product serial number is printed on the module product information printing surface;

[0016] The first test-transfer relationship table includes multiple first test-transfer relationship records; the first test-transfer relationship record includes a first test port identifier field and a first type port identifier field;

[0017] The test-module relationship table includes multiple first correspondence records; each first correspondence record includes a first test circuit type field, a first module manufacturer name field, a first module product serial number field, a first module size field, a first module pin count field, a first module pin aspect ratio field, and a first test port-module pin pair field; the first module size field includes the first module length, first module width, and first module thickness; the first module pin aspect ratio field is in the format H:W, where H is the number of module pins on the left / right side of the communication module, W is the number of module pins on the top / bottom side of the communication module, and the first module pin count field = 2*(H+W); the first test port-module pin pair field includes multiple first test port-module pin pairs; each first test port-module pin pair includes a second test port identifier and a second module pin identifier;

[0018] The first panoramic segmentation image includes multiple first segmentation instances; each first segmentation instance includes a first instance type, a first instance identifier, and a first instance depth; the first instance type includes a spring pin array reference mark type, a communication module reference mark type, a spring pin type, a module pin type, and a module product information printed surface type; the first segmentation instance of the first instance type being the module pin type is located around the four sides of the first segmentation instance of the first instance type being the module product information printed surface type.

[0019] The first module-transfer relationship table includes multiple first module-transfer relationship records; each first module-transfer relationship record includes a first module pin identifier field and a first array coordinate field.

[0020] The first test-module relationship table includes multiple second correspondence records; the second correspondence records include a third test port identifier and a third module pin identifier.

[0021] Preferably, the step of performing image recognition processing on the first image to obtain the corresponding first panoramic segmentation map specifically includes:

[0022] The first main control module performs image instance segmentation processing on the first image based on a preset depth-sensing panoramic segmentation model to generate the corresponding first panoramic segmentation map; the depth-sensing panoramic segmentation model includes the PanopticDepth model, the Mask R-CNN model, and the K-Net model.

[0023] Preferably, the step of confirming the connection relationship between the first communication module and the first spring pin array based on the first panoramic segmentation map, the first test circuit type, and the test-module relationship summary table to obtain the corresponding first module-transition relationship table, and confirming the connection relationship between the first test circuit and the first communication module to obtain the corresponding first test-module relationship table, specifically includes:

[0024] The first main control module records the first segmentation instance of the first instance type as the first reference mark instance, the first segmentation instance of the first instance type as the communication module reference mark instance, the first segmentation instance of the first instance type as the first spring pin instance, the first segmentation instance of the first instance type as the module pin instance, and the first segmentation instance of the first instance type as the module product information printing surface instance on the first panoramic segmentation image.

[0025] The first printed surface instance is processed by image text recognition to obtain the corresponding first recognized text; and each first line of the first recognized text is traversed; during traversal, the currently traversed first line of text is recorded as the corresponding current line of text; and it is recognized whether the current line of text contains a preset product serial number keyword; if so, the traversal stops and the module product serial number is extracted from the current line of text as the corresponding first serial number; if not, the traversal continues to the next first line of text until the last first line of text is traversed; the first recognized text includes one or more first line of text.

[0026] Based on the first test circuit type and the first serial number, the test-module relationship table is queried. The first module pin count field, the first module pin aspect ratio field, and the first test port-module pin pair field of the first correspondence record in the test-module relationship table that match the first test circuit type field and the first module product serial number field match the first serial number are extracted as the corresponding first pin count, first aspect ratio, and first test port-module pin pair set. The first test port-module pin pair set includes multiple first test port-module pin pairs, and each first test port-module pin pair includes a second test port identifier and a second module pin identifier.

[0027] The first spring pin instance closest to the first reference mark instance is designated as the corresponding first starting spring pin instance, the first spring pin instance farthest from the first reference mark instance is designated as the corresponding first ending spring pin instance, and all other first spring pin instances except the first starting spring pin instance and the first ending spring pin instance are designated as the corresponding first intermediate spring pin instances. The first starting spring pin instance is associated with the first spring pin at coordinate (1,1) on the first spring pin array, and the first ending spring pin instance is associated with the first spring pin at coordinate (M,N) on the first spring pin array. Each first intermediate spring pin instance is positioned on the first spring pin array according to its relative offset from the first starting spring pin instance and the first ending spring pin instance.

[0028] The number of the first module pin instances is counted to generate the corresponding second pin count; when the number of the first and second pins are equal, the first module pin instance closest to the second reference mark instance is recorded as the corresponding first starting module pin instance; the first starting module pin instance is associated with the first first module pin of the first communication module; and according to the number of module pins H on the left / right side of the communication module and the number of module pins W on the top / bottom side of the communication module in the first aspect ratio, each of the other first module pin instances around the first printed surface instance is associated with the first module pin of the first communication module.

[0029] The first spring pin instance closest to each first module pin instance is taken as the corresponding first matching spring pin instance; the first module pin identifier of the first module pin corresponding to each first module pin instance is taken as the corresponding first module pin identifier field; the first array coordinate (x, y) of the first spring pin corresponding to the first matching spring pin instance corresponding to the first module pin instance is taken as the corresponding first array coordinate field; and the obtained first module pin identifier field and first array coordinate field form the corresponding first module-transition relationship record; and all the obtained first module-transition relationship records form the corresponding first module-transition relationship table;

[0030] The second test port identifier and the second module pin identifier of each first test port-module pin pair in the first test port-module pin pair set are used as the corresponding third test port identifier and the third module pin identifier to form the corresponding second correspondence record; and all the obtained second correspondence records are used to form the corresponding first test-module relationship table.

[0031] Preferably, the step of performing the switching operation of the transfer switch of the first transfer module according to the first test-transfer relationship table, the first module-transfer relationship table, and the first test-module relationship table specifically includes:

[0032] The first main control module initializes the first closed switch identifier sequence to be empty;

[0033] The process involves iterating through each of the second correspondence records in the first test-module relationship table. During iteration, the currently iterated second correspondence record is taken as the current record. The third test port identifier and the third module pin identifier of the current record are extracted as the corresponding current test port identifier and current module pin identifier. Based on the current test port identifier, the process queries the first test-transfer relationship table and extracts the first type port identifier field of the first test-transfer relationship record that matches the current test port identifier. Based on the current module pin identifier, the process queries the first module-transfer relationship table and extracts the first array coordinate field of the first module-transfer relationship record that matches the current module pin identifier. Based on the current array coordinate, the process queries a preset first array-transfer relationship table that reflects the fixed connection relationship between the first spring pin array and the first adapter module. The second type port identifier field of the first array-transfer relationship record that matches the second array coordinate field of the first array-transfer relationship table with the current array coordinate is extracted as the corresponding current type II port identifier; and according to the current type I port identifier and the current type II port identifier, a preset first transfer correspondence table reflecting the internal connection relationship of the first transfer module is queried, and the first transfer switch identifier field of the first transfer correspondence record that matches the type I port identifier field with the current type I port identifier and the type II port identifier field with the current type II port identifier is extracted as the corresponding first closed switch identifier and added to the first closed switch identifier sequence; the first array-transfer relationship table includes multiple first array-transfer relationship records; the first array-transfer relationship record includes the second array coordinate field and the second type port identifier field; the first transfer correspondence table includes multiple first transfer correspondence records; the first transfer correspondence record includes the first transfer switch identifier field, the type I port identifier field, and the type II port identifier field;

[0034] At the end of the traversal, the first transfer switch whose identifier matches each of the first closed switch identifiers in the first closed switch identifier sequence is recorded as the corresponding first closed switch, and all the first transfer switches other than the first closed switches are recorded as the corresponding first open switches; and a switch closing operation is performed on all the first closed switches in the first transfer module; and a switch opening operation is performed on all the first open switches in the first transfer module.

[0035] A second aspect of the present invention provides an apparatus for implementing the communication module switching method based on module image recognition as described in the first aspect, comprising: a first switching module, a first spring pin array, a first camera, and a first main control module as described in the first aspect; the apparatus is connected to a first control device, a first communication module, and a first test circuit as described in the first aspect; the module package type of the first communication module is LLC.

[0036] This invention provides a communication module switching method and device based on module image recognition. The communication module switching device includes a switching module, a spring pin array, a camera, and a main control module. A test circuit is connected to the switching module, and the connection relationship between the test ports of the test circuit and the switching module is confirmed. The communication module is pressed into the spring pin array, and the camera captures a top view of the spring pin array with the communication module. Image recognition technology is used to analyze the top view to obtain the connection relationship between the spring pins and the module pins. Based on the known correspondence between the test ports of the test circuit and the module pins of the communication module, the connection relationship between the spring pins and the module pins, the fixed connection relationship between the spring pin array and the switching module, and the connection relationship between the test ports of the test circuit and the switching module, the internal switching switch of the switching module is closed or opened. This invention allows for the testing of communication modules of any manufacturer, model, size, and pin count from any single communication module switching device, reducing testing complexity, improving testing efficiency, avoiding resource waste, and saving testing costs. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of a communication module switching method based on module image recognition provided in Embodiment 1 of the present invention;

[0038] Figure 2a This is a schematic diagram of the first adapter module provided in Embodiment 1 of the present invention;

[0039] Figure 2b This is a schematic diagram of the first communication module and the first spring pin array provided in Embodiment 1 of the present invention;

[0040] Figure 3This is a module structure diagram of a communication module adapter based on module image recognition provided in Embodiment 2 of the present invention. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0042] Embodiment 1 of the present invention provides a communication module switching method based on module image recognition, such as... Figure 1 The schematic diagram shows a communication module switching method based on module image recognition provided in Embodiment 1 of the present invention. The method mainly includes the following steps:

[0043] Step 1: The first main control module of the communication module switching device continuously listens for the control commands issued by the first control device; and uses each detected control command as the corresponding first control command.

[0044] The first control instruction includes a first instruction code and first instruction data.

[0045] The communication module adapter is connected to a first control device, a first communication module to be tested, and a first test circuit for testing the first communication module. The first communication module is packaged in LLC type. The communication module adapter includes a first adapter module, a first spring pin array, a first camera, and a first main control module. The first main control module is connected to the first control device, the first adapter module, and the first camera. The first adapter module is connected to the first spring pin array and the first test circuit. The first communication module is pressed into the first spring pin array.

[0046] The first transfer module includes multiple first-type ports, multiple second-type ports, and multiple first transfer switches; each first-type port is connected to a second-type port through a first transfer switch; the closing and opening operations of each first transfer switch are controlled by the first main control module; each first-type port, second-type port, and first transfer switch corresponds to a first-type port identifier, a second-type port identifier, and a first transfer switch identifier.

[0047] The first test circuit includes multiple first test ports; each first test port corresponds to a first test port identifier; each first test port is connected to a first type port of the first adapter module.

[0048] The first spring pin array is a rectangular array consisting of M×N first spring pins, where M and N ≥ 1; each first spring pin corresponds to a first array coordinate (x, y); the first spring pin includes a pin head, a spring cavity, and a pin tail; the pin tail of each first spring pin is connected to a second type port of the first adapter module; a first reference mark is preset on the first spring pin array, the first reference mark corresponds to the first first spring pin, and the first first spring pin corresponds to the first array coordinate (x = 1, y = 1);

[0049] The first communication module includes multiple first module pins; each first module pin corresponds to a first module pin identifier; each first module pin is connected to the tip of a first spring pin in the first spring pin array; a second reference mark is preset on the first communication module, the second reference mark corresponds to the first first module pin; the first communication module has a module product information printing surface, on which at least the module product serial number is printed.

[0050] Here, the first communication module in Embodiment 1 of the present invention is the LLC interface type communication module that needs to be tested; the first test circuit is the test circuit used to test the first communication module; the communication module adapter is the device that performs test port-module pin conversion between the first test circuit and the first communication module, including: a first adapter module, a first spring pin array, a first camera, and a first main control module. The first adapter module is a switch array, such as... Figure 2a As shown in the schematic diagram of the first adapter module provided in Embodiment 1 of the present invention, it consists of multiple first-type ports, multiple second-type ports, and multiple first adapter switches; each first adapter switch is connected to one first-type port and one second-type port respectively; in Embodiment 1 of the present invention, the first test port of the first test circuit is connected to the first-type port, and the first spring pin array connected to the first communication module is connected to the second-type port. The first spring pin array and the first communication module are as follows: Figure 2b The schematic diagram of the first communication module and the first spring pin array provided in Embodiment 1 of the present invention illustrates that, as is known from the usage of LLC interface modules and spring pin arrays, establishing a connection between the two requires pressing the first communication module into the first spring pin array. The first main control module can be an MCU with on-chip memory and a communication interface, or an FPGA with a storage module and a communication interface, which can be configured according to the actual application. The function of the first main control module is to perform corresponding closing or opening operations on the internal transfer switch of the first transfer module based on the correspondence between the test port and the module pin of the first test circuit and the first communication module.

[0051] It should be noted that the first control device in Embodiment 1 of the present invention is a device, equipment, or server connected to the communication module adapter. The tester will pre-store a correspondence table, i.e., a test-module relationship summary table, on the first control device, which reflects the connection relationship between various test circuits and various communication modules. In addition, during each test, the tester will pre-record the circuit type used in this test as the corresponding first test circuit type (e.g., USB test circuit, clock test circuit, etc.); connect the first test circuit to the first adapter module; press the first communication module into the first spring pin array; record the specific connection relationship between the first test port of the first test circuit and the first type port of the first adapter module to generate the corresponding first test-adapter relationship table and store it locally; and send a control command to the communication module adapter connected to itself, with the first instruction code being the adapter instruction code and the first instruction data being the first test circuit type + the first test-adapter relationship table + the test-module relationship summary table.

[0052] Step 2: When the first instruction code is a transfer instruction code, extract the first test circuit type, the first test-transfer relationship table, and the test-module relationship summary table from the first instruction data;

[0053] The first test-transfer relationship table is a correspondence table that reflects the connection relationship between the first test circuit and the first transfer module; the first test-transfer relationship table includes multiple first test-transfer relationship records; the first test-transfer relationship record includes a first test port identifier field and a first type port identifier field;

[0054] The Test-Module Relationship Master Table is a table reflecting the correspondence between various test circuits and communication modules from different manufacturers. The Test-Module Relationship Master Table includes multiple first correspondence records. Each first correspondence record includes a first test circuit type field, a first module manufacturer name field, a first module product serial number field, a first module size field, a first module pin count field, a first module pin aspect ratio field, and a first test port-module pin pair field. The first module size field includes the first module length, first module width, and first module thickness. The first module pin aspect ratio field is formatted as H:W, where H is the number of module pins on the left / right side of the communication module, and W is the number of module pins on the top / bottom side of the communication module. The first module pin count field = 2*(H+W). The first test port-module pin pair field includes multiple first test port-module pin pairs. Each first test port-module pin pair includes a second test port identifier and a second module pin identifier.

[0055] Step 3: Use the first camera to take a top-down view of the first spring pin array that has been pressed into the first communication module to generate the corresponding first image; and perform image recognition processing on the first image to obtain the corresponding first panoramic segmentation map;

[0056] Specifically, the first panoramic segmentation map is obtained by performing image recognition processing on the first image. This includes: the first main control module performs image instance segmentation processing on the first image based on a preset depth-sensing panoramic segmentation model to generate the corresponding first panoramic segmentation map.

[0057] The depth-sensing panoramic segmentation model includes the PanopticDepth model, the Mask R-CNN model, and the K-Net model; the first panoramic segmentation map includes multiple first segmentation instances; each first segmentation instance includes a first instance type, a first instance identifier, and a first instance depth; the first instance type includes a spring pin array reference mark type, a communication module reference mark type, a spring pin type, a module pin type, and a module product information printed surface type; the first segmentation instance with the first instance type of module pin type is located around the four sides of the first segmentation instance with the first instance type of module product information printed surface type.

[0058] Here, the three depth-sensing panoramic segmentation models used in Embodiment 1 of this invention—PanopticDepth, Mask R-CNN, and K-Net—are all publicly available panoramic segmentation models. In particular, the K-Net model has high accuracy in detecting small objects, so under normal circumstances, Embodiment 1 of this invention prefers the K-Net model for processing. The model structures and loss function definitions of these three models can be obtained from relevant technical literature and will not be elaborated further here.

[0059] It should be noted that the model needs to be trained before use. In Embodiment 1 of this invention, supervised learning is used for model training. Specifically, multiple communication modules of different manufacturers, models, sizes, shapes, and pin counts are pressed onto the first spring pin array in arbitrary orientations and positions. A first camera is used to take a top-view image of the first spring pin array with the communication modules pressed in, obtaining multiple first training images. Instance labels are added to each first training image, including the spring pin array reference mark (first reference mark), the communication module reference mark (second reference mark), the spring pin (spring pin head from the top-view angle), the module pins, and the printed surface of the module product information. Then, each first training image is fed into the model for panoramic segmentation processing to obtain the corresponding first training panoramic segmentation image. Based on the model's preset loss function, loss is calculated between each instance label of the first training image and each segmented instance on the first training panoramic segmentation image. Training of the model stops after the loss function value reaches a preset convergence range.

[0060] Step 4: Based on the first panoramic segmentation diagram, the first test circuit type, and the test-module relationship table, confirm the connection relationship between the first communication module and the first spring pin array to obtain the corresponding first module-transfer relationship table, and confirm the connection relationship between the first test circuit and the first communication module to obtain the corresponding first test-module relationship table;

[0061] The first module-transfer relationship table includes multiple first module-transfer relationship records; the first module-transfer relationship record includes a first module pin identifier field and a first array coordinate field; the first test-module relationship table includes multiple second correspondence relationship records; the second correspondence relationship record includes a third test port identifier and a third module pin identifier;

[0062] Specifically, this includes: Step 41, where the first main control module records the first segmentation instance of the first instance type as the first reference mark instance, the first segmentation instance of the first instance type as the communication module reference mark instance, the first segmentation instance of the first instance type as the first spring pin instance, the first segmentation instance of the first instance type as the module pin instance, and the first segmentation instance of the first instance type as the module product information printing surface instance on the first panoramic segmentation image.

[0063] Step 42: Perform image text recognition processing on the first printed surface instance to obtain the corresponding first recognized text; and traverse each first line of text in the first recognized text; during traversal, record the currently traversed first line of text as the corresponding current line of text; and identify whether the current line of text contains a preset product serial number keyword; if so, stop traversal and extract the module product serial number from the current line of text as the corresponding first serial number; if not, proceed to the next first line of text and continue traversing until the last first line of text is traversed; the first recognized text includes one or more first lines of text;

[0064] Step 43: Query the test-module relationship table according to the first test circuit type and the first serial number. Extract the first module pin quantity field, first module pin aspect ratio field, and first test port-module pin pair field from the first correspondence record in the test-module relationship table that matches the first test circuit type field and the first module product serial number field with the first serial number. These fields are used as the corresponding first pin quantity, first aspect ratio, and first test port-module pin pair set. The first test port-module pin pair set includes multiple first test port-module pin pairs, and each first test port-module pin pair includes a second test port identifier and a second module pin identifier.

[0065] Step 44: The first spring pin instance closest to the first reference mark instance is recorded as the corresponding first starting spring pin instance, the first spring pin instance farthest from the first reference mark instance is recorded as the corresponding first ending spring pin instance, and all other first spring pin instances except the first starting spring pin instance and the first ending spring pin instance are recorded as the corresponding first intermediate spring pin instances; the first starting spring pin instance is associated with the first spring pin at coordinate (1,1) on the first spring pin array, and the first ending spring pin instance is associated with the first spring pin at coordinate (M,N) on the first spring pin array; and each first intermediate spring pin instance is positioned on the first spring pin array according to its relative offset relationship with the first starting spring pin instance and the first ending spring pin instance.

[0066] Step 45: Count the number of first module pin instances to generate the corresponding second pin number; when the number of first and second pins are equal, record the first module pin instance closest to the second reference mark instance as the corresponding first starting module pin instance; and associate the first starting module pin instance with the first first module pin of the first communication module; and according to the number of module pins H on the left / right side of the communication module and the number of module pins W on the top / bottom side of the communication module in the first aspect ratio, associate each of the other first module pin instances around the four sides of the first printed surface instance with the first module pin of the first communication module one by one;

[0067] Here, in this embodiment of the invention, when determining the first module pin instance closest to the second reference mark instance, a nearest rule is preset for determination; the nearest rule is to take the right edge of the second reference mark instance as the first reference edge, and take the first module pin instance closest to the first reference edge as the first module pin instance closest to the second reference mark instance; the nearest rule can also be to take the bottom edge of the second reference mark instance as the second reference edge, and take the first module pin instance closest to the second reference edge as the first module pin instance closest to the second reference mark instance;

[0068] Step 46: The first spring pin instance closest to each first module pin instance is taken as the corresponding first matching spring pin instance; the first module pin identifier of the first module pin corresponding to each first module pin instance is taken as the corresponding first module pin identifier field; the first array coordinate (x, y) of the first spring pin corresponding to the first matching spring pin instance is taken as the corresponding first array coordinate field; and the obtained first module pin identifier field and first array coordinate field form the corresponding first module-transition relationship record; and all the obtained first module-transition relationship records form the corresponding first module-transition relationship table.

[0069] Step 47: Take the second test port identifier and the second module pin identifier of each first test port-module pin pair in the first test port-module pin pair set as the corresponding third test port identifier and third module pin identifier to form the corresponding second correspondence record; and form the corresponding first test-module relationship table by forming all the obtained second correspondence records.

[0070] Step 5: Perform switch closing or opening operations on the transfer switch of the first transfer module according to the first test-transfer relationship table, the first module-transfer relationship table and the first test-module relationship table;

[0071] Specifically, this includes: Step 51, the first main control module initializes the first closed switch identifier sequence to be empty;

[0072] Step 52: Traverse each second correspondence record in the first test-module relationship table; during traversal, take the currently traversed second correspondence record as the corresponding current record; extract the third test port identifier and the third module pin identifier of the current record as the corresponding current test port identifier and current module pin identifier; query the first test-transfer relationship table based on the current test port identifier, extract the first type port identifier field of the first test-transfer relationship record that matches the current test port identifier in the first test-transfer relationship table as the corresponding current first type port identifier; query the first module-transfer relationship table based on the current module pin identifier, and extract the first array coordinates of the first module-transfer relationship record that matches the current module pin identifier in the first module-transfer relationship table. The field is used as the corresponding current array coordinate; and according to the current array coordinate, the preset first array-transfer relationship table reflecting the fixed connection relationship between the first spring pin array and the first transfer module is queried. The second type port identifier field of the first array-transfer relationship record that matches the second array coordinate field of the first array-transfer relationship table with the current array coordinate is extracted as the corresponding current second type port identifier; and according to the current first type port identifier and the current second type port identifier, the preset first transfer correspondence relationship table reflecting the internal connection relationship of the first transfer module is queried. The first transfer switch identifier field of the first transfer correspondence record that matches the first type port identifier field of the first transfer correspondence relationship table with the current first type port identifier and the second type port identifier field of the first transfer correspondence relationship table with the current second type port identifier is extracted as the corresponding first closed switch identifier and added to the first closed switch identifier sequence;

[0073] The first array-transfer relationship table includes multiple first array-transfer relationship records; the first array-transfer relationship record includes a second array coordinate field and a second type port identifier field; the first transfer correspondence table includes multiple first transfer correspondence records; the first transfer correspondence record includes a first transfer switch identifier field, a first type port identifier field, and a second type port identifier field;

[0074] Step 54: When the traversal ends, the first transfer switch in the first transfer module whose first transfer switch identifier matches each of the first closed switch identifiers in the first closed switch identifier sequence is recorded as the corresponding first closed switch, and all first transfer switches other than the first closed switches are recorded as the corresponding first open switches; and the first closed switches in the first transfer module are closed by switching operation; and the first open switches in the first transfer module are opened by switching operation.

[0075] Figure 3 This is a module structure diagram of a communication module adapter based on module image recognition provided in Embodiment 2 of the present invention. This communication module adapter can be a device, terminal, equipment, or server implementing the method of Embodiment 1 of the present invention, or it can be a device connected to the aforementioned terminal equipment or server implementing the method of Embodiment 1 of the present invention. For example, the communication module adapter can be a module, device, or chip system of the aforementioned terminal, equipment, or server. Figure 3 As shown, the communication module adapter 400 includes: a first adapter module 401, a first spring pin array 402, a first camera 403, and a first main control module 404; the communication module adapter 400 is connected to the first control device 100, the first communication module 300, and the first test circuit 200 respectively; the module package type of the first communication module 300 is LLC type.

[0076] The first adapter module 401, the first spring pin array 402, the first camera 403, and the first main control module 404 of the communication module adapter device 400 in Embodiment 2 of the present invention are the same as the first adapter module, the first spring pin array, the first camera, and the first main control module of the communication module adapter device in Embodiment 1 of the present invention. The implementation principle and technical effect of each module are similar, and will not be described again here.

[0077] The first control device 100, the first communication module 300, and the first test circuit 200 in Embodiment 2 of the present invention are the same as the first control device, the first communication module, and the first test circuit of the communication module switching device in Embodiment 1 of the present invention. Their implementation principles and technical effects are similar, and will not be described again here.

[0078] It should be noted that the division of the various modules in the above-described device is merely a logical functional division. In actual implementation, they can be fully or partially integrated into a single physical entity, or they can be physically separated. Furthermore, these modules can be implemented entirely in software via processing element calls; they can be fully implemented in hardware; or some modules can be implemented by processing element calls to software, while others are implemented in hardware. For example, the main control module can be a separate processing element, or it can be integrated into a chip within the device. Alternatively, it can be stored as program code in the device's memory, and called and executed by a processing element. The implementation of other modules is similar. Moreover, these modules can be fully or partially integrated together, or implemented independently. The processing element described here can be an integrated circuit with signal processing capabilities. In the implementation process, each step of the above method or each of the above modules can be completed through integrated logic circuits in the hardware of the processor element or through software instructions.

[0079] For example, these modules can be one or more integrated circuits configured to implement the above methods, such as one or more Application Specific Integrated Circuits (ASICs), one or more Digital Signal Processors (DSPs), or one or more Field Programmable Gate Arrays (FPGAs). As another example, when a module is implemented using processing element scheduler code, the processing element can be a general-purpose processor, such as a Central Processing Unit (CPU) or other processor capable of calling program code. Furthermore, these modules can be integrated together as a System-on-a-Chip (SOC).

[0080] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer described above can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions described above can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, Bluetooth, microwave, etc.) means. The computer-readable storage medium described above can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The aforementioned available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., DVDs), or semiconductor media (e.g., solid-state disks (SSDs)).

[0081] This invention provides a communication module switching method and device based on module image recognition. The communication module switching device includes a switching module, a spring pin array, a camera, and a main control module. A test circuit is connected to the switching module, and the connection relationship between the test ports of the test circuit and the switching module is confirmed. The communication module is pressed into the spring pin array, and the camera captures a top view of the spring pin array with the communication module. Image recognition technology is used to analyze the top view to obtain the connection relationship between the spring pins and the module pins. Based on the known correspondence between the test ports of the test circuit and the module pins of the communication module, the connection relationship between the spring pins and the module pins, the fixed connection relationship between the spring pin array and the switching module, and the connection relationship between the test ports of the test circuit and the switching module, the internal switching switch of the switching module is closed or opened. This invention allows for the testing of communication modules of any manufacturer, model, size, and pin count from any single communication module switching device, reducing testing complexity, improving testing efficiency, avoiding resource waste, and saving testing costs.

[0082] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0083] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein can be implemented in hardware, a software module executed by a processor, or a combination of both. The software module can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.

[0084] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A communication module switching method based on module image recognition, characterized in that, The method includes: The first main control module of the communication module adapter continuously listens for control commands issued by the first control device and uses each heard control command as a corresponding first control command. The communication module adapter is connected to the first control device, the first communication module to be tested, and a first test circuit for testing the first communication module. The first communication module has an LLC package type. The communication module adapter includes a first adapter module, a first spring pin array, a first camera, and the first main control module. The first main control module is connected to the first control device, the first adapter module, and the first camera. The first adapter module is connected to the first spring pin array and the first test circuit. The first communication module is pressed into the first spring pin array. The first control command includes a first instruction code and first instruction data. When the first instruction code is a transfer instruction code, the first test circuit type, the first test-transfer relationship table, and the test-module relationship table are extracted from the first instruction data; the first test-transfer relationship table is a correspondence table that reflects the connection relationship between the first test circuit and the first transfer module; the test-module relationship table is a correspondence table that reflects the connection relationship between various types of test circuits and various communication modules. The first camera is used to capture a top-down view of the first spring pin array that has been pressed into the first communication module, generating a corresponding first image; and the first image is processed by image recognition to obtain a corresponding first panoramic segmentation map. Based on the first panoramic segmentation map, the first test circuit type, and the test-module relationship table, the connection relationship between the first communication module and the first spring pin array is confirmed to obtain the corresponding first module-transfer relationship table, and the connection relationship between the first test circuit and the first communication module is confirmed to obtain the corresponding first test-module relationship table. The switching switch of the first switching module is closed or opened according to the first test-transfer relationship table, the first module-transfer relationship table and the first test-module relationship table.

2. The communication module switching method based on module image recognition according to claim 1, characterized in that, The first adapter module includes multiple first-type ports, multiple second-type ports, and multiple first adapter switches; Each of the first type ports is connected to a second type port through a first transfer switch; the closing and opening operations of each first transfer switch are controlled by the first main control module; each of the first type ports, the second type ports, and the first transfer switch corresponds to a first type port identifier, a second type port identifier, and a first transfer switch identifier. The first test circuit includes multiple first test ports; each first test port corresponds to a first test port identifier; each first test port is connected to a first type port of the first adapter module; The first spring pin array is a rectangular array composed of M×N first spring pins, where M and N ≥ 1; each first spring pin corresponds to a first array coordinate (x, y); the first spring pin includes a pin head, a spring cavity, and a pin tail; the pin tail of each first spring pin is connected to a second type port of the first adapter module; a first reference mark is preset on the first spring pin array, the first reference mark corresponds to the first first spring pin, and the first first spring pin corresponds to the first array coordinate (x = 1, y = 1); The first communication module includes a plurality of first module pins; each first module pin corresponds to a first module pin identifier; each first module pin is connected to the tip of a first spring pin of the first spring pin array; a second reference mark is preset on the first communication module, the second reference mark corresponds to the first first module pin; the first communication module has a module product information printing surface, and at least the module product serial number is printed on the module product information printing surface; The first test-transfer relationship table includes multiple first test-transfer relationship records; the first test-transfer relationship record includes a first test port identifier field and a first type port identifier field; The test-module relationship table includes multiple first correspondence records; each first correspondence record includes a first test circuit type field, a first module manufacturer name field, a first module product serial number field, a first module size field, a first module pin count field, a first module pin aspect ratio field, and a first test port-module pin pair field; the first module size field includes the first module length, first module width, and first module thickness; the first module pin aspect ratio field is in the format H:W, where H is the number of module pins on the left / right side of the communication module, W is the number of module pins on the top / bottom side of the communication module, and the first module pin count field = 2*(H+W); the first test port-module pin pair field includes multiple first test port-module pin pairs; each first test port-module pin pair includes a second test port identifier and a second module pin identifier; The first panoramic segmentation image includes multiple first segmentation instances; each first segmentation instance includes a first instance type, a first instance identifier, and a first instance depth; the first instance type includes a spring pin array reference mark type, a communication module reference mark type, a spring pin type, a module pin type, and a module product information printed surface type; the first segmentation instance of the first instance type being the module pin type is located around the four sides of the first segmentation instance of the first instance type being the module product information printed surface type. The first module-transfer relationship table includes multiple first module-transfer relationship records; The first module-transfer relationship record includes a first module pin identifier field and a first array coordinate field; The first test-module relationship table includes multiple second correspondence records; the second correspondence records include a third test port identifier and a third module pin identifier.

3. The communication module switching method based on module image recognition according to claim 2, characterized in that, The step of performing image recognition processing on the first image to obtain the corresponding first panoramic segmentation map specifically includes: The first main control module performs image instance segmentation processing on the first image based on a preset depth-sensing panoramic segmentation model to generate the corresponding first panoramic segmentation map; the depth-sensing panoramic segmentation model includes the PanopticDepth model, the Mask R-CNN model, and the K-Net model.

4. The communication module switching method based on module image recognition according to claim 2, characterized in that, The process of confirming the connection relationship between the first communication module and the first spring pin array based on the first panoramic segmentation map, the first test circuit type, and the test-module relationship summary table to obtain the corresponding first module-transition relationship table, and confirming the connection relationship between the first test circuit and the first communication module to obtain the corresponding first test-module relationship table, specifically includes: The first main control module records the first segmentation instance of the first instance type as the first reference mark instance, the first segmentation instance of the first instance type as the communication module reference mark instance, the first segmentation instance of the first instance type as the first spring pin instance, the first segmentation instance of the first instance type as the module pin instance, and the first segmentation instance of the first instance type as the module product information printing surface instance on the first panoramic segmentation image. The first printed surface instance is processed by image text recognition to obtain the corresponding first recognized text; and each first line of the first recognized text is traversed; during traversal, the currently traversed first line of text is recorded as the corresponding current line of text; and it is recognized whether the current line of text contains a preset product serial number keyword; if so, the traversal stops and the module product serial number is extracted from the current line of text as the corresponding first serial number; if not, the traversal continues to the next first line of text until the last first line of text is traversed; the first recognized text includes one or more first line of text. Based on the first test circuit type and the first serial number, the test-module relationship table is queried. The first module pin count field, the first module pin aspect ratio field, and the first test port-module pin pair field of the first correspondence record in the test-module relationship table that match the first test circuit type field and the first module product serial number field match the first serial number are extracted as the corresponding first pin count, first aspect ratio, and first test port-module pin pair set. The first test port-module pin pair set includes multiple first test port-module pin pairs, and each first test port-module pin pair includes a second test port identifier and a second module pin identifier. The first spring pin instance closest to the first reference mark instance is designated as the corresponding first starting spring pin instance, the first spring pin instance farthest from the first reference mark instance is designated as the corresponding first ending spring pin instance, and all other first spring pin instances except the first starting spring pin instance and the first ending spring pin instance are designated as the corresponding first intermediate spring pin instances. The first starting spring pin instance is associated with the first spring pin at coordinate (1,1) on the first spring pin array, and the first ending spring pin instance is associated with the first spring pin at coordinate (M,N) on the first spring pin array. Each first intermediate spring pin instance is positioned on the first spring pin array according to its relative offset from the first starting spring pin instance and the first ending spring pin instance. The number of the first module pin instances is counted to generate the corresponding second pin count; when the number of the first and second pins are equal, the first module pin instance closest to the second reference mark instance is recorded as the corresponding first starting module pin instance; the first starting module pin instance is associated with the first first module pin of the first communication module; and according to the number of module pins H on the left / right side of the communication module and the number of module pins W on the top / bottom side of the communication module in the first aspect ratio, each of the other first module pin instances around the first printed surface instance is associated with the first module pin of the first communication module. The first spring pin instance closest to each first module pin instance is taken as the corresponding first matching spring pin instance; the first module pin identifier of the first module pin corresponding to each first module pin instance is taken as the corresponding first module pin identifier field; the first array coordinate (x, y) of the first spring pin corresponding to the first matching spring pin instance corresponding to the first module pin instance is taken as the corresponding first array coordinate field; and the obtained first module pin identifier field and first array coordinate field form the corresponding first module-transition relationship record; and all the obtained first module-transition relationship records form the corresponding first module-transition relationship table; The second test port identifier and the second module pin identifier of each first test port-module pin pair in the first test port-module pin pair set are used as the corresponding third test port identifier and the third module pin identifier to form the corresponding second correspondence record; and all the obtained second correspondence records are used to form the corresponding first test-module relationship table.

5. The communication module switching method based on module image recognition according to claim 2, characterized in that, The step of closing or opening the switch of the first adapter module according to the first test-transfer relationship table, the first module-transfer relationship table, and the first test-module relationship table specifically includes: The first main control module initializes the first closed switch identifier sequence to be empty; The process involves iterating through each of the second correspondence records in the first test-module relationship table. During iteration, the currently iterated second correspondence record is taken as the current record. The third test port identifier and the third module pin identifier of the current record are extracted as the corresponding current test port identifier and current module pin identifier. Based on the current test port identifier, the process queries the first test-transfer relationship table and extracts the first type port identifier field of the first test-transfer relationship record that matches the current test port identifier. Based on the current module pin identifier, the process queries the first module-transfer relationship table and extracts the first array coordinate field of the first module-transfer relationship record that matches the current module pin identifier. Based on the current array coordinate, the process queries a preset first array-transfer relationship table that reflects the fixed connection relationship between the first spring pin array and the first adapter module. The second type port identifier field of the first array-transfer relationship record that matches the second array coordinate field of the first array-transfer relationship table with the current array coordinate is extracted as the corresponding current type II port identifier; and according to the current type I port identifier and the current type II port identifier, a preset first transfer correspondence table reflecting the internal connection relationship of the first transfer module is queried, and the first transfer switch identifier field of the first transfer correspondence record that matches the type I port identifier field with the current type I port identifier and the type II port identifier field with the current type II port identifier is extracted as the corresponding first closed switch identifier and added to the first closed switch identifier sequence; the first array-transfer relationship table includes multiple first array-transfer relationship records; the first array-transfer relationship record includes the second array coordinate field and the second type port identifier field; the first transfer correspondence table includes multiple first transfer correspondence records; the first transfer correspondence record includes the first transfer switch identifier field, the type I port identifier field, and the type II port identifier field; At the end of the traversal, the first transfer switch whose identifier matches each of the first closed switch identifiers in the first closed switch identifier sequence is recorded as the corresponding first closed switch, and all the first transfer switches other than the first closed switches are recorded as the corresponding first open switches; and a switch closing operation is performed on all the first closed switches in the first transfer module; and a switch opening operation is performed on all the first open switches in the first transfer module.

6. An apparatus for implementing the communication module switching method based on module image recognition as described in any one of claims 1-5, characterized in that, The device includes: a first adapter module according to any one of claims 1, 2, and 5; a first spring pin array according to any one of claims 1, 2, 4, and 5; a first camera according to the method of claim 1; and a first main control module according to any one of claims 1-5. The device is connected to a first control device according to the method of claim 1, a first communication module according to any one of claims 1, 2, and 4, and a first test circuit according to any one of claims 1, 2, and 4. The module package type of the first communication module is LLC.

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