Audio decoding chip

Abstract

The application provides an audio decoding chip, and belongs to the technical field of audio decoding. The audio decoding chip comprises a differential signal communication module, a data packaging module, a protocol conversion module, an audio processing module and a control unit. The differential signal communication module is used for converting received analog signals into digital signals and outputting the digital signals. The control unit is used for obtaining target configuration information corresponding to an audio playing device, and sending the target configuration information to the data packaging module to configure the data packaging module according to the target configuration information. The data packaging module is further used for classifying, packaging and forwarding received digital data after the configuration is completed. The protocol conversion module is used for converting the received data into different formats according to data types after the configuration is completed, and outputting the data after the format conversion to the audio processing module. The application can improve the integration and adaptability of the chip.

Description

Technical Field

[0001] This application relates to the field of audio decoding technology, and more specifically, to an audio decoding chip. Background Technology

[0002] With the development of electronic technology, more and more audio playback devices are appearing on the market, such as MP3 players, mobile phones, and computers. These audio playback devices are generally equipped with corresponding interfaces for users to plug in external devices such as speakers or headphones to convert audio data into sound.

[0003] In related technologies, external devices generally require a chip for parsing data protocols and another chip for converting audio data output from the playback device. This allows the digital signal output from the playback device to be converted into an analog signal and played back through the external device. Furthermore, peripheral circuitry is needed between the various chips in the external device to process button commands and perform signal electrical conversions.

[0004] However, the related technical solutions require the design of multiple chips with different functions and multiple peripheral circuits. Furthermore, since audio playback devices may provide interfaces such as Type-C, Lightning, or other interfaces adapted to the I2S protocol, the related technical solutions require hardware structure adjustments for different interfaces. Therefore, this approach suffers from poor integration and adaptability. Summary of the Invention

[0005] The purpose of this application is to provide an audio decoding chip that can improve the chip's integration and adaptability.

[0006] The embodiments of this application are implemented as follows:

[0007] A first aspect of this application provides an audio decoding chip, the audio decoding chip including a differential signal communication module, a data encapsulation module, a protocol conversion module, an audio processing module, and a control unit;

[0008] The differential signal communication module is connected to the data encapsulation module, the data encapsulation module is connected to the control unit and the protocol conversion module respectively, and the protocol conversion module is connected to the audio processing module;

[0009] The differential signal communication module is used to convert the received analog signal into a digital signal and output it; the control unit is used to acquire target configuration information corresponding to the audio playback device and send the target configuration information to the data encapsulation module to configure the data encapsulation module according to the target configuration information.

[0010] The data encapsulation module is used to configure the differential signal communication module, the protocol conversion module, and the audio processing module according to the target configuration information, wherein the target configuration information is used to indicate configuration parameters that match the interface type of the audio playback device;

[0011] The data encapsulation module is also used to classify, encapsulate, and forward the received digital data after configuration.

[0012] The protocol conversion module is used to convert the received data according to the data type format after configuration and output the converted data to the audio processing module; the audio processing module is used to convert the audio data output by the protocol conversion module into an analog audio signal after configuration and output the analog audio signal to the playback unit.

[0013] Optionally, the differential signal communication module is further configured to receive handshake data sent by the audio playback device when the differential signal communication module is connected to the audio playback device, and output the handshake data to the data encapsulation module;

[0014] The data encapsulation module is also used to encapsulate the handshake data and output the encapsulated handshake data to the control unit.

[0015] The control unit is also used to parse the encapsulated handshake data and output feedback data corresponding to the encapsulated handshake data to the data encapsulation module;

[0016] The data encapsulation module is also used to encapsulate the feedback data and output the encapsulated feedback data to the audio playback device through the differential signal communication module to complete the handshake communication.

[0017] The control unit is specifically used to determine the target configuration information based on the encapsulated handshake data and read the target configuration information from the memory.

[0018] Optionally, the data encapsulation module is specifically used to modify the operating parameters of the data encapsulation module according to the sub-configuration information corresponding to the data encapsulation module in the target configuration information;

[0019] The differential signal communication module is further configured to modify the operating parameters of the differential signal communication module according to the sub-configuration information corresponding to the differential signal communication module in the target configuration information sent by the data encapsulation module;

[0020] The protocol conversion module is also used to modify the operating parameters of the protocol conversion module according to the sub-configuration information corresponding to the protocol conversion module in the target configuration information sent by the data encapsulation module;

[0021] The audio processing module is also used to modify the operating parameters of the audio processing module according to the sub-configuration information corresponding to the audio processing module in the target configuration information sent by the data encapsulation module.

[0022] Optionally, the data encapsulation module is specifically used to identify the data type of the received digital signal, and encapsulate the data of each data type according to the current configuration information and output them to the control unit, the differential signal communication module and / or the protocol conversion module;

[0023] The data types include command interaction data types, control data types, and audio data types.

[0024] Optionally, the differential signal communication module is a low-voltage differential signal module;

[0025] The control unit is also configured to output configuration information corresponding to the interface type of the audio playback device to the low voltage differential signal module through the data encapsulation module, according to the interface type of the audio playback device.

[0026] The low-voltage differential signal module is also used to adjust the electrical parameters of the low-voltage differential signal module, including the common-mode level and differential amplitude of the low-voltage differential signal module.

[0027] Optionally, the protocol conversion module is further configured to convert received audio data into a data stream of the integrated circuit's built-in audio format, convert received control data into a data stream of the integrated circuit format, and output the converted data streams to the audio processing module respectively.

[0028] Optionally, the audio processing module includes a digital-to-analog converter unit;

[0029] The audio processing module is used to convert the data stream of the integrated circuit built-in audio format output by the protocol conversion module into the analog audio signal through the digital-to-analog conversion unit;

[0030] The audio processing module is also used to control the state of the output analog audio signal based on the data stream in the integrated circuit format output by the protocol conversion module.

[0031] Optionally, the audio processing module is also used to connect to the audio input device;

[0032] The audio processing module is also used to receive the input audio output by the audio input device, convert the input audio into a digital audio signal, and output the digital audio signal to the protocol conversion module;

[0033] The protocol conversion module is also used to convert the format of the digital audio signal and output the format-converted digital audio signal to the data encapsulation module.

[0034] The data encapsulation module is also used to encapsulate the format-converted digital audio signal and output the encapsulated digital audio signal to the audio playback device through the differential signal communication module.

[0035] Optionally, the audio decoding chip further includes a trigger processing module;

[0036] The first end of the trigger processing module is connected to the control unit, and the second end of the trigger processing module is used to connect to the playback unit;

[0037] The trigger processing module is used to identify trigger operations for the playback unit, generate trigger instructions based on the trigger operations, and forward the trigger instructions to the control unit.

[0038] Optionally, the control unit is further configured to generate corresponding command data according to the trigger instruction, and output the command data to the data encapsulation module;

[0039] The data encapsulation module is also used to encapsulate the command data and output the encapsulated command data to the audio playback device through the differential signal communication module.

[0040] The beneficial effects of the embodiments of this application include:

[0041] This application provides an audio decoding chip, which includes a differential signal communication module, a data encapsulation module, a protocol conversion module, an audio processing module, and a control unit. The differential signal communication module is connected to the data encapsulation module, the data encapsulation module is connected to both the protocol conversion module and the control unit, and the protocol conversion module is connected to the audio processing module.

[0042] This chip integrates a differential signal communication module, a data encapsulation module, a protocol conversion module, an audio processing module, and a control unit. The protocol conversion module can convert audio data to the integrated circuit's built-in audio bus format and control data to the integrated circuit bus format. Furthermore, the audio processing module can convert the data output from the protocol conversion module into analog audio signals. This allows for the integration of multiple functions into a single chip, improving its overall integration density.

[0043] In addition, the control unit can send the target configuration information corresponding to the interface type of the audio playback device to the data encapsulation module. The data encapsulation module then forwards the configuration information corresponding to other modules within this target configuration information to the other modules, thereby configuring the data encapsulation module, differential signal communication module, protocol conversion module, and audio processing module according to the target configuration information. Since this target configuration information corresponds to the interface type of the audio playback device, configuring each module according to this target configuration information ensures that each module can adapt to the interface type of the audio playback device and reliably and correctly transmit data with it.

[0044] Understandably, since the control unit can write configuration information corresponding to different interface types into each module, that is, different configurations can be made for each model when the interface type of the audio playback device is different. This ensures that the chip can be adapted to audio playback devices with different interface types without changing the hardware structure of the chip.

[0045] This can improve the integration and compatibility of the chip. Attached Figure Description

[0046] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0047] Figure 1 This is a schematic diagram of the structure of the first audio decoding chip provided in the embodiments of this application;

[0048] Figure 2 This is a schematic diagram of the structure of the second type of audio decoding chip provided in the embodiments of this application;

[0049] Figure 3 This is a schematic diagram of the structure of the third type of audio decoding chip provided in the embodiments of this application;

[0050] Figure 4 This is a schematic diagram of the structure of the fourth audio decoding chip provided in the embodiments of this application;

[0051] Figure 5 This is a schematic diagram of the structure of the fifth audio decoding chip provided in the embodiments of this application;

[0052] Figure 6 This is a schematic diagram of the structure of the sixth audio decoding chip provided in the embodiments of this application. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0054] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0055] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0056] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0057] In related technologies, a typical playback unit requires a chip for parsing data protocols and another chip for converting the audio data output by the playback device. This converts the digital signal from the playback device into an analog signal, which is then played back as sound. Furthermore, peripheral circuits are needed between the various chips in the playback unit to handle button commands and perform signal electrical conversions. However, these solutions require designing multiple chips with different functions and numerous peripheral circuits. Additionally, since audio playback devices may provide interfaces such as Type-C, Lightning, or other interfaces compatible with the I2S protocol, the solutions require hardware structure adjustments for different interfaces. Therefore, this approach suffers from poor integration and adaptability.

[0058] To address this, embodiments of this application provide an audio decoding chip. By incorporating a differential signal communication module, a data encapsulation module, a protocol conversion module, an audio processing module, and a control unit within the audio decoding chip, the differential signal communication module is connected to the data encapsulation module. The data encapsulation module is connected to both the control unit and the protocol conversion module. The protocol conversion module is connected to the audio processing module, thereby improving the chip's integration and adaptability.

[0059] This application uses an audio decoding chip applied in an external accessory as an example for illustration. However, it does not imply that this application's embodiments can only be applied to audio decoding in external accessories.

[0060] The audio decoding chip provided in the embodiments of this application will be explained in detail below.

[0061] Figure 1 A schematic diagram of the structure of an audio decoding chip provided in this application. See also... Figure 1 This application provides an audio decoding chip, which includes a differential signal communication module 101, a data encapsulation module 102, a protocol conversion module 103, an audio processing module 104, and a control unit 105.

[0062] The differential signal communication module 101 is connected to the data encapsulation module 102. The data encapsulation module 102 is connected to the control unit 105 and the protocol conversion module 103 respectively. The protocol conversion module 103 is connected to the audio processing module 104.

[0063] Specifically, see Figure 2 The first and second terminals of the differential signal communication module 101 are connected to the first and second terminals of the data encapsulation module 102, respectively. The third and fourth terminals of the differential signal communication module 101 are used to connect to an audio playback device. The third and fourth terminals of the data encapsulation module 102 are connected to the first and second terminals of the control unit 105, respectively. The fifth terminal of the data encapsulation module 102 is connected to the first terminal of the protocol conversion module 103. The second and third terminals of the protocol conversion module 103 are connected to the first and second terminals of the audio processing module 104, respectively. The third terminal of the audio processing module 104 is used to connect to a playback unit.

[0064] The differential signal communication module 101 is used to convert the received analog signal into a digital signal and output it. The control unit 105 is used to acquire target configuration information corresponding to the audio playback device and send the target configuration information to the data encapsulation module 102 so as to configure the data encapsulation module 102 according to the target configuration information.

[0065] The data encapsulation module 102 is used to configure the differential signal communication module 101, the protocol conversion module 103, and the audio processing module 104 according to the target configuration information. The data encapsulation module 102 is also used to classify, encapsulate, and forward the received digital data after configuration.

[0066] The protocol conversion module 103 is used to convert the received data according to its data type format after configuration and output the converted data to the audio processing module 104. The audio processing module 104 is used to convert the audio data output by the protocol conversion module 103 into an analog audio signal after configuration and output the analog audio signal to the playback unit.

[0067] Optionally, the differential signal communication module 101 may be a low-voltage differential signaling (LVDS) module.

[0068] The differential signal communication module 101 can convert received signals or data into signals or data with specific parameters according to the configuration.

[0069] For example, the audio playback device can be a mobile phone, MP3 player, computer, tablet computer, or other device capable of outputting audio data. The audio interface of the audio playback device can be a Lightning interface, a Type-C interface, a Type-A interface, or other interfaces that may use differential input signal types for data transmission.

[0070] However, the Lightning and Type-C interfaces use different electrical parameters when transmitting data. For example, the Type-C interface operates at a voltage level of 0-3.3V, which means its electrical parameters are a 1.65V differential common-mode voltage and a 3.3V amplitude.

[0071] The Lightning interface requires two sets of voltage levels for communication: 200mV to 600mV and 300mV to 500mV.

[0072] Specifically, the Type-C interface receives signals with a difference of 200mV, and transmits signals from 0 to 3.3V. The Lightning interface receives signals with a value of 50mV, and transmits signals with an output amplitude of either 400mV or 200mV.

[0073] Generally, Type-C and Type-A interfaces can use the same electrical parameters when transmitting data. However, under special circumstances, the Type-A interface can also transmit data using electrical parameters that are greater than or less than those of the Type-C interface. For example, the voltage level of the Type-A interface can be 0-5V. This application does not limit this.

[0074] In addition, due to the characteristics of the Type-A interface, it is often used in devices such as computers and televisions, while the Lightning and Type-C interfaces are more commonly used in devices such as mobile phones, MP3 players, and tablets.

[0075] In this way, the received signals or data can be converted into corresponding electrical parameters depending on the configuration of the differential signal communication module 101.

[0076] Optionally, the target configuration information is used to indicate configuration parameters that match the interface type of the audio playback device.

[0077] The target configuration information may refer to the configuration information written in advance into the memory of the chip. The target configuration information may correspond to the interface type of the audio playback device and / or the interface type of the external accessory. The target configuration information may also be the configuration information corresponding to any interface. This application embodiment does not limit this.

[0078] For example, if the accessory or device on which the chip is installed has only one Lightning interface, then the chip's memory can store only the configuration information corresponding to the Lightning interface. If the accessory or device on which the chip is installed has one Lightning interface and one Type-C interface, then the chip's memory can store the configuration information corresponding to one Lightning interface and one Type-C interface respectively.

[0079] It is understood that if the accessory or device on which the chip is installed has a Type-A interface, the chip's memory can also store the configuration information of the Type-A interface, and this application embodiment does not limit this.

[0080] In addition, when sending the target configuration information to the data encapsulation module 102, the control unit 105 can package the configuration information used to configure different modules into a data block and send each data block to the data encapsulation module 102.

[0081] After receiving the target configuration information, the data encapsulation module 102 can configure itself according to the data blocks in the target configuration information used to configure the data encapsulation module 102. It can also forward the data blocks in the target configuration information used to configure other modules to the corresponding modules to configure other modules.

[0082] In addition, the data encapsulation module 102 can receive data sent by the audio playback device, the control unit 105 and other modules, and can also forward the received data to other modules. Therefore, the data encapsulation module 102 needs to classify and encapsulate the received digital data and / or digital signals. This ensures that the data encapsulation module 102 can accurately forward the data and / or signals to the corresponding modules.

[0083] Optionally, the data type may include command interaction data type, control data type, and audio data type.

[0084] The data in the command interaction data type can refer to the data sent by the audio playback device to the control unit 105, and the data sent by the control unit 105 to the audio playback device.

[0085] The data of the control data type can refer to the data output by the control unit 105 used to control other modules.

[0086] The data in the audio data type can refer to data that can be converted into audio.

[0087] Optionally, the protocol conversion module 103 can be used to convert received control data into data in the Inter-Integrated Circuit (I2C) format, and can also be used to convert received audio data into data in the Inter-IC Sound (I2S) format.

[0088] In this way, it can be ensured that the data output to the audio processing module 104 can be accurately recognized and processed by the audio processing module 104, thereby ensuring that the audio data output to the audio processing module 104 can be accurately converted into analog audio signals for output by the playback unit.

[0089] The playback unit can refer to a speaker or horn in an external accessory. This external accessory can be a device such as headphones or an audio system.

[0090] It is worth noting that this chip integrates a differential signal communication module 101, a data encapsulation module 102, a protocol conversion module 103, an audio processing module 104, and a control unit 105. The protocol conversion module 103 can convert audio data to I2S format and control data to I2C format. Furthermore, the audio processing module 104 can convert the I2S format data output by the protocol conversion module 103 into analog audio signals. This allows for the integration of multiple functions into a single chip, improving its overall integration level.

[0091] Furthermore, since the control unit 105 can write configuration information corresponding to different interface types into each module, that is, different configurations can be applied to each model when the interface type of the audio playback device is different. This ensures that the chip can adapt to audio playback devices with different interface types without changing the chip's hardware structure. Thus, the chip's adaptability is improved.

[0092] In this embodiment, a differential signal communication module 101, a data encapsulation module 102, a protocol conversion module 103, an audio processing module 104, and a control unit 105 are provided in the audio decoding chip. The differential signal communication module 101 is connected to the data encapsulation module 102, the data encapsulation module 102 is connected to the protocol conversion module 103 and the control unit 105 respectively, and the protocol conversion module 103 is connected to the audio processing module 104.

[0093] Because this chip integrates a differential signal communication module 101, a data encapsulation module 102, a protocol conversion module 103, an audio processing module 104, and a control unit 105, audio data can be converted to I2S format data and control data can be converted to I2C format data via the protocol conversion module 103. Furthermore, the audio processing module 104 can convert the I2S format data output by the protocol conversion module 103 into analog audio signals. This achieves the goal of integrating multiple functions into a single chip, thereby improving the chip's integration level.

[0094] In addition, the control unit 105 can send target configuration information corresponding to the interface type of the audio playback device to the data encapsulation module 102, and the data encapsulation module 102 can forward the configuration information corresponding to other modules in the target configuration information to other modules, so as to configure the data encapsulation module 102, differential signal communication module 101, protocol conversion module 103, and audio processing module 104 according to the target configuration information. Since the target configuration information corresponds to the interface type of the audio playback device, after configuring each module according to the target configuration information, it can be ensured that each module can adapt to the interface type of the audio playback device and reliably and correctly transmit data with the audio playback device.

[0095] It is understandable that since the control unit 105 can write configuration information corresponding to different interface types into each module, that is, different configurations can be made for each model when the interface type of the audio playback device is different. This ensures that the chip can be adapted to audio playback devices with different interface types without changing the hardware structure of the chip.

[0096] This can improve the integration and compatibility of the chip.

[0097] In one possible implementation, the differential signal communication module 101 is further configured to receive handshake data sent by the audio playback device when the differential signal communication module 101 is connected to the audio playback device, and output the handshake data to the data encapsulation module 102.

[0098] The data encapsulation module 102 is also used to encapsulate the handshake data and output the encapsulated handshake data to the control unit 105.

[0099] The control unit 105 is also used to parse the encapsulated handshake data and output feedback data corresponding to the encapsulated handshake data to the data encapsulation module 102.

[0100] The data encapsulation module 102 is also used to encapsulate the feedback data and output the encapsulated feedback data to the audio playback device through the differential signal communication module 101 to complete the handshake communication.

[0101] The control unit 105 is specifically used to determine the target configuration information based on the encapsulated handshake data and read the target configuration information from the memory.

[0102] Optionally, the handshake data may refer to the data sent by the audio playback device when the differential signal communication module 101 or the external accessory on which the chip is installed is connected to the audio playback device to confirm whether data interaction and data transmission can be performed with the chip or the external accessory.

[0103] For example, the handshake data may include the output and input parameters of the audio playback device, as well as the interface type of the audio playback device, which is not limited in this embodiment.

[0104] Encapsulating the handshake data can refer to the operation of packaging the handshake data into a data packet.

[0105] Optionally, the feedback data may be data generated by the control unit 105 after parsing the encapsulated handshake data, used for handshake confirmation with the audio playback device.

[0106] For example, the feedback data may include the operating parameters required for the chip to run, and the feedback parameters may also include the chip's output parameters and input parameters, as well as the interface types that the chip can support. This application embodiment does not limit this.

[0107] It is worth noting that since the handshake data and the packaged handshake data can indicate information such as the output parameters, input parameters, and interface type of the audio playback device, the control unit 105 can determine whether data transmission and interaction with the audio playback device are possible based on the packaged handshake data. If interaction is confirmed, target configuration information matching the interface type of the audio playback device can be read from the memory to ensure that the chip can correctly interact with the audio playback device, thereby ensuring that the audio data output by the audio playback device can be accurately converted into analog audio signals for playback.

[0108] In one possible implementation, the data encapsulation module 102 is specifically used to modify the operating parameters of the data encapsulation module 102 according to the sub-configuration information corresponding to the data encapsulation module 102 in the target configuration information.

[0109] The differential signal communication module 101 is also used to modify the operating parameters of the differential signal communication module 101 according to the sub-configuration information corresponding to the differential signal communication module 101 in the target configuration information sent by the data encapsulation module 102.

[0110] Protocol conversion module 103 is also used to modify the operating parameters of protocol conversion module 103 according to the sub-configuration information corresponding to protocol conversion module 103 in the target configuration information sent by data encapsulation module 102.

[0111] The audio processing module 104 is also used to modify the operating parameters of the audio processing module 104 according to the sub-configuration information corresponding to the audio processing module 104 in the target configuration information sent by the data encapsulation module 102.

[0112] Optionally, each sub-configuration information refers to the information in the target configuration information used to configure each module, that is, each sub-configuration information corresponds to a data block used to configure other modules.

[0113] These operating parameters may include parameters such as the output level, level amplitude, and output timing of each module, as well as the operating strategy of each module.

[0114] For example, the sub-configuration information corresponding to the data encapsulation module 102 in the target configuration information can be used to instruct the data encapsulation module 102 on the strategy of identifying data types. For example, it can instruct the data encapsulation module 102 to classify which data as command interaction data types, which data as control data types, and which data as audio data types.

[0115] For example, the sub-configuration information corresponding to the differential signal communication module 101 in the target configuration information can be used to indicate the electrical parameters that the differential signal communication module 101 needs to use when transmitting data.

[0116] For example, the sub-configuration information corresponding to the protocol conversion module 103 in the target configuration information can indicate which data the protocol conversion module 103 needs to convert to I2S format and which data needs to be converted to I2C format.

[0117] For example, the sub-configuration information corresponding to the audio processing module 104 in the target configuration information can indicate which data the audio processing module 104 needs to convert into analog audio signals.

[0118] In this way, after configuring each module based on the target configuration information, it can be ensured that each module or the chip can interact with the audio playback device correctly and reliably, and correctly convert the analog signal output by the audio playback device into an analog audio signal for playback.

[0119] In one possible implementation, the data encapsulation module 102 is specifically used to identify the data type of the received digital signal, and encapsulate the data of each data type according to the current configuration information and output them to the control unit 105, the differential signal communication module 101 and / or the protocol conversion module 103.

[0120] For example, the data encapsulation module 102 can forward the command interaction data type signal or data output by the audio playback device through the differential signal communication module 101 to the control unit 105, and forward the command interaction data type signal or data output by the control unit 105 to the audio playback device through the differential signal communication module 101.

[0121] The data encapsulation module 102 can also forward audio data output by the differential signal communication module 101 to the protocol conversion module 103, and forward audio data output by the protocol conversion module 103 to the differential signal communication module 101.

[0122] The data encapsulation module 102 can also forward control data of the type output by the control unit 105 to the module that the control unit 105 needs to control. This application embodiment does not limit this aspect.

[0123] This ensures that the modules within the chip can achieve fast and accurate data interaction or data transmission, thus guaranteeing the chip's availability.

[0124] In one possible implementation, the differential signal communication module 101 is a low-voltage differential signal module 1011.

[0125] The control unit 105 is also used to output configuration information corresponding to the interface type of the audio playback device to the low voltage differential signal module 1011 through the data encapsulation module 102, according to the interface type of the audio playback device.

[0126] The low-voltage differential signal module 1011 is also used to adjust the electrical parameters of the low-voltage differential signal module 1011.

[0127] Specifically, the low voltage differential signal module 1011 can adjust its electrical parameters under the action of the control unit 105, or it can adjust its electrical parameters under the action of signals, information and parameters input from other external devices, equipment and units.

[0128] For example, the low voltage differential signal module 1011 can also adjust its electrical parameters upon receiving data input from the audio playback device, but this application embodiment does not limit this.

[0129] Optionally, the electrical parameters include the common-mode level and differential amplitude of the low-voltage differential signal module 1011.

[0130] In this way, the control unit 105 can send different configuration information to the low-voltage differential signal module 1011 via the data encapsulation module 102 to configure the low-voltage differential signal module 1011 differently. This ensures that the low-voltage differential signal module 1011 can accurately receive data or signals output by the audio playback device and accurately output data or signals to the audio playback device. This ensures that the chip is suitable for data transmission or data interaction with different interface types without requiring adjustments to the chip's hardware structure, thereby improving the chip's adaptability.

[0131] In one possible implementation, the protocol conversion module 103 is further configured to convert received audio data type data into I2S format data stream, convert received control data type data into I2 format data stream, and output the converted data streams to the audio processing module 104 respectively.

[0132] This ensures that the chip supports the I2S standard audio protocol and the I2C control protocol, thereby ensuring the chip's availability.

[0133] In one possible implementation, see [link to relevant documentation]. Figure 3 The audio processing module 104 includes a digital-to-analog converter unit 1041.

[0134] The audio processing module 104 is used to convert the I2S format data stream output by the protocol conversion module 103 into the analog audio signal through the digital-to-analog conversion unit 1041.

[0135] The audio processing module 104 is also used to control the output state of the analog audio signal based on the I2C format data stream output by the protocol conversion module 103.

[0136] Optionally, the digital-to-analog conversion unit 1041 may be a digital-to-analog converter (DAC).

[0137] In addition, this I2C format data stream can be used to control the state of the output analog audio signal. The state of the output analog audio signal refers to the state of audio playback, which can specifically control the volume of the audio, pause playback, and / or start playback.

[0138] In this way, the analog audio signal can be output based on the I2S standard audio protocol, and the state of the output analog audio signal can be controlled based on the I2C control protocol, thus ensuring the practicality of the chip.

[0139] In one possible implementation, the audio processing module 104 is also used to connect an audio input device.

[0140] The audio processing module 104 is also used to receive the input audio output by the audio input device, convert the input audio into a digital audio signal, and output the digital audio signal to the protocol conversion module 103.

[0141] The protocol conversion module 103 is also used to convert the format of the digital audio signal and output the converted digital audio signal to the data encapsulation module 102.

[0142] The data encapsulation module 102 is also used to encapsulate the digital audio signal after the format conversion, and output the encapsulated digital audio signal to the audio playback device through the differential signal communication module 101.

[0143] Optionally, the input audio may refer to an audio signal input by the user through the audio input device, and the input audio may be an analog signal.

[0144] The audio input device can be a microphone, a microphone, or other similar device. That is, the audio input device can be integrated with the playback unit in the same external accessory, or it can be located in a dedicated external accessory for outputting the input audio to the chip. This application does not limit this aspect.

[0145] In this way, the input audio entered by the user through the audio input device can be sent to the audio playback device for playback, forwarding or processing.

[0146] In one possible way, see Figure 4 The audio processing module 104 also includes an analog-to-digital converter unit 1042.

[0147] The analog-to-digital converter 1042 is used to convert the input audio into a digital audio signal.

[0148] This ensures that the audio input from the user via an external audio input device can be converted into a digital audio signal for the chip or the audio playback device to recognize and process.

[0149] In one possible implementation, see [link to relevant documentation]. Figure 5 The audio decoding chip also includes a trigger processing module 106.

[0150] The first end of the trigger processing module 106 is connected to the control unit 105, and the second end of the trigger processing module 106 is used to connect to the playback unit.

[0151] The trigger processing module 106 is used to identify the trigger operation for the playback unit, generate a trigger command based on the trigger operation, and forward the trigger command to the control unit 105.

[0152] Optionally, the trigger processing module 106 can be a button module, which can provide at least one button. When the user presses a button in the trigger processing module 106, the trigger processing module 106 can output a corresponding electrical signal, i.e., the trigger command, according to the button pressed by the user.

[0153] For example, the trigger processing module 106 may be equipped with a button for increasing the volume of the analog audio signal. After the user presses this button, the trigger processing module 106 can generate a trigger command for increasing the playback volume.

[0154] In this way, users can control the chip, the external accessory, and the audio playback device through the trigger processing module 106.

[0155] In one possible implementation, the control unit 105 is also used to generate corresponding command data according to the trigger instruction and output the command data to the data encapsulation module 102.

[0156] The data encapsulation module 102 is also used to encapsulate the command data and output the encapsulated command data to the audio playback device through the differential signal communication module 101.

[0157] Optionally, the command data can be data of a command interaction data type. This command data can be used to feed back trigger commands input by the user through the trigger processing module 106 to the audio playback device.

[0158] After the audio playback device receives the packaged command data, it can output corresponding command interaction data to the chip. Then, the control unit 105 generates control data based on the data output by the audio playback device to control the state of the output analog audio signal, so as to adjust the state of the audio playback. Specifically, it can control the volume of the audio playback, pause the audio playback, and / or start the audio playback.

[0159] In this way, the state of the output analog audio signal can be controlled based on the trigger command.

[0160] In one possible way, see Figure 6 The chip may also include memory 107.

[0161] The memory 107 is connected to the control unit 105.

[0162] Optionally, the memory 107 may store configuration information corresponding to at least one interface type.

[0163] Generally, if the external accessory equipped with the chip has only one type of interface, the memory 107 can store only the configuration information corresponding to that type. If the external accessory equipped with the chip has multiple types of interfaces, the configuration information corresponding to all multiple types can be stored in the memory 107. The specific configuration can be adjusted according to actual needs, and this embodiment does not limit this.

[0164] This application also protects an external accessory that includes the audio decoding chip provided in any of the above embodiments.

[0165] It should be noted that the beneficial effects and working principle of this external accessory can be found in the descriptions of the other embodiments above, and will not be repeated in this application.

[0166] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0167] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An audio decoding chip, characterized in that, The audio decoding chip includes a differential signal communication module, a data encapsulation module, a protocol conversion module, an audio processing module, and a control unit; The differential signal communication module is connected to the data encapsulation module, the data encapsulation module is connected to the control unit and the protocol conversion module respectively, and the protocol conversion module is connected to the audio processing module; The differential signal communication module is used to convert the received analog signal into a digital signal and output it; the control unit is used to acquire target configuration information corresponding to the audio playback device and send the target configuration information to the data encapsulation module to configure the data encapsulation module according to the target configuration information. The data encapsulation module is used to configure the differential signal communication module, the protocol conversion module, and the audio processing module according to the target configuration information, wherein the target configuration information is used to indicate configuration parameters that match the interface type of the audio playback device; The data encapsulation module is also used to classify, encapsulate, and forward the received digital data after configuration. The protocol conversion module is used to convert the received data according to the data type format after configuration and output the converted data to the audio processing module; the audio processing module is used to convert the audio data output by the protocol conversion module into an analog audio signal after configuration and output the analog audio signal to the playback unit.

2. The audio decoding chip as described in claim 1, characterized in that, The differential signal communication module is also used to receive handshake data sent by the audio playback device when the differential signal communication module is connected to the audio playback device, and output the handshake data to the data encapsulation module; The data encapsulation module is also used to encapsulate the handshake data and output the encapsulated handshake data to the control unit. The control unit is also used to parse the encapsulated handshake data and output feedback data corresponding to the encapsulated handshake data to the data encapsulation module; The data encapsulation module is also used to encapsulate the feedback data and output the encapsulated feedback data to the audio playback device through the differential signal communication module to complete the handshake communication. The control unit is specifically used to determine the target configuration information based on the encapsulated handshake data and read the target configuration information from the memory.

3. The audio decoding chip as described in claim 1, characterized in that, The data encapsulation module is specifically used to modify the working parameters of the data encapsulation module according to the sub-configuration information corresponding to the data encapsulation module in the target configuration information; The differential signal communication module is further configured to modify the operating parameters of the differential signal communication module according to the sub-configuration information corresponding to the differential signal communication module in the target configuration information sent by the data encapsulation module; The protocol conversion module is also used to modify the operating parameters of the protocol conversion module according to the sub-configuration information corresponding to the protocol conversion module in the target configuration information sent by the data encapsulation module; The audio processing module is also used to modify the operating parameters of the audio processing module according to the sub-configuration information corresponding to the audio processing module in the target configuration information sent by the data encapsulation module.

4. The audio decoding chip as described in claim 1, characterized in that, The data encapsulation module is specifically used to identify the data type of the received digital signal, and encapsulate the data of each data type according to the current configuration information and output them to the control unit, the differential signal communication module and / or the protocol conversion module; The data types include command interaction data types, control data types, and audio data types.

5. The audio decoding chip as described in claim 1, characterized in that, The differential signal communication module is a low-voltage differential signal module; The control unit is also configured to output configuration information corresponding to the interface type of the audio playback device to the low voltage differential signal module through the data encapsulation module, according to the interface type of the audio playback device. The low-voltage differential signal module is also used to adjust the electrical parameters of the low-voltage differential signal module, including the common-mode level and differential amplitude of the low-voltage differential signal module.

6. The audio decoding chip as described in claim 1, characterized in that, The protocol conversion module is also used to convert received audio data type data into a data stream of the integrated circuit's built-in audio format, convert received control data type data into a data stream of the integrated circuit format, and output the converted data streams to the audio processing module respectively.

7. The audio decoding chip as described in claim 1, characterized in that, The audio processing module includes a digital-to-analog conversion unit; The audio processing module is used to convert the data stream of the integrated circuit built-in audio format output by the protocol conversion module into the analog audio signal through the digital-to-analog conversion unit; The audio processing module is also used to control the state of the output analog audio signal based on the data stream in the integrated circuit format output by the protocol conversion module.

8. The audio decoding chip according to any one of claims 1-7, characterized in that, The audio processing module is also used to connect an audio input device; The audio processing module is also used to receive the input audio output by the audio input device, convert the input audio into a digital audio signal, and output the digital audio signal to the protocol conversion module; The protocol conversion module is also used to convert the format of the digital audio signal and output the format-converted digital audio signal to the data encapsulation module. The data encapsulation module is also used to encapsulate the format-converted digital audio signal and output the encapsulated digital audio signal to the audio playback device through the differential signal communication module.

9. The audio decoding chip according to any one of claims 1-7, characterized in that, The audio decoding chip also includes a trigger processing module; The first end of the trigger processing module is connected to the control unit, and the second end of the trigger processing module is used to connect to the playback unit; The trigger processing module is used to identify trigger operations for the playback unit, generate trigger instructions based on the trigger operations, and forward the trigger instructions to the control unit.

10. The audio decoding chip as described in claim 9, characterized in that, The control unit is also used to generate corresponding command data according to the trigger instruction, and output the command data to the data encapsulation module; The data encapsulation module is also used to encapsulate the command data and output the encapsulated command data to the audio playback device through the differential signal communication module.

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