Transfer device, transfer system and transfer method

Abstract

The present application relates to a kind of transfer device, transfer system and transfer method, wherein the transfer device has the box of multiple containing cavities, graphene movable part is provided in each containing cavity, and each containing cavity is covered with adhesive layer;During the chip transfer process, can make graphene movable part produce the same direction force as gravity under the irradiation of external laser photoelectric effect, move in the direction of gravity when the sum of force and gravity is greater than support force, to make the area of adhesive layer and graphene movable part fit occur deformation, reduce the contact area of light emitting chip and adhesive layer, to reduce the adhesion between light emitting chip and adhesive layer, when the adhesion between them is less than the gravity of light emitting chip, light emitting chip and adhesive layer separate, realize to peel off the light emitting chip adhered to adhesive layer in transfer device. Then the present application carries out chip transfer, does not need to press the transfer device and circuit backplate, so there will be no interference phenomenon, guarantee light emitting chip transfer success.

Description

Technical Field

[0001] This invention relates to the field of light-emitting diode technology, and in particular to a transfer device, transfer system and transfer method. Background Technology

[0002] Micro LED (Micro Light Emitting Diode Display) technology refers to a display technology that uses self-emissive, micrometer-sized LEDs as light-emitting pixel units, assembling them onto a driving panel to form a high-density LED array. In the field of Micro LED displays, the number of Micro LED chips transferred to the driving backplane is typically in the tens of thousands or higher.

[0003] In existing Micro LED chip transfer processes, a transfer head is used to transfer the light-emitting chip from a temporary substrate to a circuit backplane. During this process, after the existing transfer head picks up the light-emitting chip from the temporary substrate, the transfer head and the circuit backplane must be pressed together to ensure that the adhesion force on the lower surface of the light-emitting chip is greater than that on its upper surface for placement. If multiple transfers are required, the previously transferred light-emitting chips on the circuit backplane will interfere with the contact pressing process between the subsequent light-emitting chips and the circuit backplane, causing the subsequent light-emitting chips to fail to transfer successfully.

[0004] Therefore, how to provide a transfer method to avoid some light-emitting chips failing to be successfully transferred to the circuit backplane during the chip transfer process is an urgent problem to be solved. Summary of the Invention

[0005] In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to provide a transfer device, transfer system and transfer method, which aims to solve the technical problem that some light-emitting chips cannot be successfully transferred to the circuit backplane when using existing transfer heads for chip transfer.

[0006] A transfer device, comprising:

[0007] The housing has multiple spaced-apart cavities; each cavity is a hollow area extending from the bottom to the top of the housing, the top is configured to allow external laser light to pass through and irradiate into the cavity, and the bottom is a side opposite to the top.

[0008] Graphene movable components disposed within each of the aforementioned accommodating cavities;

[0009] An adhesive layer is disposed at the bottom of the housing and covers each of the receiving cavities, and the side of the adhesive layer facing away from the receiving cavity is configured to adhere a light-emitting chip.

[0010] Wherein, the gravity of the graphene moving part is less than the supporting force of the adhesive layer on the graphene moving part, and the graphene moving part is configured to generate a force in the same direction as gravity by undergoing photoelectric effect under external laser irradiation.

[0011] The aforementioned transfer device comprises a housing with multiple cavities, each containing a graphene movable component and covered with an adhesive layer. During chip transfer, the graphene movable component undergoes a photoelectric effect under external laser irradiation, generating a force in the same direction as gravity. When the sum of this force and gravity exceeds the supporting force, the component moves in the direction of gravity, causing deformation in the area of ​​the adhesive layer that adheres to the graphene movable component. This reduces the contact area between the light-emitting chip and the adhesive layer, thereby decreasing the adhesion between them. When the adhesive force is less than the weight of the light-emitting chip, the chip separates from the adhesive layer, thus peeling off the light-emitting chip adhered to the adhesive layer in the transfer device. Therefore, when using the transfer device provided in this application for chip transfer, it is not necessary to press the transfer device against the circuit backplane, thus avoiding interference and ensuring successful chip transfer.

[0012] Based on the same inventive concept, this application also provides a transfer system, including: a laser source and the transfer device as described above; the laser provided by the laser source irradiates the graphene movable element in the receiving cavity from the top of the housing.

[0013] The aforementioned transfer system utilizes a laser source to provide laser light to the graphene moving parts in the transfer device. Under laser irradiation, the graphene moving parts undergo a photoelectric effect, generating a force in the same direction as gravity. When the sum of this force and gravity exceeds the supporting force, the graphene moving parts move in the direction of gravity, causing deformation in the area of ​​the adhesive layer that adheres to the graphene moving parts. This reduces the contact area between the light-emitting chip and the adhesive layer, thereby decreasing the adhesion between them. When the adhesive force is less than the weight of the light-emitting chip, the chip separates from the adhesive layer, thus peeling the light-emitting chip adhered to the adhesive layer in the transfer device. Therefore, when using the transfer system provided in this application for chip transfer, it is not necessary to press the transfer device against the circuit backplane, thus avoiding interference and ensuring successful chip transfer.

[0014] Based on the same inventive concept, this application also provides a transfer method applicable to the transfer system described above, wherein the adhesive layer of the transfer device is adhered with a light-emitting chip; the transfer method includes:

[0015] The side of the circuit backplate with electrode pads is aligned with the side of the transfer device on which the light-emitting chip is attached.

[0016] The laser source provides a laser beam that irradiates the graphene movable component inside the cavity from the top of the housing. Under the irradiation of the laser, the graphene movable component undergoes a photoelectric effect, generating a force in the same direction as gravity. When the sum of the force and gravity is greater than the supporting force, the component moves in the direction of gravity, causing deformation in the area of ​​the adhesive layer that is in contact with the graphene movable component. This reduces the contact area between the light-emitting chip and the adhesive layer, thereby peeling off the light-emitting chip adhered to the adhesive layer.

[0017] The stripped-off light-emitting chip falls onto the circuit backplane.

[0018] The aforementioned transfer method utilizes the graphene moving component to move in the direction of gravity under laser irradiation, causing deformation in the area of ​​the adhesive layer that is in contact with the graphene moving component. This reduces the contact area between the light-emitting chip and the adhesive layer, allowing the light-emitting chip adhered to the adhesive layer to be peeled off, thereby transferring the light-emitting chip from the transfer device to the circuit backplane. Therefore, the transfer method provided in this application eliminates the need for the transfer device to contact the circuit backplane, preventing interference and ensuring successful transfer of the light-emitting chip. Attached Figure Description

[0019] Figure 1 This is a schematic diagram illustrating the chip transfer process using an existing transfer head.

[0020] Figure 2 This is a schematic diagram of the structure of the transfer device with the light-emitting chip attached in an embodiment of the present invention. Figure 1 ;

[0021] Figure 3 This is a schematic diagram of the structure of the transfer device with the light-emitting chip attached in an embodiment of the present invention. Figure 2 ;

[0022] Figure 4 This is a schematic diagram of the force distribution when the graphene moving part is irradiated by laser in an embodiment of the present invention;

[0023] Figure 5 This is a perspective view of a box body according to an embodiment of the present invention;

[0024] Figure 6 This is a cross-sectional view of a transfer device according to an embodiment of the present invention;

[0025] Figure 7 This is a top view of another type of housing in an embodiment of the present invention;

[0026] Figure 8 This is a cross-sectional view of another transfer device in an embodiment of the present invention;

[0027] Figure 9 This is a schematic diagram of the transfer system in an embodiment of the present invention;

[0028] Figure 10 This is a flowchart illustrating the transfer method in an embodiment of the present invention. Figure 1 ;

[0029] Figure 11 This is a flowchart illustrating the transfer method in an embodiment of the present invention. Figure 2 ;

[0030] Explanation of reference numerals in the attached figures:

[0031] 10-Box; 101-Cavity; 11-Graphene moving part; 12-Adhesive layer; 13-Transparent plate; 2-Laser source; 3-Light-emitting chip; F1-Supporting force of the adhesive layer on the graphene moving part; G-Gravity of the graphene moving part; F2-Force generated by the graphene moving part. Detailed Implementation

[0032] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0034] Micro LED (Micro Light Emitting Diode Display) technology refers to a display technology that uses self-emissive, micrometer-sized LEDs as light-emitting pixel units, assembling them onto a driving panel to form a high-density LED array. In the field of Micro LED displays, the number of Micro LED chips transferred to the driving backplane is typically in the tens of thousands or higher.

[0035] In existing Micro LED chip transfer processes, a transfer head is used to transfer the light-emitting chip from the temporary substrate to the circuit backplane. For example, such as... Figure 1As shown, the chip transfer process using a transfer head includes the following steps: S101, the transfer head has multiple red light-emitting chips attached, and the side of the transfer head with the red light-emitting chips attached is aligned with the circuit backplane. S102, external force is used to press the transfer head and the circuit backplane together, peeling the red light-emitting chips off the transfer head. S103, the transfer head is removed, leaving the peeled red light-emitting chips on the circuit backplane. S104, the transfer head has multiple blue light-emitting chips attached, and the side of the transfer head with the blue light-emitting chips attached is aligned with the circuit backplane with the multiple red light-emitting chips attached. S105, external force is used to press the transfer head and the circuit backplane together, peeling the blue light-emitting chips off the transfer head.

[0036] In this process, after the existing transfer head picks up the light-emitting chip from the temporary storage substrate, the transfer head and the circuit backplate must be pressed together to ensure that the adhesion force on the lower surface of the light-emitting chip is greater than that on its upper surface in order to achieve the placement purpose. If multiple transfers are required, the light-emitting chips transferred previously on the circuit backplate will interfere with the contact pressing process between the subsequent light-emitting chips and the circuit backplate, causing the subsequent light-emitting chips to fail to transfer successfully.

[0037] Therefore, this application aims to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in subsequent embodiments.

[0038] Embodiments of the present invention

[0039] This application provides a transfer device; please refer to [link / reference]. Figures 2 to 3 This transfer device includes at least:

[0040] The housing 10 has a plurality of spaced-apart cavities 101; each cavity 101 is a hollow area extending from the bottom to the top of the housing 10, the top is configured such that an external laser can pass through itself to irradiate into the cavity 101, and the bottom is the side opposite to the top.

[0041] Graphene movable parts 11 are disposed in each receiving cavity 101;

[0042] An adhesive layer 12 is provided at the bottom of the housing 10 and covers each receiving cavity 101. The side of the adhesive layer 12 facing away from the receiving cavity 101 is configured to adhere the light-emitting chip 3.

[0043] The graphene movable component 11 has a gravity less than the supporting force of the adhesive layer 12 on the graphene movable component 11. The graphene movable component 11 is configured to generate a force in the same direction as gravity by undergoing photoelectric effect under external laser irradiation. When the sum of the force and gravity is greater than the supporting force, it moves in the direction of gravity, so that the area of ​​the adhesive layer 12 that is attached to the graphene movable component 11 deforms, thereby reducing the contact area between the light-emitting chip 3 and the adhesive layer 12, so as to peel off the light-emitting chip 3 adhered to the adhesive layer 12.

[0044] In practical applications, when a laser is turned on and irradiates the cavity corresponding to the light-emitting chip to be transferred, the graphene moving part undergoes a photoelectric effect upon irradiation, ejecting electrons. The direction of electron ejection is opposite to the direction of laser irradiation (i.e., upward ejection). According to the principle of conservation of kinetic energy, the upward ejection of electrons generates a downward force on the graphene moving part. The force distribution on the graphene moving part when irradiated by a laser is as follows: Figure 4 As shown, F1 is the supporting force of the adhesive layer on the graphene moving part, G is the gravity of the graphene moving part, and F2 is the force generated by the graphene moving part. The magnitude of the force generated by the graphene moving part depends on the power of the laser; the greater the laser power, the greater the force generated by the graphene microsphere.

[0045] In this embodiment, the plurality of receiving cavities 101 in the housing 10 are arranged in an array, and the shape and / or size of each receiving cavity 101 may be the same. In practical applications, the spacing between adjacent receiving cavities 101 and the size of each receiving cavity 101 can be reasonably set according to the position distribution of the light-emitting chip 3 on the substrate and the size of the light-emitting chip 3. The cross-sectional shape of the receiving cavity 101 includes, but is not limited to, quadrilateral, hexagonal, octagonal, and circular shapes.

[0046] In this embodiment, the size of the graphene movable element 11 is smaller than the size of the receiving cavity 101. To allow for greater deformation in the area of ​​the adhesive layer that is in contact with the graphene movable element 11 when it moves vertically, the size of this portion of the graphene movable element 11 in contact with the adhesive layer can be set to be relatively smaller than the size of the substrate in the light-emitting chip. Furthermore, the shape of the graphene movable element 11 can be flexibly configured; for example, the graphene movable element 11 may include, but is not limited to, graphene spheres, graphene pillars, or graphene cones.

[0047] In this embodiment, the top of the housing 10 is configured such that an external laser beam passes through it and illuminates the receiving cavity 101. This means that only the area on the top of the housing 10 corresponding to the receiving cavity is translucent; the remaining areas on the top of the housing 10 may or may not be translucent. In practical applications, the area on the top of the housing 10 corresponding to the receiving cavity 101 can be a hole communicating with the receiving cavity 101, or it can be a transparent plate. The structure of the transfer device will be described in detail below through specific examples:

[0048] See one example. Figures 5 to 6 The housing 10 contains several accommodating cavities 101 arranged in an array. Each cavity 101 is a through-hole penetrating the bottom and top of the housing 10. All accommodating cavities 101 are of the same size and have a square cross-sectional shape. An adhesive layer 12 is provided on the bottom of the housing 10, covering the accommodating cavities 101. Graphene microspheres are placed inside each cavity 101. The housing 10 can be made of either a non-transparent or a transparent material. When the housing 10 is made of a transparent material, to prevent laser crosstalk between adjacent accommodating cavities 101, a light-shielding portion is provided on the inner wall of each cavity 101. This light-shielding portion can be a light-shielding film coated with one or more dark pigments such as black, gray, or brown. When the adhesive layer 12 on the housing 10 is at the bottom, the graphene microspheres adhere to the adhesive layer 12. Since the weight of the graphene microspheres is less than the supporting force of the adhesive layer 12 on the graphene microspheres, the adhesive layer 12 does not deform. Furthermore, a transparent plate 13 can be provided on the top of the housing 10 to cover each receiving cavity 101. This transparent plate 13 can be a transparent glass substrate, allowing external light to pass through and illuminate the graphene microspheres. Simultaneously, the housing 10 is made of a non-transparent material to prevent laser crosstalk between different receiving cavities 101. There are various ways to arrange the transparent plate 13 and the housing 10. As an example, the four side walls of the housing 10 have recessed L-shaped steps to form receiving grooves, and the transparent plate 13 is placed in these receiving grooves and fixed to the housing 10.

[0049] See one example. Figure 7 and Figure 8The housing 10 contains an array of several accommodating cavities 101. Each cavity 101 is a recess extending only through the bottom of the housing 10. All accommodating cavities 101 are of the same size and have a circular cross-sectional shape. The housing 10 is made of a transparent material to allow external laser light to reach the recesses from the top of the housing 10. Simultaneously, each cavity 101 has a light-shielding portion on its sidewall. This light-shielding portion can be a light-shielding film coated with one or more dark pigments such as black, gray, or brown to prevent laser crosstalk between adjacent accommodating cavities 101. An adhesive layer 12 is provided on the bottom of the housing 10, covering the accommodating cavities 101. Graphene pillars are placed within each cavity 101. When the adhesive layer 12 on the box 10 is at the bottom, the graphene pillar is attached to the adhesive layer 12. Since the weight of the graphene pillar is less than the supporting force of the adhesive layer 12 on the graphene pillar, the adhesive layer 12 does not deform at this time.

[0050] In this embodiment, the adhesive layer 12 can have high adhesive strength, such as double-sided tape, to facilitate the adhesion of the light-emitting chip. Furthermore, the adhesive layer 12 can also be elastic, giving it a certain degree of deformability, allowing it to deform appropriately under certain external forces. For example, the adhesive layer 12 can be a thermosensitive adhesive or polydimethylsiloxane (PDMS). When this adhesive layer 12 has both adhesiveness and elasticity, the reusability of the transfer transposition can be improved. For example, during chip transfer, after the light-emitting chip is peeled off from the transfer device and falls onto the circuit backplane, the laser source is turned off to stop irradiating the graphene moving parts. At this time, the graphene moving parts cannot generate force without laser irradiation. Since the supporting force of the adhesive layer on the graphene moving parts is greater than the gravity of the graphene moving parts, the graphene moving parts can move in the opposite direction of gravity, thereby restoring the area of ​​the adhesive layer that is in contact with the graphene moving parts to its undeformed shape.

[0051] The transfer device provided in this application comprises a housing with multiple cavities, each containing a graphene movable component and covered with an adhesive layer. During chip transfer, the graphene movable component undergoes a photoelectric effect under external laser irradiation, generating a force in the same direction as gravity. When the sum of this force and gravity exceeds the supporting force, the component moves in the direction of gravity, causing deformation in the area of ​​the adhesive layer that adheres to the graphene movable component. This reduces the contact area between the light-emitting chip and the adhesive layer, thereby decreasing the adhesion between them. When the adhesive force is less than the weight of the light-emitting chip, the chip separates from the adhesive layer, thus peeling off the light-emitting chip adhered to the adhesive layer in the transfer device. Therefore, when using the transfer device provided in this application for chip transfer, it is not necessary to press the transfer device against the circuit backplane, thus avoiding interference and ensuring successful chip transfer.

[0052] This application also provides a transfer system, such as Figure 9 As shown, this transfer system includes at least: a laser source 2 and any of the transfer devices described above; the laser provided by the laser source 2 irradiates the graphene moving parts inside the housing from the top of the housing.

[0053] In practical applications, when the adhesive layer 12 of the transfer device adheres to the light-emitting chip 3, and it is necessary to peel the light-emitting chip 3 from the transfer device and transfer it to the circuit backplane, the adhesive layer 12 of the transfer device faces downwards, and the laser source 2 is located above the transfer device. When using the transfer system provided in this application for chip transfer, the transfer device can pick up multiple light-emitting chips 3 arranged continuously on the substrate, selectively picking up the light-emitting chips 3 on the substrate relative to existing transfer heads. For example, if the picking spacing of the light-emitting chips 3 on the substrate needs to be greater than twice the size of the light-emitting chip to leave space for the other two colors of light-emitting chips, then this application can improve the utilization rate of the light-emitting chips on the substrate.

[0054] By selectively irradiating the transfer device with laser source 2, the graphene movable component 11 corresponding to the light-emitting chip 3 to be transferred is irradiated by the laser. Under laser irradiation, the graphene movable component 11 undergoes a photoelectric effect, generating a force in the same direction as gravity. When the sum of the force and gravity is greater than the supporting force, it moves in the direction of gravity, causing deformation in the area of ​​the adhesive layer 12 that is in contact with the graphene movable component 11. This reduces the contact area between the light-emitting chip 3 and the adhesive layer 12, thereby reducing the adhesion between them. When the adhesion force is less than the weight of the light-emitting chip 3, the light-emitting chip 3 separates from the adhesive layer 12, thus peeling the light-emitting chip 3 to be transferred from the transfer device. The peeled-off light-emitting chip 3 falls onto the circuit backplane. Since it is not necessary to press the transfer device against the circuit backplane, there will be no interference, thus ensuring successful transfer of the light-emitting chip.

[0055] The magnitude of the force generated by the graphene moving part 11 depends on the laser power; the greater the laser power, the greater the force generated by the graphene moving part 11. The laser power provided by the laser source 2 is relatively easy to control, and different laser powers can be set according to different colored light-emitting chips 3 to make the graphene moving part 11 generate an appropriate force and move downwards, causing the adhesive layer 12 to undergo appropriate deformation to peel off the different colored light-emitting chips 3. When this adhesive layer 12 also has elasticity, the entire transfer device can be reused repeatedly.

[0056] This application also provides a transfer method applicable to the transfer system described above, in which an adhesive layer of the transfer device adheres to a light-emitting chip; please refer to Figures 10 to 11 This transfer method includes at least the following steps:

[0057] S301. Align the side of the circuit backplate with the electrode pad with the side of the transfer device with the light-emitting chip attached.

[0058] S302. Using a laser source, the laser is irradiated from the top of the housing onto the graphene movable component inside the cavity. Under the irradiation of the laser, the graphene movable component undergoes a photoelectric effect, generating a force in the same direction as gravity. When the sum of the force and gravity is greater than the supporting force, it moves in the direction of gravity, causing the adhesive layer attached to the graphene movable component to deform, thereby reducing the contact area between the light-emitting chip and the adhesive layer, so as to peel off the light-emitting chip adhered to the adhesive layer.

[0059] S303, The stripped-off light-emitting chip fell onto the circuit backplane.

[0060] In this embodiment, before S301, when the side of the circuit backplate with the electrode pad is aligned with the side of the transfer device with the light-emitting chip attached, the following steps are also included:

[0061] S201. A substrate is provided, wherein the electrodes of a light-emitting chip are adhered to the substrate through a thermally descaling adhesive layer;

[0062] S202, Align the side of the substrate with the light-emitting chip attached with the side of the transfer device with the adhesive layer.

[0063] S203. Heat the substrate to peel the light-emitting chip off the substrate and transfer it to the transfer device.

[0064] In this embodiment, the light-emitting chip that was stripped off in S303 falls onto the circuit backplane, and then the process further includes:

[0065] S401. By turning off the laser source, the graphene moving part, without external laser irradiation, cannot generate force and moves in the opposite direction to gravity, so that the adhesive layer attached to the graphene moving part returns to its undeformed shape.

[0066] In practical applications, the adhesive layer in the transfer device can be elastic, the entire transfer device can be reused, and it can also be used to transfer light-emitting chips of different colors, including but not limited to red, green, and blue. For ease of understanding, the following example illustrates the transfer of two colors of light-emitting chips:

[0067] The substrate includes a first substrate on which a first light-emitting chip is adhered and a second substrate on which a second light-emitting chip is adhered, and the light-emitting colors of the first light-emitting chip and the second light-emitting chip are different from each other;

[0068] In S202 to S203 above, the side of the substrate with the light-emitting chip attached is aligned with the side of the transfer device with the adhesive layer; heating the substrate to peel the light-emitting chip off the substrate and transfer it to the transfer device includes:

[0069] The first substrate, the second substrate, and the transfer device are sequentially aligned and arranged, and the first substrate or the second substrate is heated so that the first light-emitting chip or the second light-emitting chip is transferred onto the transfer device.

[0070] In this example, the pickup stage involves using a transfer device to pick up multiple light-emitting chips arranged sequentially on a substrate; the placement stage involves selectively transferring the light-emitting chips from the transfer device. In practical applications, after the transfer device picks up multiple first light-emitting chips on the first substrate, multiple circuit backplanes can be provided. The first light-emitting chips on the transfer device are then selectively peeled off sequentially, so that all the first light-emitting chips on the transfer device are dispersed and transferred to the multiple circuit backplanes. After all the first light-emitting chips on the transfer device have been peeled off, the laser source is turned off, and the graphene moving part in the transfer device moves upward to restore the adhesive layer to its undeformed shape. The same transfer device is then used to pick up multiple first light-emitting chips on a second substrate, providing the aforementioned multiple circuit backplanes already carrying the first light-emitting chips. The second light-emitting chips on the transfer device are then selectively peeled off sequentially, so that all the second light-emitting chips on the transfer device are dispersed and transferred to the multiple circuit backplanes. After obtaining the multiple circuit backplanes carrying the first and second light-emitting chips, these circuit backplanes are heated respectively to bond the first and second light-emitting chips to the circuit backplanes.

[0071] The transfer method provided in this application does not require the transfer device to contact the circuit backplane, thus avoiding interference and ensuring successful transfer of the light-emitting chip.

[0072] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A transfer device, characterized in that, include: The housing has multiple spaced-apart cavities; each cavity is a hollow area extending from the bottom to the top of the housing, the top is configured to allow external laser light to pass through and irradiate into the cavity, and the bottom is a side opposite to the top. Graphene movable components disposed within each of the aforementioned accommodating cavities; An adhesive layer is disposed at the bottom of the housing and covers each of the receiving cavities, and the side of the adhesive layer facing away from the receiving cavity is configured to adhere a light-emitting chip. Wherein, the gravity of the graphene moving part is less than the supporting force of the adhesive layer on the graphene moving part, and the graphene moving part is configured to generate a force in the same direction as gravity by undergoing photoelectric effect under external laser irradiation.

2. The transfer device as claimed in claim 1, characterized in that, The adhesive layer is elastic.

3. The transfer device as described in claim 1 or 2, characterized in that, The receiving cavity is a through hole extending through the bottom and the top, and the transfer device further includes: A transparent plate is disposed on the top of the housing and covers each of the receiving cavities.

4. The transfer device as described in claim 3, characterized in that, The enclosure is made of a non-transparent material.

5. The transfer device as described in claim 1 or 2, characterized in that, The box is made of transparent material, the receiving cavity is a groove that runs through the bottom, and the side wall of the receiving cavity is provided with a light-shielding part.

6. The transfer device as described in claim 1 or 2, characterized in that, The graphene moving part is a graphene sphere, a graphene column, or a graphene cone.

7. A transfer system, characterized in that, include: A laser source and a transfer device as described in any one of claims 1-6; the laser provided by the laser source irradiates the graphene movable element within the receiving cavity from the top of the housing.

8. A transfer method, said transfer method being applicable to the transfer system as described in claim 7, characterized in that, The adhesive layer of the transfer device is adhered with a light-emitting chip; the transfer method includes: The side of the circuit backplate with electrode pads is aligned with the side of the transfer device on which the light-emitting chip is attached. The laser source provides a laser beam that irradiates the graphene movable component inside the cavity from the top of the housing. Under the irradiation of the laser, the graphene movable component undergoes a photoelectric effect, generating a force in the same direction as gravity. When the sum of the force and gravity is greater than the supporting force, the component moves in the direction of gravity, causing deformation in the area of ​​the adhesive layer that is in contact with the graphene movable component. This reduces the contact area between the light-emitting chip and the adhesive layer, thereby peeling off the light-emitting chip adhered to the adhesive layer. The stripped-off light-emitting chip falls onto the circuit backplane.

9. The transfer method as described in claim 8, characterized in that, The step of aligning the side of the circuit backplate with the electrode pad with the side of the transfer device with the light-emitting chip attached includes, prior to: A substrate is provided, wherein the electrodes of the light-emitting chip are adhered to the substrate by a thermally degradable adhesive layer; The side of the substrate to which the light-emitting chip is adhered is aligned with the side of the transfer device to which the adhesive layer is provided; The substrate is heated so that the light-emitting chip is peeled off from the substrate and transferred to the transfer device.

10. The transfer method as described in claim 9, characterized in that, The substrate includes a first substrate with a first light-emitting chip adhered to it and a second substrate with a second light-emitting chip adhered to it, and the light-emitting colors of the first light-emitting chip and the second light-emitting chip are different from each other. The step of aligning the side of the substrate with the light-emitting chip attached to the side of the transfer device with the adhesive layer, and heating the substrate to peel the light-emitting chip off the substrate and transfer it to the transfer device includes: The first substrate, the second substrate, and the transfer device are sequentially aligned and arranged, and the first substrate or the second substrate is heated to transfer the first light-emitting chip or the second light-emitting chip onto the transfer device.

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