Power amplification module

Abstract

A power amplification module is provided. The power amplification module includes: an output stage amplifier; a driver stage amplifier connected in cascade in front of the output stage amplifier; an input switch selectively connecting any one of a plurality of input signal paths with an input terminal of the driver stage amplifier; an output switch selectively connecting any one of a plurality of output signal paths with an output terminal of the output stage amplifier; an input matching circuit connecting the input switch with the driver stage amplifier; an inter-stage matching circuit connecting the driver stage amplifier with the output stage amplifier; an output matching circuit connecting the output stage amplifier with the output switch; and a control circuit controlling operations of the input switch, the driver stage amplifier, and the output stage amplifier, the input switch and the control circuit being integrated in a first IC chip.

Description

[0001] This application is a divisional application. The original application is an invention patent application filed on March 28, 2018, with application number 201810268282.1 and invention title "Power Amplifier Module". Technical Field

[0002] This invention relates to power amplifier modules. Background Technology

[0003] Against the backdrop of high-density installation of mobile communication terminals such as portable telephones, surface mounting of various components such as antenna switches, input switches, output switches, duplexers, power amplifiers, low-noise amplifiers, and matching circuits on the same wiring board is under development. Japanese Patent Application Publication No. 2014-207252 discloses a power amplifier module that includes a power amplifier, a control circuit for controlling the operation of the power amplifier, and an output switch that selectively connects any one of multiple output signal paths to the output terminal of the amplifier.

[0004] Prior art literature

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2014-207252 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] However, existing power amplifier modules suffer from complex wiring connections due to the separate wiring connections for various components mounted on the wiring board. Furthermore, if various components are densely mounted on the wiring board, it is difficult to ensure the isolation between input and output signals due to electromagnetic coupling and other factors.

[0009] Therefore, in view of such problems, the present invention aims to eliminate the complexity of individually wiring various components and to ensure sufficient isolation between input and output signals.

[0010] Technical solutions for solving the problem

[0011] To address the aforementioned issues, the power amplifier module of the present invention comprises: (i) an output stage amplifier; (ii) a driver stage amplifier cascaded before the output stage amplifier; (iii) an input switch selectively connecting one of a plurality of input signal paths to the input terminal of the driver stage amplifier; (iv) an output switch selectively connecting one of a plurality of output signal paths to the output terminal of the output stage amplifier; (v) an input matching circuit connecting the input switch to the driver stage amplifier; (vi) an inter-stage matching circuit connecting the driver stage amplifier to the output stage amplifier; (vii) an output matching circuit connecting the output stage amplifier to the output switch; and (viii) a control circuit controlling the operation of the input switch, the driver stage amplifier, and the output stage amplifier. Here, the input switch and the control circuit are integrated into a first IC chip.

[0012] Invention Effects

[0013] The power amplifier module according to the present invention can eliminate the complexity of individually wiring various components and can ensure sufficient isolation between input and output signals. Attached Figure Description

[0014] Figure 1 This is an explanatory diagram showing the structure of the power amplifier module according to Embodiment 1.

[0015] Figure 2 This is an explanatory diagram showing the layout relationship of each component of the power amplifier module according to Embodiment 1.

[0016] Figure 3 This is an explanatory diagram showing the positional relationship of the ground planes of the power amplifier module according to Embodiment 1.

[0017] Figure 4 This is an explanatory diagram showing the layout relationship of each component of the power amplifier module according to Embodiment 2.

[0018] Figure 5 This is an explanatory diagram showing the positional relationship of the ground planes of the power amplifier module according to Embodiment 2.

[0019] Figure 6 This is an explanatory diagram showing the layout relationship of each component of the power amplifier module according to Embodiment 3.

[0020] Figure 7 This is an explanatory diagram showing the layout relationship of each component of the power amplifier module according to Embodiment 4.

[0021] Figure 8This is an explanatory diagram showing the layout relationship of the constituent components of the power amplifier module according to Embodiment 5.

[0022] Figure 9 This is an explanatory diagram showing the layout relationship of the constituent components of the power amplifier module according to Embodiment 6.

[0023] Figure 10 This is an explanatory diagram showing the structure of the power amplifier module according to Embodiment 7.

[0024] Figure 11 This is an explanatory diagram showing the layout relationship of each component of the power amplifier module according to Embodiment 7.

[0025] Explanation of reference numerals in the attached figures

[0026] M1, M2, M3, M4, M5, M6, M7: Power amplifier modules; SW1: Input switch; SW2: Output switch; MN1: Input matching circuit; MN2: Interstage matching circuit; MN3: Output matching circuit; PA1: Driver stage amplifier; PA2: Output stage amplifier; CU: Control circuit; DPX1, DPX2, DPX3, DPX4: Duplexers; ANT-SW: Antenna switch. Detailed Implementation

[0027] Hereinafter, embodiments of the present invention will be described with reference to the figures. The same reference numerals denote the same components, and repeated descriptions are omitted.

[0028] Figure 1 This is an explanatory diagram showing the structure of the power amplifier module M1 according to Embodiment 1. The power amplifier module M1 is a high-frequency module in a mobile communication terminal such as a portable telephone that amplifies the power of the input signal to the level required for transmission to a base station. Here, the input signal is, for example, an RF (Radio Frequency) signal modulated according to a given communication method by an RFIC (Radio Frequency Integrated Circuit) or the like.

[0029] The power amplifier module M1 comprises a driver amplifier PA1, an output amplifier PA2, an input switch SW1, an output switch SW2, an input matching circuit MN1, an interstage matching circuit MN2, an output matching circuit MN3, and a control circuit CU. The driver amplifier PA1 is cascaded before the output amplifier PA2. The input switch SW1 has multiple input terminals P11 and P12 and an output terminal P13, selectively establishing signal paths between these terminals. Input terminals P11 and P12 are connected to input signal paths Sin1 and Sin2, respectively. The output terminal P13 is connected to the input terminal P21 of the driver amplifier PA1. The input switch SW1 selectively connects any one of the multiple input signal paths Sin1 and Sin2 to the input terminal P21 of the driver amplifier PA1. The driver amplifier PA1 amplifies the RF signal input to its input terminal P21 and outputs it from its output terminal P22. The RF signal output from the output terminal P22 of the driver amplifier PA1 is input to the input terminal 31 of the output amplifier PA2. The output amplifier PA2 further amplifies the RF signal input to its input terminal P31 and outputs it from its output terminal P32.

[0030] Output switch SW2 has an input terminal P41 and multiple output terminals P42, P43, P44, and P45, selectively establishing signal paths between the input terminal P41 and the multiple output terminals P42, P43, P44, and P45. Input terminal P41 is connected to the output terminal P32 of output stage amplifier PA2. Output terminals P42, P43, P44, and P45 are connected to output signal paths Tx1, Tx2, Tx3, and Tx4, respectively. Output switch SW2 selectively connects any one of the multiple output signal paths Tx1, Tx2, Tx3, and Tx4 to the output terminal P32 of output stage amplifier PA2. Thus, the RF signal input to power amplifier module M1 through any one of the multiple input signal paths Sin1 and Sin2 is amplified and output through any one of the multiple output signal paths Tx1, Tx2, Tx3, and Tx4.

[0031] Input matching circuit MN1 connects input switch SW1 to driver amplifier PA1, ensuring impedance matching between them. Interstage matching circuit MN2 connects driver amplifier PA1 to output amplifier PA2, ensuring impedance matching between them. Output matching circuit MN3 connects output amplifier PA2 to output switch SW2, ensuring impedance matching between them. Control circuit CU controls the operation of input switch SW1, output switch SW2, driver amplifier PA1, and output amplifier PA2. For example, control circuit CU controls the bias points of driver amplifier PA1 and output amplifier PA2, or controls the switching operation of input switch SW1 and output switch SW2.

[0032] Additionally, it should be noted that Figure 1 This only illustrates the connection relationships of the components that make up the power amplifier module M1, not the mounting layout. Furthermore, for ease of explanation, the example shows a case with two connection stages, but the number of connection stages can also be three or more.

[0033] Figure 2 This is an explanatory diagram showing the layout of the components of the power amplifier module M1. The components of the power amplifier module M1 are disposed on a substrate 100. The substrate 100 is also referred to as a wiring substrate or mounting substrate. The input switch SW1, output switch SW2, and control circuit CU are integrated into a single IC (Integrated Circuit) chip C1. Reference numerals 10, 20, and 30 indicate the areas where the input switch SW1, output switch SW2, and control circuit CU are disposed, respectively. The control circuit CU is disposed between the input switch SW1 and the output switch SW2. The driver stage amplifier PA1 and the output stage amplifier PA2 are integrated into a single IC chip C2. Reference numeral 40 indicates the area where the input matching circuit MN1 and the interstage matching circuit MN2 are disposed. Furthermore, reference numeral 50 indicates the area where the output matching circuit MN3 is disposed. Additionally, when viewed from a direction perpendicular to the mounting surface of the substrate 100, the IC chips C1 and C2 form a shape with four sides (e.g., a rectangle or square). In addition, for ease of explanation, the wiring diagrams connecting IC chips C1 and C2, input matching circuit MN1, inter-stage matching circuit MN2, and output matching circuit MN3 are omitted.

[0034] IC chip C2 is positioned between input matching circuit MN1, inter-stage matching circuit MN2 (region 40), and output matching circuit MN3 (region 50). For ease of explanation, the arrangement direction of input switch SW1 (region 10), control circuit CU (region 30), and output switch SW2 (region 20) is referred to as arrangement direction D1. The side of IC chip C2 that is approximately parallel to arrangement direction D1 and closest to IC chip C1 is called side L1. Furthermore, the side of IC chip C2 that is closest to input matching circuit MN1 and inter-stage matching circuit MN2 (region 40) is called side L2. Furthermore, the side of IC chip C2 that is closest to output matching circuit MN3 (region 50) is called side L3. In this configuration, sides L2 and L3 are positioned opposite side L1, with side L1 in the middle. That is, the arrangement direction of input matching circuit MN1 and inter-stage matching circuit MN2 (region 40), IC chip C2, and output matching circuit MN3 (region 50) is parallel to arrangement direction D1. Furthermore, the side of IC chip C1 that is approximately perpendicular to the arrangement direction D1 and closest to the input switch SW1 (region 10) is designated as side L4. The side of IC chip C1 that is approximately perpendicular to the arrangement direction D1 and closest to the output switch SW2 (region 20) is designated as side L5. At this time, sides L2 and L4 are positioned on the same side of the power amplifier module M1 (in...). Figure 2 In the example shown (left side), sides L3 and L5 are configured on the same side of the power amplifier module M1 (in...). Figure 2 The example shown is on the right.

[0035] Figure 3 This is an explanatory diagram showing the positional relationship of the ground planes of the power amplifier module M1. A ground plane G1 is formed between the input switch SW1 (region 10) and the output switch SW2 (region 20) on the main surface (e.g., the back side) of the IC chip C1 that is in contact with the substrate 100. Furthermore, a ground plane G2 is formed on the main surface (e.g., the back side) of the IC chip C2 that is in contact with the substrate 100. A ground layer G3 is embedded in the substrate 100, and the ground planes G1 and G2 are electrically connected to the ground layer G3 through vias (not shown).

[0036] According to the power amplifier module M1 of Embodiment 1, since the input switch SW1 (region 10), the output switch SW2 (region 20), and the control circuit CU (region 30) are integrated into a single IC chip C1, there is no need to connect them via wires or wiring provided on the substrate 100. This reduces the number of components mounted on the substrate 100, enabling miniaturization and cost reduction. Furthermore, by forming the control circuit CU (region 30) between the input switch SW1 (region 10) and the output switch SW2 (region 20), the control circuit CU (region 30) suppresses electromagnetic coupling between the input switch SW1 (region 10) and the output switch SW2 (region 20), ensuring sufficient isolation between them. This suppresses unwanted oscillations in the power amplifier module M1. In particular, by arranging the IC chip C2 between the input matching circuit MN1 and the interstage matching circuit MN2 (region 40) and the output matching circuit MN3 (region 50), sufficient isolation between the input matching circuit MN1 and the interstage matching circuit MN2 and the output matching circuit MN3 can be ensured. Furthermore, by arranging the input switch SW1 (region 10), the input matching circuit MN1 (region 40), and the interstage matching circuit MN2 (region 40) on the same side of the power amplifier module M1, and by arranging the output switch SW2 (region 20) and the output matching circuit MN3 (region 50) on the same side of the power amplifier module M1, the isolation effect can be improved. Additionally, by forming a ground plane G1 between the input switch SW1 (region 10) and the output switch SW2 (region 20) on the back of the IC chip C1, and forming a ground plane G2 on the back of the IC chip C2, the isolation effect can be improved. The ground layer G3, connected to the ground planes G1 and G2, is preferably formed such that, when viewed from a direction perpendicular to the mounting surface of the substrate 100, it separates the components of the power amplifier module M1 from each other (particularly, between the input matching circuit MN1 and the interstage matching circuit MN2 (region 40) and the output matching circuit MN3 (region 50)). This further improves the isolation effect. Figure 3 The reference numeral SL1 in the attached figure indicates the signal path through which the RF signal passes. Compared with the existing structure in which the components of the power amplifier module M1 are discretely arranged, the power amplifier module M1 according to Embodiment 1 can set the length of the signal path SL1 to the required minimum, thus having the advantage of reducing insertion loss.

[0037] Figure 4 This is an explanatory diagram showing the layout of the components of the power amplifier module M2 in Embodiment 2. The power amplifier module M2 differs from Embodiment 1 in that it includes an IC chip C3 instead of IC chips C1 and C2 in Embodiment 1. The connection relationships of the components of the power amplifier module M2 are as follows... Figure 1 The connection relationships shown are the same.

[0038] exist Figure 4 In the accompanying drawings, reference numerals 60 and 70 indicate the regions forming the driver stage amplifier PA1 and the output stage amplifier PA2, respectively. The input switch SW1 (region 10), the output switch SW2 (region 20), the control circuit CU (region 30), the driver stage amplifier PA1 (region 60), and the output stage amplifier PA2 (region 70) are integrated into a single IC chip C3. The IC chip C3 is flip-chip mounted on the substrate 100 between the input matching circuit MN1 and the inter-stage matching circuit MN2 (region 40) and the output matching circuit MN3 (region 50). For ease of explanation, diagrams showing the wiring connecting the IC chip C3, the input matching circuit MN1, the inter-stage matching circuit MN2, and the output matching circuit MN3 are omitted.

[0039] A control circuit CU (region 30) is formed between the input switch SW1 (region 10) and the output switch SW2 (region 20). A driver amplifier PA1 (region 60) and / or an output amplifier PA2 (region 70) are formed between the input switch SW1 (region 10), the driver amplifier PA1 (region 60), the output amplifier PA2 (region 70), and the output switch SW2 (region 20). The edge of the IC chip C3 closest to the input switch SW1 (region 10) and the driver amplifier PA1 (region 60) is called edge L6, and the edge closest to the output amplifier PA2 (region 70) is called edge L7. Edges L6 and L7 are then opposite each other.

[0040] Figure 5 This is an explanatory diagram showing the positional relationship of the ground planes of the power amplifier module M2. A ground plane G4 is formed on one of the two main surfaces of the IC chip C3 that is in contact with the substrate 100 (e.g., the back side). A ground layer G5 is embedded in the substrate 100, and the ground plane G4 and the ground layer G5 are electrically connected through a via (not shown).

[0041] According to the power amplifier module M2 of Embodiment 2, since the input switch SW1 (region 10), output switch SW2 (region 20), control circuit CU (region 30), driver amplifier PA1 (region 60), and output amplifier PA2 (region 70) are integrated into a single IC chip C3, there is no need to connect them via wires or wiring provided on the substrate 100. This reduces the number of components mounted on the substrate 100, enabling miniaturization and cost reduction. In particular, in Embodiment 2, compared to Embodiment 1, the number of components mounted on the substrate 100 is further reduced, thus offering the advantage of easy flip-chip mounting of the IC chip C3 to the substrate 100. Furthermore, by forming a ground plane G4 on the back side of the IC chip C3, sufficient isolation between input and output signals can be ensured. The grounding layer G5, connected to the ground plane G4, is preferably configured to isolate the components of the power amplifier module M2 from each other (particularly, between the input matching circuit MN1 and the inter-stage matching circuit MN2 and the output matching circuit MN3) when viewed from a direction perpendicular to the mounting surface of the substrate 100. This further improves the isolation effect. Additionally, Figure 4 The reference numeral SL2 in the attached figure indicates the signal path through which the RF signal passes. Compared with the existing structure in which the components of the power amplifier module M2 are discretely arranged, the power amplifier module M2 according to Embodiment 2 can set the length of the signal path SL2 to the required minimum, thus having the advantage of reducing insertion loss.

[0042] Figure 6 This is an explanatory diagram showing the mounting layout of the components of the power amplifier module M3 in Embodiment 3. The relative positional relationships between regions 10 and 60, and between regions 40 and 50, in the power amplifier module M3 differ from those in the power amplifier module M2 of Embodiment 2. Furthermore, the connection relationships of the components of the power amplifier module M3 are different from those in Embodiment 2. Figure 1 The connection relationships shown are the same. Furthermore, in Embodiment 3, similarly to Embodiment 2, the IC chip C3 has a ground plane G4, and a ground layer G5 is embedded in the substrate 100. The ground plane G4 and the ground layer G5 are electrically connected through vias (not shown). For ease of explanation, illustrations of the wiring connecting the IC chip C3, the input matching circuit MN1 (region 40), the inter-stage matching circuit MN2 (region 40), and the output matching circuit MN3 (region 50) are omitted. In the following description, the differences between Embodiments 2 and 3 will be the focus, and detailed explanations of their commonalities will be omitted.

[0043] An input switch SW1 (region 10) is configured between the driver stage amplifier PA1 (region 60) and / or the output stage amplifier PA2 (region 70) and the control circuit CU (region 30). For ease of explanation, the arrangement direction of the driver stage amplifier PA1 (region 60), the input switch SW1 (region 10), the control circuit CU (region 30), and the output switch SW2 (region 20) is referred to as the arrangement direction D2. The side of the IC chip C3 that is approximately parallel to the arrangement direction D2 and closest to the output stage amplifier PA2 is referred to as side L8. Furthermore, the side of the IC chip C3 that is orthogonal to side L8 and closest to the driver stage amplifier PA1 (region 60) is referred to as side L9. At this time, the output matching circuit MN3 (region 50) is configured parallel to side L8 and is closest to side L8 among the four sides of the IC chip C3. In addition, the input matching circuit MN1 and the inter-stage matching circuit MN2 (region 40) are configured parallel to side L9 and are closest to side L9 among the four sides of the IC chip C3.

[0044] According to the power amplifier module M3 of embodiment 3, the wiring of input and output signals can be formed in two mutually orthogonal directions, thus ensuring sufficient isolation between the input and output signals. Furthermore, Figure 6 The reference numeral SL3 in the attached figure indicates the signal path through which the RF signal passes. Compared with the existing structure in which the components of the power amplifier module M3 are discretely arranged, the power amplifier module M3 according to Embodiment 3 can set the length of the signal path SL3 to the required minimum, thus having the advantage of reducing insertion loss.

[0045] Figure 7 This is an explanatory diagram showing the mounting layout of the components of the power amplifier module M4 according to Embodiment 4. The power amplifier module M4 differs from the power amplifier module M1 of Embodiment 1 in that it does not have an input switch SW1. The connection relationships of the components of the power amplifier module M4 are as follows... Figure 1 The connection relationships shown are the same. In the following description, the focus is on the differences between embodiments 1 and 4, and detailed descriptions of the commonalities between the two are omitted.

[0046] The output switch SW2 (region 20) and the control circuit CU (region 30) are integrated into a single IC chip C4. The driver stage amplifier PA1 and the output stage amplifier PA2 are integrated into a single IC chip C5. Note that the wiring diagrams connecting IC chips C4 and C5, the input matching circuit MN1 (region 40), the inter-stage matching circuit MN2 (region 40), and the output matching circuit MN3 (region 50) are omitted. For ease of explanation, the arrangement direction of the control circuit CU (region 30) and the output switch SW2 (region 20) is referred to as the arrangement direction D3. The side of IC chip C5 that is approximately parallel to the arrangement direction D3 and closest to IC chip C4 is referred to as side L10. The side of IC chip C5 that is closest to the input matching circuit MN1 (region 40) and the inter-stage matching circuit MN2 (region 40) is referred to as side L11. The side of IC chip C5 that is closest to the output matching circuit MN3 (region 50) is referred to as side L12. At this point, edges L11 and L12 are positioned opposite edge L10, with edge L10 in the middle. Furthermore, the edge of IC chip C4 that is approximately perpendicular to the arrangement direction D3 and closest to the control circuit CU (region 30) is called edge L13. The edge of IC chip C4 that is approximately perpendicular to the arrangement direction D3 and closest to the output switch SW2 (region 20) is called edge L14. At this point, edges L11 and L13 are positioned on the same side of the power amplifier module M4 (in... Figure 7 In the example shown, the left side is shown, and sides L12 and L14 are configured on the same side of the power amplifier module M4 (in...). Figure 7 The example shown is on the right.

[0047] According to the power amplifier module M4 of Embodiment 4, since the output switch SW2 (region 20) and the control circuit CU (region 30) are integrated into a single IC chip C4, they do not need to be connected by wires or wiring provided on the substrate 100. This reduces the number of components mounted on the substrate 100, enabling miniaturization and cost reduction. Furthermore, by arranging the IC chip C5 between the input matching circuit MN1 and the interstage matching circuit MN2 (region 40) and the output matching circuit MN3 (region 50), sufficient isolation between the input matching circuit MN1 and the interstage matching circuit MN2 (region 40) and the output matching circuit MN3 (region 50) can be ensured. Moreover, by arranging the input matching circuit MN1 and the interstage matching circuit MN2 (region 40) on the same side of the power amplifier module M4, and arranging the output switch SW2 (region 20) and the output matching circuit MN3 (region 50) on the same side of the power amplifier module M4, sufficient isolation between the input and output signals can be ensured. Figure 7The reference numeral SL4 in the attached figure indicates the signal path through which the RF signal passes. Compared with the existing structure in which the components of the power amplifier module M4 are discretely arranged, the power amplifier module M4 according to embodiment 4 can set the length of the signal path SL4 to the required minimum, thus having the advantage of reducing insertion loss.

[0048] Figure 8 This is an explanatory diagram showing the mounting layout of the components of the power amplifier module M5 according to Embodiment 5. The power amplifier module M5 differs from Embodiment 4 in that it includes an IC chip C6 instead of IC chips C4 and C5 in Embodiment 4. The connection relationships of the components of the power amplifier module M5 are as follows... Figure 1 The connection relationships shown are the same.

[0049] The driver stage amplifier PA1 (region 60), output stage amplifier PA2 (region 70), control circuit CU (region 30), and output switch SW2 (region 20) are integrated into a single IC chip C6. Note that the wiring diagrams connecting the IC chip C6, input matching circuit MN1 (region 40), interstage matching circuit MN2 (region 40), and output matching circuit MN3 (region 50) are omitted. The IC chip C6 is flip-chip mounted on the substrate 100. The control circuit CU (region 30) is formed between the driver stage amplifier PA1 (region 60), output stage amplifier PA2 (region 70), and output switch SW2 (region 20). Furthermore, the side of the IC chip C6 closest to the output stage amplifier PA2 (region 70) and output matching circuit MN3 (region 50) is designated as side L15, and the side closest to the driver stage amplifier PA1 (region 60), input matching circuit MN1 (region 40), and interstage matching circuit MN2 (region 40) is designated as side L16. At this point, edge L15 is opposite to edge L16.

[0050] According to the power amplifier module M5 of Embodiment 5, since the output switch SW2 (region 20), control circuit CU (region 30), driver stage amplifier PA1 (region 60), and output stage amplifier PA2 (region 70) are integrated into a single IC chip C6, there is no need to connect them via wires or wiring provided on the substrate 100. This reduces the number of components mounted on the substrate 100, enabling miniaturization and cost reduction. In particular, in Embodiment 5, compared to Embodiment 4, the number of components mounted on the substrate 100 is further reduced, thus providing the advantage of easy flip-chip mounting of the IC chip C6 to the substrate 100. Because the IC chip C6 is positioned between the input matching circuit MN1 and the interstage matching circuit MN2 (region 40) and the output matching circuit MN3 (region 50), sufficient isolation between the input and output signals can be ensured. Furthermore, Figure 8 The reference numeral SL5 in the attached figure indicates the signal path through which the RF signal passes. Compared with the existing structure in which the components of the power amplifier module M5 are discretely arranged, the power amplifier module M5 according to Embodiment 5 can set the length of the signal path SL5 to the required minimum, thus having the advantage of reducing insertion loss.

[0051] Figure 9 This is an explanatory diagram showing the mounting layout of the components of the power amplifier module M6 in Embodiment 6. The relative positional relationship between regions 40 and 50 in the power amplifier module M6 differs from that in the power amplifier module M5 of Embodiment 5. Furthermore, the connection relationships of the components of the power amplifier module M6 are different from those in Embodiment 5. Figure 1 The connection relationships shown are the same. The edge of IC chip C6 that is closest to the driver amplifier PA1 (region 60), the input matching circuit MN1 (region 40), and the interstage matching circuit MN2 (region 40) is called edge L17. At this point, edge L15 and edge L17 are approximately orthogonal.

[0052] According to the power amplifier module M6 of embodiment 6, the wiring of input and output signals can be formed in two mutually orthogonal directions, thus ensuring sufficient isolation between the input and output signals. Furthermore, Figure 9 The reference numeral SL6 in the attached figure indicates the signal path through which the RF signal passes. Compared with the existing structure in which the components of the power amplifier module M6 are discretely arranged, the power amplifier module M6 according to embodiment 6 can set the length of the signal path SL6 to the required minimum, thus having the advantage of reducing insertion loss.

[0053] Figure 10This is an explanatory diagram showing the structure of the power amplifier module M7 according to Embodiment 7. The power amplifier module M7 differs from the power amplifier module M1 of Embodiment 1 in that it includes multiple duplexers DPX1, DPX2, DPX3, and DPX4, and an antenna switch ANT-SW. The antenna switch ANT-SW has terminals P51, P52, P53, and P54 respectively connected to the duplexers DPX1, DPX2, DPX3, and DPX4, and an antenna terminal P55 connected to the antenna ANT. The antenna switch ANT-SW selectively establishes signal paths between the multiple terminals P51, P52, P53, and P54 and the antenna terminal P55, thereby selectively connecting any one of the multiple output signal paths Tx1, Tx2, Tx3, and Tx4 to the antenna terminal P55. The control circuit CU controls the switching operation of the antenna switch ANT-SW.

[0054] The duplexer DPX1 separates the RF signal (transmit signal) input to it via output signal path Tx1 from the RF signal (receive signal) input to it via terminal P51 of the antenna switch ANT-SW. Similarly, duplexers DPX2, DPX3, and DPX4 separate the transmit and receive signals. The received signals, filtered by duplexers DPX1, DPX2, DPX3, and DPX4, are then transmitted via receive signal paths Rx1, Rx2, Rx3, and Rx4, respectively.

[0055] Figure 11This is an explanatory diagram showing the mounting layout of the components of the power amplifier module M7. Reference numerals 80, 91, 92, 93, and 94 indicate the areas where the antenna switch ANT-SW and duplexers DPX1, DPX2, DPX3, and DPX4 are configured, respectively. The driver stage amplifier PA1 (area 60), output stage amplifier PA2 (area 70), input switch SW1 (area 10), output switch SW2 (area 20), control circuit CU (area 30), and antenna switch ANT-SW (area 80) are integrated into a single IC chip C7. Note that the wiring connecting the IC chip C7, duplexers DPX1 (area 91), DPX2 (area 92), DPX3 (area 93), DPX4 (area 94), input matching circuit MN1 (area 40), interstage matching circuit MN2 (area 40), and output matching circuit MN3 (area 50) is omitted. The IC chip C7 is flip-chip mounted on the substrate 100. IC chip C7 is disposed between regions 91 and 92 where duplexers DPX1 and DPX2 are disposed and regions 93 and 94 where duplexers DPX3 and DPX4 are disposed. A control circuit CU (region 30) is formed between input switch SW1 (region 10) and output switch SW2 (region 20). Furthermore, a ground plane G6 is formed between output switch SW2 (region 20) and antenna switch ANT-SW (region 80) on one of the two main surfaces of IC chip C7 that is in contact with substrate 100 (e.g., the back side). A ground layer G7 is embedded in substrate 100, and ground plane G6 is electrically connected to ground layer G7 via vias (not shown). The relative positions of input switch SW1 (region 10), output switch SW2 (region 20), control circuit CU (region 30), driver amplifier PA1 (region 60), and output amplifier PA2 (region 70) are the same as in Embodiment 3, therefore, detailed descriptions are omitted.

[0056] According to the power amplifier module M7 of Embodiment 7, since the driver stage amplifier PA1 (region 60), output stage amplifier PA2 (region 70), input switch SW1 (region 10), output switch SW2 (region 20), control circuit CU (region 30), and antenna switch ANT-SW (region 80) are integrated into a single IC chip C7, there is no need to connect them via wires or wiring provided on the substrate 100. This reduces the number of components mounted on the substrate 100, enabling miniaturization and cost reduction. Furthermore, by arranging the control circuit CU (region 30) between the input switch SW1 (region 10) and the output switch SW2 (region 20), the control circuit CU (region 30) suppresses electromagnetic coupling between the input switch SW1 (region 10) and the output switch SW2 (region 20), ensuring sufficient isolation between them. This suppresses unwanted oscillations in the power amplifier module M7. In particular, by forming a ground plane G6 between the output switch SW2 (region 20) and the antenna switch ANT-SW (region 80), the isolation between the two can be improved. Furthermore, by connecting the ground plane G6 on the back of the IC chip C7 to the ground layer G7 of the substrate 100, sufficient isolation between the output switch SW2 and the antenna switch ANT-SW (region 80) can be ensured. The ground layer G7, connected to the ground plane G6, is preferably formed such that, when viewed from a direction perpendicular to the mounting surface of the substrate 100, it separates the components of the power amplifier module M7 from each other (particularly, between regions 40 and regions 91, 92, and between regions 50 and regions 93, 94). This further improves the isolation effect. Additionally, Figure 11 The reference numeral SL7 in the attached figure indicates the signal path through which the RF signal passes. Compared with the existing structure in which the components of the power amplifier module M7 are discretely arranged, the power amplifier module M7 according to embodiment 7 can set the length of the signal path SL7 to the required minimum, thus having the advantage of reducing insertion loss.

[0057] Furthermore, to distinguish IC chips C1 to C7, IC chip Ci is sometimes referred to as the i-th IC chip (where i is an integer from 1 to 7). Additionally, to distinguish edges L1 to L17, edge Lj is sometimes referred to as the j-th edge (where j is an integer from 1 to 17). Furthermore, when distinguishing between ground surfaces G1 and G2, ground surface G1 is sometimes referred to as the first ground surface, and ground surface G2 is sometimes referred to as the second ground surface.

[0058] The embodiments described above are intended to facilitate understanding of the present invention and are not intended to limit the scope of the invention. The present invention can be modified or improved without departing from its spirit, and the present invention also includes its equivalents. That is, any appropriate design changes made to the embodiments by those skilled in the art, as long as the features of the present invention are present, are also included within the scope of the present invention. The elements and their configurations included in the embodiments are not limited to the illustrated elements and their configurations, and can be appropriately modified.

Claims

1. A power amplification module comprising: an output stage amplifier; a driver stage amplifier connected in cascade to a stage preceding the output stage amplifier; an input switch selectively connecting any one of a plurality of input signal paths to an input terminal of the driver stage amplifier; an output switch selectively connecting any one of a plurality of output signal paths to an output terminal of the output stage amplifier; an input matching circuit connecting the input switch to the driver stage amplifier; an inter-stage matching circuit connecting the driver stage amplifier to the output stage amplifier; an output matching circuit connecting the output stage amplifier to the output switch; and a control circuit controlling operations of the input switch, the driver stage amplifier, and the output stage amplifier, wherein the input switch and the control circuit are integrated in a first IC chip, and the control circuit is disposed between the input switch and the output switch.

2. The power amplification module according to claim 1, wherein the input switch and the control circuit are adjacently disposed in the first IC chip.

3. The power amplification module according to claim 1 or 2, wherein the driver stage amplifier is integrated in the first IC chip.

4. The power amplification module according to claim 3, wherein the driver stage amplifier and the input switch are adjacently disposed.

5. The power amplification module according to claim 3, comprising three or more amplifiers including the driver stage amplifier and the output stage amplifier.

6. The power amplification module according to claim 1 or 2, wherein the output stage amplifier is integrated in a second IC chip.

7. The power amplification module according to claim 3, wherein the first IC chip is rectangular, and the input switch and the control circuit are arranged along a relatively long side of four sides of the first IC chip.

8. The power amplification module according to claim 7, wherein the driver stage amplifier is arranged along the relatively long side of the four sides of the first IC chip together with the input switch and the control circuit, and the input switch is disposed between the driver stage amplifier and the control circuit.

9. The power amplification module according to claim 6, further comprising a substrate on which the first IC chip, the second IC chip, the input matching circuit, the inter-stage matching circuit, and the output matching circuit are disposed, and a first ground plane is formed between the input switch and the output switch of the first IC chip on a main surface of the first IC chip that is in contact with the substrate.

10. The power amplification module according to claim 9, wherein a second ground plane is formed on a main surface of the second IC chip that is in contact with the substrate, and the first ground plane is connected to the second ground plane.

11. A power amplification module comprising: an output stage amplifier; a driver stage amplifier connected in cascade to a stage preceding the output stage amplifier; ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ an input switch that selectively connects any one of a plurality of input signal paths to an input terminal of the driver stage amplifier; an output switch that selectively connects any one of a plurality of output signal paths to an output terminal of the output stage amplifier; an input matching circuit that connects the input switch to the driver stage amplifier; an inter-stage matching circuit that connects the driver stage amplifier to the output stage amplifier; an output matching circuit that connects the output stage amplifier to the output switch; and a control circuit that controls operations of the output switch, the driver stage amplifier, and the output stage amplifier, the output switch and the control circuit are integrated in a third IC chip, the control circuit is disposed between the input switch and the output switch.

12. The power amplification module according to claim 11, wherein in the third IC chip, the output switch is disposed adjacent to the control circuit.

13. The power amplification module according to claim 11 or 12, wherein the power amplification module further includes a substrate on which the third IC chip, the input matching circuit, the inter-stage matching circuit, and the output matching circuit are disposed, a ground plane is formed on a main surface of the third IC chip that is in contact with the substrate.

14. The power amplification module according to claim 13, wherein the third IC chip is flip-chip mounted on the substrate.

15. A power amplification module including: an output stage amplifier; a driver stage amplifier that is cascade-connected to a stage preceding the output stage amplifier; an input switch that selectively connects any one of a plurality of input signal paths to an input terminal of the driver stage amplifier; an output switch that selectively connects any one of a plurality of output signal paths to an output terminal of the output stage amplifier; an input matching circuit that connects the input switch to the driver stage amplifier; an inter-stage matching circuit that connects the driver stage amplifier to the output stage amplifier; an output matching circuit that connects the output terminal of the output stage amplifier to the output switch; and a control circuit that controls operations of the driver stage amplifier and the output stage amplifier, the driver stage amplifier and the input switch are integrated in a fourth IC chip, the control circuit is disposed between the input switch and the output switch.

16. The power amplification module according to claim 15, wherein in the fourth IC chip, the driver stage amplifier and the input switch are disposed adjacent to each other.

17. The power amplification module according to claim 15 or 16, wherein three or more amplifiers including the driver stage amplifier and the output stage amplifier are included.

18. The power amplification module according to claim 15 or 16, wherein the output stage amplifier is integrated in a fifth IC chip.

19. The power amplification module according to claim 15 or 16, wherein the fourth IC chip is rectangular, ​ The input switch and the control circuit are arranged along an opposite long side of the four sides of the fourth IC chip.

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