Gold wire bonding method and gold wire bonding system

Abstract

The present application relates to a kind of gold wire bonding method and gold wire bonding system, method is used to realize the packaging of optical transceiver module, comprising the following steps: step S1, by surface mounting technology, optical chip or device is mounted on PCBA board;Step S2, ground pad, power pad, low-frequency control signal pad in optical chip or device are welded on PCBA board using spherical welding process;Step S3, detection is carried out to ball welding process;Step S4, again high-frequency control signal pad in optical chip or device is welded on PCBA board using wedge welding process;Step S5, detection is carried out to ball welding process, wedge welding process;System is used to realize the above gold wire bonding method, including: carrier and transmission device, spherical welding gold wire bonding device, first appearance detection device, wedge welding gold wire bonding device and second appearance detection device are sequentially arranged along the conveying direction of the transmission device.The gold wire bonding method and gold wire bonding system of the present application can effectively reduce high-frequency impedance while improving space utilization.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optical module packaging, in particular to a gold wire bonding method and a gold wire bonding system. BACKGROUND

[0002] As an optical device for realizing optical / electric and electric / optical conversion functions, the optical module is responsible for high-rate data exchange between electric / optical signals in an optical communication system and is an indispensable part of a data center optical communication network system.

[0003] In optical module packaging, gold wires are usually used to connect different optoelectronic devices and PCB circuits. However, when connecting high-frequency signals, problems such as impedance discontinuity and impedance mismatch often occur, so high-speed communication requires more stringent impedance matching. However, the impedance of the gold wire itself is difficult to control relative to the PCBA circuit, and the parameter characteristics of the bonded gold wire, such as the number, length, arch height, span, and solder joint position, can have a serious impact on high-frequency signal transmission characteristics.

[0004] To solve the problem of high-frequency impedance abnormalities, the usual way is to use two or more gold wires in parallel bonding or to use larger diameter gold wires to bond between two devices or components. However, in a highly integrated high-speed optical module package, for highly integrated optoelectronic chips, using multiple parallel gold wires and larger diameter gold wires for bonding means larger bonding size and space, which cannot be achieved in the process. SUMMARY

[0005] Therefore, the technical problem to be solved by the present application is to overcome the problem of high-frequency impedance abnormalities in gold wire bonding in the prior art, and to provide a gold wire bonding method and a gold wire bonding system that can effectively reduce high-frequency impedance while improving space utilization.

[0006] To solve the above technical problems, the present application provides a gold wire bonding method for realizing the packaging of an optical transceiver module, comprising the following steps:

[0007] Step S1, mounting an optoelectronic chip or device on a PCBA board by surface mounting technology;

[0008] Step S2, welding the ground pad, power pad, and low-frequency control signal pad in the optoelectronic chip or device on the PCBA board using a spherical welding process;

[0009] Step S3, detecting the spherical welding process;

[0010] Step S4, welding the high-frequency control signal pad in the optoelectronic chip or device on the PCBA board using a wedge-shaped welding process;

[0011] Step S5, detecting the spherical welding process and the wedge-shaped welding process.

[0012] In one embodiment of the present application, in step S2, the ball bonding process is set such that the pad area is 2.5-3 times the diameter of the gold wire, and the arch height of the gold wire is greater than 100 μm.

[0013] In one embodiment of the present application, in step S2, in the ball bonding process, the pad is set to be able to be welded in any welding direction.

[0014] In one embodiment of the present application, in step S4, the wedge bonding process is set such that the pad area is 1-1.5 times the diameter of the gold wire, and the arch height of the gold wire is set smoothly.

[0015] In one embodiment of the present application, in step S4, in the wedge bonding process, a plurality of gold wires are used in parallel to achieve the welding of the optoelectronic chip or device and the PCBA board in a single direction.

[0016] In one embodiment of the present application, in steps S2 and S4, before welding, the welding elements in the optoelectronic chip or device and the pads on the PCBA board need to be positioned and identified.

[0017] In one embodiment of the present application, in steps S2 and S4, the welding is performed by using a hot ultrasonic welding method.

[0018] In one embodiment of the present application, in step S3, the appearance of the ball bonding is detected, including the position, number, shape, and appearance quality problems.

[0019] In one embodiment of the present application, in step S5, the internal defects of the bonding gold wire, such as cracks, notches, curls, scratches, and deformations, are detected.

[0020] To solve the above technical problems, the present application provides a gold wire bonding system for implementing the above gold wire bonding method, comprising:

[0021] A carrier for carrying a PCBA board on which an optoelectronic chip or device is mounted;

[0022] A conveying device for conveying the carrier;

[0023] A ball bonding gold wire bonding device, a first appearance detection device, a wedge bonding gold wire bonding device, and a second appearance detection device are sequentially arranged along the conveying direction of the conveying device, wherein:

[0024] The ball bonding gold wire bonding device uses a ball bonding process to weld a ground pad, a power supply pad, and a low-frequency control signal pad in an optoelectronic chip or device on a PCBA board;

[0025] The first appearance detection device detects the ball welding process;

[0026] The wedge bonding device adopts a wedge bonding process to weld a high-frequency control signal pad in an optoelectronic chip or device on a PCBA board.

[0027] The second appearance detection device detects the ball welding process and the wedge bonding process.

[0028] The above technical solution of the present application has the following advantages compared with the prior art:

[0029] The gold wire bonding method mixes the ball bonding process and the wedge bonding process to classify the elements to be welded in the optoelectronic chip or device: the ball bonding process is used for the connection of some low-frequency control signals such as ground connection and power connection, the ball bonding has large contact area, excellent performance such as tension and gold ball thrust, and the welding speed of the ball bonding machine is faster than that of the wedge bonding, which effectively improves the wire bonding rate; the wedge bonding process is used for the connection of some high-frequency control signals with impedance abnormality problems, a plurality of gold wires can be connected in parallel under the same pad size, the arc height and arc length are reduced, and the space utilization is effectively improved while the high-frequency performance is improved.

[0030] In addition, in the gold wire bonding method, the sequence of the welding process is also important, that is, the ball bonding process is performed first, and then the wedge bonding process is performed, which is beneficial to electrostatic discharge and can avoid damage to the electrostatic discharge (ESD) in the welding process flow.

[0031] The gold wire bonding system can realize the above gold wire bonding method, set a carrier to carry the PCBA board on which the optoelectronic chip or device is attached, position and fix the PCBA board, drive the carrier to pass through the ball bonding gold wire bonding device, the first appearance detection device, the wedge bonding gold wire bonding device and the second appearance detection device in sequence by using a transmission device, and complete the welding of different gold wire bonding processes by using the ball bonding gold wire bonding device, the first appearance detection device, the wedge bonding gold wire bonding device and the second appearance detection device, and detect the welding to ensure the quality of the welding. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to make the content of the present application more easily understood, the present application will be further described in detail below according to specific embodiments of the present application and in conjunction with the drawings, in which

[0033] Figure 1 is a step flow chart of the gold wire bonding method of the present application;

[0034] Figure 2 is a structure diagram of the ball bonding process of the present application;

[0035] Figure 3 is a structural diagram of a wedge bonding process of the present application;

[0036] Figure 4 is a simulation test result diagram of return loss of gold wire with different arch heights in the wedge bonding process of the present application;

[0037] Figure 5 is a simulation test result diagram of transmission insertion loss of gold wire with different arch heights in the wedge bonding process of the present application;

[0038] Figure 6 is a simulation test result diagram of return loss and transmission insertion loss of single gold wire in the wedge bonding process of the present application;

[0039] Figure 7 is a simulation test result diagram of return loss and transmission insertion loss of four gold wires in the wedge bonding process of the present application;

[0040] Figure 8 is a structural diagram of a gold wire bonding system of the present application;

[0041] Figure 9 is a structural diagram of a carrier of the present application;

[0042] Figure 10 is a structural diagram of a transmission device of the present application.

[0043] The description of the drawings of the present application is as follows: 1, carrier; 11, plate body; 12, pressing block; 121, pressing part; 122, threaded hole; 123, inclined surface; 13, limiting groove; 131, protruding part; 132, recessed part; 2, transmission device; 21, guide rail; 22, accommodating groove; 3, ball bonding gold wire bonding device; 4, first appearance detection device; 5, wedge bonding gold wire bonding device; 6, second appearance detection device; 7, floating top device. DETAILED DESCRIPTION

[0044] The present application will be further described below in conjunction with the drawings and specific embodiments, so that those skilled in the art can better understand the present application and implement it, but the embodiments are not limiting to the present application.

[0045] Embodiment 1

[0046] Referring to Figure 1 , the present application discloses a gold wire bonding method for realizing packaging of an optical transceiver module, comprising the following steps:

[0047] Step S1, using SMT (Surface Mounted Technology), mounting an optoelectronic chip or device on a PCBA board;

[0048] Step S2, the ground pad, power pad, low-frequency control signal pad in the optoelectronic chip or device are welded on the PCBA board by using the ball welding process, to obtain a wire bonding semi-finished product;

[0049] Step S3, the ball welding process of the wire bonding semi-finished product is detected, mainly visual detection, the appearance of the ball welding is detected, including position, number, shape and appearance quality problems;

[0050] Step S4, the high-frequency control signal pad in the optoelectronic chip or device is welded on the PCBA board by using the wedge welding process, to obtain a wire bonding finished product;

[0051] Step S5, the ball welding process and wedge welding process of the wire bonding finished product are detected, the internal defects of the bonding gold wire such as crack, notch, curl, scratch and deformation are detected.

[0052] By using the above method, the elements to be welded in the optoelectronic chip or device are classified, and a mixed wire bonding method of ball welding process and wedge welding process is adopted: for some ground connection, power connection and low-frequency control signal connection, ball welding process is adopted, the ball welding contact area is large, the performance of pull force and gold ball thrust is excellent, and the welding speed of the ball welding machine is faster than that of the wedge welding, which effectively improves the wire bonding rate; for some high-frequency control signal connections for which impedance abnormality problems occur, wedge welding process is adopted, under the same pad size, multiple gold wires can be connected in parallel, the arc height and arc length are reduced, the high-frequency performance is improved, and the space utilization is effectively improved;

[0053] Moreover, in the gold wire bonding method of the present application, the sequence of the welding process is also important, which is first ball welding process and then wedge welding process, which is beneficial to electrostatic discharge and can avoid damage to electrostatic discharge (ESD) in the welding process flow.

[0054] Specifically, for the ground connection, power connection and low-frequency control signal connection, impedance abnormality problem does not need to be considered, referring to Figure 2As shown, the ground pad, power pad, and low-frequency control signal pad in the optoelectronic chip or device are welded on the PCBA board by using a spherical welding process. The solder area in the spherical welding process is set to be 2.5-3 times the diameter of the gold wire. On the one hand, the contact area of the solder joint is large, which can improve the performance of the pull force and the gold wire thrust, and on the other hand, the arch height of the gold wire does not need to be considered, and the arch height of the gold wire can be set to be greater than 100 μm. In this way, when arranging the optoelectronic chip or device on the PCBA board, the arrangement can be slightly farther. In the spherical welding process, the welding point can be welded in any welding direction, i.e., the second welding point can be welded at any angle of 360° with respect to the first welding point, the welding depth range is wider, the speed of spherical welding is faster, the wire bonding rate is effectively improved, the layout requirement of the PCBA component is not high, the PCB wiring flexibility is higher, and the design difficulty of the PCBA is effectively reduced.

[0055] Specifically, the connection of the high-frequency control signal needs to consider the problem of abnormal high-frequency signal. According to the simulation of return loss and transmission insertion loss, increasing the return loss and reducing the transmission insertion loss can effectively improve the high-frequency performance. Therefore, the improvement methods of high-frequency performance mainly include the following four methods.

[0056] 1. Increasing the diameter of the gold wire. Because the thicker the gold wire, the greater the return loss and the smaller the transmission insertion loss, the better the high-frequency performance. However, increasing the diameter of the gold wire will increase the production cost on the one hand, and will make the toughness of the gold wire worse and affect the bonding performance on the other hand. Moreover, the diameter of the gold wire is limited by the size of the pad of the optical chip, and 1 mil gold wire is generally used for gold wire bonding in the communication industry.

[0057] 2. Reducing the length of the gold wire. Because the shorter the gold wire, the greater the return loss and the smaller the transmission insertion loss, the better the high-frequency performance. On the one hand, the distance between components is shortened, and on the other hand, the arch height is reduced. However, the distance between components is affected by the space layout and the patch process, and the arch height of the gold wire cannot be too low, otherwise the welding strength of the gold wire will be reduced. Therefore, the gold wire needs to maintain a certain arch height in the actual process.

[0058] 3. Increasing the number of wires can effectively improve the high-frequency performance. However, high-speed optoelectronic devices generally have high integration, and the size of the pad is limited.

[0059] 4. Increasing the distance between gold wires can also improve the high-frequency performance, but it is still limited by the size of the pad.

[0060] The welding method of the embodiment is improved by combining the above four improvement methods, which is described with reference to Figure 3As shown, the high-frequency control signal pad in the optoelectronic chip or device is welded on the PCBA board by using the wedge welding process, the welding point area in the wedge welding process is set as: 1~1.5 of the gold wire diameter, the area of the welding point is reduced as much as possible, the number of wire bonding is appropriately increased under the condition that the size of the welding pad is limited, the welding of the optoelectronic chip or device and the PCBA board is realized in a single direction by using the welding mode of multiple gold wires in parallel, and the high-frequency performance can be effectively improved; and the arch height of the gold wire is set to be as smooth as possible, so that the length of the gold wire can be as short as possible.

[0061] Specifically, in order to meet the requirement that the arch height of the gold wire is as smooth as possible, in the gold wire bonding method of the embodiment, certain requirements are also proposed for the layout design of the PCBA board: the optoelectronic chip or device is subjected to the sinking patch process in the surface mount technology, so that the optoelectronic chip or device is flush with the PCBA board, and on the wiring design of the PCBA board, the layout of the electronic components with large sizes such as capacitors and inductors avoids the direction of wedge welding wire bonding, so as to avoid the direction or position interference problem and improve the process efficiency.

[0062] Referring to Figure 4 and Figure 5 In the embodiment, in order to further verify the influence of the welding mode of the wedge welding process and the gold wire set as smooth as possible on the transmission of high-frequency signals, in step S4, the arch height of the gold wire is set as: 0.1mm, 0.15mm, 0.2mm, 0.25mm and 0.3mm respectively, and the simulation test result graphs of return loss and transmission insertion loss are obtained, Figure 6 and Figure 7 In the graphs, the arch height of the gold wire corresponding to the curve a is 0.1mm, the arch height of the gold wire corresponding to the curve b is 0.15mm, the arch height of the gold wire corresponding to the curve c is 0.2mm, the arch height of the gold wire corresponding to the curve d is 0.25mm, and the arch height of the gold wire corresponding to the curve e is 0.3mm.

[0063] It is obtained from the simulation test result that the lower the arch height of the gold wire bonding is, the greater the return loss is, the smaller the transmission insertion loss is, and the better the high-frequency performance is, thereby verifying the beneficial effects of the bonding method.

[0064] Referring to Figure 6 and Figure 7 In the embodiment, in order to further verify the influence of the welding mode of the wedge welding process on the transmission of high-frequency signals in the limited size of the welding pad, in step S4, single gold wire connection and four gold wire connections are set respectively, and the simulation test result graphs of return loss and transmission insertion loss are obtained, Figure 6 and Figure 7 In the graphs, the left side is the simulation test graph of return loss, and the right side is the simulation test graph of insertion loss.

[0065] The simulation test results show that the more the gold wire bonding is, the lower the return loss is, the smaller the transmission insertion loss is, and the better the high-frequency performance is, thereby verifying the beneficial effects of the bonding method.

[0066] Specifically, in steps S2 and S4, before welding, the soldering elements in the optoelectronic chip or device and the pads on the PCBA board need to be positioned and recognized, both of which are subjected to local image recognition positioning of the elements in the optoelectronic chip or device and overall image recognition of the pads on the PCBA board, which is beneficial to the accurate positioning of the gold wire bonding.

[0067] Specifically, in step S3, a high-power microscope (magnification 30-100 times), a high-definition display, and an ATE program for automatically determining the wire bonding position, number, and shape are used to preliminarily inspect the appearance quality of the wire bonding.

[0068] Specifically, in step S5, a high-power metallographic microscope with a magnification of ≥400 times is used to detect defects such as cracks, notches, curls, scratches, or deformations on the bonded gold wire.

[0069] Embodiment 2

[0070] Referring to Figure 8 The present application also provides a gold wire bonding system for implementing the gold wire bonding method of embodiment 1, comprising:

[0071] A carrier 1 for carrying a PCBA board on which an optoelectronic chip or device is attached;

[0072] A transmission device 2, comprising two parallelly arranged guide rails 21 for conveying the carrier 1;

[0073] A ball-welding gold wire bonding device 3, a first appearance detection device 4, a wedge-welding gold wire bonding device 5, and a second appearance detection device 6 are sequentially arranged along the conveying direction of the transmission device 2, wherein:

[0074] The ball-welding gold wire bonding device 3 uses a ball-welding process to weld the ground pads, power pads, and low-frequency control signal pads in the optoelectronic chip or device on the PCBA board;

[0075] The first appearance detection device 4 detects the ball-welding process;

[0076] The wedge-welding gold wire bonding device 5 uses a wedge-welding process to weld the high-frequency control signal pads in the optoelectronic chip or device on the PCBA board;

[0077] The second appearance detection device 6 detects the ball-welding process and the wedge-welding process.

[0078] The gold wire bonding system can realize the gold wire bonding method, set the carrier 1, carry the PCBA board with the optical module, position and fix the PCBA board, drive the carrier 1 to pass through the ball welding gold wire bonding device 3, the first appearance detection device 4, the wedge welding gold wire bonding device 5 and the second appearance detection device 6 in turn by using the transmission device 2, and complete the welding of different gold wire bonding processes and the detection after welding by using the ball welding gold wire bonding device 3, the first appearance detection device 4, the wedge welding gold wire bonding device 5 and the second appearance detection device 6 respectively, so as to ensure the quality of welding.

[0079] Specifically, a plurality of floating top devices 7 are arranged along the conveying direction of the transmission device 2, and the plurality of floating top devices 7 are correspondingly arranged at positions corresponding to the ball welding gold wire bonding device 3, the first appearance detection device 4, the wedge welding gold wire bonding device 5 and the second appearance detection device 6, respectively. After the carrier 1 reaches the position of the ball welding gold wire bonding device 3, the carrier 1 is stopped by the floating top device 7. After the ball welding gold wire bonding device 3 completes the ball welding, the floating top device 7 avoids the carrier 1, and the carrier 1 continues to convey in the transmission device 2. Similarly, when the carrier 1 passes through the first appearance detection device 4, the wedge welding gold wire bonding device 5 and the second appearance detection device 6, the floating top device 7 can also perform the same action.

[0080] The clamp of the embodiment plays a role in positioning and fixing the PCBA board. As shown in Figure 9 The carrier 1 includes a plate body 11 and a pressing block 12 arranged on the plate body 11. A limiting groove 13 is arranged on the plate body 11, and the limiting groove 13 is used to accommodate the PCBA board. The PCBA board is placed into the limiting groove 13 in parallel to the plate body 11, so that the position of the PCBA board is limited, and accurate positioning of the PCBA board is realized. The pressing block 12 is arranged outside the limiting groove 13 and has a pressing part extending towards the limiting groove 13. The pressing part protrudes above the limiting groove 13. The PCBA board is fixed in the limiting groove 13 by cooperation of the pressing block 12 and the limiting groove 13, so that the position of the PCBA board is fixed during welding, the PCBA board is prevented from moving, the accuracy of the welding position is improved, and the welding quality is improved.

[0081] In actual use, the jig of the embodiment is used to clamp and position the PCBA board, and then the optical unit on the PCBA board is bonded and packaged with the PCBA board by gold wire. In the process of packaging and wiring, the wiring area of the PCBA board needs to be heated. Generally, the jig is placed on the heating table of the wiring device, and the jig is heated directly. However, if the entire jig is heated, the optical module on the PCBA board will also be heated, which will affect the performance of the optical module. Therefore, in the embodiment, the jig is required to be able to heat only the wiring area of the PCBA board and not to heat other areas. In order to achieve this technical effect, as shown in Figure 1 When the PCBA board is placed in the limiting groove 13, the protruding part 131 abuts against the PCBA board to support the wiring area of the PCBA board, and the recessed part 132 avoids the electronic components on the PCBA board, and the PCBA board above the recessed part 132 is suspended. In this way, when the entire jig is heated, the heat is only transmitted to the wiring area through the protruding part 131 abutting against the PCBA board, and the wiring area can be positioned and heated. Due to the position of the recessed part 132, there is a gap between the PCBA board and the jig, and heat cannot be transmitted to the PCBA board.

[0082] Specifically, in order to facilitate the limiting of the PCBA board, the limiting groove 13 is directly set as a profiling groove with the same shape as the PCBA board. The PCBA board is placed in the profiling groove, and the limiting of the PCBA board is achieved.

[0083] In the embodiment, before the PCBA board is placed in the limiting groove 13, the pressing block 12 needs to avoid the limiting groove 13 so as not to interfere with the placement of the PCBA board. After the PCBA board is placed in the limiting groove 13, the pressing block 12 is used to press and fix it. Therefore, in the embodiment, the detachable pressing block 12 is arranged on the plate body 11. Threaded holes are formed in the pressing block 12, and the pressing block 12 is connected to the plate body 11 by bolts.

[0084] Specifically, in actual use, the tight block 12 is often disassembled, which is also more troublesome, in order to quickly take and place the PCBA board, the side of the pressing part of the pressing block 12 towards the limiting groove 13 is an inclined surface, so that when the PCBA board is placed, one end of the PCBA board can be placed under the tight block 12 along the inclined surface to avoid the pressing part of the tight block 12, and then the other end of the PCBA board is placed in the limiting groove 13, when the PCBA board is taken out, the PCBA board is lifted from the opposite side of the tight block 12, and then the PCBA board is taken out of the limiting groove 13 along the inclined surface, so that the effect of conveniently taking out the PCBA board without disassembling the tight block 12 can be achieved, and the work efficiency can be improved.

[0085] In the embodiment, the transmission device 2 clamps and limits the clamp through two parallel guide rails 21, and limits the clamp in the conveying direction through the floating top device 7, so that the clamp is limited in the horizontal plane in the transverse and longitudinal directions. However, in order to limit the clamp in space, it is also necessary to limit the clamp in the direction perpendicular to the clamp. Referring to FIG. 2, in the embodiment, a containing groove 22 is opened on the contact surface of the guide rail 21 and the clamp, the clamp is inserted into the containing groove 22, and the containing groove 22 limits the clamp in the vertical direction, so that the clamp is limited in three directions in space. Figure 10

[0086] Obviously, the above embodiments are only examples for clearly illustrating, and are not limitation to the embodiments. For those skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, all the embodiments are not required to be exhausted, and the obvious changes or variations derived therefrom are still within the protection scope of the present application.​

Claims

1. A gold wire bonding method for implementing a package of an optical transceiver module, characterized by, The method comprises the following steps: Step S1, mounting the optoelectronic chip or device on the PCBA board by surface mounting technology; Step S2, welding the ground pad, power pad and low-frequency control signal pad of the optoelectronic chip or device on the PCBA board by using a ball welding process; Step S3, detecting the ball welding process; Step S4, welding the high-frequency control signal pad of the optoelectronic chip or device on the PCBA board by using a wedge welding process; Step S5, detecting the ball welding process and the wedge welding process.

2. The gold wire bonding method of claim 1, wherein: In step S2, the ball welding process is set such that the welding point area is 2.5-3 times the diameter of the gold wire, and the arch height of the gold wire is greater than 100 μm.

3. The gold wire bonding method of claim 1, wherein: In step S2, in the ball welding process, the welding point can be welded in any welding direction.

4. The gold wire bonding method of claim 1, wherein: In step S4, the wedge welding process is set such that the welding point area is 1-1.5 times the diameter of the gold wire, and the arch height of the gold wire is smoothly set.

5. The gold wire bonding method of claim 1, wherein: In step S4, in the wedge welding process, a plurality of gold wires are used in parallel to achieve the welding of the optoelectronic chip or device and the PCBA board in a single direction.

6. The gold wire bonding method of claim 1, wherein: In steps S2 and S4, before welding, the welding elements in the optoelectronic chip or device and the pads on the PCBA board need to be positioned and identified.

7. The gold wire bonding method of claim 1, wherein: In steps S2 and S4, the welding process is performed by using a hot ultrasonic welding method.

8. The gold wire bonding method of claim 1, wherein: In step S3, the appearance of the ball welding is detected, including the position, number, shape and appearance quality problems.

9. The gold wire bonding method of claim 1, wherein: In step S5, the internal defects of the bonded gold wire, such as cracks, notches, curling, scratches and deformation, are detected.

10. A gold wire bonding system for implementing the gold wire bonding method according to any one of claims 1 to 9, characterized in that: The method comprises: a carrier for carrying the PCBA board on which the optoelectronic chip or device is mounted; a conveying device for conveying the carrier; a ball welding gold wire bonding device, a first appearance detection device, a wedge welding gold wire bonding device and a second appearance detection device are sequentially arranged along the conveying direction of the conveying device, wherein: the ball welding gold wire bonding device welds the ground pad, power pad and low-frequency control signal pad of the optoelectronic chip or device on the PCBA board by using a ball welding process; the first appearance detection device detects the ball welding process; the wedge welding gold wire bonding device welds the high-frequency control signal pad of the optoelectronic chip or device on the PCBA board by using a wedge welding process; the second appearance detection device detects the ball welding process and the wedge welding process.

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