A UV adhesive with reduced adhesion, a tape with reduced adhesion, and a preparation method thereof, which are convenient for PCB cutting

Abstract

The present invention discloses a UV adhesive for facilitating PCB cutting. The adhesive comprises an adhesive composition and a solvent. The adhesive composition consists of the following components in parts by weight: 100 parts of acrylic resin, 0.1 - 0.8 part of curing agent, 1 - 3 parts of initiator, 0.2 - 0.5 part of bis(acetylacetonato)diisopropoxytitanium, and 2 - 5 parts of small molecule monomer 2-phenoxyethyl acrylate. Among them, the acrylic resin has a viscosity of 500 - 5000 cps, a weight average molecular weight of 400,000 - 800,000, and a glass transition temperature of -40 to -30 °C. Through the design of the UV adhesive film structure, and further through the selection and design of acrylic resin, bis(acetylacetonato)diisopropoxytitanium, and small molecule monomer, and controlling the contents of bis(acetylacetonato)diisopropoxytitanium and small molecule monomer within a specific range, the prepared UV adhesive film has a low post-UV adhesiveness, solves the problem of pre-UV flying chips, and effectively improves the problem of contamination after the filter is picked up.

Description

Technical Field

[0001] The present invention relates to a UV adhesive with reduced viscosity for facilitating PCB cutting, belonging to the technical field of UV adhesives with reduced viscosity. Background Art

[0002] PCB circuit boards are widely used in computer components and other electronic components. After years of development from the initial single-layer boards, they have continuously reduced in size, decreased in cost, and improved in performance, enabling printed circuit boards to still maintain strong vitality in the development process of future electronic products. The existing PCB board cutting application is to laminate a PVB board with a UV adhesive with reduced viscosity and fix the UV adhesive tape with an iron ring, cut off the excess UV film at the edge with a cutting machine, and then cut it on a cutting machine according to the specified size.

[0003] However, high density, high precision, and fine apertures require that the UV adhesive with reduced viscosity used in the PCB board cutting process has strong fixing properties in the initial stage. Otherwise, when cutting chips with smaller sizes, it is easy for the materials to fly, and while ensuring relatively high initial viscosity, no residual glue, white fog, water marks, etc. should be generated on the PCB substrate after UV treatment. Existing UV adhesives with reduced viscosity are extremely prone to material flying and blade damage when cutting sizes below 0.6mm * 0.6mm, and cause relatively large waste of materials, which urgently needs to be solved. Summary of the Invention

[0004] The purpose of the present invention is to provide a UV adhesive with reduced viscosity, an adhesive tape with reduced viscosity, and a preparation method thereof for facilitating PCB cutting. This UV adhesive with reduced viscosity solves the problem of insufficient initial fixing properties of the existing UV adhesive with reduced viscosity, resulting in material flying when cutting chips with smaller sizes, and also solves the problem of residual glue pollution during PCB cutting and picking up.

[0005] To achieve the above purpose, the technical solution adopted by the present invention is: a UV adhesive with reduced viscosity for facilitating PCB cutting, the adhesive with reduced viscosity comprising an adhesive composition with reduced viscosity and a solvent, and the adhesive composition with reduced viscosity consisting of the following components in parts by weight: 100 parts of acrylic resin, 0.1 - 0.8 part of curing agent, 1 - 3 parts of initiator, 0.2 - 0.5 part of bis(acetylacetonato)diisopropoxytitanium, and 2 - 5 parts of 2 - phenoxyethyl acrylate small molecule monomer; wherein, the viscosity of the acrylic resin is 500 - 5000 cps, the weight - average molecular weight is 400,000 - 800,000, and the glass transition temperature is - 40 - - 30 °C.

[0006] The further improved solutions in the above - mentioned technical solutions are as follows:

[0007] 1. In the above solution, the acrylic resin, by mass, comprises the following components: 30 - 40 parts of isobutyl acrylate, 1 - 2 parts of acrylic acid, 4 - 5 parts of 2-hydroxyethyl acrylate, 4 - 5 parts of butyl methacrylate, 4 - 5 parts of 2-hydroxyethyl methacrylate, 4 - 5 parts of glycidyl methacrylate, 40 - 50 parts of ethyl acetate, 0.5 - 1.5 parts of light stabilizer, 0.1 - 1 part of initiator, 0 - 0.5 part of defoamer, and 0 - 0.3 part of leveling agent.

[0008] 2. In the above solution, the molecular weight of the small molecule monomer is 500 - 1000 um, and the viscosity is 1000 - 5000 cps.

[0009] 3. In the above solution, the curing agent is any one or a combination of at least two of triphenylmethane triisocyanate toluene diisocyanate trimer, isophorone diisocyanate trimer, or tris(4-phenyl isocyanate) thiophosphate.

[0010] 4. In the above solution, the solvent is any one or a combination of at least two of ethyl acetate, toluene, and methyl ethyl ketone.

[0011] 5. In the above solution, the solid content of the pressure-sensitive adhesive is 20 - 25%.

[0012] The present invention also provides a UV pressure-sensitive adhesive tape for facilitating PCB cutting, comprising a substrate layer, a pressure-sensitive adhesive layer, and a release film layer stacked in sequence, wherein the pressure-sensitive adhesive layer is made of the UV pressure-sensitive adhesive for facilitating PCB cutting according to any one of claims 1 - 6.

[0013] The further improved solutions in the above technical solutions are as follows:

[0014] 1. In the above solution, the thickness of the substrate layer is 130 - 160 μm, the thickness of the pressure-sensitive adhesive layer is 20 - 30 μm, and the thickness of the release film layer is 12 - 75 μm.

[0015] The present invention also provides a preparation method of a UV pressure-sensitive adhesive tape for facilitating PCB cutting, comprising the following steps:

[0016] Coat the pressure-sensitive adhesive on either side of the release film layer, and dry it at 90 - 110 °C for 1 - 4 min to obtain a pressure-sensitive adhesive layer and a release film layer that are adhered together;

[0017] Compound the pressure-sensitive adhesive layer on the side away from the release film layer with the substrate layer, and cure it at 40 - 50 °C for 50 - 80 h to obtain the UV pressure-sensitive adhesive tape.

[0018] Due to the application of the above technical solutions, the present invention has the following advantages compared with the prior art: [[ID=�5]]

[0019] 1. A UV tack - reducing adhesive, a tack - reducing tape and a preparation method thereof for facilitating PCB cutting according to the present invention. Through the selection and design of acrylic resin, bis(acetylacetonato)diisopropoxytitanium and 2 - phenoxyethyl acrylate small - molecule monomers, and controlling the contents of bis(acetylacetonato)diisopropoxytitanium and 2 - phenoxyethyl acrylate small - molecule monomers within a specific range, the prepared UV tack - reducing adhesive film has a lower post - UV tackiness, solves the problem of pre - UV flying chips, and effectively improves the problem of contamination after the filter is picked up.

[0020] 2. A UV tack - reducing adhesive, a tack - reducing tape and a preparation method thereof for facilitating PCB cutting according to the present invention. Through the formulation design of specific bis(acetylacetonato)diisopropoxytitanium and 2 - phenoxyethyl acrylate small - molecule monomers combined with a PO substrate, the prepared UV tack - reducing adhesive film has extremely low post - UV tackiness and good anti - contamination properties, a relatively high adhesive degree, extremely low tackiness after UV, and no contamination to the PCB board. The addition of an adhesion promoter can greatly increase the bonding force between the adhesive layer and the PO substrate, preventing the problem of post - UV contamination. Specific embodiments

[0021] Example 1:

[0022] This example provides a UV tack - reducing tape and a preparation method thereof. The tack - reducing tape includes a PO substrate layer with a thickness of 150 μm, a tack - reducing adhesive layer with a thickness of 20 μm, and a PET single - silicon release film layer with a thickness of 36 μm, which are stacked in sequence.

[0023] The tack - reducing adhesive layer is made of a tack - reducing adhesive, and the tack - reducing adhesive is made of a tack - reducing adhesive composition and a solvent;

[0024] The tack-reducing adhesive composition comprises the following components in parts by weight: 100 parts of acrylic resin, 0.3 part of toluene diisocyanate trimer, 1 part of initiator, 0.3 part of bis(acetylacetonato)diisopropoxytitanium, 2 parts of 2-phenoxyethyl acrylate small molecule monomer, and 38 parts of solvent; the acrylic resin, by mass parts, comprises the following components: 30-40 parts of isobutyl acrylate, 4-5 parts of acrylic acid, 4-5 parts of hydroxyethyl acrylate, 4-5 parts of butyl methacrylate, 4-5 parts of hydroxyethyl methacrylate, 2-3 parts of glycidyl methacrylate, 40-50 parts of ethyl acetate, 0.5-1.5 parts of light stabilizer, 0.1-1 part of initiator, 0-0.5 part of defoamer, and 0-0.3 part of leveling agent. The synthesis method of the UV tack-reducing adhesive is as follows: Add 30 g of isobutyl acrylate, 5 g of acrylic acid, 4 g of hydroxyethyl acrylate, 4 g of butyl methacrylate, and 40 g of ethyl acetate into a reaction kettle, stir and heat up to 77 °C under a nitrogen atmosphere, then add 0.1 g of initiator benzoyl peroxide, control the reaction temperature at 75-77 °C, stir for 2 h, then add 5 g of hydroxyethyl methacrylate, 2 g of glycidyl methacrylate, and 0.1 g of benzoyl peroxide and continue to react for five hours, then cool down to 50 °C, add 0.2 g of leveling agent isopropyl palmitate, defoamer GP type glycerol polyether, 8 g of polyethylene glycol diacrylate, and 0.2 g of bis(2,2,6,6-tetramethylpiperidin-4-yl) sebacate (light stabilizer 770), stir evenly and cool down to room temperature to obtain the UV tack-reducing adhesive composition.

[0025] The solvent consists of ethyl acetate and toluene in a mass ratio of 7:3;

[0026] The preparation method of the UV tack-reducing adhesive is as follows:

[0027] Mix the acrylic resin, toluene diisocyanate trimer, initiator, bis(acetylacetonato)diisopropoxytitanium, 2-phenoxyethyl acrylate small molecule monomer, ethyl acetate and toluene evenly to obtain a tack-reducing adhesive with a solid content of 25%.

[0028] The preparation method of the above-mentioned UV tack-reducing tape is as follows:

[0029] (1) Coat the UV tack-reducing adhesive on either side of the PET single-silicone release film layer, and dry at 90 °C for 3 min to obtain a tack-reducing adhesive layer and a PET single-silicone release film layer that are adhered together;

[0030] (2) Laminate the tack-reducing adhesive layer 2 on the side away from the release film layer with the smooth surface of the PO substrate layer, and cure at 45 °C for 72 h to obtain the UV tack-reducing tape.

[0031] Example 2:

[0032] This embodiment provides a UV pressure-sensitive adhesive tape and a preparation method thereof. The pressure-sensitive adhesive tape includes a PO substrate layer with a thickness of 140 μm, a pressure-sensitive adhesive layer with a thickness of 20 μm, and a PET single-sided silicone release film layer with a thickness of 36 μm, which are stacked in sequence.

[0033] The pressure-sensitive adhesive layer is made of a pressure-sensitive adhesive, and the pressure-sensitive adhesive is made of a pressure-sensitive adhesive composition and a solvent;

[0034] The pressure-sensitive adhesive composition includes the following components in parts by weight: 100 parts of acrylic resin, 0.2 parts of toluene diisocyanate trimer, 2 parts of initiator, 0.3 parts of bis(acetylacetonato)diisopropoxytitanium, 2 parts of 2-phenoxyethyl acrylate small molecule monomer, and 32 parts of solvent; the synthesis method of this UV pressure-sensitive adhesive is the same as that of Example 1.

[0035] The solvent is composed of ethyl acetate and toluene in a mass ratio of 7:3;

[0036] The preparation method of the UV pressure-sensitive adhesive composition is as follows:

[0037] Mix acrylic resin, toluene diisocyanate trimer, initiator, bis(acetylacetonato)diisopropoxytitanium, 2-phenoxyethyl acrylate small molecule monomer, ethyl acetate and toluene evenly to obtain a pressure-sensitive adhesive with a solid content of 28%.

[0038] The preparation method of the above-mentioned UV pressure-sensitive adhesive tape is as follows:

[0039] (1) Coat the UV pressure-sensitive adhesive on either side of the PET single-sided silicone release film layer, and dry it at 90 °C for 3 min to obtain a pressure-sensitive adhesive layer and a PET single-sided silicone release film layer that are adhered together;

[0040] (2) Laminate the pressure-sensitive adhesive layer 2 on the side away from the release film layer with the smooth surface of the PO substrate layer, and cure it at 45 °C for 72 h to obtain a UV pressure-sensitive adhesive tape.

[0041] Example 3:

[0042] This embodiment provides a UV pressure-sensitive adhesive tape and a preparation method thereof. The heat pressure-sensitive adhesive tape includes a PO substrate layer with a thickness of 160 μm, a pressure-sensitive adhesive layer with a thickness of 30 μm, and a PET single-sided silicone release film layer with a thickness of 45 μm, which are stacked in sequence.

[0043] The pressure-sensitive adhesive layer is made of a pressure-sensitive adhesive, and the pressure-sensitive adhesive is made of a pressure-sensitive adhesive composition and a solvent;

[0044] The pressure-sensitive adhesive composition comprises the following components in parts by weight: 100 parts of acrylic resin, 0.1 part of toluene diisocyanate trimer, 2 parts of initiator, 0.4 part of bis(acetylacetonato) diisopropoxytitanium, 5 parts of 2-phenoxyethyl acrylate small molecule monomer, and 38 parts of solvent. The synthesis method of this UV pressure-sensitive adhesive is the same as that of Example 1.

[0045] The solvent consists of ethyl acetate and toluene in a mass ratio of 8:2;

[0046] The preparation method of the pressure-sensitive adhesive is as follows:

[0047] Mix the acrylic resin, toluene diisocyanate trimer, initiator, bis(acetylacetonato) diisopropoxytitanium, 2-phenoxyethyl acrylate small molecule monomer, ethyl acetate and toluene evenly to obtain a pressure-sensitive adhesive with a solid content of 25%.

[0048] The preparation method of the above UV pressure-sensitive adhesive tape is as follows:

[0049] (1) Coat the UV pressure-sensitive adhesive on any one side of the PET single-silicone release film layer, and dry it at 100 °C for 5 min to obtain a pressure-sensitive adhesive layer and a PET single-silicone release film layer that are adhered to each other;

[0050] (2) Laminate the pressure-sensitive adhesive layer 2 on the side away from the release film layer with the smooth surface of the PO substrate layer, and cure it at 45 °C for 72 h to obtain a UV pressure-sensitive adhesive tape.

[0051] Example 4:

[0052] This example provides a UV pressure-sensitive adhesive tape and its preparation method. The pressure-sensitive adhesive tape comprises a PO substrate layer with a thickness of 150 μm, a pressure-sensitive adhesive layer with a thickness of 25 μm, and a PET single-silicone release film layer with a thickness of 45 μm that are stacked in sequence.

[0053] The pressure-sensitive adhesive layer is made of a pressure-sensitive adhesive, and the pressure-sensitive adhesive is made of a pressure-sensitive adhesive composition and a solvent;

[0054] The pressure-sensitive adhesive composition comprises the following components in parts by weight: 100 parts of acrylic resin, 0.2 part of toluene diisocyanate trimer, 1 part of initiator, 0.2 part of bis(acetylacetonato) diisopropoxytitanium, 3 parts of 2-phenoxyethyl acrylate small molecule monomer, and 38 parts of solvent. The synthesis method of this UV pressure-sensitive adhesive is the same as that of Example 1.

[0055] The solvent consists of ethyl acetate and toluene in a mass ratio of 8:2;

[0056] The preparation method of the pressure-sensitive adhesive is as follows:

[0057] Mix acrylic resin, toluene diisocyanate trimer, initiator, bis(acetylacetonato)diisopropoxytitanium, 2-phenoxyethyl acrylate small molecule monomer, ethyl acetate and toluene uniformly to obtain a heat-removable adhesive composition with a solid content of 25%.

[0058] The preparation method of the above UV-removable adhesive tape is as follows:

[0059] (1) Coat the UV-removable adhesive on either side of the PET single-silicone release film layer, and dry it at 90 °C for 5 min to obtain a adhered removable adhesive layer and PET single-silicone release film layer;

[0060] (2) Laminate the removable adhesive layer 2 on the side away from the release film layer with the smooth surface of the PO substrate layer, and cure it at 45 °C for 72 h to obtain the UV-removable adhesive tape.

[0061] Example 5:

[0062] This example provides a UV-removable adhesive tape and its preparation method. The removable adhesive tape includes a PO substrate layer with a thickness of 150 μm, a removable adhesive layer with a thickness of 20 μm, and a PET single-silicone release film layer with a thickness of 45 μm, which are stacked in sequence.

[0063] The removable adhesive layer is made of a removable adhesive, and the removable adhesive is made of a removable adhesive composition and a solvent;

[0064] The removable adhesive composition includes the following components in parts by weight: 100 parts of acrylic resin, 0.5 part of toluene diisocyanate trimer, 2 parts of initiator, 0.7 part of bis(acetylacetonato)diisopropoxytitanium, 2 parts of small molecule monomer, and 32 parts of solvent. The synthesis method of this UV-removable adhesive is the same as that of Example 1.

[0065] The solvent is composed of ethyl acetate and toluene in a mass ratio of 7:3;

[0066] The preparation method of the removable adhesive is as follows:

[0067] Mix acrylic resin, toluene diisocyanate trimer, initiator, adhesion promoter, 2-phenoxyethyl acrylate small molecule monomer, ethyl acetate and toluene uniformly to obtain a heat-removable adhesive composition with a solid content of 28%.

[0068] The preparation method of the above UV-removable adhesive tape is as follows:

[0069] (1) Coat the removable adhesive on either side of the PET single-silicone release film layer, and dry it at 90 °C for 5 min to obtain a adhered removable adhesive layer and PET single-silicone release film layer;

[0070] (2) The anti-adhesive layer 2 on the side away from the release film layer is compounded with the smooth surface of the PO substrate layer and cured at 45 °C for 72 h to obtain a UV anti-adhesive tape.

[0071] Example 6:

[0072] This example provides a tape, the difference from Example 1 is only that the content of toluene diisocyanate trimer in the anti-adhesive composition is changed to 1.5 parts, and other components, dosages and structures are the same as those in Example 1.

[0073] This example provides a preparation method of the tape, and the specific steps are the same as those in Example 1.

[0074] Example 7:

[0075] This example provides a tape, the difference from Example 1 is only that the small molecule monomer in the anti-adhesive composition is changed to 6 parts, and other components, dosages and structures are the same as those in Example 1.

[0076] This example provides a preparation method of the tape, and the specific steps are the same as those in Example 1.

[0077] Example 8:

[0078] This example provides a tape, the difference from Example 1 is only that the adhesion promoter in the anti-adhesive composition is changed to 0.1 part, and other components, dosages and structures are the same as those in Example 1.

[0079] This example provides a preparation method of the tape, and the specific steps are the same as those in Example 1.

[0080] Comparative Example 1:

[0081] This comparative example provides a tape, the difference from Example 1 is only that no small molecule monomer is added to the anti-adhesive composition, and other components, dosages and structures are the same as those in Example 1.

[0082] This comparative example provides a preparation method of the tape, and the specific steps are the same as those in Example 1.

[0083] Comparative Example 2:

[0084] This comparative example provides a tape, the difference from Example 1 is only that no curing agent is added to the anti-adhesive composition, and other components, dosages and structures are the same as those in Example 1.

[0085] This comparative example provides a preparation method of the tape, and the specific steps are the same as those in Example 1.

[0086] The properties of the UV anti-adhesive tapes provided in the above examples and comparative examples are tested, and the test standards are as follows:

[0087] Adhesion test: GB / T2792-1998;

[0088] Cutting test: Disco cutting machine;

[0089] UV energy: LED UV curing machine;

[0090] Pollution: Microscope;

[0091] The performance test results of the heat-reducible adhesive film provided by the above examples and comparative examples are shown in Table 1 below:

[0092] Table 1

[0093]

[0094] It can be seen from the content of Table 1 that from Examples 1-4, through the design of bis(acetylacetonato)diisopropoxytitanate and 2-phenoxyethyl acrylate small molecule monomers and the use of specific acrylic resins, the prepared UV-reducible adhesive film has high initial adhesion, extremely low post-UV adhesion and good anti-pollution effect. By comparing Example 5 and 8 with Example 1, it can be seen that when the addition amount of bis(acetylacetonato)diisopropoxytitanate is too small, the effect of improving the adhesion between the substrate and the adhesive layer of the UV-reducible adhesive film is not obvious, and there is pollution on the surface of the PCB board after picking up; if the addition amount of bis(acetylacetonato)diisopropoxytitanate is too large, the water resistance of the glue is reduced, resulting in flying chips during cutting and reducing the initial peel strength; by comparing Examples 6 and 7 with Example 1, it is found that when the addition amount of the curing agent is too large, the initial peel strength becomes low, resulting in a high probability of flying chips, and when the addition amount of 2-phenoxyethyl acrylate small molecule monomer is too high, the water resistance of the glue is reduced, resulting in flying chips during cutting and reducing the initial peel strength.

[0095] By comparing Example 1 with Comparative Examples 1 and 2, when 2-phenoxyethyl acrylate small molecule monomer or curing agent is not added, the adhesiveness of the glue is reduced, the reaction is incomplete, and there is pollution after picking up.

[0096] In summary, through the design of bis(acetylacetonato)diisopropoxytitanate, 2-phenoxyethyl acrylate small molecule monomers and the use of specific acrylic resins, the prepared UV-reducible adhesive film has high initial adhesion, extremely low post-UV adhesion and good anti-pollution effect. The UV-reducible adhesive film provided by the present invention is suitable for the production and preparation of PCB cutting.

[0097] The applicant declares that the detailed process flow of the present invention is illustrated by the above embodiments, but the present invention is not limited to the above detailed process flow, that is, it does not mean that the present invention must rely on the above detailed process flow to be implemented. Those skilled in the art should understand that any improvement to the present invention, the equivalent substitution of each raw material of the present invention's product, the addition of auxiliary components, the selection of specific methods, etc. all fall within the protection scope and the disclosure scope of the present invention.

Claims

1. A UV adhesive with reduced viscosity for facilitating PCB cutting, characterized in that The pressure-sensitive adhesive release agent comprises a pressure-sensitive adhesive release agent composition and a solvent. The pressure-sensitive adhesive release agent composition is composed of the following components in parts by weight: 100 parts of an acrylic resin, 0.1 to 0.8 part of a curing agent, 1 to 3 parts of an initiator, 0.2 to 0.5 part of bis(acetylacetonato)diisopropoxytitanium, and 2 to 5 parts of a 2-phenoxyethyl acrylate small molecule monomer; wherein, the viscosity of the acrylic resin is 500 to 5000 cps, the weight-average molecular weight is 400,000 to 800,000, and the glass transition temperature is -40 to -30 °C. The acrylic resin, by mass, comprises the following components: 30 to 40 parts of isobutyl acrylate, 1 to 2 parts of acrylic acid, 4 to 5 parts of hydroxyethyl acrylate, 4 to 5 parts of butyl methacrylate, 4 to 5 parts of hydroxyethyl methacrylate, 4 to 5 parts of glycidyl methacrylate, 40 to 50 parts of ethyl acetate, 0.5 to 1.5 parts of a light stabilizer, 0.1 to 1 part of an initiator, 0 to 0.5 part of an antifoaming agent, and 0 to 0.3 part of a leveling agent. The curing agent is any one or a combination of at least two of triphenylmethane triisocyanate toluene diisocyanate trimer, isophorone diisocyanate trimer, or tris(4-phenylisocyanate) thiophosphate.

2. The UV adhesive for facilitating PCB cutting according to claim 1, wherein The solvent is any one or a combination of at least two of ethyl acetate, toluene, and methyl ethyl ketone.

3. The UV adhesive for facilitating PCB cutting according to claim 1, wherein, The solid content of the pressure-sensitive adhesive release agent is 20 to 25%.

4. A UV adhesive-reducing tape convenient for PCB cutting, characterized in that, It includes a substrate layer, a pressure-sensitive adhesive release agent layer, and a release film layer stacked in sequence. The pressure-sensitive adhesive release agent layer is prepared from the UV pressure-sensitive adhesive release agent for facilitating PCB cutting according to any one of claims 1 to 3.

5. The UV release tape for facilitating PCB cutting according to claim 4, wherein, The thickness of the substrate layer is 130 to 160 μm, the thickness of the pressure-sensitive adhesive release agent layer is 20 to 30 μm, and the thickness of the release film layer is 12 to 75 μm.

6. The preparation method of a UV tack - reducing tape facilitating PCB cutting according to claim 4, characterized in that, It includes the following steps: Coat the pressure-sensitive adhesive release agent on either side of the release film layer and dry it at 90 to 110 °C for 1 to 4 minutes to obtain a pressure-sensitive adhesive release agent layer and a release film layer that are adhered together. Compound the pressure-sensitive adhesive release agent layer on the side away from the release film layer with the substrate layer and cure it at 40 to 50 °C for 50 to 80 hours to obtain the UV pressure-sensitive adhesive release agent.

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