A wire drawing die coating growth device

Abstract

The present invention discloses a wire drawing die coating growth device, belonging to the technical field of chemical vapor deposition diamond coating. The wire drawing die coating growth device includes a box component with a closable growth zone formed therein; at least one clamp unit arranged in the growth zone, wherein a single clamp unit includes: a mold support member, a top surface of which is provided with a plurality of groove members spaced apart along a first direction; and a wire pressing assembly including an electrode plate and a pressing plate adapted to each other. By providing multiple clamp units, the groove members on the mold support members in the clamp units can be used to place wire drawing dies of different specifications to meet the growth environment of wire drawing dies of different specifications. At the same time, by providing a wire drawing assembly and a wire guide assembly, the stability of the hot wire during the growth process of the wire drawing die coating can be ensured, thereby improving the coating growth effect.

Description

Technical Field

[0001] The invention belongs to the technical field of chemical vapor deposition diamond coatings, and in particular relates to a wire drawing die coating growth device. Background Art

[0002] Diamond has high hardness, wear resistance, high thermal conductivity and chemical stability, and is considered to be an ideal coating material for cutting tools and mechanical components. In the wire drawing process, depositing a diamond coating inside the drawing die can increase the service life of the drawing die, thereby improving production efficiency and reducing production costs. For example, patent document CN108570654A discloses a device for preparing a diamond coating on the inner hole of a drawing die. The device achieves uniform deposition of the diamond coating by directing the plasma group generated by the reaction gas used for depositing the coating around the hot wire into the die hole of the drawing die.

[0003] When the existing wire drawing die coating growth equipment is used, the hot wire and the wire drawing die are not very stable during the growth process, and the hot wire is prone to shaking, which affects the stability of the coating during growth. Summary of the Invention

[0004] The object of the present invention is to provide a wire drawing die coating growth device to solve the problems encountered by the existing wire drawing die coating growth device during use as mentioned in the background art.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: a wire drawing die coating growth device, comprising a box component, wherein a closable growth zone is formed inside;

[0006] At least one clamp unit is disposed in the growth zone, wherein a single clamp unit comprises:

[0007] A mold support member, a top surface of which is provided with a plurality of groove members spaced apart along a first direction;

[0008] A wire pressing assembly, comprising an electrode plate and a pressing plate adapted to each other;

[0009] The guide wire assembly includes a first guide wire component, wherein the first guide wire component is provided with a plurality of first annular grooves spaced apart along a first direction, wherein the annular grooves correspond to the groove body components one by one;

[0010] When in use, one end of a single hot wire is pressed by the electrode plate and the pressure plate, and the other end extends along the second direction. After passing through the through hole of the drawing die placed on the slot body component, it changes direction at the first annular groove position and is connected to the counterweight block for straightening.

[0011] Preferably, the guide wire assembly also includes a second guide wire component connected to the first guide wire component through an inclined connecting plate, and the second guide wire component is provided with second annular grooves corresponding to the first annular grooves spaced apart along the first direction, and the hot wire in a horizontal state is converted into a vertical state after being guided by the first annular groove and the second annular groove.

[0012] Preferably, the growth device further comprises a plate component.

[0013] Preferably, the mold support member is connected to the plate member via a spacer ring member.

[0014] Preferably, the electrode plate is fixed to the plate component via a first supporting unit, and the first guide wire component is fixed to the plate component via a second supporting unit.

[0015] Preferably, the cross-section of the trough body part is V-shaped, and a clamping force is applied to the wire drawing die through the trough body part.

[0016] Preferably, the length of the trough part is at least 2.5 times the length of the drawing die.

[0017] Preferably, the mold support member extension portion is provided with positioning plates on both sides of the trough body component, and the hot wire is positioned through the through holes on the positioning plates.

[0018] Preferably, the material of the plate component includes copper.

[0019] Preferably, the heating wire is a molybdenum wire.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] By setting up multiple clamp units in the growth interval, the placement of wire drawing dies of different specifications can be achieved through the groove parts on the mold support in the clamp unit to meet the growth environment of wire drawing dies of different specifications. At the same time, by setting up wire drawing components and wire guide components, the stability of the hot wire of the wire drawing die coating during the growth process can be guaranteed, and the uniformity of the coating growth process can be guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a schematic structural diagram of the clamp assembly of the present invention;

[0024] Figure 3 Schematic diagram of the fixture unit structure of the present invention Figure 1 ;

[0025] Figure 4 Schematic diagram of the fixture unit structure of the present invention Figure 2;

[0026] Figure 5 This is a schematic structural diagram of the mold support member of the present invention;

[0027] Figure 6 This is a schematic structural diagram of the first guide wire component of the present invention.

[0028] In the figure: 100, box body component; 101, growth interval; 200, clamp unit; 201, mold support; 201a, main body; 201b, extension part; 202, trough body component; 203, wire release assembly; 204, plate body component; 205, support column; 206, wire pressing assembly; 207, electrode plate; 208, pressing plate; 209, wire guide assembly; 210, first wire guide component; 211, first annular groove; 211a, arc-shaped bottom surface; 211b, inclined side surface; 212, connecting plate; 213, second wire guide component; 214, second annular groove; 215, positioning plate; 216, spacer ring component; 300, hot wire; 400, counterweight block. DETAILED DESCRIPTION

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] Reference Figure 1-6 A wire drawing die coating growth device includes a box component 100, in which a closable growth area 101 is formed, which is connected to an external vacuum pumping device to form a corresponding vacuum growth area 101. At the same time, a clamp assembly is provided in the growth area 101 for placing the wire drawing die to be coated and the hot wire 300 for forming the coating, wherein the clamp assembly is composed of a plurality of independent clamp units 200. Preferably, the hot wire 300 is a molybdenum wire.

[0031] Reference Figure 3The main body of a single clamp unit 200 is composed of a wire-releasing assembly 203 and a mold support 201, wherein the mold support 201 is used to place the wire drawing die, and the wire-releasing assembly 203 is used to arrange the hot wire 300 passing through the wire drawing die. Specifically, the wire-releasing assembly includes a plate part 204, and the plate part 204 is a rectangular plate. The plate part 204 can be made of metal materials such as copper. The length direction is recorded as the first direction, and the width direction is recorded as the second direction. Referring to Figure X, the mold support 201 includes a main body 201a and an extension part 201b. The main body 201a is a rectangular plate extending along the first direction. The body has a plurality of trough parts 202 spaced apart along the first direction on its top surface for placing the wire drawing dies to be processed. A single trough part 202 extends along the second direction, and the length of the trough part 202 is the same as the width of the main body 201a, that is, the trough part 202 extends from one end face of the main body 201a to the other end face. For the convenience of description, the length of the trough part 202 is recorded as L1, and the length of a single wire drawing die is recorded as L2. Preferably, L1 ≥ 2.5L2, so that at least two wire drawing dies can be placed on a single trough part 202 to improve the space utilization of the trough part 202. For details, refer to Figure 5 The cross-section of the trough part 202 is "V"-shaped. When the wire drawing die is placed on the trough part 202, the cylindrical wire drawing die is placed along the length direction of the trough part 202, and the circumferential outer surface of the wire drawing die contacts the inner surface of the "V"-shaped trough body, so that the wire drawing die can be fixed; by setting the trough part 202 with a "V"-shaped cross-section, on the one hand, when the wire drawing die is placed on the trough part 202, the horizontal component of the reaction force of the inner surface of the trough part 202 on the wire drawing die can exert a clamping force on the wire drawing die, thereby improving the stability of the wire drawing die during the coating growth process. On the other hand, the "V"-shaped trough part 202 can be used for wire drawing dies of various specifications. When placing wire drawing dies of different specifications, they will only differ in the vertical height of the central axis, which will not affect their stability when placed, thereby expanding the scope of use of the clamp unit 200.

[0032] Furthermore, the mold support 201 is installed on the plate part 204 through the spacer ring part 216, and a plurality of spacer ring parts 216 are provided and spaced apart along the second direction, wherein the spacer ring part 216 as a whole is a hollow cylinder and extends in the vertical direction (i.e., perpendicular to the top surface of the plate part 204), and the upper and lower end faces of the spacer ring part 216 are in contact with the end faces of the mold support 201 and the plate part 204 respectively, thereby forming an assembled whole of the mold support 201, the spacer ring part 216 and the plate part 204. Furthermore, a groove adapted to the spacer ring part 216 is provided on the contact surface between the mold support 201 and the plate part 204 and the spacer ring part 216, so that the connection between the mold support 201 and the plate part 204 and the spacer ring part 216 is more stable.

[0033] Reference Figure 4 The assembly also includes a plurality of support columns 205, which are made of metal materials such as copper, and a single support column 205 extends upward in the vertical direction. Specifically, the support columns 205 located on both sides of the mold support 201 are respectively recorded as support unit one and support unit two. Preferably, the number of support columns 205 is four, and they are distributed at the four corners of the plate component 204.

[0034] Furthermore, a wire pressing assembly 206 and a wire guiding assembly 209 are provided at the top of the support unit 1 and the support unit 2, respectively. The main body of the wire pressing assembly 206 is composed of an electrode plate 207 and a pressing plate 208. The overall specifications of the pressing plate 208 are adapted to the specifications of the electrode plate 207. The electrode plate 207 extends roughly along the second direction, and the two ends of the electrode plate 207 are respectively fixed on the two support columns 205 constituting the support unit 1. The main body of the wire guiding assembly 209 is composed of a first wire guiding component 210 and a counterweight block 400. A guide wire component 210 is a cylindrical body extending in a first direction, and the two ends of the first guide wire component 210 are respectively fixed on the two support columns 205 constituting the support unit 2. Furthermore, the first guide wire component 210 is provided with a plurality of first annular grooves 211 spaced apart along its axial direction. The number of the first annular grooves 211 and the spacing between adjacent first annular grooves 211 are adapted to the arrangement of the groove body component 202, that is, the first annular grooves 211 correspond to the groove body component 202 one by one. Specifically, a single first annular groove 211 is provided. 11 has an arc-shaped bottom surface 211a and two inclined side surfaces 211b. Preferably, the arc-shaped bottom surface 211a in the single first annular groove 211 is in the same horizontal plane as the contact surface of the electrode plate 207 and the pressure plate 208. When in use, one end of the hot wire 300 is clamped by the pressure plate 208 and the electrode plate 207 to achieve fixation. The other end of the hot wire 300 passes through the center hole of the wire drawing die and the first annular groove 211 in sequence and is connected to the counterweight 400. Under the action of the gravity of the counterweight 400, the hot wire 300 is straightened. When the second annular groove 214 is formed, the outer surface of the hot wire 300 contacts the arc-shaped bottom surface 211a of the first annular groove 211. Since the arc-shaped bottom surface 211a in the first annular groove 211 is in the same horizontal plane as the contact surface of the electrode plate 207 and the pressure plate 208, the hot wire 300 located between the wire pressing assembly 206 and the first guide wire component 210 is horizontally arranged as a whole. That is, the guide wire in this section is parallel to the axis of the wire drawing die. Combined with the function of the counterweight block 400, it can be ensured that no wire jitter will occur during the coating growth process.

[0035] Furthermore, the wire-releasing assembly 203 further includes a second wire-guiding component 213 and a connecting plate 212, wherein the connecting plate 212 is tilted. Preferably, the tilt angle of the connecting plate 212 is 45°-75°. The second wire-guiding component 213 is a cylinder extending along the first direction, and its two ends are connected to the first guide plate through the connecting plate 212. The second wire-guiding component 213 is provided with a radially outwardly extending flange at a position corresponding to the annular groove on the first wire-guiding component 210, and a second annular groove is provided at the flange position. shaped groove 214. The shape of the second annular groove 214 is the same as that of the first annular groove 211, and is used to guide and limit the hot wire 300. By setting the second guide wire component 213 and the connecting plate 212, on the one hand, the conversion process of the hot wire 300 from the horizontal state to the vertical state can be smoother, further improving the stability of the hot wire 300 during the growth process. On the other hand, a certain distance is provided between the counterweight block 400 and the plate component 204, providing an installation interval for the installation of the counterweight block 400.

[0036] Furthermore, a plurality of positioning plates are provided on the extension portion 201b of the mold support 201. The positioning plates are spaced apart along the first direction and correspond to the position of the trough member 202. Through holes are provided on the positioning plates for the heating wire 300 to pass through for positioning the heating wire 300.

[0037] The working process of the growth device is now described with a preferred embodiment:

[0038] 1. Clean the equipment cavity and place the pre-treated abrasive tool to be coated after assembling the fixture unit;

[0039] 2. Evacuate the growth area to a vacuum better than 3Pa, close the main pumping valve and maintain the pressure for 3 minutes to ensure that there is no leakage and the seal is intact.

[0040] 3. Introduce the mixed gas proportional valve to automatically stabilize the pressure to the required pressure. After stabilization, the precision power supply output power, current and voltage will start to grow for 6-12 hours until completion;

[0041] 4. Turn off the precision power supply, remove the residual mixed gas in the chamber, turn on the machine and take out the grown products.

[0042] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A wire drawing die coating growth device, characterized in that: include The box body has a closable growth area formed therein; At least one clamp unit is disposed in the growth zone, wherein a single clamp unit comprises: A mold support member, a top surface of which is provided with a plurality of groove members spaced apart along a first direction; A wire pressing assembly, comprising an electrode plate and a pressing plate adapted to each other; The guide wire assembly includes a first guide wire component, wherein the first guide wire component is provided with a plurality of first annular grooves spaced apart along a first direction, wherein the annular grooves correspond to the groove body components one by one; When in use, one end of the single hot wire is pressed by the electrode plate and the pressure plate, and the other end extends along the second direction, passes through the through hole of the wire drawing die placed on the slot body component, changes direction at the first annular groove position and is connected to the counterweight block for straightening; The guide wire assembly further includes a second guide wire component connected to the first guide wire component via an inclined connecting plate, and the second guide wire component is provided with second annular grooves spaced apart along a first direction and corresponding to the first annular grooves, and the horizontal hot wire is converted into a vertical state after being guided by the first annular groove and the second annular groove; The growth device further includes a plate component; The mold support member is connected to the plate member via a spacer ring member; The electrode plate is fixed to the plate component via a first supporting unit, and the first guide wire component is fixed to the plate component via a second supporting unit; The cross section of the trough body part is V-shaped, and a clamping force is applied to the wire drawing die through the trough body part; The length of the trough part is at least 2.5 times the length of the drawing die; The mold support member extension portion is provided with positioning plates on both sides of the trough body component, and the hot wire is positioned through the through holes on the positioning plates.

2. The wire drawing die coating growth device according to claim 1, characterized in that: The material of the plate member includes copper.

3. The wire drawing die coating growth device according to claim 1, characterized in that: The heating wire is a molybdenum wire.

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