A component failure excitation method and device

Abstract

This invention discloses a method and apparatus for triggering component failures, comprising: performing failure analysis on failed components in a circuit board to obtain the failure mechanism and triggering stress set of the failed components; when the triggering stress set includes electrical stress, analyzing and disassembling the circuit board to obtain the functional circuit of the failed component and the operating condition signal of the failed component in the functional circuit; generating a fault triggering unit circuit based on the functional circuit of the failed component, and determining the monitoring signal and monitoring signal threshold used to monitor component failure; combining multiple fault triggering unit circuits to construct a fault triggering device; and detecting whether components in the same batch as the failed component have failed based on the monitoring signal threshold and the monitoring signal obtained through the fault triggering device. This invention can perform batch fault triggering tests on components and simulate the actual application conditions of components, more realistically and effectively assessing the risks of components in field applications.

Description

Technical Field

[0001] This invention relates to the field of component measurement technology, and in particular to a method and apparatus for triggering component faults. Background Technology

[0002] When batch quality issues occur with components on a circuit board, it is necessary to assess the risk of these components in field applications. Based on the assessment results, a decision should be made regarding whether to modify the circuit boards affected by the batch of components to ensure the safety and reliability of the boards. Currently, there are two main methods for component risk assessment. One method is to use actual circuit boards for fault-induced testing to assess component risk. While this method can realistically simulate the actual application conditions of components, the cost of the circuit boards is high, and the sample size of the tested components is limited, making it unable to effectively assess the proportion of components with quality problems. The other method is to use individual environmental stress testing for fault-induced testing to assess component risk. Although this method is simple and easy to operate, the components are not operating in actual circuits, and the test conditions do not match the actual application conditions, making it impossible to truly assess the risk of components in field applications. Summary of the Invention

[0003] In view of this, the present invention provides a method and apparatus for triggering component failures, in order to solve the problem that existing methods cannot accurately and effectively assess the risks of components in field applications.

[0004] To achieve the above objectives, embodiments of the present invention provide a method for triggering component faults, comprising:

[0005] Failure analysis is performed on the failed components in the circuit board to obtain the failure mechanism and the set of excitation stresses of the failed components;

[0006] When the set of excitation stresses includes electrical stress, the circuit board is analyzed and disassembled to obtain the functional circuit of the failed component and the operating condition signal of the failed component in the functional circuit.

[0007] A fault triggering unit circuit is generated based on the functional circuit of the failed component, and a monitoring signal and a monitoring signal threshold are determined for monitoring component failure.

[0008] The fault excitation unit circuits described above are combined to construct a fault excitation device;

[0009] Based on the monitoring signal threshold and the monitoring signal obtained through the fault excitation device, it is determined whether components from the same batch as the failed component have failed.

[0010] Optionally, the failure analysis of the failed components in the circuit board to obtain the failure mechanism and excitation stress set of the failed components includes:

[0011] The failure of the component is analyzed by a preset electronic component failure analysis method to determine the failure mechanism caused by at least one excitation stress; and the set of excitation stresses of the component is obtained based on all the excitation stresses.

[0012] Optionally, the implementation process of the electronic component failure analysis method is as follows:

[0013] The failed component is subjected to external visual inspection to obtain external defect information of the failed component;

[0014] The internal defect information of the failed component is determined by non-destructive testing using X-rays.

[0015] After the failed component is unpacked, the internal analysis results are obtained by performing an internal analysis of the unpacked failed component using a stereomicroscope.

[0016] The failure of the components after unpacking was analyzed by scanning electron microscopy to determine the cause of failure.

[0017] Optionally, when the set of excitation stresses includes electrical stress, the circuit board is analyzed and disassembled to obtain the functional circuit of the failed component and the operating condition signal of the failed component in the functional circuit, including:

[0018] Detect whether the set of excitation stresses includes electrical stress;

[0019] When the set of excitation stresses includes electrical stress, the circuit board is analyzed and disassembled to obtain multiple functional module circuits.

[0020] Detect whether each of the functional module circuits contains the failed component, and mark the functional module circuit containing the failed component as the functional circuit of the component;

[0021] The input signals, output signals, control signals, and operating condition signals of the components in the functional circuit are acquired.

[0022] Optionally, the step of generating a fault triggering unit circuit based on the functional circuit of the failed component and determining the monitoring signal and the monitoring signal threshold includes:

[0023] Determine whether the control signal of the functional circuit is related to the cause of the circuit failure when the component fails;

[0024] If associated, the control terminal corresponding to the control signal is retained in the functional circuit to obtain the fault triggering unit circuit; if not associated, the control terminal corresponding to the control signal is deleted from the functional circuit to obtain the fault triggering unit circuit.

[0025] The output signal of the fault triggering unit circuit when the component fails is obtained, the output signal is set as the monitoring signal, and the monitoring signal threshold is obtained.

[0026] Optionally, the fault triggering unit circuits can be combined in parallel or in series.

[0027] Optionally, combining the multiple fault excitation unit circuits to construct a fault excitation device includes:

[0028] The multi-channel fault excitation unit circuits are connected in parallel to construct a fault excitation module; the fault excitation module is used to perform fault excitation testing on the component under test through the fault excitation unit circuits.

[0029] The design includes a signal control module comprising a signal generator and a signal control switch; the signal control module is used to generate an input signal through the signal generator and to control whether the input signal is sent to the fault triggering module through the signal control switch.

[0030] The design includes a monitoring module with multiple test circuits; the monitoring module is used to output the monitoring signal of the corresponding fault triggering unit circuit through the test circuits.

[0031] A fault triggering device is constructed based on the signal control module, the fault triggering module, and the monitoring module.

[0032] Optionally, detecting whether components from the same batch as the failed component have failed, based on the monitoring signal threshold and the monitoring signal obtained through the fault triggering device, includes:

[0033] Acquire the various monitoring signals output by the fault excitation device;

[0034] Detect whether the monitoring signal for each channel exceeds the monitoring signal threshold;

[0035] If a certain monitoring signal exceeds the monitoring signal threshold, then the component corresponding to that monitoring signal is determined to be faulty.

[0036] In addition, embodiments of the present invention also provide a component fault triggering device, including a signal control module, a fault triggering module and a monitoring module;

[0037] The signal control module includes a signal generator and a signal control switch; the fault activation module includes N fault activation unit circuits; and the monitoring module includes N test circuits. The signal generator is connected to the input terminals of the N fault activation unit circuits via the signal control switch, and the output terminal of each fault activation unit circuit is connected to one of the test circuits.

[0038] The signal generator is used to generate the input signal;

[0039] The signal control switch is used to select M fault triggering unit circuits and send the input signal to the input terminal of the M fault triggering unit circuits; wherein, M≤N;

[0040] The fault excitation unit circuit is used to perform fault excitation testing on the component under test;

[0041] The test circuit is used to output the monitoring signal from the output terminal of the fault triggering unit circuit 21.

[0042] Preferably, the component fault triggering device further includes a power control module; the power control module includes a power circuit and a power switch, used to supply power to each of the fault triggering unit circuits in the fault triggering module.

[0043] As can be seen from the above, the component failure excitation method provided by the embodiments of the present invention is based on the failure mechanism and excitation stress set of the component. It analyzes and disassembles the functional circuit of the component from the motherboard circuit to obtain the functional circuit of the component, and generates the component failure excitation unit circuit based on the functional circuit of the component. It builds a component failure excitation device, which can perform component failure excitation tests in batches, improves the testing efficiency and reduces the testing cost. At the same time, it can simulate the actual application conditions of the component and more realistically and effectively evaluate the risk of the component in field application. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a flowchart illustrating a component fault triggering method in one embodiment of the present invention;

[0046] Figure 2 This is a functional circuit diagram of a transistor in one embodiment of the present invention;

[0047] Figure 3This is a transistor fault excitation unit circuit in one embodiment of the present invention;

[0048] Figure 4 This is a schematic diagram of the structure of a transistor fault excitation device in one embodiment of the present invention;

[0049] Figure 5 This is a schematic diagram of the component fault triggering device in one embodiment of the present invention;

[0050] Figure 6 This is a schematic diagram of the component fault excitation device in another embodiment of the present invention. Detailed Implementation

[0051] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0052] Figure 1 This is a flowchart of the component fault triggering method according to an embodiment of the present invention, such as... Figure 1 As shown, the component fault triggering method of this embodiment includes steps S10 to S50.

[0053] For ease of explanation, this embodiment uses a transistor as a component for illustration.

[0054] Step S10: Perform failure analysis on the failed components in the board circuit to obtain the failure mechanism and excitation stress set of the failed components.

[0055] Preferably, step S10 includes: performing failure analysis on the failed component using a preset electronic component failure analysis method to determine the failure mechanism caused by at least one excitation stress; and obtaining a set of excitation stresses for the failed component based on all excitation stresses. The excitation stresses include electrical stress, temperature stress, mechanical stress, and climatic stress, etc.

[0056] Furthermore, the implementation process of the preset electronic component failure analysis method is as follows: Step 1, perform external visual inspection on the failed component to obtain external defect information; Step 2, perform non-destructive testing on the failed component using X-rays to determine internal defect information; Step 3, after unpacking the failed component, perform internal analysis on the unpacked failed component using a stereomicroscope to obtain internal analysis results; Step 4, determine the failure cause of the failed component through morphological analysis or composition analysis.

[0057] Understandably, this embodiment uses the above-mentioned electronic component failure analysis method to perform failure analysis on the failed component, and determines the failure mechanism and corresponding set of excitation stresses of the failed component based on the external defect information, internal defect information, internal analysis results and failure causes obtained from the failure analysis.

[0058] For example, if a failed transistor exhibits emitter junction leakage failure, common electronic component failure analysis methods such as cross-sectional analysis, scanning electron microscopy, and focused ion beam analysis can be used to analyze the transistor's failure mechanism. This reveals that under the combined action of electrical stress and high-temperature stress, copper elements in the emitter bonding wire migrate into the silicon wafer. Insufficient withstand voltage leads to the formation of tiny breakdown points in the silicon wafer, manifesting as emitter junction leakage. Based on the transistor's failure mechanism, the excitation stress set composed of the combination of electrical stress and temperature stress can be determined.

[0059] Step S20: When the excitation stress set includes electrical stress, the board circuit is analyzed and disassembled to obtain the functional circuit of the failed component and the operating condition signal of the failed component in the functional circuit.

[0060] Preferably, step S20 includes the following steps:

[0061] Step S201: Detect whether the excited stress set contains electrical stress;

[0062] Step S202: When the excitation stress set includes electrical stress, the board circuit is analyzed and disassembled to obtain multiple functional module circuits.

[0063] Step S203: Detect whether each functional module circuit contains a failed component, and determine the functional module circuit containing the failed component as the functional circuit containing the failed component.

[0064] Step S204: Obtain the input signals, output signals, control signals, and operating condition signals of the failed components in the functional circuit.

[0065] Understandably, if electrical stress is detected in the combined excitation application, the circuit board is functionally analyzed and disassembled to obtain K functional module circuits. Each functional module circuit is then checked for any failed components. If a functional module circuit contains a failed component, it is identified as a functional circuit with a failed component. Conversely, if no electrical stress is detected in the combined excitation application, the circuit board is not analyzed or disassembled.

[0066] Furthermore, by combining the preceding and following functional module circuits of this functional circuit in the board circuit, the input signals, output signals, and control signals of this functional circuit are obtained, and the operating condition signals of the failed component when it is working normally in the functional circuit are also obtained. These operating condition signals include voltage signals, current signals, and other signals generated by the failed component when it is working normally in the functional circuit; other signals generated by the component during operation include frequency signals and digital signals.

[0067] Specifically, in Figure 2 The transistor functional circuit shown includes a transistor Q1, a first resistor R1, a second resistor R2, a third resistor R3, and a Zener diode Z1, wherein the transistor Q1 is a PNP transistor; the first terminal of the first resistor R1 serves as the input terminal IN of the transistor functional circuit and is connected to the cathode of the Zener diode Z1, and the second terminal of the first resistor R1 is connected to the emitter of the transistor Q1; the collector of the transistor Q1 serves as the output terminal OUT of the transistor functional circuit and is connected to the first terminal of the second resistor R2; the base of the transistor Q1 serves as the control terminal CON of the transistor functional circuit and is connected to the anode of the Zener diode Z1 and the first terminal of the third resistor R3; the second terminals of the second resistor R2 and the second terminal of the third resistor R3 are both grounded.

[0068] exist Figure 2 In the process, based on the input voltage Vi and output voltage Vo of the transistor's functional circuit, the operating condition signals of transistor Q1 when it is in the amplification state are determined, which mainly include emitter voltage Ve, base voltage Vb, emitter current Ie, collector current Ic, base current Ib, and current amplification factor A.

[0069] Step S30: Generate a fault triggering unit circuit for the component based on the functional circuit of the component, and determine the monitoring signal and monitoring signal threshold used to monitor component failure.

[0070] Preferably, step S30 includes the following steps:

[0071] Step S301: Determine whether the control signal of the functional circuit is related to the cause of the circuit failure when the component fails;

[0072] In step S302, if the circuit is associated, the control terminal corresponding to the control signal is retained in the functional circuit to obtain the fault triggering unit circuit; if the circuit is not associated, the control terminal corresponding to the control signal is deleted from the functional circuit to obtain the fault triggering unit circuit.

[0073] Step S303: Obtain the output signal of the fault triggering unit circuit when the component fails, set the output signal as the monitoring signal, and obtain the monitoring signal threshold.

[0074] Specifically, in Figure 2 In the circuit diagram, when the transistor functional circuit is operating normally, the base current Ib of transistor Q1 is very small, almost floating, and transistor Q1 is in amplification mode. However, when an overcurrent fault occurs in the transistor functional circuit, the base voltage Vb of transistor Q1 increases, and transistor Q1 is in cutoff mode. To trigger a fault in transistor Q1, the cutoff state of transistor Q1 can be omitted, that is, the control terminal CON of the transistor functional circuit can be deleted, retaining the input terminal IN and the output terminal OUT of the transistor functional circuit, resulting in... Figure 3 The circuit shown is a transistor fault triggering unit circuit.

[0075] exist Figure 3 In this circuit, the leakage failure of a transistor manifests as a change in the collector voltage (i.e., the output voltage) Vo. The output voltage is used as a monitoring signal, and the threshold value of the monitoring signal is determined based on the circuit fault conditions.

[0076] Step S40: Combine the multiple fault excitation unit circuits to construct a fault excitation device. The multiple fault excitation unit circuits consist of two or more excitation unit circuits.

[0077] In this embodiment, the multi-path fault triggering unit circuits are combined in parallel or in series.

[0078] Preferably, step S40 includes the following steps:

[0079] Step S401: The multiple fault excitation unit circuits are connected in parallel to form a fault excitation module; the fault excitation module is used to perform fault excitation tests on components of the same batch as the failed components through the fault excitation unit circuits.

[0080] Step S402: Design a signal control module that includes a signal generator and a signal control switch; the signal control module is used to generate an input signal through the signal generator and to control whether the input signal is sent to the fault excitation unit circuit of the fault excitation module through the signal control switch.

[0081] Step S403: Design a monitoring module that includes multiple test circuits; the monitoring module is used to output the monitoring signal of the corresponding fault triggering unit circuit through the test circuits.

[0082] Step S404: Construct a fault triggering device based on the signal control module, fault triggering module, and monitoring module.

[0083] In another embodiment, step S40 further includes: designing a power module including a power supply circuit and a power switch, wherein the power supply circuit is used to supply power to the fault triggering module, and at this time, a fault triggering device is constructed based on the signal control module, the fault triggering module, the monitoring module and the power supply module.

[0084] Specifically, in Figure 4 The transistor fault excitation device shown consists of a signal control module containing a power supply (i.e., a signal generator) 1 and a selection switch (i.e., a signal selection switch) 2, a fault excitation module containing N transistor fault excitation unit circuits 3, and a monitoring module containing N test circuits 4 (i.e., the number of transistor fault excitation unit circuits 3 is the same as the number of test circuits 4). The power supply 1 is connected to the input terminals of the N transistor fault excitation unit circuits 3 through the selection switch 2, and the output terminal of each transistor fault excitation unit circuit 3 is connected to a test circuit 4.

[0085] In this circuit, power supply 1 provides input voltage Vi; selection switch 2 selects M (M≤N) transistor fault excitation unit circuits 3, and sends the input voltage Vi to the input terminals of the M transistor fault excitation unit circuits 3 respectively; transistor fault excitation unit circuit 3 performs fault excitation test on the transistor after receiving input voltage Vi; test circuit 4 outputs the voltage Vo at the output terminal of transistor fault excitation unit circuit 3 as a monitoring signal, so as to monitor whether the transistor under test has failed in real time in subsequent steps based on the monitoring signal.

[0086] Step S50: Based on the monitoring signal threshold and the monitoring signal obtained through the fault excitation device, detect whether components in the same batch as the failed component have failed.

[0087] Preferably, step S50 includes: acquiring each monitoring signal output by the fault excitation device; detecting whether each monitoring signal exceeds the monitoring signal threshold; if a monitoring signal exceeds the monitoring signal threshold, determining that the component corresponding to that monitoring signal has failed; and if a monitoring signal does not exceed the monitoring signal threshold, determining that the component corresponding to that monitoring signal has not failed.

[0088] As can be seen from the above, the component failure excitation method of this embodiment is based on the failure mechanism and excitation stress set of the component. It analyzes and disassembles the functional circuit of the component from the motherboard circuit to obtain the functional circuit of the component, and generates the component failure excitation unit circuit based on the functional circuit of the component. It builds a component failure excitation device, which can perform component failure excitation tests in batches, improves the testing efficiency and reduces the testing cost. At the same time, it can simulate the actual application conditions of the component and more realistically and effectively evaluate the risk of the component in field application.

[0089] like Figure 5As shown, an embodiment of the present invention also provides a component fault excitation device, including a signal control module 10, a fault excitation module 20, and a monitoring module 30; the signal control module 10 includes a signal generator 11 and a signal control switch 12, the fault excitation module 20 includes N fault excitation unit circuits 21, and the monitoring module 30 includes N test circuits 31; the signal generator 11 is connected to the input terminal of the N fault excitation unit circuits 21 through the signal control switch 12, and the output terminal of each fault excitation unit circuit 21 is connected to one test circuit 31;

[0090] Signal generator 11 is used to generate input signals;

[0091] The signal control switch 12 is used to select the M-channel fault excitation unit circuit 21 and send the input signal to the input terminal of the M-channel fault excitation unit circuit 21; where M≤N;

[0092] The fault excitation unit circuit 21 is used to perform fault excitation testing on the component under test.

[0093] Test circuit 31 is used to output the monitoring signal from the output terminal of fault triggering unit circuit 21.

[0094] Furthermore, such as Figure 6 As shown, the component fault triggering device also includes a power control module 40; the power control module 40 includes a power circuit and a power switch, which are used to supply power to each fault triggering unit circuit 21 in the fault triggering module 20.

[0095] The component failure excitation device of this invention can perform batch component failure excitation tests, improving testing efficiency and reducing testing costs. At the same time, it can simulate the actual application conditions of components, and more realistically and effectively assess the risks of components in field applications.

[0096] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the invention (including the claims) is limited to these examples; within the framework of the invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of the invention as described above, which are not provided in detail for the sake of brevity.

[0097] The embodiments of this invention are intended to cover all such substitutions, modifications, and variations falling within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this invention should be included within the protection scope of this invention.

Claims

1. A method for triggering component faults, characterized in that, include: Failure analysis is performed on the failed components in the circuit board to obtain the failure mechanism and the set of excitation stresses of the failed components; When the set of excitation stresses includes electrical stress, the circuit board is analyzed and disassembled to obtain the functional circuit of the failed component and the operating condition signal of the failed component in the functional circuit. A fault triggering unit circuit is generated based on the functional circuit of the failed component, and a monitoring signal and a monitoring signal threshold are determined for monitoring component failure. This includes: determining whether the control signal of the functional circuit is related to the cause of the circuit failure when the component fails; if related, retaining the control terminal corresponding to the control signal in the functional circuit to obtain the fault triggering unit circuit; if not related, deleting the control terminal corresponding to the control signal in the functional circuit to obtain the fault triggering unit circuit; acquiring the output signal of the fault triggering unit circuit when the component fails, setting the output signal as the monitoring signal, and acquiring the monitoring signal threshold. The fault excitation unit circuits described above are combined to construct a fault excitation device; Based on the monitoring signal threshold and the monitoring signal obtained through the fault excitation device, it is determined whether components from the same batch as the failed component have failed.

2. The component fault triggering method according to claim 1, characterized in that, The failure analysis of the failed components in the circuit board to obtain the failure mechanism and excitation stress set of the failed components includes: The failure of the component is analyzed by a preset electronic component failure analysis method to determine the failure mechanism caused by at least one excitation stress; and the set of excitation stresses of the component is obtained based on all the excitation stresses.

3. The component fault triggering method according to claim 2, characterized in that, The implementation process of the electronic component failure analysis method is as follows: The failed component is subjected to external visual inspection to obtain external defect information of the failed component; The internal defect information of the failed component is determined by non-destructive testing using X-rays. After the failed component is unpacked, the internal analysis results are obtained by performing an internal analysis of the unpacked failed component using a stereomicroscope. The cause of failure of components can be determined by morphological analysis or composition analysis.

4. The component fault triggering method according to claim 1, characterized in that, When the set of excitation stresses includes electrical stress, the circuit board is analyzed and disassembled to obtain the functional circuit of the failed component and the operating condition signal of the failed component in the functional circuit, including: Detect whether the set of excitation stresses includes electrical stress; When the set of excitation stresses includes electrical stress, the circuit board is analyzed and disassembled to obtain multiple functional module circuits. Detect whether each of the functional module circuits contains the failed component, and determine the functional module circuit containing the failed component as the functional circuit containing the failed component; The input signals, output signals, control signals, and operating condition signals of the failed component in the functional circuit are acquired.

5. The component fault triggering method according to claim 1, characterized in that, The fault triggering unit circuits are combined in parallel or in series.

6. The component fault triggering method according to claim 1, characterized in that, The step of combining multiple fault triggering unit circuits to construct a fault triggering device includes: The multi-channel fault excitation unit circuits are connected in parallel to construct a fault excitation module; the fault excitation module is used to perform fault excitation testing on the component under test through the fault excitation unit circuits. The design includes a signal control module comprising a signal generator and a signal control switch; the signal control module is used to generate an input signal through the signal generator and to control whether the input signal is sent to the fault triggering module through the signal control switch. The design includes a monitoring module with multiple test circuits; the monitoring module is used to output the monitoring signal of the corresponding fault triggering unit circuit through the test circuits. A fault triggering device is constructed based on the signal control module, the fault triggering module, and the monitoring module.

7. The component fault triggering method according to claim 1, characterized in that, The step of detecting whether components from the same batch as the failed component have failed, based on the monitoring signal threshold and the monitoring signal obtained through the fault excitation device, includes: Acquire the monitoring signals output by the fault triggering device; Detect whether the monitoring signal for each channel exceeds the monitoring signal threshold; If a certain monitoring signal exceeds the monitoring signal threshold, then the component corresponding to that monitoring signal is determined to be faulty.

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