A device and equipment for testing S parameters of a ceramic package

Abstract

The application provides a kind of ceramic package S parameter testing device and testing equipment.The testing device includes: first test board and second test board, the inside of first test board is equipped with the internal circuit of connecting first array pad and second array pad.The interval of first array pad is same with the interval of external test probe, and the distribution of second array pad is same with the upper surface pad of ceramic package.The inside of second test board is equipped with the internal circuit of connecting third array pad and fourth array pad.The distribution of third array pad is same with the lower surface pad of ceramic package, and the interval of fourth array pad is same with the interval of external test probe.The application can be connected to the upper surface of first test board and second test board by probe group in the same direction to realize testing, and the testing method is simple, which avoids using bidirectional probe equipment, and the structure requirement of testing equipment is low.

Description

Technical Field

[0001] This invention relates to the field of ceramic packaging shell technology, and in particular to a testing device and equipment for testing the S-parameters of ceramic packaging shells. Background Technology

[0002] Ceramic packages are used for chip packaging, typically to establish circuit connections between the chip and the circuit board. Flip-chip ceramic packages usually have a top-and-bottom planar structure; that is, the upper surface pads of the ceramic package connect to the flip chip, and the lower surface pads connect to the circuit board. As the carrier of the chip, the S-parameter characteristics of the ceramic package are crucial to the quality of signal transmission. Generally, probes are large, and the probe spacing is larger than the pad spacing of the ceramic package. Therefore, a test board with a top-and-bottom planar structure is typically used to connect the probes and the pads of the ceramic package to achieve spacing conversion for S-parameter testing.

[0003] S-parameters include S 11 S 22 S 12 and S 21 Parameters. Test S 12 and S 21 When testing parameters, two sets of probes and a test board are needed to simultaneously connect to the upper and lower surface pads of the ceramic package. In actual production, a bidirectional probe device is generally used to simultaneously test both surfaces of the ceramic package. The bidirectional probe device has two sets of opposing probes, each set of probes can move up and down. During testing, the two sets of probes move and align towards each other to connect to the upper and lower surface pads of the ceramic package. This double-sided testing method requires simultaneous alignment of both sides, is complex to operate, and necessitates the use of a bidirectional probe device, placing high demands on the testing equipment. Summary of the Invention

[0004] This invention provides a testing device and equipment for testing the S-parameters of ceramic packaging shells, in order to solve the problems of complex double-sided testing methods for the S-parameters of existing ceramic packaging shells and high requirements for the structure of testing equipment.

[0005] In a first aspect, embodiments of the present invention provide a testing apparatus for S-parameters of a ceramic package shell. The ceramic package shell to be tested is used for packaging flip chips, and the ceramic package shell includes upper surface pads and lower surface pads. The testing apparatus includes a first test board and a second test board, wherein the ceramic package shell is placed between the first test board and the second test board during testing. The upper surface of the first test board is provided with a first array of pads, and the lower surface is provided with a second array of pads. An internal circuit is provided inside to connect the first array of pads and the second array of pads. The spacing of the first array of pads is the same as the spacing of the external test probes, and the distribution of the second array of pads is the same as that of the upper surface pads of the ceramic package shell. The upper surface of the second test board is provided with a third array of pads and a fourth array of pads, and an internal circuit is provided inside to connect the third array of pads and the fourth array of pads. The distribution of the third array of pads is the same as that of the lower surface pads of the ceramic package shell, and the spacing of the fourth array of pads is the same as that of the external test probes.

[0006] In one possible implementation, a third array of pads is disposed in a first region on the upper surface of the second test board, and a fourth array of pads is disposed in a second region on the upper surface of the second test board. The upper surface of the second test board corresponding to the second region is higher than the upper surface of the second test board corresponding to the first region.

[0007] In one possible implementation, the vertical height difference between the first region and the second region is equal to the sum of the thicknesses of the first test plate and the ceramic package shell to be tested.

[0008] In one possible implementation, the cross-sectional shape of the second test board corresponding to the second region is a multi-step shape. Each step has a set of the fourth array pads, and each set of the fourth array pads is connected to the third array pads through internal circuitry.

[0009] In one possible implementation, the upper surface of the second test board is provided with multiple sets of third array pads, and each set of third array pads is connected to a fourth array pad through internal circuitry.

[0010] In one possible implementation, the first array pads include N first signal pads, where N ≥ 2. The second array pads include N second signal pads, wherein each second signal pad is connected to one of the first signal pads in a one-to-one correspondence. Between two first signal pads connected to two adjacent second signal pads, a first ground pad is also provided, wherein the first ground pad is connected to any one of the ground pads in the second array pads via internal circuitry.

[0011] In one possible implementation, the third array pads include M third signal pads, where M ≥ 2. The fourth array pads include M fourth signal pads, wherein each fourth signal pad is connected to one of the third signal pads in a one-to-one correspondence. Between two fourth signal pads that are connected to two adjacent third signal pads, a second ground pad is also provided, wherein the second ground pad is connected to any one of the ground pads in the third array pads via an internal circuit.

[0012] In one possible implementation, the first test plate and the second test plate are made of ceramic material.

[0013] In one possible implementation, the ceramic material includes alumina.

[0014] In a second aspect, embodiments of the present invention provide a testing device for S-parameters of a ceramic package shell, including a testing apparatus for S-parameters of a ceramic package shell as described in any possible implementation of the first aspect.

[0015] This invention provides a testing apparatus and equipment for testing the S-parameters of a ceramic package shell. The testing apparatus includes a first test board and a second test board, wherein the ceramic package shell is placed between the first and second test boards during testing. The upper surface of the first test board has a first array of pads, and the lower surface has a second array of pads. An internal circuit is provided inside to connect the first and second array of pads. The spacing of the first array of pads is the same as the spacing of the external test probes, and the distribution of the second array of pads is the same as that of the pads on the upper surface of the ceramic package shell. The upper surface of the second test board has a third array of pads and a fourth array of pads, and an internal circuit is provided inside to connect the third and fourth array of pads. The distribution of the third array of pads is the same as that of the pads on the lower surface of the ceramic package shell, and the spacing of the fourth array of pads is the same as that of the external test probes. This invention uses two test boards. The pads on the lower surface of the first test board are distributed in the same way as the pads on the upper surface of the ceramic package shell to be tested. The pads on the lower surface of the ceramic package shell are distributed in the same way as the third array pads on the upper surface of the second test board. Both the third array pads and the fourth array pads are located on the upper surface. During testing, the ceramic package shell can be placed between the first and second test boards. The test can be performed by connecting the upper surfaces of the first and second test boards with probes facing the same direction. The testing method is simple, avoids the use of bidirectional probe equipment, and has low requirements for the structure of the test equipment. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the testing device for the S-parameters of the ceramic packaging shell provided in an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the structure of the testing device for the S-parameters of the second type of ceramic packaging shell provided in this embodiment of the invention;

[0019] Figure 3 This is a schematic diagram of the structure of the testing device for the S-parameters of the third type of ceramic packaging shell provided in the embodiments of the present invention;

[0020] Figure 4 This is a schematic diagram of the structure of the fourth type of ceramic packaging shell S-parameter testing device provided in the embodiments of the present invention;

[0021] Figure 5 This is a schematic diagram of the structure of the first test board provided in an embodiment of the present invention;

[0022] Figure 6 This is a three-dimensional structural diagram of the first test board provided in an embodiment of the present invention;

[0023] Figure 7 This is a schematic diagram of the structure of the second test board provided in an embodiment of the present invention. Detailed Implementation

[0024] To enable those skilled in the art to better understand this solution, the technical solutions in the embodiments of this solution will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this solution, not all of them. Based on the embodiments of this solution, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this solution.

[0025] The term "comprising" and any other variations thereof in the specification, claims, and accompanying drawings of this invention mean "including but not limited to," and are intended to cover a non-exclusive inclusion, not limited to the examples listed herein. Furthermore, the terms "first" and "second," etc., are used to distinguish different objects, not to describe a specific order.

[0026] The implementation of the present invention will be described in detail below with reference to the accompanying drawings:

[0027] Ceramic packages are used for chip packaging, typically to establish circuit connections between the chip and the circuit board. Flip chip ceramic packages usually have a flat, plate-like structure; that is, the upper surface pads of the ceramic package connect to the flip chip, and the lower surface pads connect to the circuit board. As the carrier of the chip, the S-parameter characteristics of the ceramic package are crucial to the quality of signal transmission.

[0028] Generally, probes are large in size, and the probe spacing is larger than the pad spacing of the ceramic package. A local standard component with a structure similar to the ceramic package can be fabricated. This local standard component retains only a few key sets of pads from the ceramic package to increase the pad spacing. By measuring the S-parameters of this local standard component, the overall S-parameters of the ceramic package can be simulated. However, the S-parameters measured using this local standard component have a relatively large error.

[0029] Typically, a test board with an upper and lower flat plate structure can be used to connect the probes and the pads of the ceramic package to achieve pitch conversion testing of S-parameters. 12 The parameter is the isolation degree, S 21 The parameters refer to gain / loss. In actual production, bidirectional probe equipment is generally used to simultaneously test the upper and lower surfaces of a ceramic package. The bidirectional probe equipment has two sets of opposing probes, one facing the upper surface of the ceramic package and the other facing the lower surface. Both sets of probes can move up and down, and during testing, they can move towards each other. A microscopic imaging device is usually also required to observe the relative position of the probes and the device under test (DUT) for alignment. The two sets of probes can connect to the pads on the upper and lower surfaces of the ceramic package, respectively. This bidirectional testing method requires simultaneous alignment of both sides, is complex to operate, and necessitates the use of bidirectional probe equipment, placing high demands on the testing equipment.

[0030] This invention provides a testing device and equipment for testing the S-parameters of ceramic packaging shells, in order to solve the problems of complex double-sided testing methods for the S-parameters of existing ceramic packaging shells and high requirements for the structure of testing equipment.

[0031] Figure 1 This is a schematic diagram of a testing device for the S-parameters of a ceramic packaging shell provided in an embodiment of the present invention. (Refer to...) Figure 1The ceramic package under test is used to package a flip chip. The ceramic package includes upper surface pads and lower surface pads. The testing device includes a first test board 100 and a second test board 200, wherein the ceramic package is placed between the first test board 100 and the second test board 200 during testing. The upper surface of the first test board 100 is provided with a first array of pads 110, and the lower surface is provided with a second array of pads. Internal circuitry connects the first array of pads 110 and the second array of pads 120. The spacing of the first array of pads 110 is the same as the spacing of the external test probes, and the distribution of the second array of pads 120 is the same as that of the upper surface pads of the ceramic package. The upper surface of the second test board 200 is provided with a third array of pads 210 and a fourth array of pads 220, and internal circuitry connects the third array of pads 210 and the fourth array of pads 220. The distribution of the third array of pads 210 is the same as that of the lower surface pads of the ceramic package, and the spacing of the fourth array of pads 220 is the same as that of the external test probes.

[0032] The ceramic package under test is used to encapsulate a flip chip, enabling electrical connection between the flip chip and the circuit board. For example, the ceramic package model is FC-CLGA. The ceramic package includes upper and lower surface pads; that is, the ceramic package has a flat, top-bottom structure. The upper surface pads connect to the pads below the flip chip, and the lower surface pads connect to the circuit board, such as a PCB. Typically, the spacing between the upper surface pads is smaller than that between the lower and upper surface pads. The upper and lower surface pads are electrically connected through internal circuitry located inside the ceramic package. For example, the ceramic package can be fabricated using a multilayer ceramic co-firing process.

[0033] During testing, the ceramic encapsulation shell is placed between the first test plate 100 and the second test plate 200. For example, during testing, the upper surface of the ceramic encapsulation shell is connected to the lower surface of the first test plate 100, and the lower surface of the ceramic encapsulation shell is connected to the upper surface of the second test plate 200.

[0034] The upper surface of the first test board 100 is provided with a first array pad 110, and the lower surface is provided with a second array pad 120. An array pad refers to multiple pads arranged in an array. The first test board 100 has internal circuitry that connects the first array pad 110 and the second array pad 120. For example, the first array pad 110 and the second array pad 120 are connected one-to-one via the internal circuitry. The pad spacing of the first array pad 110 is the same as the spacing of the external probes. These external probes are microwave probes. For example, the external probes are a probe group, i.e., composed of multiple probes. The pad spacing of the second array pad 120 is the same as the distribution of the pads on the upper surface of the ceramic package shell; that is, the number of second array pads 120 and the pads on the upper surface of the ceramic package shell are the same, and their distribution positions correspond one-to-one.

[0035] During testing, external probes are connected to the first array pads 110, and the second array pads 120 are connected to the upper surface pads of the ceramic package. The external probes are relatively large, and their spacing is typically greater than the pad spacing of the ceramic package. For example, the spacing of the first array pads 110 is greater than the spacing of the second array pads 120, so that the external probes can be electrically connected to the upper surface pads of the ceramic package.

[0036] The upper surface of the second test board 200 is provided with a third array pad 210 and a fourth array pad 220, meaning that the third array pad 210 and the fourth array pad 220 are distributed on the same side of the second test board 200. For example, the distribution areas of the third array pad 210 and the fourth array pad 220 do not overlap. The second test board 200 has internal circuitry that connects the third array pad 210 and the second array pad 120. For example, the first array pad 110 and the second array pad 120 are connected one-to-one via internal circuitry. The distribution of the third array pad 210 is the same as that of the pads on the lower surface of the ceramic package shell; that is, the number of third array pads 210 and the pads on the lower surface of the ceramic package shell are the same, and their distribution positions correspond one-to-one.

[0037] During testing, external probes are connected to the fourth array pads 220, and the third array pads 210 are connected to the lower surface pads of the ceramic package. The external probes are relatively large, and their spacing is typically greater than the pad spacing of the ceramic package. For example, the spacing of the fourth array pads 220 is greater than the spacing of the third array pads 210, so that the external probes can be electrically connected to the upper surface pads of the ceramic package.

[0038] The present invention provides a testing device for S-parameters of a ceramic package shell. By setting two test boards, the pads on the lower surface of the first test board 100 are distributed in the same way as the pads on the upper surface of the ceramic package shell to be tested. The pads on the lower surface of the ceramic package shell are distributed in the same way as the third array pads 210 on the upper surface of the second test board 200. The third array pads 210 and the fourth array pads 220 are both set on the upper surface. During testing, the ceramic package shell can be placed between the first test board 100 and the second test board 200. The test can be carried out by connecting the upper surfaces of the first test board 100 and the second test board 200 with probes facing the same direction. The testing method is simple, avoids the use of bidirectional probe equipment, and has low structural requirements for the testing equipment.

[0039] When testing the S-parameters of the ceramic package shell provided in this embodiment of the invention, the probe device requires at least two sets of probes, and the stroke of the two sets of probes can be independently adjusted. One set of probes is connected to the first array pad 110, and the other set of probes is connected to the fourth array pad 220. For example, the second test board 200 is a flat plate with uniform thickness. During testing, the probe heights corresponding to the first array pad 110 and the fourth array pad 220 are different, making testing inconvenient.

[0040] Figure 2 This is a schematic diagram of the structure of the testing device for the S-parameters of the second type of ceramic packaging shell provided in this embodiment of the invention. (Refer to...) Figure 2 :

[0041] In one possible implementation, a third array pad 210 is disposed in a first region on the upper surface of the second test board 200, and a fourth array pad 220 is disposed in a second region on the upper surface of the second test board 200. The upper surface of the second test board 200 corresponding to the second region is higher than the upper surface of the second test board 200 corresponding to the first region.

[0042] The upper surface of the second test board 200 includes a first region and a second region that do not overlap. For example, the upper surface of the second test board 200 is rectangular. For example, the first region is located on one side of the second test board 200, and the second region is located on the other side of the second test board 200. For example, the first region is located in the middle of the second test board 200, and the second region is located on both sides of the second region. For example, the first region is located at the center of the second test board 200, and the second region has an annular structure and is located around the first region. A third array pad 210 is provided within the first region, and a fourth array pad 220 is provided within the second region.

[0043] The second region is higher than the first region. That is, the upper surface of the second test board 200 has a stepped structure. During testing, the ceramic package shell and the first test board 100 need to be sequentially set on the surface of the first region, resulting in a higher vertical height and a shorter probe travel corresponding to the first array pad 110. Increasing the height of the second region can reduce the probe travel corresponding to the fourth array pad 220, improving testing efficiency and making testing more convenient.

[0044] In one possible implementation, the vertical height difference between the first region and the second region is equal to the sum of the thicknesses of the first test plate 100 and the ceramic package shell to be tested.

[0045] During testing, a ceramic package shell and a first test plate 100 are sequentially mounted on the surface of the first region. When the vertical height difference between the first and second regions equals the sum of the thicknesses of the first test plate 100 and the ceramic package shell under test, the heights of the first array pad 110 and the fourth array pad 220 are the same, and the corresponding probe heights are also the same. On the one hand, since the probe heights are the same, it is not necessary for the two sets of probe heights to be independently adjustable; only synchronous adjustment is required. On the other hand, since the probe heights are the same, it is not necessary for two separate microscopic systems to observe the two sets of probes; only one microscopic system is needed to observe the two sets of probes at the same height. The testing device for the S-parameters of the ceramic package shell provided in this embodiment of the invention can reduce the requirements for probe testing equipment during testing, making the testing more convenient.

[0046] Figure 3 This is a schematic diagram of the structure of the testing device for the S-parameters of the third type of ceramic packaging shell provided in this embodiment of the invention. (Refer to...) Figure 3 :

[0047] In one possible implementation, the cross-sectional shape of the second test board 200 corresponding to the second region is a multi-step shape. Each step has a set of fourth array pads 220, and each set of fourth array pads 220 is connected to the third array pads 210 through internal circuitry.

[0048] The cross-section of the second test plate 200 is perpendicular to its upper surface and parallel to the direction from the first region to the second region. For example, the height of the second region is greater than that of the first region. The second region is multi-step, meaning it includes at least three platforms of different heights.

[0049] The second region has multiple sets of identically distributed fourth array pads 220. Each platform in the second region has one set of fourth array pads 220. Each set of fourth array pads 220 is connected to the third array pads 210 via internal circuitry. That is, external probes can be connected to the third array pads 210 through any set of fourth array pads 220.

[0050] The ceramic package shell S-parameter testing device provided in this embodiment of the invention can connect to the fourth array pads 220 of different heights via external probes during testing. This ensures that when testing ceramic package shells of different heights, the probe heights corresponding to the first array pads 110 and the fourth array pads 220 are the same, which reduces the requirements for probe testing equipment and makes testing more convenient.

[0051] For example, when the distribution of the pads on the lower surface of ceramic package components of different heights is different, multiple sets of third array pads 210 can be set in the first region.

[0052] Figure 4This is a schematic diagram of the structure of the fourth type of ceramic packaging shell S-parameter testing device provided in this embodiment of the invention. (Refer to...) Figure 4 :

[0053] In one possible implementation, the upper surface of the second test board 200 is provided with multiple sets of third array pads 210, and each set of third array pads 210 is connected to the fourth array pads 220 through internal circuits.

[0054] The first region is provided with multiple sets of third array pads 210. For example, the distribution of each set of third array pads 210 is the same. During testing, each set of third array pads 210 can be connected to a ceramic package shell. External probes are connected to fourth array pads 220 and first array pads 110, and the first test board 100 is sequentially connected to each ceramic package shell, enabling the testing of multiple ceramic package shells on the same test device.

[0055] Alternatively, multiple first test boards 100 can be set up, each first test board 100 connected to a ceramic package shell. One set of external probes is connected to the fourth array pad 220, and another set of external probes is sequentially connected to the first array pad 110 of each first test board 100, so as to test multiple ceramic package shells on the same test device.

[0056] The testing device for S-parameters of ceramic packaging shells provided in this embodiment of the invention can test multiple ceramic packaging shells on the same testing device, thereby improving testing efficiency.

[0057] Figure 5 This is a schematic diagram of the structure of the first test board provided in an embodiment of the present invention. Figure 6 This is a three-dimensional structural schematic diagram of the first test board provided in an embodiment of the present invention. (Refer to...) Figure 5 , Figure 6 :

[0058] In one possible implementation, the first array pad 110 includes N first signal pads 111, where N ≥ 2. The second array pad 120 includes N second signal pads 121, wherein each second signal pad 121 is connected to a first signal pad 111 in a one-to-one correspondence. Between two first signal pads 111 that are connected to two adjacent second signal pads 121, a first ground pad 112 is also provided, wherein the first ground pad 112 is connected to any one of the ground pads in the second array pad 120 through an internal circuit.

[0059] The pads of the ceramic package may include adjacent signal pads, including SS mode or GSSG mode, where S represents a signal pad and G represents a ground pad. The distribution of the second array pads 120 is the same as the distribution of the pads on the upper surface of the ceramic package, and also includes adjacent signal pads, that is, there are two adjacent second signal pads 121.

[0060] The first signal pad 111 and the second signal pad 121 are connected in a one-to-one correspondence. A first ground pad 112 is provided between the first signal pads 111 corresponding to adjacent second signal pads 121, and the first ground pad 112 is connected to any one of the ground pads in the second array pads 120 to achieve grounding. For example, the first signal pad 111 is in SS mode, and the corresponding second signal pad 121 is in SGS mode. Alternatively, the first signal pad 111 is in GSSG mode, and the corresponding second signal pad 121 is in GGSSG mode. Providing a ground pad between the first signal pads 111 corresponding to adjacent second signal pads 121 increases the signal isolation between adjacent signal pads during testing, resulting in more accurate test results.

[0061] For example, during testing, each ground pad in the first array pad 110 is connected to the same ground terminal via an external circuit. For example, the first ground pad 112 is interconnected with each ground pad in the second array pad 120 to ensure that the ground reference plane of the first ground pad 112 is the same as that of the other ground pads, thus improving test accuracy. For example, each ground pad in the first array pad 110 is interconnected with each ground pad in the second array pad 120 via an internal circuit.

[0062] Figure 7 This is a schematic diagram of the structure of the second test board provided in an embodiment of the present invention. (Refer to...) Figure 7 :

[0063] In one possible implementation, the third array pad 210 includes M third signal pads 211, where M ≥ 2. The fourth array pad 220 includes M fourth signal pads 221, wherein the fourth signal pads 221 are connected to the third signal pads 211 in a one-to-one correspondence. Between two fourth signal pads 221 that are connected to two adjacent third signal pads 211, a second ground pad 222 is also provided, wherein the second ground pad 222 is connected to any one of the ground pads in the third array pad 210 through an internal circuit.

[0064] The third array pads 210 have the same distribution as the pads on the lower surface of the ceramic package. The third signal pads 211 and fourth signal pads 221 are connected in a one-to-one correspondence. A second ground pad 222 is provided between the fourth signal pads 221 corresponding to adjacent third signal pads 211, and the second ground pad 222 is connected to any one of the ground pads in the third array pads 210 to achieve grounding. For example, the third signal pad 211 is in SS mode, and the corresponding fourth signal pad 221 is in SGS mode. For example, the third signal pad 211 is in GSSG mode, and the corresponding fourth signal pad 221 is in GGSSG mode. Providing a ground pad between the fourth signal pads 221 corresponding to adjacent third signal pads 211 increases the signal isolation between adjacent signal pads during testing, resulting in more accurate test results.

[0065] For example, during testing, each ground pad in the fourth array pad 220 is connected to the same ground terminal via an external circuit. For example, the second ground pad 222 is interconnected with each ground pad in the third array pad 210 to ensure that the ground reference plane of the second ground pad 222 is the same as that of the other ground pads, thus improving test accuracy. For example, each ground pad in the fourth array pad 220 is interconnected with each ground pad in the third array pad 210 via an internal circuit.

[0066] In one possible implementation, the first test board 100 and the second test board 200 are made of ceramic material. The pad spacing of ceramic packages is typically small, making it difficult for test boards made of ordinary materials to match the pad spacing of the ceramic package. Using ceramic material allows for the same pad spacing as the ceramic package through the same processing technology. For example, the materials of the first test board 100 and the second test board 200 are the same as the ceramic package material. For example, the materials of the first test board 100 and the second test board 200 include aluminum nitride.

[0067] In one possible implementation, the ceramic material includes alumina.

[0068] This invention provides a testing device for S-parameters of ceramic packaging shells, including a testing apparatus for S-parameters of ceramic packaging shells as provided in any of the above possible implementations.

[0069] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A testing device for the S-parameters of a ceramic encapsulation shell, characterized in that, The ceramic package housing to be tested is used to encapsulate a flip chip, and the ceramic package housing includes upper surface pads and lower surface pads; The testing device includes a first test board and a second test board, wherein the ceramic encapsulation shell is placed between the first test board and the second test board during testing; The first test board has a first array of pads on its upper surface and a second array of pads on its lower surface. It also has an internal circuit that connects the first and second array of pads. The spacing of the first array of pads is the same as the spacing of the external test probes, and the distribution of the second array of pads is the same as that of the pads on the upper surface of the ceramic package. The upper surface of the second test board is provided with a third array pad and a fourth array pad, and the interior is provided with an internal circuit connecting the third array pad and the fourth array pad; wherein, the distribution of the third array pad is the same as that of the pad on the lower surface of the ceramic package shell, and the spacing of the fourth array pad is the same as that of the external test probe. The third array pads are disposed in the first region on the upper surface of the second test board, and the fourth array pads are disposed in the second region on the upper surface of the second test board. The upper surface of the second test board corresponding to the second region is higher than the upper surface of the second test board corresponding to the first region.

2. The testing apparatus for the S-parameters of the ceramic packaging shell as described in claim 1, characterized in that, The vertical height difference between the first region and the second region is equal to the sum of the thicknesses of the first test plate and the ceramic encapsulation shell to be tested.

3. The testing apparatus for the S-parameters of the ceramic packaging shell as described in claim 1, characterized in that, The cross-sectional shape of the second test plate corresponding to the second region is a multi-step shape; Each step has a set of the fourth array pads on its surface, and each set of the fourth array pads is connected to the third array pads through internal circuitry.

4. The testing apparatus for the S-parameters of the ceramic packaging shell as described in claim 1, characterized in that, The upper surface of the second test board is provided with multiple sets of third array pads, and each set of third array pads is connected to the fourth array pads through internal circuitry.

5. The testing apparatus for the S-parameters of the ceramic packaging shell as described in claim 1, characterized in that, The first array pads include N first signal pads, where N ≥ 2; The second array pads include N second signal pads, wherein each second signal pad is connected to a first signal pad in a one-to-one correspondence. Between the two first signal pads that are connected to the two adjacent second signal pads, there is also a first ground pad, wherein the first ground pad is connected to any one of the ground pads in the second array pads through an internal circuit.

6. The testing apparatus for the S-parameters of the ceramic packaging shell as described in claim 1, characterized in that, The third array pads include M third signal pads, where M ≥ 2; The fourth array pads include M fourth signal pads, wherein the fourth signal pads are connected to the third signal pads in a one-to-one correspondence. Between the two fourth signal pads that are connected to the two adjacent third signal pads, there is also a second ground pad, wherein the second ground pad is connected to any one of the ground pads in the third array pads through an internal circuit.

7. The testing apparatus for the S-parameters of the ceramic packaging shell as described in claim 1, characterized in that, The first and second test plates are made of ceramic material.

8. The testing apparatus for the S-parameters of the ceramic packaging shell as described in claim 7, characterized in that, The ceramic material includes alumina.

9. A testing device for the S-parameters of a ceramic packaging shell, characterized in that, A testing apparatus for the S-parameters of a ceramic package as described in any one of claims 1 to 8.

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